for High Quality Equipment
Notice for TAIYO YUDEN products
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
■ Product Information in this Catalog
Product information in this catalog is as of October
2020. All
All of
of the
the
January 2021.
contents specified herein and production status of the products listed in
this catalog are subject to change without notice due to technical
improvement of our products, etc. Therefore, please check for the latest
information carefully before practical application or use of our products.
(4) Powe r g e n e r atio n c o ntro l e quip m e nt (nu c le a r p owe r,
hydroelectric power, thermal power plant control system, etc.)
(5) Undersea equipment (submarine repeating equipment,
underwater work equipment, etc.)
(6) Military equipment
(7) Any other equipment requiring extremely high levels of safety
and/or reliability equal to the equipment listed above
Please note that TAIYO YUDEN shall not be in any way responsible
for any damages and defects in products or equipment incorporating
our products, which are caused under the conditions other than those
specified in this catalog or individual product specification sheets.
*Notes:
1. There is a possibility that our products can be used only
for aviation equipment that does not directly affect the safe
operation of aircraft (e.g., in-flight entertainment, cabin
light, electric seat, cooking equipment) if such use meets
requirements specified separately by TAIYO YUDEN. Please
be sure to contact TAIYO YUDEN for further information
before using our products for such aviation equipment.
2. Implantable medical devices contain not only internal unit
which is implanted in a body, but also external unit which is
connected to the internal unit.
■ Approval of Product Specifications
Ple a se c ont ac t TA IYO YUD EN for fur the r det a ils of p ro duc t
specifications as the individual product specification sheets are
available. When using our products, please be sure to approve our
product specifications or make a written agreement on the product
specification with TAIYO YUDEN in advance.
■ Pre-Evaluation in the Actual Equipment and Conditions
Please conduct validation and verification of our products in actual
conditions of mounting and operating environment before using our
products.
■ Limited Application
1. Equipment Intended for Use
The products listed in this catalog are intended for generalpurpose and standard use in general electronic equipment (e.g.,
AV equipment, OA equipment, home electric appliances, office
equipment, information and communication equipment including,
without limitation, mobile phone, and PC) and other equipment
specified in this catalog or the individual product specification sheets.
TAIYO YUDEN has the line-up of the products intended for
use in automotive electronic equipment, telecommunications
infrastructure and industrial equipment, or medical devices
classified as GHTF Classes A to C (Japan Classes I to III).
Therefore, when using our products for these equipment,
please check available applications specified in this catalog
or the individual product specification sheets and use the
corresponding products.
2. Equipment Requiring Inquiry
Please be sure to contact TAIYO YUDEN for further information
before using the products listed in this catalog for the following
equipment (excluding intended equipment as specified in this
catalog or the individual product specification sheets) which may
cause loss of human life, bodily injury, serious property damage
and/or serious public impact due to a failure or defect of the
products and/or malfunction attributed thereto.
(1) Transportation equipment (automotive powertrain control
system, train control system, and ship control system, etc.)
(2) Traffic signal equipment
(3) Disaster prevention equipment, crime prevention equipment
(4) Medical devices classified as GHTF Class C (Japan Class III)
(5) H i g h l y p u b l i c i n f o r m a t i o n n e t wo r k e q u i p m e n t , d a t a processing equipment (telephone exchange, and base
station, etc.)
(6) Any other equipment requiring high levels of quality and/or
reliability equal to the equipment listed above
3. Equipment Prohibited for Use
Please do not incorporate our products into the following
equipment requiring extremely high levels of safety and/or
reliability.
(1) Aerospace equipment (artificial satellite, rocket, etc.)
(2) Aviation equipment *1
(3) Medical devices classified as GHTF Class D (Japan Class IV),
implantable medical devices *2
4. Limitation of Liability
Please note that unless you obtain prior written consent of TAIYO
YUDEN, TAIYO YUDEN shall not be in any way responsible for
any damages incurred by you or third parties arising from use of
the products listed in this catalog for any equipment that is not
intended for use by TAIYO YUDEN, or any equipment requiring
inquiry to TAIYO YUDEN or prohibited for use by TAIYO YUDEN
as described above.
■ Safety Design
When using our products for high safety and/or reliability-required
equipment or circuits, please fully perform safety and/or reliability
evaluation. In addition, please install (i) systems equipped with
a protection circuit and a protection device and/or (ii) systems
equipped with a redundant circuit or other system to prevent an
unsafe status in the event of a single fault for a failsafe design to
ensure safety.
■ Intellectual Property Rights
Information contained in this catalog is intended to convey examples
of typical performances and/or applications of our products and is
not intended to make any warranty with respect to the intellectual
property rights or any other related rights of TAIYO YUDEN or any
third parties nor grant any license under such rights.
■ Limited Warranty
Please note that the scope of warranty for our products is limited to
the delivered our products themselves and TAIYO YUDEN shall not
be in any way responsible for any damages resulting from a failure
or defect in our products. Notwithstanding the foregoing, if there is
a written agreement (e.g., supply and purchase agreement, quality
assurance agreement) signed by TAIYO YUDEN and your company,
TAIYO YUDEN will warrant our products in accordance with such
agreement.
■ TAIYO YUDEN’s Official Sales Channel
The contents of this catalog are applicable to our products which are
purchased from our sales offices or authorized distributors (hereinafter
“TAIYO YUDEN’
s official sales channel”). Please note that the contents
of this catalog are not applicable to our products purchased from any
seller other than TAIYO YUDEN’
s official sales channel.
■ Caution for Export
Some of our products listed in this catalog may require specific
procedures for export according to“U.S. Export Administration
Regulations”,“Foreign Exchange and Foreign Trade Control Law”
of Japan, and other applicable regulations. Should you have any
questions on this matter, please contact our sales staff.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
2
21
for High Quality Equipment
for High Quality Equipment
APPLICATION GUIDE
Industrial
Application
Guide
Industrial
Application
Guide
INDUSTRIAL
APPLICATION
GUIDEAPPLICATION
APPLICATION
GUIDE
INDUSTRIAL
The products described as“For Telecommunications Infrastructure and Industrial Equipment”in this
catalog are intended for use in the equipment shown in the below table as its typical example. Therefore,
when using our products for these equipment, please check it carefully by referring to the part number
or the individual product specification sheets and use the corresponding products. Should you have any
questions on this matter, please contact us.
Category
Telecommunications Infrastructure and Industrial Equipment (Typical Example)
Telecommunications
Infrastructure
・Base Station
・Optical Transceiver
・Router/Switch (Carrier-Grade)
・UPS (Uninterruptible Power Supply), etc.
Factory Automation
・PLC (Programmable Logic Controller)
・Servomotor/Servo Driver
・Industry Robot, etc.
・Gas Meter
・Water Meter
GUIDE
・Flow Meter
・Pressure Gauge Meter
・Magnetometer
・Thermometer, etc.
Measurement
Electric Power Apparatus
・Power Conditioner (Solar Power System)
・Smart Meter
・GFCI (Ground Fault Circuit Interrupter)
・Electric Vehicle Charging Station, etc.
■ Part Numbering System
Multilayer Ceramic Capacitors：
8
①
②
③
④
⑤
⑥
⑦
⑧
⑨
⑩
⑪
⑫
⑬
⑭
⑮
⑯
⑰
If the 15th code from the left is“8”
, it indicates“For Telecommunications Infrastructure and Industrial
Equipment”or“For Medical Devices”
.
Inductors：
8
If the 1st code from the right is“8”regardless of the total digit number, it indicates“For
Telecommunications Infrastructure and Industrial Equipment”or“For Medical Devices”.
Because there are some exceptions, for details please refer to each page of this catalog where the
part numbering system of each product is described.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
16
4
20
21
High
QualityEquipment
Equipment
forfor
High
Quality
Japan
Classification according to the PMD Act of Japan
(based on the GHTF Rules)
U.S.A.
