for General Electronic Equipment
Notice for TAIYO YUDEN products
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
■ Product Information in this Catalog
Product information in this catalog is as of October
2020. All
All of
of the
the
January 2021.
contents specified herein and production status of the products listed in
this catalog are subject to change without notice due to technical
improvement of our products, etc. Therefore, please check for the latest
information carefully before practical application or use of our products.
(4) Powe r g e n e r atio n c o ntro l e quip m e nt (nu c le a r p owe r,
hydroelectric power, thermal power plant control system, etc.)
(5) Undersea equipment (submarine repeating equipment,
underwater work equipment, etc.)
(6) Military equipment
(7) Any other equipment requiring extremely high levels of safety
and/or reliability equal to the equipment listed above
Please note that TAIYO YUDEN shall not be in any way responsible
for any damages and defects in products or equipment incorporating
our products, which are caused under the conditions other than those
specified in this catalog or individual product specification sheets.
*Notes:
1. There is a possibility that our products can be used only
for aviation equipment that does not directly affect the safe
operation of aircraft (e.g., in-flight entertainment, cabin
light, electric seat, cooking equipment) if such use meets
requirements specified separately by TAIYO YUDEN. Please
be sure to contact TAIYO YUDEN for further information
before using our products for such aviation equipment.
2. Implantable medical devices contain not only internal unit
which is implanted in a body, but also external unit which is
connected to the internal unit.
■ Approval of Product Specifications
Ple a se c ont ac t TA IYO YUD EN for fur the r det a ils of p ro duc t
specifications as the individual product specification sheets are
available. When using our products, please be sure to approve our
product specifications or make a written agreement on the product
specification with TAIYO YUDEN in advance.
■ Pre-Evaluation in the Actual Equipment and Conditions
Please conduct validation and verification of our products in actual
conditions of mounting and operating environment before using our
products.
■ Limited Application
1. Equipment Intended for Use
The products listed in this catalog are intended for generalpurpose and standard use in general electronic equipment (e.g.,
AV equipment, OA equipment, home electric appliances, office
equipment, information and communication equipment including,
without limitation, mobile phone, and PC) and other equipment
specified in this catalog or the individual product specification sheets.
TAIYO YUDEN has the line-up of the products intended for
use in automotive electronic equipment, telecommunications
infrastructure and industrial equipment, or medical devices
classified as GHTF Classes A to C (Japan Classes I to III).
Therefore, when using our products for these equipment,
please check available applications specified in this catalog
or the individual product specification sheets and use the
corresponding products.
2. Equipment Requiring Inquiry
Please be sure to contact TAIYO YUDEN for further information
before using the products listed in this catalog for the following
equipment (excluding intended equipment as specified in this
catalog or the individual product specification sheets) which may
cause loss of human life, bodily injury, serious property damage
and/or serious public impact due to a failure or defect of the
products and/or malfunction attributed thereto.
(1) Transportation equipment (automotive powertrain control
system, train control system, and ship control system, etc.)
(2) Traffic signal equipment
(3) Disaster prevention equipment, crime prevention equipment
(4) Medical devices classified as GHTF Class C (Japan Class III)
(5) H i g h l y p u b l i c i n f o r m a t i o n n e t wo r k e q u i p m e n t , d a t a processing equipment (telephone exchange, and base
station, etc.)
(6) Any other equipment requiring high levels of quality and/or
reliability equal to the equipment listed above
3. Equipment Prohibited for Use
Please do not incorporate our products into the following
equipment requiring extremely high levels of safety and/or
reliability.
(1) Aerospace equipment (artificial satellite, rocket, etc.)
(2) Aviation equipment *1
(3) Medical devices classified as GHTF Class D (Japan Class IV),
implantable medical devices *2
4. Limitation of Liability
Please note that unless you obtain prior written consent of TAIYO
YUDEN, TAIYO YUDEN shall not be in any way responsible for
any damages incurred by you or third parties arising from use of
the products listed in this catalog for any equipment that is not
intended for use by TAIYO YUDEN, or any equipment requiring
inquiry to TAIYO YUDEN or prohibited for use by TAIYO YUDEN
as described above.
