LDK063BBJ225MPLF

Ref No.MLRME1500160A To：LETDO Electronics Co.，Ltd PRODUCT SPECIFICATION P/N： LDK063BBJ225MPLF Type： Standard Multilayer Ceramic Capacitors Soldering： Reflow only Issue date： June 25, 2015 Applicable products to RoHS restriction TAIYO YUDEN CO., LTD. Document No. Specifications Multilayer Ceramic Capacitor MLRME1500160A (High dielectric type) 1． Scope This specification covers multilayer chip type ceramic capacitor (Pb-Free) for use (for reflow soldering) in electronic appliances and electric communications equipment. 2．Part Numbering System Part number is indicated as follows. (Example) L ① DK ※ 063 ② B ③ BJ ④ 225 Capacitance M ⑤ P ⑥ LF ⑦ ※Voltage in high temperature loading test.(100％) ①Rated voltage Code L ②Size Code 063 Voltage [VDC] 10.0 ③Control Code L×W [mm] 0.6×0.3 ※Per Fig.1. ④Temperature characteristics (High dielectric type) Characteristic Capacitance change rate [%] Temperature range [℃] Reference temperature [℃] BJ(X5R) ±15(EIA) -55 to +85 25 ⑤Tolerance Code M Tolerance ±20% ⑥Thickness code Code Thickness [mm] P 0.3 ⑦Packaging Code LF Packaging Taping －1 － Multilayer Ceramic Chip Capacitor 3．Test Conditions Standard test conditions shall be temperature of 5 to 35℃, relative humidity of 45 to 85% and air pressure of 86 to 106kPa. Tests shall be conducted at temperature of 25±3℃, relative humidity of 60 to 70% and air pressure of 86 to 106kPa if test results are suspicious. Unless otherwise specified, all tests shall be conducted under the standard test conditions. 4．Construction，Dimensions and Performance Details of construction，dimensions and performance shall be specified in the following sheets. 5．Packaging Capacitors shall be packaged properly to avoid damage in the capacitors during transportation and storage. The package shall be marked with part number，quantity, lot number, and manufacturer’s name at its appropriate position. 6．Manufacturing site TAIYO YUDEN CO., LTD. （JAPAN） TAIYO YUDEN (GUANG DONG) CO., LTD. (CHINA) TAIYO YUDEN (SARAWAK) SDN. BHD. (MALAYSIA) TAIYO YUDEN (PHILIPPINES), INC. (PHILIPPINES) 7．Precautions ・This specification does not cover capacitors when Sn-Zn lead free solder is used. If you need further information, please contact us. 8．Storage conditions ・Temperature and humidity in storage area shall be controlled carefully to maintain the solderability of terminal electrodes and to keep the packaging material in good condition. Humidity should especially be kept as low as possible. ・Recommended conditions Ambient temperature: 30℃ or below Humidity: 70% RH or below The ambient temperature must be kept below +40℃. Even under ideal storage conditions, capacitor electrode solderability decreases with time. Therefore ceramic chip capacitors should be used within 6 months from the time of delivery. If the period is exceeded, please check solderability before using the capacitors. ・The packaging material should be kept where no chlorine or sulfur exists in the air. －2 － Multilayer Ceramic Chip Capacitor 9． RoHS compliance ・Our products conform to RoHS. ・”RoHS compliance” means that the product does not contain lead, cadmium, mercury, hexavalent chromium, PBB or PBDE referring to EU Directive 2011/65/EU, except other non-restricted substances or impurities which cannot be technically removed at refining process. ・Our products are halogen-free products. 10．Others Resin-coating: ・Coating/molding capacitors with resin may have negative effects on the capacitor functions. ・When capacitors are coated/molded with resin, please check effects on the capacitors by analyzing them in actual applications prior to use. －3 － No. 1 Item Specified Value Operating Range 2 3 Temperature Capable of continuous operation under these conditions. Shape and Dimensions Per Fig.1 Heat Treatment 4 Voltage Treatment 5 Dielectric Withstanding Voltage (between terminals) No abnormality. 6 Insulation Resistance (IR) 20MΩ・μF min. 7 Capacitance (Cap.) 2200000pF Remarks -55 to +85℃ Initial value shall be measured after test sample is heat-treated at 150 +0/-10℃ for an hour and kept at room temperature for 24±2 hours. Initial value shall be measured after test sample is voltage-treated for an hour at temperature and voltage which are specified as test conditions, and kept at room temperature for 24±2 hours. Conforming to EIA RS-198 (1991). 