有关敝公司产品的注意事项
【一般电子设备】
请务必在使用敝公司产品之前阅读。
注意
■ 本产品目录中所记载的内容为2018 年10月之内容。因改良等原因，可能会不经预告而变更记载内容，所以请务必在
使用前先确认最新的产品信息。未按照本产品目录中所记载的内容或交货规格说明书使用敝公司产品的，即便其致
使使用设备发生损害、瑕疵等时，敝公司也不承担任何责任，敬请悉知。
■ 就规格相关的详细内容，敝公司备有交货规格说明书，详情请向敝公司咨询。
■ 使用敝公司产品时，请务必事先安装到设备之后，在实际使用的环境下进行评估和确认。
■ 本产品目录中所记载的产品可使用于一般电子设备［音像设备、办公自动化设备、家电产品、办公设备、信息 /通讯设
备（手机、电脑等）］以及医疗设备（国际（IMDRF）第一类，第二类）。因此，若考虑将本产品目录中所记载的产品使
用于可能会直接危及生命或身体的设备［运输用设备（汽车驱动控制设备、火车控制设备、船舶控制设备等）、交通
信号设备、防灾设备、医疗设备（国际（IMDRF ）第三类）、高公共性信息通信设备（电话交换机以及电话、无线、广
播电视等基站）］等时，请务必事先向敝公司咨询。
另外，请勿将敝公司产品使用于对安全性和可靠性要求较高的设备（航天设备、航空设备※、医疗设备（国际（IMDRF）
第四类）、原子能控制设备、海底设备、军事设备等）。
※ 注释 ：仅限于对航空设备的安全运行不产生直接干扰的设备
［机内娱乐设备、机内照明设备、电动座椅、餐饮设备等］，在满足敝公司另行指定的相关
条件时，亦可将敝公司产品用于以上用途。在贵公司考虑将敝公司的产品用于以上用途时，请务必事先向敝公司咨询相关的信息。
且即便属于一般电子设备，使用于对安全性和可靠性要求较高的设备、电路上时，敝公司建议进行充分的安全评估，
并根据需要，在设计时追加保护电路等。
未经敝公司的事先书面同意，把本产品目录中所记载的产品使用于前述需要向敝公司咨询的设备或敝公司禁止使用
的设备，从而给客户或第三方造成损害的，敝公司不承担任何责任，敬请悉知。
■ 本产品目录中所记载的信息是用于说明相关产品的典型操作以及相关应用。此类信息的使用不代表对于敝公司以及
第三方的知识产权以及其他权利的使用许可或是不侵权保证。
■ 敝公司产品的保证范围仅限于交付的敝公司产品单品，就敝公司产品的故障或瑕疵所誘発的损害，敝公司不承担任
何责任，敬请悉知。但是，以书面形式另行签署了交易基本合同书，品质保证协定书等时，敝公司将根据该合同等的
条件提供保证。
■ 本产品目录中所记载的内容适用于从敝公司营业所、销售子公司、销售代理店（即“正规销售渠道”）购买的敝公司产
品，并不适用于从上述以外的渠道购买的敝公司产品，敬请悉知。
■ 出口相关注意事项
本产品目录中所记载的部分产品在出口时须事先确认《外汇和对外贸易法》以及美国出口管理的相关法规，并办理
相关手续。如有不明之处，请向敝公司咨询。
19
金属绕线型片状功率电感器 (MCOILTM ME 系列）
METAL WIRE-WOUND CHIP POWER INDUCTORS（MCOILTM ME SERIES）
回流焊
REFLOW
※使用温度范围：
-40 ～+125℃（包含产品本身发热）
* Operating Temp.：-40～+125℃（Including
self-generated heat）
型号标示法
■PARTS
NUMBER
M E
①
K
K
2
0
②
1
6
T
④
③
①类型
①Series name
Code
代码
ME
1
R 0
⑤
M △ △
⑥ ⑦ ⑧
⑤Nominal inductance
⑤标称电感值
Code
代码
（example）
（例）
R47
1R0
4R7
小数点 point
※R＝Decimal
Series
类型name
Metal 金属绕线型片状功率电感器
Wire-wound Chip Power Inductor
Dimensions（T）［mm］
尺寸（ T ）
［mm］
1.0
③Dimensions（L×W）
③尺寸（L×W）
Code
代码
2016
2520
0.47
1.0
4.7
⑥电感量公差
⑥Inductance tolerance
代码
Code
M
Dimensions（L×W）［mm］
尺寸（L×W ）
［mm］
2.0×1.6
2.5×2.0
④包装
④Packaging
Code
代码
T
Nominal
inductance［μH］
标称电感值
［μH］
电感量公差
Inductance
tolerance
±20％
⑦个别规格
⑦Special code
Code
代码
△
Packaging
包装
卷盘带装
Taping
电感器／功率电感器
②尺寸（
②Dimensions（T）
T）
Code
代码
KK
空格 space
△＝Blank
Special
code
个别规格
Standard
标准品
⑧本公司管理记号
⑧Internal code
■STANDARD
EXTERNAL DIMENSIONS / STANDARD QUANTITY
标准外型尺寸／标准数量
推荐焊盘图案
Recommended Land Patterns
实装上的注意
Surface Mounting
・请确认实装状态后使用。
・Mounting and soldering conditions should be checked beforehand.
T
・
本产品焊法限定为回流焊法。
・Applicable
soldering process to these products is reflow soldering only.
Type
A
B
e
C
2016
0.7
0.8
L
W
2520
0.9
1.0
B
A
Type
MEKK2016
MEKK2520
C
1.8
2.2
单位：mm
Unit：mm
A
Standard
quantity［pcs］
标准数量
[pcs]
卷盘带装
Taping
L
W
T
e
2.0±0.2
（0.079±0.008）
2.5±0.2
（0.098±0.008）
1.6±0.2
（0.063±0.008）
2.0±0.2
（0.079±0.008）
1.0 max
（0.039 max）
1.0 max
（0.039 max）
0.5±0.3
（0.020±0.012）
0.65±0.3
（0.026±0.012）
3000
3000
单位：
mm（inch）
Unit：mm（inch）
型号一览
■PARTS
NUMBER
●MEKK2016
MEKK2016 型 type
Parts型号
number
MEKK2016TR47M
MEKK2016TR68M
MEKK2016T1R0M
MEKK2016T2R2M
【厚度:1.0mm
max.】
【Thickness：1.0mm
EHS
Inductance
tolerance
电感量公差
RoHS
RoHS
RoHS
RoHS
0.47
0.68
1.0
2.2
±20％
±20％
±20％
±20％
MEKK2520 型 type
●MEKK2520
Parts型号
number
MEKK2520TR33M
MEKK2520TR47M
MEKK2520T1R0M
MEKK2520T1R5M
MEKK2520T2R2M
MEKK2520T4R7M
max.】
Nominal
inductance
标称电感值
［μH］
［μ
H］
【厚度:1.0mm
max.】
【Thickness：1.0mm
Self-resonant
自共振频率
frequency
［MHｚ］
［MHｚ］（min.）
（min.）
-
DC直流电阻
Resistance
［Ω］（max.）
［Ω］
（max.）
Rated
current ※） ［ｍA］（max.）
额定电流 ※）
［ｍ A］
（max.）
Measuring
测试频率
温度上升允许电流
Temperature
rise current frequency［MHz］
［MHz］
Idc1
Idc2
Idc1
Idc2
4,500
4,300
1
3,800
3,300
1
3,600
3,100
1
2,400
1,900
1
直流重叠允许电流
Saturation current
0.030
0.052
0.060
0.150
max.】
EHS
标称电感值
Nominal
inductance
［μH］
［μ
H］
电感量公差
Inductance
tolerance
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.33
0.47
1.0
1.5
2.2
4.7
±20％
±20％
±20％
±20％
±20％
±20％
Self-resonant
自共振频率
frequency
［MHｚ］
［MHｚ］（min.）
（min.）
-
DC直流电阻
Resistance
［Ω］（max.）
［Ω］
（max.）
Rated
current ※） ［ｍA］（max.）
额定电流 ※）
［ｍ A］
（max.）
Measuring
测试频率
温度上升允许电流
Temperature
rise current frequency［MHz］
［MHz］
Idc1
Idc2
Idc2
Idc1
6,400
5,100
1
5,900
4,800
1
4,300
3,300
1
3,200
2,800
1
3,100
2,400
1
1,600
1,500
1
直流重叠允许电流
Saturation current
0.022
0.025
0.053
0.069
0.097
0.240
※）直流重叠允许电流（Idc1）
为直流重叠带来的电感值下降，范围在30％以内的直流电感值（at 20℃）
※）温度上升允许电流
The saturation current
value
(Idc1) is the DC current value（at
having
inductance decrease down to 30%. (at 20℃)
※）
（Idc2）
为温度上升到40℃时的直流电感值
20℃）
※）最大额定电流值为能够满足直流重叠允许电流和温度上升允许电流的直流电流值
The temperature rise current value（Idc2) is the DC current value having temperature increase up to 40℃. (at 20℃)
※）
※） The rated current is the DC current value that satisfies both of current value saturation current value and temperature rise current value.
※） Idc2
Idc2 测试基板规格
Measurement board材料
data：FR4Material:FR4
※）
基板尺寸 ：
100×50×1.6t mm
Board
dimensions：100×50×1.6t ㎜
焊盘尺寸 ：
45×45 mm (双面基板)
Pattern
dimensions：45×45 ㎜ (Double side board)
焊盘厚度 ：
70μm
Pattern thickness：70μm
i_wound_ME_e-E07R01
▶ 由于篇幅有限，本产品目录中只记载了有代表性的产品规格，若考虑使用弊司产品时，请确认交货规格说明书中的详细规格。
另外，有关各产品的详细信息
（特性图、可靠性信息、使用时的注意事项等），请参阅弊司网站
（http://www.ty-top.com/ ）。
19
49
金属绕线型片状功率电感器 (MCOILTM ME-H 系列）
METAL WIRE-WOUND CHIP POWER INDUCTORS（MCOILTM ME-Ｈ SERIES）
回流焊
REFLOW
※使用温度范围：
-40 ～+125℃（包含产品本身发热）
* Operating Temp.：-40～+125℃（Including
self-generated heat）
型号标示法
■PARTS
NUMBER
M E
①
K
K
2
0
②
1
6
Ｈ
④
③
①类型
①Series name
代码
Code
ME
1
R 0
⑤
M △ △
⑥ ⑦ ⑧
电感器／功率电感器
⑤Nominal inductance
⑤标称电感值
Code
代码
（example）
（例）
R47
1R0
2R2
小数点 point
※R＝Decimal
类型name
Series
Metal 金属绕线型片状功率电感器
Wire-wound Chip Power Inductor
②尺寸（
T）
②Dimensions（T）
Code
代码
KK
Dimensions（T）［mm］
尺寸（ T ）
［mm］
1.0
③Dimensions（L×W）
③尺寸（L×W）
代码
Code
2012
2016
Nominal
inductance［μH］
标称电感值
［μH］
0.47
1.0
2.2
⑥电感量公差
⑥Inductance tolerance
Code
代码
M
尺寸（L×W ）
［mm］
Dimensions（L×W）［mm］
2.0×1.2
2.0×1.6
④包装
④Packaging
Code
代码
H
空格 space
△＝Blank
Inductance
tolerance
电感量公差
±20％
⑦个别规格
⑦Special code
Code
代码
△
Packaging
包装
编带（高特性规格）
Taping（special
specification）
Special
code
个别规格
标准品
Standard
⑧本公司管理记号
⑧Internal code
标准外型尺寸／标准数量
■STANDARD
EXTERNAL DIMENSIONS / STANDARD QUANTITY
推荐焊盘图案 Land Patterns
Recommended
实装上的注意
Surface
Mounting
・请确认实装状态后使用。
・Mounting
and soldering conditions should be checked beforehand.
T
・本产品焊法限定为回流焊法。
・Applicable
soldering process to these products is reflow soldering only.
Type
A
B
e
C
2012
0.7
0.8
L
W
2016
0.7
0.8
B
A
Type
MEKK2012H
MEKK2016H
A
C
1.4
1.8
单位：
mm
Unit：mm
Standard
quantity［pcs］
标准数量
[pcs]
卷盘带装
Taping
L
W
T
e
2.0±0.2
（0.079±0.008）
2.0±0.2
（0.079±0.008）
1.2±0.2
（0.047±0.008）
1.6±0.2
（0.063±0.008）
1.0 max
（0.039 max）
1.0 max
（0.039 max）
0.5±0.3
（0.020±0.012）
0.5±0.3
（0.020±0.012）
3000
3000
单位：
Unit：mm（inch）
mm（inch）
型号一览
■PARTS
NUMBER
MEKK2012H 型 type
●MEKK2012H
Parts型号
number
MEKK2012HR47M
【厚度:1.0mm
max.】
【Thickness：1.0mm
EHS
Inductance
tolerance
电感量公差
RoHS
0.47
±20％
MEKK2016H 型 type
●MEKK2016H
Parts型号
number
MEKK2016HR47M
MEKK2016H1R0M
MEKK2016H2R2M
max.】
Nominal
inductance
标称电感值
［μH］
［μ
H］
【厚度:1.0mm
max.】
【Thickness：1.0mm
Self-resonant
自共振频率
frequency
［MHｚ］
［MHｚ］（min.）
（min.）
-
DC直流电阻
Resistance
［Ω］（max.）
［Ω］
（max.）
Rated
current ※） ［ｍA］（max.）
额定电流 ※）
［ｍ A］
（max.）
Measuring
测试频率
温度上升允许电流
Temperature
rise current frequency［MHz］
［MHz］
Idc1
Idc2
Idc1
Idc2
4,500
4,200
1
直流重叠允许电流
Saturation current
0.030
max.】
EHS
Nominal
inductance
标称电感值
［μH］
［μ
H］
Inductance
tolerance
电感量公差
RoHS
RoHS
RoHS
0.47
1.0
2.2
±20％
±20％
±20％
自共振频率
Self-resonant
frequency
［MHｚ］
［MHｚ］（min.）
（min.）
-
DC直流电阻
Resistance
［Ω］（max.）
［Ω］
（max.）
Rated
current ※） ［ｍA］（max.）
额定电流 ※）
［ｍ A］
（max.）
Measuring
测试频率
温度上升允许电流
直流重叠允许电流
Saturation current Temperature
rise current frequency［MHz］
［MHz］
0.026
0.048
0.100
Idc1
Idc1
5,300
4,000
2,300
Idc2
Idc2
4,700
3,500
2,300
1
1
1
※） The saturation current value (Idc1) is the DC current value having inductance decrease down to 30%. (at 20℃)
※）直流重叠允许电流（Idc1）为直流重叠带来的电感值下降，范围在30％以内的直流电感值（at 20℃）
※） The temperature rise current value（Idc2) is the DC current value having temperature increase up to 40℃. (at 20℃)
※）温度上升允许电流（Idc2）为温度上升到40℃时的直流电感值（at 20℃）
※） The rated current is the DC current value that satisfies both of current value saturation current value and temperature rise current value.
※）最大额定电流值为能够满足直流重叠允许电流和温度上升允许电流的直流电流值
※） Idc2 Measurement board data
Material:FR4
Board dimensions：100×50×1.6t ㎜
※）Idc2 测试基板规格
材料 ：FR4
Pattern dimensions：45×45 ㎜ (Double side board)
基板尺寸 ：100×50×1.6t mm
Pattern
thickness：70μm
焊盘尺寸 ：
45×45 mm (双面基板)
焊盘厚度 ：70μm
i_wound_ME-H_e-E07R01
▶ 由于篇幅有限，本产品目录中只记载了有代表性的产品规格，若考虑使用弊司产品时，请确认交货规格说明书中的详细规格。
另外，有关各产品的详细信息
（特性图、可靠性信息、使用时的注意事项等），请参阅弊司网站
（http://www.ty-top.com/ ）。
50
19
METAL WIRE-WOUND CHIP POWER INDUCTORS
(MCOILTM ME SERIES／MCOILTM ME-H SERIES)
■PACKAGING
①Minimum Quantity
Standard Quantity [pcs]
Tape ＆ Reel
3000
3000
3000
Type
MEKK2012
MEKK2016
MEKK2520
②Tape Material
●Embossed Tape
Top tape
Chip Filled
Sprocket hole
Base tape
Chip cavity
Chip
③Taping dimensions
●Embossed tape 8mm wide (0.315 inches wide)
3.5±0.1
(0.138±0.004)
A
B
F
1.75±0.1
(0.069±0.004）
8.0±0.2
(0.315±0.008)
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
Sprocket hole
4.0±0.1
(0.157±0.004)
2.0±0.05
(0.079±0.002)
Type
MEKK2012
MEKK2016
MEKK2520
Chip cavity
A
B
1.45±0.1
2.25±0.1
（0.057±0.004）
（0.089±0.004）
1.9±0.1
2.45±0.1
（0.075±0.004）
（0.097±0.004）
2.4±0.1
2.9±0.1
（0.094±0.004）
（0.114±0.004）
Insertion pitch
F
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
Tape thickness
T
K
0.25±0.05
1.1±0.1
（0.009±0.002）
（0.043±0.004）
0.25±0.05
1.2±0.1
（0.009±0.002）
（0.047±0.004）
0.25±0.05
1.1±0.1
（0.009±0.002）
（0.043±0.004）
Unit：mm（inch）
④Leader and Blank portion
Blank portions
Chip cavity
Blank portions
Leader
Direction of tape feed
160 mm or more
160 mm ～ 200 mm
400 mm ～ 560 mm
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_ME_pack_e-E07R01
⑤Reel size
Type
MEKK2012
MEKK2016
MEKK2520
φD
Reel size (Reference values)
φd
W
180+0/-3
（7.087+0/-0.118）
60+1/-0
（2.36+0.039/0）
10.0±1.5
（0.394±0.059）
Unit：mm（inch）
⑥Top Tape Strength
The top The top tape requires a peel-off force of 0.1 to 1.0N in the direction of the arrow as illustrated below.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_ME_pack_e-E07R01
METAL WIRE-WOUND CHIP POWER INDUCTORS
(MCOILTM ME SERIES／MCOILTM ME-H SERIES)
■RELIABILITY DATA
1. Operating Temperature Range
Specified Value
Test Methods and
Remarks
ME series
－40～＋125℃
ME-H series
Including self-generated heat
2. Storage Temperature Range
Specified Value
Test Methods and
Remarks
ME series
－40～＋85℃
ME-H series
0 to 40℃ for the product with taping.
3. Rated current
Specified Value
ME series
ME-H series
Within the specified tolerance
4. Inductance
Specified Value
Test Methods and
Remarks
ME series
ME-H series
Measuring equipment
Measuring frequency
Within the specified tolerance
: LCR Meter （HP 4294A or equivalent）
: 1MHz、0.5V
5. DC Resistance
Specified Value
Test Methods and
Remarks
ME series
ME-H series
Measuring equipment
Within the specified tolerance
: DC ohmmeter （HIOKI 3227 or equivalent）
6. Self resonance frequency
Specified Value
ME series
ME-H series
－
7. Temperature characteristic
Specified Value
Test Methods and
Remarks
ME series
ME-H series
Inductance change : Within ±15%
Measurement of inductance shall be taken at temperature range within －40℃～＋125℃.
With reference to inductance value at ＋20℃., change rate shall be calculated.
8. Resistance to flexure of substrate
Specified Value
Test Methods and
Remarks
ME series
ME-H series
No damage
The test samples shall be soldered to the test board by the reflow. As illustrated below, apply force in the direction of the arrow indicating
until deflection of the test board reaches to 2 mm.