FDA Classification
Coverage of
those Classes by
TAIYO YUDEN
Products
Low
High
Class I
General
Medical Devices
(GHTF Class A)
Class II
Class III
Controlled
Medical Devices
(GHTF Class B)
Medical devices with
extremely low risk to the
human body in case of
problems
Medical devices with
relatively low risk to the
human body in case of
problems
[Ex.]
[Ex.]
・Electronic Thermometer
・Electronic Blood Pressure
・In Vitro Diagnostic Devices
・Nebulizer
・Blood Gas Analyzer
・Plethysmographs
・Breathing Sensor
・AC-powered Operating Table
・Surgical Light
・Cholesterol Analysis Device
・Blood Type Analysis Device,
etc.
Class IV
Specially-controlled
Medical Devices
(GHTF Class C)
Specially-controlled
Medical Devices
(GHTF Class D)
Medical devices highly
invasive to patients and
with life-threatening risk in
case of problems
Medical devices with
relatively high risk to the
human body in case of
problems
[Ex.]
・Dialysis Machine
・Radiation Therapy Equipment
・Infusion Pump
Gauge
・Respirator
・Electronic Endoscope
・Glucose Monitoring System
・Hearing Aid
・AED (Automated External
・Electrocardiograph
Defibrillator)
・MRI
・Ultrasonic Diagnostic System ・Skin Laser Scanner
・Diagnostic Imaging Equipment ・Electric Surgical Unit
・X-ray Diagnostic Equipment ・Insulin Pump, etc.
・Central Monitor
・Pulse Oximeter, etc.
Class I
Class II
[Ex.]
・Cardiac Pacemaker
・Video Flexible Angioscope
・Implantable Infusion Pump
・Cardiac Electrosurgical Unit
・Inspection Device with
Cardiac Catheter
・Defibrillator, etc.
MEDICAL
MEDICAL APPLICATION
GUIDEAPPLICATION GUIDE
Risk Level
APPLICATION GUIDE
The products described as“For Medical Devices”in this catalog are intended for use in the medical
devices classified as GHTF Classes A to C (Japan Classes I to III) except for all medical devices classified
as GHTF Class D (Japan Class IV) and implantable medical devices (bone-anchored hearing aid, artificial
retina system, and external unit which is connected to internal unit which is implanted in a body, etc.).
Therefore, when using our products for these medical devices, please check it carefully by referring to the
part number or the individual product specification sheets and use the corresponding products. Should
you have any questions on this matter, please contact us.
APPLICATION GUIDE
Medical
Application
GuideGuide
Medical
Application
Class III
General Controls
General Controls and
Special Controls
General Controls and
Premarket Approval
Medical devices without the possibility
of causing serious injury or harm
to the patient or user even if there
is a defect or malfunction in such
medical devices
Medical devices with the possibility
of causing injury or harm to the
patient or user if there is a defect or
malfunction in such medical devices
Medical devices with the possibility
of causing serious injury, disability
or death to the patient or user if a
defect or malfunction occurs in such
medical devices
Product Series for Medical Devices
*Note: It is prohibited that our products are used in some medical devices such as
implantable medical devices even if such medical devices are classified as GHTF
Class C (Japan Class III).
N/A
▶ This
▶ This catalog contains the typical specification
specification only due to the limitation of space. When
space. When you consider the purchase of our products, please check our product specification
specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
20
21
17
5
for High Quality Equipment
MULTILAYER CERAMIC CAPACITORS
MULTILAYER CERAMIC CAPACITORS
REFLOW
AEC-Q200
■PART NUMBER
J M K
① ② ③
CERAMIC
CAPACITORS
INDL
3
1 6
④
For Telecommunications Infrastructure and Industrial Equipment / Medical Devices
MULTILAYER CERAMIC CAPACITORS
①Rated voltage
Code
A
J
L
E
T
G
U
H
Q
S
②Series name
Code
M
V
W
△
⑤
B
J
1
⑥
0 6
⑦
③End termination
Code
End termination
K
Plated
J
Soft Termination
S
Cu Internal Electrodes (For High Frequency)
F
High Reliability Application
R
High Reliability Application
(Cu External Electrodes)
Rated voltage［VDC］
4
6.3
10
16
25
35
50
100
250
630
④Dimension（L×W）
Dimensions
（L×W）［mm］
063
0.6 × 0.3
1.0 × 0.5
105
0.52× 1.0 ※
1.6 × 0.8
107
0.8 × 1.6 ※
2.0 × 1.25
212
1.25× 2.0 ※
316
3.2 × 1.6
325
3.2 × 2.5
432
4.5 × 3.2
Note : ※LW reverse type（□WK） only
Type
Series name
Multilayer ceramic capacitor
Multilayer ceramic capacitor for high frequency
LW reverse type multilayer capacitor
⑤Dimension tolerance
Code
Type
△
ALL
063
105
107
A
212
L［mm］
Standard
W［mm］
Standard
0.6±0.05
1.0±0.10
1.6＋0.15/－0.05
0.3±0.05
0.5±0.10
0.8＋0.15/－0.05
2.0＋0.15/－0.05
1.25＋0.15/－0.05
316
325
105
107
3.2±0.20
3.2±0.30
1.0＋0.15/－0.05
1.6＋0.20/－0
1.6±0.20
2.5±0.30
0.5＋0.15/－0.05
0.8＋0.20/－0
212
2.0＋0.20/－0
1.25＋0.20/－0
C
316
105
107
212
212
3.2±0.30
1.0＋0.20/－0
1.6＋0.25/－0
2.0＋0.25/－0
2.0±0.15
1.6±0.30
0.5＋0.20/－0
0.8＋0.25/－0
1.25＋0.25/－0
1.25±0.15
K
316
3.2±0.20
1.6±0.20
B
325
△＝Blank space
M L H T △
⑧ ⑨ ⑩ ⑪ ⑫
0201
0402
0204
0603
0306
0805
0508
1206
1210
1812
T［mm］
Standard
0.3±0.05
0.5±0.10
0.8＋0.15/－0.05
0.85±0.10
1.25＋0.15/－0.05
1.6±0.20
2.5±0.30
0.5＋0.15/－0.05
0.8＋0.20/－0
0.85±0.10
1.25＋0.20/－0
1.6±0.30
0.5＋0.20/－0
0.8＋0.25/－0
1.25＋0.25/－0
0.85±0.15
1.15±0.20
1.6±0.20
2.5±0.30
3.2±0.50
2.5±0.30
Note: ｃｆ. STANDARD EXTERNAL DIMENSIONS
⑥Temperature characteristics code
■High dielectric type
Applicable
Temperature
Code
standard
range［℃］
EIA（inch）
△= Blank space
Ref. Temp.［℃］
Capacitance change
BJ
EIA
X5R
－55～＋ 85
25
±15％
C6
EIA
X6S
－55～＋105
25
±22％
B7
EIA
X7R
－55～＋125
25
±15％
C7
EIA
X7S
－55～＋125
25
±22％
D7
EIA
X7T
－55～＋125
25
＋22％/－33％
Capacitance
tolerance
±10％
±20％
±10％
±20％
±10％
±20％
±10％
±20％
±10％
±20％
Tolerance
code