160% of DC rated voltage shall be applied for 1 to 5 seconds. Charging and discharging current shall be 50mA or less. Conforming to EIA RS-198 (1991). Rated voltage shall be applied to test sample for 1 minute±5 seconds. Charging and discharging current shall be 50mA or less. Conforming to EIA RS-198 (1991). Heat treatment specified in this specification shall be conducted prior to measurement. Measuring frequency and voltage shall conform to the table below. Measuring Frequency 1kHz±10% 8 Dissipation Factor (DF) 20.0％max. Conforming to EIA RS-198 (1991). Heat treatment specified in this specification shall be conducted prior to measurement. Measuring frequency and voltage shall conform to the table below. Measuring Frequency 1kHz±10% 9 Temperature Characteristic Per P.1④ Measuring Voltage 0.5±0.1Vrms Measuring Voltage 0.5±0.1Vrms Heat treatment specified in this specification shall be conducted prior to measurement. Maximum capacitance deviation in both (+) and (-) sides in range of lowest temperature to highest temperature for capacitor shall be indicated in ratio of variation in reference to capacitance value at reference temperature. Measuring Frequency 1kHz±10% －4 － Measuring Voltage 0.2±0.05Vrms No. Item Specified Value 10 Adhesive Force of Terminal Electrodes Terminal electrodes shall be no exfoliation or a sign of exfoliation. 11 Vibration Initial performance shall be satisfied. Remarks Conforming to EIA RS-198 (1991). Test sample shall be soldered to test board shown in Fig.2 and a force of 2N｛200gf｝ shall be applied in vertically downward direction for 10±1 seconds. Conforming to EIA RS-198 (1991). Test sample shall be soldered to test board shown in Fig.2. Heat treatment specified in this specification shall be conducted prior to test. Test conditions: Frequency range: 10-55Hz Overall amplitude: 1.5mm Sweeping method: 10-55-10Hz for 1 min. Each two hours in X,Y,Z direction: 6 hours in total 12 13 Solderability Resistance to Soldering Heat More than 95% of terminal electrode shall be covered with fresh solder. Appearance No abnormality Cap. Change ±25.0% DF 20.0%max. IR Initial value shall be satisfied. Dielectric Withstanding Voltage (between terminals） No dielectric breakdown or damage 【Eutectic】 Solder used shall be [JIS Z 3282 H60A or H63A]. Test sample shall be completely submerged in molten solder at 230±5℃ for 4±1 seconds. 【Pb free】 Solder used shall be [Sn/3.0Ag/0.5Cu]. Test sample shall be completely submerged in molten solder at 245±3℃ for 4±1 seconds. Conforming to EIA RS-198 (1991). Solder used shall be [JIS Z 3282 H60A or H63A]. Heat treatment specified in this specification shall be conducted prior to test. Test sample shall be completely submerged in molten solder of 270±5℃ for 3±0.5seconds. Preheating as shown in the table below shall be continuously conducted before submersion and test sample shall be kept at ambient temperature after test. Temperature (℃) 150±1 Time (min) 1 to 2 Measurement shall be conducted after test sample is kept at ambient temperature for 24±2 hours. －5 － No. 14 Item Thermal Shock Specified Value Appearance No abnormality Cap. Change ±40.0% DF 20.0%max. IR Initial value shall be satisfied. Dielectric Withstanding Voltage (between terminals） No dielectric Breakdown or damage Remarks Conforming to EIA RS-198 (1991). Test sample shall be soldered to test board shown in Fig.2. Heat treatment specified in this specification shall be conducted prior to test. Test sample shall be exposed to each of temperature conditions in the following Steps 1 to 4 in sequence for the specified time. Step 1 2 3 4 Temperature (℃) Lowest operating temperature Ambient temperature Highest operating temperature Ambient temperature Time (min) 30±3 2 to 3 30±3 2 to 3 Temperature cycle shall be repeated five times in this method, and measurement shall be conducted after test sample is kept at ambient temperature for 24±2 hours. 