Test board size
: 100×40×1.0 mm
Test board material
: Glass epoxy-resin
Solder cream thickness
: 0.12 mm
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_ME_reli_e-E07R01
9. Insulation resistance : between wires
Specified Value
ME series
ME-H series
－
10. Insulation resistance : between wire and over-coating
Specified Value
ME series
ME-H series
DC25V 100k Ωmin
11. Withstanding voltage : between wire and over-coating
Specified Value
ME series
ME-H series
－
12. Adhesion of terminal electrode
Specified Value
Test Methods and
Remarks
ME series
ME-H series
No abnormality.
The test samples shall be soldered to the test board by the reflow.
Applied force
: 10N to X and Y directions.
Duration
: 5s.
Solder cream thickness
: 0.12mm.
13. Resistance to vibration
Specified Value
ME series
ME-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow.
Then it shall be submitted to below test conditions.
Test Methods and
Remarks
Frequency Range
Total Amplitude
Sweeping Method
10～55Hz
1.5mm (May not exceed acceleration 196m/s2)
10Hz to 55Hz to 10Hz for 1min.
X
Time
Y
For 2 hours on ach X, Y, and Z axis.
Z
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
14. Solderability
Specified Value
Test Methods and
Remarks
ME series
ME-H series
At least 90％ of surface of terminal electrode is covered by new solder.
The test samples shall be dipped in flux, and then immersed in molten solder as shown in below table.
Flux : Methanol solution containing rosin 25%.
Solder Temperature
245±5℃
Time
5±0.5 sec.
※Immersion depth : All sides of mounting terminal shall be immersed.
15. Resistance to soldering heat
Specified Value
Test Methods and
Remarks
ME series
ME-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test sample shall be exposed to reflow oven at 230℃ for 40 seconds, with peak temperature at 260＋0/－5℃ for 5 seconds, 2 times.
Test board material
: Glass epoxy-resin
Test board thickness
: 1.0mm
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_ME_reli_e-E07R01
16. Thermal shock
Specified Value
Test Methods and
Remarks
ME series
ME-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow. The test samples shall be placed at specified temperature for specified
time by step 1 to step 4 as shown in below table in sequence. The temperature cycle shall be repeated 100 cycles.
Conditions of 1 cycle
Step
Temperature (℃)
Duration (min)
1
－40±3
30±3
2
Room temperature
Within 3
3
＋85±2
30±3
4
Room temperature
Within 3
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
17. Damp heat
Specified Value
Test Methods and
Remarks
ME series
ME-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at specified temperature and humidity as shown in below table.
Temperature
60±2℃
Humidity
90～95%RH
Time
500＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
18. Loading under damp heat
Specified Value
Test Methods and
Remarks
ME series
ME-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at specified temperature and humidity and applied the rated current
continuously as shown in below table.
Temperature
60±2℃
Humidity
90～95％RH
Applied current
Rated current
Time
500＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
19. Low temperature life test
Specified Value
Test Methods and
Remarks
ME series
ME-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown
in below table.
Temperature
－40±2℃
Time
500＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
20. High temperature life test
Specified Value
Test Methods and
Remarks
ME series
ME-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown
in below table.
Temperature
125±2℃
Time
500＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
21. Loading at high temperature life test
Specified Value
ME series
ME-H series
－
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_ME_reli_e-E07R01
22. Standard condition
ME series
Specified Value
ME-H series
Standard test condition :
Unless otherwise specified, temperature is 20±15℃ and 65±20％of relative humidity.
When there is any question concerning measurement result: In order to provide correlation
data, the test shall be condition of 20±2℃ of temperature, 65±5% relative humidity.
Inductance is in accordance with our measured value.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_ME_reli_e-E07R01
METAL WIRE-WOUND CHIP POWER INDUCTORS
(MCOILTM ME SERIES／MCOILTM ME-H SERIES)
■PRECAUTIONS
1. Circuit Design
Precautions
◆Operating environment
1. The products described in this specification are intended for use in general electronic equipment,(office supply equipment,
telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical
equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear
control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or
damage. For such uses, contact TAIYO YUDEN Sales Department in advance.
2. PCB Design
Precautions
Technical
considerations
◆Land pattern design
1. Please refer to a recommended land pattern.
◆Land pattern design
Surface Mounting
・ Mounting and soldering conditions should be checked beforehand.
・ Applicable soldering process to this products is reflow soldering only.
3. Considerations for automatic placement
Precautions
Technical
considerations
◆Adjustment of mounting machine
1. Excessive impact load should not be imposed on the products when mounting onto the PC boards.
2. Mounting and soldering conditions should be checked beforehand.
◆Adjustment of mounting machine
1. When installing products, care should be taken not to apply distortion stress as it may deform the products.
4. Soldering
Precautions
◆Reflow soldering
1. Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified.
2. The product shall be used reflow soldering only.
3. Please do not add any stress to a product until it returns in normal temperature after reflow soldering.
◆Lead free soldering
1. When using products with lead free soldering, we request to use them after confirming adhesion, temperature of resistance to soldering
heat, soldering etc sufficiently.
◆Reflow soldering
1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently
degrade the reliability of the products.
Recommended reflow condition (Pb free solder)
Technical
considerations
5. Cleaning
Precautions
Technical
considerations
◆Cleaning conditions
1. Washing by supersonic waves shall be avoided.
◆Cleaning conditions
1. If washed by supersonic waves, the products might be broken.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_ME_prec_e-E07R01
6. Handling
Precautions
Technical
considerations
◆Handling
1. Keep the product away from all magnets and magnetic objects.
◆Breakaway PC boards (splitting along perforations)
1. When splitting the PC board after mounting product, care should be taken not to give any stresses of deflection or twisting to the board.
2. Board separation should not be done manually, but by using the appropriate devices.
◆Mechanical considerations
1. Please do not give the product any excessive mechanical shocks.
2. Please do not add any shock and power to a product in transportation.
◆Pick-up pressure
1. Please do not push to add any pressure to a winding part. Please do not give any shock and push into a ferrite core exposure part.
◆Packing
1. Please avoid accumulation of a packing box as much as possible.
◆Handling
1. There is a case that a characteristic varies with magnetic influence.
◆Breakaway PC boards (splitting along perforations)
1. The position of the product on PCBs shall be carefully considered to minimize the stress caused from splitting of the PCBs.
◆Mechanical considerations
1. There is a case to be damaged by a mechanical shock.
2. There is a case to be broken by the handling in transportation.
◆Pick-up pressure
1. Damage and a characteristic can vary with an excessive shock or stress.
◆Packing
1. If packing boxes are accumulated, that could cause a deformation on packing tapes or a damage on the products.
7. Storage conditions
Precautions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the
storage area should be controlled.
・ Recommended conditions
Ambient temperature : 0～40℃
Humidity : Below 70% RH
・ The ambient temperature must be kept below 30℃. Even under ideal storage conditions, solderability of products electrodes may
decrease as time passes.
For this reason, product should be used within 6 months from the time of delivery.
In case of storage over 6 months, solderability shall be checked before actual usage.
Technical
considerations
◆Storage
1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes
and deterioration of taping/packaging materials may take place.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_ME_prec_e-E07R01
金属多层片状功率电感器 (MCOILTM MC 系列）
METAL MULTILAYER CHIP POWER INDUCTORS（MCOILTM MC SERIES）
回流焊
REFLOW
※使用温度范围：
-40 ～+125℃（包含产品本身发热）
* Operating Temp.：-40～+125℃(Including
self-generated heat)
型号标示法
■PARTS
NUMBER
M C
①
K
K
2
0
②
1
③
①Series name
①类型
代码
Code
MC
2
T
④
1
R 0
⑤
M △ △
⑥ ⑦ ⑧
⑤Nominal
inductance
⑤标称电感值
Code
代码
（example）
（例）
R24
R47
1R0
※R＝Decimal
小数点 point
类型name
Series
金属多层片状功率电感器
Metal base
multilayer chip power inductor
Thickness［mm］
产品厚度
（T）
［mm］
0.55 max
0.60 max
0.65 max
0.80 max
1.0 max
Type（inch）
外型
（inch）
1005
1608
2012
1005(0402)
1608（0603）
2012（0805）
④包装
④Packaging
Code
代码
Ｔ
0.24
0.47
1.0
⑥电感量公差tolerance
⑥Inductance
代码
Code
M
③尺寸（
L×W）
③Dimensions（L×W）
Code
代码
Nominal
inductance［μH］
标称电感值
［μH］
Dimensions
尺寸（L×W ）
［mm］
（L×W）［mm］
1.0×0.5
1.6×0.8
2.0×1.25
Packaging
包装
Taping
卷盘带装
电感器／功率电感器
②产品厚度（
②Thickness T）
Code
代码
EE
FK
FE
HK
KK
空格 space
△＝Blank
电感量公差
Inductance
tolerance
±20％
⑦本公司管理记号
⑦Special code1 1
Code
代码
△
G
H
Special code1 1
本公司管理记号
标准品
Standard
电极5面品
5 surface
terminal
标准品（内部代码）
Standard
(Internal Code)
⑧本公司管理记号
⑧Special code2 2
代码
Code
△
N
本公司管理记号
Special code2 2
无表示
Non
Polarity
Polarity
Marking
有极性表示
标准外型尺寸／标准数量
■STANDARD
EXTERNAL DIMENSIONS / STANDARD QUANTITY
标准品
Standard
电极5面品
5 surface
terminal
Ｐolarity
Marking
极性表示产品
W
W
W
L
L
L
T
T
T
e
e
e
标准数量
[pcs]
Standard
quantity［pcs］
Paper
tape
Embossed
纸带
压纹带tape
型号
Type
L
W
T
e
MCEE1005
(0402)
MCFK1608
(0603)
MCFE1608
（0603）
MCKK1608
（0603）
MCHK2012
（0805）
MCKK2012
（0805）
1.0±0.2
（0.039±0.008）
1.6±0.2
（0.063±0.008）
1.6±0.2
（0.063±0.008）
1.6±0.2
（0.063±0.008）
2.0±0.2
（0.079±0.008）
2.0±0.2
（0.079±0.008）
0.5±0.2
（0.020±0.008）
0.8±0.2
（0.031±0.008）
0.8±0.2
（0.031±0.008）
0.8±0.2
（0.031±0.008）
1.25±0.2
（0.049±0.008）
1.25±0.2
（0.049±0.008）
0.55 max
（0.022 max）
0.60 max
（0.024 max）
0.65 max
（0.026 max）
1.0 max
（0.039 max）
0.80 max
（0.031 max）
1.0 max
（0.039 max）
0.25±0.15
（0.010±0.006）
0.3±0.2
（0.012±0.008）
0.3±0.2
（0.012±0.008）
0.3±0.2
（0.012±0.008）
0.5±0.3
（0.02±0.012）
0.5±0.3
（0.02±0.012）
10000
4000
－
4000
－
－
3000
4000
－
－
3000
单位：
Unit：mm（inch）
mm（inch）
i_mlci_MC_e-E07R01
▶ 由于篇幅有限，本产品目录中只记载了有代表性的产品规格，若考虑使用弊司产品时，请确认交货规格说明书中的详细规格。
另外，有关各产品的详细信息
（特性图、可靠性信息、使用时的注意事项等），请参阅弊司网站
（http://www.ty-top.com/ ）。
19
51
■PARTS
NUMBER
型号一览
●MC1005
Parts
number
型号
MCEE1005TR10MHN
MCEE1005TR22MHN
MCEE1005TR47MHN
MCEE1005T1R0MHN
EHS
Nominal
inductance
标称电感值
［μH］
［μ
H］
Inductance
tolerance
电感量公差
RoHS
RoHS
RoHS
RoHS
0.10
0.22
0.47
1.0
±20％
±20％
±20％
±20％
EHS
Nominal
inductance
标称电感值
［μH］
［μ
H］
Inductance
tolerance
电感量公差
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.24
0.47
1.0
0.24
0.47
1.0
0.24
0.47
1.0
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
EHS
Nominal
inductance
标称电感值
［μH］
［μ
H］
Inductance
tolerance
电感量公差
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.24
0.47
1.0
0.24
0.47
1.0
±20％
±20％
±20％
±20％
±20％
±20％
DC直流电阻
Resistance
［［mΩ］
mΩ］
（max.）
（typ.）
50
41
80
65
140
114
300
244
额定电流
Rated
current(Idc1)
（Idc1）
（max.）
［［A］（max.）
A］
额定电流
Rated
current(Idc2)
（Idc2）
［A］（max.）
］
（max.）
［A
Measuring
测试频率
frequency
［MHz］
［MHz］
Thickness
厚度
［［mm］（max.）
mm］（max.）
2.00
1.60
1.20
1.00
2.00
1.60
1.20
0.80
1
1
1
1
0.55
0.55
0.55
0.55
DC直流电阻
Resistance
［［mΩ］
mΩ］
（max.）
（typ.）
50
40
85
69
224
182
100
75
150
114
340
270
38
35
55
44
123
100
额定电流
Rated
current(Idc1)
（Idc1）
（max.）
［［A］（max.）
A］
2.30
1.90
1.50
2.60
2.00
1.40
2.80
2.40
2.00
额定电流
Rated
current(Idc2)
（Idc2）
［A］（max.）
］
（max.）
［A
2.10
1.60
0.90
1.50
1.20
0.80
2.60
2.00
1.30
Measuring
测试频率
frequency
［MHz］
［MHz］
厚度
Thickness
［［mm］（max.）
mm］（max.）
1
1
1
1
1
1
1
1
1
0.60
0.60
0.60
0.65
0.65
0.65
1.00
1.00
1.00
DC直流电阻
Resistance
［［mΩ］
mΩ］
（max.）
（typ.）
24
19
36
30
111
90
25
20
39
32
90
73
额定电流
Rated
current(Idc1)
（Idc1）
］
［［A］（max.）
A （max.）
额定电流
Rated
current(Idc2)
（Idc2）
］
［［A］（max.）
A （max.）
Measuring
测试频率
frequency
［MHz］
［MHz］
Thickness
厚度
［［mm］（max.）
mm］（max.）
4.32
3.21
2.26
6.20
4.50
3.60
3.60
3.15
1.47
4.00
3.10
2.10
1
1
1
1
1
1
0.80
0.80
0.80
1.00
1.00
1.00
●MC1608
型号
Parts
number
电感器／功率电感器
MCFK1608TR24M
MCFK1608TR47M
MCFK1608T1R0M
MCFE1608TR24MG
MCFE1608TR47MG
MCFE1608T1R0MG
MCKK1608TR24M N
MCKK1608TR47M N
MCKK1608T1R0M N
●MC2012
Parts
number
型号
MCHK2012TR24M
MCHK2012TR47M
MCHK2012T1R0M
MCKK2012TR24M
MCKK2012TR47M
MCKK2012T1R0M
※）直流重叠允许电流（Idc1）为直流重叠带来的电感值下降，范围在30％以内的直流电感值（at 20℃）
※Idc1
is the DC value
at which the initial L由自发热引起的温度上升达
value is decreased within 30% by ℃以下的电流值
※）
额定电流
℃）（at 20℃）
(Idc2)：直流电流负载时，
40 the application of（DC
20bias.
