for General Electronic Equipment
Notice for TAIYO YUDEN products
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
■ Product Information in this Catalog
Product information in this catalog is as of October
2020. All
All of
of the
the
January 2021.
contents specified herein and production status of the products listed in
this catalog are subject to change without notice due to technical
improvement of our products, etc. Therefore, please check for the latest
information carefully before practical application or use of our products.
(4) Powe r g e n e r atio n c o ntro l e quip m e nt (nu c le a r p owe r,
hydroelectric power, thermal power plant control system, etc.)
(5) Undersea equipment (submarine repeating equipment,
underwater work equipment, etc.)
(6) Military equipment
(7) Any other equipment requiring extremely high levels of safety
and/or reliability equal to the equipment listed above
Please note that TAIYO YUDEN shall not be in any way responsible
for any damages and defects in products or equipment incorporating
our products, which are caused under the conditions other than those
specified in this catalog or individual product specification sheets.
*Notes:
1. There is a possibility that our products can be used only
for aviation equipment that does not directly affect the safe
operation of aircraft (e.g., in-flight entertainment, cabin
light, electric seat, cooking equipment) if such use meets
requirements specified separately by TAIYO YUDEN. Please
be sure to contact TAIYO YUDEN for further information
before using our products for such aviation equipment.
2. Implantable medical devices contain not only internal unit
which is implanted in a body, but also external unit which is
connected to the internal unit.
■ Approval of Product Specifications
Ple a se c ont ac t TA IYO YUD EN for fur the r det a ils of p ro duc t
specifications as the individual product specification sheets are
available. When using our products, please be sure to approve our
product specifications or make a written agreement on the product
specification with TAIYO YUDEN in advance.
■ Pre-Evaluation in the Actual Equipment and Conditions
Please conduct validation and verification of our products in actual
conditions of mounting and operating environment before using our
products.
■ Limited Application
1. Equipment Intended for Use
The products listed in this catalog are intended for generalpurpose and standard use in general electronic equipment (e.g.,
AV equipment, OA equipment, home electric appliances, office
equipment, information and communication equipment including,
without limitation, mobile phone, and PC) and other equipment
specified in this catalog or the individual product specification sheets.
TAIYO YUDEN has the line-up of the products intended for
use in automotive electronic equipment, telecommunications
infrastructure and industrial equipment, or medical devices
classified as GHTF Classes A to C (Japan Classes I to III).
Therefore, when using our products for these equipment,
please check available applications specified in this catalog
or the individual product specification sheets and use the
corresponding products.
2. Equipment Requiring Inquiry
Please be sure to contact TAIYO YUDEN for further information
before using the products listed in this catalog for the following
equipment (excluding intended equipment as specified in this
catalog or the individual product specification sheets) which may
cause loss of human life, bodily injury, serious property damage
and/or serious public impact due to a failure or defect of the
products and/or malfunction attributed thereto.
(1) Transportation equipment (automotive powertrain control
system, train control system, and ship control system, etc.)
(2) Traffic signal equipment
(3) Disaster prevention equipment, crime prevention equipment
(4) Medical devices classified as GHTF Class C (Japan Class III)
(5) H i g h l y p u b l i c i n f o r m a t i o n n e t wo r k e q u i p m e n t , d a t a processing equipment (telephone exchange, and base
station, etc.)
(6) Any other equipment requiring high levels of quality and/or
reliability equal to the equipment listed above
3. Equipment Prohibited for Use
Please do not incorporate our products into the following
equipment requiring extremely high levels of safety and/or
reliability.
(1) Aerospace equipment (artificial satellite, rocket, etc.)
(2) Aviation equipment *1
(3) Medical devices classified as GHTF Class D (Japan Class IV),
implantable medical devices *2
4. Limitation of Liability
Please note that unless you obtain prior written consent of TAIYO
YUDEN, TAIYO YUDEN shall not be in any way responsible for
any damages incurred by you or third parties arising from use of
the products listed in this catalog for any equipment that is not
intended for use by TAIYO YUDEN, or any equipment requiring
inquiry to TAIYO YUDEN or prohibited for use by TAIYO YUDEN
as described above.
■ Safety Design
When using our products for high safety and/or reliability-required
equipment or circuits, please fully perform safety and/or reliability
evaluation. In addition, please install (i) systems equipped with
a protection circuit and a protection device and/or (ii) systems
equipped with a redundant circuit or other system to prevent an
unsafe status in the event of a single fault for a failsafe design to
ensure safety.
■ Intellectual Property Rights
Information contained in this catalog is intended to convey examples
of typical performances and/or applications of our products and is
not intended to make any warranty with respect to the intellectual
property rights or any other related rights of TAIYO YUDEN or any
third parties nor grant any license under such rights.
■ Limited Warranty
Please note that the scope of warranty for our products is limited to
the delivered our products themselves and TAIYO YUDEN shall not
be in any way responsible for any damages resulting from a failure
or defect in our products. Notwithstanding the foregoing, if there is
a written agreement (e.g., supply and purchase agreement, quality
assurance agreement) signed by TAIYO YUDEN and your company,
TAIYO YUDEN will warrant our products in accordance with such
agreement.
■ TAIYO YUDEN’s Official Sales Channel
The contents of this catalog are applicable to our products which are
purchased from our sales offices or authorized distributors (hereinafter
“TAIYO YUDEN’
s official sales channel”). Please note that the contents
of this catalog are not applicable to our products purchased from any
seller other than TAIYO YUDEN’
s official sales channel.
■ Caution for Export
Some of our products listed in this catalog may require specific
procedures for export according to“U.S. Export Administration
Regulations”,“Foreign Exchange and Foreign Trade Control Law”
of Japan, and other applicable regulations. Should you have any
questions on this matter, please contact our sales staff.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
2
21
for General Electronic Equipment
METAL WIRE-WOUND CHIP POWER INDUCTORS（MCOILTM
ME SERIES）
TM
METAL WIRE-WOUND CHIP POWER INDUCTORS（MCOIL
ME SERIES）
REFLOW
■PARTS NUMBER
M E
①
K
* Operating Temp.：-40～+125℃（Including self-generated heat）
K
2
0
②
1
③
INDUCTORS
①Series name
Code
ME
6
T
④
1
R 0
⑤
M △ △
⑥ ⑦ ⑧
⑤Nominal inductance
Code
（example）
R47
1R0
4R7
※R＝Decimal point
Series name
Metal Wire-wound Chip Power Inductor
②Dimensions（T）
Code
KK
Dimensions（T）［mm］
1.0
POWER INDUCTORS
③Dimensions（L×W）
Code
2016
2520
⑥Inductance tolerance
Code
M
Dimensions（L×W）［mm］
2.0×1.6
2.5×2.0
④Packaging
Code
T
△＝Blank space
⑦Special code
Code
△
Packaging
Taping
Nominal inductance［μH］
0.47
1.0
4.7
Inductance tolerance
±20％
Special code
Standard
⑧Internal code
■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY
Recommended Land Patterns
Surface Mounting
・Mounting and soldering conditions should be checked beforehand.
T
・Applicable soldering process to these products is reflow soldering only.
Type
A
B
e
C
2016
0.7
0.8
L
W
2520
0.9
1.0
A
Type
MEKK2016
MEKK2520
B
A
C
1.8
2.2
Unit：mm
Standard quantity［pcs］
Taping
L
W
T
e
2.0±0.2
（0.079±0.008）
2.5±0.2
（0.098±0.008）
1.6±0.2
（0.063±0.008）
2.0±0.2
（0.079±0.008）
1.0 max
（0.039 max）
1.0 max
（0.039 max）
0.5±0.3
（0.020±0.012）
0.65±0.3
（0.026±0.012）
3000
3000
Unit：mm（inch）
i_wound_ME_e-E08R01.doc
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
34
21
for General Electronic Equipment
■PARTS NUMBER
●MEKK2016 type
Parts number
MEKK2016TR47M
MEKK2016TR68M
MEKK2016T1R0M
MEKK2016T2R2M
【Thickness：1.0mm max.】
EHS
Nominal inductance
［μH］
Inductance tolerance
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
RoHS
RoHS
RoHS
RoHS
0.47
0.68
1.0
2.2
±20％
±20％
±20％
±20％
-
0.030
0.052
0.060
0.150
●MEKK2520 type
Parts number
EHS
Nominal inductance
［μH］
Inductance tolerance
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.33
0.47
1.0
1.5
2.2
4.7
±20％
±20％
±20％
±20％
±20％
±20％
-
0.022
0.025
0.053
0.069
0.097
0.240
Rated current ※） ［ｍA］（max.）
Measuring
Saturation current Temperature rise current frequency［MHz］
Idc1
Idc2
6,400
5,100
1
5,900
4,800
1
4,300
3,300
1
3,200
2,800
1
3,100
2,400
1
1,600
1,500
1
POWER INDUCTORS
※）
※）
※）
※）
【Thickness：1.0mm max.】
INDUCTORS
MEKK2520TR33M
MEKK2520TR47M
MEKK2520T1R0M
MEKK2520T1R5M
MEKK2520T2R2M
MEKK2520T4R7M
Rated current ※） ［ｍA］（max.）
Measuring
Saturation current Temperature rise current frequency［MHz］
Idc1
Idc2
4,500
4,300
1
3,800
3,300
1
3,600
3,100
1
2,400
1,900
1
The saturation current value (Idc1) is the DC current value having inductance decrease down to 30%. (at 20℃)
The temperature rise current value（Idc2) is the DC current value having temperature increase up to 40℃. (at 20℃)
The rated current is the DC current value that satisfies both of current value saturation current value and temperature rise current value.
Idc2 Measurement board data
Material:FR4
Board dimensions：100×50×1.6t ㎜
Pattern dimensions：45×45 ㎜ (Double side board)
Pattern thickness：70μm
i_wound_ME_e-E08R01.xls
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
21
35
for General Electronic Equipment
METAL WIRE-WOUND CHIP POWER INDUCTORS（MCOILTM
ME-H SERIES）
TM
METAL WIRE-WOUND CHIP POWER INDUCTORS（MCOIL
ME-H SERIES）
REFLOW
■PARTS NUMBER
M E
①
K
* Operating Temp.：-40～+125℃（Including self-generated heat）
K
2
0
②
INDUCTORS
①Series name
Code
ME
6
Ｈ
④
1
R 0
⑤
M △ △
⑥ ⑦ ⑧
Dimensions（T）［mm］
0.8
1.0
POWER INDUCTORS
③Dimensions（L×W）
Code
2012
2016
2520
△＝Blank space
⑤Nominal inductance
Code
（example）
R47
1R0
2R2
※R＝Decimal point
Series name
Metal Wire-wound Chip Power Inductor
②Dimensions（T）
Code
HK
KK
④Packaging
Code
H
1
③
⑥Inductance tolerance
Code
M
Dimensions（L×W）［mm］
2.0×1.2
2.0×1.6
2.5×2.0
⑦Special code
Code
△
Nominal inductance［μH］
0.47
1.0
2.2
Inductance tolerance
±20％
Special code
Standard
⑧Internal code
Packaging
Taping（special specification）
■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY
Recommended Land Patterns
Surface Mounting
・Mounting and soldering conditions should be checked beforehand.
・Applicable soldering process to these products is reflow soldering
T
Type
A
C
2012
0.7
e
L
W
2016
0.7
2520
0.9
B
A
A
Type
MEHK2012H
MEKK2012H
MEKK2016H
MEKK2520H
only.
B
0.8
0.8
1.0
C
1.4
1.8
2.2
Unit：mm
Standard quantity［pcs］
Taping
L
W
T
e
2.0±0.2
（0.079±0.008）
2.0±0.2
（0.079±0.008）
2.0±0.2
（0.079±0.008）
2.5±0.2
（0.098±0.008）
1.2±0.2
（0.047±0.008）
1.2±0.2
（0.047±0.008）
1.6±0.2
（0.063±0.008）
2.0±0.2
（0.079±0.008）
0.8 max
（0.031 max）
1.0 max
（0.039 max）
1.0 max
（0.039 max）
1.0 max
（0.039 max）
0.5±0.3
（0.020±0.012）
0.5±0.3
（0.020±0.012）
0.5±0.3
（0.020±0.012）
0.65±0.3
（0.026±0.012）
3000
3000
3000
3000
Unit：mm（inch）
i_wound_ME-H_e-E08R01.doc
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
36
21
for General Electronic Equipment
■PARTS NUMBER
●MEHK2012H type
Parts number
MEHK2012HR47M
【Thickness：0.8mm max.】
EHS
Nominal inductance
［μH］
Inductance tolerance
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
RoHS
0.47
±20％
-
0.035
●MEKK2012H type
Parts number
MEKK2012HR47M
【Thickness：1.0mm max.】
EHS
Nominal inductance
［μH］
Inductance tolerance
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
RoHS
0.47
±20％
-
0.030
MEKK2016HR47M
MEKK2016H1R0M
MEKK2016H2R2M
【Thickness：1.0mm max.】
EHS
Nominal inductance
［μH］
Inductance tolerance
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
RoHS
RoHS
RoHS
0.47
1.0
2.2
±20％
±20％
±20％
-
0.026
0.048
0.100
MEKK2520H1R0M
※）
※）
※）
※）
Rated current ※） ［ｍA］（max.）
Measuring
Saturation current Temperature rise current frequency［MHz］
Idc1
Idc2
5,300
4,700
1
4,000
3,500
1
2,300
2,300
1
【Thickness：1.0mm max.】
EHS
Nominal inductance
［μH］
Inductance tolerance
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
RoHS
1
±20％
-
0.039
Rated current ※） ［ｍA］（max.）
Measuring
Saturation current Temperature rise current frequency［MHz］
Idc1
Idc2
4,400
3,800
1
The saturation current value (Idc1) is the DC current value having inductance decrease down to 30%. (at 20℃)
The temperature rise current value（Idc2) is the DC current value having temperature increase up to 40℃. (at 20℃)
The rated current is the DC current value that satisfies both of current value saturation current value and temperature rise current value.
Idc2 Measurement board data
Material:FR4
Board dimensions：100×50×1.6t ㎜
Pattern dimensions：45×45 ㎜ (Double side board)
Pattern thickness：70μm
POWER INDUCTORS
●MEKK2520H type
Parts number
Rated current ※） ［ｍA］（max.）
Measuring
Saturation current Temperature rise current frequency［MHz］
Idc1
Idc2
4,500
4,200
1
INDUCTORS
●MEKK2016H type
Parts number
Rated current ※） ［ｍA］（max.）
Measuring
Saturation current Temperature rise current frequency［MHz］
Idc1
Idc2
4,100
3,700
1
i_wound_ME-H_e-E08R01.xls
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
21
37
METAL WIRE-WOUND CHIP POWER INDUCTORS
(MCOILTM ME SERIES／MCOILTM ME-H SERIES)
■PACKAGING
①Minimum Quantity
Standard Quantity [pcs]
Tape ＆ Reel
3000
3000
3000
3000
Type
MEHK2012
MEKK2012
MEKK2016
MEKK2520
②Tape Material
●Embossed Tape
Top tape
Chip Filled
Sprocket hole
Base tape
Chip cavity
Chip
③Taping dimensions
●Embossed tape 8mm wide (0.315 inches wide)
3.5±0.1
(0.138±0.004)
A
B
F
4.0±0.1
(0.157±0.004)
2.0±0.05
(0.079±0.002)
Type
MEHK2012
MEKK2012
MEKK2016
MEKK2520
1.75±0.1
(0.069±0.004）
8.0±0.2
(0.315±0.008)
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
Sprocket hole
Chip cavity
A
B
1.45±0.1
2.25±0.1
（0.057±0.004）
（0.089±0.004）
1.45±0.1
2.25±0.1
（0.057±0.004）
（0.089±0.004）
1.9±0.1
2.45±0.1
（0.075±0.004）
（0.097±0.004）
2.4±0.1
2.9±0.1
（0.094±0.004）
（0.114±0.004）
Insertion pitch
F
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
Tape thickness
T
K
0.25±0.05
1.1±0.1
（0.009±0.002）
（0.043±0.004）
0.25±0.05
1.1±0.1
（0.009±0.002）
（0.043±0.004）
0.25±0.05
1.2±0.1
（0.009±0.002）
（0.047±0.004）
0.25±0.05
1.1±0.1
（0.009±0.002）
（0.043±0.004）
Unit：mm（inch）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_ME_pack_e-E08R01
④Leader and Blank portion
Blank portions
Chip cavity
Blank portions
Leader
Direction of tape feed
160 mm or more
160 mm ～ 200 mm
400 mm ～ 560 mm
⑤Reel size
Type
MEHK2012
MEKK2012
MEKK2016
φD
Reel size (Reference values)
φd
W
180+0/-3
（7.087+0/-0.118）
60+1/-0
（2.36+0.039/0）
10.0±1.5
（0.394±0.059）
MEKK2520
Unit：mm（inch）
⑥Top Tape Strength
The top The top tape requires a peel-off force of 0.1 to 1.0N in the direction of the arrow as illustrated below.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_ME_pack_e-E08R01
METAL WIRE-WOUND CHIP POWER INDUCTORS
(MCOILTM ME SERIES／MCOILTM ME-H SERIES)
■RELIABILITY DATA
1. Operating Temperature Range
Specified Value
Test Methods and
Remarks
ME series
－40～＋125℃
ME-H series
Including self-generated heat
2. Storage Temperature Range
Specified Value
Test Methods and
Remarks
ME series
－40～＋85℃
ME-H series
0 to 40℃ for the product with taping.
3. Rated current
Specified Value
ME series
ME-H series
Within the specified tolerance
4. Inductance
Specified Value
Test Methods and
Remarks
ME series
ME-H series
Measuring equipment
Measuring frequency
Within the specified tolerance
: LCR Meter （HP 4294A or equivalent）
: 1MHz、0.5V
5. DC Resistance
Specified Value
Test Methods and
Remarks
ME series
ME-H series
Measuring equipment
Within the specified tolerance
: DC ohmmeter （HIOKI 3227 or equivalent）
6. Self resonance frequency
Specified Value
ME series
ME-H series
－
7. Temperature characteristic
Specified Value
Test Methods and
Remarks
ME series
ME-H series
Inductance change : Within ±15%
Measurement of inductance shall be taken at temperature range within －40℃～＋125℃.
