QVS107CG4R7CCHT

Notice for TAIYO YUDEN Products [ For High Quality and/or Reliability Equipment (Automotive Electronic Equipment / Industrial Equipment) ] Please read this notice before using the TAIYO YUDEN products. REMINDERS ■ Product information in this catalog is as of October 2018. All of the contents specified herein are subject to change without notice due to technical improvements, etc. Therefore, please check for the latest information carefully before practical application or use of our products. Please note that TAIYO YUDEN shall not be in any way responsible for any damages and defects in products or equipment incorporating our products, which are caused under the conditions other than those specified in this catalog or individual product specification sheets. ■ Please contact TAIYO YUDEN for further details of product specifications as the individual product specification sheets are available. ■ Please conduct validation and verification of our products in actual condition of mounting and operating environment before using our products. ■ The products listed in this catalog are intended for use in general electronic equipment (e.g., AV equipment, OA equipment, home electric appliances, office equipment, information and communication equipment), medical equipment classified as Class I or II by IMDRF, industrial equipment, and automotive interior applications, etc. Please be sure to contact TAIYO YUDEN for further information before using the products for any equipment which may directly cause loss of human life or bodily injury (e.g., transportation equipment including, without limitation, automotive powertrain control system, train control system, and ship control system, traffic signal equipment, medical equipment classified as Class III by IMDRF). Please do not incorporate our products into any equipment requiring high levels of safety and/or reliability (e.g., aerospace equipment, aviation equipment*, medical equipment classified as Class IV by IMDRF, nuclear control equipment, undersea equipment, military equipment). *Note: There is a possibility that our products can be used only for aviation equipment that does not directly affect the safe operation of aircraft (e.g., in-flight entertainment, cabin light, electric seat, cooking equipment) if such use meets requirements specified separately by TAIYO YUDEN. Please be sure to contact TAIYO YUDEN for further information before using our products for such aviation equipment. When our products are used even for high safety and/or reliability-required devices or circuits of general electronic equipment, it is strongly recommended to perform a thorough safety evaluation prior to use of our products and to install a protection circuit as necessary. Please note that unless you obtain prior written consent of TAIYO YUDEN, TAIYO YUDEN shall not be in any way responsible for any damages incurred by you or third parties arising from use of the products listed in this catalog for any equipment requiring inquiry to TAIYO YUDEN or prohibited for use by TAIYO YUDEN as described above. ■ Information contained in this catalog is intended to convey examples of typical performances and/or applications of our products and is not intended to make any warranty with respect to the intellectual property rights or any other related rights of TAIYO YUDEN or any third parties nor grant any license under such rights. ■ Please note that the scope of warranty for our products is limited to the delivered our products themselves and TAIYO YUDEN shall not be in any way responsible for any damages resulting from a fault or defect in our products. Notwithstanding the foregoing, if there is a written agreement (e.g., supply and purchase agreement, quality assurance agreement) signed by TAIYO YUDEN and your company, TAIYO YUDEN will warrant our products in accordance with such agreement. ■ The contents of this catalog are applicable to our products which are purchased from our sales offices or authorized distributors (hereinafter“TAIYO YUDEN’ s official sales channel”). Please note that the contents of this catalog are not applicable to our products purchased from any seller other than TAIYO YUDEN’ s official sales channel. ■ Caution for Export Some of our products listed in this catalog may require specific procedures for export according to“U.S. Export Administration Regulations” ,“Foreign Exchange and Foreign Trade Control Law”of Japan, and other applicable regulations. Should you have any questions on this matter, please contact our sales staff. 19 Automotive Application Guide We classify automotive electronic equipment into the following four application categories and set usable application categories for each of our products. When using our products for automotive electronic equipment, please be sure to check such application categories and use our products accordingly. Should you have any questions on this matter, please contact us. Category SAFETY ・ABS (Anti-Lock Brake System) ・ESC (Electronic Stability Control) ・Airbag ・ADAS (Equipment that directly controls running, turning and stopping), etc. BODY & CHASSIS ・Wiper ・Automatic Door ・Power Window ・Keyless Entry System ・Electric Door Mirror ・Interior Lighting ・LED Headlight ・TPMS (Tire Pressure Monitoring System) ・Anti-Theft Device (Immobilizer), etc. INFOTAINMENT ・Car Infotainment System ・ITS/Telematics System ・Instrument Cluster ・ADAS (Sensor, Equipment that is not interlocked with safety equipment or powertrain), etc. Automotive Application Guide POWERTRAIN Automotive Electronic Equipment (Typical Example) ・Engine ECU (Electronically Controlled Fuel Injector) ・Cruise Control Unit ・4WS (4 Wheel Steering) ・Automatic Transmission ・Power Steering ・HEV/PHV/EV Core Control (Battery, Inverter, DC-DC) ・Automotive Locator (Car location information providing device), etc. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 19 15 MULTILAYER CERAMIC CAPACITORS MULTILAYER CERAMIC CAPACITORS REFLOW REFLOW AEC-Q200 AECQ200 ■PART NUMBER J M K ① ② ③ 3 1 6 ④ CERAMIC CAPACITORS ①Rated voltage Code A J L E T G U H Q S ②Series name Code M V W △ ⑤ B J 1 ⑥ 0 6 ⑦ M L H T △ ⑧ ⑨ ⑩ ⑪ ⑫ ③End termination Code End termination K Plated J Soft Termination S Cu Internal Electrodes (For High Frequency) F High Reliability Application Rated voltage［VDC］ 4 6.3 10 16 25 35 50 100 250 630 ④Dimension（L×W） Dimensions （L×W）［mm］ 063 0.6 × 0.3 1.0 × 0.5 105 0.52× 1.0 ※ 1.6 × 0.8 107 0.8 × 1.6 ※ 2.0 × 1.25 212 1.25× 2.0 ※ 316 3.2 × 1.6 325 3.2 × 2.5 432 4.5 × 3.2 Note : ※LW reverse type（□WK） only Type Series name Multilayer ceramic capacitor Multilayer ceramic capacitor for high frequency LW reverse type multilayer capacitor ⑤Dimension tolerance Code Type △ ALL 063 105 107 A 212 L［mm］ Standard W［mm］ Standard 0.6±0.05 1.0±0.10 1.6＋0.15/－0.05 0.3±0.05 0.5±0.10 0.8＋0.15/－0.05 2.0＋0.15/－0.05 1.25＋0.15/－0.05 316 325 105 107 3.2±0.20 3.2±0.30 1.0＋0.15/－0.05 1.6＋0.20/－0 1.6±0.20 2.5±0.30 0.5＋0.15/－0.05 0.8＋0.20/－0 212 2.0＋0.20/－0 1.25＋0.20/－0 C 316 105 107 212 212 3.2±0.30 1.0＋0.20/－0 1.6＋0.25/－0 2.0＋0.25/－0 2.0±0.15 1.6±0.30 0.5＋0.20/－0 0.8＋0.25/－0 1.25＋0.25/－0 1.25±0.15 K 316 3.2±0.20 1.6±0.20 B 325 EIA（inch） 0201 0402 0204 0603 0306 0805 0508 1206 1210 1812 T［mm］ Standard 0.3±0.05 0.5±0.10 0.8＋0.15/－0.05 0.85±0.10 1.25＋0.15/－0.05 1.6±0.20 2.5±0.30 0.5＋0.15/－0.05 0.8＋0.20/－0 0.85±0.10 1.25＋0.20/－0 1.6±0.30 0.5＋0.20/－0 0.8＋0.25/－0 1.25＋0.25/－0 0.85±0.15 1.15±0.20 1.6±0.20 2.5±0.30 3.2±0.50 2.5±0.30 Note: ｃｆ. STANDARD EXTERNAL DIMENSIONS ⑥Temperature characteristics code ■High dielectric type Applicable Temperature Code standard range［℃］ △＝Blank space △= Blank space Ref. Temp.