■ Safety Design
When using our products for high safety and/or reliability-required
equipment or circuits, please fully perform safety and/or reliability
evaluation. In addition, please install (i) systems equipped with
a protection circuit and a protection device and/or (ii) systems
equipped with a redundant circuit or other system to prevent an
unsafe status in the event of a single fault for a failsafe design to
ensure safety.
■ Intellectual Property Rights
Information contained in this catalog is intended to convey examples
of typical performances and/or applications of our products and is
not intended to make any warranty with respect to the intellectual
property rights or any other related rights of TAIYO YUDEN or any
third parties nor grant any license under such rights.
■ Limited Warranty
Please note that the scope of warranty for our products is limited to
the delivered our products themselves and TAIYO YUDEN shall not
be in any way responsible for any damages resulting from a failure
or defect in our products. Notwithstanding the foregoing, if there is
a written agreement (e.g., supply and purchase agreement, quality
assurance agreement) signed by TAIYO YUDEN and your company,
TAIYO YUDEN will warrant our products in accordance with such
agreement.
■ TAIYO YUDEN’s Official Sales Channel
The contents of this catalog are applicable to our products which are
purchased from our sales offices or authorized distributors (hereinafter
“TAIYO YUDEN’
s official sales channel”). Please note that the contents
of this catalog are not applicable to our products purchased from any
seller other than TAIYO YUDEN’
s official sales channel.
■ Caution for Export
Some of our products listed in this catalog may require specific
procedures for export according to“U.S. Export Administration
Regulations”,“Foreign Exchange and Foreign Trade Control Law”
of Japan, and other applicable regulations. Should you have any
questions on this matter, please contact our sales staff.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
2
21
for General Electronic Equipment
METAL WIRE-WOUND CHIP POWER INDUCTORS(MCOILTM
MB SERIES)
TM
METAL WIRE-WOUND CHIP POWER INDUCTORS(MCOIL
MB SERIES)
REFLOW
■PARTS NUMBER
M B
①
K
* Operating Temp.:-40~+105℃(Including self-generated heat)
K
1
6
②
0
③
T
④
1
R 0
⑤
M △
⑥ ⑦
④Packaging
Code
T
Series name
Metal Wire-Wound chip power inductor
②Dimensions(T)
Code
KK
MK
1608
2012
2520
1608(0603)
2012(0805)
2520(1008)
Dimensions
(L×W)[mm]
1.6×0.8
2.0×1.25
2.5×2.0
⑥Inductance tolerance
Code
M
N
Nominal inductance[μH]
0.24
1.0
4.7
POWER INDUCTORS
③Dimensions(L×W)
Type(inch)
Packaging
Taping
⑤Nominal inductance
Code
(example)
R24
1R0
4R7
※R=Decimal point
Dimensions(T)[mm]
1.0
1.2
Code
△=Blank space
INDUCTORS
①Series name
Code
MB
8
Inductance tolerance
±20%
±30%
⑦Internal code
■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY
Recommended Land Patterns
Surface Mounting
L
W
・Mounting and soldering conditions should be checked beforehand.
・Applicable soldering process to these products is reflow soldering
Type
A
T
C
1608
0.55
2012
0.60
e
2520
0.60
B
A
A
Type
MBKK1608
MBKK2012
MBMK2520
only.
B
0.70
1.00
1.50
C
1.00
1.45
2.00
Unit:mm
Standard quantity[pcs]
Paper tape
Embossed tape
L
W
T
e
1.6±0.2
(0.063±0.008)
2.0±0.2
(0.079±0.008)
2.5±0.2
(0.098±0.008)
0.8±0.2
(0.031±0.008)
1.25±0.2
(0.049±0.008)
2.0±0.2
(0.079±0.008)
1.0 max
(0.040 max)
1.0 max
(0.040 max)
1.2 max
(0.047 max)
0.45±0.15
(0.016±0.006)
0.5±0.2
(0.020±0.008)
0.5±0.2
(0.020±0.008)
-
3000
-
3000
-
3000
Unit:mm(inch)
i_wound_MB_e-E08R01.doc
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
21
47
for General Electronic Equipment
■PARTS NUMBER
●MBKK1608(0603) type
Parts number
MBKK1608TR24N
MBKK1608TR47N
MBKK1608TR68N
MBKK1608T1R0M
MBKK1608T1R5M
MBKK1608T2R2M
MBKK1608T3R3M
MBKK1608T4R7M
EHS
Nominal inductance
[μH]
Inductance tolerance
Self-resonant
frequency
[MHz](min.)