With reference to inductance value at ＋20℃., change rate shall be calculated.
8. Resistance to flexure of substrate
Specified Value
Test Methods and
Remarks
ME series
ME-H series
No damage
The test samples shall be soldered to the test board by the reflow. As illustrated below, apply force in the direction of the arrow indicating
until deflection of the test board reaches to 2 mm.
Test board size
: 100×40×1.0 mm
Test board material
: Glass epoxy-resin
Solder cream thickness
: 0.12 mm
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_ME_reli_e-E08R01
9. Insulation resistance : between wires
Specified Value
ME series
ME-H series
－
10. Insulation resistance : between wire and over-coating
Specified Value
ME series
ME-H series
－
11. Withstanding voltage : between wire and over-coating
Specified Value
ME series
ME-H series
－
12. Adhesion of terminal electrode
Specified Value
Test Methods and
Remarks
ME series
ME-H series
No abnormality.
The test samples shall be soldered to the test board by the reflow.
Applied force
: 10N to X and Y directions.
Duration
: 5s.
Solder cream thickness
: 0.12mm.
13. Resistance to vibration
Specified Value
ME series
ME-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow.
Then it shall be submitted to below test conditions.
Test Methods and
Remarks
Frequency Range
Total Amplitude
Sweeping Method
10～55Hz
1.5mm (May not exceed acceleration 196m/s2)
10Hz to 55Hz to 10Hz for 1min.
X
Time
Y
For 2 hours on ach X, Y, and Z axis.
Z
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
14. Solderability
Specified Value
Test Methods and
Remarks
ME series
ME-H series
At least 90％ of surface of terminal electrode is covered by new solder.
The test samples shall be dipped in flux, and then immersed in molten solder as shown in below table.
Flux : Methanol solution containing rosin 25%.
Solder Temperature
245±5℃
Time
5±0.5 sec.
※Immersion depth : All sides of mounting terminal shall be immersed.
15. Resistance to soldering heat
Specified Value
Test Methods and
Remarks
ME series
ME-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test sample shall be exposed to reflow oven at 230℃ for 40 seconds, with peak temperature at 260＋0/－5℃ for 5 seconds, 2 times.
Test board material
: Glass epoxy-resin
Test board thickness
: 1.0mm
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_ME_reli_e-E08R01
16. Thermal shock
Specified Value
Test Methods and
Remarks
ME series
ME-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow. The test samples shall be placed at specified temperature for specified
time by step 1 to step 4 as shown in below table in sequence. The temperature cycle shall be repeated 100 cycles.
Conditions of 1 cycle
Step
Temperature (℃)
Duration (min)
1
－40±3
30±3
2
Room temperature
Within 3
3
＋85±2
30±3
4
Room temperature
Within 3
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
17. Damp heat
Specified Value
Test Methods and
Remarks
ME series
ME-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at specified temperature and humidity as shown in below table.
Temperature
60±2℃
Humidity
90～95%RH
Time
500＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
18. Loading under damp heat
Specified Value
Test Methods and
Remarks
ME series
ME-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at specified temperature and humidity and applied the rated current
continuously as shown in below table.
Temperature
60±2℃
Humidity
90～95％RH
Applied current
Rated current
Time
500＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
19. Low temperature life test
Specified Value
Test Methods and
Remarks
ME series
ME-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown
in below table.
Temperature
－40±2℃
Time
500＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
20. High temperature life test
Specified Value
Test Methods and
Remarks
ME series
ME-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown
in below table.
Temperature
125±2℃
Time
500＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
21. Loading at high temperature life test
Specified Value
ME series
ME-H series
－
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_ME_reli_e-E08R01
22. Standard condition
ME series
Specified Value
ME-H series
Standard test condition :
Unless otherwise specified, temperature is 20±15℃ and 65±20％of relative humidity.
When there is any question concerning measurement result: In order to provide correlation
data, the test shall be condition of 20±2℃ of temperature, 65±5% relative humidity.
Inductance is in accordance with our measured value.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_ME_reli_e-E08R01
METAL WIRE-WOUND CHIP POWER INDUCTORS
(MCOILTM ME SERIES／MCOILTM ME-H SERIES)
■PRECAUTIONS
1. Circuit Design
Precautions
◆Operating environment
1. The products described in this specification are intended for use in general electronic equipment,(office supply equipment,
telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical
equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear
control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or
damage. For such uses, contact TAIYO YUDEN Sales Department in advance.
2. PCB Design
Precautions
Technical
considerations
◆Land pattern design
1. Please refer to a recommended land pattern.
◆Land pattern design
Surface Mounting
・ Mounting and soldering conditions should be checked beforehand.
・ Applicable soldering process to this products is reflow soldering only.
3. Considerations for automatic placement
Precautions
Technical
considerations
◆Adjustment of mounting machine
1. Excessive impact load should not be imposed on the products when mounting onto the PC boards.
2. Mounting and soldering conditions should be checked beforehand.
◆Adjustment of mounting machine
1. When installing products, care should be taken not to apply distortion stress as it may deform the products.
4. Soldering
Precautions
◆Reflow soldering
1. Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified.
2. The product shall be used reflow soldering only.
3. Please do not add any stress to a product until it returns in normal temperature after reflow soldering.
◆Lead free soldering
1. When using products with lead free soldering, we request to use them after confirming adhesion, temperature of resistance to soldering
heat, soldering etc sufficiently.
◆Reflow soldering
1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently
degrade the reliability of the products.
Recommended reflow condition (Pb free solder)
5sec max
Technical
considerations
Temperature［℃］
300
Peak：250＋0/－5℃
150～180℃
200
100
100～120sec
30±10sec
230℃ min
0
Heating Time［sec］
5. Cleaning
Precautions
Technical
considerations
◆Cleaning conditions
1. Washing by supersonic waves shall be avoided.
◆Cleaning conditions
1. If washed by supersonic waves, the products might be broken.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_ME_prec_e-E09R01
6. Handling
Precautions
Technical
considerations
◆Handling
1. Keep the product away from all magnets and magnetic objects.
◆Breakaway PC boards (splitting along perforations)
1. When splitting the PC board after mounting product, care should be taken not to give any stresses of deflection or twisting to the board.
2. Board separation should not be done manually, but by using the appropriate devices.
◆Mechanical considerations
1. Please do not give the product any excessive mechanical shocks.
2. Please do not add any shock and power to a product in transportation.
◆Pick-up pressure
1. Please do not push to add any pressure to a winding part. Please do not give any shock and push into a ferrite core exposure part.
◆Packing
1. Please avoid accumulation of a packing box as much as possible.
◆Handling
1. There is a case that a characteristic varies with magnetic influence.
◆Breakaway PC boards (splitting along perforations)
1. The position of the product on PCBs shall be carefully considered to minimize the stress caused from splitting of the PCBs.
◆Mechanical considerations
1. There is a case to be damaged by a mechanical shock.
2. There is a case to be broken by the handling in transportation.
◆Pick-up pressure
1. Damage and a characteristic can vary with an excessive shock or stress.
◆Packing
1. If packing boxes are accumulated, that could cause a deformation on packing tapes or a damage on the products.
7. Storage conditions
Precautions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the
storage area should be controlled.
・ Recommended conditions
Ambient temperature : 0～40℃
Humidity : Below 70% RH
・ The ambient temperature must be kept below 30℃. Even under ideal storage conditions, solderability of products electrodes may
decrease as time passes.
For this reason, product should be used within 6 months from the time of delivery.
In case of storage over 6 months, solderability shall be checked before actual usage.
Technical
considerations
◆Storage
1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes
and deterioration of taping/packaging materials may take place.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_ME_prec_e-E09R01
for General Electronic Equipment
METAL MULTILAYER CHIP POWER INDUCTORS（MCOILTM
MC SERIES）
TM
METAL MULTILAYER CHIP POWER INDUCTORS（MCOIL
MC SERIES）
REFLOW
■PARTS NUMBER
M C
①
K
* Operating Temp.：-40～+125℃(Including self-generated heat)
K
2
0
②
1
③
INDUCTORS
①Series name
Code
MC
2
T
④
1
R 0
⑤
M △ △ △ △
⑥
⑦
⑤Nominal inductance
Code
（example）
R24
R47
1R0
※R＝Decimal point
Series name
Metal base multilayer chip power inductor
POWER INDUCTORS
②Thickness
Code
EK
EE
FK
FE
HK
KK
Thickness［mm］
0.50 max
0.55 max
0.60 max
0.65 max
0.80 max
1.0 max
Type（inch）
1005
1210
1608
2012
2016
1005(0402)
1210(0504)
1608（0603）
2012（0805）
2016(0806)
④Packaging
Code
Ｔ
Nominal inductance［μH］
0.24
0.47
1.0
⑥Inductance tolerance
Code
M
⑦Special code
Code
△△△△
△N△△
HN△△
KN△△
G△△△
JG△B
③Dimensions（L×W）
Code
△＝Blank space
Dimensions
（L×W）［mm］
1.0×0.5
1.25 x 1.05
1.6×0.8
2.0×1.25
2.0×1.6
Inductance tolerance
±20％
Special code
Standard
Polarity Marking
5 surface terminal
Packaging
Taping
■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY
Standard
Ｐolarity Marking
5 surface terminal
W
W
W
W
L
L
L
L
T
T
e
e
T
T
e
e
Standard quantity［pcs］
Paper tape
Embossed tape
Type
L
W
T
e
MCEE1005
(0402)
MCEK1210
(0504)
MCFK1608
(0603)
MCFE1608
（0603）
MCHK1608
（0603）
MCKK1608
（0603）
MCHK2012
（0805）
MCKK2012
（0805）
MCFE2016
(0806)
1.0±0.2
（0.039±0.008）
1.25±0.1
（0.049±0.004）
1.6±0.2
（0.063±0.008）
1.6±0.2
（0.063±0.008）
1.6±0.2
（0.063±0.008）
1.6±0.2
（0.063±0.008）
2.0±0.2
（0.079±0.008）
2.0±0.2
（0.079±0.008）
2.0±0.2
（0.079±0.008）
0.5±0.2
（0.020±0.008）
1.05±0.1
（0.041±0.004）
0.8±0.2
（0.031±0.008）
0.8±0.2
（0.031±0.008）
0.8±0.2
（0.031±0.008）
0.8±0.2
（0.031±0.008）
1.25±0.2
（0.049±0.008）
1.25±0.2
（0.049±0.008）
1.6±0.2
（0.063±0.008）
0.55 max
（0.022 max）
0.50 max
（0.020 max）
0.60 max
（0.024 max）
0.65 max
（0.026 max）
0.80 max
（0.031 max）
1.0 max
（0.039 max）
0.80 max
（0.031 max）
1.0 max
（0.039 max）
0.65 max
（0.026 max）
0.25±0.15
（0.010±0.006）
0.30±0.2
（0.012±0.008）
0.3±0.2
（0.012±0.008）
0.3±0.2
（0.012±0.008）
0.4±0.2
（0.016±0.008）
0.3±0.2
（0.012±0.008）
0.5±0.3
（0.02±0.012）
0.5±0.3
（0.02±0.012）
0.5±0.3
（0.02±0.012）
10000
5000
－
4000
－
4000
－
4000
－
－
3000
4000
－
－
3000
4000
－
Unit：mm（inch）
i_mlci_MC_e-E09R01.doc
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
38
21
for General Electronic Equipment
■PARTS NUMBER
●MC1005
Nominal inductance
［μH］
Inductance tolerance
RoHS
RoHS
RoHS
RoHS
0.10
0.22
0.47
1.0
±20％
±20％
±20％
±20％
EHS
Nominal inductance
［μH］
Inductance tolerance
RoHS
RoHS
RoHS
0.47
1.0
1.5
±20％
±20％
±20％
EHS
Nominal inductance
［μH］
Inductance tolerance
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.24
0.47
1.0
0.24
0.47
1.0
0.24
0.47
0.56
1.0
1.5
2.2
0.24
0.47
1.0
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
Parts number
EHS
Nominal inductance
［μH］
Inductance tolerance
MCHK2012TR24M
MCHK2012TR47M
MCHK2012T1R0M
MCKK2012TR24M
MCKK2012TR47M
MCKK2012T1R0M
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.24
0.47
1.0
0.24
0.47
1.0
±20％
±20％
±20％
±20％
±20％
±20％
Parts number
EHS
Nominal inductance
［μH］
Inductance tolerance
MCFE2016TR47MJG B
MCFE2016TR68MJG B
MCFE2016T1R0MJG B
RoHS
RoHS
RoHS
0.47
0.68
1.0
±20％
±20％
±20％
Parts number
MCEE1005TR10MHN
MCEE1005TR22MHN
MCEE1005TR47MHN
MCEE1005T1R0MHN
EHS
DC Resistance
［mΩ］
（typ.）
41
65
114
244
Rated
current(Idc1)
［A］（max.）
Rated
current(Idc2)
［A］（max.）
Measuring
frequency
［MHz］
Thickness
［mm］（max.）
2.00
1.60
1.20
1.00
2.00
1.60
1.20
0.80
1
1
1
1
0.55
0.55
0.55
0.55
DC Resistance
［mΩ］
（max.）
（typ.）
82
70
179
157
240
200
Rated
current(Idc1)
［A］（max.）
Rated
current(Idc2)
［A］（max.）
Measuring
frequency
［MHz］
Thickness
［mm］（max.）
2.30
1.50
1.20
1.60
1.10
0.90
1
1
1
0.50
0.50
0.50
DC Resistance
［mΩ］
（max.）
（typ.）
50
40
85
69
224
182
100
75
150
114
340
270
24
20
43
38
55
45
110
89
200
160
292
237
38
35
55
44
123
100
Rated
current(Idc1)
［A］（max.）
Rated
current(Idc2)
［A］（max.）
Measuring
frequency
［MHz］
Thickness
［mm］（max.）
2.30
1.90
1.50
2.60
2.00
1.40
4.30
3.30
2.70
2.20
1.70
1.50
2.80
2.40
2.00
2.10
1.60
0.90
1.50
1.20
0.80
3.70
2.70
2.60
1.60
1.30
1.20
2.60
2.00
1.30
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0.60
0.60
0.60
0.65
0.65
0.65
0.80
0.80
0.80
0.80
0.80
0.80
1.00
1.00
1.00
DC Resistance
［mΩ］
（max.）
（typ.）
24
19
36
30
111
90
25
20
39
32
90
73
Rated
current(Idc1)
［A］（max.）
Rated
current(Idc2)
［A］（max.）
Measuring
frequency
［MHz］
Thickness
［mm］（max.）
4.32
3.21
2.26
6.20
4.50
3.60
3.60
3.15
1.47
4.00
3.10
2.10
1
1
1
1
1
1
0.80
0.80
0.80
1.00
1.00
1.00
DC Resistance
［mΩ］
（max.）
（typ.）
45
40
60
50
70
60
Rated
current(Idc1)
［A］（max.）
4.0
3.0
2.8
Rated
current(Idc2)
［A］（max.）
3.20
2.50
2.30
Measuring
frequency
［MHz］
1
1
1
（max.）
50
80
140
300
●MC1210
Parts number
●MC1608
Parts number
POWER INDUCTORS
MCFK1608TR24M
MCFK1608TR47M
MCFK1608T1R0M
MCFE1608TR24MG
MCFE1608TR47MG
MCFE1608T1R0MG
MCHK1608TR24MKN
MCHK1608TR47MKN
MCHK1608TR56MKN
MCHK1608T1R0MKN
MCHK1608T1R5MKN
MCHK1608T2R2MKN
MCKK1608TR24M N
MCKK1608TR47M N
MCKK1608T1R0M N
INDUCTORS
MCEK1210TR47MHN
MCEK1210T1R0MHN
MCEK1210T1R5MHN
●MC2012
●MC2016
Thickness
［mm］（max.）
0.65
0.65
0.65
※Idc1 is the DC value at which the initial L value is decreased within 30% by the application of DC bias. （at 20℃）
※Idc2 is the DC value at which the temperature of element is increased within 40℃ by the application of DC bias. （at 20℃）
i_mlci_MC_e-E09R01.xls
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
21
39
Multilayer chip inductors
Multilayer chip inductors for high frequency, Multilayer chip bead inductors