K
M
K
M
K
M
K
M
K
M
hq_c_mlcc_e-E09R01.docx
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
32
21
for High Quality Equipment
■Temperature compensating type
Applicable
Code
standard
JIS
Temperature
range［℃］
CG
CG
Ref. Temp.［℃］
20
－55～＋125
EIA
25
Nominal capacitance
Capacitance tolerance
±0.05pF
±0.1pF
±0.25pF
±0.5pF
±2％
±5％
±10％
±20％
Thickness［mm］
0.3
0.5
0.7(107type or more)
0.8
0.85(212type or more)
1.15
1.25
1.6
1.9
2.5
⑩Special code
Code
H
8
⑪Packaging
Code
F
R
T
Special code
Standard
MLCC for Automotive
MLCC for Telecommunications infrastructure
and Industrial equipment / Medical devices
Packaging
φ178mm Taping （2mm pitch）
φ178mm Embossed Taping （4mm pitch）
φ178mm Taping （4mm pitch）
φ178mm Taping （4mm pitch, 1000 pcs/reel）
325 type（Thickness code M）
P
⑫Internal code
Code
△
Internal code
Standard
INDL
For Telecommunications Infrastructure and Industrial Equipment / Medical Devices
0.5pF
1pF
10pF
100pF
1,000pF
0.01μF
0.1μF
1.0μF
10μF
100μF
⑨Thickness
Code
P
T
V
C
A
D
F
G
L
N
M
Tolerance
code
B
C
D
F
G
J
MULTILAYER CERAMIC CAPACITORS
⑧Capacitance tolerance
Code
A
B
C
D
G
J
K
M
C0G
0±30ppm/℃
Capacitance
tolerance
±0.1pF
±0.25pF
±0.5pF
±1pF
±2％
±5％
CERAMIC
CAPACITORS
⑦Nominal capacitance
Code
（example）
0R5
010
100
101
102
103
104
105
106
107
Note : R＝Decimal point
Capacitance change
hq_c_mlcc_e-E09R01.docx
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
21
33
for High Quality Equipment
■STANDARD EXTERNAL DIMENSIONS
W
2.0±0.10
(0.079±0.004)
1.25±0.15
(0.049±0.006)
Dimension [mm] （inch）
W
T
0.3±0.03
0.3±0.03
(0.012±0.001)
(0.012±0.001)
0.5±0.05
0.5±0.05
(0.020±0.002)
(0.020±0.002)
1.0±0.05
0.3±0.05
(0.039±0.002)
(0.012±0.002)
0.8±0.10
0.8±0.10
(0.031±0.004)
(0.031±0.004)
0.8±0.10
0.8±0.10
(0.031±0.004)
(0.031±0.004)
0.8±0.10
0.7±0.10
(0.031±0.004)
(0.028±0.004)
1.6±0.10
0.5±0.05
(0.063±0.004)
(0.020±0.002)
0.85±0.10
(0.033±0.004)
1.25±0.10
(0.049±0.004)
1.25±0.10
(0.049±0.004)
0.85±0.10
(0.033±0.004)
1.25±0.10
(0.049±0.004)
1.25±0.10
(0.049±0.004)
1.25±0.10
0.85±0.10
(0.049±0.004)
(0.033±0.004)
2.0±0.15
0.85±0.10
(0.079±0.006)
(0.033±0.004)
□MK316（1206）
□MF316（1206）
3.2±0.15
(0.126±0.006)
1.6±0.15
(0.063±0.006)
□MJ316（1206）
3.2±0.15
(0.126±0.006)
1.6±0.15
(0.063±0.006)
Type( EIA )
L
T
□MK063（0201）
□MK105（0402）
□MF105（0402）
e
□WK105（0204）※
□MK107（0603）
□MF107（0603）
CERAMIC
CAPACITORS
L
□MJ107（0603）
W
□VS107（0603）
□WK107（0306）※
L
0.6±0.03
(0.024±0.001)
1.0±0.05
(0.039±0.002)
0.52±0.05
(0.020±0.002)
1.6±0.10
(0.063±0.004)
1.6±0.10
(0.063±0.004)
1.6±0.10
(0.063±0.004)
0.8±0.10
(0.031±0.004)
T
INDL
e
□MK212（0805）
□MF212（0805）
2.0±0.10
(0.079±0.004)
□MJ212（0805）
2.0±0.10
(0.079±0.004)
※ LW reverse type
For Telecommunications Infrastructure and Industrial Equipment / Medical Devices
MULTILAYER CERAMIC CAPACITORS
□VS212（0805）
□WK212（0508）※
□MK325（1210）
□MF325（1210）
□MJ325（1210）
3.2±0.30
(0.126±0.012)
3.2±0.30
(0.126±0.012)
2.5±0.20
(0.098±0.008)
2.5±0.20
(0.098±0.008)
4.5±0.40
3.2±0.30
□MK432（1812）
(0.177±0.016)
(0.126±0.012)
Note : ※. LW reverse type, *1.Thickness code
*1
T
V
P
A
A
C
V
D
G
D
G
D
D
1.15±0.10
(0.045±0.004)
Ｆ
1.6±0.20
(0.063±0.008)
L
1.15±0.10
(0.045±0.004)
Ｆ
1.6±0.20
(0.063±0.008)
1.15±0.10
(0.045±0.004)
1.9±0.20
(0.075±0.008)
2.5±0.20
(0.098±0.008)
1.9±0.20
(0.075±0.008)
2.5±0.20
(0.098±0.008)
2.5±0.20
(0.098±0.008)
L
e
0.15±0.05
(0.006±0.002)
0.25±0.10
(0.010±0.004)
0.18±0.08
(0.007±0.003)
0.35±0.25
(0.014±0.010)
0.35＋0.3/－0.25
(0.014＋0.012/－0.010)
0.35±0.25
(0.014±0.010)
0.25±0.15
(0.010±0.006)
0.5±0.25
(0.020±0.010)
0.5＋0.35/－0.25
（0.020＋0.014/－0.010）
0.5±0.25
(0.020±0.010)
0.3±0.2
(0.012±0.008)
0.5＋0.35/－0.25
（0.020＋0.014/－0.010）
0.6＋0.4/－0.3
（0.024＋0.016/－0.012）
F
N
0.6±0.3
(0.024±0.012)
M
N
M
M
0.6＋0.4/－0.3
（0.024＋0.016/－0.012）
0.9±0.6
(0.035±0.024)
hq_c_mlcc_e-E09R01.docx
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
34
21
for High Quality Equipment
■STANDARD QUANTITY
Type
063
105
107
EIA（inch）
0201
0402
0204 ※
0603
212
0805
0508 ※
316
1206
325
1210
0.8
Standard quantity［pcs］
Paper tape
Embossed tape
15000
－
10000
－
4000
－
A
3000
（Soft Termination）
－
0.8
A
－
0.50
0.85
1.25
V
D
G
－
4000
－
1.25
G
－
0.85
1.15
1.6
1.15
1.9
2.5
2.5
D
F
L
F
N
M
M
4000
－
－
3000
（Soft Termination）
4000
－
3000
2000
（Soft Termination）
－
3000
2000
－
2000
－
－
500（T），1000（P）
500
INDL
For Telecommunications Infrastructure and Industrial Equipment / Medical Devices
MULTILAYER CERAMIC CAPACITORS
432
1812
Note : ※.LW Reverse type（□WK）
Code
T
V
P
C
A
CERAMIC
CAPACITORS
0306 ※
Dimension
［ｍｍ］
0.3
0.5
0.30
0.7
0.8
hq_c_mlcc_e-E09R01.docx
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
21
35
for High Quality Equipment
■PART NUMBER
・ All the Multilayer Ceramic Capacitors of the catalog lineup are RoHS compliant.
・ Capacitance tolerance code is applied to [] of part number.
・ All the Multilayer Ceramic Capacitors in the catalog lineup are applicable for reflow-soldering.
Notes)
・ The exchange of individual specifications is necessary depending on your application and/or circuit condition. Please contact TAIYO YUDEN's official sales channel.
・ The products are for Telecommunications infrastructure and Industrial equipment and for Medical devices.
Please consult with TAIYO YUDEN's official sales channel for the details of the product specifications, etc.,
and please review and approve the product specifications before ordering.
Please be sure to contact us for further information in advance when the products are used for automotive electronic equipment.
・ *1: For standard case size, please kindly refer to ④Dimension, ⑤Dimension tolerance, ⑨Thickness and STANDARD EXTERNAL DIMENSIONS.