DC Resistance
[Ω](max.)
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.24
0.47
0.68
1.0
1.5
2.2
3.3
4.7
±30%
±30%
±30%
±20%
±20%
±20%
±20%
±20%
-
0.049
0.104
0.120
0.150
0.200
0.345
0.512
0.730
INDUCTORS
●MBKK2012(0805) type
Parts number
POWER INDUCTORS
MBKK2012TR24N
MBKK2012TR47N
MBKK2012TR68N
MBKK2012T1R0M
MBKK2012T1R5M
MBKK2012T2R2M
MBKK2012T3R3M
MBKK2012T4R7M
【Thickness:1.0mm max.】
【Thickness:1.0mm max.】
EHS
Nominal inductance
[μH]
Inductance tolerance
Self-resonant
frequency
[MHz](min.)
DC Resistance
[Ω](max.)
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.24
0.47
0.68
1.0
1.5
2.2
3.3
4.7
±30%
±30%
±30%
±20%
±20%
±20%
±20%
±20%
-
0.041
0.078
0.090
0.106
0.173
0.290
0.500
0.615
●MBMK2520(1008) type
Rated current ※) [mA](max.)
Measuring
Saturation current Temperature rise current frequency[MHz]
Idc1
Idc2
1,650
2,300
1.0
1,100
1,400
1.0
950
1,200
1.0
800
1,150
1.0
650
1,000
1.0
520
750
1.0
450
600
1.0
370
500
1.0
Rated current ※) [mA](max.)
Measuring
Saturation current Temperature rise current frequency[MHz]
Idc1
Idc2
3,000
2,400
1.0
2,000
1,650
1.0
1,800
1,500
1.0
1,500
1,450
1.0
1,200
1,100
1.0
900
850
1.0
700
650
1.0
600
600
1.0
【Thickness:1.2mm max.】
Parts number
EHS
Nominal inductance
[μH]
Inductance tolerance
Self-resonant
frequency
[MHz](min.)
DC Resistance
[Ω](max.)
MBMK2520TR24N
MBMK2520TR47N
MBMK2520TR68N
MBMK2520T1R0M
MBMK2520T1R5M
MBMK2520T2R2M
MBMK2520T3R3M
MBMK2520T4R7M
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.24
0.47
0.68
1.0
1.5
2.2
3.3
4.7
±30%
±30%
±30%
±20%
±20%
±20%
±20%
±20%
-
0.026
0.042
0.058
0.072
0.106
0.159
0.260
0.380
Rated current ※) [mA](max.)
Measuring
Saturation current Temperature rise current frequency[MHz]
Idc1
Idc2
4,750
3,500
1.0
3,900
2,600
1.0
3,150
2,150
1.0
2,350
1,850
1.0
2,050
1,500
1.0
1,800
1,250
1.0
1,400
970
1.0
1,150
800
1.0
※)The saturation current value (Idc1) is the DC current value having inductance decrease down to 30%. (at 20℃)
※)The temperature rise current value (Idc2) is the DC current value having temperature increase by 40℃. (at 20℃)
※)The rated current value is following either Idc1 or Idc2, which is the lower one.