Multilayer common mode choke coils（MC series F type）
Metal Multilayer Chip Power Inductors (MCOILTM MC series)
■PACKAGING
①Minimum Quantity
●Tape & Reel Packaging
Type
CK 1608 （0603）
CK 2125 （0805）
CKS2125 （0805）
CKP1608 （0603）
CKP2012 （0805）
CKP2016 （0806）
CKP2520 （1008）
LK 1005 （0402）
LK 1608 （0603）
LK 2125 （0805）
HK 0603 （0201）
HK 1005 （0402）
HK 1608 （0603）
HK 2125 （0805）
HKQ0603S （0201）
HKQ0603U （0201）
AQ 105 （0402）
BK 0603 （0201）
BK 1005 （0402）
BKH0603 （0201）
BKH1005 （0402）
BK 1608 （0603）
BK 2125 （0805）
BK 2010 （0804）
BK 3216 （1206）
BKP0603 （0201）
BKP1005 （0402）
BKP1608 （0603）
BKP2125 （0805）
MCF0605 （0202）
MCF0806 （0302）
MCF1210 （0504）
MCF2010 （0804）
MCEE1005 （0402）
MCEK1210 （0504)
MCFK1608 （0603）
MCFE1608 （0603）
MCHK1608 （0603)
MCKK1608 （0603）
MCHK2012 （0806）
MCKK2012 （0805）
MCFE2016 （0806)
Thickness
mm（inch）
0.8 （0.031）
0.85 （0.033）
1.25 （0.049）
0.85 （0.033）
1.25 （0.049）
0.95 max （0.037 max）
1.0 max （0.039 max）
1.0 max （0.039 max）
0.8 max （0.031 max）
1.0 max （0.039 max）
1.2 max （0.047 max）
0.5 （0.020）
0.8 （0.031）
0.85 （0.033）
1.25 （0.049）
0.3 （0.012）
0.5 （0.020）
0.8 （0.031）
0.85 （0.033）
1.0 （0.039）
0.3 （0.012）
0.3 （0.012）
0.5 （0.020）
0.3 （0.012）
0.5 （0.020）
0.3 （0.012）
0.5 （0.020）
0.8 （0.031）
0.85 （0.033）
1.25 （0.049）
0.45 （0.018）
0.8 （0.031）
0.3 （0.012）
0.5 （0.020）
0.8 （0.031）
0.85（0.033）
0.3 （0.012）
0.4 （0.016）
0.55（0.022）
0.45（0.018）
0.55 max （0.022 max）
0.5 max （0.020 max）
0.6 max （0.024 max）
0.65 max （0.026 max）
0.8 max （0.031 max）
1.0 max （0.039 max）
0.8 max （0.031 max）
1.0 max （0.039 max）
0.65 max （0.026 max）
Standard Quantity ［pcs］
Paper Tape
Embossed Tape
4000
－
4000
－
－
2000
4000
－
－
2000
4000
－
－
3000
－
3000
－
3000
－
3000
－
2000
10000
－
4000
－
4000
－
－
2000
15000
－
10000
－
4000
－
－
4000
－
3000
15000
－
15000
－
10000
－
15000
－
10000
－
15000
－
10000
－
4000
－
4000
－
－
2000
4000
－
－
4000
15000
－
10000
－
4000
－
4000
－
15000
－
－
10000
－
5000
－
4000
10000
－
5000
－
4000
－
4000
－
4000
－
3000
4000
－
3000
4000
－
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E09R01
②Taping material
●Card board carrier tape
Top tape
Base tape
Sprocket hole
Bottom tape
CK
CKP
CK
CKS
LK
LK
LK
HK
HK
HK
HKQ
AQ
1608
1608
2125
2125
1005
1608
2125
0603
1005
1608
0603
105
BK
BK
BK
BK
BK
BKP
BKP
BKP
BKP
BKH
BKH
MCF
MC
MC
MC
MC
MC
0603
1005
1608
2125
2010
0603
1005
1608
2125
0603
1005
0605
1005
1210
1608
2012
2016
CK
CKS
CKP
CKP
CKP
LK
HK
2125
2125
2012
2016
2520
2125
2125
BK
BK
MCF
MCF
MCF
MC
MC
2125
3216
0806
1210
2010
1608
2012
Chip cavity
Chip Filled
Chip
●Embossed Tape
Top tape
Sprocket hole
Base tape
Chip cavity
Chip Filled
Chip
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E09R01
③Taping Dimensions
●Paper tape (8mm wide)
Unit：mm（inch）
A
B
T
8.0±0.3
(0.315±0.012)
3.5±0.05
(0.138±0.002)
Sprocket hole
F
1.75±0.1
(0.069±0.004）
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
4.0±0.1
(0.157±0.004)
2.0±0.05
(0.079±0.002)
CK、CKS、CKP、LK、HK、HKQ、AQ、BK、BKP、BKH series
Ａ
Ｂ
Insertion Pitch
Ｆ
Tape Thickness
Ｔ
0.3
（0.012）
0.40
（0.016）
0.70
（0.028）
2.0±0.05
（0.079±0.002）
0.45max
（0.018max）
0.5
（0.020）
0.65
（0.026）
1.15
（0.045）
2.0±0.05
（0.079±0.002）
0.8max
（0.031max）
1.0
（0.039）
1.8
（0.071）
4.0±0.1
（0.157±0.004）
1.1max
（0.043max）
0.95 max
（0.037max）
0.45
（0.018）
1.2
（0.047）
2.17
（0.085）
4.0±0.1
（0.157±0.004）
0.8max
（0.031max）
CK 2125 （0805）
CKS2125 （0805）
LK 2125 （0805）
BK 2125 （0805）
BKP2125 （0805）
0.85
（0.033）
1.5
（0.059）
2.3
（0.091）
4.0±0.1
（0.157±0.004）
1.1max
（0.043max）
AQ 105 （0402）
0.5
（0.020）
0.75
（0.030）
1.15
（0.045）
2.0±0.05
（0.079±0.002）
0.8max
（0.031max）
Unit : mm（inch）
Ｂ
0.77
（0.030）
Insertion Pitch
Ｆ
2.0±0.05
（0.079±0.002）
Tape Thickness
Ｔ
0.45max
（0.018max）
Unit : mm（inch）
Ｂ
1.3
(0.051)
1.55
（0.061）
1.9
（0.075）
1.9
（0.075）
2.0
（0.079）
2.4
（0.094）
2.3
（0.091）
Insertion Pitch
Ｆ
2.0±0.05
（0.079±0.002）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
Tape Thickness
Ｔ
0.64max
(0.025max)
0.64max
(0.025max)
0.72max
(0.028max)
0.72max
(0.028max)
0.9max
(0.035max)
0.9max
（0.035max）
0.72max
(0.028max)
Unit : mm（inch）
Type
HK 0603 （0201）
HKQ0603S （0201）
HKQ0603U （0201）
BK 0603 （0201）
BKH0603 （0201）
BKP0603 （0201）
LK 1005 （0402）
HK 1005 （0402）
BK 1005 （0402）
BKH1005 （0402）
BKP1005 （0402）
CK 1608 （0603）
LK 1608 （0603）
HK 1608 （0603）
BK 1608 （0603）
BKP1608 （0603）
CKP1608 （0603）
BK 2010 （0804）
Thickness
0.8
（0.031）
Chip cavity
MC series F type
Type
MCF0605 （0202）
Thickness
0.3
（0.012）
Chip cavity
Ａ
0.62
（0.024）
MCOILTM MC series
Type
MCEE1005 （0402）
MCEK1210 （0504）
MCFK1608 （0603）
MCFE1608 （0603）
MCHK1608 （0603）
MCHK2012 （0805）
MCFE2016 （0806)
Thickness
0.55 max
（0.021 max）
0.5 max
（0.020 max）
0.6 max
（0.024 max）
0.65 max
（0.026 max）
0.8 max
（0.031 max）
0.8 max
（0.031 max）
0.65 max
（0.026 max）
Chip cavity
Ａ
0.8
(0.031)
1.3
（0.051）
1.1
（0.043）
1.1
（0.043）
1.2
（0.047）
1.65
（0.065）
1.95
(0.077)
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E09R01
●Embossed Tape (8mm wide)
Unit：mm（inch）
A
B
8.0±0.3
(0.315±0.012)
3.5±0.05
(0.138±0.002)
Sprocket hole
F
1.75±0.1
(0.069±0.004）
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
4.0±0.1
(0.157±0.004)
2.0±0.05
(0.079±0.002)
CK、CKS、CKP、LK、HK、BK series
Type
HK 2125 （0805）
CK 2125 （0805）
CKS2125 （0805）
LK 2125 （0805）
BK 2125 （0805）
BK 3216 （1206）
CKP2012 （0805）
CKP2016 （0806）
CKP2520 （1008）
Thickness
0.85
（0.033）
1.0
（0.039）
Chip cavity
Ｂ
Insertion Pitch
Ｆ
2.3
（0.091）
4.0±0.1
（0.157±0.004）
1.9
（0.075）
1.55
（0.061）
1.8
（0.071）
3.5
（0.138）
2.3
（0.091）
2.2
（0.087）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
2.3
（0.091）
2.8
（0.110）
4.0±0.1
（0.157±0.004）
Ｂ
0.95
（0.037）
1.40
（0.055）
2.3
（0.091）
Insertion Pitch
Ｆ
2.0±0.05
（0.079±0.002）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
Tape Thickness
K
T
0.55 max
0.3 max
（0.022 max）
（0.012 max）
0.65 max
0.3 max
（0.026 max）
（0.012 max）
0.85 max
0.3 max
（0.033 max）
（0.012 max）
Unit : mm（inch）
Ｂ
1.95
(0.077)
2.35
（0.093）
Insertion Pitch
Ｆ
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
Tape Thickness
K
T
1.5 max
0.3 max
（0.059 max）
（0.012 max）
1.45 max
0.3 max
（0.057 max）
（0.012 max）
Unit : mm（inch）
Ａ
1.5
（0.059）
1.25
（0.049）
0.8
（0.031）
1.0 max
（0.039 max）
1.0 max
（0.039 max）
0.8 max
（0.031 max）
1.0 max
（0.039 max）
1.2 max
（0.047 max）
Tape Thickness
K
T
1.5max
（0.059 max）
2.0 max
（0.079 max）
0.3max
（0.012 max）
2.0 max
（0.079 max）
1.4 max
0.3 max
（0.055 max）
（0.012 max）
1.3 max
0.3 max
（0.051 max）
（0.012 max）
1.3 max
0.25 max
（0.051 max）
（0.01 max）
1.4 max
（0.055 max）
1.4 max
0.3 max
（0.055 max）
（0.012 max）
1.7 max
（0.067 max）
単位 : mm（inch）
MC series F type
Type
MCF0806 （0302）
MCF1210 （0504）
MCF2010 （0804）
Thickness
0.4
（0.016）
0.55
（0.022）
0.45
（0.018）
Chip cavity
Ａ
0.75
（0.030）
1.15
（0.045）
1.1
（0.043）
MCOILTM MC series
Type
MCKK1608 （0603）
MCKK2012 （0805）
Thickness
1.0 max
（0.039 max）
1.0 max
（0.039 max）
Chip cavity
Ａ
1.1
（0.043）
1.55
（0.061）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E09R01
④LEADER AND BLANK PORTION
Blank portion
Chip cavity
Blank portion
Leader
100mm or more
(3.94inches or more)
160mm or more
(6.3inches or more)
Direction of tape feed
400mm or more
(15.7inches or more)
⑤Reel Size
t
E
C
R
B
D
A
W
A
φ178±2.0
B
φ50 or more
C
φ13.0±0.2
4mm width tape
8mm width tape
t
1.5max.
2.5max.
W
5±1.0
10±1.5
D
φ21.0±0.8
E
2.0±0.5
R
1.0
(Unit : mm)
⑥Top tape strength
The top tape requires a peel-off force of 0.1 to 0.7N (*) in the direction of the arrow as illustrated below.
*) MCOILTM MC series is 0.1 to 1.0N.
Pull direction
0～15°
Top tape
Base tape
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E09R01
Multilayer chip inductors
Multilayer chip inductors for high frequency, Multilayer chip bead inductors
Multilayer common mode choke coils（MC series F type）
Metal Multilayer Chip Power Inductors (MCOILTM MC series)
■RELIABILITY DATA
1. Operating Temperature Range
BK series
BKH series
BKP series
MCF series
CK series
CKS series
Specified Value
CKP series
LK series
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
MCOILTM MC series
2. Storage Temperature Range
BK series
BKH series
BKP series
MCF series
CK series
CKS series
Specified Value
CKP series
LK series
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
MCOILTM MC series
－55～＋125℃
－55～＋125℃(BKP0603: -55～+85℃)
－40～＋85℃
－40～＋85℃
－55～＋125℃
－40～＋85℃
－55～＋125℃
－40～＋125℃（Including self-generated heat）
－55～＋125℃
－55～＋125℃(BKP0603: -55～+85℃)
－40～＋85℃
－40～＋85℃
－55～＋125℃
－40～＋85℃
－55～＋125℃
－40～＋85℃
3. Rated Current
Specified Value
BK series
BKH series
BKP series
MCF series
CK series
CKS series
CKP series
LK series
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
MCOILTM MC series
The temperature of the element is increased within 20℃.
The temperature of the element is increased within 40℃
Refer to each specification.
The temperature of the element is increased within 20℃.
The temperature of the element is increased within 40℃
The decreasing-rate of inductance value is within 5 %
The decreasing-rate of inductance value is within 5 %, or the temperature of the element is
increased within 20℃
Idc1:
Idc2:
The decreasing-rate of inductance value is within 30 %
The temperature of the element is increased within 40℃
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http: //www.ty-top.com/) .
i_mlci_reli_e-E09R01
4. Impedance
Specified Value
Test Methods and
Remarks
BK series
BKH series
Refer to each specification.
BKP series
MCF series
BK0603 series, BKP0603 series
Measuring frequency
: 100±1MHz
Measuring equipment
: 4991A（or its equivalent）
Measuring jig
: 16193A（or its equivalent）, 16197A（or its equivalent）
BK(except 0603) series, BKP(except 0603) series
Measuring frequency
: 100±1MHz
Measuring equipment
: 4291A（or its equivalent）, 4195A（or its equivalent）
Measuring jig
: 16192A（or its equivalent）, HW: 16193A（or its equivalent）
BKH series
Measuring frequency
Measuring equipment
Measuring jig
:
:
:
100±1MHz, 1GHz±1MHz
4991A（or its equivalent）
16193A（or its equivalent）, 16197A（or its equivalent）
MCF series
Measuring frequency
Measuring equipment
:
:
100±1MHz
4291A（or its equivalent）
5. Inductance
Specified Value
CK series
CKS series
CKP series
LK series
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
MCOILTM MC series
CK、CKS、LK series
Measuring frequency
Measuring equipment /jig
Measuring current
CKP、MCOILTM MC series
Measuring frequency
Measuring equipment
Test Methods and
Remarks
Refer to each specification.
:
:
Refer to each specification.
1608,2125⇒4294A＋16092A（or its equivalent）
1005⇒4291A＋16193A（or its equivalent）
: 047～4.7μH ⇒1mArms 、 5.6～33μH ⇒0.1mArms
:
:
HK0603、HK1005、AQ series
Measuring frequency
:
Measuring equipment /jig
:
1MHz
4285A（or its equivalent）
100MHz
HK0603⇒ E4991A+16197A（or its equivalent） , AQ105⇒4291A＋16197A（or its equivalent）
HK1005⇒ 4291A＋16193A（or its equivalent）
HK1608、HK2125 series
Measuring frequency
Measuring equipment /jig
:
:
～100nH⇒100MHz 、120nH～⇒50MHz
4291A＋16092A（or its equivalent）
HKQ series
Measuring frequency
Measuring equipment /jig
:
:
500MHz
E4991A＋16197A（or its equivalent）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http: //www.ty-top.com/) .
i_mlci_reli_e-E09R01
6. Q
Specified Value
Test Methods and
Remarks
LK series
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
LK series
Measuring frequency
:
Measuring equipment /jig :
Measuring current
:
Refer to each specification.
Refer to each specification.
1608,2125⇒4294A＋16092A（or its equivalent）、 1005⇒4291A＋16193A（or its equivalent）
047～4.7μH ⇒1mArms 、 5.6～33μH ⇒0.1mArms
HK0603、HK1005、AQ series
Measuring frequency
:
Measuring equipment /jig
:
100MHz
HK0603⇒E4991A＋16197A（or its equivalent） , AQ105⇒4291A＋16197A（or its equivalent）
HK1005⇒4291A＋16193A（or its equivalent）
HK1608、HK2125 series
Measuring frequency
Measuring equipment /jig
:
:
～100nH⇒100MHz 、120nH～⇒50MHz
4291A＋16092A（or its equivalent）
HKQ series
Measuring frequency
Measuring equipment /jig
:
:
500MHz
E4991A＋16197A（or its equivalent）
7. DC Resistance
Specified Value
BK series
BKH series
BKP series
MCF series
CK series
CKS series
CKP series
LK series
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
MCOILTM MC series
Test Methods and
Remarks
Measuring equipment: IWATSU VOAC7512, HIOKI RM3545 (or its equivalent)
8. Self Resonance Frequency（SRF）
CK series
CKS series
LK series
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
LK、CK series :
Measuring equipment
Test Methods and
Measuring jig
Remarks
HK、HKQ、AQ series :
Measuring equipment
Refer to each specification.
Refer to each specification.
Refer to each specification.
:
:
4195A（or its equivalent）
16092A（or its equivalent）
:
8719C（or its equivalent）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http: //www.ty-top.com/) .
i_mlci_reli_e-E09R01
9. Resistance to Flexure of Substrate
BK series
BKH series
BKP series
MCF series
CK series
CKS series
Specified Value
CKP series
No mechanical damage.
LK series
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
MCOILTM MC series
Warp
: 2mm（BK series、BKP、BKH1005、CK、CKS、CKP、LK、HK、HKQ0603S、HKQ0603U、AQ series、MCF1210、MC
series）
: 1mm（BKH0603、MCF series without 1210 size,）
Testing board
: glass epoxy-resin substrate
Thickness
: 0.8mm
20
Test Methods and
Remarks
R-230
Board
Warp
Deviation±1
45
45
（Unit：mm）
10. Solderability
Specified Value
Test Methods and
Remarks
BK series
BKH series
BKP series
MCF series
CK series
CKS series
CKP series
LK series
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
MCOILTM MC series
Solder temperature
Solder temperature
Duration
11. Resistance to Soldering
BK series
BKH series
BKP series
MCF series
CK series
CKS series
Specified Value
CKP series
LK series
At least 90％ of terminal electrode is covered by new solder.
: 230±5℃ (JIS Z 3282 H60A or H63A)
: 245±3℃ (Sn/3.0Ag/0.5Cu)
: 4±1 sec.
Appearance: No significant abnormality
Impedance change: Within ±30％
Appearance: No significant abnormality
Impedance change: Within ±20％
Appearance: No significant abnormality
Inductance change: R10～4R7⇒Within ±10％、 6R8～100⇒Within ±15％
Appearance: No significant abnormality
Inductance change: Within ±20％
Appearance: No significant abnormality
Inductance change: Within ±30％
Appearance: No significant abnormality
Inductance change: 1005⇒Within ±15％
1608,2125⇒ 47N～4R7: Within ±10％ 5R6～330: Within ±15％
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
Appearance: No significant abnormality
Inductance change: Within ±5％
MCOILTM MC series
Appearance: No significant abnormality
Inductance change: Within ±10％
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http: //www.ty-top.com/) .
i_mlci_reli_e-E09R01
Test Methods and
Remarks
Solder temperature
Duration
Preheating temperature
Preheating time
Flux
Recovery
:
:
:
:
:
:
260±5℃
10±0.5 sec.