CERAMIC
CAPACITORS
INDL
Multilayer Ceramic Capacitors (High dielectric type)
●063TYPE (Demension:0.6×0.3mm JIS:1005 EIA:0402）
【Temperature Characteristic B7 : X7R（－55～＋125℃）】 0.3mm thickness（P）
Part number 1
For Telecommunications Infrastructure and Industrial Equipment / Medical Devices
MULTILAYER CERAMIC CAPACITORS(HIGH DIELECTRIC TYPE)
TMK063 B7101[]P8FE
TMK063 B7151[]P8FE
TMK063 B7221[]P8FE
TMK063 B7331[]P8FE
TMK063 B7471[]P8FE
TMK063 B7102[]P8FE
TMK063 B7152[]P8FE
TMK063 B7222[]P8FE
TMK063 B7332[]P8FE
EMK063 B7101[]P8FE
EMK063 B7151[]P8FE
EMK063 B7221[]P8FE
EMK063 B7331[]P8FE
EMK063 B7471[]P8FE
EMK063 B7102[]P8FE
EMK063 B7152[]P8FE
EMK063 B7222[]P8FE
EMK063 B7332[]P8FE
LMK063 B7101[]P8FE
LMK063 B7151[]P8FE
LMK063 B7221[]P8FE
LMK063 B7331[]P8FE
LMK063 B7471[]P8FE
LMK063 B7102[]P8FE
LMK063 B7152[]P8FE
LMK063 B7222[]P8FE
LMK063 B7332[]P8FE
LMK063 B7472[]P8FE
LMK063 B7682[]P8FE
LMK063 B7103[]P8FE
Part number 2
Rated voltage
[V]
25
16
10
Temperature
characteristics
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
100
150
220
330
470
1000
1500
2200
3300
100
150
220
330
470
1000
1500
2200
3300
100
150
220
330
470
1000
1500
2200
3300
4700
6800
10000
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
3.5
3.5
3.5
3.5
3.5
5
5
5
5
3.5
3.5
3.5
3.5
3.5
5
5
5
5
3.5
3.5
3.5
3.5
3.5
5
5
5
5
5
5
5
p
p
p
p
p
p
p
p
p
p
p
p
p
p
p
p
p
p
p
p
p
p
p
p
p
p
p
p
p
p
HTLT
Rated voltage x ％
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
*1
Thickness
[mm]
Note
0.3±0.03
0.3±0.03
0.3±0.03
0.3±0.03
0.3±0.03
0.3±0.03
0.3±0.03
0.3±0.03
0.3±0.03
0.3±0.03
0.3±0.03
0.3±0.03
0.3±0.03
0.3±0.03
0.3±0.03
0.3±0.03
0.3±0.03
0.3±0.03
0.3±0.03
0.3±0.03
0.3±0.03
0.3±0.03
0.3±0.03
0.3±0.03
0.3±0.03
0.3±0.03
0.3±0.03
0.3±0.03
0.3±0.03
0.3±0.03
hq_c_mlcc_INDL_e-E09R01.xlsx
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
36
21
for High Quality Equipment
■PART NUMBER
●105TYPE (Demension:1.0×0.5mm JIS:1005 EIA:0402）
【Temperature Characteristic BJ : X5R（－55～＋85℃）】 0.5mm thickness（V）
Part number 1
Part number 2
50
25
6.3
4
Capacitance
tolerance [％]
tanδ
[％]
470
1000
1500
2200
3300
4700
6800
0.01
0.022
0.047
0.1
4700
6800
0.01
0.015
0.022
0.033
0.047
0.1
0.22
0.47
0.1
0.22
0.47
1
0.22
0.47
1
2.2
0.47
1
2.2
4.7
2.2
4.7
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±20
±10, ±20
±20
2.5
2.5
2.5
2.5
2.5
2.5
2.5
3.5
5
5
10
2.5
2.5
3.5
3.5
3.5
3.5
3.5
5
10
10
5
10
10
10
5
10
10
10
10
10
10
10
10
10
p
p
p
p
p
p
p
μ
μ
μ
μ
p
p
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
HTLT
Rated voltage x ％
200
200
200
200
200
200
150
200
200
200
150
200
200
200
200
200
150
150
150
150
150
150
150
150
150
150
150
150
150
150
150
150
150
150
150
*1
Thickness
[mm]
Note
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.10
0.5±0.05
0.5±0.05
0.5±0.10
0.5±0.05
0.5±0.05
0.5±0.10
0.5±0.05
0.5±0.10
0.5±0.05
0.5±0.05
0.5±0.05
0.5+0.15/-0.05
0.5±0.05
0.5+0.15/-0.05
INDL
【Temperature Characteristic B7 : X7R（－55～＋125℃）, D7 : X7T（－55～＋125℃）】 0.5mm thickness（V）
Part number 1
UMK105 B7221[]V8F
UMK105 B7331[]V8F
UMK105 B7471[]V8F
UMK105 B7681[]V8F
UMK105 B7102[]V8F
UMK105 B7152[]V8F
UMK105 B7222[]V8F
UMK105 B7332[]V8F
UMK105 B7472[]V8F
UMK105 B7682[]V8F
UMK105 B7103[]V8F
UMK105 B7153[]V8FE
UMK105 B7223[]V8F
UMK105 B7333[]V8FE
UMK105 B7473[]V8F
UMK105 B7104[]V8F
TMK105 B7472[]V8F
TMK105 B7682[]V8F
TMK105 B7103[]V8F
TMK105 B7153[]V8F
TMK105 B7223[]V8F
TMK105 B7333[]V8F
TMK105 B7473[]V8F
TMK105 B7104[]V8F
EMK105 B7103[]V8F
EMK105 B7153[]V8F
EMK105 B7223[]V8F
EMK105 B7333[]V8F
EMK105 B7473[]V8F
EMK105 B7104[]V8F
EMK105 B7224[]V8F
LMK105 B7473[]V8F
LMK105 B7104[]V8F
LMK105 B7224[]V8F
JMK105 B7104[]V8F
JMK105 B7224[]V8F
JMK105 B7474[]V8F
JMK105CD7105[]V8F
AMK105 B7474[]V8F
Part number 2
Rated voltage
[V]
50
25
16
10
6.3
4
Temperature
characteristics
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7T
X7R
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
220
330
470
680
1000
1500
2200
3300
4700
6800
0.01
0.015
0.022
0.033
0.047
0.1
4700
6800
0.01
0.015
0.022
0.033
0.047
0.1
0.01
0.015
0.022
0.033
0.047
0.1
0.22
0.047
0.1
0.22
0.1
0.22
0.47
1
0.47
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
3.5
3.5
10
3.5
10
10
2.5
2.5
3.5
3.5
3.5
3.5
3.5
10
3.5
3.5
3.5
3.5
3.5
5
10
3.5
5
10
5
10
10
10
10
p
p
p
p
p
p
p
p
p
p
μ
μ
μ
μ
μ
μ
p
p
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
HTLT
Rated voltage x ％
200
200
200
200
200
200
200
200
150
150
150
200
200
150
200
150
200
200
200
150
150
150
150
150
200
150
150
150
150
150
150
150
150
150
150
150
150
150
150
Thickness*1 [mm]
Note
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5+0.2/-0
0.5±0.05
For Telecommunications Infrastructure and Industrial Equipment / Medical Devices
10
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
Capacitance
[F]
MULTILAYER CERAMIC CAPACITORS(HIGH DIELECTRIC TYPE)
16
Temperature
characteristics
CERAMIC
CAPACITORS
UMK105 BJ471[]V8F
UMK105 BJ102[]V8F
UMK105 BJ152[]V8F
UMK105 BJ222[]V8F
UMK105 BJ332[]V8F
UMK105 BJ472[]V8F
UMK105 BJ682[]V8F
UMK105 BJ103[]V8F
UMK105 BJ223[]V8F
UMK105 BJ473[]V8F
UMK105 BJ104[]V8F
TMK105 BJ472[]V8F
TMK105 BJ682[]V8F
TMK105 BJ103[]V8F
TMK105 BJ153[]V8F
TMK105 BJ223[]V8F
TMK105 BJ333[]V8F
TMK105 BJ473[]V8F
TMK105 BJ104[]V8F
TMK105 BJ224[]V8F
TMK105ABJ474[]V8F
EMK105 BJ104[]V8F
EMK105 BJ224[]V8F
EMK105ABJ474[]V8F
EMK105 BJ105[]V8F
LMK105 BJ224[]V8F
LMK105ABJ474[]V8F
LMK105 BJ105[]V8F
LMK105ABJ225[]V8F
JMK105 BJ474[]V8F
JMK105 BJ105[]V8F