※Idc2 is the DC value at which the temperature of element is increased within 40℃ by the application of DC bias. （at 20℃）
i_mlci_MC_e-E07R01
▶ 由于篇幅有限，本产品目录中只记载了有代表性的产品规格，若考虑使用弊司产品时，请确认交货规格说明书中的详细规格。
另外，有关各产品的详细信息
（特性图、可靠性信息、使用时的注意事项等），请参阅弊司网站
（http://www.ty-top.com/ ）。
52
19
Multilayer chip inductors
Multilayer chip inductors for high frequency, Multilayer chip bead inductors
Multilayer common mode choke coils（MC series F type）
Metal Multilayer Chip Power Inductors (MCOILTM MC series)
■PACKAGING
①Minimum Quantity
●Tape & Reel Packaging
Type
CK1608（0603）
CK2125（0805）
CKS2125（0805）
CKP1608（0603）
CKP2012（0805）
CKP2016（0806）
CKP2520（1008）
LK1005（0402）
LK1608（0603）
LK2125（0805）
HK0603（0201）
HK1005（0402）
HK1608（0603）
HK2125（0805）
HKQ0603W（0201）
HKQ0603S（0201）
HKQ0603U（0201）
AQ105（0402）
BK0603（0201）
BK1005（0402）
BKH0603（0201）
BKH1005（0402）
BK1608（0603）
BK2125（0805）
BK2010（0804）
BK3216（1206）
BKP0603（0201）
BKP1005（0402）
BKP1608（0603）
BKP2125（0805）
MCF0605（0202）
MCF0806（0302）
MCF1210（0504）
MCF2010（0804）
MCEE1005（0402）
MCFK1608（0603）
MCFE1608（0603）
MCKK1608（0603）
MCHK2012（0806）
MCKK2012（0805）
Thickness
mm（inch）
0.8 （0.031）
0.85（0.033）
1.25（0.049）
0.85（0.033）
1.25（0.049）
0.8 （0.031）
0.9 （0.035）
0.9 （0.035）
0.7 （0.028）
0.9 （0.035）
1.1 （0.043）
0.5 （0.020）
0.8 （0.031）
0.85（0.033）
1.25（0.049）
0.3 （0.012）
0.5 （0.020）
0.8 （0.031）
0.85（0.033）
1.0 （0.039）
0.3 （0.012）
0.3 （0.012）
0.3 （0.012）
0.5 （0.020）
0.3 （0.012）
0.5 （0.020）
0.3 （0.012）
0.5 （0.020）
0.8 （0.031）
0.85（0.033）
1.25（0.049）
0.45（0.018）
0.8 （0.031）
0.3 （0.012）
0.5 （0.020）
0.8 （0.031）
0.85（0.033）
0.3 （0.012）
0.4 （0.016）
0.55（0.022）
0.45（0.018）
0.55（0.022）
0.6 （0.024）
0.65（0.026）
1.0 （0.039）
0.8 （0.031）
1.0 （0.039）
Standard Quantity ［pcs］
Paper Tape
Embossed Tape
4000
－
4000
－
－
2000
4000
－
－
2000
4000
－
－
3000
－
3000
－
3000
－
3000
－
2000
10000
－
4000
－
4000
－
－
2000
15000
－
10000
－
4000
－
－
4000
－
3000
15000
－
15000
－
15000
－
10000
－
15000
－
10000
－
15000
－
10000
－
4000
－
4000
－
－
2000
4000
－
－
4000
15000
－
10000
－
4000
－
4000
－
15000
－
－
10000
－
5000
－
4000
10000
－
4000
－
4000
－
3000
4000
－
3000
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E07R01
②Taping material
●Card board carrier tape
Top tape
Base tape
Sprocket hole
Bottom tape
CK
CKP
CK
CKS
LK
LK
LK
HK
HK
HK
HKQ
AQ
1608
1608
2125
2125
1005
1608
2125
0603
1005
1608
0603
105
BK
BK
BK
BK
BK
BKP
BKP
BKP
BKP
BKH
BKH
MCF
MC
MC
MC
0603
1005
1608
2125
2010
0603
1005
1608
2125
0603
1005
0605
1005
1608
2012
CK
CKS
CKP
CKP
CKP
LK
HK
2125
2125
2012
2016
2520
2125
2125
BK
BK
MCF
MCF
MCF
MC
MC
2125
3216
0806
1210
2010
1608
2012
Chip cavity
Chip Filled
Chip
●Embossed Tape
Top tape
Sprocket hole
Base tape
Chip cavity
Chip Filled
Chip
③Taping Dimensions
●Paper tape (8mm wide)
B
T
8.0±0.3
(0.315±0.012)
A
F
Unit：mm（inch）
1.75±0.1
(0.069±0.004）
3.5±0.05
(0.138±0.002)
Sprocket hole
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
4.0±0.1
(0.157±0.004)
2.0±0.05
(0.079±0.002)
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E07R01
Type
Thickness
mm（inch）
CK1608（0603）
0.8 （0.031）
CK2125（0805）
0.85（0.033）
CKS2125（0805）
0.85（0.033）
CKP1608（0603）
0.8 （0.031）
LK1005（0402）
0.5 （0.020）
LK1608（0603）
0.8 （0.031）
LK2125（0805）
0.85（0.033）
HK0603（0201）
0.3 （0.012）
HK1005（0402）
0.5 （0.020）
HK1608（0603）
0.8 （0.031）
HKQ0603W（0201）
0.3 （0.012）
HKQ0603S（0201）
0.3 （0.012）
HKQ0603U（0201）
0.3 （0.012）
AQ105（0402）
0.5 （0.020）
BK0603（0201）
0.3 （0.012）
BK1005（0402）
0.5 （0.020）
BK1608（0603）
0.8 （0.031）
BK2125（0805）
0.85（0.033）
BK2010（0804）
0.45（0.018）
BKP0603（0201）
0.3 （0.012）
BKP1005（0402）
0.5 （0.020）
BKP1608（0603）
0.8 （0.031）
BKP2125（0805）
0.85（0.033）
BKH0603（0201）
0.3 （0.012）
BKH1005（0402）
0.5 （0.020）
MCF0605（0202）
0.3 （0.012）
MCFK1608（0603）
0.6 （0.024）
MCEE1005（0402）
0.55（0.021）
MCFE1608（0603）
0.65（0.026）
MCHK2012（0805）
0.8 （0.031）
Chip cavity
Ａ
Ｂ
1.0±0.2
1.8±0.2
（0.039±0.008）
（0.071±0.008）
1.5±0.2
2.3±0.2
（0.059±0.008）
（0.091±0.008）
1.5±0.2
2.3±0.2
（0.059±0.008）
（0.091±0.008）
1.0±0.2
1.8±0.2
（0.039±0.008）
（0.071±0.008）
0.65±0.1
1.15±0.1
（0.026±0.004）
（0.045±0.004）
1.0±0.2
1.8±0.2
（0.039±0.008）
（0.071±0.008）
1.5±0.2
2.3±0.2
（0.059±0.008）
（0.091±0.008）
0.40±0.06
0.70±0.06
（0.016±0.002）
（0.028±0.002）
0.65±0.1
1.15±0.1
（0.026±0.004）
（0.045±0.004）
1.0±0.2
1.8±0.2
（0.039±0.008）
（0.071±0.008）
0.40±0.06
0.70±0.06
（0.016±0.002）
（0.028±0.002）
0.40±0.06
0.70±0.06
（0.016±0.002）
（0.028±0.002）
0.40±0.06
0.70±0.06
（0.016±0.002）
（0.028±0.002）
0.75±0.1
1.15±0.1
（0.030±0.004）
（0.045±0.004）
0.40±0.06
0.70±0.06
（0.016±0.002）
（0.028±0.002）
0.65±0.1
1.15±0.1
（0.026±0.004）
（0.045±0.004）
1.0±0.2
1.8±0.2
（0.039±0.008）
（0.071±0.008）
1.5±0.2
2.3±0.2
（0.059±0.008）
（0.091±0.008）
1.2±0.1
2.17±0.1
（0.047±0.004）
（0.085±0.004）
0.40±0.06
0.70±0.06
（0.016±0.002）
（0.028±0.002）
0.65±0.1
1.15±0.1
（0.026±0.004）
（0.045±0.004）
1.0±0.2
1.8±0.2
（0.039±0.008）
（0.071±0.008）
1.5±0.2
2.3±0.2
（0.059±0.008）
（0.091±0.008）
0.40±0.06
0.70±0.06
（0.016±0.002）
（0.028±0.002）
0.65±0.1
1.15±0.1
（0.026±0.004）
（0.045±0.004）
0.62±0.03
0.77±0.03
（0.024±0.001）
（0.030±0.001）
1.1±0.05
1.9±0.05
（0.043±0.002）
（0.075±0.002）
0.8±0.05
1.3±0.05
(0.031±0.002)
(0.051±0.002)
1.1±0.05
1.9±0.05
（0.043±0.002）
（0.075±0.002）
1.55±0.2
2.3±0.2
（0.061±0.008）
（0.091±0.008）
Insertion Pitch
Ｆ
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
2.0±0.05
（0.079±0.002）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
2.0±0.05
（0.079±0.002）
2.0±0.05
（0.079±0.002）
4.0±0.1
（0.157±0.004）
2.0±0.05
（0.079±0.002）
2.0±0.05
（0.079±0.002）
2.0±0.05
（0.079±0.002）
2.0±0.05
（0.079±0.002）
2.0±0.05
（0.079±0.002）
2.0±0.05
（0.079±0.002）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
2.0±0.05
（0.079±0.002）
2.0±0.05
（0.079±0.002）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
2.0±0.05
（0.079±0.002）
2.0±0.05
（0.079±0.002）
2.0±0.05
（0.079±0.002）
4.0±0.1
（0.157±0.004）
2.0±0.05
（0.079±0.002）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
Tape Thickness
Ｔ
1.1max
（0.043max）
1.1max
（0.043max）
1.1max
（0.043max）
1.1max
（0.043max）
0.8max
（0.031max）
1.1max
（0.043max）
1.1max
（0.043max）
0.45max
（0.018max）
0.8max
（0.031max）
1.1max
（0.043max）
0.45max
（0.018max）
0.45max
（0.018max）
0.45max
（0.018max）
0.8max
（0.031max）
0.45max
（0.018max）
0.8max
（0.031max）
1.1max
（0.043max）
1.1max
（0.043max）
0.8max
（0.031max）
0.45max
（0.018max）
0.8max
（0.031max）
1.1max
（0.043max）
1.1max
（0.043max）
0.45max
（0.018max）
0.8max
（0.031max）
0.45max
（0.018max）
0.72max
(0.028max)
0.6max
(0.016max)
0.9max
（0.035max）
0.9max
（0.035max）
Unit : mm（inch）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E07R01
●Embossed Tape (8mm wide)
Unit：mm（inch）
A
B
8.0±0.3
(0.315±0.012)
3.5±0.05
(0.138±0.002)
Sprocket hole
F
1.75±0.1
(0.069±0.004）
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
4.0±0.1
(0.157±0.004)
2.0±0.05
(0.079±0.002)
Type
Thickness
mm（inch）
CK2125（0805）
1.25（0.049）
CKS2125（0805）
1.25（0.049）
CKP2012（0805）
0.9 （0.035）
CKP2016（0806）
0.9 （0.035）
Chip cavity
Ａ
Ｂ
1.5±0.2
2.3±0.2
（0.059±0.008）
（0.091±0.008）
1.5±0.2
2.3±0.2
（0.059±0.008）
（0.091±0.008）
1.55±0.2
2.3±0.2
（0.061±0.008）
（0.091±0.008）
1.8±0.1
2.2±0.1
（0.071±0.004）
（0.087±0.004）
Insertion Pitch
Ｆ
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
2.3±0.1
（0.091±0.004）
2.8±0.1
（0.110±0.004）
4.0±0.1
（0.157±0.004）
1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.5±0.2
（0.059±0.008）
1.9±0.1
（0.075±0.004）
0.75±0.05
（0.030±0.002）
1.15±0.05
（0.045±0.002）
1.1±0.1
（0.043±0.004）
1.1±0.1
（0.043±0.004）
1.55±0.2
（0.061±0.008）
2.3±0.2
（0.091±0.008）
3.5±0.1
（0.138±0.004）
0.95±0.05
（0.037±0.002）
1.40±0.05
（0.055±0.002）
2.3±0.1
（0.091±0.004）
1.95±0.1
（±0.004）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
2.0±0.05
（0.079±0.002）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
0.7 （0.028）
0.9 （0.035）
CKP2520（1008）
1.1 （0.043）
1.1 （0.043）
LK2125（0805）
1.25（0.049）
0.85（0.033）
HK2125（0805）
1.0 （0.039）
BK2125（0805）
1.25（0.049）
BK3216（1206）
0.8 （0.031）
MCF0806（0302）
0.4 （0.016）
MCF1210（0504）
0.55（0.022）
MCF2010（0804）
0.45（0.018）
MCKK1608（0603）
1.0 （0.039）
MCKK2012（0805）
1.0 （0.039）
Tape Thickness
K
T
2.0
0.3
（0.079）
（0.012）
2.0
0.3
（0.079）
（0.012）
1.3
0.3
（0.051）
（0.012）
1.3
0.25
（0.051）
（0.01）
1.4
（0.055）
1.4
（0.055）
0.3
（0.012）
1.7
（0.067）
1.7
（0.067）
2.0
0.3
（0.079）
（0.012）
1.5
（0.059）
0.3
（0.012）
2.0
（0.079）
2.0
0.3
（0.079）
（0.012）
1.4
0.3
（0.055）
（0.012）
0.55
0.3
（0.022）
（0.012）
0.65
0.3
（0.026）
（0.012）
0.85
0.3
（0.033）
（0.012）
1.4
0.25
（0.055）
（0.01）
1.35
0.25
（0.053）
（0.010）
Unit : mm（inch）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E07R01
④LEADER AND BLANK PORTION
Blank portion
Chip cavity
Blank portion
Leader
100mm or more
(3.94inches or more)
160mm or more
(6.3inches or more)
Direction of tape feed
400mm or more
(15.7inches or more)
⑤Reel Size
t
E
C
R
B
D
A
W
A
φ178±2.0
B
φ50 or more
C
φ13.0±0.2
4mm width tape
8mm width tape
t
1.5max.
2.5max.
W
5±1.0
10±1.5
D
φ21.0±0.8
E
2.0±0.5
R
1.0
(Unit : mm)
⑥Top tape strength
The top tape requires a peel-off force of 0.1～0.7N in the direction of the arrow as illustrated below.
Pull direction
0～15°
Top tape
Base tape
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E07R01
Multilayer chip inductors
Multilayer chip inductors for high frequency, Multilayer chip bead inductors
Multilayer common mode choke coils（MC series F type）
Metal Multilayer Chip Power Inductors (MCOILTM MC series)
■RELIABILITY DATA
1. Operating Temperature Range
BK series
BKH series
BKP series
MCF series
CK series
CKS series
Specified Value
CKP series
LK series
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
MCOILTM MC series
2. Storage Temperature Range
BK series
BKH series
BKP series
MCF series
CK series
CKS series
Specified Value
CKP series
LK series
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
MCOILTM MC series
－55～＋125℃
－55～＋85℃
－40～＋85℃
－40～＋85℃
－55～＋125℃
－40～＋85℃
－55～＋125℃
－40～＋125℃（Including self-generated heat）
－55～＋125℃
－55～＋85℃
－40～＋85℃
－40～＋85℃
－55～＋125℃
－40～＋85℃
－55～＋125℃
－40～＋85℃
3. Rated Current
Specified Value
BK series
BKH series
BKP series
MCF series
CK series
CKS series
CKP series
LK series
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
MCOILTM MC series
The temperature of the element is increased within 20℃.
The temperature of the element is increased within 40℃
Refer to each specification.
The temperature of the element is increased within 20℃.
The temperature of the element is increased within 40℃
The decreasing-rate of inductance value is within 5 %
The decreasing-rate of inductance value is within 5 %, or the temperature of the element is increased
within 20℃
Idc1: The decreasing-rate of inductance value is within 30 %
Idc2: The temperature of the element is increased within 40℃
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-E07R01
4. Impedance
Specified Value
Test Methods and
Remarks
BK series
BKH series
Refer to each specification.
BKP series
MCF series
BK0603Series, BKP0603Series, BKH Series
Measuring frequency
: 100±1MHz
Measuring equipment
: 4991A（or its equivalent）
Measuring jig
: 16193A（or its equivalent）
BK1005Series, BKP1005Series ,BKH1005Series
Measuring frequency
: 100±1MHz
Measuring equipment
: 4291A（or its equivalent）
Measuring jig
: 16192A（or its equivalent）, HW:16193A（or its equivalent）
BK1608・2125Series, BKP1608・2125Series
Measuring frequency
: 100±1MHz
Measuring equipment
: 4291A（or its equivalent）, 4195A（or its equivalent）
Measuring jig
: 16092A（or its equivalent）, HW:16192A（or its equivalent）
BK2010・3216Series
Measuring frequency
: 100±1MHz
Measuring equipment
: 4291A（or its equivalent）, 4195A（or its equivalent）
Measuring jig
: 16192A（or its equivalent）
MCF Series
Measuring frequency
: 100±1MHz
Measuring equipment
: 4291A（or its equivalent）
5. Inductance
Specified Value
CK series
CKS series
CKP series
LK series
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
MCOILTM MC series
CK、CKS、LK Series
Measuring frequency
Measuring equipment /jig
Measuring current
CKP、MCOILTM MC Series
Measuring frequency
Measuring equipment
Test Methods and
Remarks
HK0603、HK1005、AQ Series
Measuring frequency
Measuring equipment /jig
HK1608、HK2125 Series
Measuring frequency
Measuring equipment /jig
HKQ Series
Measuring frequency
Measuring frequency
Measuring equipment /jig
Refer to each specification.
: Refer to each specification.
: 1608,2125⇒4194A＋16085B＋16092A（or its equivalent）、4195A＋41951＋16092A（or its equivalent）
1005⇒4291A＋16193A（or its equivalent）
: 047～4.7μH ⇒1mArms 、 5.6～33μH ⇒0.1mArms
: 1MHz
: 4285A（or its equivalent）
: 100MHz
: HK0603・AQ105⇒4291A＋16197A（or its equivalent）
HK1005⇒4291A＋16193A（or its equivalent）
: ～100nH⇒100MHz 、120nH～⇒50MHz
: 4195A＋16092A（or its equivalent）
: HKQ0603S・HKQ0603U⇒ 500MHz
: HKQ0603W⇒ 300/500MHz
: E4991A＋16197A（or its equivalent）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-E07R01
6. Q
Specified Value
CK series
CKS series
CKP series
LK series
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
MCOILTM MC series
LK Series
Measuring frequency
Measuring equipment /jig
Measuring current
Test Methods and
Remarks
HK0603、HK1005、AQ Series
Measuring frequency
Measuring equipment /jig
HK1608、HK2125 Series
Measuring frequency
Measuring equipment /jig
HKQ Series
Measuring frequency
Measuring frequency
Measuring equipment /jig
－
Refer to each specification.
－
: Refer to each specification.
: 1608,2125⇒4194A＋16085B＋16092A（or its equivalent）、4195A＋41951＋16092A（or its equivalent）
1005⇒4291A＋16193A（or its equivalent）
: 047～4.7μH ⇒1mArms 、 5.6～33μH ⇒0.1mArms
: 100MHz
: HK0603・AQ105⇒4291A＋16197A（or its equivalent）
HK1005⇒4291A＋16193A（or its equivalent）
: ～100nH⇒100MHz 、120nH～⇒50MHz
: 4195A＋16092A（or its equivalent）
: HKQ0603S・HKQ0603U⇒ 500MHz
: HKQ0603W⇒ 300/500MHz
: E4991A＋16197A（or its equivalent）
7. DC Resistance
Specified Value
BK series
BKH series
BKP series
MCF series
CK series
CKS series
CKP series
LK series
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
MCOILTM MC series
Test Methods and
Remarks
Measuring equipment：VOAC-7412, VOAC-7512, VOAC-7521（made by Iwasaki Tsushinki）, HIOKI3227 (or its equivalent)
8. Self Resonance Frequency（SRF）
BK series
BKH series
BKP series
MCF series
CK series
CKS series
Specified Value
CKP series
LK series
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
MCOILTM MC series
LK、CK Series :
Measuring equipment
Test Methods and
Measuring jig
Remarks
HK、HKQ、AQ Series :
Measuring equipment
Refer to each specification.
－
Refer to each specification.
－
Refer to each specification.
－
: 4195A（or its equivalent）
: 41951＋16092A（or its equivalent）
: 8719C（or its equivalent）・8753D（or its equivalent）/HK2125
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-E07R01
9. Temperature Characteristic
BK series
BKH series
BKP series
MCF series
CK series
CKS series
CKP series
LK series
HK0603, HK1005
Specified Value
HK1608, HK2125
HKQ0603
AQ105
MCOILTM MC series
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
MCOILTM MC series
HK、HKQ、AQ Series：
Temperature range
Test Methods and
Reference temperature
Remarks
MCOILTM MC series：
Temperature range
Reference temperature
10. Resistance to Flexure of Substrate
BK series
BKH series
BKP series
MCF series
CK series
CKS series
Specified Value
CKP series
LK series
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
MCOILTM MC series
Warp
:
:
Testing board
:
Thickness
:
－
Inductance change：Within ±10％
Inductance change：Within ±15％
: －30～＋85℃
: ＋20℃
: －40～＋85℃
: ＋20℃
No mechanical damage.
2mm（BK Series、BKP、BKH1005、CK、CKS、CKP、LK、HK、HKQ0603S、HKQ0603U、AQ Series、MCF1210、MC Series）
1mm（BKH0603、HKQ0603W、MCF Series without 1210 size,）
glass epoxy-resin substrate
0.8mm
20
R-230
Test Methods and
Remarks
Board
Warp
Deviation±1
45
45
（Unit：mm）
11. Solderability
Specified Value
Test Methods and
Remarks
BK series
BKH series
BKP series
MCF series
CK series
CKS series
CKP series
LK series
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
MCOILTM MC series
Solder temperature
Solder temperature
Duration
At least 90％ of terminal electrode is covered by new solder.
：230±5℃ (JIS Z 3282 H60A or H63A)
：245±3℃ (Sn/3.0Ag/0.5Cu)
：4±1 sec.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-E07R01
12. Resistance to Soldering
BK series
BKH series
BKP series
MCF series
CK series
CKS series
Specified Value
CKP series
LK series
Appearance：No significant abnormality
Impedance change：Within ±30％
Appearance：No significant abnormality
Impedance change：Within ±20％
Appearance：No significant abnormality
Inductance change： R10～4R7⇒Within ±10％、 6R8～100⇒Within ±15％
Appearance：No significant abnormality
Inductance change：Within ±20％
Appearance：No significant abnormality
Inductance change：Within ±30％
Appearance：No significant abnormality
Inductance change：1005⇒Within ±15％
1608,2125⇒ 47N～4R7: Within ±10％ 5R6～330: Within ±15％
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
Appearance：No significant abnormality
Inductance change： Within ±5％
MCOILTM MC series
Appearance：No significant abnormality
Inductance change： Within ±10％
Solder temperature
：260±5℃
Duration
：10±0.5 sec.
Test Methods and
Preheating temperature
：150 to 180℃
Remarks
Preheating time
：3 min.
Flux
：Immersion into methanol solution with colophony for 3 to 5 sec.
Recovery
：2 to 3 hrs of recovery under the standard condition after the test.（See Note 1）
(Note 1) When there are questions concerning measurement result；measurement shall be made after 48±2 hrs of recovery under the standard condition.