［℃］ Capacitance change BJ EIA X5R －55～＋ 85 25 ±15％ C6 EIA X6S －55～＋105 25 ±22％ B7 EIA X7R －55～＋125 25 ±15％ C7 EIA X7S －55～＋125 25 ±22％ D7 EIA X7T －55～＋125 25 ＋22％/－33％ Capacitance tolerance ±10％ ±20％ ±10％ ±20％ ±10％ ±20％ ±10％ ±20％ ±10％ ±20％ Tolerance code K M K M K M K M K M hq_c_mlcc_e-E07R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 18 19 ■Temperature compensating type Applicable Code standard JIS Temperature range［℃］ CG CG Ref. Temp.［℃］ 20 －55～＋125 EIA ⑧Capacitance tolerance Code A B C D G J K M C0G 0±30ppm/℃ 25 Nominal capacitance 0.5pF 1pF 10pF 100pF 1,000pF 0.01μF 0.1μF 1.0μF 10μF 100μF Capacitance tolerance ±0.05pF ±0.1pF ±0.25pF ±0.5pF ±2％ ±5％ ±10％ ±20％ ⑨Thickness Code P T V C A D F G L N M Capacitance tolerance ±0.1pF ±0.25pF ±0.5pF ±1pF ±2％ ±5％ Tolerance code B C D F G J Thickness［mm］ 0.3 0.5 0.7(107type or more) 0.8 0.85(212type or more) 1.15 1.25 1.6 1.9 2.5 ⑩Special code Code H ⑪Packaging Code F R T CERAMIC CAPACITORS ⑦Nominal capacitance Code （example） 0R5 010 100 101 102 103 104 105 106 107 Note : R＝Decimal point Capacitance change Special code MLCC for Industrial and Automotive Packaging φ178mm Taping （2mm pitch） φ178mm Embossed Taping （4mm pitch） φ178mm Taping （4mm pitch） φ178mm Taping （4mm pitch, 1000 pcs/reel） 325 type（Thickness code M） P ⑫Internal code Code △ Internal code Standard hq_c_mlcc_e-E07R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 19 19 ■STANDARD EXTERNAL DIMENSIONS W Type( EIA ) L T □MK063（0201） □MK105（0402） □MF105（0402） e □WK105（0204）※ □MK107（0603） □MF107（0603） L □MJ107（0603） W □VS107（0603） CERAMIC CAPACITORS □WK107（0306）※ L 0.6±0.03 (0.024±0.001) 1.0±0.05 (0.039±0.002) 0.52±0.05 (0.020±0.002) 1.6±0.10 (0.063±0.004) 1.6±0.10 (0.063±0.004) 1.6±0.10 (0.063±0.004) 0.8±0.10 (0.031±0.004) T e □MK212（0805） □MF212（0805） 2.0±0.10 (0.079±0.004) □MJ212（0805） 2.0±0.10 (0.079±0.004) ※ LW reverse type □VS212（0805） □WK212（0508）※ 2.0±0.10 (0.079±0.004) 1.25±0.15 (0.049±0.006) Dimension [mm] （inch） W T 0.3±0.03 0.3±0.03 (0.012±0.001) (0.012±0.001) 0.5±0.05 0.5±0.05 (0.020±0.002) (0.020±0.002) 1.0±0.05 0.3±0.05 (0.039±0.002) (0.012±0.002) 0.8±0.10 0.8±0.10 (0.031±0.004) (0.031±0.004) 0.8±0.10 0.8±0.10 (0.031±0.004) (0.031±0.004) 0.8±0.10 0.7±0.10 (0.031±0.004) (0.028±0.004) 1.6±0.10 0.5±0.05 (0.063±0.004) (0.020±0.002) 0.85±0.10 (0.033±0.004) 1.25±0.10 (0.049±0.004) 1.25±0.10 (0.049±0.004) 0.85±0.10 (0.033±0.004) 1.25±0.10 (0.049±0.004) 1.25±0.10 (0.049±0.004) 1.25±0.10 0.85±0.10 (0.049±0.004) (0.033±0.004) 2.0±0.15 0.85±0.10 (0.079±0.006) (0.033±0.004) □MK316（1206） □MF316（1206） 3.2±0.15 (0.126±0.006) 1.6±0.15 (0.063±0.006) □MJ316（1206） 3.2±0.15 (0.126±0.006) 1.6±0.15 (0.063±0.006) □MK325（1210） □MF325（1210） □MJ325（1210） 3.2±0.30 (0.126±0.012) 3.2±0.30 (0.126±0.012) 2.5±0.20 (0.098±0.008) 2.5±0.20 (0.098±0.008) 4.5±0.40 3.2±0.30 □MK432（1812） (0.177±0.016) (0.126±0.012) Note : ※. LW reverse type, *1.Thickness code *1 T V P A A C V D G D G D D 1.15±0.10 (0.045±0.004) Ｆ 1.6±0.20 (0.063±0.008) L 1.15±0.10 (0.045±0.004) Ｆ 1.6±0.20 (0.063±0.008) 1.15±0.10 (0.045±0.004) 1.9±0.20 (0.075±0.008) 2.5±0.20 (0.098±0.008) 1.9±0.20 (0.075±0.008) 2.5±0.20 (0.098±0.008) 2.5±0.20 (0.098±0.008) L e 0.15±0.05 (0.006±0.002) 0.25±0.10 (0.010±0.004) 0.18±0.08 (0.007±0.003) 0.35±0.25 (0.014±0.010) 0.35＋0.3/－0.25 (0.014＋0.012/－0.010) 0.35±0.25 (0.014±0.010) 0.25±0.15 (0.010±0.006) 0.5±0.25 (0.020±0.010) 0.5＋0.35/－0.25 （0.020＋0.014/－0.010） 0.5±0.25 (0.020±0.010) 0.3±0.2 (0.012±0.008) 0.5＋0.35/－0.25 （0.020＋0.014/－0.010） 0.6＋0.4/－0.3 （0.024＋0.016/－0.012） F N 0.6±0.3 (0.024±0.012) M N M M 0.6＋0.4/－0.3 （0.024＋0.016/－0.012） 0.9±0.6 (0.035±0.024) hq_c_mlcc_e-E07R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 20 19 ■STANDARD QUANTITY Type 063 105 107 EIA（inch） 0201 0402 0204 ※ 0603 0306 ※ 212 0805 316 1206 325 1210 432 1812 Note : ※.LW Reverse type（□WK） Code T V P C A 0.8 Standard quantity［pcs］ Paper tape Embossed tape 15000 － 10000 － 4000 － A 3000 （Soft Termination） － 0.8 A － 0.50 0.85 1.25 V D G － 4000 － 1.25 G － 0.85 1.15 1.6 1.15 1.9 2.5 2.5 D F L F N M M 4000 － － 3000 （Soft Termination） 4000 － 3000 2000 （Soft Termination） － 3000 2000 － 2000 － － 500（T），1000（P） 500 CERAMIC CAPACITORS 0508 ※ Dimension ［ｍｍ］ 0.3 0.5 0.30 0.7 0.8 hq_c_mlcc_e-E07R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 19 21 ■PART NUMBER Soft Termination Multilayer Ceramic Capacitors ●107TYPE　 (Dimension:1.6×0.8mm　JIS:1608　EIA:0603） 【Temperature Characteristic B7 : X7R（－55～＋125℃）】　0.8mm thickness（A） Part number 1 Part number 2 25 35 50 100 Temperature characteristics X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R Capacitance [F] Capacitance tolerance [％] tanδ [％] 0.047 0.1 0.22 0.47 1 0.047 0.1 0.22 0.47 1 1000 2200 4700 0.01 0.022 0.047 0.1 1000 2200 4700 0.01 0.022 0.047 0.1 ±10, ±20 ±10, ±20 ±10, ±20 ±10, ±20 ±10, ±20 ±10, ±20 ±10, ±20 ±10, ±20 ±10, ±20 ±10, ±20 ±10, ±20 ±10, ±20 ±10, ±20 ±10, ±20 ±10, ±20 ±10, ±20 ±10, ±20 ±10, ±20 ±10, ±20 ±10, ±20 ±10, ±20 ±10, ±20 ±10, ±20 ±10, ±20 3.5 3.5 10 10 10 3.5 3.5 10 10 10 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 μ μ μ μ μ μ μ μ μ μ p p p μ μ μ μ p p p μ μ μ μ HTLT Rated voltage x ％ 200 200 150 150 150 200 200 150 150 150 200 200 200 200 200 200 200 200 200 200 200 200 200 200 Thickness*3 [mm] Note 0.8+0.20/-0 0.8+0.20/-0 0.8+0.20/-0 0.8+0.20/-0 0.8+0.25/-0 0.8+0.20/-0 0.8+0.20/-0 0.8+0.20/-0 0.8+0.20/-0 0.8+0.25/-0 0.8+0.15/-0.05 0.8+0.15/-0.05 0.8+0.20/-0 0.8+0.20/-0 0.8+0.20/-0 0.8+0.20/-0 0.8+0.20/-0 0.8+0.15/-0.05 0.8+0.15/-0.05 0.8+0.20/-0 0.8+0.20/-0 0.8+0.20/-0 0.8+0.20/-0 0.8+0.20/-0 *1, *2 *1, *2 *1, *2 *1, *2 *1, *2 *1, *2 *1, *2 *1, *2 *1, *2 *1, *2 *1, *2 *1, *2 *1, *2 *1, *2 *1, *2 *1, *2 *1, *2 *1, *2 *1, *2 *1, *2 *1, *2 *1, *2 *1, *2 *1, *2 ●212TYPE　(Dimension:2.0×1.25mm　JIS:2012　EIA:0805） 【Temperature Characteristic B7 : X7R（－55～＋125℃）, C7 : X7S（－55～＋125℃）】　0.85mm thickness（D）、1.25mm thickness（G） Part number 1 JMJ212CB7106[]GHT EMJ212CB7225[]GHT EMJ212CB7475[]GHT TMJ212CB7225[]GHT GMJ212CB7105[]GHT UMJ212BB7103[]GHT UMJ212BB7223[]GHT UMJ212BB7473[]GHT UMJ212BB7104[]GHT UMJ212BB7224[]GHT UMJ212CC7474[]GHTE UMJ212CB7105[]GHT HMJ212KB7102[]DHT HMJ212KB7222[]DHT HMJ212BB7472[]GHT HMJ212BB7103[]GHT HMJ212BB7223[]GHT HMJ212BB7473[]GHT HMJ212BB7104[]GHT HMJ212BB7224[]GHT HMJ212CC7474[]GHTE QMJ212KB7102[]DHT QMJ212KB7222[]DHT QMJ212BB7472[]GHT QMJ212BB7103[]GHT QMJ212BB7223[]GHT Part number 2 Rated voltage [V] 6.3 16 25 35 50 100 250 Temperature characteristics X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7S X7R X7R X7R X7R X7R X7R X7R X7R X7R X7S X7R X7R X7R X7R X7R Capacitance [F] 10 2.2 4.7 2.2 1 0.01 0.022 0.047 0.1 0.22 0.47 1 1000 2200 4700 0.01 0.022 0.047 0.1 0.22 0.47 1000 2200 4700 0.01 0.022 μ μ μ μ μ μ μ μ μ μ μ μ p p p μ μ μ μ μ μ p p p μ μ Capacitance tolerance [％] ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 tanδ [％] 10 10 10 10 10 3.5 3.5 3.5 3.5 3.5 3.5 10 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 2.5 2.5 2.5 2.5 2.5 HTLT Rated voltage x ％ 150 150 150 150 150 200 200 200 200 200 150 150 200 200 200 200 200 200 200 200 150 150 