JMK105 BJ225[]V8F
JMK105BBJ475MV8F
AMK105 BJ225[]V8F
AMK105BBJ475MV8F
Rated voltage
[V]
hq_c_mlcc_INDL_e-E09R01.xlsx
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
21
37
for High Quality Equipment
■PART NUMBER
●107TYPE (Dimension:1.6×0.8mm JIS:1608 EIA:0603）
【Temperature Characteristic BJ : X5R（－55～＋85℃）】 0.8mm thickness（A）
Part number 1
CERAMIC
CAPACITORS
INDL
Part number 2
UMK107 BJ224[]A8T
UMK107 BJ474[]A8T
UMK107ABJ105[]A8T
GMK107 BJ224[]A8T
GMK107ABJ474[]A8T
GMK107 BJ105[]A8T
TMK107 BJ224[]A8T
TMK107 BJ474[]A8T
TMK107 BJ105[]A8T
TMK107BBJ225[]A8T
EMK107 BJ105[]A8T
EMK107ABJ225[]A8T
EMK107BBJ475[]A8T
LMK107 BJ225[]A8T
LMK107 BJ475[]A8T
LMK107BBJ106MA8T
JMK107 BJ475[]A8T
JMK107ABJ106[]A8T
AMK107ABJ106[]A8T
AMK107BBJ226MA8T
Rated voltage
[V]
50
35
25
16
10
6.3
4
Temperature
characteristics
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
0.22
0.47
1
0.22
0.47
1
0.22
0.47
1
2.2
1
2.2
4.7
2.2
4.7
10
4.7
10
10
22
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±20
±10, ±20
±10, ±20
±10, ±20
±20
10
10
10
10
10
10
5
3.5
10
10
5
10
10
10
10
10
10
10
10
10
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
HTLT
Rated voltage x ％
150
150
150
150
150
150
150
150
150
150
150
150
150
150
150
150
150
150
150
150
Thickness*1 [mm]
Note
0.8±0.10
0.8±0.10
0.8+0.15/-0.05
0.8±0.10
0.8+0.15/-0.05
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8+0.20/-0
0.8±0.10
0.8+0.15/-0.05
0.8+0.20/-0
0.8±0.10
0.8±0.10
0.8+0.20/-0
0.8±0.10
0.8+0.15/-0.05
0.8+0.15/-0.05
0.8+0.20/-0
For Telecommunications Infrastructure and Industrial Equipment / Medical Devices
MULTILAYER CERAMIC CAPACITORS(HIGH DIELECTRIC TYPE)
【Temperature Characteristic B7 : X7R（－55～＋125℃）, C7 : X7S（－55～＋125℃）, D7 : X7T（－55～＋125℃）】 0.8mm thickness（A）
Part number 1
UMK107AC7154[]A8TE
UMK107 C7224[]A8TE
GMK107 B7224[]A8T
GMK107 B7474[]A8T
GMK107AB7105[]A8T
TMK107 B7224[]A8T
TMK107 B7474[]A8T
TMK107AB7105[]A8T
EMK107 B7224[]A8T
EMK107 B7474[]A8T
EMK107 B7105[]A8T
LMK107 B7474[]A8T
LMK107 B7105[]A8T
LMK107BD7225[]A8T
JMK107 B7105[]A8T
JMK107 B7225[]A8TR
Part number 2
Rated voltage
[V]
50
35
25
16
10
6.3
Temperature
characteristics
X7S
X7S
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7T
X7R
X7R
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
0.15
0.22
0.22
0.47
1
0.22
0.47
1
0.22
0.47
1
0.47
1
2.2
1
2.2
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
3.5
3.5
10
10
10
10
10
10
5
10
10
3.5
10
10
10
10
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
HTLT
Rated voltage x ％
150
150
150
150
150
150
150
150
150
150
150
150
150
200
150
150
Thickness*1 [mm]
Note
0.8+0.15/-0.05
0.8±0.10
0.8±0.10
0.8±0.10
0.8+0.15/-0.05
0.8±0.10
0.8±0.10
0.8+0.15/-0.05
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8+0.20/-0
0.8±0.10
0.8±0.10
hq_c_mlcc_INDL_e-E09R01.xlsx
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
38
21
for High Quality Equipment
■PART NUMBER
●212TYPE (Dimension:2.0×1.25mm JIS:2012 EIA:0805）
【Temperature Characteristic BJ : X5R（－55～＋85℃）】 1.25mm thickness（G）
Part number 1
Part number 2
50
35
25
16
10
6.3
4
Temperature
characteristics
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
0.47
1
1
2.2
2.2
4.7
10
2.2
4.7
10
4.7
10
10
22
47
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±20
±20
3.5
5
5
10
5
10
10
5
10
10
10
10
10
10
10
Capacitance
tolerance [％]
tanδ
[％]
±10, ±20
±10, ±20
5
10
Capacitance
tolerance [％]
tanδ
[％]
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
HTLT
Thickness*1 [mm]
Rated voltage x ％
150
1.25±0.10
150
1.25±0.10
150
1.25±0.10
150
1.25+0.20/-0
150
1.25±0.10
150
1.25+0.20/-0
150
1.25+0.20/-0
150
1.25±0.10
150
1.25+0.15/-0.05
150
1.25+0.20/-0
150
1.25+0.15/-0.05
150
1.25+0.15/-0.05
150
1.25+0.15/-0.05
150
1.25+0.20/-0
150
1.25+0.20/-0
Note
CERAMIC
CAPACITORS
UMK212 BJ474[]G8T
UMK212 BJ105[]G8T
GMK212 BJ105[]G8T
GMK212BBJ225[]G8T
TMK212 BJ225[]G8T
TMK212BBJ475[]G8T
TMK212BBJ106[]G8T
EMK212 BJ225[]G8T
EMK212ABJ475[]G8T
EMK212BBJ106[]G8T
LMK212ABJ475[]G8T
LMK212ABJ106[]G8T
JMK212ABJ106[]G8T
JMK212BBJ226MG8T
AMK212BBJ476MG8T
Rated voltage
[V]
【Temperature Characteristic BJ : X5R（－55～＋85℃）】 0.85mm thickness（D）
Part number 1
Part number 2
16
Capacitance
[F]
X5R
X5R
2.2 μ
4.7 μ
HTLT
Rated voltage x ％
150
150
Thickness*1 [mm]
Note
0.85±0.10
0.85±0.10
【Temperature Characteristic B7 : X7R（－55～＋125℃）】 1.25mm thickness（G）
Part number 1
UMK212 B7473[]G8T
UMK212 B7683[]G8T
UMK212 B7104[]G8T
UMK212BB7154[]G8TE
UMK212 B7224[]G8T
UMK212BC7334[]G8TE
UMK212 C7474[]G8TE
UMK212CC7684[]G8TE
UMK212 B7105[]G8T
GMK212 B7105[]G8T
TMK212 B7474[]G8T
TMK212 B7105[]G8TR
TMK212 B7225[]G8T
EMK212 B7105[]G8TR
EMK212 B7225[]G8T
EMK212AB7475[]G8T
LMK212 B7225[]G8T
LMK212 B7475[]G8T
JMK212 B7475[]G8T
JMK212AB7106[]G8T
Part number 2
Rated voltage
[V]
50
35
25
16
10
6.3
Temperature
characteristics
X7R
X7R
X7R
X7R
X7R
X7S
X7S
X7S
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
Capacitance
[F]
0.047
0.068
0.1
0.15
0.22
0.33
0.47
0.68
1
1
0.47
1
2.2
1
2.2
4.7
2.2
4.7
4.7
10
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
10
10
3.5
10
10
10
10
10
10
10
10
10
HTLT
Thickness*1 [mm]
Rated voltage x ％
200
1.25±0.10
200
1.25±0.10
200
1.25±0.10
200
1.25+0.20/-0
150
1.25±0.10
150
1.25+0.20/-0
150
1.25±0.10
150
1.25+0.25/-0
150
1.25±0.10
150
1.25±0.10
150
1.25±0.10
150
1.25±0.10
150
1.25±0.10
150
1.25±0.10
150
1.25±0.10
150
1.25+0.15/-0.05
150
1.25±0.10
150
1.25±0.10
150
1.25±0.10
150
1.25+0.15/-0.05
Note
INDL