13. Thermal Shock
BK series
BKH series
BKP series
MCF series
CK series
CKS series
Specified Value
CKP series
LK series
Appearance：No significant abnormality
Impedance change： Within ±30％
Appearance：No significant abnormality
Impedance change： Within ±20％
Appearance：No significant abnormality
Inductance change：Within ±20％
Appearance：No significant abnormality
Inductance change： Within ±30％
Appearance：No significant abnormality
Inductance change： Within ±10％ Q change： Within ±30％
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
Appearance：No significant abnormality
Inductance change： Within ±10％ Q change： Within ±20％
MCOILTM MC series
Appearance：No significant abnormality
Inductance change： Within ±10％
Conditions for 1 cycle
Step
temperature（℃）
time（min.）
1
Minimum operating temperature ＋0/－3
30±3
Test Methods and
2
Room temperature
2～3
Remarks
3
Maximum operating temperature ＋3/－0
30±3
4
Room temperature
2～3
Number of cycles：5
Recovery：2 to 3 hrs of recovery under the standard condition after the test.（See Note 1）
(Note 1) When there are questions concerning measurement result；measurement shall be made after 48±2 hrs of recovery under the standard condition.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-E07R01
14. Damp Heat（ Steady state）
BK series
BKH series
BKP series
MCF series
CK series
CKS series
CKP series
Specified Value
LK series
Test Methods and
Remarks
Appearance：No significant abnormality
Impedance change： Within ±30％
Appearance：No significant abnormality
Impedance change： Within ±20％
Appearance：No significant abnormality
Inductance change： Within ±20％
Appearance：No significant abnormality
Inductance change： Within ±30％
Appearance：No significant abnormality
Inductance change： 1005,1608⇒Within ±10％
Q change： Within ±30％
2125⇒Within ±20％
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
Appearance：No significant abnormality
Inductance change： Within ±10％ Q change： Within ±20％
MCOILTM MC series
Appearance：No significant abnormality
Inductance change： Within ±10％
BK、BKP、BKH、LK、CK、CKS、CKP、MCF Series：
Temperature
：40±2℃
Humidity
：90 to 95％RH
Duration
：500 +24/-0 hrs
Recovery
：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
HK、HKQ、AQ、MCOILTM MC series：
Temperature
：60±2℃
Humidity
：90 to 95％RH
Duration
：500 +24/-0 hrs
Recovery
：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
(Note 1) When there are questions concerning measurement result；measurement shall be made after 48±2 hrs of recovery under the standard condition.
15. Loading under Damp Heat
BK series
BKH series
BKP series
MCF series
CK series
CKS series
CKP series
Specified Value
LK series
Test Methods and
Remarks
Appearance：No significant abnormality
Impedance change： Within ±30％
－
Appearance：No significant abnormality
Inductance change： Within ±20％
Appearance：No significant abnormality
Inductance change： Within ±30％
Appearance：No significant abnormality
Inductance change： 1005⇒Within ±10％
1608⇒0.047～12.0μH： Within ±10％
2125⇒Within ±20％
Q change： Within ±30％
15.0～33.0μH： Within ±15％
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
Appearance：No significant abnormality
Inductance change： Within ±10％ Q change： Within ±20％
MCOILTM MC series※
Appearance：No significant abnormality
Inductance change： Within ±10％
BK、BKP、BKH、LK、CK、CKS、CKP Series：
Temperature
：40±2℃
Humidity
：90 to 95％RH
Applied current
：Rated current
Duration
：500 +24/-0 hrs
Recovery
：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
HK、HKQ、AQ、MCOILTM MC Series：
Temperature
：60±2℃
Humidity
：90 to 95％RH
Applied current
：Rated current ※MC series ; Idc2max
Duration
：500 +24/-0 hrs
Recovery
：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
Note on standard condition: "standard condition" referred to herein is defined as follows:
5 to 35℃ of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.
When there are questions concerning measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air pressure.
Unless otherwise specified, all the tests are conducted under the "standard condition."
(Note 1) Measurement shall be made after 48±2 hrs of recovery under the standard condition.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-E07R01
16. Loading at High Temperature
BK series
BKH series
BKP series
Appearance：No significant abnormality
Impedance change： Within ±30％
Appearance：No significant abnormality
Impedance change： Within ±20％
Appearance：No significant abnormality
Inductance change： Within ±20％
Appearance：No significant abnormality
Inductance change： Within ±30％
Appearance：No significant abnormality
Inductance change： 1005⇒Within ±10％
1608⇒0.047～12.0μH： Within ±10％
2125⇒Within ±20％
Q change： Within ±30％
MCF series
CK series
CKS series
CKP series
Specified Value
LK series
Test Methods and
Remarks
15.0～33.0μH： Within ±15％
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
Appearance：No significant abnormality
Inductance change： Within ±10％ Q change： Within ±20％
MCOILTM MC series※
Appearance：No significant abnormality
Inductance change： Within ±10％
Temperature
Applied current
Duration
Recovery
: Maximum operating temperature
：Rated current ※MC series ; Idc2max
：500 +24/-0 hrs
：2 to 3 hrs of recovery under the standard condition after the removal from test chamber. （See Note 1）
Note on standard condition: "standard condition" referred to herein is defined as follows:
5 to 35℃ of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.
When there are questions concerning measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air pressure. Unless
otherwise specified, all the tests are conducted under the "standard condition."
(Note 1) Measurement shall be made after 48±2 hrs of recovery under the standard condition.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-E07R01
Metal Multilayer Chip Power Inductors (MCOILTM MC series)
■PRECAUTIONS
1. Circuit Design
Precautions
◆Operating environment
The products described in this specification are intended for use in general electronic equipment,(office supply equipment,
telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical equipment
or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear control systems and
medical equipment including life-support systems,) where product failure might result in loss of life, injury or damage. For such uses,
contact TAIYO YUDEN Sales Department in advance.
2. PCB Design
Precautions
Technical
considerations
◆Land pattern design
・ Please refer to a recommended land pattern specified.
◆Land pattern design
Surface Mounting
・ Mounting and soldering conditions should be checked beforehand.
・ Applicable soldering process to this products is reflow soldering only.
3. Considerations for automatic placement
Precautions
Technical
considerations
◆Adjustment of mounting machine
・ Excessive impact load should not be imposed on the products when mounting onto the PC boards.
・ Mounting and soldering conditions should be checked beforehand.
◆Adjustment of mounting machine
・ When installing products, care should be taken not to apply distortion stress as it may deform the products.
4. Soldering
Precautions
◆Reflow soldering
・ Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified.
・ The product shall be used reflow soldering only.
・ Please do not add any stress to a product until it returns in normal temperature after reflow soldering.
◆Lead free soldering
・ When using products with lead free soldering, we request to use them after confirming adhesion, temperature of resistance to soldering
heat, soldering etc sufficiently.
Technical
considerations
Temperature［℃］
◆Reflow soldering
・ If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently
degrade the reliability of the products.
Recommended reflow condition (Pb free solder)
5sec max
300
Peak：260+0/-5℃
150～180
200
100
40sec max
90±30sec 230℃ min
0
Heating Time［sec］
5. Cleaning
Precautions
Technical
considerations
◆Cleaning conditions
・ Washing by supersonic waves shall be avoided.
◆Cleaning conditions
・ If washed by supersonic waves, the products might be broken.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_MC_prec_e-E07R01
6. Handling
Precautions
Technical
considerations
◆Handling
・ Keep the product away from all magnets and magnetic objects.
◆Breakaway PC boards (splitting along perforations)
・ When splitting the PC board after mounting product, care should be taken not to give any stresses of deflection or twisting to the board.
・ Board separation should not be done manually, but by using the appropriate devices.
◆Mechanical considerations
・ Please do not give the product any excessive mechanical shocks.
・ Please do not add any shock and power to a product in transportation.
◆Application of resin coatings, moldings, etc. to the PCB and components.
・ Please avoid operation, which apply excessive stress and/or temperature to the products such as resin molding.
◆Handling
・ There is a case that a characteristic varies with magnetic influence.
◆Breakaway PC boards (splitting along perforations)
・ The position of the product on PCBs shall be carefully considered to minimize the stress caused from splitting of the PCBs.
◆Mechanical considerations
・ There is a case to be damaged by a mechanical shock.
・ There is a case to be broken by the handling in transportation.
◆Application of resin coatings, moldings, etc. to the PCB and components.
・ Damage and a characteristic can vary with an excessive stress and/or temperature
7. Storage conditions
Precautions
◆Storage
・ To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the
storage area should be controlled.
Recommended conditions
Ambient temperature : 0～40℃
Humidity : Below 70% RH
The ambient temperature must be kept below 30℃. Even under ideal storage conditions, solderability of products electrodes may
decrease as time passes.
For this reason, product should be used within 6 months from the time of delivery.
In case of storage over 6 months, solderability shall be checked before actual usage.
Technical
considerations
◆Storage
・ Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes
and deterioration of taping/packaging materials may take place.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_MC_prec_e-E07R01
金属磁芯 SMD 功率电感器
（MCOILTM MD 系列）
METAL CORE SMD POWER INDUCTORS（MCOILTM MD SERIES）
回流焊
REFLOW
※使用温度范围：
-40 ～+125℃（包含产品本身发热）
*Operating
Temp.：-40～+125℃（Including
self-generated heat）
型号标示法
■PARTS
NUMBER
M D
①
K
K
②
①Series name
①类型
Code
代码
MD
1
6
1
T
④
1
R 0
⑤
M M △
⑥ ⑦ ⑧
⑥电感量公差
⑥Inductance tolerance
Code
代码
M
N
标称电感值
［μH］
Nominal
inductance［μH］
0.47
1.0
4.7
电感量公差
Inductance
tolerance
±20％
±30％
⑦个别规格
⑦Special code
Code
代码
F
M
尺寸（L×W ）
［mm］
Dimensions（L×W）［mm］
1.6×1.6
2.0×2.0
3.0×3.0
4.0×4.0
4.9×4.9
电感器／功率电感器
尺寸（H）
［mm］
Dimensions（H）［mm］
0.95
1.0
1.2
1.4
2.0
④包装
④Packaging
代码
Code
T
空格 space
△＝Blank
⑤标称电感值
⑤Nominal inductance
Code
代码
（例）
（example）
R47
1R0
4R7
※R＝Decimal
小数点 point
Series
name
类型
Metal 基本金属线圈规格
base coil specification
②Dimensions（H）
②尺寸（
H）
Code
代码
JE
KK
MK
PK
WK
③尺寸（L×W）
③Dimensions（L×W）
Code
代码
1616
2020
3030
4040
5050
6
③
Special
code
个别规格
Ferrite coating
铁氧体外塗品
金属外塗品
Metal coating
⑧本公司管理记号
⑧Internal code
包装
Packaging
卷盘带装
Taping
标准外型尺寸／标准数量
■STANDARD
EXTERNAL DIMENSIONS / STANDARD QUANTITY
推荐焊盘图案
Recommended
Land Patterns
B
e
f
L
C
e
W
MDKK1616
MDJE2020
MDKK2020
MDMK2020
MDKK3030
MDMK3030
MDJE4040
MDMK4040
MDWK4040
MDPK5050
A
0.5
0.65
0.8
1.2
1.5
H
A
Type
Type
1616
2020
3030
4040
5050
B
1.10
1.35
2.2
2.8
3.6
C
1.65
2.0
2.7
3.7
4.2
Unit：mm
单位：
mm
A
L
W
H
e
f
1.64±0.1
(0.065±0.004)
2.0±0.15
(0.079±0.006)
2.0±0.15
(0.079±0.006)
2.0±0.15
(0.079±0.006)
3.0±0.1
(0.118±0.004)
3.0±0.1
(0.118±0.004)
4.0±0.2
(0.157±0.008)
4.0±0.2
(0.157±0.008)
4.0±0.2
(0.157±0.008)
4.9±0.2
(0.193±0.008)
1.64±0.1
(0.065±0.004)
2.0±0.15
(0.079±0.006)
2.0±0.15
(0.079±0.006)
2.0±0.15
(0.079±0.006)
3.0±0.1
(0.118±0.004)
3.0±0.1
(0.118±0.004)
4.0±0.2
(0.157±0.008)
4.0±0.2
(0.157±0.008)
4.0±0.2
(0.157±0.008)
4.9±0.2
(0.193±0.008)
1.0 max
(0.039 max)
0.95 max
(0.037 max)
1.0 max
(0.039 max)
1.2 max
(0.047 max)
1.0 max
(0.039 max)
1.2 max
(0.047 max)
0.95 max
(0.037 max)
1.2 max
(0.047 max)
2.0 max
(0.079 max)
1.4 max
(0.055 max)
0.40 +0.2/-0.1
(0.016 +0.008/-0.004)
0.50±0.2
(0.02±0.008)
0.50±0.2
(0.02±0.008)
0.50±0.2
(0.02±0.008)
0.90±0.2
(0.035±0.008)
0.90±0.2
(0.035±0.008)
1.1±0.2
(0.043±0.008)
1.1±0.2
(0.043±0.008)
1.1±0.2
(0.043±0.008)
1.20±0.2
(0.047±0.008)
1.0±0.2
(0.039±0.008)
1.25±0.2
(0.049±0.008)
1.25±0.2
(0.049±0.008)
1.25±0.2
(0.049±0.008)
1.9±0.2
(0.075±0.008)
1.9±0.2
(0.075±0.008)
2.5±0.2
(0.098±0.008)
2.5±0.2
(0.098±0.008)
2.5±0.2
(0.098±0.008)
3.3±0.2
(0.130±0.008)
Standard
标准数量quantity
[pcs]
卷盘带装
［pcs］
Taping
2500
2500
2500
2500
2000
2000
1000
1000
700
1000
单位：mm
（inch）
Unit：mm（inch）
i_smd_MD_e-E07R01
▶ 由于篇幅有限，本产品目录中只记载了有代表性的产品规格，若考虑使用弊司产品时，请确认交货规格说明书中的详细规格。
另外，有关各产品的详细信息
（特性图、可靠性信息、使用时的注意事项等），请参阅弊司网站
（http://www.ty-top.com/ ）。
19
53
型号一览
■PARTS
NUMBER
MDKK1616 型 type
●MDKK1616
【厚度:1.0mm
max.】
【Thickness：1.0mm
Parts
number
型号
EHS
Nominal
inductance
标称电感值
［μH］
［μ
H］
MDKK1616TR47MM
MDKK1616T1R0MM
MDKK1616T1R5MM
MDKK1616T2R2MM
MDKK1616T3R3MM
MDKK1616T4R7MM
MDKK1616T6R8MM
MDKK1616T100MM
MDKK1616T150MM
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.47
1.0
1.5
2.2
3.3
4.7
6.8
10
15
MDJE2020 型 type
●MDJE2020
【厚度:0.95mm
max.】
【Thickness：0.95mm
电感器／功率电感器
Parts
number
型号
EHS
Nominal
inductance
标称电感值
［μH］
［μ
H］
MDJE2020T1R0MM
MDJE2020T2R2MM
MDJE2020T3R3MM
MDJE2020T4R7MM
MDJE2020T6R8MM
MDJE2020T100MM
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
1.0
2.2
3.3
4.7
6.8
10
MDKK2020 型 type
●MDKK2020
【厚度:1.0mm
max.】
【Thickness：1.0mm
Parts
number
型号
EHS
Nominal
inductance
标称电感值
［μH］
［μ
H］
MDKK2020TR47MM
MDKK2020TR68MM
MDKK2020T1R0MM
MDKK2020T1R5MM
MDKK2020T2R2MM
MDKK2020T3R3MM
MDKK2020T4R7MM
MDKK2020T100MM
MDKK2020T150MM
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.47
0.68
1.0
1.5
2.2
3.3
4.7
10
15
MDMK2020 型 type
●MDMK2020
Parts
number
型号
MDMK2020TR47MM
MDMK2020TR68MM
MDMK2020T1R0MM
MDMK2020T1R5MM
MDMK2020T2R2MM
MDMK2020T3R3MM
MDMK2020T4R7MM
MDKK3030 型 type
●MDKK3030
【厚度:1.2mm
max.】
【Thickness：1.2mm
Inductance
tolerance
电感量公差
±20％
±20％
±20％
±20％
±20％
±20％
电感量公差
Inductance
tolerance
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.47
1.0
1.5
2.2
3.3
4.7
6.8
10
【厚度:1.2mm
max.】
【Thickness：1.2mm
Typ.
0.080
0.120
0.160
0.215
0.450
0.550
0.710
0.970
1.600
DC直流电阻
Resistance［Ω］
［Ω］
Max.
0.121
0.266
0.340
0.475
0.630
1.040
Typ.
0.106
0.230
0.290
0.410
0.550
0.910
Rated
current ※） ［ｍA］
额定电流 ※）
［ｍ A］
Measuring
测试频率
Saturation
current::Idc1
Idc1
Temperature
rise current:
Idc2 frequency［MHz］
直流重叠允许电流
温度上升允许电流
:Idc2
［MHz］
Max.
Typ.
Max.
Typ.
3,100
3,800
1,550
1,800
1
1,550
1,900
1,050
1,200
1
1,350
1,600
950
1,100
1
1,200
1,550
850
950
1
800
1,100
750
850
1
700
900
550
600
1
DC直流电阻
Resistance［Ω］
［Ω］
Max.
0.046
0.060
0.085
0.133
0.165
0.275
0.435
0.690
1.180
Typ.
0.040
0.052
0.074
0.115
0.139
0.240
0.375
0.600
1.020
Rated
current ※） ［ｍA］
额定电流 ※）
［ｍ A］
Measuring
测试频率
Saturation
current::Idc1
Idc1
Temperature
rise current:
Idc2
直流重叠允许电流
温度上升允许电流
:Idc2
frequency［MHz］
［MHz］
Max.
Typ.
Max.
Typ.
3,500
4,150
2,200
2,500
1
3,200
3,650
2,000
2,100
1
2,900
3,400
1,700
1,900
1
1,900
2,250
1,350
1,500
1
1,650
1,950
1,200
1,350
1
1,300
1,550
940
1,050
1
1,050
1,250
750
850
1
750
900
630
680
1
550
750
480
550
1
max.】
0.47
0.68
1.0
1.5
2.2
3.3
4.7
MDKK3030TR47MM
MDKK3030T1R0MM
MDKK3030T1R5MM
MDKK3030T2R2MM
MDKK3030T3R3MM
MDKK3030T4R7MM
MDKK3030T6R8MM
MDKK3030T100MM
Max.
0.095
0.140
0.185
0.250
0.515
0.640
0.820
1.120
1.800
Rated
current ※） ［ｍA］
额定电流 ※）
［ｍ A］
Measuring
测试频率
Saturation
current::Idc1
Idc1
Temperature
rise current:
Idc2 frequency［MHz］
直流重叠允许电流
温度上升允许电流
:Idc2
［MHz］
Max.
Typ.
Max.
Typ.
3,300
4,100
1,500
1,780
1
2,200
2,750
1,200
1,490
1
1,750
2,200
1,100
1,330
1
1,500
1,800
950
1,110
1
1,150
1,450
650
730
1
950
1,200
550
630
1
630
880
520
600
1
550
800
450
500
1
460
640
400
440
1
max.】
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
【厚度:1.0mm
max.】
【Thickness：1.0mm
DC直流电阻
Resistance［Ω］
［Ω］
max.】
Inductance
tolerance
电感量公差
EHS
MDMK3030TR30MM
MDMK3030TR33MM
MDMK3030TR47MM
MDMK3030T1R0MM
MDMK3030T1R5MM
MDMK3030T2R2MM
MDMK3030T3R3MM
MDMK3030T4R7MM
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
EHS
Parts
number
型号
Parts
number
型号
Inductance
tolerance
电感量公差
Nominal
inductance
标称电感值
［μH］
［μ
H］
Nominal
inductance
标称电感值
［μH］
［μ
H］
MDMK3030 型 type
●MDMK3030
max.】
DC直流电阻
Resistance［Ω］
［Ω］
Max.
0.046
0.058
0.064
0.086
0.109
0.178
0.242
Typ.
0.040
0.050
0.056
0.075
0.095
0.155
0.210
Rated
current ※） ［ｍA］
额定电流 ※）
［ｍ A］
Measuring
测试频率
Saturation
current::Idc1
Idc1
Temperature
rise current:
Idc2 frequency［MHz］
直流重叠允许电流
温度上升允许电流
:Idc2
［MHz］
Max.
Typ.
Max.
Typ.
4,200
4,800
2,300
2,450
1
3,500
4,100
2,000
2,200
1
2,550
2,900
1,900
2,050
1
2,000
2,300
1,650
1,750
1
1,750
2,000
1,450
1,550
1
1,350
1,550
1,150
1,200
1
1,150
1,300
950
1,050
1
max.】
Inductance
tolerance
电感量公差
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
DC直流电阻
Resistance［Ω］
［Ω］
Max.
0.039
0.086
0.100
0.144
0.248
0.345
0.437
0.575
Typ.