150 to 180℃
3 min.
Immersion into methanol solution with colophony for 3 to 5 sec.
2 to 3 hrs of recovery under the standard condition after the test.（See Note 1）
12. Thermal Shock
BK series
BKH series
BKP series
MCF series
CK series
CKS series
Specified Value
CKP series
LK series
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
Appearance: No significant abnormality
Impedance change: Within ±30％
Appearance: No significant abnormality
Impedance change: Within ±20％
Appearance: No significant abnormality
Inductance change: Within ±20％
Appearance: No significant abnormality
Inductance change: Within ±30％
Appearance: No significant abnormality
Inductance change: Within ±10％ Q change:
Within ±30％
Appearance: No significant abnormality
Inductance change: Within ±10％ Q change:
Within ±20％
Appearance: No significant abnormality
Inductance change: Within ±10％
BK、BKP（0603 を除く）、BKH、HK0603、HK1005、HKQ、AQ series
Conditions for 1 cycle
Step
temperature（℃）
time（min.）
1
-55 ＋0/－3
30±3
2
Room temperature
2～3
3
+125 ＋3/－0
30±3
4
Room temperature
2～3
Number of cycles: 5
Recovery: 2 to 3 hrs of recovery under the standard condition after the test.（See Note 1）
MCOILTM MC series
Test Methods and
Remarks
BKP0603 series
Conditions for 1 cycle
Step
temperature（℃）
time（min.）
1
-55 ＋0/－3
30±3
2
Room temperature
2～3
3
+85 ＋3/－0
30±3
4
Room temperature
2～3
Number of cycles: 5
Recovery: 2 to 3 hrs of recovery under the standard condition after the test.（See Note 1）
MCF、CK、CKS、CKP 、LK、HK1608、HK2125、MCOILTM MC＊series
Conditions for 1 cycle
Step
temperature（℃）
time（min.）
1
-40 ＋0/－3
30±3
2
Room temperature
2～3
3
+85 ＋3/－0
30±3
4
Room temperature
2～3
Number of cycles: 5（* MCOILTM MC series: 100)
Recovery: 2 to 3 hrs of recovery under the standard condition after the test.（See Note 1）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http: //www.ty-top.com/) .
i_mlci_reli_e-E09R01
13. Damp Heat（ Steady state）
BK series
BKH series
BKP series
MCF series
CK series
CKS series
CKP series
Specified Value
LK series
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
Appearance: No significant abnormality
Impedance change: Within ±30％
Appearance: No significant abnormality
Impedance change: Within ±20％
Appearance: No significant abnormality
Inductance change: Within ±20％
Appearance: No significant abnormality
Inductance change: Within ±30％
Appearance: No significant abnormality
Inductance change: 1005,1608⇒Within ±10％
Q change: Within ±30％
Appearance: No significant abnormality
Inductance change: Within ±10％ Q change:
2125⇒Within ±20％
Within ±20％
Appearance: No significant abnormality
Inductance change: Within ±10％
BK、BKP、BKH、LK、CK、CKS、CKP、MCF series
Temperature : 40±2℃
Humidity
: 90 to 95％RH
Duration
: 500 +24/-0 hrs
Recovery
: 2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
MCOILTM MC series
Test Methods and
Remarks
HK、HKQ、AQ、MCOILTM MC series
Temperature : 60±2℃
Humidity
: 90 to 95％RH
Duration
: 500 +24/-0 hrs
Recovery
: 2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
14. Loading under Damp Heat
BK series
BKH series
BKP series
CK series
CKS series
CKP series
Specified Value
LK series
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
Appearance: No significant abnormality
Impedance change: Within ±30％
Appearance: No significant abnormality
Inductance change: Within ±20％
Appearance: No significant abnormality
Inductance change: Within ±30％
Appearance: No significant abnormality
Inductance change: 1005⇒Within ±10％
1608⇒0.047～12.0μH: Within ±10％
2125⇒Within ±20％
Q change: Within ±30％
Appearance: No significant abnormality
Inductance change: Within ±10％ Q change:
15.0～33.0μH:
Within ±15％
Within ±20％
Appearance: No significant abnormality
Inductance change: Within ±10％
BK、BKP、BKH、LK、CK、CKS、CKP series
Temperature
: 40±2℃
Humidity
: 90 to 95％RH
Applied current
: Rated current
Duration
: 500 +24/-0 hrs
Recovery
: 2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
MCOILTM MC series
Test Methods and
Remarks
HK、HKQ、AQ、MCOILTM MC* series
Temperature
: 60±2℃
Humidity
: 90 to 95％RH
Applied current
: Rated current (*MCOILTM MC series ; Idc2max)
Duration
: 500 +24/-0 hrs
Recovery
: 2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http: //www.ty-top.com/) .
i_mlci_reli_e-E09R01
15. Loading at High Temperature
BK series
BKH series
BKP series
MCF series
CK series
CKS series
CKP series
Specified Value
LK series
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
Appearance: No significant abnormality
Impedance change: Within ±30％
Appearance: No significant abnormality
Impedance change: Within ±20％
Appearance: No significant abnormality
Inductance change: Within ±20％
Appearance: No significant abnormality
Inductance change: Within ±30％
Appearance: No significant abnormality
Inductance change: 1005⇒Within ±10％
1608⇒0.047～12.0μH: Within ±10％
2125⇒Within ±20％
Q change: Within ±30％
Appearance: No significant abnormality
Inductance change: Within ±10％ Q change:
15.0～33.0μH:
Within ±15％
Within ±20％
Appearance: No significant abnormality
Inductance change: Within ±10％
BK、BKP（except 0603）＊、BKH、HK0603、HK1005＊、HKQ、AQ series
Temperature : 125±2℃
Applied current : Rated current （* BKP series and HK1005 series apply the rated current of 125℃.）
Duration
: 500 +24/-0 hrs
Recovery
: 2 to 3 hrs of recovery under the standard condition after the removal from test chamber. （See Note 1）
MCOILTM MC series※
Test Methods and
Remarks
BKP0603、MCF、CK、CKS、CKP 、LK、HK1608、HK2125、MCOILTM MC＊＊series
Temperature : 85±2℃
Applied current : Rated current（** MCOILTM MC series ; Idc2max）
Duration
: 500 +24/-0 hrs
Recovery
: 2 to 3 hrs of recovery under the standard condition after the removal from test chamber. （See Note 1）
(Note 1) Measurement shall be made after 48±2 hrs of recovery under the standard condition.
"standard condition" referred to herein is defined as follows:
5 to 35℃ of temperature, 45 to 85% relative humidity.
When there are questions concerning measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity, and 86 to
106kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition."
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http: //www.ty-top.com/) .
i_mlci_reli_e-E09R01
Metal Multilayer Chip Power Inductors (MCOILTM MC series)
■PRECAUTIONS
1. Circuit Design
Precautions
◆Verification of operating environment, electrical rating and performance
1. A malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social
ramifications. As such, any inductors to be used in such equipment may require higher safety and/or reliability considerations and
should be clearly differentiated from components used in general purpose applications.
2. When inductors are used in places where dew condensation develops and/or where corrosive gas such as hydrogen sulfide, sulfurous
acid, or chlorine exists in the air, characteristic deterioration may occur. Please do not use inductors under such environmental
conditions.
◆Operating Current（Verification of Rated current）
1. The operating current including inrush current for inductors must always be lower than their rated values.
2. Do not apply current in excess of the rated value because the inductance may be reduced due to the magnetic saturation effect.
◆Temperature rise
Temperature rise of power choke coil depends on the installation condition in end products.
Make sure that temperature rise of power choke coils in actual end products is within the specified temperature range.
2. PCB Design
Precautions
◆Pattern configurations（Design of Land-patterns）
When inductors are mounted on a PCB, the size of land patterns and the amount of solder used（size of fillet）can directly affect inductor
performance. Therefore, the following items must be carefully considered in the design of solder land patterns:
（1） The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or
cracking. Therefore, when designing land-patterns it is necessary to consider the appropriate size and configuration of the solder
pads which in turn determines the amount of solder necessary to form the fillets.
（2） When more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's
soldering point is separated by solder-resist.
◆Pattern configurations（Inductor layout on panelized［ breakaway］ PC boards）
After inductors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufacturing
processes （PCB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered
boards etc.）For this reason, planning pattern configurations and the position of SMD inductors should be carefully performed to minimize
stress.
◆Pattern configurations（Design of Land-patterns）
The following diagrams and tables show some examples of recommended patterns to prevent excessive solder amounts. Examples of
improper pattern designs are also shown.
（1） Recommended land dimensions for a typical chip inductor land patterns for PCBs
（Unit：mm）
B
A
A
1608
1608
Type
1005
1210
2012
2016
(Except MCHK)
(MCHK)
A
0.4
0.45
0.45
0.65
0.5
0.7
C
B
0.5
0.6
1.0
0.6
1.2
0.8
C
0.7
1.15
1.0
1.0
1.45
1.8
（２）Examples of good and bad solder application
Item
Not recommended
Recommended
Lead wire of component
Technical
considerations
Solder-resist
Mixed mounting of SMD and
leaded components
Chassis
Solder (for grounding)
Solder-resist
Component placement close to
the chassis
Electrode pattern
Lead wire of component
Soldering iron
Hand-soldering of leaded
components near mounted
components
Solder-resist
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_MC_prec_e-E09R01
Solder-resist
Horizontal component
placement
◆Pattern configurations（Inductor layout on panelized［ breakaway］ PC boards）
1. The following are examples of good and bad inductor layout; SMD inductors should be located to minimize any possible mechanical
stresses from board warp or deflection.
Item
Not recommended
Recommended
Position the component at a
right angle to the direction of
the mechanical stresses that
are anticipated.
Deflection of the board
2. To layout the inductors for the breakaway PC board, it should be noted that the amount of mechanical stresses given will vary depending
on inductor layout.
An example below should be counted for better design.
E
D
Perforation
C
A
B
Slit
Magnitude of stress
A＞B＝C＞D＞E
3. When breaking PC boards along their perforations, the amount of mechanical stress on the inductors can vary according to the method
used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus,
any ideal SMD inductor layout must also consider the PCB splitting procedure.
3. Considerations for automatic placement
Precautions
◆Adjustment of mounting machine
1. Excessive impact load should not be imposed on the inductors when mounting onto the PC boards.
2. The maintenance and inspection of the mounter should be conducted periodically.
◆Adjustment of mounting machine
1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the inductors, causing damage. To avoid this, the
following points should be considered before lowering the pick-up nozzle:
（1） The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC board after correcting for deflection of the
board.
（2） The pick-up pressure should be adjusted between 1 and 3N static loads.
（3） To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins should be
used under the PC board. The following diagrams show some typical examples of good pick-up nozzle placement:
Item
Improper method
Proper method
Technical
considerations
Single-sided mounting
chipping
or cracking
supporting pins
or back-up pins
Double-sided mounting
chipping
or cracking
supporting pins
or back-up pins
2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the inductors because of mechanical
impact on the inductors. To avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance,
inspection and replacement of the pin should be conducted periodically.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_MC_prec_e-E09R01
4. Soldering
Precautions
◆Reflow soldering
・ Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified.
・ The product shall be used reflow soldering only.
・ Please do not add any stress to a product until it returns in normal temperature after reflow soldering.
◆Lead free soldering
・ When using products with lead free soldering, we request to use them after confirming adhesion, temperature of resistance to soldering
heat, soldering etc sufficiently.
◆The conditions for Reworking with soldering irons
・Put the soldering iron on the land-pattern and don’t touch it to the inductor directly.
Soldering iron's temperature below 350 degC , Duration 3 seconds or less
Temperature［℃］
◆Reflow soldering
・ If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently
degrade the reliability of the products.
Recommended reflow condition (Pb free solder)
5sec max
300
Technical
considerations
150～180
Peak：260+0/-5℃
200
100
40sec max
90±30sec 230℃ min
0
Heating Time［sec］
The allowable number of reflow soldering is 3 times.
5. Cleaning
Precautions
Technical
considerations
◆Cleaning conditions
・ Washing by supersonic waves shall be avoided.
◆Cleaning conditions
・ If washed by supersonic waves, the products might be broken.
6. Resin coating and mold
Precautions
1. With some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or
while left under normal storage conditions resulting in the deterioration of the inductor's performance.
2. Thermal expansion and thermal shrinkage characteristics of resins may lead to the deterioration of inductors’ performance.
3. When a resin hardening temperature is higher than inductor operating temperature, the stresses generated by the excessive heat may
lead to damage in inductors.
4. In prior to use, please make the reliability evaluation with the product mounted in your application set.
7. Handling
Precautions
◆Breakaway PC boards（splitting along perforations）
1. When splitting the PC board after mounting inductors and other components, care is required so as not to give any stresses of deflection
or twisting to the board.
2. Board separation should not be done manually, but by using the appropriate devices.
◆General handling precautions
・Always wear static control bands to protect against ESD.
・ Keep the inductors away from all magnets and magnetic objects.
・ Use non-magnetic tweezers when handling inductors.
・ Any devices used with the inductors（ soldering irons, measuring instruments） should be properly grounded.
・ Keep bare hands and metal products（i.e., metal desk）away from inductor electrodes or conductive areas that lead to chip electrodes.
・ Keep inductors away from items that generate magnetic fields such as speakers or coils.
◆Mechanical considerations
Be careful not to subject the inductors to excessive mechanical shocks.
（1） If inductors are dropped on the floor or a hard surface they should not be used.
（2） When handling the mounted boards, be careful that the mounted components do not come in contact with or bump against other
boards or components.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_MC_prec_e-E09R01
8. Storage conditions
Precautions
◆Storage
To maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control
temperature and humidity in the storage area. Humidity should especially be kept as low as possible.
・Recommended conditions
Ambient temperature: 30℃ or below
Humidity: 70% RH or below
The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of inductor is deteriorated as time
passes, so inductors should be used within 6 months from the time of delivery.
・Inductor should be kept where no chlorine or sulfur exists in the air.
Technical
considerations
◆Storage
If the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of
terminal electrodes and deterioration of taping/packaging materials may take place. For this reason, components should be used within 6
months from the time of delivery. If exceeding the above period, please check solderability before using the inductors.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_MC_prec_e-E09R01
for General Electronic Equipment
METAL CORE SMD POWER INDUCTORS（MCOILTM
MD SERIES）
TM
METAL CORE SMD POWER INDUCTORS（MCOIL
MD SERIES）
REFLOW
■PARTS NUMBER
M D
①
K
K
*Operating Temp.：-40～+125℃（Including self-generated heat）
1
6
②
INDUCTORS
①Series name
Code
MD
6
T
④
1
R 0
⑤
M M △
⑥ ⑦ ⑧
POWER INDUCTORS
Dimensions（H）［mm］
0.95
1.0
1.2
1.4
2.0
⑥Inductance tolerance
Code
M
N
Nominal inductance［μH］
0.47
1.0
4.7
Inductance tolerance
±20％
±30％
⑦Special code
Code
F
M
Dimensions（L×W）［mm］
1.6×1.6
2.0×2.0
3.0×3.0
4.0×4.0
4.9×4.9
④Packaging
Code
T
△＝Blank space
⑤Nominal inductance
Code
（example）
R47
1R0
4R7
※R＝Decimal point
Series name
Metal base coil specification
②Dimensions（H）
Code
JE
KK
MK
PK
WK
③Dimensions（L×W）
Code
1616
2020
3030
4040
5050
1
③
Special code
Ferrite coating
Metal coating
⑧Internal code
Packaging
Taping
■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY
Recommended Land Patterns
B
e
f
W
e
C
L
H
A
Type
MDKK1616
MDJE2020
MDKK2020
MDMK2020
MDKK3030
MDMK3030
MDJE4040
MDMK4040
MDWK4040
MDPK5050
Type
1616
2020
3030
4040
5050
A
0.5
0.65
0.8
1.2
1.5
B
1.10
1.35
2.2
2.8
3.6
C
1.65
2.0
2.7
3.7
4.2
Unit：mm
A
L
W
H
e
f
1.64±0.1
(0.065±0.004)
2.0±0.15
(0.079±0.006)
2.0±0.15
(0.079±0.006)
2.0±0.15
(0.079±0.006)
3.0±0.1
(0.118±0.004)
3.0±0.1
(0.118±0.004)
4.0±0.2
(0.157±0.008)
4.0±0.2
(0.157±0.008)
4.0±0.2
(0.157±0.008)
4.9±0.2
(0.193±0.008)
1.64±0.1
(0.065±0.004)
2.0±0.15
(0.079±0.006)
2.0±0.15
(0.079±0.006)
2.0±0.15
(0.079±0.006)
3.0±0.1
(0.118±0.004)
3.0±0.1
(0.118±0.004)
4.0±0.2
(0.157±0.008)
4.0±0.2
(0.157±0.008)
4.0±0.2
(0.157±0.008)
4.9±0.2
(0.193±0.008)
1.0 max
(0.039 max)
0.95 max
(0.037 max)
1.0 max
(0.039 max)
1.2 max
(0.047 max)
1.0 max
(0.039 max)
1.2 max
(0.047 max)
0.95 max
(0.037 max)
1.2 max
(0.047 max)
2.0 max
(0.079 max)
1.4 max
(0.055 max)
0.40 +0.2/-0.1
(0.016 +0.008/-0.004)
0.50±0.2
(0.02±0.008)
0.50±0.2
(0.02±0.008)
0.50±0.2
(0.02±0.008)
0.90±0.2
(0.035±0.008)
0.90±0.2
(0.035±0.008)
1.1±0.2
(0.043±0.008)
1.1±0.2
(0.043±0.008)
1.1±0.2
(0.043±0.008)
1.20±0.2
(0.047±0.008)
1.0±0.2
(0.039±0.008)
1.25±0.2
(0.049±0.008)
1.25±0.2
(0.049±0.008)
1.25±0.2
(0.049±0.008)
1.9±0.2
(0.075±0.008)
1.9±0.2
(0.075±0.008)
2.5±0.2
(0.098±0.008)
2.5±0.2
(0.098±0.008)
2.5±0.2
(0.098±0.008)
3.3±0.2
(0.130±0.008)
Standard quantity
［pcs］ Taping
2500
2500
2500
2500
2000
2000
1000
1000
700
1000
Unit：mm（inch）
i_smd_MD_e-E08R01.docx
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
40
21
for General Electronic Equipment
■PARTS NUMBER
●MDKK1616 type
Parts number
MDKK1616TR47MM
MDKK1616T1R0MM
MDKK1616T1R5MM
MDKK1616T2R2MM
MDKK1616T3R3MM
MDKK1616T4R7MM
MDKK1616T6R8MM
MDKK1616T100MM
MDKK1616T150MM
【Thickness：1.0mm max.】
EHS
Nominal inductance
［μH］
Inductance tolerance
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.47
1.0
1.5
2.2
3.3
4.7
6.8
10
15
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
Nominal inductance
［μH］
Inductance tolerance
MDJE2020T1R0MM
MDJE2020T2R2MM
MDJE2020T3R3MM
MDJE2020T4R7MM
MDJE2020T6R8MM
MDJE2020T100MM
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
1.0
2.2
3.3
4.7
6.8
10
±20％
±20％
±20％
±20％
±20％
±20％
●MDKK2020 type
MDMK2020TR47MM
MDMK2020TR68MM
MDMK2020T1R0MM
MDMK2020T1R5MM
MDMK2020T2R2MM
MDMK2020T3R3MM
MDMK2020T4R7MM
EHS
Nominal inductance
［μH］
Inductance tolerance
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.47
0.68
1.0
1.5
2.2
3.3
4.7
10
15
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
MDKK3030TR47MM
MDKK3030T1R0MM
MDKK3030T1R5MM
MDKK3030T2R2MM
MDKK3030T3R3MM
MDKK3030T4R7MM
MDKK3030T6R8MM
MDKK3030T100MM
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
MDMK3030TR30MM
MDMK3030TR33MM
MDMK3030TR47MM
MDMK3030T1R0MM
MDMK3030T1R5MM
MDMK3030T2R2MM
MDMK3030T3R3MM
MDMK3030T4R7MM
DC Resistance［Ω］
Max.