For Telecommunications Infrastructure and Industrial Equipment / Medical Devices
Temperature
characteristics
MULTILAYER CERAMIC CAPACITORS(HIGH DIELECTRIC TYPE)
EMK212ABJ225[]D8T
EMK212BBJ475[]D8T
Rated voltage
[V]
hq_c_mlcc_INDL_e-E09R01.xlsx
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
21
39
for High Quality Equipment
■PART NUMBER
●316TYPE (Dimension:3.2×1.6mm JIS:3216 EIA:1206）
【Temperature Characteristic BJ : X5R（－55～＋85℃）】 1.6mm thickness（L）
Part number 1
Part number 2
CERAMIC
CAPACITORS
UMK316 BJ225[]L8T
UMK316ABJ475[]L8T
GMK316 BJ225[]L8T
GMK316 BJ475[]L8T
GMK316BBJ106[]L8T
TMK316 BJ475[]L8T
TMK316 BJ106[]L8T
EMK316 BJ475[]L8T
EMK316 BJ106[]L8T
EMK316BBJ226ML8T
LMK316ABJ226[]L8T
JMK316ABJ476ML8T
JMK316BBJ107ML8T
AMK316ABJ107ML8T
Rated voltage
[V]
50
35
25
16
10
6.3
4
Temperature
characteristics
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
Capacitance
[F]
2.2
4.7
2.2
4.7
10
4.7
10
4.7
10
22
22
47
100
100
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
Capacitance
tolerance [％]
tanδ
[％]
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±20
±10, ±20
±20
±20
±20
10
10
10
10
10
5
5
5
5
10
10
10
10
10
HTLT
Rated voltage x ％
150
150
150
150
150
150
150
150
150
150
150
150
150
150
Thickness*1 [mm]
Note
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.30
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.30
1.6±0.20
1.6±0.20
1.6±0.30
1.6±0.20
【Temperature Characteristic B7 : X7R（－55～＋125℃）, C7 : X7S（－55～＋125℃）】 1.6mm thickness（L）
Part number 1
INDL
Part number 2
For Telecommunications Infrastructure and Industrial Equipment / Medical Devices
MULTILAYER CERAMIC CAPACITORS(HIGH DIELECTRIC TYPE)
UMK316 B7105[]L8T
UMK316BC7155[]L8TE
UMK316 B7225[]L8T
UMK316AC7475[]L8TE
GMK316 B7225[]L8T
GMK316AB7475[]L8T
TMK316AB7475[]L8T
TMK316AB7106[]L8T
EMK316AB7475[]L8T
EMK316AB7106[]L8T
LMK316AB7106[]L8T
JMK316AB7226[]L8T
AMK316AB7226[]L8T
AMK316AC7476ML8T
Rated voltage
[V]
50
35
25
16
10
6.3
4
Temperature
characteristics
X7R
X7S
X7R
X7S
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7S
Capacitance
[F]
1
1.5
2.2
4.7
2.2
4.7
4.7
10
4.7
10
10
22
22
47
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
Capacitance
tolerance [％]
tanδ
[％]
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±20
3.5
3.5
10
2.5
10
10
10
10
10
10
10
10
10
10
Capacitance
tolerance [％]
tanδ
[％]
±10, ±20
±10, ±20
±10, ±20
±20
±20
5
10
10
10
10
Capacitance
tolerance [％]
tanδ
[％]
±20
10
Capacitance
tolerance [％]
tanδ
[％]
HTLT
Rated voltage x ％
200
150
150
150
150
150
150
150
150
150
150
150
150
150
Thickness*1 [mm]
Note
1.6±0.20
1.6±0.30
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
●325TYPE (Dimension:3.2×2.5mm JIS:3225 EIA:1210）
【Temperature Characteristic BJ : X5R（－55～＋85℃）】 2.5mm thickness（M）
Part number 1
Part number 2
UMK325 BJ106[]M8P
EMK325ABJ476[]M8P
LMK325 BJ476[]M8P
LMK325ABJ107MM8P
AMK325ABJ227MM8P
Rated voltage
[V]
50
16
10
4
Temperature
characteristics
X5R
X5R
X5R
X5R
X5R
Capacitance
[F]
10
47
47
100
220
μ
μ
μ
μ
μ
HTLT
Rated voltage x ％
150
150
150
150
150
Thickness*1 [mm]
Note
2.5±0.20
2.5±0.30
2.5±0.20
2.5±0.30
2.5±0.30
【Temperature Characteristic C6 : X6S（－55～＋105℃）】 2.5mm thickness（M）
Part number 1
Part number 2
JMK325AC6107MM8P
Rated voltage
[V]
6.3
Temperature
characteristics
Capacitance
[F]
X6S
100 μ
HTLT
Rated voltage x ％
150
Thickness*1 [mm]
Note
2.5±0.30
【Temperature Characteristic B7 : X7R（－55～＋125℃）】 2.5mm thickness（M）
Part number 1
UMK325 B7475[]M8P
UMK325AB7106[]M8P
GMK325AB7106[]M8P
TMK325AB7106[]M8PR
TMK325 B7226[]M8P
EMK325 B7226[]M8P
LMK325 B7226[]M8P
JMK325 B7476[]M8PR
Part number 2
Rated voltage
[V]
50
35
25
16
10
6.3
Temperature
characteristics
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
Capacitance
[F]
4.7
10
10
10
22
22
22
47
μ
μ
μ
μ
μ
μ
μ
μ
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±20
±20
±20
±20
±20
±20
±20
±20
5
10
10
10
10
10
10
10
HTLT
Rated voltage x ％
150
150
150
150
150
150
150
150
Thickness*1 [mm]
Note
2.5±0.20
2.5±0.30
2.5±0.30
2.5±0.30
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
hq_c_mlcc_INDL_e-E09R01.xlsx
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
40
21
Multilayer Ceramic Capacitors
■PACKAGING
①Minimum Quantity
●Taped package
Thickness
Type(EIA)
□MK021(008004)
□VS021(008004)
□MK042(01005)
□VS042(01005)
□MK063(0201)
□WK105(0204) ※
□MK105(0402)
□MF105(0402)
□VK105(0402)
□MK107(0603)
□WK107(0306) ※
□MF107(0603)
□VS107(0603)
□MJ107(0603)
□MK212(0805)
□WK212(0508) ※
□MF212(0805)
□VS212(0805)
□MJ212(0805)
□MK316(1206)
□MF316(1206)
□MJ316(1206)
□MK325(1210)
□MF325(1210)
□MJ325(1210)
□MK432(1812)
Note : ※ LW Reverse type.
mm
code
0.125
K
0.2
0.2
0.3
0.3
0.13
0.18
0.2
0.3
0.5
0.5
0.45
0.5
0.8
0.7
0.8
0.45
0.85
1.25
0.85
0.85
1.25
0.85
1.15
1.6
1.15
1.6
0.85
1.15
1.9
2.0max.
2.5
1.9
2.5
2.5
C, D
C
P,T
P
H
E
C
P
V
W
K
V
A
C
A
K
D
G
D
D
G
D
F
L
F
L
D
F
N
Y
M
N
M
M
Standard quantity [pcs]
Paper tape
Embossed tape
－
50000
－
40000
15000
10000
－
－
20000
15000
10000
10000
4000
－
4000
4000
3000
－
－
20000
15000
－
－
－
－
－
4000
－
－
3000
4000
－
－
4000
4000
－
4000
－
－
－
－
3000
－
－
2000
－
3000
2000
3000
2000
－
2000
－
－
－
－
1000
2000
500(T), 1000(P)
500
②Taping material
※No bottom tape for pressed carrier tape
●Card board carrier tape
●Embossed tape
Top tape
Top tape
Base tape
Sprocket hole
Sprocket hole
Bottom tape
Chip cavity
Base tape
Chip cavity
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E06R01
Chip filled
Chip
※ LW Reverse type.