i_wound_MB_e-E08R01.xls
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
48
21
METAL WIRE-WOUND CHIP POWER INDUCTORS
(MCOILTM MB SERIES/MCOILTM MB-H SERIES)
■PACKAGING
①Minimum Quantity
Type
MBKK1608/MBKK1608H
MBKK2012
MBMK2520/MBMK2520H
Standard Quantity [pcs]
Tape & Reel
3000
3000
3000
②Tape Material
●Embossed Tape
Top tape
Chip Filled
Sprocket hole
Base tape
Chip cavity
Chip
③Taping dimensions
●Embossed tape 8mm wide (0.315 inches wide)
3.5±0.1
(0.138±0.004)
A
B
F
1.75±0.1
(0.069±0.004)
8.0±0.2
(0.315±0.008)
φ1.5+0.1/-0
(φ0.059+0.004/-0)
Sprocket hole
4.0±0.1
(0.157±0.004)
2.0±0.05
(0.079±0.002)
Type
MBKK1608/MBKK1608H
MBKK2012
MBMK2520/MBMK2520H
Electrode(bottom view)
Chip cavity
A
1.1
(0.043)
1.45
(0.057)
2.3
(0.091)
B
1.9
(0.075)
2.2
(0.087)
2.8
(0.110)
Insertion pitch
F
4.0±0.1
(0.157±0.004)
4.0±0.1
(0.157±0.004)
4.0±0.1
(0.157±0.004)
Tape thickness
T
K
0.25±0.05
1.2 max
(0.010±0.002)
(0.047 max)
0.25±0.05
1.2 max
(0.010±0.002)
(0.047 max)
0.3±0.05
1.45 max
(0.012±0.002)
(0.057 max)
Unit:mm(inch)
④Leader and Blank portion
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MB_pack_e-E06R01
⑤Reel size
Type
MBKK1608/MBKK1608H
MBKK2012
MBMK2520/MBMK2520H
φD
Reel size (Reference values)
φd
180+0/-3
(7.087+0/-0.118)
60+1/-0
(2.36+0.039/0)
W
10.0±1.5
(0.394±0.059)
Unit:mm(inch)
⑥Top Tape Strength
The top The top tape requires a peel-off force of 0.2 to 0.7N in the direction of the arrow as illustrated below.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MB_pack_e-E06R01
METAL WIRE-WOUND CHIP POWER INDUCTORS
(MCOILTM MB SERIES/MCOILTM MB-H SERIES)
■RELIABILITY DATA
1. Operating Temperature Range
Specified Value
Test Methods and
Remarks
MB series
-40~+105℃
MB-H series
-40~+125℃
Including self-generated heat
2. Storage Temperature Range
Specified Value
Test Methods and
Remarks
MB series
-40~+85℃
MB-H series
0 to 40℃ for the product with taping.
3. Rated current
Specified Value
MB series
MB-H series
Within the specified tolerance
4. Inductance
Specified Value
Test Methods and
Remarks
MB series
MB-H series
Measuring equipment
Measuring frequency
Within the specified tolerance
: LCR Meter (HP 4285A or equivalent)
: 1MHz、1V
5. DC Resistance
Specified Value
Test Methods and
Remarks
MB series
MB-H series
Measuring equipment
Within the specified tolerance
: DC ohmmeter (HIOKI 3227 or equivalent)
6. Self resonance frequency
Specified Value
MB series
MB-H series
-
7. Temperature characteristic
Specified Value
Test Methods and
Remarks
MB series
MB-H series
Inductance change : Within ±15%
MB series :
Measurement of inductance shall be taken at temperature range within -40℃~+105℃.
With reference to inductance value at +20℃., change rate shall be calculated.
MB-H series :
Measurement of inductance shall be taken at temperature range within -40℃~+125℃.
With reference to inductance value at +20℃., change rate shall be calculated.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MB_reli_e-E06R01
8. Resistance to flexure of substrate
Specified Value
Test Methods and
Remarks
MB series
MB-H series
No damage
The test samples shall be soldered to the test board by the reflow. As illustrated below, apply force in the direction of the arrow indicating
until deflection of the test board reaches to 2 mm.
Test board size
: 100×40×1.0 mm (1608:0.8mm)
Test board material
: Glass epoxy-resin
Solder cream thickness
: 0.1 mm
9. Insulation resistance : between wires
Specified Value
MB series
MB-H series
-
10. Insulation resistance : between wire and core
Specified Value
MB series
DC25V 100kΩ min
MB-H series
DC50V 100kΩ min
11. Withstanding voltage : between wire and core
Specified Value
MB series
MB-H series
-
12. Adhesion of terminal electrode
Specified Value
Test Methods and
Remarks
MB series
MB-H series
No abnormality.
The test samples shall be soldered to the test board by the reflow.