0.046
0.060
0.085
0.133
0.165
0.275
0.435
0.690
1.180
Typ.
0.040
0.052
0.074
0.115
0.139
0.240
0.375
0.600
1.020
Rated current ※） ［ｍA］
Measuring
Saturation current: Idc1
Temperature rise current: Idc2
frequency［MHz］
Max.
Typ.
Max.
Typ.
3,500
4,150
2,200
2,500
1
3,200
3,650
2,000
2,100
1
2,900
3,400
1,700
1,900
1
1,900
2,250
1,350
1,500
1
1,650
1,950
1,200
1,350
1
1,300
1,550
940
1,050
1
1,050
1,250
750
850
1
750
900
630
680
1
550
750
480
550
1
Nominal inductance
［μH］
Inductance tolerance
0.47
0.68
1.0
1.5
2.2
3.3
4.7
±20％
±20％
±20％
±20％
±20％
±20％
±20％
DC Resistance［Ω］
Max.
0.046
0.058
0.064
0.086
0.109
0.178
0.242
Typ.
0.040
0.050
0.056
0.075
0.095
0.155
0.210
Rated current ※） ［ｍA］
Measuring
Saturation current: Idc1
Temperature rise current: Idc2 frequency［MHz］
Max.
Typ.
Max.
Typ.
4,200
4,800
2,300
2,450
1
3,500
4,100
2,000
2,200
1
2,550
2,900
1,900
2,050
1
2,000
2,300
1,650
1,750
1
1,750
2,000
1,450
1,550
1
1,350
1,550
1,150
1,200
1
1,150
1,300
950
1,050
1
【Thickness：1.0mm max.】
EHS
Nominal inductance
［μH］
Inductance tolerance
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.47
1.0
1.5
2.2
3.3
4.7
6.8
10
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
●MDMK3030 type
Parts number
Typ.
0.106
0.230
0.290
0.410
0.550
0.910
【Thickness：1.2mm max.】
EHS
●MDKK3030 type
Parts number
Max.
0.121
0.266
0.340
0.475
0.630
1.040
Rated current ※） ［ｍA］
Measuring
Saturation current: Idc1
Temperature rise current: Idc2 frequency［MHz］
Max.
Typ.
Max.
Typ.
3,100
3,800
1,550
1,800
1
1,550
1,900
1,050
1,200
1
1,350
1,600
950
1,100
1
1,200
1,550
850
950
1
800
1,100
750
850
1
700
900
550
600
1
【Thickness：1.0mm max.】
●MDMK2020 type
Parts number
DC Resistance［Ω］
POWER INDUCTORS
EHS
MDKK2020TR47MM
MDKK2020TR68MM
MDKK2020T1R0MM
MDKK2020T1R5MM
MDKK2020T2R2MM
MDKK2020T3R3MM
MDKK2020T4R7MM
MDKK2020T100MM
MDKK2020T150MM
Typ.
0.080
0.120
0.160
0.215
0.450
0.550
0.710
0.970
1.600
【Thickness：0.95mm max.】
Parts number
Parts number
Max.
0.095
0.140
0.185
0.250
0.515
0.640
0.820
1.120
1.800
Rated current ※） ［ｍA］
Measuring
Saturation current: Idc1
Temperature rise current: Idc2 frequency［MHz］
Max.
Typ.
Max.
Typ.
3,300
4,100
1,500
1,780
1
2,200
2,750
1,200
1,490
1
1,750
2,200
1,100
1,330
1
1,500
1,800
950
1,110
1
1,150
1,450
650
730
1
950
1,200
550
630
1
630
880
520
600
1
550
800
450
500
1
460
640
400
440
1
INDUCTORS
●MDJE2020 type
DC Resistance［Ω］
DC Resistance［Ω］
Max.
0.039
0.086
0.100
0.144
0.248
0.345
0.437
0.575
Typ.
0.033
0.074
0.087
0.125
0.215
0.300
0.380
0.500
Rated current ※） ［ｍA］
Measuring
Saturation current: Idc1
Temperature rise current: Idc2 frequency［MHz］
Max.
Typ.
Max.
Typ.
5,400
6,500
3,900
4,500
1
4,400
5,200
2,400
2,800
1
3,000
3,500
2,100
2,400
1
2,500
3,000
1,900
2,200
1
2,000
2,400
1,350
1,500
1
1,700
2,000
1,150
1,300
1
1,400
1,700
1,000
1,150
1
1,100
1,300
850
1,000
1
【Thickness：1.2mm max.】
EHS
Nominal inductance
［μH］
Inductance tolerance
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.30
0.33
0.47
1.0
1.5
2.2
3.3
4.7
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
DC Resistance［Ω］
Max.
0.020
0.020
0.027
0.050
0.074
0.112
0.167
0.263
Typ.
0.017
0.017
0.023
0.043
0.064
0.097
0.145
0.228
Rated current ※） ［ｍA］
Measuring
Saturation current: Idc1
Temperature rise current: Idc2 frequency［MHz］
Max.
Typ.
Max.
Typ.
7,600
9,200
5,500
6,400
1
6,400
8,700
5,500
6,400
1
6,300
7,500
4,700
5,500
1
4,300
5,100
3,300
3,900
1
3,400
4,100
2,500
3,000
1
2,800
3,600
2,100
2,400
1
2,100
2,700
1,650
1,900
1
1,800
2,300
1,350
1,550
1
i_smd_MD_e-E08R01.xls
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
21
41
for General Electronic Equipment
■PARTS NUMBER
●MDJE4040 type
【Thickness：0.95mm max.】
Parts number
EHS
Nominal inductance
［μH］
Inductance tolerance
MDJE4040TR47MM
MDJE4040T1R0MM
MDJE4040T1R5MM
MDJE4040T2R2MM
MDJE4040T3R3MM
MDJE4040T4R7MM
MDJE4040T6R8MM
MDJE4040T100MM
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.47
1.0
1.5
2.2
3.3
4.7
6.8
10
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
INDUCTORS
●MDMK4040F type
Parts number
MDMK4040TR47MF
MDMK4040T1R0MF
MDMK4040T1R2MF
MDMK4040T1R5MF
MDMK4040T2R2MF
POWER INDUCTORS
MDMK4040TR68MM
MDMK4040T1R0MM
MDMK4040T1R5MM
MDMK4040T2R2MM
MDMK4040T3R3MM
MDMK4040T4R7MM
MDMK4040T6R8MM
MDMK4040T100MM
EHS
RoHS
RoHS
RoHS
RoHS
RoHS
MDWK4040TR33NM
MDWK4040TR47NM
MDWK4040TR56NM
MDWK4040TR68MM
MDWK4040T1R0MM
MDWK4040T1R5MM
MDWK4040T2R2MM
MDWK4040T3R3MM
MDWK4040T4R7MM
MDWK4040T6R8MM
MDWK4040T100MM
MDWK4040T220MM
MDWK4040T330MM
MDPK5050T1R0MM
MDPK5050T2R2MM
MDPK5050T3R3MM
MDPK5050T4R7MM
MDPK5050T6R8MM
MDPK5050T100MM
Nominal inductance
［μH］
Inductance tolerance
0.47
1.0
1.2
1.5
2.2
±20％
±20％
±20％
±20％
±20％
EHS
Nominal inductance
［μH］
Inductance tolerance
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.68
1.0
1.5
2.2
3.3
4.7
6.8
10
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
DC Resistance［Ω］
Max.
0.029
0.047
0.047
0.065
0.092
Typ.
0.025
0.041
0.041
0.056
0.080
Rated current ※） ［ｍA］
Measuring
Saturation current: Idc1
Temperature rise current: Idc2
frequency［kHz］
Max.
Typ.
Max.
Typ.
7,500
10,000
4,600
5,400
100
5,200
7,500
3,500
4,200
100
4,200
6,200
3,500
4,200
100
3,700
5,400
3,300
3,600
100
3,200
4,500
2,500
2,900
100
DC Resistance［Ω］
Max.
0.029
0.036
0.065
0.079
0.130
0.160
0.230
0.330
Typ.
0.025
0.031
0.056
0.069
0.113
0.140
0.200
0.280
Rated current ※） ［ｍA］
Measuring
Saturation current: Idc1
Temperature rise current: Idc2 frequency［MHz］
Max.
Typ.
Max.
Typ.
6,700
7,800
5,000
5,700
1
5,000
6,200
4,500
5,100
1
4,500
5,600
3,200
3,600
1
3,800
4,500
2,800
3,200
1
3,200
4,000
2,200
2,500
1
2,500
3,000
1,900
2,200
1
1,900
2,200
1,600
1,800
1
1,700
2,000
1,400
1,600
1
【Thickness：2.0mm max.】
EHS
Nominal inductance
［μH］
Inductance tolerance
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.33
0.47
0.56
0.68
1.0
1.5
2.2
3.3
4.7
6.8
10
22
33
±30％
±30％
±30％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
●MDPK5050 type
Parts number
Typ.
0.035
0.060
0.073
0.100
0.175
0.220
0.320
0.440
【Thickness：1.2mm max.】
●MDWK4040 type
Parts number
Max.
0.040
0.069
0.084
0.115
0.200
0.250
0.370
0.510
Rated current ※） ［ｍA］
Measuring
Saturation current: Idc1
Temperature rise current: Idc2 frequency［MHz］
Max.
Typ.
Max.
Typ.
6,000
7,900
4,000
4,500
1
4,700
5,700
3,000
3,500
1
3,000
4,000
2,700
3,100
1
2,400
3,100
2,400
2,700
1
2,000
2,600
1,800
2,000
1
1,900
2,300
1,600
1,900
1
1,500
1,800
1,300
1,500
1
1,400
1,700
1,100
1,300
1
【Thickness：1.2mm max.】
●MDMK4040 type
Parts number
DC Resistance［Ω］
DC Resistance［Ω］
Max.
0.013
0.013
0.016
0.016
0.027
0.041
0.054
0.075
0.107
0.158
0.194
0.460
0.720
Typ.
0.011
0.011
0.014
0.014
0.023
0.035
0.047
0.066
0.093
0.138
0.169
0.400
0.625
Rated current ※） ［ｍA］
Measuring
Saturation current: Idc1
Temperature rise current: Idc2 frequency［MHz］
Max.
Typ.
Max.
Typ.
16,000
21,000
7,800
8,800
1
10,000
15,000
7,800
8,800
1
9,000
13,000
6,500
7,500
1
8,000
12,000
7,300
8,300
1
7,000
9,400
5,100
5,800
1
7,000
9,400
4,100
4,700
1
5,400
7,500
3,500
4,000
1
3,700
5,200
3,000
3,300
1
3,500
5,000
2,500
2,800
1
2,900
4,000
2,000
2,300
1
2,200
3,100
1,600
1,900
1
1,500
2,100
1,200
1,400
1
1,200
1,700
800
1,000
1
【Thickness：1.4mm max.】
EHS
Nominal inductance
［μH］
Inductance tolerance
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
1.0
2.2
3.3
4.7
6.8
10
±20％
±20％
±20％
±20％
±20％
±20％
DC Resistance［Ω］
Max.
0.040
0.055
0.086
0.102
0.138
0.225
Typ.
0.034
0.047
0.073
0.088
0.12
0.19
Rated current ※） ［ｍA］
Measuring
Saturation current: Idc1
Temperature rise current: Idc2 frequency［MHz］
Max.
Typ.
Max.
Typ.
8,500
10,000
4,300
4,700
1
4,100
5,000
3,600
4,200
1
3,800
4,500
2,900
3,400
1
3,500
4,200
2,500
3,000
1
2,700
3,200
2,200
2,500
1
2,200
2,600
1,700
2,000
1
※） The saturation current value (Idc1) is the DC current value having inductance decrease down to 30%. (at 20℃)
※） The temperature rise current value（Idc2) is the DC current value having temperature increase up to 40℃. (at 20℃)
※） The rated current is the DC current value that satisfies both of current value saturation current value and temperature rise current value.
i_smd_MD_e-E08R01.xls
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
42
21
METAL CORE SMD POWER INDUCTORS (MCOILTM MD SERIES）
■PACKAGING
①Minimum Quantity
Standard Quantity [pcs]
Tape ＆ Reel
2500
Type
MDKK1616
MDJE2020
MDKK2020
MDMK2020
MDKK3030
MDMK3030
MDJE4040
MDMK4040
MDWK4040
MDPK5050
2500
2000
1000
700
1000
②Tape Material
●Embossed Tape
Top tape
Chip Filled
Sprocket hole
Base tape
Chip cavity
Chip
③Taping dimensions
●Embossed tape 8mm wide (0.315 inches wide)
1.75±0.1
(0.069±0.004）
A
B
T
8.0±0.2
(0.315±0.008)
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
3.5±0.1
(0.138±0.004)
Sprocket hole
K
F
Type
MDKK1616
MDJE2020
MDKK2020
MDMK2020
MDKK3030
MDMK3030
4.0±0.1
(0.157±0.004)
2.0±0.05
(0.079±0.002)
Electrode（bottom view）
Chip cavity
A
B
1.79±0.1
1.79±0.1
(0.071±0.004)
(0.071±0.004)
Insertion pitch
F
4.0±0.1
(0.157±0.004)
Tape thickness
T
K
0.25±0.05
1.1±0.1
(0.010±0.002)
(0.043±0.004)
2.2±0.1
（0.102±0.004）
2.2±0.1
（0.102±0.004）
4.0±0.1
（0.157±0.004）
0.25±0.05
（0.009±0.002）
1.3±0.1
（0.051±0.004）
3.2±0.1
(0.126±0.004)
3.2±0.1
(0.126±0.004)
4.0±0.1
(0.157±0.004)
0.3±0.05
(0.012±0.002)
1.4±0.1
(0.055±0.004)
Unit：mm（inch）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_smd_MD_pack_e-E09R01
●Embossed tape 12mm wide (0.47 inches wide)
1.75±0.1
(0.069±0.004）
A
B
T
12.0±0.3
(0.472±0.012)
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
5.5±0.1
(0.217±0.004)
Sprocket hole
K
F
2.0±0.1
(0.079±0.004)
Type
MDJE4040
MDMK4040
MDWK4040
MDPK5050
4.0±0.1
(0.157±0.004)
Electrode（bottom view）
Chip cavity
A
B
4.3±0.1
4.3±0.1
（0.169±0.004）
（0.169±0.004）
4.3±0.1
4.3±0.1
（0.169±0.004）
（0.169±0.004）
Insertion pitch
F
8.0±0.1
（0.315±0.004）
8.0±0.1
（0.315±0.004）
Tape thickness
T
K
0.3±0.05
1.6±0.1
（0.012±0.002）
（0.063±0.004）
0.3±0.05
2.3±0.1
（0.012±0.002）
（0.091±0.004）
5.25±0.1
（0.207±0.004）
8.0±0.1
（0.315±0.004）
0.3±0.1
（0.012±0.004）
5.25±0.1
（0.207±0.004）
1.6±0.1
（0.063±0.004）
Unit：mm（inch）
④Leader and Blank portion
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_smd_MD_pack_e-E09R01
⑤Reel size
Type
MDKK1616
MDJE2020
MDKK2020
MDMK2020
MDKK3030
MDMK3030
MDJE4040
MDMK4040
MDWK4040
MDPK5050
φD
Reel size (Reference values)
φd
W
180±0.5
（7.087±0.019）
60±1.0
（2.36±0.04）
10.0±1.5
（0.394±0.059）
180±3.0
（7.087±0.118）
60±2.0
（2.36±0.08）
14.0±1.5
（0.551±0.059）
Unit：mm（inch）
⑥Top Tape Strength
Top tape strength
Type
MDKK1616
MDJE2020
MDKK2020
MDMK2020
MDKK3030
MDMK3030
MDJE4040
MDMK4040
MDWK4040
MDPK5050
Peel-off strength
0.1N～1.0N
0.1N～1.3N
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_smd_MD_pack_e-E09R01
METAL CORE SMD POWER INDUCTORS (MCOILTM MD SERIES）
■RELIABILITY DATA
1. Operating Temperature Range
Specified Value
MD series
－40～＋125℃
Test Methods and
Remarks
Including self-generated heat
2. Storage Temperature Range
Specified Value
MD series
Test Methods and
Remarks
－40～＋85℃
－5 to 40℃ for the product with taping.