③Representative taping dimensions
●Paper Tape（8mm wide）
●Pressed carrier tape（ 2mm pitch）
Unit：mm（inch）
A
B
T
8.0±0.3
(0.315±0.012)
Sprocket hole
1.75±0.1
(0.069±0.004）
3.5±0.05
(0.138±0.002)
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
T1
2.0±0.05
(0.079±0.002)
F
4.0±0.1
(0.157±0.004)
Chip Cavity
Type(EIA)
Ａ
0.37
Insertion Pitch
Ｆ
Ｂ
0.67
□MK063(0201)
□WK105(0204) ※
0.65
1.15
□MK105(0402) （*1 C）
□MK105(0402) （*1 P）
Note *1 Thickness, C：0.2mm ,P：0.3mm. ※ LW Reverse type.
2.0±0.05
●Punched carrier tape （2mm pitch）
0.45max.
0.42max.
0.4max.
0.45max.
0.3max.
0.42max.
Unit：mm
T
8.0±0.3
(0.315±0.012)
B
2.0±0.05
(0.079±0.002)
1.75±0.1
(0.069±0.004）
3.5±0.05
(0.138±0.002)
A
F
T1
Unit：mm（inch）
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
Sprocket hole
Tape Thickness
Ｔ
4.0±0.1
(0.157±0.004)
Ａ
Chip Cavity
Ｂ
Insertion Pitch
Ｆ
Tape Thickness
Ｔ
0.65
1.15
2.0±0.05
0.8max.
Type(EIA)
□MK105 (0402)
□MF105 (0402)
□VK105 (0402)
Unit：mm
●Punched carrier tape （4mm pitch）
B
T
8.0±0.3
(0.315±0.012)
A
F
Unit：mm（inch）
1.75±0.1
(0.069±0.004）
3.5±0.05
(0.138±0.002)
Sprocket hole
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
4.0±0.1
(0.157±0.004)
2.0±0.1
(0.079±0.004)
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E06R01
Chip Cavity
Type(EIA)
Ａ
Insertion Pitch
Ｆ
Ｂ
□MK107(0603)
□WK107(0306) ※
1.0
1.8
□MF107(0603)
4.0±0.1
□MK212(0805)
1.65
2.4
□WK212(0508) ※
□MK316(1206)
2.0
3.6
Note：Taping size might be different depending on the size of the product. ※ LW Reverse type.
●Embossed tape（4mm wide）
Unit：mm
4.0±0.05
(0.157±0.002)
B
1.0±0.02
(0.039±0.001)
1.1max.
0.9±0.05
(0.035±0.002)
1.8±0.02
(0.071±0.001)
A
F
1.1max.
Unit：mm（inch）
φ0.8±0.04
(φ0.031±0.002)
Sprocket hole
Tape Thickness
Ｔ
2.0±0.04
(0.079±0.002)
Chip Cavity
Type(EIA)
□MK021(008004)
□VS021(008004)
□MK042(01005)
□VS042(01005)
Ａ
Ｂ
0.135
0.27
0.23
0.43
Insertion Pitch
Ｆ
K
Tape Thickness
T
1.0±0.02
0.5max.
0.25max.
Unit：mm
●Embossed tape（8mm wide）
Unit：mm（inch）
3.5±0.05
(0.138±0.002)
Sprocket hole
A
B
F
1.75±0.1
(0.069±0.004）
8.0±0.3
(0.315±0.012)
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
4.0±0.1
(0.157±0.004)
2.0±0.1
(0.079±0.004)
Type(EIA)
□MK105(0402)
□WK107(0306) ※
□MK212(0805)
□MF212(0805)
□MK316(1206)
□MF316(1206)
□MK325(1210)
□MF325(1210)
Note： ※ LW Reverse type.
Chip Cavity
Ａ
0.6
1.0
Ｂ
1.1
1.8
1.65
2.4
2.0
3.6
2.8
3.6
Insertion Pitch
Ｆ
2.0±0.1
4.0±0.1
Tape Thickness
K
0.6max
1.3max.
T
0.2±0.1
0.25±0.1
3.4max.
0.6max.
Unit：mm
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E06R01
●Embossed tape（12mm wide）
Unit：mm（inch）
5.5±0.05
(0.217±0.002)
Sprocket hole
A
B
4.0±0.1
(0.157±0.004)
12.0±0.3
(0.472±0.012)
1.75±0.1
(0.069±0.004）
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
2.0±0.1
(0.079±0.004)
F
Chip Cavity
Type(EIA)
Ａ
3.1
3.7
□MK325(1210)
□MK432(1812)
Ｂ
4.0
4.9
Insertion Pitch
Ｆ
8.0±0.1
8.0±0.1
K
4.0max.
4.0max.
Tape Thickness
E
2.0±0.5
T
0.6max.
0.6max.
Unit：mm
④Trailer and Leader
Blank portion
Chip cavity
Blank portion
Leader
100mm or more
(3.94inches or more)
160mm or more
(6.3inches or more)
Direction of tape feed
400mm or more
(15.7inches or more)
⑤Reel size
t
E
C
R
B
A
D
W
A
φ178±2.0
B
φ50min.
C
φ13.0±0.2
D
φ21.0±0.8
4mm wide tape
8mm wide tape
12mm wide tape
T
1.5max.
2.5max.
2.5max.
W
5±1.0
10±1.5
14±1.5
Unit：mm
R
1.0
⑥Top Tape Strength
The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow as illustrated below.
Pull direction
0～20°
Top tape
Base tape
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E06R01
Multilayer Ceramic Capacitors
■RELIABILITY DATA
1.Operating Temperature Range
Temperature
Compensating（Class1）
Standard
High Frequency Type
－55 to ＋125℃
Specification
Temperature Range
B
－25 to ＋85℃
BJ
X5R
－55 to ＋85℃
B7
X7R
－55 to ＋125℃
C6
X6S
－55 to ＋105℃
C7
X7S
－55 to ＋125℃
D7
X7T
－55 to ＋125℃
LD(※)
X5R
－55 to ＋85℃
Note: ※LD Low distortion high value multilayer ceramic capacitor
Specified
Value
High Permittivity （Class2）
2. Storage Conditions
Temperature
Compensating（Class1）
Standard
High Frequency Type
－55 to ＋125℃
Specification
Temperature Range
B
－25 to ＋85℃
BJ
X5R
－55 to ＋85℃
B7
X7R
－55 to ＋125℃
C6
X6S
－55 to ＋105℃
C7
X7S
－55 to ＋125℃
D7
X7T
－55 to ＋125℃
LD(※)
X5R
－55 to ＋85℃
Note: ※LD Low distortion high value multilayer ceramic capacitor
Specified
Value
High Permittivity （Class2）
3. Rated Voltage
Specified
Value
Temperature
Compensating（Class1）
Standard
50VDC, 25VDC
High Frequency Type
50VDC, 25VDC
High Permittivity （Class2）
50VDC, 35VDC, 25VDC, 16VDC, 10VDC, 6.3VDC, 4VDC, 2.5VDC
4. Withstanding Voltage （Between terminals）
Specified
Value
Temperature
Compensating（Class1）
Standard
High Frequency Type
No breakdown or damage
High Permittivity （Class2）
Test
Methods and
Remarks
Class 1
Rated volta×3
Applied voltage
Duration
Charge/discharge current
Class 2
Rated voltage×2.5
1 to 5 sec.
50mA max.
5. Insulation Resistance
Specified
Value
Temperature
Compensating（Class1）
Standard
High Frequency Type
High Permittivity （Class2） Note 1
Test
Methods and
Remarks
Applied voltage
Duration
Charge/discharge current
10000 MΩ min.
C≦0.047μF : 10000 MΩ min.