Applied force
: 10N (1608:5N) to X and Y directions.
Duration
: 5s.
Solder cream thickness
: 0.1mm.
13. Resistance to vibration
Specified Value
Test Methods and
Remarks
MB series
MB-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow.
Then it shall be submitted to below test conditions.
Frequency Range
10~55Hz
Total Amplitude
1.5mm (May not exceed acceleration 196m/s2)
Sweeping Method
10Hz to 55Hz to 10Hz for 1min.
X
Time
Y
For 2 hours on each X, Y, and Z axis.
Z
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
14. Solderability
Specified Value
Test Methods and
Remarks
MB series
MB-H series
At least 90% of surface of terminal electrode is covered by new solder.
The test samples shall be dipped in flux, and then immersed in molten solder as shown in below table.
Flux : Methanol solution containing rosin 25%.
Solder Temperature
245±5℃
Immersing speed
25mm/s
Time
5±0.5 sec.
※Immersion depth : All sides of mounting terminal shall be immersed.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MB_reli_e-E06R01
15. Resistance to soldering heat
Specified Value
Test Methods and
Remarks
MB series
MB-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test sample shall be exposed to reflow oven at 230℃ for 40 seconds, with peak temperature at 260+0/-5℃ for 5 seconds, 3 times.
Test board material
: Glass epoxy-resin
Test board thickness
: 1.0mm
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
16. Thermal shock
Specified Value
Test Methods and
Remarks
MB series
MB-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
MB series:
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed at specified temperature for
specified time by step 1 to step 4 as shown in below table in
sequence. The temperature cycle shall be repeated 100 cycles.
Conditions of 1 cycle
Step
Temperature (℃)
Duration (min)
1
-40±3
30±3
2
Room temperature
Within 3
3
+85±2
30±3
4
Room temperature
Within 3
Recovery : At least 2hrs of recovery under the standard condition
after the test, followed by the measurement within 48hrs.
MB-H series:
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed at specified temperature for
specified time by step 1 to step 4 as shown in below table in
sequence. The temperature cycle shall be repeated 100 cycles.
Conditions of 1 cycle
Step
Temperature (℃)
Duration (min)
1
-40±3
30±3
2
Room temperature
Within 3
3
+125±2
30±3
4
Room temperature
Within 3
Recovery : At least 2hrs of recovery under the standard condition
after the test, followed by the measurement within 48hrs.
17. Damp heat
Specified Value
Test Methods and
Remarks
MB series
MB-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
MB series:
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at
specified temperature and humidity as shown in below table.
Temperature
60±2℃
Humidity
90~95%RH
Time
1000+24/-0 hour
Recovery : At least 2hrs of recovery under the standard condition
after the test, followed by the measurement within 48hrs.
MB-H series:
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at
specified temperature and humidity as shown in below table.
Temperature
85±2℃
Humidity
85%RH
Time
1000+24/-0 hour
Recovery : At least 2hrs of recovery under the standard condition
after the test, followed by the measurement within 48hrs.
18. Loading under damp heat
Specified Value
Test Methods and
Remarks
MB series
MB-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
MB series:
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at
specified temperature and humidity and applied the rated current
continuously as shown in below table.
Temperature
60±2℃
Humidity
90~95%RH
Applied current
Rated current
Time
1000+24/-0 hour
Recovery : At least 2hrs of recovery under the standard condition
after the test, followed by the measurement within 48hrs.
MB-H series:
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at
specified temperature and humidity and applied the rated current
continuously as shown in below table.
Temperature
85±2℃
Humidity
85%RH
Applied current
Rated current
Time
1000+24/-0 hour
Recovery : At least 2hrs of recovery under the standard condition
after the test, followed by the measurement within 48hrs.
19. Low temperature life test
Specified Value
Test Methods and
Remarks
MB series
MB-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown
in below table.
Temperature
-40±2℃
Time
1000+24/-0 hour
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MB_reli_e-E06R01
20. High temperature life test
Specified Value
Test Methods and
Remarks
MB series
MB-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown
in below table.