0.033
0.074
0.087
0.125
0.215
0.300
0.380
0.500
Rated
current ※） ［ｍA］
额定电流 ※）
［ｍ A］
Measuring
测试频率
Saturation
current::Idc1
Idc1
Temperature
rise current:
Idc2 frequency［MHz］
直流重叠允许电流
温度上升允许电流
:Idc2
［MHz］
Max.
Typ.
Max.
Typ.
5,400
6,500
3,900
4,500
1
4,400
5,200
2,400
2,800
1
3,000
3,500
2,100
2,400
1
2,500
3,000
1,900
2,200
1
2,000
2,400
1,350
1,500
1
1,700
2,000
1,150
1,300
1
1,400
1,700
1,000
1,150
1
1,100
1,300
850
1,000
1
max.】
EHS
Nominal
inductance
标称电感值
［μH］
［μ
H］
Inductance
tolerance
电感量公差
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.30
0.33
0.47
1.0
1.5
2.2
3.3
4.7
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
DC直流电阻
Resistance［Ω］
［Ω］
Max.
0.020
0.020
0.027
0.050
0.074
0.112
0.167
0.263
Typ.
0.017
0.017
0.023
0.043
0.064
0.097
0.145
0.228
Rated
current ※） ［ｍA］
额定电流 ※）
［ｍ A］
Measuring
测试频率
Saturation
current::Idc1
Idc1
Temperature
rise current:
Idc2 frequency［MHz］
直流重叠允许电流
温度上升允许电流
:Idc2
［MHz］
Max.
Typ.
Max.
Typ.
7,600
9,200
5,500
6,400
1
6,400
8,700
5,500
6,400
1
6,300
7,500
4,700
5,500
1
4,300
5,100
3,300
3,900
1
3,400
4,100
2,500
3,000
1
2,800
3,600
2,100
2,400
1
2,100
2,700
1,650
1,900
1
1,800
2,300
1,350
1,550
1
i_smd_MD_e-E07R01
▶ 由于篇幅有限，本产品目录中只记载了有代表性的产品规格，若考虑使用弊司产品时，请确认交货规格说明书中的详细规格。
另外，有关各产品的详细信息
（特性图、可靠性信息、使用时的注意事项等），请参阅弊司网站
（http://www.ty-top.com/ ）。
54
19
■PARTS
NUMBER
型号一览
MDJE4040 型 type
●MDJE4040
【厚度:0.95mm
max.】
【Thickness：0.95mm
Parts
number
型号
EHS
Nominal
inductance
标称电感值
［μH］
［μ
H］
MDJE4040TR47MM
MDJE4040T1R0MM
MDJE4040T1R5MM
MDJE4040T2R2MM
MDJE4040T3R3MM
MDJE4040T4R7MM
MDJE4040T6R8MM
MDJE4040T100MM
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.47
1.0
1.5
2.2
3.3
4.7
6.8
10
MDMK4040F 型 type
●MDMK4040F
Parts
number
型号
MDMK4040 型 type
●MDMK4040
Parts
number
型号
MDMK4040TR68MM
MDMK4040T1R0MM
MDMK4040T1R5MM
MDMK4040T2R2MM
MDMK4040T3R3MM
MDMK4040T4R7MM
MDMK4040T6R8MM
MDMK4040T100MM
MDWK4040 型 type
●MDWK4040
Parts
number
型号
MDWK4040TR33NM
MDWK4040TR47NM
MDWK4040TR56NM
MDWK4040TR68MM
MDWK4040T1R0MM
MDWK4040T1R5MM
MDWK4040T2R2MM
MDWK4040T3R3MM
MDWK4040T4R7MM
MDWK4040T6R8MM
MDWK4040T100MM
MDWK4040T220MM
MDWK4040T330MM
●MDPK5050
MDPK5050 型 type
RoHS
RoHS
RoHS
RoHS
RoHS
Inductance
tolerance
电感量公差
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
Inductance
tolerance
电感量公差
0.47
1.0
1.2
1.5
2.2
±20％
±20％
±20％
±20％
±20％
EHS
Inductance
tolerance
电感量公差
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.68
1.0
1.5
2.2
3.3
4.7
6.8
10
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
EHS
Inductance
tolerance
电感量公差
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.33
0.47
0.56
0.68
1.0
1.5
2.2
3.3
4.7
6.8
10
22
33
±30％
±30％
±30％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
Parts
number
型号
EHS
Nominal
inductance
标称电感值
［μH］
［μ
H］
MDPK5050T1R0MM
MDPK5050T2R2MM
MDPK5050T3R3MM
MDPK5050T4R7MM
MDPK5050T6R8MM
MDPK5050T100MM
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
1.0
2.2
3.3
4.7
6.8
10
DC直流电阻
Resistance［Ω］
［Ω］
Max.
0.029
0.047
0.047
0.065
0.092
Typ.
0.025
0.041
0.041
0.056
0.080
Rated
current ※） ［ｍA］
额定电流 ※）
［ｍ A］
测试频率
Measuring
Saturation current::Idc1
Idc1
Temperature
rise current:
直流重叠允许电流
温度上升允许电流
:Idc2Idc2 frequency［kHz］
［kHz］
Max.
Typ.
Max.
Typ.
7,500
10,000
4,600
5,400
100
5,200
7,500
3,500
4,200
100
4,200
6,200
3,500
4,200
100
3,700
5,400
3,300
3,600
100
3,200
4,500
2,500
2,900
100
DC直流电阻
Resistance［Ω］
［Ω］
Max.
0.029
0.036
0.065
0.079
0.130
0.160
0.230
0.330
Typ.
0.025
0.031
0.056
0.069
0.113
0.140
0.200
0.280
Rated
current ※） ［ｍA］
额定电流 ※）
［ｍ A］
Measuring
测试频率
Saturation current::Idc1
Idc1
Temperature
rise current:
直流重叠允许电流
温度上升允许电流
:Idc2Idc2 frequency［MHz］
［MHz］
Max.
Typ.
Max.
Typ.
6,700
7,800
5,000
5,700
1
5,000
6,200
4,500
5,100
1
4,500
5,600
3,200
3,600
1
3,800
4,500
2,800
3,200
1
3,200
4,000
2,200
2,500
1
2,500
3,000
1,900
2,200
1
1,900
2,200
1,600
1,800
1
1,700
2,000
1,400
1,600
1
max.】
Nominal
inductance
标称电感值
［μH］
［μ
H］
【厚度:1.4mm
max.】
【Thickness：1.4mm
Typ.
0.035
0.060
0.073
0.100
0.175
0.220
0.320
0.440
max.】
Nominal
inductance
标称电感值
［μH］
［μ
H］
【厚度:2.0mm
max.】
【Thickness：2.0mm
Max.
0.040
0.069
0.084
0.115
0.200
0.250
0.370
0.510
Rated
current ※） ［ｍA］
额定电流 ※）
［ｍ A］
Measuring
测试频率
Saturation current::Idc1
Idc1
Temperature
rise current:
直流重叠允许电流
温度上升允许电流
:Idc2Idc2 frequency［MHz］
［MHz］
Max.
Typ.
Max.
Typ.
6,000
7,900
4,000
4,500
1
4,700
5,700
3,000
3,500
1
3,000
4,000
2,700
3,100
1
2,400
3,100
2,400
2,700
1
2,000
2,600
1,800
2,000
1
1,900
2,300
1,600
1,900
1
1,500
1,800
1,300
1,500
1
1,400
1,700
1,100
1,300
1
max.】
Nominal
inductance
标称电感值
［μH］
［μ
H］
【厚度:1.2mm
max.】
【Thickness：1.2mm
DC直流电阻
Resistance［Ω］
［Ω］
电感器／功率电感器
MDMK4040TR47MF
MDMK4040T1R0MF
MDMK4040T1R2MF
MDMK4040T1R5MF
MDMK4040T2R2MF
【厚度:1.2mm
max.】
【Thickness：1.2mm
EHS
max.】
DC直流电阻
Resistance［Ω］
［Ω］
Max.
0.013
0.013
0.016
0.016
0.027
0.041
0.054
0.075
0.107
0.158
0.194
0.460
0.720
Typ.
0.011
0.011
0.014
0.014
0.023
0.035
0.047
0.066
0.093
0.138
0.169
0.400
0.625
Rated
current ※） ［ｍA］
额定电流 ※）
［ｍ A］
Measuring
测试频率
Saturation current::Idc1
Idc1
Temperature
rise current:
直流重叠允许电流
温度上升允许电流
:Idc2Idc2 frequency［MHz］
［MHz］
Max.
Typ.
Max.
Typ.
16,000
21,000
7,800
8,800
1
10,000
15,000
7,800
8,800
1
9,000
13,000
6,500
7,500
1
8,000
12,000
7,300
8,300
1
7,000
9,400
5,100
5,800
1
7,000
9,400
4,100
4,700
1
5,400
7,500
3,500
4,000
1
3,700
5,200
3,000
3,300
1
3,500
5,000
2,500
2,800
1
2,900
4,000
2,000
2,300
1
2,200
3,100
1,600
1,900
1
1,500
2,100
1,200
1,400
1
1,200
1,700
800
1,000
1
max.】
Inductance
tolerance
电感量公差
±20％
±20％
±20％
±20％
±20％
±20％
DC直流电阻
Resistance［Ω］
［Ω］
Max.
0.040
0.055
0.086
0.102
0.138
0.225
Typ.
0.034
0.047
0.073
0.088
0.12
0.19
Rated
current ※） ［ｍA］
额定电流 ※）
［ｍ A］
Measuring
测试频率
Saturation current::Idc1
Idc1
Temperature
rise current:
直流重叠允许电流
温度上升允许电流
:Idc2Idc2 frequency［MHz］
［MHz］
Max.
Typ.
Max.
Typ.
8,500
10,000
4,300
4,700
1
4,100
5,000
3,600
4,200
1
3,800
4,500
2,900
3,400
1
3,500
4,200
2,500
3,000
1
2,700
3,200
2,200
2,500
1
2,200
2,600
1,700
2,000
1
※）
（Idc1）
为直流重叠带来的电感值下降，范围在30％以内的直流电感值
（at
20℃）
※）直流重叠允许电流
The saturation current
value
(Idc1) is the DC current value having inductance decrease
down
to 30%. (at 20℃)
※）
为温度上升到40℃时的直流电感值
（at
20℃）
※）温度上升允许电流
The temperature（Idc2）
rise current
value（Idc2) is the DC current
value
having temperature increase up to 40℃. (at 20℃)
※）最大额定电流值为能够满足直流重叠允许电流和温度上升允许电流的直流电流值
※） The rated current is the DC current value that satisfies both of current value saturation current value and temperature rise current value.
i_smd_MD_e-E07R01
▶ 由于篇幅有限，本产品目录中只记载了有代表性的产品规格，若考虑使用弊司产品时，请确认交货规格说明书中的详细规格。
另外，有关各产品的详细信息
（特性图、可靠性信息、使用时的注意事项等），请参阅弊司网站
（http://www.ty-top.com/ ）。
19
55
METAL CORE SMD POWER INDUCTORS (MCOILTM MD SERIES）
■PACKAGING
①Minimum Quantity
Standard Quantity [pcs]
Tape ＆ Reel
2500
Type
MDKK1616
MDJE2020
MDKK2020
MDMK2020
MDKK3030
MDMK3030
MDJE4040
MDMK4040
MDWK4040
MDPK5050
2500
2000
1000
700
1000
②Tape Material
●Embossed Tape
Top tape
Chip Filled
Sprocket hole
Base tape
Chip cavity
Chip
③Taping dimensions
●Embossed tape 8mm wide (0.315 inches wide)
1.75±0.1
(0.069±0.004）
A
B
T
8.0±0.2
(0.315±0.008)
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
3.5±0.1
(0.138±0.004)
Sprocket hole
K
F
Type
MDKK1616
MDJE2020
MDKK2020
MDMK2020
MDKK3030
MDMK3030
4.0±0.1
(0.157±0.004)
2.0±0.05
(0.079±0.002)
Electrode（bottom view）
Chip cavity
A
B
1.79±0.1
1.79±0.1
(0.071±0.004)
(0.071±0.004)
Insertion pitch
F
4.0±0.1
(0.157±0.004)
Tape thickness
T
K
0.25±0.05
1.1±0.1
(0.010±0.002)
(0.043±0.004)
2.2±0.1
（0.102±0.004）
2.2±0.1
（0.102±0.004）
4.0±0.1
（0.157±0.004）
0.25±0.05
（0.009±0.002）
1.3±0.1
（0.051±0.004）
3.2±0.1
(0.126±0.004)
3.2±0.1
(0.126±0.004)
4.0±0.1
(0.157±0.004)
0.3±0.05
(0.012±0.002)
1.4±0.1
(0.055±0.004)
Unit：mm（inch）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_smd_MD_pack_e-E05R01
●Embossed tape 12mm wide (0.47 inches wide)
1.75±0.1
(0.069±0.004）
A
B
T
12.0±0.3
(0.472±0.012)
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
5.5±0.1
(0.217±0.004)
Sprocket hole
K
F
2.0±0.1
(0.079±0.004)
4.0±0.1
(0.157±0.004)
Electrode（bottom view）
A
B
Insertion pitch
F
T
K
MDJE4040
MDMK4040
MDWK4040
4.3±0.1
（0.169±0.004）
4.3±0.1
（0.169±0.004）
8.0±0.1
（0.315±0.004）
0.3±0.1
（0.012±0.004）
1.6±0.1
（0.063±0.004）
MDPK5050
5.25±0.1
（0.207±0.004）
5.25±0.1
（0.207±0.004）
8.0±0.1
（0.315±0.004）
0.3±0.1
（0.012±0.004）
1.6±0.1
（0.063±0.004）
Type
Chip cavity
Tape thickness
Unit：mm（inch）
④Leader and Blank portion
⑤Reel size
Type
MDKK1616
MDJE2020
MDKK2020
MDMK2020
MDKK3030
MDMK3030
MDJE4040
MDMK4040
MDWK4040
MDPK5050
φD
Reel size (Reference values)
φd
W
180±0.5
（7.087±0.019）
60±1.0
（2.36±0.04）
10.0±1.5
（0.394±0.059）
180±3.0
（7.087±0.118）
60±2.0
（2.36±0.08）
14.0±1.5
（0.551±0.059）
Unit：mm（inch）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_smd_MD_pack_e-E05R01
⑥Top Tape Strength
Top tape strength
Type
MDKK1616
MDJE2020
MDKK2020
MDMK2020
MDKK3030
MDMK3030
MDJE4040
MDMK4040
MDWK4040
MDPK5050
Peel-off strength
0.1N～1.0N
0.1N～1.3N
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_smd_MD_pack_e-E05R01
METAL CORE SMD POWER INDUCTORS (MCOILTM MD SERIES）
■RELIABILITY DATA
1. Operating Temperature Range
Specified Value
MD series
－40～＋125℃
Test Methods and
Remarks
Including self-generated heat
2. Storage Temperature Range
Specified Value
MD series
Test Methods and
Remarks
－40～＋85℃
－5 to 40℃ for the product with taping.
3. Rated current
Specified Value
MD series
Within the specified tolerance
4. Inductance
Specified Value
Test Methods and
Remarks
MD series
Measuring equipment
Measuring condition
Within the specified tolerance
: LCR Meter （HP 4285A or equivalent）
: Please see item list.
5. DC Resistance
Specified Value
MD series
Test Methods and
Remarks
Measuring equipment
Within the specified tolerance
: DC ohmmeter （HIOKI 3227 or equivalent）
6. Self resonance frequency
Specified Value
MD series
－
7. Temperature characteristic
Specified Value
MD series
Test Methods and
Remarks
Measurement of inductance shall be taken at temperature range within －40℃～＋125℃.
With reference to inductance value at ＋20℃., change rate shall be calculated.
Inductance change : Within ±10%
8. Resistance to flexure of substrate
Specified Value
Test Methods and
Remarks
MD series
No damage
The test samples shall be soldered to the test board by the reflow. As illustrated below, apply force in the direction of the arrow indicating
until deflection of the test board reaches to 2 mm.
Test board size
: 100×40×1.0 mm
Test board material
: Glass epoxy-resin
Solder cream thickness
: 0.10 mm
9. Insulation resistance : between wires
Specified Value
MD series
－
10. Insulation resistance : between wire and core
Specified Value
MD series
－
11. Withstanding voltage : between wire and core
Specified Value
MD series
－
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_smd_MD_reli_e-E04R01
12. Adhesion of terminal electrode
Specified Value
MD series
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow.
Applied force
: 10N to X and Y directions.
Duration
: 5s.
Solder cream thickness
Shall not come off PC board
: 0.10mm.
13. Resistance to vibration
Inductance change : Within ±10%
No significant abnormality in appearance.
Specified Value
MD series
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow.
Then it shall be submitted to below test conditions.
Frequency Range
10～55Hz
Total Amplitude
1.5mm (May not exceed acceleration 196m/s2)
Sweeping Method
10Hz to 55Hz to 10Hz for 1min.
X
Time
Y
For 2 hours on each X, Y, and Z axis.
Z
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
14. Solderability
Specified Value
MD series
Test Methods and
Remarks
The test samples shall be dipped in flux, and then immersed in molten solder as shown in below table.
Flux : Methanol solution containing rosin 25%.
Solder Temperature
245±5℃
Time
5±1.0 sec.
※Immersion depth : All sides of mounting terminal shall be immersed.
At least 90％ of surface of terminal electrode is covered by new solder.
15. Resistance to soldering heat
Inductance change : Within ±10%
No significant abnormality in appearance.
Specified Value
MD series
Test Methods and
Remarks
The test sample shall be exposed to reflow oven at 230±5℃ for 40 seconds, with peak temperature at 260±5℃ for 5 seconds, 2 times.
Test board material
: Glass epoxy-resin
Test board thickness
: 1.0mm
16. Thermal shock
Inductance change : Within ±10%
No significant abnormality in appearance.
Specified Value
MD series
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow. The test samples shall be placed at specified temperature for specified
time by step 1 to step 4 as shown in below table in sequence. The temperature cycle shall be repeated 100 cycles.
Conditions of 1 cycle
Step
Temperature (℃)
Duration (min)
1
－40±3
30±3
2
Room temperature
Within 3
3
＋85±2
30±3
4
Room temperature
Within 3
17. Damp heat
Specified Value
Test Methods and
Remarks
MD series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at specified temperature and humidity as shown in below table.
Temperature
60±2℃
Humidity
90～95%RH
Time
500＋24/－0 hour
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_smd_MD_reli_e-E04R01
18. Loading under damp heat
Specified Value
Test Methods and
Remarks
MD series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at specified temperature and humidity and applied the rated current
continuously as shown in below table.
Temperature
60±2℃
Humidity
90～95％RH
Applied current
Rated current
Time
500＋24/－0 hour
19. Low temperature life test
Specified Value
Test Methods and
Remarks
MD series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown
in below table.
Temperature
－40±2℃
Time
500＋24/－0 hour
20. High temperature life test
Specified Value
MD series
－
21. Loading at high temperature life test
Specified Value
Test Methods and
Remarks
MD series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at specified temperature and applied the rated current continuously as shown in
below table.
Temperature
85±2℃
Applied current
Rated current
Time
500＋24/－0 hour
22. Standard condition
Specified Value
MD series
Standard test condition :
Unless otherwise specified, temperature is 20±15℃ and 65±20％of relative humidity.
When there is any question concerning measurement result: In order to provide correlation
data, the test shall be condition of 20±2℃ of temperature, 65±5% relative humidity.
Inductance is in accordance with our measured value.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_smd_MD_reli_e-E04R01
METAL CORE SMD POWER INDUCTORS (MCOILTM MD SERIES）
■PRECAUTIONS
1. Circuit Design
Precautions
◆Operating environment
1. The products described in this specification are intended for use in general electronic equipment,(office supply equipment,
telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical
equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear
control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or
damage. For such uses, contact TAIYO YUDEN Sales Department in advance.