15 16 Humidity (Steady State) High Temperature Loading Appearance No abnormality Cap. Change ±25.0% DF 20.0%max. IR 2MΩ･μFmin. Appearance No abnormality Cap. Change ±25.0% DF 20.0%max. IR 2MΩ･μFmin. －6 － Conforming to EIA RS-198 (1991). Heat treatment specified in this specification shall be conducted prior to test. Test sample shall be put into constant temperature/humidity bath at 40±2℃ and 90 to 95%RH for 500+24/-0 hours. Measurement shall be conducted after test sample is kept at ambient temperature for the 24±2 hours. Conforming to EIA RS-198 (1991). Voltage treatment specified in this specification shall be conducted prior to test. Test sample shall be put in thermostatic oven with maximum temperature and 100% of DC rated voltage shall be continuously applied for 1000+48/-0 hours. Charging and discharging current shall be 50mA or less. Measurement shall be conducted after test sample is kept at ambient temperature for 24±2 hours. No. 17 18 Item Humidity Loading Bending Strength Specified Value Appearance No abnormality Cap. Change ±60.0% DF 20.0%max. IR 1MΩ･μFmin. Appearance No abnormality Cap. Change ±12.5％ Remarks Conforming to EIA RS-198 (1991). Voltage treatment specified in this specification shall be conducted prior to test. Test sample shall be put into constant temperature/humidity bath at 40±2℃ and 90 to 95%RH, and DC rated voltage shall be continuously applied for 500 +24/-0 hours. Charging and discharging current shall be 50mA or less. Measurement shall be conducted after test sample is kept at ambient temperature for 24±2 hours. Test sample shall be soldered to test board as shown in Fig.3. Sample shall be carefully soldered to avoid abnormality such as heat shock. The board is bent 1.0mm for 10 seconds as shown in Fig.4. Measurement shall be conducted as the board is bent 1.0mm. －7 － Fig.1 Shape and Dimensions L W ① ① ④ ② ③ T ⑤ e e [High dielectric type] No. Name ① Terminal Electrodes (Surface) ② Terminal Electrodes ③ ④ ⑤ External Electrodes Internal Electrodes Dielectric Item type 063 Control Code B Material Sn Plating Ni Plating Cu Plating Ni Ni Barium titanate Dimension [Unit: mm] L W T e 0.6±0.09 0.3±0.09 0.3±0.09 0.15±0.05 －8 － Fig.2 Board / Test Jig of Adhesive force of Terminal Electrodes, Vibration and Thermal Shock c Size (L×W) 0.6×0.3 a 0.3 b 0.9 c 0.3 [Unit: mm] b a Scratch tool Material: Glass epoxy board [JIS C 6484] R0.5 Board Copper foil (thickness: 0.035mm) Solder resist Chip Cross Section Remarks: Uniform soldering shall be conducted with solder (H60A or H63A in JIS Z 3282) by using soldering iron or soldering oven. Soldering shall be conducted with care to avoid abnormality such as heat shock. Fig.3 Test Board Fig.4 20 10 a 1±0.1 R230 40 0.8 b 45±2 100 Material: Glass epoxy board [JIS C 6484] a 0.3 b 0.9 45±2 [Unit: mm] Apply pressure at the rate of 0.5mm/sec. until amount of deflection reaches to 1.0mm. Copper foil (thickness: 0.035mm) Solder resist Size (L×W) 0.6×0.3 Amount of deflection Board c c 0.3 [Unit: mm] －9 － Tape Packaging 063 Type ◎Tape packaging type: Paper tape Dimensions [Unit: mm] Type A ※1 B ※1 063 0.44±0.06 0.74±0.06 Dimensions C [Unit: mm] D E F G H 8.0±0.3 3.5±0.05 1.75±0.1 2.0±0.05 2.0±0.05 4.0±0.1 Type t t1※1 A Type 0.52max※1 － B Type 0.65max 0.50max J φ1.5 +0.1 -0 ※1: A, B, t, t1: Sufficient clearance B Type Paper tape A Type Sprocket hole J Paper tape (Press pocket) t t Chip cavity E A D C B F G H t1 Feeding direction － 10 － Tape Packaging 063 Type Dimensions of Reel [Unit: mm] A B C φ178±2.0 φ50min. φ13.0±0.2 D φ21.0±0.8 E 2.0±0.5 W 10.0±1.5 E C B R D t A W － 11 － t 2.5max. R 1.0 Tape Packaging 063 Type 1. Taping shall be right-sided wound. Sprocket hole shall be on the right side against the pull-out direction. 2. Either the width side (W) or the thickness side (T) of the components faces up at random when the components are inserted in the chip cavities. 3. There shall be blank spaces in each reel tape as shown in the following figure. ・Leader part 400mm min. ・Leader part (Blank part) 100mm min. ・Trailer (Blank part) 160mm min. Trailer Chip packaging area Leader part Start End Blank part Blank part No shorter than 160mm No shorter than 100mm No shorter than 400mm Feeding direction 4. Top tape of paper taping shall not be crossed over sprocket holes. 