Temperature
85±2℃
Time
1000+24/-0 hour
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
21. Loading at high temperature life test
Specified Value
MB series
MB-H series
-
22. Standard condition
MB series
Specified Value
MB-H series
Standard test condition :
Unless otherwise specified, temperature is 20±15℃ and 65±20%of relative humidity.
When there is any question concerning measurement result: In order to provide correlation
data, the test shall be condition of 20±2℃ of temperature, 65±5% relative humidity.
Inductance is in accordance with our measured value.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MB_reli_e-E06R01
METAL WIRE-WOUND CHIP POWER INDUCTORS
(MCOILTM MB SERIES/MCOILTM MB-H SERIES)
■PRECAUTIONS
1. Circuit Design
Precautions
◆Operating environment
1. The products described in this specification are intended for use in general electronic equipment,(office supply equipment,
telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical
equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear
control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or
damage. For such uses, contact TAIYO YUDEN Sales Department in advance.
2. PCB Design
Precautions
Technical
considerations
◆Land pattern design
1. Please refer to a recommended land pattern.
◆Land pattern design
Surface Mounting
・ Mounting and soldering conditions should be checked beforehand.
・ Applicable soldering process to this products is reflow soldering only.
3. Considerations for automatic placement
Precautions
Technical
considerations
◆Adjustment of mounting machine
1. Excessive impact load should not be imposed on the products when mounting onto the PC boards.
2. Mounting and soldering conditions should be checked beforehand.
◆Adjustment of mounting machine
1. When installing products, care should be taken not to apply distortion stress as it may deform the products.
4. Soldering
Precautions
◆Reflow soldering
1. Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified.
2. The product shall be used reflow soldering only.
3. Please do not add any stress to a product until it returns in normal temperature after reflow soldering.
◆Lead free soldering
1. When using products with lead free soldering, we request to use them after confirming adhesion, temperature of resistance to soldering
heat, soldering etc sufficiently.
Technical
considerations
Temperature[℃]
◆Reflow soldering
1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently
degrade the reliability of the products.
Recommended reflow condition (Pb free solder)
5sec max
300
Peak:260+0/-5℃
150~180
200
100
40sec max
90±30sec 230℃ min
0
Heating Time[sec]
5. Cleaning
Precautions
Technical
considerations
◆Cleaning conditions
1. Washing by supersonic waves shall be avoided.
◆Cleaning conditions
1. If washed by supersonic waves, the products might be broken.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MB_prec_e-E06R01
6. Handling
Precautions
Technical
considerations
◆Handling
1. Keep the product away from all magnets and magnetic objects.
◆Breakaway PC boards (splitting along perforations)
1. When splitting the PC board after mounting product, care should be taken not to give any stresses of deflection or twisting to the board.
2. Board separation should not be done manually, but by using the appropriate devices.
◆Mechanical considerations
1. Please do not give the product any excessive mechanical shocks.
2. Please do not add any shock and power to a product in transportation.
◆Pick-up pressure
1. Please do not push to add any pressure to a winding part. Please do not give any shock and push into a ferrite core exposure part.
◆Packing
1. Please avoid accumulation of a packing box as much as possible.
◆Handling
1. There is a case that a characteristic varies with magnetic influence.
◆Breakaway PC boards (splitting along perforations)
1. The position of the product on PCBs shall be carefully considered to minimize the stress caused from splitting of the PCBs.
◆Mechanical considerations
1. There is a case to be damaged by a mechanical shock.
2. There is a case to be broken by the handling in transportation.
◆Pick-up pressure
1. Damage and a characteristic can vary with an excessive shock or stress.
◆Packing
1. If packing boxes are accumulated, that could cause a deformation on packing tapes or a damage on the products.
7. Storage conditions
Precautions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the
storage area should be controlled.
・ Recommended conditions
Ambient temperature : 0~40℃
Humidity : Below 70% RH
・ The ambient temperature must be kept below 30℃. Even under ideal storage conditions, solderability of products electrodes may
decrease as time passes.
For this reason, product should be used within 6 months from the time of delivery.
In case of storage over 6 months, solderability shall be checked before actual usage.
Technical
considerations
◆Storage
1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes
and deterioration of taping/packaging materials may take place.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MB_prec_e-E06R01