2. PCB Design
Precautions
Technical
considerations
◆Land pattern design
1. Please refer to a recommended land pattern.
◆Land pattern design
Surface Mounting
・ Mounting and soldering conditions should be checked beforehand.
・ Applicable soldering process to this products is reflow soldering only.
3. Considerations for automatic placement
Precautions
Technical
considerations
◆Adjustment of mounting machine
1. Excessive impact load should not be imposed on the products when mounting onto the PC boards.
2. Mounting and soldering conditions should be checked beforehand.
◆Adjustment of mounting machine
1. When installing products, care should be taken not to apply distortion stress as it may deform the products.
4. Soldering
Precautions
◆Reflow soldering
1. Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified.
2. The product shall be used reflow soldering only.
3. Please do not add any stress to a product until it returns in normal temperature after reflow soldering.
◆Lead free soldering
1. When using products with lead free soldering, we request to use them after confirming adhesion, temperature of resistance to soldering
heat, soldering etc sufficiently.
◆Recommended conditions for using a soldering iron (NR10050 Type)
・ Put the soldering iron on the land-pattern.
・ Soldering iron's temperature - Below 350℃
・ Duration - 3 seconds or less
・ The soldering iron should not directly touch the inductor.
◆Reflow soldering
1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently
degrade the reliability of the products.
・NR30/40/50/60/80, NRV20/30, NRH24/30, NRS20/40/50/60/80 Type, NR10050 Type, NS101/125 Type
Recommended reflow condition (Pb free solder)
Technical
considerations
5. Cleaning
Precautions
Technical
considerations
◆Cleaning conditions
1. Washing by supersonic waves shall be avoided.
◆Cleaning conditions
1. If washed by supersonic waves, the products might be broken.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_smd_MD_prec_e-E02R01
6. Handling
Precautions
◆Handling
1. Keep the product away from all magnets and magnetic objects.
◆Breakaway PC boards (splitting along perforations)
1. When splitting the PC board after mounting product, care should be taken not to give any stresses of deflection or twisting to the board.
2. Board separation should not be done manually, but by using the appropriate devices.
◆Mechanical considerations
1. Please do not give the product any excessive mechanical shocks.
2. Please do not add any shock and power to a product in transportation.
◆Pick-up pressure
1. Please do not push to add any pressure to a winding part. Please do not give any shock and push into a ferrite core exposure part.
◆Packing
1. Please avoid accumulation of a packing box as much as possible.
◆Board mounting
1. There shall be no pattern or via between terminals at the bottom of product.
2. Components which are located in peripheral of product shall not make contact with surface (top, side) of product.
Technical
considerations
◆Handling
1. There is a case that a characteristic varies with magnetic influence.
◆Breakaway PC boards (splitting along perforations)
1. The position of the product on PCBs shall be carefully considered to minimize the stress caused from splitting of the PCBs.
◆Mechanical considerations
1. There is a case to be damaged by a mechanical shock.
2. There is a case to be broken by the handling in transportation.
◆Pick-up pressure
1. Damage and a characteristic can vary with an excessive shock or stress.
◆Packing
1. If packing boxes are accumulated, that could cause a deformation on packing tapes or a damage on the products.
◆Board mounting
1. If there is pattern or via between terminals at the bottom of product, it may cause characteristics change.
2. If components which are located in peripheral of product make contact with surface (top, side) of product, it may cause damage or
characteristics change.
7. Storage conditions
Precautions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the
storage area should be controlled.
・ Recommended conditions
Ambient temperature : －5～40℃
Humidity : Below 70% RH
・ The ambient temperature must be kept below 30℃. Even under ideal storage conditions, solderability of products electrodes may
decrease as time passes.
For this reason, product should be used within 6 months from the time of delivery.
In case of storage over 6 months, solderability shall be checked before actual usage.
Technical
considerations
◆Storage
1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes
and deterioration of taping/packaging materials may take place.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_smd_MD_prec_e-E02R01
金属磁芯绕线型片状功率电感器 (MCOILTM MA 系列）
METAL CORE WIRE-WOUND CHIP POWER INDUCTORS（MCOILTM MA SERIES）
回流焊
REFLOW
※使用温度范围：
-40 ～+105℃（包含产品本身发热）
* Operating Temp.：-40～+105℃（Including
self-generated heat）
型号标示法
■PARTS
NUMBER
M A
①
K
K
2
0
②
①类型
①Series name
代码
Code
MA
1
③
6
T
④
1
R 0
⑤
M △ △
⑥ ⑦ ⑧
电感器／功率电感器
⑤标称电感值
⑤Nominal inductance
Code
代码
（example）
（例）
R47
1R0
4R7
小数点 point
※R＝Decimal
类型name
Series
金属磁芯绕线型片状功率电感器
Metal Core
Wire-wound Chip Power Inductor
②Dimensions（T）
②尺寸（
T）
Code
代码
KK
MK
Dimensions（T）［mm］
尺寸（ T ）
［mm］
1.0
1.2
③尺寸（L×W）
③Dimensions（L×W）
Code
代码
2016
2520
⑥电感量公差
⑥Inductance tolerance
Code
代码
M
Dimensions（L×W）［mm］
尺寸（L×W ）
［mm］
2.0×1.6
2.5×2.0
④包装
④Packaging
Code
代码
T
空格 space
△＝Blank
⑦个别规格
⑦Special code
Code
代码
△
Packaging
包装
Nominal
inductance［μH］
标称电感值
［μH］
0.47
1.0
4.7
Inductance
tolerance
电感量公差
±20％
个别规格
Special code
标准品
Standard
⑧本公司管理记号
⑧Internal
code
卷盘带装
Taping
标准外型尺寸／标准数量
■STANDARD
EXTERNAL DIMENSIONS / STANDARD QUANTITY
推荐焊盘图案
Recommended Land Patterns
L
W
实装上的注意
Surface Mounting
・请确认实装状态后使用。
・Mounting and soldering conditions should be checked beforehand.
・本产品焊法限定为回流焊法。
・Applicable soldering process to these products is reflow soldering only.
T
Type
A
B
C
2016
0.７
0.8
e
2520
0.8
1.2
A
Type
MAKK2016
MAKK2520
MAMK2520
B
C
1.8
2.0
单位：
Unit：mm
mm
A
Standard
quantity［pcs］
标准数量
[pcs]
卷盘带装
Taping
L
W
T
e
2.0±0.1
（0.079±0.004）
2.5±0.2
（0.098±0.008）
2.5±0.2
（0.098±0.008）
1.6±0.1
（0.063±0.004）
2.0±0.2
（0.079±0.008）
2.0±0.2
（0.079±0.008）
1.0 max
（0.039 max）
1.0 max
（0.039 max）
1.2 max
（0.047 max）
0.5±0.3
（0.020±0.012）
0.5±0.3
（0.020±0.012）
0.5±0.3
（0.020±0.012）
3000
3000
3000
单位：
mm（inch）
Unit：mm（inch）
i_wound_MA_e-E05R01
▶ 由于篇幅有限，本产品目录中只记载了有代表性的产品规格，若考虑使用弊司产品时，请确认交货规格说明书中的详细规格。
另外，有关各产品的详细信息
（特性图、可靠性信息、使用时的注意事项等），请参阅弊司网站
（http://www.ty-top.com/ ）。
56
19
型号一览
■PARTS
NUMBER
MAKK2016 型 type
●MAKK2016
Parts型号
number
MAKK2016TR24M
MAKK2016TR33M
MAKK2016TR47M
MAKK2016TR68M
MAKK2016T1R0M
MAKK2016T1R5M
MAKK2016T2R2M
MAKK2016T3R3M
MAKK2016T4R7M
【厚度:1.0mm
max.】
【Thickness：1.0mm
EHS
Inductance
tolerance
电感量公差
Self-resonant
自共振频率
frequency
（min.）
［MHｚ］
［MHｚ］（min.）
DC直流电阻
Resistance
［Ω］（max.）
［Ω］
（max.）
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.24
0.33
0.47
0.68
1.0
1.5
2.2
3.3
4.7
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
-
0.037
0.040
0.460
0.065
0.075
0.130
0.160
0.255
0.380
EHS
Nominal
inductance
标称电感值
［μH］
［μ
H］
Inductance
tolerance
电感量公差
Self-resonant
自共振频率
frequency
［［MHｚ］（min.）
（min.）
MHｚ］
DC直流电阻
Resistance
［Ω］（max.）
［Ω］
（max.）
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.33
0.47
0.68
1.0
1.5
2.2
3.3
4.7
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
-
0.038
0.046
0.059
0.072
0.125
0.156
0.200
0.300
MAKK2520 型 type
●MAKK2520
型号
Parts
number
【厚度:1.0mm
max.】
【Thickness：1.0mm
MAMK2520 型 type
●MAMK2520
【厚度:1.2mm
max.】
【Thickness：1.2mm
额定电流 ※）
［ｍ A］
（max.）
Rated
current ※） ［ｍA］（max.）
Measuring
测试频率
直流重叠允许电流
温度上升允许电流
Saturation current Temperature
rise current frequency［MHz］
［MHz］
Idc1
Idc2
Idc1
Idc2
4,200
3,600
3,200
2,500
2,200
1,600
1,500
1,150
1,000
3,000
3,200
2,800
2,500
2,200
1,650
1,500
1,200
950
2
2
2
2
2
2
2
2
2
max.】
Rated
current ※） ［ｍA］（max.）
额定电流 ※）
［ｍ A］
（max.）
Measuring
测试频率
温度上升允许电流
Saturation current Temperature
rise current frequency［MHz］
直流重叠允许电流
［MHz］
Idc1
Idc2
Idc2
Idc1
4,700
3,900
3,700
2,700
2,300
1,900
1,550
1,300
3,500
3,200
2,900
2,500
1,800
1,500
1,300
1,100
2
2
2
2
2
2
2
2
max.】
Parts
number
型号
EHS
Nominal
inductance
标称电感值
［μH］
［μ
H］
Inductance
tolerance
电感量公差
MAMK2520TR47M
MAMK2520TR68M
MAMK2520T1R0M
MAMK2520T2R2M
MAMK2520T3R3M
MAMK2520T4R7M
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.47
0.68
1.0
2.2
3.3
4.7
±20％
±20％
±20％
±20％
±20％
±20％
Self-resonant
自共振频率
frequency
ｚ］
（min.）
［MH
［MHｚ］（min.）
-
DC直流电阻
Resistance
［Ω］（max.）
［Ω］
（max.）
Rated
current ※） ［ｍA］（max.）
额定电流 ※）
［ｍ A］
（max.）
Measuring
测试频率
Temperature
rise current frequency［MHz］
温度上升允许电流
［MHz］
Idc2
Idc2
4,200
3,400
2
3,200
3,200
2
3,100
2,700
2
2,000
1,900
2
1,800
1,700
2
1,500
1,300
2
电感器／功率电感器
MAKK2520TR33M
MAKK2520TR47M
MAKK2520TR68M
MAKK2520T1R0M
MAKK2520T1R5M
MAKK2520T2R2M
MAKK2520T3R3M
MAKK2520T4R7M
max.】
Nominal
inductance
标称电感值
［μH］
［μ
H］
Saturation current
直流重叠允许电流
Idc1
Idc1
0.039
0.048
0.059
0.110
0.156
0.260
※）
（Idc1）
为直流重叠带来的电感值下降，范围在30％以内的直流电感值
（atdown
20℃）
※）直流重叠允许电流
The saturation current
value
(Idc1) is the DC current value having inductance decrease
to 30%. (at 20℃)
※）
为温度上升到40℃时的直流电感值
（at
20℃）
※）温度上升允许电流
The temperature（Idc2）
rise current
value（Idc2) is the DC current
value
having temperature increase by 40℃. (at 20℃)
※）额定电流值为Idc1 或 Idc2 中较低的直流电流值。
※） The rated current value is following either Idc1 or Idc2, which is the lower one.
i_wound_MA_e-E05R01
▶ 由于篇幅有限，本产品目录中只记载了有代表性的产品规格，若考虑使用弊司产品时，请确认交货规格说明书中的详细规格。
另外，有关各产品的详细信息
（特性图、可靠性信息、使用时的注意事项等），请参阅弊司网站
（http://www.ty-top.com/ ）。
19
57
金属磁芯绕线型片状功率电感器 (MCOILTM MA-H 系列）
METAL CORE WIRE-WOUND CHIP POWER INDUCTORS（MCOILTM MA-H SERIES）
回流焊
REFLOW
※使用温度范围：
-40 ～+125℃（包含产品本身发热）
* Operating Temp.：-40～+125℃（Including
self-generated heat）
※使用温度范围：
※1参照物料清单
-40 ～+105℃（包含产品本身发热）
* Operating Temp.：-40～+105℃（Including
self-generated
heat）※1Parts Number reference
型号标示法
■PARTS
NUMBER
M A
①
K
K
2
0
②
①Series name
①类型
Code
代码
MA
③
6
H
④
1
R 0
⑤
M △ △
⑥ ⑦ ⑧
电感器／功率电感器
Dimensions（T）［mm］
尺寸（ T ）
［mm］
1.0
1.2
③尺寸（
L×W）
③Dimensions（L×W）
代码
Code
2016
2520
空格 space
△＝Blank
⑤Nominal inductance
⑤标称电感值
Code
代码
（example）
（例）
R47
1R0
4R7
小数点 point
※R＝Decimal
Series
类型name
Metal Core
Wire-wound Chip Power Inductor
金属磁芯绕线型片状功率电感器
②Dimensions（T）
②尺寸（
T）
Code
代码
KK
MK
④包装
④Packaging
代码
Code
H
1
⑥电感量公差 tolerance
⑥Inductance
Code
代码
M
尺寸（L×W ）
［mm］
Dimensions（L×W）［mm］
2.0×1.6
2.5×2.0
⑦个别规格
⑦Special code
代码
Code
△
Packaging
or Special specification
包装及特殊规格
Taping（High
characteristics）
盘带（高特性规格）
Nominal
inductance［μH］
标称电感值
［μH］
0.47
1.0
4.7
Inductance
tolerance
电感量公差
±20％
个别规格
Special code
标准品
Standard
⑧本公司管理记号
⑧Internal code
标准外型尺寸／标准数量
■STANDARD
EXTERNAL DIMENSIONS / STANDARD QUANTITY
推荐焊盘图案
Recommended Land Patterns
L
W
实装上的注意
Surface Mounting
・请确认实装状态后使用。
・Mounting and soldering conditions should be checked beforehand.
・
本产品焊法限定为回流焊法。
・Applicable
soldering process to these products is reflow soldering only.
T
Type
A
B
C
2016
0.７
0.8
e
2520
0.8
1.2
A
Type
MAKK2016H
MAKK2520H
MAMK2520H
B
A
C
1.8
2.0
单位：
Unit：mm
mm
Standard
quantity［pcs］
标准数量
[pcs]
卷盘带装
Taping
L
W
T
e
2.0±0.1
（0.079±0.004）
2.5±0.2
（0.098±0.008）
2.5±0.2
（0.098±0.008）
1.6±0.1
（0.063±0.004）
2.0±0.2
（0.079±0.008）
2.0±0.2
（0.079±0.008）
1.0 max
（0.039 max）
1.0 max
（0.039 max）
1.2 max
（0.047 max）
0.5±0.3
（0.020±0.012）
0.5±0.3
（0.020±0.012）
0.5±0.3
（0.020±0.012）
3000
3000
3000
单位：
mm（inch）
Unit：mm（inch）
i_wound_MA-H_e-E07R01
▶ 由于篇幅有限，本产品目录中只记载了有代表性的产品规格，若考虑使用弊司产品时，请确认交货规格说明书中的详细规格。
另外，有关各产品的详细信息
（特性图、可靠性信息、使用时的注意事项等），请参阅弊司网站
（http://www.ty-top.com/ ）。
58
19
■PARTS
NUMBER
型号一览
MAKK2016H 型 type
●MAKK2016H
【厚度:1.0mm
max.】
【Thickness：1.0mm
Parts型号
number
EHS
Nominal
inductance
标称电感值
［μH］
［μ
H］
Inductance
tolerance
电感量公差
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.22
0.24
0.33
0.47
0.68
1.0
1.5
±20％
±20％
±20％
±20％
±20％
±20％
±20％
MAKK2016HR22M
MAKK2016HR24M
MAKK2016HR33M
MAKK2016HR47M
MAKK2016HR68M
MAKK2016H1R0M
MAKK2016H1R5M
【厚度:1.0mm
max.】
【Thickness：1.0mm
MAKK2520H 型 type
●MAKK2520H
max.】
Nominal
inductance
标称电感值
［μH］
［μ
H］
Inductance
tolerance
电感量公差
MAKK2520HR22M
MAKK2520HR33M
MAKK2520HR47M
MAKK2520HR68M
MAKK2520H1R0M
MAKK2520H1R5M
MAKK2520H2R2M
MAKK2520H100M ※1
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.22
0.33
0.47
0.68
1.0
1.5
2.2
10
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
Parts型号
number
EHS
Nominal
inductance
标称电感值
［μH］
［μ
H］
MAMK2520HR22M
MAMK2520HR33M
MAMK2520HR47M
MAMK2520HR68M
MAMK2520H1R0M
MAMK2520H1R5M
MAMK2520H2R2M
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.22
0.33
0.47
0.68
1.0
1.5
2.2
Rated
current ※） ［ｍA］（max.）
额定电流 ※）
［ｍ A］
（max.）
Measuring
测试频率
直流重叠允许电流
温度上升允许电流
Saturation current Temperature
rise current frequency［MHz］
［MHz］
Idc1
Idc1
5,800
5,800
4,700
4,300
3,200
2,700
2,100
0.026
0.026
0.030
0.036
0.050
0.070
0.105
Idc2
Idc2
4,000
4,000
3,500
3,300
2,700
2,300
1,800
2
2
2
2
2
2
2
Self-resonant
自共振频率
frequency
［MHｚ］
［MHｚ］（min.）
（min.）
-
DC直流电阻
Resistance
［Ω］（max.）
［Ω］
（max.）
Rated
current ※） ［ｍA］（max.）
额定电流 ※）
［ｍ A］
（max.）
Measuring
测试频率
直流重叠允许电流
温度上升允许电流
Saturation current Temperature
rise current frequency［MHz］
［MHz］
Idc1
Idc1
7500
6200
5700
4300
3800
3000
2500
1100
0.021
0.026
0.029
0.043
0.053
0.078
0.120
0.650
Idc2
Idc2
4900
4300
4000
3400
3000
2400
1800
750
2
2
2
2
2
2
2
2
max.】
Inductance
tolerance
电感量公差
±20％
±20％
±20％
±20％
±20％
±20％
±20％
Self-resonant
自共振频率
frequency
［MHｚ］
［MHｚ］（min.）
（min.）
-
DC直流电阻
Resistance
［Ω］（max.）
［Ω］
（max.）
Rated
current ※） ［ｍA］（max.）
额定电流 ※）
［ｍ A］
（max.）
Measuring
测试频率
直流重叠允许电流
温度上升允许电流
Saturation current Temperature
rise current frequency［MHz］
［MHz］
0.021
0.023
0.026
0.036
0.045
0.065
0.090
Idc1
Idc1
7500
6600
5800
5100
4300
3300
2800
Idc2
Idc2
5000
4400
4100
3500
3100
2600
2200
2
2
2
2
2
2
2
电感器／功率电感器
EHS
【厚度:1.2mm
max.】
【Thickness：1.2mm
DC直流电阻
Resistance
［Ω］（max.）
［Ω］
（max.）
max.】
Parts型号
number
MAMK2520H 型 type
●MAMK2520H
Self-resonant
自共振频率
frequency
［MHｚ］
［MHｚ］（min.）
（min.）
-
※）
（Idc1）
为直流重叠带来的电感值下降，范围在30％以内的直流电感值
（atdown
20℃）
※）直流重叠允许电流
The saturation current
value
(Idc1) is the DC current value having inductance decrease
to 30%. (at 20℃)
※）
为温度上升到40℃时的直流电感值
（at
20℃）
※）温度上升允许电流
The temperature（Idc2）
rise current
value（Idc2) is the DC current
value
having temperature increase by 40℃. (at 20℃)
※）
Idc2is中较低的直流电流值。
※）额定电流值为Idc1
The rated current或value
following either Idc1 or Idc2, which is the lower one.