3. Rated current
Specified Value
MD series
Within the specified tolerance
4. Inductance
Specified Value
Test Methods and
Remarks
MD series
Measuring equipment
Measuring condition
Within the specified tolerance
: LCR Meter （HP 4285A or equivalent）
: Please see item list.
5. DC Resistance
Specified Value
MD series
Test Methods and
Remarks
Measuring equipment
Within the specified tolerance
: DC ohmmeter （HIOKI 3227 or equivalent）
6. Self resonance frequency
Specified Value
MD series
－
7. Temperature characteristic
Specified Value
MD series
Test Methods and
Remarks
Measurement of inductance shall be taken at temperature range within －40℃～＋125℃.
With reference to inductance value at ＋20℃., change rate shall be calculated.
Inductance change : Within ±10%
8. Resistance to flexure of substrate
Specified Value
Test Methods and
Remarks
MD series
No damage
The test samples shall be soldered to the test board by the reflow. As illustrated below, apply force in the direction of the arrow indicating
until deflection of the test board reaches to 2 mm.
Test board size
: 100×40×1.0 mm
Test board material
: Glass epoxy-resin
Solder cream thickness
: 0.10 mm
9. Insulation resistance : between wires
Specified Value
MD series
－
10. Insulation resistance : between wire and core
Specified Value
MD series
－
11. Withstanding voltage : between wire and core
Specified Value
MD series
－
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_smd_MD_reli_e-E04R01
12. Adhesion of terminal electrode
Specified Value
MD series
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow.
Applied force
: 10N to X and Y directions.
Duration
: 5s.
Solder cream thickness
Shall not come off PC board
: 0.10mm.
13. Resistance to vibration
Inductance change : Within ±10%
No significant abnormality in appearance.
Specified Value
MD series
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow.
Then it shall be submitted to below test conditions.
Frequency Range
10～55Hz
Total Amplitude
1.5mm (May not exceed acceleration 196m/s2)
Sweeping Method
10Hz to 55Hz to 10Hz for 1min.
X
Time
Y
For 2 hours on each X, Y, and Z axis.
Z
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
14. Solderability
Specified Value
MD series
Test Methods and
Remarks
The test samples shall be dipped in flux, and then immersed in molten solder as shown in below table.
Flux : Methanol solution containing rosin 25%.
Solder Temperature
245±5℃
Time
5±1.0 sec.
※Immersion depth : All sides of mounting terminal shall be immersed.
At least 90％ of surface of terminal electrode is covered by new solder.
15. Resistance to soldering heat
Inductance change : Within ±10%
No significant abnormality in appearance.
Specified Value
MD series
Test Methods and
Remarks
The test sample shall be exposed to reflow oven at 230±5℃ for 40 seconds, with peak temperature at 260±5℃ for 5 seconds, 2 times.
Test board material
: Glass epoxy-resin
Test board thickness
: 1.0mm
16. Thermal shock
Inductance change : Within ±10%
No significant abnormality in appearance.
Specified Value
MD series
Test Methods and
Remarks
The test samples shall be soldered to the test board by the reflow. The test samples shall be placed at specified temperature for specified
time by step 1 to step 4 as shown in below table in sequence. The temperature cycle shall be repeated 100 cycles.
Conditions of 1 cycle
Step
Temperature (℃)
Duration (min)
1
－40±3
30±3
2
Room temperature
Within 3
3
＋85±2
30±3
4
Room temperature
Within 3
17. Damp heat
Specified Value
Test Methods and
Remarks
MD series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at specified temperature and humidity as shown in below table.
Temperature
60±2℃
Humidity
90～95%RH
Time
500＋24/－0 hour
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_smd_MD_reli_e-E04R01
18. Loading under damp heat
Specified Value
Test Methods and
Remarks
MD series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at specified temperature and humidity and applied the rated current
continuously as shown in below table.
Temperature
60±2℃
Humidity
90～95％RH
Applied current
Rated current
Time
500＋24/－0 hour
19. Low temperature life test
Specified Value
Test Methods and
Remarks
MD series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown
in below table.
Temperature
－40±2℃
Time
500＋24/－0 hour
20. High temperature life test
Specified Value
MD series
－
21. Loading at high temperature life test
Specified Value
Test Methods and
Remarks
MD series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at specified temperature and applied the rated current continuously as shown in
below table.
Temperature
85±2℃
Applied current
Rated current
Time
500＋24/－0 hour
22. Standard condition
Specified Value
MD series
Standard test condition :
Unless otherwise specified, temperature is 20±15℃ and 65±20％of relative humidity.
When there is any question concerning measurement result: In order to provide correlation
data, the test shall be condition of 20±2℃ of temperature, 65±5% relative humidity.
Inductance is in accordance with our measured value.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_smd_MD_reli_e-E04R01
METAL CORE SMD POWER INDUCTORS (MCOILTM MD SERIES）
■PRECAUTIONS
1. Circuit Design
Precautions
◆Operating environment
1. The products described in this specification are intended for use in general electronic equipment,(office supply equipment,
telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical
equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear
control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or
damage. For such uses, contact TAIYO YUDEN Sales Department in advance.
2. PCB Design
Precautions
Technical
considerations
◆Land pattern design
1. Please refer to a recommended land pattern.
◆Land pattern design
Surface Mounting
・ Mounting and soldering conditions should be checked beforehand.
・ Applicable soldering process to this products is reflow soldering only.
3. Considerations for automatic placement
Precautions
Technical
considerations
◆Adjustment of mounting machine
1. Excessive impact load should not be imposed on the products when mounting onto the PC boards.
2. Mounting and soldering conditions should be checked beforehand.
◆Adjustment of mounting machine
1. When installing products, care should be taken not to apply distortion stress as it may deform the products.
4. Soldering
Precautions
◆Reflow soldering
1. Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified.
2. The product shall be used reflow soldering only.
3. Please do not add any stress to a product until it returns in normal temperature after reflow soldering.
◆Lead free soldering
1. When using products with lead free soldering, we request to use them after confirming adhesion, temperature of resistance to soldering
heat, soldering etc sufficiently.
◆Recommended conditions for using a soldering iron (NR10050 Type)
・ Put the soldering iron on the land-pattern.
・ Soldering iron's temperature - Below 350℃
・ Duration - 3 seconds or less
・ The soldering iron should not directly touch the inductor.
◆Reflow soldering
1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently
degrade the reliability of the products.
・NR30/40/50/60/80, NRV20/30, NRH24/30, NRS20/40/50/60/80 Type, NR10050 Type, NS101/125 Type
Recommended reflow condition (Pb free solder)
Technical
considerations
5. Cleaning
Precautions
Technical
considerations
◆Cleaning conditions
1. Washing by supersonic waves shall be avoided.
◆Cleaning conditions
1. If washed by supersonic waves, the products might be broken.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_smd_MD_prec_e-E02R01
6. Handling
Precautions
◆Handling
1. Keep the product away from all magnets and magnetic objects.
◆Breakaway PC boards (splitting along perforations)
1. When splitting the PC board after mounting product, care should be taken not to give any stresses of deflection or twisting to the board.
2. Board separation should not be done manually, but by using the appropriate devices.
◆Mechanical considerations
1. Please do not give the product any excessive mechanical shocks.
2. Please do not add any shock and power to a product in transportation.
◆Pick-up pressure
1. Please do not push to add any pressure to a winding part. Please do not give any shock and push into a ferrite core exposure part.
◆Packing
1. Please avoid accumulation of a packing box as much as possible.
◆Board mounting
1. There shall be no pattern or via between terminals at the bottom of product.
2. Components which are located in peripheral of product shall not make contact with surface (top, side) of product.
Technical
considerations
◆Handling
1. There is a case that a characteristic varies with magnetic influence.
◆Breakaway PC boards (splitting along perforations)
1. The position of the product on PCBs shall be carefully considered to minimize the stress caused from splitting of the PCBs.
◆Mechanical considerations
1. There is a case to be damaged by a mechanical shock.
2. There is a case to be broken by the handling in transportation.
◆Pick-up pressure
1. Damage and a characteristic can vary with an excessive shock or stress.
◆Packing
1. If packing boxes are accumulated, that could cause a deformation on packing tapes or a damage on the products.
◆Board mounting
1. If there is pattern or via between terminals at the bottom of product, it may cause characteristics change.
2. If components which are located in peripheral of product make contact with surface (top, side) of product, it may cause damage or
characteristics change.
7. Storage conditions
Precautions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the
storage area should be controlled.
・ Recommended conditions
Ambient temperature : －5～40℃
Humidity : Below 70% RH
・ The ambient temperature must be kept below 30℃. Even under ideal storage conditions, solderability of products electrodes may
decrease as time passes.
For this reason, product should be used within 6 months from the time of delivery.
In case of storage over 6 months, solderability shall be checked before actual usage.
Technical
considerations
◆Storage
1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes
and deterioration of taping/packaging materials may take place.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_smd_MD_prec_e-E02R01
for General Electronic Equipment
METAL CORE WIRE-WOUND CHIP POWER INDUCTORS（MCOILTM
MA SERIES）
TM
METAL CORE WIRE-WOUND CHIP POWER INDUCTORS（MCOIL
MA SERIES）
REFLOW
■PARTS NUMBER
M A
①
K
* Operating Temp.：-40～+105℃（Including self-generated heat）
K
2
0
②
6
T
④
1
R 0
⑤
M △ △
⑥ ⑦ ⑧
⑤Nominal inductance
Code
（example）
R47
1R0
4R7
※R＝Decimal point
Series name
Metal Core Wire-wound Chip Power Inductor
②Dimensions（T）
Code
KK
MK
Dimensions（T）［mm］
1.0
1.2
Type（inch）
2016
2520
2016（0806）
2520（1008）
④Packaging
Code
T
Dimensions
（L×W）［mm］
2.0×1.6
2.5×2.0
⑦Special code
Code
△
Nominal inductance［μH］
0.47
1.0
4.7
Inductance tolerance
±20％
POWER INDUCTORS
⑥Inductance tolerance
Code
M
③Dimensions（L×W）
Code
△＝Blank space
Special code
Standard
⑧Internal code
Packaging
Taping
■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY
Recommended Land Patterns
L
W
Surface Mounting
・Mounting and soldering conditions should be checked beforehand.
・Applicable soldering process to these products is reflow soldering only.
T
Type
A
B
C
2016
0.７
0.8
e
2520
0.8
1.2
A
Type
MAKK2016
MAKK2520
MAMK2520
INDUCTORS
①Series name
Code
MA
1
③
B
A
C
1.8
2.0
Unit：mm
Standard quantity［pcs］
Taping
L
W
T
e
2.0±0.1
（0.079±0.004）
2.5±0.2
（0.098±0.008）
2.5±0.2
（0.098±0.008）
1.6±0.1
（0.063±0.004）
2.0±0.2
（0.079±0.008）
2.0±0.2
（0.079±0.008）
1.0 max
（0.039 max）
1.0 max
（0.039 max）
1.2 max
（0.047 max）
0.5±0.3
（0.020±0.012）
0.5±0.3
（0.020±0.012）
0.5±0.3
（0.020±0.012）
3000
3000
3000
Unit：mm（inch）
i_wound_MA_e-E08R01.doc
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
21
43
for General Electronic Equipment
■PARTS NUMBER
●MAKK2016（0806） type
Parts number
MAKK2016TR24M
MAKK2016TR33M
MAKK2016TR47M
MAKK2016TR68M
MAKK2016T1R0M
MAKK2016T1R5M
MAKK2016T2R2M
MAKK2016T3R3M
MAKK2016T4R7M
EHS
Nominal inductance
［μH］
Inductance tolerance
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.24
0.33
0.47
0.68
1.0
1.5
2.2
3.3
4.7
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
-
0.037
0.040
0.460
0.065
0.075
0.130
0.160
0.255
0.380
INDUCTORS
●MAKK2520（1008） type
Parts number
POWER INDUCTORS
MAKK2520TR33M
MAKK2520TR47M
MAKK2520TR68M
MAKK2520T1R0M
MAKK2520T1R5M
MAKK2520T2R2M
MAKK2520T3R3M
MAKK2520T4R7M
【Thickness：1.0mm max.】
【Thickness：1.0mm max.】
EHS
Nominal inductance
［μH］
Inductance tolerance
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.33
0.47
0.68
1.0
1.5
2.2
3.3
4.7
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
-
0.038
0.046
0.059
0.072
0.125
0.156
0.200
0.300
●MAMK2520（1008） type
Rated current ※） ［ｍA］（max.）
Measuring
Saturation current Temperature rise current frequency［MHz］
Idc1
Idc2
4,200
3,000
2
3,600
3,200
2
3,200
2,800
2
2,500
2,500
2
2,200
2,200
2
1,600
1,650
2
1,500
1,500
2
1,150
1,200
2
1,000
950
2
Rated current ※） ［ｍA］（max.）
Measuring
Saturation current Temperature rise current frequency［MHz］
Idc1
Idc2
4,700
3,500
2
3,900
3,200
2
3,700
2,900
2
2,700
2,500
2
2,300
1,800
2
1,900
1,500
2
1,550
1,300
2
1,300
1,100
2
【Thickness：1.2mm max.】
Parts number
EHS
Nominal inductance
［μH］
Inductance tolerance
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
MAMK2520TR47M
MAMK2520TR68M
MAMK2520T1R0M
MAMK2520T2R2M
MAMK2520T3R3M
MAMK2520T4R7M
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.47
0.68
1.0
2.2
3.3
4.7
±20％
±20％
±20％
±20％
±20％
±20％
-
0.039
0.048
0.059
0.110
0.156
0.260
Rated current ※） ［ｍA］（max.）
Measuring
Saturation current Temperature rise current frequency［MHz］
Idc1
Idc2
4,200
3,400
2
3,200
3,200
2
3,100
2,700
2
2,000
1,900
2
1,800
1,700
2
1,500
1,300
2
※） The saturation current value (Idc1) is the DC current value having inductance decrease down to 30%. (at 20℃)
※） The temperature rise current value（Idc2) is the DC current value having temperature increase by 40℃. (at 20℃)
※） The rated current value is following either Idc1 or Idc2, which is the lower one.
i_wound_MA_e-E08R01.xls
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
44
21
for General Electronic Equipment
METAL CORE WIRE-WOUND CHIP POWER INDUCTORS（MCOILTM
MA-H SERIES）
TM
METAL CORE WIRE-WOUND CHIP POWER INDUCTORS（MCOIL
MA-H SERIES）
REFLOW
* Operating Temp.：-40～+125℃（Including self-generated heat）
* Operating Temp.：-40～+105℃（Including self-generated heat）※1Parts Number reference
■PARTS NUMBER
M A
①
K
K
2
0
②
③
6
H
④
1
R 0
⑤
M △ △
⑥ ⑦ ⑧
⑤Nominal inductance
Code
（example）
R47
1R0
4R7
※R＝Decimal point
Series name
Metal Core Wire-wound Chip Power Inductor
②Dimensions（T）
Code
KK
MK
Dimensions（T）［mm］
1.0
1.2
Type（inch）
2016
2520
2016（0806）
2520（1008）
④Packaging
Code
H
Dimensions
（L×W）［mm］
2.0×1.6
2.5×2.0
⑦Special code
Code
△
Nominal inductance［μH］
0.47
1.0
4.7
POWER INDUCTORS
⑥Inductance tolerance
Code
M
③Dimensions（L×W）
Code
△＝Blank space
Inductance tolerance
±20％
Special code
Standard
⑧Internal code
Packaging or Special specification
Taping（High characteristics）
■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY
Recommended Land Patterns
L
W
Surface Mounting
・Mounting and soldering conditions should be checked beforehand.
・Applicable soldering process to these products is reflow soldering only.