5. Paper tape shall not be seamed. 6. Tensile strength of the tape is 5N (0.51kgf) or over. 7. The number of the chip missing from tape reel shall be 1 piece at a maximum per reel. 8. The number of packaged chips per reel is 15,000 pieces. 9. Label indicating part No., quantity and control No. shall be attached to the outside of reel. 10. Peeling strength of top tape shall be 0.1 to 0.7N (10.2 to 71.4gf) when top tape is peeled from carrier tape at an angle of 0°to 20°. 0 to 20° － 12 － Tape Packaging 063 Type ［Packaging Mode］ Tape packaging Customer Label contents Unreeling direction 1. Manufacture Name 2. Customer Parts No. 3. Our parts no. Reel 4. Quantity Customer Label 5. Control No. (Shipping lot number)※ Our control label 6. Manufacturing site MADE IN ○○○ 7. RoHS A ※Shipping lot number is marked on our control label and is also traceable from Control number shown in customer label; no shipping lot number is marked on customer label. B C Code A B Size 190 185 C 70 140 Material: Paper reel 5reel max. 10reel max. ［Unit: mm］ (The size is only for reference.) Packaging unit: 5 reels or 10 reels in a box at a maximum Note: Labels are attached on reels/boxes only after components passed all inspections. Labeled products: Acceptance components － 13 － Composition of the shipping lot number （ex） 5 Year of production Month of production ① Sequence number ② ① First digit of lot No.: ② ③ Second digit of lot No.: Sequence number of lot No.: Month Code □○※※※△△△△△ A 1 2 3 A B C 4 D ③ Production year (Last number of the Christian era) Example: 2015year → 5 Month of production (See the table below.) Alphanumeric characters including space 5 E 6 F － 14 － 7 G 8 H 9 J 10 K 11 L 12 M － 15 － Operating conditions for guarantee of products are as shown in the specification. Please note that TAIYO YUDEN CO., LTD. shall not be responsible for a failure and/or abnormality which are caused by use under the conditions other than aforesaid operating conditions. All electronic components listed in this specification are developed, designed and intended for use in general electronics equipment(for AV, office automation, household, office supply, information service, telecommunications, 〔such as mobile phone or PC〕 etc). Before incorporating the components or devices into any equipment in the field such as transportation, (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network(telephone exchange, base station) etc. which may have direct influence to harm or injure a human body, please contact TAIYO YUDEN CO., LTD. for more detail in advance. Do not incorporate the components into any equipment in fields such as aerospace, aviation, nuclear control, submarine system, military, etc. where higher safety and reliability are especially required. In addition, even electronic components or functional modules that are used for the general electronic equipment, if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliability evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to install a protective circuit is strongly recommended at customer's design stage. Please conduct validation and verification of products in actual condition of mounting and operating environment before commercial shipment of the equipment. The contents of this specification are applicable to the components which are purchased from our sales offices or distributors (so called TAIYO YUDEN’s official sales channel). It is only applicable to the components purchased from any of TAIYO YUDEN’s official sales channel. Please note that TAIYO YUDEN CO., LTD. shall have no responsibility for any controversies or disputes that may occur in connection with a third party's intellectual property rights and other related rights arising from your usage of products in this specification. Taiyo Yuden Co., Ltd. grants no license for such rights. Caution for export Certain items in this specification may require specific procedures for export according to Foreign Exchange and Foreign Trade Control Law of Japan, U.S. Export Administration Regulations, and other applicable regulations. Should you have any question or inquiry on this matter, please contact our sales staff. － 16 －