i_wound_MA-H_e-E07R01
▶ 由于篇幅有限，本产品目录中只记载了有代表性的产品规格，若考虑使用弊司产品时，请确认交货规格说明书中的详细规格。
另外，有关各产品的详细信息
（特性图、可靠性信息、使用时的注意事项等），请参阅弊司网站
（http://www.ty-top.com/ ）。
19
59
METAL CORE WIRE-WOUND CHIP POWER INDUCTORS
(MCOILTM MA SERIES / MCOILTM MA-Ｈ SERIES)
■PACKAGING
①Minimum Quantity
Standard Quantity [pcs]
Tape ＆ Reel
3000
3000
3000
Type
MAKK2016
MAKK2520
MAMK2520
②Tape Material
●Embossed Tape
Top tape
Chip Filled
Sprocket hole
Base tape
Chip cavity
Chip
③Taping dimensions
●Embossed tape 8mm wide (0.315 inches wide)
3.5±0.1
(0.138±0.004)
A
B
F
1.75±0.1
(0.069±0.004）
8.0±0.2
(0.315±0.008)
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
Sprocket hole
4.0±0.1
(0.157±0.004)
2.0±0.05
(0.079±0.002)
Type
MAKK2016
MAKK2520
MAMK2520
Electrode（bottom view）
Chip cavity
A
B
1.9±0.1
2.3±0.1
（0.075±0.004）
（0.091±0.004）
2.3±0.1
2.8±0.1
(0.091±0.004)
(0.110±0.004)
2.3±0.1
2.8±0.1
(0.091±0.004)
(0.110±0.004)
Insertion pitch
F
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
(0.157±0.004)
Tape thickness
T
K
0.25±0.05
1.2 max
（0.009±0.002）
（0.047 max）
0.3±0.05
1.25 max
(0.012±0.002)
（0.049 max）
0.3±0.05
1.4 max
(0.012±0.002)
(0.055 max)
Unit：mm（inch）
④Leader and Blank portion
Blank portions
Chip cavity
Blank portions
Leader
Direction of tape feed
160 mm or more
160 mm ～ 200 mm
400 mm ～ 560 mm
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MA_pack_e-E05R01
⑤Reel size
Type
MAKK2016
MAKK2520
MAMK2520
φD
Reel size (Reference values)
φd
W
180+0/-3
（7.087+0/-0.118）
60+1/-0
（2.36+0.039/0）
10.0±1.5
（0.394±0.059）
Unit：mm（inch）
⑥Top Tape Strength
The top The top tape requires a peel-off force of 0.1 to 1.2N in the direction of the arrow as illustrated below.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MA_pack_e-E05R01
METAL CORE WIRE-WOUND CHIP POWER INDUCTORS
(MCOILTM MA SERIES / MCOILTM MA-Ｈ SERIES)
■RELIABILITY DATA
1. Operating Temperature Range
Specified Value
Test Methods and
Remarks
MA series
－40～＋105℃
MA-H series
－40～＋125℃
Including self-generated heat
2. Storage Temperature Range
Specified Value
Test Methods and
Remarks
MA series
－40～＋85℃
MA-H series
0 to 40℃ for the product with taping.
3. Rated current
Specified Value
MA series
MA-H series
Within the specified tolerance
4. Inductance
Specified Value
Test Methods and
Remarks
MA series
MA-H series
Measuring equipment
Measuring frequency
Within the specified tolerance
: LCR Meter （HP 4285A or equivalent）
: 2MHz、1V
5. DC Resistance
Specified Value
Test Methods and
Remarks
MA series
MA-H series
Measuring equipment
Within the specified tolerance
: DC ohmmeter （HIOKI 3227 or equivalent）
6. Self resonance frequency
Specified Value
MA series
MA-H series
－
7. Temperature characteristic
Specified Value
Test Methods and
Remarks
MA series
MA-H series
Inductance change : Within ±15%
Measurement of inductance shall be taken at temperature range within －40℃～＋85℃.
With reference to inductance value at ＋20℃., change rate shall be calculated.
8. Resistance to flexure of substrate
Specified Value
Test Methods and
Remarks
MA series
MA-H series
No damage
The test samples shall be soldered to the test board by the reflow. As illustrated below, apply force in the direction of the arrow indicating
until deflection of the test board reaches to 2 mm.
Test board size
: 100×40×1.0 mm
Test board material
: Glass epoxy-resin
Solder cream thickness
: 0.12 mm
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MA_reli_e-E05R01
9. Insulation resistance : between wires
Specified Value
MA series
MA-H series
－
10. Insulation resistance : between wire and core
Specified Value
MA series
MA-H series
DC25V 100kΩ min
11. Withstanding voltage : between wire and core
Specified Value
MA series
MA-H series
－
12. Adhesion of terminal electrode
Specified Value
Test Methods and
Remarks
MA series
MA-H series
No abnormality.
The test samples shall be soldered to the test board by the reflow.
Applied force
: 10N to X and Y directions.
Duration
: 5s.
Solder cream thickness
: 0.12mm.
13. Resistance to vibration
Specified Value
Test Methods and
Remarks
MA series
MA-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow.
Then it shall be submitted to below test conditions.
Frequency Range
10～55Hz
Total Amplitude
1.5mm (May not exceed acceleration 196m/s2)
Sweeping Method
10Hz to 55Hz to 10Hz for 1min.
X
Time
Y
For 2 hours on each X, Y, and Z axis.
Z
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
14. Solderability
Specified Value
Test Methods and
Remarks
MA series
MA-H series
At least 90％ of surface of terminal electrode is covered by new solder.
The test samples shall be dipped in flux, and then immersed in molten solder as shown in below table.
Flux : Methanol solution containing rosin 25%.
Solder Temperature
245±5℃
Time
5±0.5 sec.
※Immersion depth : All sides of mounting terminal shall be immersed.
15. Resistance to soldering heat
Specified Value
Test Methods and
Remarks
MA series
MA-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test sample shall be exposed to reflow oven at 230℃ for 40 seconds, with peak temperature at 260＋0/－5℃ for 5 seconds, 3 times.
Test board material
: Glass epoxy-resin
Test board thickness
: 1.0mm
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MA_reli_e-E05R01
16. Thermal shock
Specified Value
Test Methods and
Remarks
MA series
MA-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow. The test samples shall be placed at specified temperature for specified
time by step 1 to step 4 as shown in below table in sequence. The temperature cycle shall be repeated 100 cycles.
Conditions of 1 cycle
Step
Temperature (℃)
Duration (min)
1
－40±3
30±3
2
Room temperature
Within 3
3
＋85±2
30±3
4
Room temperature
Within 3
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
17. Damp heat
Specified Value
Test Methods and
Remarks
MA series
MA-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at specified temperature and humidity as shown in below table.
Temperature
60±2℃
Humidity
90～95%RH
Time
500＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
18. Loading under damp heat
Specified Value
Test Methods and
Remarks
MA series
MA-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at specified temperature and humidity and applied the rated current
continuously as shown in below table.
Temperature
60±2℃
Humidity
90～95％RH
Applied current
Rated current
Time
500＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
19. Low temperature life test
Specified Value
Test Methods and
Remarks
MA series
MA-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown
in below table.
Temperature
－40±2℃
Time
500＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
20. High temperature life test
Specified Value
Test Methods and
Remarks
MA series
MA-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown
in below table.
Temperature
85±2℃
Time
500＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
21. Loading at high temperature life test
Specified Value
MA series
MA-H series
－
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MA_reli_e-E05R01
22. Standard condition
MA series
Specified Value
MA-H series
Standard test condition :
Unless otherwise specified, temperature is 20±15℃ and 65±20％of relative humidity.
When there is any question concerning measurement result: In order to provide correlation
data, the test shall be condition of 20±2℃ of temperature, 65±5% relative humidity.
Inductance is in accordance with our measured value.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MA_reli_e-E05R01
METAL CORE WIRE-WOUND CHIP POWER INDUCTORS
(MCOILTM MA SERIES / MCOILTM MA-Ｈ SERIES)
■PRECAUTIONS
1. Circuit Design
Precautions
◆Operating environment
1. The products described in this specification are intended for use in general electronic equipment,(office supply equipment,
telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical
equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear
control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or
damage. For such uses, contact TAIYO YUDEN Sales Department in advance.
2. PCB Design
Precautions
Technical
considerations
◆Land pattern design
1. Please refer to a recommended land pattern.
◆Land pattern design
Surface Mounting
・ Mounting and soldering conditions should be checked beforehand.
・ Applicable soldering process to this products is reflow soldering only.
3. Considerations for automatic placement
Precautions
Technical
considerations
◆Adjustment of mounting machine
1. Excessive impact load should not be imposed on the products when mounting onto the PC boards.
2. Mounting and soldering conditions should be checked beforehand.
◆Adjustment of mounting machine
1. When installing products, care should be taken not to apply distortion stress as it may deform the products.
4. Soldering
Precautions
◆Reflow soldering
1. Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified.
2. The product shall be used reflow soldering only.
3. Please do not add any stress to a product until it returns in normal temperature after reflow soldering.
◆Lead free soldering
1. When using products with lead free soldering, we request to use them after confirming adhesion, temperature of resistance to soldering
heat, soldering etc sufficiently.
◆Reflow soldering
1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently
degrade the reliability of the products.
Recommended reflow condition (Pb free solder)
Technical
considerations
5. Cleaning
Precautions
Technical
considerations
◆Cleaning conditions
1. Washing by supersonic waves shall be avoided.
◆Cleaning conditions
1. If washed by supersonic waves, the products might be broken.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MA_prec_e-E06R01
6. Handling
Precautions
Technical
considerations
◆Handling
1. Keep the product away from all magnets and magnetic objects.
◆Breakaway PC boards (splitting along perforations)
1. When splitting the PC board after mounting product, care should be taken not to give any stresses of deflection or twisting to the board.
2. Board separation should not be done manually, but by using the appropriate devices.
◆Mechanical considerations
1. Please do not give the product any excessive mechanical shocks.
2. Please do not add any shock and power to a product in transportation.
◆Pick-up pressure
1. Please do not push to add any pressure to a winding part. Please do not give any shock and push into a ferrite core exposure part.
◆Packing
1. Please avoid accumulation of a packing box as much as possible.
◆Handling
1. There is a case that a characteristic varies with magnetic influence.
◆Breakaway PC boards (splitting along perforations)
1. The position of the product on PCBs shall be carefully considered to minimize the stress caused from splitting of the PCBs.
◆Mechanical considerations
1. There is a case to be damaged by a mechanical shock.
2. There is a case to be broken by the handling in transportation.
◆Pick-up pressure
1. Damage and a characteristic can vary with an excessive shock or stress.
◆Packing
1. If packing boxes are accumulated, that could cause a deformation on packing tapes or a damage on the products.
7. Storage conditions
Precautions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the
storage area should be controlled.
・ Recommended conditions
Ambient temperature : 0～40℃
Humidity : Below 70% RH
・ The ambient temperature must be kept below 30℃. Even under ideal storage conditions, solderability of products electrodes may
decrease as time passes.
For this reason, product should be used within 6 months from the time of delivery.
In case of storage over 6 months, solderability shall be checked before actual usage.
Technical
considerations
◆Storage
1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes
and deterioration of taping/packaging materials may take place.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MA_prec_e-E06R01
金属绕线型片状功率电感器 (MCOILTM MB 系列）
METAL WIRE-WOUND CHIP POWER INDUCTORS（MCOILTM MB SERIES）
回流焊
REFLOW
※使用温度范围：
-40 ～+105℃（包含产品本身发热）
* Operating Temp.：-40～+105℃（Including
self-generated heat）
■PARTS
NUMBER
型号标示法
M B
①
K
K
1
6
②
0
③
①Series
①类型 name
Code
代码
MB
8
T
④
1
R 0
⑤
M △
⑥ ⑦
④包装
④Packaging
Code
代码
T
Series
类型name
Metal金属绕线型片状功率电感器
Wire-Wound chip power inductor
电感器／功率电感器
②尺寸（
T）
②Dimensions（T）
Code
代码
KK
MK
⑤Nominal inductance
⑤标称电感值
Code
代码
（例）
（example）
R24
1R0
4R7
小数点 point
※R＝Decimal
Dimensions（T）［mm］
尺寸（ T ）
［mm］
1.0
1.2
③Dimensions（L×W）
③尺寸（
L×W）
代码
Code
外型
（inch）
Type（inch）
1608
2012
2520
1608（0603）
2012（0805）
2520（1008）
空格 space
△＝Blank
Dimensions
尺寸（L×W ）
［mm］
（L×W）［mm］
1.6×0.8
2.0×1.25
2.5×2.0
⑥Inductance tolerance
⑥电感量公差
Code
代码
M
N
Packaging
包装
卷盘带装
Taping
Nominal
inductance［μH］
标称电感值
［μH］
0.24
1.0
4.7
Inductance
tolerance
电感量公差
±20％
±30％
⑦Internal code
⑦本公司管理记号
标准外型尺寸／标准数量
■STANDARD
EXTERNAL DIMENSIONS / STANDARD QUANTITY
推荐焊盘图案
Recommended Land Patterns
实装上的注意
Surface Mounting
L
W
・请确认实装状态后使用。
・Mounting and soldering conditions should be checked beforehand.
・本产品焊法限定为回流焊法。
・Applicable soldering process to these products is reflow soldering
型号
Type
A
T
C
1608
0.55
2012
0.60
e
2520
0.60
B
A
A
型号
Type
MBKK1608
MBKK2012
MBMK2520
only.
B
0.70
1.00
1.50
C
1.00
1.45
2.00
单位：mm
（inch）
Unit：mm
标准数量
[pcs]
Standard
quantity［pcs］
Paper
Embossed
纸带tape
压纹带 tape
L
W
T
e
1.6±0.2
（0.063±0.008）
2.0±0.2
（0.079±0.008）
2.5±0.2
（0.098±0.008）
0.8±0.2
（0.031±0.008）
1.25±0.2
（0.049±0.008）
2.0±0.2
（0.079±0.008）
1.0 max
（0.040 max）
1.0 max
（0.040 max）
1.2 max
（0.047 max）
0.45±0.15
（0.016±0.006）
0.5±0.2
（0.020±0.008）
0.5±0.2
（0.020±0.008）
－
3000
－
3000
－
3000
单位：
mm（inch）
Unit：mm（inch）
▶ 由于篇幅有限，本产品目录中只记载了有代表性的产品规格，若考虑使用弊司产品时，请确认交货规格说明书中的详细规格。
另外，有关各产品的详细信息
（特性图、可靠性信息、使用时的注意事项等），请参阅弊司网站
（http://www.ty-top.com/ ）。
60
19
i_wound_MB_e-E07R01
■PARTS
NUMBER
型号一览
MBKK1608 (0603) 型 type
●MBKK1608（0603）
Parts
number
型号
MBKK1608TR24N
MBKK1608TR47N
MBKK1608TR68N
MBKK1608T1R0M
MBKK1608T1R5M
MBKK1608T2R2M
MBKK1608T3R3M
MBKK1608T4R7M
EHS
Inductance
tolerance
电感量公差
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.24
0.47
0.68
1.0
1.5
2.2
3.3
4.7
±30％
±30％
±30％
±20％
±20％
±20％
±20％
±20％
【厚度:1.0mm
max.】
【Thickness：1.0mm
EHS
Inductance
tolerance
电感量公差
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.24
0.47
0.68
1.0
1.5
2.2
3.3
4.7
±30％
±30％
±30％
±20％
±20％
±20％
±20％
±20％
【厚度:1.2mm
max.】
【Thickness：1.2mm
Parts
number
型号
EHS
Nominal
inductance
标称电感值
［μH］
［μ
H］
MBMK2520TR24N
MBMK2520TR47N
MBMK2520TR68N
MBMK2520T1R0M
MBMK2520T1R5M
MBMK2520T2R2M
MBMK2520T3R3M
MBMK2520T4R7M
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.24
0.47
0.68
1.0
1.5
2.2
3.3
4.7
DC直流电阻
Resistance
［Ω］（max.）
［Ω］
（max.）
0.049
0.104
0.120
0.150
0.200
0.345
0.512
0.730
Rated
current ※） ［ｍA］（max.）
额定电流 ※）
［ｍ A］
（max.）
Measuring
测试频率
直流重叠允许电流
温度上升允许电流
Saturation
current Temperature
rise current frequency［MHz］
［MHz］
Idc1
Idc1
Idc2
Idc2
1,650
2,300
1.0
1,100
1,400
1.0
950
1,200
1.0
800
1,150
1.0
650
1,000
1.0
520
750
1.0
450
600
1.0
370
500
1.0
max.】
标称电感值
Nominal
inductance
［μH］
［μ
H］
MBMK2520 (1008) 型 type
●MBMK2520（1008）
自共振频率
Self-resonant
frequency
［
MHｚ］
［MHｚ］（min.）
（min.）
-
自共振频率
Self-resonant
frequency
［MHｚ］
［MHｚ］（min.）
（min.）
-
DC直流电阻
Resistance
［Ω］（max.）
［Ω］
（max.）
Rated
current ※） ［ｍA］（max.）
额定电流 ※）
［ｍ A］
（max.）
Measuring
测试频率
直流重叠允许电流
温度上升允许电流
Saturation current Temperature
rise current frequency［MHz］
［MHz］
Idc1
Idc2
Idc1
Idc2
0.041
0.078
0.090
0.106
0.173
0.290
0.500
0.615
3,000
2,000
1,800
1,500
1,200
900
700
600
2,400
1,650
1,500
1,450
1,100
850
650
600
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
max.】
Inductance
tolerance
电感量公差
±30％
±30％
±30％
±20％
±20％
±20％
±20％
±20％
自共振频率
Self-resonant
frequency
［
MHｚ］
［MHｚ］（min.）
（min.）
-
DC直流电阻
Resistance
［Ω］（max.）
［Ω］
（max.）
Rated
current ※） ［ｍA］（max.）
额定电流 ※）
［ｍ A］
（max.）
Measuring
测试频率
直流重叠允许电流
温度上升允许电流
Saturation current Temperature
rise current frequency［MHz］
［MHz］
Idc1
Idc2
Idc1
Idc2
0.026
0.042
0.058
0.072
0.106
0.159
0.260
0.380
4,750
3,900
3,150
2,350
2,050
1,800
1,400
1,150
3,500
2,600
2,150
1,850
1,500
1,250
970
800
电感器／功率电感器
MBKK2012TR24N
MBKK2012TR47N
MBKK2012TR68N
MBKK2012T1R0M
MBKK2012T1R5M
MBKK2012T2R2M
MBKK2012T3R3M
MBKK2012T4R7M
max.】
Nominal
inductance
标称电感值
［μH］
［μ
H］
MBKK2012 (0805) 型 type
●MBKK2012（0805）
Parts型号
number
【厚度:1.0mm
max.】
【Thickness：1.0mm
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
※）
直流重叠允许电流
（Idc1
为直流重叠带来的电感值下降，
（at
℃）
30％以内的直流电感值
※）The
saturation current
value）(Idc1)
is the DC current value having范围在
inductance
decrease down to 30%.