T
Type
A
B
C
2016
0.７
0.8
e
2520
0.8
1.2
A
Type
MAKK2016H
MAKK2520H
MAMK2520H
INDUCTORS
①Series name
Code
MA
1
B
A
C
1.8
2.0
Unit：mm
Standard quantity［pcs］
Taping
L
W
T
e
2.0±0.1
（0.079±0.004）
2.5±0.2
（0.098±0.008）
2.5±0.2
（0.098±0.008）
1.6±0.1
（0.063±0.004）
2.0±0.2
（0.079±0.008）
2.0±0.2
（0.079±0.008）
1.0 max
（0.039 max）
1.0 max
（0.039 max）
1.2 max
（0.047 max）
0.5±0.3
（0.020±0.012）
0.5±0.3
（0.020±0.012）
0.5±0.3
（0.020±0.012）
3000
3000
3000
Unit：mm（inch）
i_wound_MA-H_e-E08R01.doc
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
21
45
for General Electronic Equipment
■PARTS NUMBER
●MAKK2016H（0806） type
Parts number
MAKK2016HR22M
MAKK2016HR24M
MAKK2016HR33M
MAKK2016HR47M
MAKK2016HR68M
MAKK2016H1R0M
MAKK2016H1R5M
【Thickness：1.0mm max.】
EHS
Nominal inductance
［μH］
Inductance tolerance
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.22
0.24
0.33
0.47
0.68
1.0
1.5
±20％
±20％
±20％
±20％
±20％
±20％
±20％
-
0.026
0.026
0.030
0.036
0.050
0.070
0.105
●MAKK2520H（1008） type
【Thickness：1.0mm max.】
INDUCTORS
POWER INDUCTORS
Parts number
EHS
Nominal inductance
［μH］
Inductance tolerance
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
MAKK2520HR22M
MAKK2520HR33M
MAKK2520HR47M
MAKK2520HR68M
MAKK2520H1R0M
MAKK2520H1R5M
MAKK2520H2R2M
MAKK2520H100M ※1
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.22
0.33
0.47
0.68
1.0
1.5
2.2
10
±20％
±20％
±20％
±20％
±20％
±20％
±20％
±20％
-
0.021
0.026
0.029
0.043
0.053
0.078
0.120
0.650
●MAMK2520H（1008） type
Rated current ※） ［ｍA］（max.）
Measuring
Saturation current Temperature rise current frequency［MHz］
Idc1
Idc2
5,800
4,000
2
5,800
4,000
2
4,700
3,500
2
4,300
3,300
2
3,200
2,700
2
2,700
2,300
2
2,100
1,800
2
Rated current ※） ［ｍA］（max.）
Measuring
Saturation current Temperature rise current frequency［MHz］
Idc1
Idc2
7500
4900
2
6200
4300
2
5700
4000
2
4300
3400
2
3800
3000
2
3000
2400
2
2500
1800
2
1100
750
2
【Thickness：1.2mm max.】
Parts number
EHS
Nominal inductance
［μH］
Inductance tolerance
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
MAMK2520HR22M
MAMK2520HR33M
MAMK2520HR47M
MAMK2520HR68M
MAMK2520H1R0M
MAMK2520H1R5M
MAMK2520H2R2M
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.22
0.33
0.47
0.68
1.0
1.5
2.2
±20％
±20％
±20％
±20％
±20％
±20％
±20％
-
0.021
0.023
0.026
0.036
0.045
0.065
0.090
Rated current ※） ［ｍA］（max.）
Measuring
Saturation current Temperature rise current frequency［MHz］
Idc1
Idc2
7500
5000
2
6600
4400
2
5800
4100
2
5100
3500
2
4300
3100
2
3300
2600
2
2800
2200
2
※） The saturation current value (Idc1) is the DC current value having inductance decrease down to 30%. (at 20℃)
※） The temperature rise current value（Idc2) is the DC current value having temperature increase by 40℃. (at 20℃)
※） The rated current value is following either Idc1 or Idc2, which is the lower one.
i_wound_MA-H_e-E08R01.xls
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
46
21
METAL CORE WIRE-WOUND CHIP POWER INDUCTORS
(MCOILTM MA SERIES / MCOILTM MA-Ｈ SERIES)
■PACKAGING
①Minimum Quantity
Standard Quantity [pcs]
Tape ＆ Reel
3000
3000
3000
Type
MAKK2016
MAKK2520
MAMK2520
②Tape Material
●Embossed Tape
Top tape
Chip Filled
Sprocket hole
Base tape
Chip cavity
Chip
③Taping dimensions
●Embossed tape 8mm wide (0.315 inches wide)
3.5±0.1
(0.138±0.004)
A
B
F
1.75±0.1
(0.069±0.004）
8.0±0.2
(0.315±0.008)
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
Sprocket hole
4.0±0.1
(0.157±0.004)
2.0±0.05
(0.079±0.002)
Type
MAKK2016
MAKK2520
MAMK2520
Electrode（bottom view）
Chip cavity
A
B
1.9±0.1
2.3±0.1
（0.075±0.004）
（0.091±0.004）
2.3±0.1
2.8±0.1
(0.091±0.004)
(0.110±0.004)
2.3±0.1
2.8±0.1
(0.091±0.004)
(0.110±0.004)
Insertion pitch
F
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
(0.157±0.004)
Tape thickness
T
K
0.25±0.05
1.2 max
（0.009±0.002）
（0.047 max）
0.3±0.05
1.25 max
(0.012±0.002)
（0.049 max）
0.3±0.05
1.4 max
(0.012±0.002)
(0.055 max)
Unit：mm（inch）
④Leader and Blank portion
Blank portions
Chip cavity
Blank portions
Leader
Direction of tape feed
160 mm or more
160 mm ～ 200 mm
400 mm ～ 560 mm
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MA_pack_e-E05R01
⑤Reel size
Type
MAKK2016
MAKK2520
MAMK2520
φD
Reel size (Reference values)
φd
W
180+0/-3
（7.087+0/-0.118）
60+1/-0
（2.36+0.039/0）
10.0±1.5
（0.394±0.059）
Unit：mm（inch）
⑥Top Tape Strength
The top The top tape requires a peel-off force of 0.1 to 1.2N in the direction of the arrow as illustrated below.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MA_pack_e-E05R01
METAL CORE WIRE-WOUND CHIP POWER INDUCTORS
(MCOILTM MA SERIES / MCOILTM MA-Ｈ SERIES)
■RELIABILITY DATA
1. Operating Temperature Range
Specified Value
Test Methods and
Remarks
MA series
－40～＋105℃
MA-H series
－40～＋125℃
Including self-generated heat
2. Storage Temperature Range
Specified Value
Test Methods and
Remarks
MA series
－40～＋85℃
MA-H series
0 to 40℃ for the product with taping.
3. Rated current
Specified Value
MA series
MA-H series
Within the specified tolerance
4. Inductance
Specified Value
Test Methods and
Remarks
MA series
MA-H series
Measuring equipment
Measuring frequency
Within the specified tolerance
: LCR Meter （HP 4285A or equivalent）
: 2MHz、1V
5. DC Resistance
Specified Value
Test Methods and
Remarks
MA series
MA-H series
Measuring equipment
Within the specified tolerance
: DC ohmmeter （HIOKI 3227 or equivalent）
6. Self resonance frequency
Specified Value
MA series
MA-H series
－
7. Temperature characteristic
Specified Value
Test Methods and
Remarks
MA series
MA-H series
Inductance change : Within ±15%
Measurement of inductance shall be taken at temperature range within －40℃～＋85℃.
With reference to inductance value at ＋20℃., change rate shall be calculated.
8. Resistance to flexure of substrate
Specified Value
Test Methods and
Remarks
MA series
MA-H series
No damage
The test samples shall be soldered to the test board by the reflow. As illustrated below, apply force in the direction of the arrow indicating
until deflection of the test board reaches to 2 mm.
Test board size
: 100×40×1.0 mm
Test board material
: Glass epoxy-resin
Solder cream thickness
: 0.12 mm
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MA_reli_e-E08R01
9. Insulation resistance : between wires
Specified Value
MA series
MA-H series
－
10. Insulation resistance : between wire and core
Specified Value
MA series
MA-H series
－
11. Withstanding voltage : between wire and core
Specified Value
MA series
MA-H series
－
12. Adhesion of terminal electrode
Specified Value
Test Methods and
Remarks
MA series
MA-H series
No abnormality.
The test samples shall be soldered to the test board by the reflow.
Applied force
: 10N to X and Y directions.
Duration
: 5s.
Solder cream thickness
: 0.12mm.
13. Resistance to vibration
Specified Value
Test Methods and
Remarks
MA series
MA-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow.
Then it shall be submitted to below test conditions.
Frequency Range
10～55Hz
Total Amplitude
1.5mm (May not exceed acceleration 196m/s2)
Sweeping Method
10Hz to 55Hz to 10Hz for 1min.
X
Time
Y
For 2 hours on each X, Y, and Z axis.
Z
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
14. Solderability
Specified Value
Test Methods and
Remarks
MA series
MA-H series
At least 90％ of surface of terminal electrode is covered by new solder.
The test samples shall be dipped in flux, and then immersed in molten solder as shown in below table.
Flux : Methanol solution containing rosin 25%.
Solder Temperature
245±5℃
Time
5±0.5 sec.
※Immersion depth : All sides of mounting terminal shall be immersed.
15. Resistance to soldering heat
Specified Value
Test Methods and
Remarks
MA series
MA-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test sample shall be exposed to reflow oven at 230℃ for 40 seconds, with peak temperature at 260＋0/－5℃ for 5 seconds, 3 times.
Test board material
: Glass epoxy-resin
Test board thickness
: 1.0mm
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MA_reli_e-E08R01
16. Thermal shock
Specified Value
Test Methods and
Remarks
MA series
MA-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow. The test samples shall be placed at specified temperature for specified
time by step 1 to step 4 as shown in below table in sequence. The temperature cycle shall be repeated 100 cycles.
Conditions of 1 cycle
Step
Temperature (℃)
Duration (min)
1
－40±3
30±3
2
Room temperature
Within 3
3
＋85±2
30±3
4
Room temperature
Within 3
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
17. Damp heat
Specified Value
Test Methods and
Remarks
MA series
MA-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at specified temperature and humidity as shown in below table.
Temperature
60±2℃
Humidity
90～95%RH
Time
500＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
18. Loading under damp heat
Specified Value
Test Methods and
Remarks
MA series
MA-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at specified temperature and humidity and applied the rated current
continuously as shown in below table.
Temperature
60±2℃
Humidity
90～95％RH
Applied current
Rated current
Time
500＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
19. Low temperature life test
Specified Value
Test Methods and
Remarks
MA series
MA-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown
in below table.
Temperature
－40±2℃
Time
500＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
20. High temperature life test
Specified Value
Test Methods and
Remarks
MA series
MA-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown
in below table.
Temperature
85±2℃
Time
500＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
21. Loading at high temperature life test
Specified Value
MA series
MA-H series
－
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MA_reli_e-E08R01
22. Standard condition
MA series
Specified Value
MA-H series
Standard test condition :
Unless otherwise specified, temperature is 20±15℃ and 65±20％of relative humidity.
When there is any question concerning measurement result: In order to provide correlation
data, the test shall be condition of 20±2℃ of temperature, 65±5% relative humidity.
Inductance is in accordance with our measured value.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MA_reli_e-E08R01
METAL CORE WIRE-WOUND CHIP POWER INDUCTORS
(MCOILTM MA SERIES / MCOILTM MA-Ｈ SERIES)
■PRECAUTIONS
1. Circuit Design
Precautions
◆Operating environment
1. The products described in this specification are intended for use in general electronic equipment,(office supply equipment,
telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical
equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear
control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or
damage. For such uses, contact TAIYO YUDEN Sales Department in advance.
2. PCB Design
Precautions
Technical
considerations
◆Land pattern design
1. Please refer to a recommended land pattern.
◆Land pattern design
Surface Mounting
・ Mounting and soldering conditions should be checked beforehand.
・ Applicable soldering process to this products is reflow soldering only.
3. Considerations for automatic placement
Precautions
Technical
considerations
◆Adjustment of mounting machine
1. Excessive impact load should not be imposed on the products when mounting onto the PC boards.
2. Mounting and soldering conditions should be checked beforehand.
◆Adjustment of mounting machine
1. When installing products, care should be taken not to apply distortion stress as it may deform the products.
4. Soldering
Precautions
◆Reflow soldering
1. Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified.
2. The product shall be used reflow soldering only.
3. Please do not add any stress to a product until it returns in normal temperature after reflow soldering.
◆Lead free soldering
1. When using products with lead free soldering, we request to use them after confirming adhesion, temperature of resistance to soldering
heat, soldering etc sufficiently.
◆Reflow soldering
1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently
degrade the reliability of the products.
Recommended reflow condition (Pb free solder)
Technical
considerations
5. Cleaning
Precautions
Technical
considerations
◆Cleaning conditions
1. Washing by supersonic waves shall be avoided.
◆Cleaning conditions
1. If washed by supersonic waves, the products might be broken.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MA_prec_e-E06R01
6. Handling
Precautions
Technical
considerations
◆Handling
1. Keep the product away from all magnets and magnetic objects.
◆Breakaway PC boards (splitting along perforations)
1. When splitting the PC board after mounting product, care should be taken not to give any stresses of deflection or twisting to the board.
2. Board separation should not be done manually, but by using the appropriate devices.
◆Mechanical considerations
1. Please do not give the product any excessive mechanical shocks.
2. Please do not add any shock and power to a product in transportation.
◆Pick-up pressure
1. Please do not push to add any pressure to a winding part. Please do not give any shock and push into a ferrite core exposure part.
◆Packing
1. Please avoid accumulation of a packing box as much as possible.
◆Handling
1. There is a case that a characteristic varies with magnetic influence.
◆Breakaway PC boards (splitting along perforations)
1. The position of the product on PCBs shall be carefully considered to minimize the stress caused from splitting of the PCBs.
◆Mechanical considerations
1. There is a case to be damaged by a mechanical shock.
2. There is a case to be broken by the handling in transportation.
◆Pick-up pressure
1. Damage and a characteristic can vary with an excessive shock or stress.
◆Packing
1. If packing boxes are accumulated, that could cause a deformation on packing tapes or a damage on the products.
7. Storage conditions
Precautions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the
storage area should be controlled.
・ Recommended conditions
Ambient temperature : 0～40℃
Humidity : Below 70% RH
・ The ambient temperature must be kept below 30℃. Even under ideal storage conditions, solderability of products electrodes may
decrease as time passes.
For this reason, product should be used within 6 months from the time of delivery.
In case of storage over 6 months, solderability shall be checked before actual usage.
Technical
considerations
◆Storage
1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes
and deterioration of taping/packaging materials may take place.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MA_prec_e-E06R01
for General Electronic Equipment
METAL WIRE-WOUND CHIP POWER INDUCTORS（MCOILTM
MB SERIES）
TM
METAL WIRE-WOUND CHIP POWER INDUCTORS（MCOIL
MB SERIES）
REFLOW
■PARTS NUMBER
M B
①
K
* Operating Temp.：-40～+105℃（Including self-generated heat）
K
1
6
②
0
③
T
④
1
R 0
⑤
M △
⑥ ⑦
④Packaging
Code
T
Series name
Metal Wire-Wound chip power inductor
②Dimensions（T）
Code
KK
MK
1608
2012
2520
1608（0603）
2012（0805）
2520（1008）
Dimensions
（L×W）［mm］
1.6×0.8
2.0×1.25
2.5×2.0
⑥Inductance tolerance
Code
M
N
Nominal inductance［μH］
0.24
1.0
4.7
POWER INDUCTORS
③Dimensions（L×W）
Type（inch）
Packaging
Taping
⑤Nominal inductance
Code
（example）
R24
1R0
4R7
※R＝Decimal point
Dimensions（T）［mm］
1.0
1.2
Code
△＝Blank space
INDUCTORS
①Series name
Code
MB
8
Inductance tolerance
±20％
±30％
⑦Internal code
■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY
Recommended Land Patterns
Surface Mounting
L
W
・Mounting and soldering conditions should be checked beforehand.
・Applicable soldering process to these products is reflow soldering
Type
A
T
C
1608
0.55
2012
0.60
e
2520
0.60
B
A
A
Type
MBKK1608
MBKK2012
MBMK2520
only.
B
0.70
1.00
1.50
C
1.00
1.45
2.00
Unit：mm
Standard quantity［pcs］
Paper tape
Embossed tape
L
W
T
e
1.6±0.2
（0.063±0.008）
2.0±0.2
（0.079±0.008）
2.5±0.2
（0.098±0.008）
0.8±0.2
（0.031±0.008）
1.25±0.2
（0.049±0.008）
2.0±0.2
（0.079±0.008）
1.0 max
（0.040 max）
1.0 max
（0.040 max）
1.2 max
（0.047 max）
0.45±0.15
（0.016±0.006）
0.5±0.2
（0.020±0.008）
0.5±0.2
（0.020±0.008）
－
3000
－
3000
－
3000
Unit：mm（inch）
i_wound_MB_e-E08R01.doc
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
21
47
for General Electronic Equipment
■PARTS NUMBER
●MBKK1608（0603） type
Parts number
MBKK1608TR24N
MBKK1608TR47N
MBKK1608TR68N
MBKK1608T1R0M
MBKK1608T1R5M
MBKK1608T2R2M
MBKK1608T3R3M
MBKK1608T4R7M
EHS
Nominal inductance
［μH］
Inductance tolerance
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.24
0.47
0.68
1.0
1.5
2.2
3.3
4.7
±30％
±30％
±30％
±20％
±20％
±20％
±20％
±20％
-
0.049
0.104
0.120
0.150
0.200
0.345
0.512
0.730
INDUCTORS
●MBKK2012（0805） type
Parts number
POWER INDUCTORS
MBKK2012TR24N
MBKK2012TR47N
MBKK2012TR68N
MBKK2012T1R0M
MBKK2012T1R5M
MBKK2012T2R2M
MBKK2012T3R3M
MBKK2012T4R7M
【Thickness：1.0mm max.】
【Thickness：1.0mm max.】
EHS
Nominal inductance
［μH］
Inductance tolerance
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.24
0.47
0.68
1.0
1.5
2.2
3.3
4.7
±30％
±30％
±30％
±20％
±20％
±20％
±20％
±20％
-
0.041
0.078
0.090
0.106
0.173
0.290
0.500
0.615
●MBMK2520（1008） type
Rated current ※） ［ｍA］（max.）
Measuring
Saturation current Temperature rise current frequency［MHz］
Idc1
Idc2
1,650
2,300
1.0
1,100
1,400
1.0
950
1,200
1.0
800
1,150
1.0
650
1,000
1.0
520
750
1.0
450
600
1.0
370
500
1.0
Rated current ※） ［ｍA］（max.）
Measuring
Saturation current Temperature rise current frequency［MHz］
Idc1
Idc2
3,000
2,400
1.0
2,000
1,650
1.0
1,800
1,500
1.0
1,500
1,450
1.0
1,200
1,100
1.0
900
850
1.0
700
650
1.0
600
600
1.0
【Thickness：1.2mm max.】
Parts number
EHS
Nominal inductance
［μH］
Inductance tolerance
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
MBMK2520TR24N
MBMK2520TR47N
MBMK2520TR68N
MBMK2520T1R0M
MBMK2520T1R5M
MBMK2520T2R2M
MBMK2520T3R3M
MBMK2520T4R7M
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.24
0.47
0.68
1.0
1.5
2.2
3.3
4.7
±30％
±30％
±30％
±20％
±20％
±20％
±20％
±20％
-
0.026
0.042
0.058
0.072
0.106
0.159
0.260
0.380
Rated current ※） ［ｍA］（max.）
Measuring
Saturation current Temperature rise current frequency［MHz］
Idc1
Idc2
4,750
3,500
1.0
3,900
2,600
1.0
3,150
2,150
1.0
2,350
1,850
1.0
2,050
1,500
1.0
1,800
1,250
1.0
1,400
970
1.0
1,150
800
1.0
※）The saturation current value (Idc1) is the DC current value having inductance decrease down to 30%. (at 20℃)
※）The temperature rise current value (Idc2) is the DC current value having temperature increase by 40℃. (at 20℃)
※）The rated current value is following either Idc1 or Idc2, which is the lower one.
i_wound_MB_e-E08R01.xls
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
48
21
for General Electronic Equipment
METAL WIRE-WOUND CHIP POWER INDUCTORS（MCOILTM
MB-H SERIES）
TM
METAL WIRE-WOUND CHIP POWER INDUCTORS（MCOIL
MB-H SERIES）
REFLOW
■PARTS NUMBER
M B
①
K
* Operating Temp.：-40～+125℃（Including self-generated heat）
K
1
6
②
0
③
H
④
1
R 0
⑤
M △
⑥ ⑦
△＝Blank space
④Packaging
Code
H
Series name
Metal Wire-Wound chip power inductor
②Dimensions（T）
Code
KK
MK
③Dimensions（L×W）
Type（inch）
1608
2520
1608（0603）
2520（1008）
Dimensions
（L×W）［mm］
1.6×0.8
2.5×2.0
⑥Inductance tolerance
Code
M
N
Nominal inductance［μH］
0.24
1.0
4.7
POWER INDUCTORS
⑤Nominal inductance
Code
（example）
R24
1R0
4R7
※R＝Decimal point
Dimensions（T）［mm］
1.0
1.2
Code
Packaging
Taping（Special specification）
INDUCTORS
①Series name
Code
MB
8
Inductance tolerance
±20％
±30％
⑦Internal code
■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY
Recommended Land Patterns
Surface Mounting
L
W
・Mounting and soldering conditions should be checked beforehand.