150 150 150 150 Thickness*3 [mm] 1.25+0.25/-0 1.25+0.25/-0 1.25+0.25/-0 1.25+0.25/-0 1.25+0.25/-0 1.25+0.20/-0 1.25+0.20/-0 1.25+0.20/-0 1.25+0.20/-0 1.25+0.20/-0 1.25+0.25/-0 1.25+0.25/-0 0.85±0.15 0.85±0.15 1.25+0.20/-0 1.25+0.20/-0 1.25+0.20/-0 1.25+0.20/-0 1.25+0.20/-0 1.25+0.20/-0 1.25+0.25/-0 0.85±0.15 0.85±0.15 1.25+0.20/-0 1.25+0.20/-0 1.25+0.20/-0 CERAMIC CAPACITORS TMJ107BB7473[]AHT TMJ107BB7104[]AHT TMJ107BB7224[]AHT TMJ107BB7474[]AHT TMJ107CB7105[]AHR GMJ107BB7473[]AHT GMJ107BB7104[]AHT GMJ107BB7224[]AHT GMJ107BB7474[]AHT GMJ107CB7105[]AHR UMJ107AB7102[]AHT UMJ107AB7222[]AHT UMJ107BB7472[]AHT UMJ107BB7103[]AHT UMJ107BB7223[]AHT UMJ107BB7473[]AHT UMJ107BB7104[]AHT HMJ107AB7102[]AHT HMJ107AB7222[]AHT HMJ107BB7472[]AHT HMJ107BB7103[]AHT HMJ107BB7223[]AHT HMJ107BB7473[]AHT HMJ107BB7104[]AHT Rated voltage [V] Note *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 hq_c_mlcc_e-E07R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 19 33 ■PART NUMBER ●316TYPE (Dimension:3.2×1.6mm　JIS:3216　EIA:1206） 【Temperature Characteristic B7 : X7R（－55～＋125℃）, C7 : X7S（－55～＋125℃）】　1.15mm thickness（F）、1.6mm thickness（L） Part number 1 Part number 2 CERAMIC CAPACITORS LMJ316BB7226[]LHT EMJ316BB7475[]LHT EMJ316BB7106[]LHT TMJ316BB7474[]LHT TMJ316BB7475[]LHT TMJ316BB7106[]LHT GMJ316BB7474[]LHT GMJ316AB7225[]LHT GMJ316BB7475[]LHT GMJ316BB7106[]LHT UMJ316BB7473[]LHT UMJ316BB7104[]LHT UMJ316BB7224[]LHT UMJ316BB7474[]LHT UMJ316BB7105[]LHT UMJ316AB7225[]LHT UMJ316BC7475[]LHTE HMJ316 B7102[]FHT HMJ316 B7222[]FHT HMJ316 B7472[]FHT HMJ316KB7103[]FHT HMJ316BB7223[]LHT HMJ316BB7473[]LHT HMJ316BB7104[]LHT HMJ316BB7224[]LHT HMJ316BB7474[]LHT HMJ316BB7105[]LHT HMJ316BC7225[]LHTE QMJ316 B7102[]FHT QMJ316 B7222[]FHT QMJ316 B7472[]FHT QMJ316KB7103[]FHT QMJ316BB7223[]LHT QMJ316BB7473[]LHT QMJ316BB7104[]LHT SMJ316 B7102[]FHT SMJ316 B7222[]FHT SMJ316 B7472[]FHT SMJ316KB7103[]FHT SMJ316BB7223[]LHT Rated voltage [V] 10 16 25 35 50 100 250 630 Temperature characteristics X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7S X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7S X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R Capacitance [F] 22 4.7 10 0.47 4.7 10 0.47 2.2 4.7 10 0.047 0.1 0.22 0.47 1 2.2 4.7 1000 2200 4700 0.01 0.022 0.047 0.1 0.22 0.47 1 2.2 1000 2200 4700 0.01 0.022 0.047 0.1 1000 2200 4700 0.01 0.022 μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ p p p μ μ μ μ μ μ μ μ p p p μ μ μ μ p p p μ μ Capacitance tolerance [％] ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 tanδ [％] 10 10 10 3.5 10 10 3.5 10 10 10 3.5 3.5 3.5 3.5 3.5 10 2.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 HTLT Rated voltage x ％ 150 150 150 200 150 150 200 150 150 150 200 200 200 200 200 150 150 200 200 200 200 200 200 200 200 200 200 150 150 150 150 150 150 150 150 120 120 120 120 120 Thickness*3 [mm] 1.6±0.30 1.6±0.30 1.6±0.30 1.6±0.30 1.6±0.30 1.6±0.30 1.6±0.30 1.6±0.20 1.6±0.30 1.6±0.30 1.6±0.30 1.6±0.30 1.6±0.30 1.6±0.30 1.6±0.30 1.6±0.20 1.6±0.30 1.15±0.10 1.15±0.10 1.15±0.10 1.15±0.20 1.6±0.30 1.6±0.30 1.6±0.30 1.6±0.30 1.6±0.30 1.6±0.30 1.6±0.30 1.15±0.10 1.15±0.10 1.15±0.10 1.15±0.20 1.6±0.30 1.6±0.30 1.6±0.30 1.15±0.10 1.15±0.10 1.15±0.10 1.15±0.20 1.6±0.30 Note *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 ●325TYPE (Dimension:3.2×2.5mm　JIS:3225　EIA:1210） 【Temperature Characteristic B7 : X7R（－55～＋125℃）, C7 : X7S（－55～＋125℃）】　1.9mm thickness（N）、2.5mm thickness（M） Part number 1 JMJ325KB7476[]MHP EMJ325KB7226[]MHP TMJ325AB7475[]MHP TMJ325KB7106[]MHP GMJ325AB7475[]MHP GMJ325KB7106[]MHP UMJ325AB7225[]MHP UMJ325AB7475[]MHP UMJ325KB7106[]MHP HMJ325 B7223[]NHT HMJ325 B7473[]NHT HMJ325 B7104[]NHT HMJ325 B7224[]NHT HMJ325 B7474[]NHT HMJ325 B7105[]NHT HMJ325AB7225[]MHP HMJ325KC7475[]MHPE QMJ325 B7223[]NHT QMJ325 B7473[]NHT QMJ325 B7104[]NHT QMJ325 B7224[]NHT SMJ325 B7223[]NHT SMJ325 B7473[]NHT Part number 2 Rated voltage [V] 6.3 16 25 35 50 100 250 630 Temperature characteristics X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7S X7R X7R X7R X7R X7R X7R Capacitance [F] 47 22 4.7 10 4.7 10 2.2 4.7 10 0.022 0.047 0.1 0.22 0.47 1 2.2 4.7 0.022 0.047 0.1 0.22 0.022 0.047 μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ Capacitance tolerance [％] ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±10, ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 ±20 tanδ [％] 10 10 5 10 5 10 3.5 5 10 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 2.5 2.5 2.5 2.5 2.5 2.5 HTLT Rated voltage x ％ 150 150 150 150 150 150 200 150 150 200 200 200 200 200 200 200 150 150 150 150 150 120 120 Thickness*3 [mm] 2.5±0.30 2.5±0.30 2.5±0.30 2.5±0.30 2.5±0.30 2.5±0.30 2.5±0.30 2.5±0.30 2.5±0.30 1.9±0.20 1.9±0.20 1.9±0.20 1.9±0.20 1.9±0.20 1.9±0.20 2.5±0.30 2.5±0.30 1.9±0.20 1.9±0.20 1.9±0.20 1.9±0.20 1.9±0.20 1.9±0.20 Note *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *1, *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 *2 hq_c_mlcc_e-E07R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 34 19 Multilayer Ceramic Capacitors ■PACKAGING ①Minimum Quantity ●Taped package Thickness Type(EIA) □MK021(008004) □VS021(008004) □MK042(01005) □VS042(01005) □MK063(0201) □WK105(0204) ※ □MK105(0402) □MF105(0402) □VK105(0402) □MK107(0603) □WK107(0306) ※ □MF107(0603) □VS107(0603) □MJ107(0603) □MK212(0805) □WK212(0508) ※ □MF212(0805) □VS212(0805) □MJ212(0805) □MK316(1206) □MF316(1206) □MJ316(1206) □MK325(1210) □MF325(1210) □MJ325(1210) □MK432(1812) Note : ※ LW Reverse type. mm code 0.125 K 0.2 0.2 0.3 0.3 0.13 0.18 0.2 0.3 0.5 0.5 0.45 0.5 0.8 0.7 0.8 0.45 0.85 1.25 0.85 0.85 1.25 0.85 1.15 1.6 1.15 1.6 0.85 1.15 1.9 2.0max. 2.5 1.9 2.5 2.5 C, D C P,T P H E C P V W K V A C A K D G D D G D F L F L D F N Y M N M M Standard quantity [pcs] Paper tape Embossed tape － 50000 － 40000 15000 10000 － － 20000 15000 10000 10000 4000 － 4000 4000 3000 － － 20000 15000 － － － － － 4000 － － 3000 4000 － － 4000 4000 － 4000 － － － － 3000 － － 2000 － 3000 2000 3000 2000 － 2000 － － － － 1000 2000 500(T), 1000(P) 500 ②Taping material ※No bottom tape for pressed carrier tape ●Card board carrier tape ●Embossed tape Top tape Top tape Base tape Sprocket hole Sprocket hole Bottom tape Chip cavity Base tape Chip cavity ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_pack_e-E06R01 Chip filled Chip ※ LW Reverse type. ③Representative taping dimensions ●Paper Tape（8mm wide） ●Pressed carrier tape（ 2mm pitch） Unit：mm（inch） A B T 8.0±0.3 (0.315±0.012) Sprocket hole 1.75±0.1 (0.069±0.004） 3.5±0.05 (0.138±0.002) φ1.5＋0.1/－0 (φ0.059＋0.004/-0) T1 2.0±0.05 (0.079±0.002) F 4.0±0.1 (0.157±0.004) Chip Cavity Type(EIA) Ａ 0.37 Insertion Pitch Ｆ Ｂ 0.67 □MK063(0201) □WK105(0204) ※ 0.65 1.15 □MK105(0402) （*1 C） □MK105(0402) （*1 P） Note *1 Thickness, C：0.2mm ,P：0.3mm. ※ LW Reverse type. 2.0±0.05 ●Punched carrier tape （2mm pitch） 0.45max. 0.42max. 0.4max. 0.45max. 0.3max. 0.42max. Unit：mm T 8.0±0.3 (0.315±0.012) B 2.0±0.05 (0.079±0.002) 1.75±0.1 (0.069±0.004） 3.5±0.05 (0.138±0.002) A F T1 Unit：mm（inch） φ1.5＋0.1/－0 (φ0.059＋0.004/-0) Sprocket hole Tape Thickness Ｔ 4.0±0.1 (0.157±0.004) Ａ Chip Cavity Ｂ Insertion Pitch Ｆ Tape Thickness Ｔ 0.65 1.15 2.0±0.05 0.8max. Type(EIA) □MK105 (0402) □MF105 (0402) □VK105 (0402) Unit：mm ●Punched carrier tape （4mm pitch） B T 8.0±0.3 (0.315±0.012) A F Unit：mm（inch） 1.75±0.1 (0.069±0.004） 3.5±0.05 (0.138±0.002) Sprocket hole φ1.5＋0.1/－0 (φ0.059＋0.004/-0) 4.0±0.1 (0.157±0.004) 2.0±0.1 (0.079±0.004) ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_pack_e-E06R01 Chip Cavity Type(EIA) Ａ Insertion Pitch Ｆ Ｂ □MK107(0603) □WK107(0306) ※ 1.0 1.8 □MF107(0603) 4.0±0.1 □MK212(0805) 1.65 2.4 □WK212(0508) ※ □MK316(1206) 2.0 3.6 Note：Taping size might be different depending on the size of the product. ※ LW Reverse type. ●Embossed tape（4mm wide） Unit：mm 4.0±0.05 (0.157±0.002) B 1.0±0.02 (0.039±0.001) 1.1max. 0.9±0.05 (0.035±0.002) 1.8±0.02 (0.071±0.001) A F 1.1max. Unit：mm（inch） φ0.8±0.04 (φ0.031±0.002) Sprocket hole Tape Thickness Ｔ 2.0±0.04 (0.079±0.002) Chip Cavity Type(EIA) □MK021(008004) □VS021(008004) □MK042(01005) □VS042(01005) Ａ Ｂ 0.135 0.27 0.23 0.43 Insertion Pitch Ｆ K Tape Thickness T 1.0±0.02 0.5max. 0.25max. Unit：mm ●Embossed tape（8mm wide） Unit：mm（inch） 3.5±0.05 (0.138±0.002) Sprocket hole A B F 1.75±0.1 (0.069±0.004） 8.0±0.3 (0.315±0.012) φ1.5＋0.1/－0 (φ0.059＋0.004/-0) 4.0±0.1 (0.157±0.004) 2.0±0.1 (0.079±0.004) Type(EIA) □MK105(0402) □WK107(0306) ※ □MK212(0805) □MF212(0805) □MK316(1206) □MF316(1206) □MK325(1210) □MF325(1210) Note： ※ LW Reverse type. Chip Cavity Ａ 0.6 1.0 Ｂ 1.1 1.8 1.65 2.4 2.0 3.6 2.8 3.6 Insertion Pitch Ｆ 2.0±0.1 4.0±0.1 Tape Thickness K 0.6max 1.3max. T 0.2±0.1 0.25±0.1 3.4max. 0.6max. Unit：mm ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_pack_e-E06R01 ●Embossed tape（12mm wide） Unit：mm（inch） 5.5±0.05 (0.217±0.002) Sprocket hole A B 4.0±0.1 (0.157±0.004) 12.0±0.3 (0.472±0.012) 1.75±0.1 (0.069±0.004） φ1.5＋0.1/－0 (φ0.059＋0.004/-0) 2.0±0.1 (0.079±0.004) F Chip Cavity Type(EIA) Ａ 3.1 3.7 □MK325(1210) □MK432(1812) Ｂ 4.0 4.9 Insertion Pitch Ｆ 8.0±0.1 8.0±0.1 K 4.0max. 4.0max. Tape Thickness E 2.0±0.5 T 0.6max. 0.6max. Unit：mm ④Trailer and Leader Blank portion Chip cavity Blank portion Leader 100mm or more (3.94inches or more) 160mm or more (6.3inches or more) Direction of tape feed 400mm or more (15.7inches or more) ⑤Reel size t E C R B A D W A φ178±2.0 B φ50min. C φ13.0±0.2 D φ21.0±0.8 4mm wide tape 8mm wide tape 12mm wide tape T 1.5max. 2.5max. 2.5max. W 5±1.0 10±1.5 14±1.5 Unit：mm R 1.0 ⑥Top Tape Strength The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow as illustrated below. Pull direction 0～20° Top tape Base tape ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_pack_e-E06R01 Multilayer Ceramic Capacitors ■RELIABILITY DATA 1.Operating Temperature Range Temperature Compensating（Class1） Standard High Frequency Type －55 to ＋125℃ Specification Temperature Range B －25 to ＋85℃ BJ X5R －55 to ＋85℃ B7 X7R －55 to ＋125℃ C6 X6S －55 to ＋105℃ C7 X7S －55 to ＋125℃ D7 X7T －55 to ＋125℃ LD(※) X5R －55 to ＋85℃ Note: ※LD Low distortion high value multilayer ceramic capacitor Specified Value High Permittivity （Class2） 2. Storage Conditions Temperature Compensating（Class1） Standard High Frequency Type －55 to ＋125℃ Specification Temperature Range B －25 to ＋85℃ BJ X5R －55 to ＋85℃ B7 X7R －55 to ＋125℃ C6 X6S －55 to ＋105℃ C7 X7S －55 to ＋125℃ D7 X7T －55 to ＋125℃ LD(※) X5R －55 to ＋85℃ Note: ※LD Low distortion high value multilayer ceramic capacitor Specified Value High Permittivity （Class2） 3. Rated Voltage Specified Value Temperature Compensating（Class1） Standard 50VDC, 25VDC High Frequency Type 50VDC, 25VDC High Permittivity （Class2） 50VDC, 35VDC, 25VDC, 16VDC, 10VDC, 6.3VDC, 4VDC, 2.5VDC 4. Withstanding Voltage （Between terminals） Specified Value Temperature Compensating（Class1） Standard High Frequency Type No breakdown or damage High Permittivity （Class2） Test Methods and Remarks Class 1 Rated volta×3 Applied voltage Duration Charge/discharge current Class 2 Rated voltage×2.5 1 to 5 sec. 50mA max. 5. Insulation Resistance Specified Value Temperature Compensating（Class1） Standard High Frequency Type High Permittivity （Class2） Note 1 Test Methods and Remarks Applied voltage Duration Charge/discharge current 10000 MΩmin. C≦0.047μF : 10000 MΩ min. C＞0.047μF : 500MΩ・μF : Rated voltage : 60±5 sec. : 50mA max. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_c_mlcc_reli_e-E06R01 6. Capacitance （Tolerance） Specified Value Temperature Compensating（Class1） Standard C□ U□ SL 0.2pF≦C≦5pF 0.2pF≦C≦10pF C＞10pF : ±0.25pF : ±0.5pF : ±5% or ±10% High Frequency Type CH 0.3pF≦C≦2pF C＞2pF : ±0.1pF : ±5% BJ, B7, C6, C7, D7, LD(※) : ±10% or ±20% Note: ※LD Low distortion high value multilayer ceramic capacitor High Permittivity （Class2） Test Methods and Remarks Standard Preconditioning Measuring frequency Measuring voltage Note Bias application Class 1 High Frequency Type None 1ＭHz±10% 0.5 to 5Vrms Class 2 C≦10μF C＞10μF Thermal treatment （at 150℃ for 1hr） Note 2 1kHz±10% 120±10Hz 1±0.2Vrms 0.5±0.1rms one 7. Q or Dissipation Factor Specified Value Temperature Compensating（Class1） Standard High Frequency Type High Permittivity （Class2） Note 1 C＜30pF : Q≧400＋20C C≧30pF : Q≧1000 （C：Nominal capacitance） Refer to detailed specification BJ, B7, C6, C7, D7：2.5% max. Class 1 High Frequency Type None 1ＭHz±10% 1GHz 0.5 to 5Vrms Standard Test Methods and Remarks Preconditioning Measuring frequey Measuring voltage Note 1 Bias application High Frequency Type Measuring equipment Measuring jig Class 2 C≦10μF C＞10μF Thermal treatment （at 150℃ for 1hr） Note 2 1ｋHz±10% 120±10Hz 1±0.2Vrms 0.5±0.1Vrms None : HP4291A : HP16192A 8. Temperature Characteristic （Without voltage application） Temperature Characteristic ［ppm/℃］ C□ : Temperature Compensating（Class1） 0 CG,CH, CJ, CK Standard U□ : －750 SL High Frequency Type UJ, UK : ＋350 to －1000 Temperature Characteristic ［ppm/℃］ C□ : 0 CH Specified Value Tolerance ［ppm/℃］ G : ±30 H : ±60 J : ±120 K : ±250 Tolerance ［ppm/℃］ H : ±60 Capacitance Reference Temperature Range change temperature ±10% 20℃ －25 to ＋85℃ ±15% 25℃ －55 to ＋85℃ ±15% 25℃ －55 to ＋125℃ ±22% 25℃ －55 to ＋105℃ ±22% 25℃ －55 to ＋125℃ ＋22/－33% 25℃ －55 to ＋125℃ ±15% 25℃ －55 to ＋85℃ distortion high value multilayer ceramic capacitor Specification B X5R B7 X7R C6 X6S C7 X7S D7 X7S LD(※) X5R Note : ※LD Low BJ High Permittivity （Class2） Class 1 Capacitance at 20℃ and 85℃ shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following equation. （C85－C20） ×106（ppm/℃） C20×△T △T＝65 Test Methods and Remarks Class 2 Capacitance at each step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following equation. Step B X5R、X7R、X6S、X7S、X7T 1 Minimum operating temperature 2 20℃ 25℃ 3 Maximum operating temperature ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_c_mlcc_reli_e-E06R01 （C－C2） ×100（%） C2 C ：Capacitance in Step 1 or Step 3 C2 ：Capacitance in Step 2 9. Deflection Specified Value Temperature Compensating（Class1） Standard High Frequency Type Appearance Cpaitance change : No abnormality : Within±0.5 pF Multilayer Ceramic Capacitors 105 Type The other types Glass epoxy-resin substrate 0.8mm 1.6mm 1mm （Soft Termination type:3mm） 10 sec. ※１： 105 Type thickness, C： 0.2mm ,P： 0.3mm. 042, 063, Board Thickness Warp Duration : No abnormality : Within ±5% or ±0.5 pF, whichever is larger. Appearance : No abnormality Capacitance change : Within ±12.5%（BJ, B7, C6, C7, D7, LD(※)） Note: ※LD Low distortion high value multilayer ceramic capacitor High Permittivity （Class2） Test Methods and Remarks Appearance Capacitance change ※１ Capacitance measurement shall be conducted with the board bent 10. Body Strength Specified Value Temperature Compensating（Class1） Standard High Frequency Type High Permittivity （Class2） Test Methods and Remarks － No mechanical damage. － High Frequency Type Applied force : 5N Duration : 10 sec. 11. Adhesive Strength of Terminal Electrodes Specified Value Temperature Compensating（Class1） Standard High Frequency Type No terminal separation or its indication. High Permittivity （Class2） Test Methods and Remarks Applied force Duration Multilayer Ceramic Capacitors 042, 063 Type 105 Type or more 2N 5N 30±5 sec. 12. Solderability Specified Value Temperature Compensating（Class1） Standard High Frequency Type At least 95% of terminal electrode is covered by new solder. High Permittivity （Class2） Test Methods and Remarks Solder type Solder temperature Duration Eutectic solder H60A or H63A 230±5℃ Lead-free solder Sn-3.0Ag-0.5Cu 245±3℃ 4±1 sec. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_c_mlcc_reli_e-E06R01 13. Resistance to Soldering Standard Appearance Capacitance change Q Insulation resistance Withstanding voltage : No abnormality : Within ±2.5% or ±0.25pF, whichever is larger. : Initial value : Initial value （between terminals） : No abnormality High Frequency Type Appearance Capacitancecange Q Insulation resistance Withstanding voltage : No abnormality : Within ±2.5% : Initial value : Initial value （between terminals） : No abnormality Temperature Compensating（Class1） Specified Value High Permittivity （Class2） Appearance : No abormality Capactace change : Within ±7.5%（BJ, B7, C6, C7, D7, LD(※)） Dissipation factor : Initial value Insulation resistance : Initial value Withstanding voltage （between terminals）: No abnormality Note: ※LD Low distortion high value multilayer ceramic capacitor Note 1 lss 1 042, 063 Type 105 Type Preconditioning Preheating Test Methods and Remarks None Solder temp. Duration Recovery 270±5℃ 3±0.5 sec. 6 to 24 hrs （Standard condition） Noe 5 042、063 Type Preconditioning Preheating 80 to 100℃, 2 to 5 min. 150 to 200℃, 2 to 5 min. 150℃, 1 to 2 min. 150℃, 1 to 2 min. Solder temp. Duration Recovery Class 2 105, 107, 212 Type 316, 325 Type Thermal treatment （at 150℃ for 1 hr） Note 2 80 to 100℃, 2 to 5 min. 80 to 100℃, 5 to 10 min. 150 to 200℃, 2 to 5 min. 150 to 200℃, 5 to 10 min. 270±5℃ 3±0.5 sec. 24±2 hrs （Standard condition） Note 5 14. Temperature Cycle (Thermal Shock） Standard Appearance Capacitance change Q Insulation resistance Withstanding voltage : No abnormality : Within ±2.5% or ±0.25pF, whichever is larger. : Initial value : Initial value （between terminals） : No abnormality High Frequency Type Appearance Capacitance change Q Insulation resistance Withstanding voltage : No abnormality : Within ±0.25pF : Initial value : Initial value （between terminals） : No abnormality Temperature Compensating（Class1） Specified Value High Permittivity （Class2） Appearance : No abnormality Capacitance change : Within ±7.5% （BJ, B7, C6, C7, D7, LD(※)） Dissipation factor : Initial value Insulation resistance : Initial value Withstanding voltage （between terminals） : No abnormality Note: ※LD Low distortion high value multilayer ceramic capacitor Note 1 Class 1 Preconditioning Test Methods and Remarks 1 cycle Number of cycles Recovery Class 2 Thermal treatment （at 150℃ for 1 hr） Note 2 None Step 1 2 3 4 Temperature（℃） Minimum operating temperature Normal temperature Maximum operating temperature Normal temperature Time（min.） 30±3 2 to 3 30±3 2 to 3 5 times 6 to 24 hrs （Standard condition） Note 5 24±2 hrs （Standard condition） Note 5 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_c_mlcc_reli_e-E06R01 15. Humidity （Steady State） Appearance Capacitance change Q Standard Temperature Compensating（Class1） Specified Value High Frequency Type High Permittivity （Class2） Insulation resistance : No abnormality : Within ±5% or ±0.5pF, whichever is larger. : C＜10pF : Q≧200＋10C 10≦C＜30pF : Q≧275＋2.5C C≧30pF:Q≧350（C：Nominal capacitance） : 1000 MΩmin. Appearance Capacitance change Insulation resistance : No abnormality : Within ±0.5pF, : 1000 MΩmin. Appearance : No abnormality Capacitance change : Within ±12.5% （BJ, B7, C6, C7, D7, LD(※)） Dissipation factor : 5.0% max.（BJ, B7, C6, C7, D7, LD(※)） Insulation resistance : 50 MΩμF or 1000 MΩwhichever is smaller. Note: ※LD Low distortion high value multilayer ceramic capacitor Note 1 Class 1 Standard Test Methods and Remarks Preconditioning Temperature Humidity Duration Recovery Class 2 All items Thermal treatment（ at 150℃ for 1 hr） Note 2 40±2℃ 90 to 95%RH 500＋24/－0 hrs 24±2 hrs （Standard condition） Note 5 High Frequency Type None 40±2℃ 60±2℃ 90 to 95%RH 500＋24/－0 hrs 6 to 24 hrs （Standard condition） Note 5 16. Humidity Loading Appearance Capacitance change Q Standard Insulation resistance Temperature Compensating（Class1） Specified Value Appearance Capacitance change High Frequency Type Insulation resistance High Permittivity （Class2） Note 1 Appearance : No abnormality Capacitance change : Within ±12.5% （BJ, B7, C6, C7, D7, LD(※)） Dissipation factor : 5.0% max. （BJ, B7, C6, C7, D7, LD(※)） Insulation resistance : 25 MΩμF or 500 MΩ, whichever is smaller. Note: ※LD Low distortion high value multilayer ceramic capacitor 90 to 95%RH 500＋24/－0 hrs Rated voltage 50mA max. 50mA max. 6 to 24 hrs （Standard condition） Note 5 24±2 hrs（Standard condition） Note 5 Preconditioning Temperature Humidity Duration Applied voltage Charge/discharge current Recovery : No abnormality : C≦2pF：Within ±0.4 pF C＞2pF：Within ±0.75 pF （C：Nominal capacitance） : 500 MΩmin. Class 2 All items Voltage treatment （Rated voltage are applied for 1 hour at 40℃） Note 3 40±2℃ 90 to 95%RH 500＋24/－0 hrs Rated voltage Standard Test Methods and Remarks : No abnormality : Within ±7.5% or ±0.75pF, whichever is larger. : C＜30pF：Q≧100＋10C/3 C≧30pF：Q≧200 （C：Nominal capacitance） : 500 MΩmin. Class 1 High Frequency Type None 40±2℃ 60±2℃ ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_c_mlcc_reli_e-E06R01 17. High Temperature Loading Appearance Capacitance change Q Standard Temperature Compensating（Class1） Specified Value High Frequency Type High Permittivity （Class2） Test Methods and Remarks Temperature Duration Applied voltage Charge/discharge current Recovery Appearance Capacitance change Insulation resistance : No abnormality : Within ±3% or ±0.3pF, whichever is larger. : 1000 MΩmin. Appearance : No abnormality Capacitance change : Within ±12.5% （BJ, B7, C6, C7, D7, LD(※)） Dissipation factor : 5.0% max.（BJ, B7, C6, C7, D7, LD(※)） Insulation resistance : 50 MΩμF or 1000 MΩ, whichever is smaller. Note: ※LD Low distortion high value multilayer ceramic capacitor Note 1 Maximum operating temperature 1000＋48/－0 hrs Rated voltage×2 Class 2 BJ, LD(※) C6 B7, C7, D7 Voltage treatment（Twice the rated voltage shall be applied for 1 hour at 85℃, 105℃ or 125℃） Note 3, 4 Maximum operating temperature 1000＋48/－0 hrs Rated voltage×2 Note 4 50mA max. 50mA max. Standard Preconditioning Insulation resistance : No abnormality : Within ±3% or ±0.3pF, whichever is larger. : C＜10pF： Q≧200＋10C 10≦C＜30pF：Q≧275＋2.5C C≧30pF： Q≧350（C：Nominal capacitance） : 1000 MΩmin. Class 1 High Frequency Type None 6 to 24hr （Standard condition） Note 5 24±2 hrs （Standard condition） Note 5 Note: ※LD Low distortion high value multilayer ceramic capacitor Note 1 The figures indicate typical specifications. Please refer to individual specifications in detail. Note 2 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 150＋0/－10℃ for an hour and kept at room temperature for 24±2hours. Note 3 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in the test conditions, and kept at room temperature for 24±2hours. Note 4 150% of rated voltage is applicable to some items. Please refer to their specifications for further information. Note 5 Standard condition: Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa When there are questions concerning measurement results, in order to provide correlation data, the test shall be conducted under the following condition. Temperature: 20±2℃, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa Unless otherwise specified, all the tests are conducted under the "standard condition". ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_c_mlcc_reli_e-E06R01 Medium-High Voltage Multilayer Ceramic Capacitor ■RELIABILITY DATA 1. Operating Temperature Range Temperature Compensating(High Frequency type) CG(C0G) : －55 to ＋125℃ Specified Value High permittivity X7R, X7S : －55 to ＋125℃ X5 : －55 to ＋85℃ B : －25 to ＋85℃ 2. Storage Temperature Range Temperature Compensating(High Frequency type) CG(C0G) : －55 to ＋125℃ Specified Value High permittivity X7R, X7S : －55 to ＋125℃ X5R : －55 to ＋85℃ B : －25 to ＋85℃ 3. Rated Voltage Specified Value 100VDC(HMK,HMJ), 250VDC(QMK,QMJ,QVS), 630VDC(SMK,SMJ) 4. Withstanding Voltage（Between terminals） Specified Value No breakdown or damage Test Methods and Remarks Applied voltage Duration Carge/discharge current : Rated voltage×2.5（HMK,HMJ）, Rated voltage×2（QMK,QMJ,QVS）, Rated voltage×1.2（SMK,SMJ） : 1 to 5sec. : 50mA max. ５．Insulation Resistance Temperature Compensating(High Frequency type) 10000MΩ min Specified Value High permittivity 100MΩμF or 10GΩ, whichever is smaller. Test Methods and Remarks Applied voltage Duration Charge/discharge current : Rated voltage（HMK,HMJ, QMK,QMJ,QVS）, 500V（SMK,SMJ） : 60±5sec. : 50mA max. 6．Capacitance （Tolerance） Temperature Compensating(High Frequency type) ±0.1pF (C＜5pF) ±0.25pF (C＜10pF) ±0.5pF (5pF≦C＜10pF) ±2%(C=10pF) ±5%(C≧10pF) Specified Value High permittivity ±10%, ±20% Test Methods and Remarks Temperature Compensating(High Frequency type) Measuring frequency : 1MHz±10% Measuring voltage : 0.5 to 5Vrms Bias application : None High permittivity Measuring frequency Measuring voltage Bias application : 1kHz±10% : 1±0.2Vrms : None ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_c_mlcc_mhv_reli_e-E06R01 7．Q or Dissipation Factor Temperature Compensating(High Frequency type) C＜30pF : Q≧800＋20C C≧30pF : Q≧1400 C:Normal Capacitance(/pF) Specified Value High permittivity 3.5%max（HMK,HMJ） 2.5%max（QMK,QMJ, SMK,SMJ） Test Methods and Remarks Temperature Compensating(High Frequency type) Measuring frequency : 1MHz±10% Measuring voltage : 0.5 to 5Vrms Bas application : None High permittivity Measuring frequency Measuring voltage Bas application : 1kHz±10% : 1±0.2Vrms : None 8．Temperature Characteristic of Capacitance Temperature Compensating(High Frequency type) C0G :±30ppm（25 to ＋125℃） Specified Value Test Methods and Remarks High permittivity B : ±10%（－25 to ＋85℃） X5R : ±15%（－55 to ＋85℃） X7R : ±15%（－55 to ＋125℃） X7S : ±22%（－55 to ＋125℃） Temperature Compensating(High Frequency type) Capacitance at 25℃ and 85℃ shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the ｆollowing equation. （C85－C25） ×106×[ppm/℃] C25×ΔT High permittivity Capacitance value at each step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following equation. Step B X5R、X7R、X7S 1 Minimum operating tempeature 2 20℃ 25℃ 3 Maximum operating temperature （C－C2） ×100（%） C2 C : Capacitance value in Step 1 or Step 3 C2 : Capacitance value in Step 2 9．Deflection Temperature Compensating(High Frequency type) Appearance : No abnormality Capacitance change :±5% or ±0.5pF, whichever is larger. Specified Value High permittivity Appearance Capacitance change Test Methods and Remarks Warp Duration Test board Thicknss : : : : : No abnormality : Within±10% 1mm （Soft Termination type:3mm） 10sec. Glass epoxy-resin substrate 1.6mm Capacitance measurement shall be conducted with the board bent. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_c_mlcc_mhv_reli_e-E06R01 10．Adhesive Strength of Terminal Electrodes Specified Value No terminal separation or its indication. Temperature Compensating(High Frequency type) Applied force : 2N Duration : 10±5sec. Test Methods and Remarks High permittivity Applied force : 5N Duration : 30±5sec. 11．Solderability Specified Value Test Methods and Remarks At least 95% of terminal electrode is covered by new solder Eutectic solder H60A or H63A 230±5℃ Solder type Solder temperature Duration Lead-free solder Sn-3.0Ag-0.5Cu 245±3℃ 4±1 sec. 12．Resistance to Soldering Temperature Compensating(High Frequency type) Appearance : No abnormality Capacitance change : C※≦10pF :±0.25pF C※＞10pF :±2.5% Insulation resistance : Initial value Withstanding voltage （between terminals） : No abnormality Specified Value Test Methods and Remarks ※Normal capacitance High permittivity Appearance Capacitance change Dissipation factor Insulation resistance Withstanding voltage : No abnormality : Within±15%（HMK,HMJ）, ±10%（QMK,QMJ, SMK,SMJ） : Inital value : Initial value （between terminals） : No abnormality Preconditioning Solder temperature Duration Preheating conditions Recovery : : : : : Thermal treatment（at 150℃ for 1hr） Note1 (Only High permittivity) 270±5℃ 3±0.5sec. 80 to 100℃, 2 to 5 min. 150 to 200℃, 2 to 5min. 24±2hrs under the stadard condition Note3 13．Temperature Cycle （Thermal Shock） Temperature Compensating(High Frequency type) Appearance : No abnormality Capacitance change : C※≦10pF :±0.25% C※＞10pF :±2.5% Insulation resistance : Initial value Withstanding voltage （between terminals） : No abnormality Specified Value Test Methods and Remarks High permittivity Appearance Capacitance change Dissipation factor Insulation resistance Withstanding voltage : No abnormality : Within±15%（HMK,HMJ）, ±7.5%（QMK,QMJ, SMK,SMJ） : Initial value : Initial value （between terminals） : No abnormality Preconditioning : Thermal treatment （at 150℃ for 1hr） Note1 Conditions for 1 cycle Step temperature（℃） 1 Minimum operating temperature 2 Normal temperature 3 Maximum operating temperature 4 Normal temperature Number of cycles : 5 times Recovery : 24±2hrs under the standard condition Note3 Time（min.） 30±3min. 2 to 3min. 30±3min. 2 to 3min. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_c_mlcc_mhv_reli_e-E06R01 14．Humidity （Steady state） Temperature Compensating(High Frequency type) Appearance : No abnormality Capacitance change : C※≦10pF :±0.5pF Insulation resistance : 1000MΩmin Specified Value Test Methods and Remarks C※＞10pF :±5% ※Normal capacitance High permittivity Appearance Capacitance change Dissipation factor Insulation resistance : : : : No abnormality Within±15% 7%max（HMK,HMJ）, 5%max（QMK,QMJ, SMK,SMJ）. 25MΩμF or 1000MΩ, whichever is smaller. Preconditioning Temperature Humidity Duration Recovery : : : : : Thermal treatment（at 150℃ for 1hr） Note1 (Only High permittivity) 40±2℃ 90 to 95%RH 500 ＋24/－0 hrs 24±2hrs under the standard condition Note3 15．Humidity Loading Temperature Compensating(High Frequency type) Appearance : No abnormality Capacitance change : C※≦2.0pF :±0.4pF 2.0pF＜C≦10pF : ±0.75pF C※＞10pF :±7.5% : ※Normal capacitance Insulation resistance : 500MΩmin Specified Value High permittivity Appearance Capacitance change Dissipation factor Insulation resistance Test Methods and Remarks : : : : No abnormality Within±15% 7%max（HMK,HMJ）, 5%max（QMK,QMJ, SMK,SMJ）. 