(at20
20℃)
※）
温度上升允许电流
℃时的直流电感值
（attemperature
Idc2）为温度上升到
40DC
20℃） increase by 40℃. (at 20℃)
※）The
temperature rise（current
value (Idc2) is the
current value having
※）
额定电流值：
或Idc2
中低的一方的直流电流值当作额定电流值。
Idc1
※）The
rated current
value
is following
either Idc1 or Idc2, which is the lower one.
i_wound_MB_e-E07R01
▶ 由于篇幅有限，本产品目录中只记载了有代表性的产品规格，若考虑使用弊司产品时，请确认交货规格说明书中的详细规格。
另外，有关各产品的详细信息
（特性图、可靠性信息、使用时的注意事项等），请参阅弊司网站
（http://www.ty-top.com/ ）。
19
61
金属绕线型片状功率电感器 (MCOILTM MB-H 系列）
METAL WIRE-WOUND CHIP POWER INDUCTORS（MCOILTM MB-H SERIES）
回流焊
REFLOW
※使用温度范围：
-40 ～+105℃（包含产品本身发热）
* Operating Temp.：-40～+125℃（Including
self-generated heat）
■PARTS
NUMBER
型号标示法
M B
①
K
K
1
6
②
0
③
①Series
①类型 name
Code
代码
MB
8
H
④
1
R 0
⑤
M △
⑥ ⑦
空格 space
△＝Blank
④包装
④Packaging
Code
代码
H
Series
类型name
Metal金属绕线型片状功率电感器
Wire-Wound chip power inductor
电感器／功率电感器
②尺寸（
T）
②Dimensions（T）
Code
代码
KK
MK
⑤Nominal inductance
⑤标称电感值
Code
代码
（例）
（example）
R24
1R0
4R7
小数点 point
※R＝Decimal
Dimensions（T）［mm］
尺寸（ T ）
［mm］
1.0
1.2
③Dimensions（L×W）
③尺寸（
L×W）
代码
Code
外型
（inch）
Type（inch）
1608
2520
1608（0603）
2520（1008）
Dimensions
尺寸（L×W ）
［mm］
（L×W）［mm］
1.6×0.8
2.5×2.0
⑥Inductance tolerance
⑥电感量公差
Code
代码
M
N
Packaging
包装
胶带（高特性规格）
Taping（Special
specification）
Nominal
inductance［μH］
标称电感值
［μH］
0.24
1.0
4.7
Inductance
tolerance
电感量公差
±20％
±30％
⑦Internal code
⑦本公司管理记号
标准外型尺寸／标准数量
■STANDARD
EXTERNAL DIMENSIONS / STANDARD QUANTITY
推荐焊盘图案
Recommended Land Patterns
实装上的注意
Surface Mounting
L
W
・请确认实装状态后使用。
・Mounting and soldering conditions should be checked beforehand.
・本产品焊法限定为回流焊法。
・Applicable soldering process to these products is reflow soldering only.
T
型号
Type
A
B
C
1608
0.55
0.70
e
2520
0.60
1.50
A
型号
Type
MBKK1608
MBMK2520
B
C
1.00
2.00
单位：mm
（inch）
Unit：mm
A
标准数量
[pcs]
Standard
quantity［pcs］
Paper
Embossed
纸带tape
压纹带 tape
L
W
T
e
1.6±0.2
（0.063±0.008）
2.5±0.2
（0.098±0.008）
0.8±0.2
（0.031±0.008）
2.0±0.2
（0.079±0.008）
1.0 max
（0.040 max）
1.2 max
（0.047 max）
0.45±0.15
（0.016±0.006）
0.5±0.2
（0.020±0.008）
－
3000
－
3000
单位：
mm（inch）
Unit：mm（inch）
▶ 由于篇幅有限，本产品目录中只记载了有代表性的产品规格，若考虑使用弊司产品时，请确认交货规格说明书中的详细规格。
另外，有关各产品的详细信息
（特性图、可靠性信息、使用时的注意事项等），请参阅弊司网站
（http://www.ty-top.com/ ）。
62
19
i_wound_MB-H_e-E07R01
型号一览
■PARTS
NUMBER
MBKK1608H (0603) 型 type
●MBKK1608H（0603）
Parts
number
型号
MBKK1608HR24N
MBKK1608HR47N
MBKK1608HR68N
MBKK1608H1R0M
MBKK1608H1R5M
MBKK1608H2R2M
MBKK1608H3R3M
MBKK1608H4R7M
【厚度:1.0mm
max.】
【Thickness：1.0mm
max.】
EHS
Nominal
inductance
标称电感值
［μH］
［μ
H］
Inductance
tolerance
电感量公差
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.24
0.47
0.68
1.0
1.5
2.2
3.3
4.7
±30％
±30％
±30％
±20％
±20％
±20％
±20％
±20％
MBMK2520H (1008) 型 type
●MBMK2520H（1008）
【厚度:1.2mm
max.】
【Thickness：1.2mm
EHS
MBMK2520HR24N
MBMK2520HR47N
MBMK2520HR68N
MBMK2520H1R0M
MBMK2520H1R5M
MBMK2520H2R2M
MBMK2520H3R3M
MBMK2520H4R7M
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.24
0.47
0.68
1.0
1.5
2.2
3.3
4.7
DC直流电阻
Resistance
［Ω］（max.）
［Ω］
（max.）
0.049
0.104
0.120
0.150
0.200
0.345
0.512
0.730
额定电流 ※）
［ｍ A］
（max.）
Rated
current ※） ［ｍA］（max.）
Measuring
测试频率
直流重叠允许电流
温度上升允许电流
Saturation
current Temperature
rise current frequency［MHz］
［MHz］
Idc1
Idc2
Idc1
Idc2
1,650
2,300
1.0
1,100
1,400
1.0
950
1,200
1.0
800
1,150
1.0
650
1,000
1.0
520
750
1.0
450
600
1.0
370
500
1.0
max.】
Inductance
tolerance
电感量公差
±30％
±30％
±30％
±20％
±20％
±20％
±20％
±20％
Self-resonant
自共振频率
frequency
［MHｚ］
［MHｚ］（min.）
（min.）
-
DC直流电阻
Resistance
［Ω］（max.）
［Ω］
（max.）
0.026
0.042
0.058
0.072
0.106
0.159
0.260
0.380
Rated
current ※） ［ｍA］（max.）
额定电流 ※）
［ｍ A］
（max.）
Measuring
测试频率
直流重叠允许电流
温度上升允许电流
Saturation
current Temperature
rise current frequency［MHz］
［MHz］
Idc2
Idc1
Idc1
Idc2
4,750
3,500
1.0
3,900
2,600
1.0
3,150
2,150
1.0
2,350
1,850
1.0
2,050
1,500
1.0
1,800
1,250
1.0
1,400
970
1.0
1,150
800
1.0
※）The
saturation current
value）(Idc1)
is the DC current value having范围在
inductance
decrease down to 30%.
(at20
20℃)
※）
直流重叠允许电流
（Idc1
为直流重叠带来的电感值下降，
（at
℃）
30％以内的直流电感值
※）The
temperature rise（current
value (Idc2) is the
current value having
※）
温度上升允许电流
℃时的直流电感值
（attemperature
Idc2）为温度上升到
40DC
20℃） increase by 40℃. (at 20℃)
※）The
rated current
value
is following
either Idc1 or Idc2, which is the lower one.
※）
额定电流值：
或Idc2
中低的一方的直流电流值当作额定电流值。
Idc1
电感器／功率电感器
Parts
number
型号
Nominal
inductance
标称电感值
［μH］
［μ
H］
Self-resonant
自共振频率
frequency
［MHｚ］
［MHｚ］（min.）
（min.）
-
i_wound_MB-H_e-E07R01
▶ 由于篇幅有限，本产品目录中只记载了有代表性的产品规格，若考虑使用弊司产品时，请确认交货规格说明书中的详细规格。
另外，有关各产品的详细信息
（特性图、可靠性信息、使用时的注意事项等），请参阅弊司网站
（http://www.ty-top.com/ ）。
19
63
METAL WIRE-WOUND CHIP POWER INDUCTORS
(MCOILTM MB SERIES／MCOILTM MB-H SERIES)
■PACKAGING
①Minimum Quantity
Type
MBKK1608／MBKK1608H
MBKK2012
MBMK2520／MBMK2520H
Standard Quantity [pcs]
Tape ＆ Reel
3000
3000
3000
②Tape Material
●Embossed Tape
Top tape
Chip Filled
Sprocket hole
Base tape
Chip cavity
Chip
③Taping dimensions
●Embossed tape 8mm wide (0.315 inches wide)
3.5±0.1
(0.138±0.004)
A
B
F
1.75±0.1
(0.069±0.004）
8.0±0.2
(0.315±0.008)
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
Sprocket hole
4.0±0.1
(0.157±0.004)
2.0±0.05
(0.079±0.002)
Type
MBKK1608／MBKK1608H
MBKK2012
MBMK2520／MBMK2520H
Electrode（bottom view）
Chip cavity
A
1.1
(0.043)
1.45
(0.057)
2.3
(0.091)
B
1.9
(0.075)
2.2
(0.087)
2.8
(0.110)
Insertion pitch
F
4.0±0.1
(0.157±0.004)
4.0±0.1
(0.157±0.004)
4.0±0.1
(0.157±0.004)
Tape thickness
T
K
0.25±0.05
1.2 max
(0.010±0.002)
(0.047 max)
0.25±0.05
1.2 max
(0.010±0.002)
(0.047 max)
0.3±0.05
1.45 max
(0.012±0.002)
(0.057 max)
Unit：mm（inch）
④Leader and Blank portion
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MB_pack_e-E06R01
⑤Reel size
Type
MBKK1608／MBKK1608H
MBKK2012
MBMK2520／MBMK2520H
φD
Reel size (Reference values)
φd
180+0/-3
（7.087+0/-0.118）
60+1/-0
（2.36+0.039/0）
W
10.0±1.5
（0.394±0.059）
Unit：mm（inch）
⑥Top Tape Strength
The top The top tape requires a peel-off force of 0.2 to 0.7N in the direction of the arrow as illustrated below.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MB_pack_e-E06R01
METAL WIRE-WOUND CHIP POWER INDUCTORS
(MCOILTM MB SERIES／MCOILTM MB-H SERIES)
■RELIABILITY DATA
1. Operating Temperature Range
Specified Value
Test Methods and
Remarks
MB series
－40～＋105℃
MB-H series
－40～＋125℃
Including self-generated heat
2. Storage Temperature Range
Specified Value
Test Methods and
Remarks
MB series
－40～＋85℃
MB-H series
0 to 40℃ for the product with taping.
3. Rated current
Specified Value
MB series
MB-H series
Within the specified tolerance
4. Inductance
Specified Value
Test Methods and
Remarks
MB series
MB-H series
Measuring equipment
Measuring frequency
Within the specified tolerance
: LCR Meter （HP 4285A or equivalent）
: 1MHz、1V
5. DC Resistance
Specified Value
Test Methods and
Remarks
MB series
MB-H series
Measuring equipment
Within the specified tolerance
: DC ohmmeter （HIOKI 3227 or equivalent）
6. Self resonance frequency
Specified Value
MB series
MB-H series
－
7. Temperature characteristic
Specified Value
Test Methods and
Remarks
MB series
MB-H series
Inductance change : Within ±15%
MB series :
Measurement of inductance shall be taken at temperature range within －40℃～＋105℃.
With reference to inductance value at ＋20℃., change rate shall be calculated.
MB-H series :
Measurement of inductance shall be taken at temperature range within －40℃～＋125℃.
With reference to inductance value at ＋20℃., change rate shall be calculated.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MB_reli_e-E06R01
8. Resistance to flexure of substrate
Specified Value
Test Methods and
Remarks
MB series
MB-H series
No damage
The test samples shall be soldered to the test board by the reflow. As illustrated below, apply force in the direction of the arrow indicating
until deflection of the test board reaches to 2 mm.
Test board size
: 100×40×1.0 mm (1608：0.8mm)
Test board material
: Glass epoxy-resin
Solder cream thickness
: 0.1 mm
9. Insulation resistance : between wires
Specified Value
MB series
MB-H series
－
10. Insulation resistance : between wire and core
Specified Value
MB series
DC25V 100kΩ min
MB-H series
DC50V 100kΩ min
11. Withstanding voltage : between wire and core
Specified Value
MB series
MB-H series
－
12. Adhesion of terminal electrode
Specified Value
Test Methods and
Remarks
MB series
MB-H series
No abnormality.
The test samples shall be soldered to the test board by the reflow.
Applied force
: 10N (1608：5N) to X and Y directions.
Duration
: 5s.
Solder cream thickness
: 0.1mm.
13. Resistance to vibration
Specified Value
Test Methods and
Remarks
MB series
MB-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow.
Then it shall be submitted to below test conditions.
Frequency Range
10～55Hz
Total Amplitude
1.5mm (May not exceed acceleration 196m/s2)
Sweeping Method
10Hz to 55Hz to 10Hz for 1min.
X
Time
Y
For 2 hours on each X, Y, and Z axis.
Z
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
14. Solderability
Specified Value
Test Methods and
Remarks
MB series
MB-H series
At least 90％ of surface of terminal electrode is covered by new solder.
The test samples shall be dipped in flux, and then immersed in molten solder as shown in below table.
Flux : Methanol solution containing rosin 25%.
Solder Temperature
245±5℃
Immersing speed
25mm/s
Time
5±0.5 sec.
※Immersion depth : All sides of mounting terminal shall be immersed.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MB_reli_e-E06R01
15. Resistance to soldering heat
Specified Value
Test Methods and
Remarks
MB series
MB-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test sample shall be exposed to reflow oven at 230℃ for 40 seconds, with peak temperature at 260＋0/－5℃ for 5 seconds, 3 times.
Test board material
: Glass epoxy-resin
Test board thickness
: 1.0mm
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
16. Thermal shock
Specified Value
Test Methods and
Remarks
MB series
MB-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
MB series:
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed at specified temperature for
specified time by step 1 to step 4 as shown in below table in
sequence. The temperature cycle shall be repeated 100 cycles.
Conditions of 1 cycle
Step
Temperature (℃)
Duration (min)
1
－40±3
30±3
2
Room temperature
Within 3
3
＋85±2
30±3
4
Room temperature
Within 3
Recovery : At least 2hrs of recovery under the standard condition
after the test, followed by the measurement within 48hrs.
MB-H series:
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed at specified temperature for
specified time by step 1 to step 4 as shown in below table in
sequence. The temperature cycle shall be repeated 100 cycles.
Conditions of 1 cycle
Step
Temperature (℃)
Duration (min)
1
－40±3
30±3
2
Room temperature
Within 3
3
＋125±2
30±3
4
Room temperature
Within 3
Recovery : At least 2hrs of recovery under the standard condition
after the test, followed by the measurement within 48hrs.
17. Damp heat
Specified Value
Test Methods and
Remarks
MB series
MB-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
MB series:
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at
specified temperature and humidity as shown in below table.
Temperature
60±2℃
Humidity
90～95%RH
Time
1000＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition
after the test, followed by the measurement within 48hrs.
MB-H series:
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at
specified temperature and humidity as shown in below table.
Temperature
85±2℃
Humidity
85%RH
Time
1000＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition
after the test, followed by the measurement within 48hrs.
18. Loading under damp heat
Specified Value
Test Methods and
Remarks
MB series
MB-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
MB series:
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at
specified temperature and humidity and applied the rated current
continuously as shown in below table.
Temperature
60±2℃
Humidity
90～95％RH
Applied current
Rated current
Time
1000＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition
after the test, followed by the measurement within 48hrs.
MB-H series:
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at
specified temperature and humidity and applied the rated current
continuously as shown in below table.
Temperature
85±2℃
Humidity
85％RH
Applied current
Rated current
Time
1000＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition
after the test, followed by the measurement within 48hrs.
19. Low temperature life test
Specified Value
Test Methods and
Remarks
MB series
MB-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown
in below table.
Temperature
－40±2℃
Time
1000＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MB_reli_e-E06R01
20. High temperature life test
Specified Value
Test Methods and
Remarks
MB series
MB-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown
in below table.
Temperature
85±2℃
Time
1000＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
21. Loading at high temperature life test
Specified Value
MB series
MB-H series
－
22. Standard condition
MB series
Specified Value
MB-H series
Standard test condition :
Unless otherwise specified, temperature is 20±15℃ and 65±20％of relative humidity.
When there is any question concerning measurement result: In order to provide correlation
data, the test shall be condition of 20±2℃ of temperature, 65±5% relative humidity.
Inductance is in accordance with our measured value.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MB_reli_e-E06R01
METAL WIRE-WOUND CHIP POWER INDUCTORS
(MCOILTM MB SERIES／MCOILTM MB-H SERIES)
■PRECAUTIONS
1. Circuit Design
Precautions
◆Operating environment
1. The products described in this specification are intended for use in general electronic equipment,(office supply equipment,
telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical
equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear
control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or
damage. For such uses, contact TAIYO YUDEN Sales Department in advance.
2. PCB Design
Precautions
Technical
considerations
◆Land pattern design
1. Please refer to a recommended land pattern.
◆Land pattern design
Surface Mounting
・ Mounting and soldering conditions should be checked beforehand.
・ Applicable soldering process to this products is reflow soldering only.
3. Considerations for automatic placement
Precautions
Technical
considerations
◆Adjustment of mounting machine
1. Excessive impact load should not be imposed on the products when mounting onto the PC boards.
2. Mounting and soldering conditions should be checked beforehand.
◆Adjustment of mounting machine
1. When installing products, care should be taken not to apply distortion stress as it may deform the products.
4. Soldering
Precautions
◆Reflow soldering
1. Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified.
2. The product shall be used reflow soldering only.
3. Please do not add any stress to a product until it returns in normal temperature after reflow soldering.
◆Lead free soldering
1. When using products with lead free soldering, we request to use them after confirming adhesion, temperature of resistance to soldering
heat, soldering etc sufficiently.
Technical
considerations
Temperature［℃］
◆Reflow soldering
1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently
degrade the reliability of the products.
Recommended reflow condition (Pb free solder)
5sec max
300
Peak：260+0/-5℃
150～180
200
100
40sec max
90±30sec 230℃ min
0
Heating Time［sec］
5. Cleaning
Precautions
Technical
considerations
◆Cleaning conditions
1. Washing by supersonic waves shall be avoided.
◆Cleaning conditions
1. If washed by supersonic waves, the products might be broken.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MB_prec_e-E06R01
6. Handling
Precautions
Technical
considerations
◆Handling
1. Keep the product away from all magnets and magnetic objects.
◆Breakaway PC boards (splitting along perforations)
1. When splitting the PC board after mounting product, care should be taken not to give any stresses of deflection or twisting to the board.
2. Board separation should not be done manually, but by using the appropriate devices.
◆Mechanical considerations
1. Please do not give the product any excessive mechanical shocks.
2. Please do not add any shock and power to a product in transportation.
◆Pick-up pressure
1. Please do not push to add any pressure to a winding part. Please do not give any shock and push into a ferrite core exposure part.
◆Packing
1. Please avoid accumulation of a packing box as much as possible.
◆Handling
1. There is a case that a characteristic varies with magnetic influence.
◆Breakaway PC boards (splitting along perforations)
1. The position of the product on PCBs shall be carefully considered to minimize the stress caused from splitting of the PCBs.
◆Mechanical considerations
1. There is a case to be damaged by a mechanical shock.
2. There is a case to be broken by the handling in transportation.
◆Pick-up pressure
1. Damage and a characteristic can vary with an excessive shock or stress.
◆Packing
1. If packing boxes are accumulated, that could cause a deformation on packing tapes or a damage on the products.
7. Storage conditions
Precautions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the
storage area should be controlled.
・ Recommended conditions
Ambient temperature : 0～40℃
Humidity : Below 70% RH
・ The ambient temperature must be kept below 30℃. Even under ideal storage conditions, solderability of products electrodes may
decrease as time passes.
For this reason, product should be used within 6 months from the time of delivery.
In case of storage over 6 months, solderability shall be checked before actual usage.
Technical
considerations
◆Storage
1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes
and deterioration of taping/packaging materials may take place.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MB_prec_e-E06R01
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