・Applicable soldering process to these products is reflow soldering only.
T
Type
A
B
C
1608
0.55
0.70
e
2520
0.60
1.50
A
Type
MBKK1608
MBMK2520
B
A
C
1.00
2.00
Unit：mm
Standard quantity［pcs］
Paper tape
Embossed tape
L
W
T
e
1.6±0.2
（0.063±0.008）
2.5±0.2
（0.098±0.008）
0.8±0.2
（0.031±0.008）
2.0±0.2
（0.079±0.008）
1.0 max
（0.040 max）
1.2 max
（0.047 max）
0.45±0.15
（0.016±0.006）
0.5±0.2
（0.020±0.008）
－
3000
－
3000
Unit：mm（inch）
i_wound_MB-H_e-E08R01.doc
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
21
49
for General Electronic Equipment
■PARTS NUMBER
●MBKK1608H（0603） type
Parts number
MBKK1608HR24N
MBKK1608HR47N
MBKK1608HR68N
MBKK1608H1R0M
MBKK1608H1R5M
MBKK1608H2R2M
MBKK1608H3R3M
MBKK1608H4R7M
【Thickness：1.0mm max.】
EHS
Nominal inductance
［μH］
Inductance tolerance
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.24
0.47
0.68
1.0
1.5
2.2
3.3
4.7
±30％
±30％
±30％
±20％
±20％
±20％
±20％
±20％
-
0.049
0.104
0.120
0.150
0.200
0.345
0.512
0.730
INDUCTORS
●MBMK2520H（1008） type
Rated current ※） ［ｍA］（max.）
Measuring
Saturation current Temperature rise current frequency［MHz］
Idc1
Idc2
1,650
2,300
1.0
1,100
1,400
1.0
950
1,200
1.0
800
1,150
1.0
650
1,000
1.0
520
750
1.0
450
600
1.0
370
500
1.0
【Thickness：1.2mm max.】
POWER INDUCTORS
Parts number
EHS
Nominal inductance
［μH］
Inductance tolerance
Self-resonant
frequency
［MHｚ］（min.）
DC Resistance
［Ω］（max.）
MBMK2520HR24N
MBMK2520HR47N
MBMK2520HR68N
MBMK2520H1R0M
MBMK2520H1R5M
MBMK2520H2R2M
MBMK2520H3R3M
MBMK2520H4R7M
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.24
0.47
0.68
1.0
1.5
2.2
3.3
4.7
±30％
±30％
±30％
±20％
±20％
±20％
±20％
±20％
-
0.026
0.042
0.058
0.072
0.106
0.159
0.260
0.380
Rated current ※） ［ｍA］（max.）
Measuring
Saturation current Temperature rise current frequency［MHz］
Idc1
Idc2
4,750
3,500
1.0
3,900
2,600
1.0
3,150
2,150
1.0
2,350
1,850
1.0
2,050
1,500
1.0
1,800
1,250
1.0
1,400
970
1.0
1,150
800
1.0
※）The saturation current value (Idc1) is the DC current value having inductance decrease down to 30%. (at 20℃)
※）The temperature rise current value (Idc2) is the DC current value having temperature increase by 40℃. (at 20℃)
※）The rated current value is following either Idc1 or Idc2, which is the lower one.
i_wound_MB-H_e-E08R01.xls
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
50
21
METAL WIRE-WOUND CHIP POWER INDUCTORS
(MCOILTM MB SERIES／MCOILTM MB-H SERIES)
■PACKAGING
①Minimum Quantity
Type
MBKK1608／MBKK1608H
MBKK2012
MBMK2520／MBMK2520H
Standard Quantity [pcs]
Tape ＆ Reel
3000
3000
3000
②Tape Material
●Embossed Tape
Top tape
Chip Filled
Sprocket hole
Base tape
Chip cavity
Chip
③Taping dimensions
●Embossed tape 8mm wide (0.315 inches wide)
3.5±0.1
(0.138±0.004)
A
B
F
1.75±0.1
(0.069±0.004）
8.0±0.2
(0.315±0.008)
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
Sprocket hole
4.0±0.1
(0.157±0.004)
2.0±0.05
(0.079±0.002)
Type
MBKK1608／MBKK1608H
MBKK2012
MBMK2520／MBMK2520H
Electrode（bottom view）
Chip cavity
A
1.1
(0.043)
1.45
(0.057)
2.3
(0.091)
B
1.9
(0.075)
2.2
(0.087)
2.8
(0.110)
Insertion pitch
F
4.0±0.1
(0.157±0.004)
4.0±0.1
(0.157±0.004)
4.0±0.1
(0.157±0.004)
Tape thickness
T
K
0.25±0.05
1.2 max
(0.010±0.002)
(0.047 max)
0.25±0.05
1.2 max
(0.010±0.002)
(0.047 max)
0.3±0.05
1.45 max
(0.012±0.002)
(0.057 max)
Unit：mm（inch）
④Leader and Blank portion
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MB_pack_e-E06R01
⑤Reel size
Type
MBKK1608／MBKK1608H
MBKK2012
MBMK2520／MBMK2520H
φD
Reel size (Reference values)
φd
180+0/-3
（7.087+0/-0.118）
60+1/-0
（2.36+0.039/0）
W
10.0±1.5
（0.394±0.059）
Unit：mm（inch）
⑥Top Tape Strength
The top The top tape requires a peel-off force of 0.2 to 0.7N in the direction of the arrow as illustrated below.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MB_pack_e-E06R01
METAL WIRE-WOUND CHIP POWER INDUCTORS
(MCOILTM MB SERIES／MCOILTM MB-H SERIES)
■RELIABILITY DATA
1. Operating Temperature Range
Specified Value
Test Methods and
Remarks
MB series
－40～＋105℃
MB-H series
－40～＋125℃
Including self-generated heat
2. Storage Temperature Range
Specified Value
Test Methods and
Remarks
MB series
－40～＋85℃
MB-H series
0 to 40℃ for the product with taping.
3. Rated current
Specified Value
MB series
MB-H series
Within the specified tolerance
4. Inductance
Specified Value
Test Methods and
Remarks
MB series
MB-H series
Measuring equipment
Measuring frequency
Within the specified tolerance
: LCR Meter （HP 4285A or equivalent）
: 1MHz、1V
5. DC Resistance
Specified Value
Test Methods and
Remarks
MB series
MB-H series
Measuring equipment
Within the specified tolerance
: DC ohmmeter （HIOKI 3227 or equivalent）
6. Self resonance frequency
Specified Value
MB series
MB-H series
－
7. Temperature characteristic
Specified Value
Test Methods and
Remarks
MB series
MB-H series
Inductance change : Within ±15%
MB series :
Measurement of inductance shall be taken at temperature range within －40℃～＋105℃.
With reference to inductance value at ＋20℃., change rate shall be calculated.
MB-H series :
Measurement of inductance shall be taken at temperature range within －40℃～＋125℃.
With reference to inductance value at ＋20℃., change rate shall be calculated.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MB_reli_e-E06R01
8. Resistance to flexure of substrate
Specified Value
Test Methods and
Remarks
MB series
MB-H series
No damage
The test samples shall be soldered to the test board by the reflow. As illustrated below, apply force in the direction of the arrow indicating
until deflection of the test board reaches to 2 mm.
Test board size
: 100×40×1.0 mm (1608：0.8mm)
Test board material
: Glass epoxy-resin
Solder cream thickness
: 0.1 mm
9. Insulation resistance : between wires
Specified Value
MB series
MB-H series
－
10. Insulation resistance : between wire and core
Specified Value
MB series
DC25V 100kΩ min
MB-H series
DC50V 100kΩ min
11. Withstanding voltage : between wire and core
Specified Value
MB series
MB-H series
－
12. Adhesion of terminal electrode
Specified Value
Test Methods and
Remarks
MB series
MB-H series
No abnormality.
The test samples shall be soldered to the test board by the reflow.
Applied force
: 10N (1608：5N) to X and Y directions.
Duration
: 5s.
Solder cream thickness
: 0.1mm.
13. Resistance to vibration
Specified Value
Test Methods and
Remarks
MB series
MB-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow.
Then it shall be submitted to below test conditions.
Frequency Range
10～55Hz
Total Amplitude
1.5mm (May not exceed acceleration 196m/s2)
Sweeping Method
10Hz to 55Hz to 10Hz for 1min.
X
Time
Y
For 2 hours on each X, Y, and Z axis.
Z
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
14. Solderability
Specified Value
Test Methods and
Remarks
MB series
MB-H series
At least 90％ of surface of terminal electrode is covered by new solder.
The test samples shall be dipped in flux, and then immersed in molten solder as shown in below table.
Flux : Methanol solution containing rosin 25%.
Solder Temperature
245±5℃
Immersing speed
25mm/s
Time
5±0.5 sec.
※Immersion depth : All sides of mounting terminal shall be immersed.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MB_reli_e-E06R01
15. Resistance to soldering heat
Specified Value
Test Methods and
Remarks
MB series
MB-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test sample shall be exposed to reflow oven at 230℃ for 40 seconds, with peak temperature at 260＋0/－5℃ for 5 seconds, 3 times.
Test board material
: Glass epoxy-resin
Test board thickness
: 1.0mm
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
16. Thermal shock
Specified Value
Test Methods and
Remarks
MB series
MB-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
MB series:
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed at specified temperature for
specified time by step 1 to step 4 as shown in below table in
sequence. The temperature cycle shall be repeated 100 cycles.
Conditions of 1 cycle
Step
Temperature (℃)
Duration (min)
1
－40±3
30±3
2
Room temperature
Within 3
3
＋85±2
30±3
4
Room temperature
Within 3
Recovery : At least 2hrs of recovery under the standard condition
after the test, followed by the measurement within 48hrs.
MB-H series:
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed at specified temperature for
specified time by step 1 to step 4 as shown in below table in
sequence. The temperature cycle shall be repeated 100 cycles.
Conditions of 1 cycle
Step
Temperature (℃)
Duration (min)
1
－40±3
30±3
2
Room temperature
Within 3
3
＋125±2
30±3
4
Room temperature
Within 3
Recovery : At least 2hrs of recovery under the standard condition
after the test, followed by the measurement within 48hrs.
17. Damp heat
Specified Value
Test Methods and
Remarks
MB series
MB-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
MB series:
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at
specified temperature and humidity as shown in below table.
Temperature
60±2℃
Humidity
90～95%RH
Time
1000＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition
after the test, followed by the measurement within 48hrs.
MB-H series:
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at
specified temperature and humidity as shown in below table.
Temperature
85±2℃
Humidity
85%RH
Time
1000＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition
after the test, followed by the measurement within 48hrs.
18. Loading under damp heat
Specified Value
Test Methods and
Remarks
MB series
MB-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
MB series:
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at
specified temperature and humidity and applied the rated current
continuously as shown in below table.
Temperature
60±2℃
Humidity
90～95％RH
Applied current
Rated current
Time
1000＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition
after the test, followed by the measurement within 48hrs.
MB-H series:
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at
specified temperature and humidity and applied the rated current
continuously as shown in below table.
Temperature
85±2℃
Humidity
85％RH
Applied current
Rated current
Time
1000＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition
after the test, followed by the measurement within 48hrs.
19. Low temperature life test
Specified Value
Test Methods and
Remarks
MB series
MB-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown
in below table.
Temperature
－40±2℃
Time
1000＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MB_reli_e-E06R01
20. High temperature life test
Specified Value
Test Methods and
Remarks
MB series
MB-H series
Inductance change : Within ±10%
No significant abnormality in appearance.
The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown
in below table.
Temperature
85±2℃
Time
1000＋24/－0 hour
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs.
21. Loading at high temperature life test
Specified Value
MB series
MB-H series
－
22. Standard condition
MB series
Specified Value
MB-H series
Standard test condition :
Unless otherwise specified, temperature is 20±15℃ and 65±20％of relative humidity.
When there is any question concerning measurement result: In order to provide correlation
data, the test shall be condition of 20±2℃ of temperature, 65±5% relative humidity.
Inductance is in accordance with our measured value.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MB_reli_e-E06R01
METAL WIRE-WOUND CHIP POWER INDUCTORS
(MCOILTM MB SERIES／MCOILTM MB-H SERIES)
■PRECAUTIONS
1. Circuit Design
Precautions
◆Operating environment
1. The products described in this specification are intended for use in general electronic equipment,(office supply equipment,
telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical
equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear
control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or
damage. For such uses, contact TAIYO YUDEN Sales Department in advance.
2. PCB Design
Precautions
Technical
considerations
◆Land pattern design
1. Please refer to a recommended land pattern.
◆Land pattern design
Surface Mounting
・ Mounting and soldering conditions should be checked beforehand.
・ Applicable soldering process to this products is reflow soldering only.
3. Considerations for automatic placement
Precautions
Technical
considerations
◆Adjustment of mounting machine
1. Excessive impact load should not be imposed on the products when mounting onto the PC boards.
2. Mounting and soldering conditions should be checked beforehand.
◆Adjustment of mounting machine
1. When installing products, care should be taken not to apply distortion stress as it may deform the products.
4. Soldering
Precautions
◆Reflow soldering
1. Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified.
2. The product shall be used reflow soldering only.
3. Please do not add any stress to a product until it returns in normal temperature after reflow soldering.
◆Lead free soldering
1. When using products with lead free soldering, we request to use them after confirming adhesion, temperature of resistance to soldering
heat, soldering etc sufficiently.
Technical
considerations
Temperature［℃］
◆Reflow soldering
1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently
degrade the reliability of the products.
Recommended reflow condition (Pb free solder)
5sec max
300
Peak：260+0/-5℃
150～180
200
100
40sec max
90±30sec 230℃ min
0
Heating Time［sec］
5. Cleaning
Precautions
Technical
considerations
◆Cleaning conditions
1. Washing by supersonic waves shall be avoided.
◆Cleaning conditions
1. If washed by supersonic waves, the products might be broken.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MB_prec_e-E06R01
6. Handling
Precautions
Technical
considerations
◆Handling
1. Keep the product away from all magnets and magnetic objects.
◆Breakaway PC boards (splitting along perforations)
1. When splitting the PC board after mounting product, care should be taken not to give any stresses of deflection or twisting to the board.
2. Board separation should not be done manually, but by using the appropriate devices.
◆Mechanical considerations
1. Please do not give the product any excessive mechanical shocks.
2. Please do not add any shock and power to a product in transportation.
◆Pick-up pressure
1. Please do not push to add any pressure to a winding part. Please do not give any shock and push into a ferrite core exposure part.
◆Packing
1. Please avoid accumulation of a packing box as much as possible.
◆Handling
1. There is a case that a characteristic varies with magnetic influence.
◆Breakaway PC boards (splitting along perforations)
1. The position of the product on PCBs shall be carefully considered to minimize the stress caused from splitting of the PCBs.
◆Mechanical considerations
1. There is a case to be damaged by a mechanical shock.
2. There is a case to be broken by the handling in transportation.
◆Pick-up pressure
1. Damage and a characteristic can vary with an excessive shock or stress.
◆Packing
1. If packing boxes are accumulated, that could cause a deformation on packing tapes or a damage on the products.
7. Storage conditions
Precautions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the
storage area should be controlled.
・ Recommended conditions
Ambient temperature : 0～40℃
Humidity : Below 70% RH
・ The ambient temperature must be kept below 30℃. Even under ideal storage conditions, solderability of products electrodes may
decrease as time passes.
For this reason, product should be used within 6 months from the time of delivery.
In case of storage over 6 months, solderability shall be checked before actual usage.
Technical
considerations
◆Storage
1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes
and deterioration of taping/packaging materials may take place.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_MB_prec_e-E06R01