10MΩμF or 500MΩ, whichever is smaller. According to JIS 5102 clause 9.9. Preconditioning : Voltage treatment Note2 (Only High permittivity) Temperature : 40±2℃ Humidity : 90 to 95%RH Applied voltage : Rated voltage Charge/discharge current : 50mA max. Duration : 500 ＋24/－0 hrs Recovery : 24±2hrs under the standard condition Note3 16．High Temperature Loading Temperature Compensating(High Frequency type) Appearance : No abnormality Capacitance change : C※≦10pF :±0.3pF Insulation resistance :1000MΩmin Specified Value Test Methods and Remarks High permittivity Appearance Capacitance change Dissipation factor Insulation resistance : : : : C※＞10pF :±3% No abnormality Within±15% 7%max（HMK,HMJ）, 5%max（QMK,QMJ, SMK,SMJ）. 50MΩμF or 1000MΩ, whichever is smaller. According to JIS 5102 clause 9.10. Preconditioning : Voltage treatment Note2 (Only High permittivity) Temperature : Maximum operating temperature Applied voltage : Rated voltage×2（HMK,HMJ,QVS） Rated voltage×1.5（QMK,QMJ） Rated voltage×1.2（SMK,SMJ） Charge/discharge current : 50mA max. Duration : 1000 ＋24/－0 hrs Recovery : 24±2hrs under the standard condition Note3 Note1 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 150＋0/－10℃ for an hour and kept at room temperature for 24±2hours. Note2 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in the test conditions, and kept at room temperature for 24±2hours. Note3 Standard condition : Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa When there are questions concerning measurement results, in order to provide correlation data, the test shall be conducted under the following condition. Temperature: 20±2℃, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa Unless otherwise specified, all the tests are conducted under the "standard condition". ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_c_mlcc_mhv_reli_e-E06R01 Precautions on the use of Multilayer Ceramic Capacitors ■PRECAUTIONS 1. Circuit Design Precautions ◆Verification of operating environment, electrical rating and performance 1. A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have severe social ramifications. Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from them used in general purpose applications. ◆Operating Voltage （Verification of Rated voltage） 1. The operating voltage for capacitors must always be their rated voltage or less. If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less. For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less. 2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC voltage or a pulse voltage having rapid rise time is used in a circuit. 2. PCB Design Precautions ◆Pattern configurations （Design of Land-patterns） 1. When capacitors are mounted on PCBs, the amount of solder used （size of fillet） can directly affect the capacitor performance. Therefore, the following items must be carefully considered in the design of land patterns: （1）Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider appropriate land-patterns for proper amount of solder. （2）When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by solder-resist. ◆Pattern configurations （Capacitor layout on PCBs） After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes （PCB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.）. For this reason, land pattern configurations and positions of capacitors shall be carefully considered to minimize stresses. ◆Pattern configurations （Design of Land-patterns） The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts. （1）Recommended land dimensions for typical chip capacitors Land patterns for PCBs ●Multilayer Ceramic Capacitors : Recommended land dimensions Land pattern （unit: mm） Solder-resist Wave-soldering Chip capacitor Type 107 212 316 325 L 1.6 2.0 3.2 3.2 C Size W 0.8 1.25 1.6 2.5 A 0.8 to 1.0 1.0 to 1.4 1.8 to 2.5 1.8 to 2.5 B 0.5 to 0.8 0.8 to 1.5 0.8 to 1.7 0.8 to 1.7 B A B C 0.6 to 0.8 0.9 to 1.2 1.2 to 1.6 1.8 to 2.5 Chip capacitor W L Technical considerations Reflow-soldering Type 042 063 105 L 0.4 0.6 1.0 Size W 0.2 0.3 0.5 A 0.15 to 0.25 0.20 to 0.30 0.45 to 0.55 B 0.15 to 0.20 0.20 to 0.30 0.40 to 0.50 C 0.15 to 0.30 0.25 to 0.40 0.45 to 0.55 Note：Recommended land size might be different according 107 212 316 1.6 2.0 3.2 0.8 1.25 1.6 0.8 to 1.0 0.8 to 1.2 1.8 to 2.5 0.6 to 0.8 0.8 to 1.2 1.0 to 1.5 0.6 to 0.8 0.9 to 1.6 1.2 to 2.0 to the allowance of the size of the product. ●LWDC: Recommended land dimensions for reflow-soldering （unit: mm） Type 105 107 212 L 0.52 0.8 1.25 Size W 1.0 1.6 2.0 A 0.18 to 0.22 0.25 to 0.3 0.5 to 0.7 B 0.2 to 0.25 0.3 to 0.4 0.4 to 0.5 C 0.9 to 1.1 1.5 to 1.7 1.9 to 2.1 325 3.2 2.5 1.8 to 2.5 1.0 to 1.5 1.8 to 3.2 432 4.5 3.2 2.5 to 3.5 1.5 to 1.8 2.3 to 3.5 LWDC W L ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_c_mlcc_prec_e-E07R01 （2）Examples of good and bad solder application Items Not eommended Lead wire of component Recommended Solder-resist Mixed mounting of SMD and leaded components Chassis Solder (for grounding) Solder-resist Component placement close to the chassis Electrode pattern Lead wire of component Soldering iron Hand-soldering of leaded Components near mounted components Solder-resist Solder-resist Horizontal component placement ◆Pattern configurations （Capacitor layout on PCBs） 1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any stresses from board warp or deflection. Items Not recommended Recommended possible mechanical Place the product at a right angle to the direction of the anticipated mechanical stress. Deflection of board 1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below. E D Perforation C A B Slit Magnitude of stress A＞B＝C＞D＞E 1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB, split methods as well as chip location. 3. Mounting Precautions ◆Adjustment of mounting machine 1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them. 2. Maintenance and inspection of mounting machines shall be conducted periodically. ◆Selection of Adhesives 1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the following factors are appropriately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, please contact us for further information. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_c_mlcc_prec_e-E07R01 ◆Adjustment of mounting machine 1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid this, the following points shall be considerable. （1）The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection. （2）The pressure of nozzle shall be adjusted between 1 and 3 N static loads. （3）To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be used on the other side of the PCB. The following diagrams show some typical examples of good and bad pick-up nozzle placement: Items Single-sided mounting Not recommended Recommended chipping or cracking supporting pins or back-up pins Double-sided mounting chipping or cracking Technical considerations supporting pins or back-up pins 2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical impact on the capacitors. To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of the pin shall be conducted periodically. ◆Selection of Adhesives Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in stresses on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect components. Therefore, the following precautions shall be noted in the application of adhesives. （1）Required adhesive characteristics a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process. b. The adhesive shall have sufficient strength at high temperatures. c. The adhesive shall have good coating and thickness consistency. d. The adhesive shall be used during its prescribed shelf life. e. The adhesive shall harden rapidly. f. The adhesive shall have corrosion resistance. g. The adhesive shall have excellent insulation characteristics. h. The adhesive shall have no emission of toxic gasses and no effect on the human body. （2）The recommended amount of adhesives is as follows; Amount adhesive After capacitor are bonded ［Recommended condition］ a a Figure 212/316 case sizes as examples a 0.3mm min b b 100 to 120μm c Adhesives shall not contact land c c 4. Soldering Precautions ◆Selection of Flux Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use; （1）Flux used shall be less than or equal to 0.1 wt%（ in Cl equivalent） of halogenated content. Flux having a strong acidity content shall not be applied. （2）When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level. （3）When water-soluble flux is used, special care shall be taken to properly clean the boards. ◆Soldering Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions. Sn-Zn solder paste can adversely affect MLCC reliability. Please contact us prior to usage of Sn-Zn solder. Technical considerations ◆Selection of Flux 1-1. When too much halogenated substance（Chlorine, etc.） content is used to activate flux, or highly acidic flux is used, it may lead to corrosion of terminal electrodes or degradation of insulation resistance on the surfaces of the capacitors. 1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted and may adversely affect the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system. 1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high humidity conditions may cause a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning methods and the capability of the machines used shall also be considered carefully when water-soluble flux is used. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_c_mlcc_prec_e-E07R01 ◆Soldering ･ Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. ･ Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal shock. ･ Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within 100 to 130℃. ･ Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100℃. ［Reflow soldering］ 【Recommended conditions for eutectic soldering】 【Recommended condition for Pb-free soldering】 300 300 Peak 260℃ Max. Within 10sec. 230℃ Within 10sec. 60sec. 60sec Min. 200 Min. Slow cooling 100 Temperature（℃） Temperature（℃） Preheating 200 100 0 0 Slow cooling Preheating150℃ Heating above 230℃ 60sec. Min. 40sec. Max. 1/2T～1/3T Capacitor Caution ①The ideal condition is to have solder mass（fillet）controlled to 1/2 to 1/3 of the thickness of a capacitor. ②Because excessive dwell times can adversely affect solderability, soldering duration shall be kept as close to recommended times as possible. ③Allowable number of reflow soldering : 2 times max. Solder T PC board ［Wave soldering］ 【Recommended conditions for eutectic soldering】 【Recommended condition for Pb-free soldering】 300 Preheating 120sec. Min. Peak 260℃ Max. Within 10sec. 230～250℃ Within 3sec. 200 Slow cooling 100 Temperature（℃） Temperature（℃） 300 0 200 120sec. Min. Preheating 150℃ 100 Slow cooling 0 Caution ①Wave soldering must not be applied to capacitors designated as for reflow soldering only. ②Allowable number of wave soldering : 1 times max. ［Hand soldering］ 【Recommended condition for Pb-free soldering】 400 400 300 200 Slow cooling 100 0 Preheating 60sec. Min. Temperature（℃） Temperature（℃） 300 ⊿T Slow cooling 200 Preheating 150℃ Min. 100 0 400 Peak 350℃ Max. Within 3sec. 230～280℃ Within 3sec. 316type or less 200 0 Slow cooling ⊿T Preheating 150℃ Min. 100 60sec. Min. ⊿T ⊿T≦150℃ Peak 280℃ Max. Within 3sec. 300 温度（℃） 【Recommended conditions for eutectic soldering】 60sec. Min. 325type or more ⊿T ⊿T≦130℃ Caution ①Use a 50W soldering iron with a maximum tip diameter of 1.0 mm. ②The soldering iron shall not directly touch capacitors. ③Allowable number of hand soldering : 1 times max. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_c_mlcc_prec_e-E07R01 5. Cleaning Precautions Technical considerations ◆Cleaning conditions 1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use of the cleaning. （e.g. to remove soldering flux or other materials from the production process.） 2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect capacitor's characteristics. 1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate their outer coating, resulting in a degradation of the capacitor's electrical properties （especially insulation resistance）. 2. Inappropriate cleaning conditions（ insufficient or excessive cleaning） may adversely affect the performance of the capacitors. In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead to the cracking of capacitors or the soldered portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall be carefully checked; Ultrasonic output : 20 W/ℓ or less Ultrasonic frequency : 40 kHz or less Ultrasonic washing period : 5 min. or less 6. Resin coating and mold Precautions 1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal storage conditions resulting in the deterioration of the capacitor's performance. 2. When a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat may lead to damage or destruction of capacitors. The use of such resins, molding materials etc. is not recommended. 7. Handling ◆Splitting of PCB 1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board. 2. Board separation shall not be done manually, but by using the appropriate devices. Precautions ◆Mechanical considerations Be careful not to subject capacitors to excessive mechanical shocks. （1）If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used. （2）Please be careful that the mounted components do not come in contact with or bump against other boards or components. 8. Storage conditions Precautions ◆Storage 1. To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control temperature and humidity in the storage area. Humidity should especially be kept as low as possible. ・Recommended conditions Ambient temperature : Below 30℃ Humidity : Below 70% RH The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of capacitor is deteriorated as time passes, so capacitors shall be used within 6 months from the time of delivery. ・Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air. 2. The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time, so care shall be taken to design circuits . Even if capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at 150℃ for 1hour. Technical considerations If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and quality loss of taping/packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the above period, please check solderability before using the capacitors. ※RCR-2335B（Safety Application Guide for fixed ceramic capacitors for use in electronic equipment）is published by JEITA. Please check the guide regarding precautions for deflection test, soldering by spot heat, and so on. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_c_mlcc_prec_e-E07R01