C＞0.047μF : 500MΩ・μF
: Rated voltage
: 60±5 sec.
: 50mA max.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_c_mlcc_reli_e-E09R01
6. Capacitance （Tolerance）
Specified
Value
Temperature
Compensating（Class1）
Standard
C□
U□
SL
0.2pF≦C≦5pF
0.2pF≦C≦10pF
C＞10pF
: ±0.25pF
: ±0.5pF
: ±5% or ±10%
High Frequency Type
CH
0.3pF≦C≦2pF
C＞2pF
: ±0.1pF
: ±5%
BJ, B7, C6, C7, D7, LD(※) : ±10% or ±20%
Note: ※LD Low distortion high value multilayer ceramic capacitor
High Permittivity （Class2）
Test
Methods and
Remarks
Standard
Preconditioning
Measuring frequency
Measuring voltage Note
Bias application
Class 1
High Frequency Type
None
1ＭHz±10%
0.5 to 5Vrms
Class 2
C≦10μF
Thermal treatment （at 150℃
1kHz±10%
1±0.2Vrms
None
C＞10μF
for 1hr） Note 2
120±10Hz
0.5±0.1rms
7. Q or Dissipation Factor
Specified
Value
Temperature
Compensating（Class1）
Standard
High Frequency Type
High Permittivity （Class2） Note 1
C＜30pF : Q≧400＋20C
C≧30pF : Q≧1000
（C：Nominal capacitance）
Refer to detailed specification
BJ, B7, C6, C7, D7：2.5% max.
Class 1
High Frequency Type
None
1ＭHz±10%
1GHz
0.5 to 5Vrms
Standard
Test
Methods and
Remarks
Preconditioning
Measuring frequey
Measuring voltage Note 1
Bias application
High Frequency Type
Measuring equipment
Measuring jig
Class 2
C≦10μF
C＞10μF
Thermal treatment （at 150℃ for 1hr） Note 2
1ｋHz±10%
120±10Hz
1±0.2Vrms
0.5±0.1Vrms
None
: HP4291A
: HP16192A
8. Temperature Characteristic （Without voltage application）
Temperature Characteristic ［ppm/℃］
C□ :
Temperature
Compensating（Class1）
0
CG,CH, CJ, CK
Standard
U□ : －750
SL
High Frequency Type
UJ, UK
: ＋350 to －1000
Temperature Characteristic ［ppm/℃］
C□ : 0
CH
Specified
Value
Tolerance ［ppm/℃］
G : ±30
H : ±60
J : ±120
K : ±250
Tolerance ［ppm/℃］
H : ±60
Capacitance
Reference
Temperature Range
change
temperature
±10%
20℃
－25 to ＋85℃
±15%
25℃
－55 to ＋85℃
±15%
25℃
－55 to ＋125℃
±22%
25℃
－55 to ＋105℃
±22%
25℃
－55 to ＋125℃
＋22/－33%
25℃
－55 to ＋125℃
±15%
25℃
－55 to ＋85℃
distortion high value multilayer ceramic capacitor
Specification
B
X5R
B7
X7R
C6
X6S
C7
X7S
D7
X7S
LD(※)
X5R
Note : ※LD Low
BJ
High Permittivity （Class2）
Class 1 : Capacitance at 20℃ and 85℃ shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from
the following equation.
（C85－C20）
×106（ppm/℃）
C20×△T
△T＝65
Test
Methods and
Remarks
Class 2 : Capacitance at each step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the
following equation.
Step
B
X5R、X7R、X6S、X7S、X7T
1
Minimum operating temperature
2
20℃
25℃
3
Maximum operating temperature
（C－C2）
×100（%）
C2
C ：Capacitance in Step 1 or Step 3
C2 ：Capacitance in Step 2
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_c_mlcc_reli_e-E09R01
9. Deflection
Specified
Value
Temperature
Compensating（Class1）
Standard
High Frequency Type
Appearance
Cpaitance change
: No abnormality
: Within±0.5 pF
Multilayer Ceramic Capacitors
105 Type
The other types
Glass epoxy-resin substrate
0.8mm
1.6mm
1mm （Soft Termination type:3mm）
10 sec.
※１：
105 Type thickness, C： 0.2mm ,P： 0.3mm.
042, 063,
Board
Thickness
Warp
Duration
: No abnormality
: Within ±5% or ±0.5 pF, whichever is larger.
Appearance
: No abnormality
Capacitance change : Within ±12.5%（BJ, B7, C6, C7, D7, LD(※)）
Note: ※LD Low distortion high value multilayer ceramic capacitor
High Permittivity （Class2）
Test
Methods and
Remarks
Appearance
Capacitance change
※１
Capacitance measurement shall be conducted
with the board bent
10. Body Strength
Specified
Value
Temperature
Compensating（Class1）
Standard
High Frequency Type
High Permittivity （Class2）
Test
Methods and
Remarks
－
No mechanical damage.
－
High Frequency Type
Applied force
: 5N
Duration
: 10 sec.
11. Adhesive Strength of Terminal Electrodes
Specified
Value
Temperature
Compensating（Class1）
Standard
High Frequency Type
No terminal separation or its indication.
High Permittivity （Class2）
Test
Methods and
Remarks
Applied force
Duration
Multilayer Ceramic Capacitors
042, 063 Type
105 Type or more
2N
5N
30±5 sec.
12. Solderability
Specified
Value
Temperature
Compensating（Class1）
Standard
High Frequency Type
At least 95% of terminal electrode is covered by new solder.
High Permittivity （Class2）
Test
Methods and
Remarks
Solder type
Solder temperature
Duration
Eutectic solder
H60A or H63A
230±5℃
Lead-free solder
Sn-3.0Ag-0.5Cu
245±3℃
4±1 sec.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_c_mlcc_reli_e-E09R01
13. Resistance to Soldering
Standard
Appearance
Capacitance change
Q
Insulation resistance
Withstanding voltage
: No abnormality
: Within ±2.5% or ±0.25pF, whichever is larger.
: Initial value
: Initial value
（between terminals） : No abnormality
High Frequency Type
Appearance
Capacitancecange
Q
Insulation resistance
Withstanding voltage
: No abnormality
: Within ±2.5%
: Initial value
: Initial value
（between terminals） : No abnormality
Temperature
Compensating（Class1）
Specified
Value
High Permittivity （Class2）
Appearance
: No abormality
Capactace change
: Within ±7.5%（BJ, B7, C6, C7, D7, LD(※)）
Dissipation factor
: Initial value
Insulation resistance
: Initial value
Withstanding voltage
（between terminals）: No abnormality
Note: ※LD Low distortion high value multilayer ceramic capacitor
Note 1
Class 1
042, 063 Type
105 Type
Preconditioning
Preheating
Test
Methods and
Remarks
None
Solder temp.
Duration
Recovery
270±5℃
3±0.5 sec.
6 to 24 hrs （Standard condition） Noe 5
042、063 Type
Preconditioning
Preheating
80 to 100℃, 2 to 5 min.
150 to 200℃, 2 to 5 min.
150℃, 1 to 2 min.
150℃, 1 to 2 min.
Solder temp.
Duration
Recovery
Class 2
105, 107, 212 Type
316, 325 Type
Thermal treatment （at 150℃ for 1 hr） Note 2
80 to 100℃, 2 to 5 min.
80 to 100℃, 5 to 10 min.
150 to 200℃, 2 to 5 min.
150 to 200℃, 5 to 10 min.
270±5℃
3±0.5 sec.
24±2 hrs （Standard condition） Note 5
14. Temperature Cycle (Thermal Shock）
Standard
Appearance
Capacitance change
Q
Insulation resistance
Withstanding voltage
: No abnormality
: Within ±2.5% or ±0.25pF, whichever is larger.
: Initial value
: Initial value
（between terminals） : No abnormality
High Frequency Type
Appearance
Capacitance change
Q
Insulation resistance
Withstanding voltage
: No abnormality
: Within ±0.25pF
: Initial value
: Initial value
（between terminals） : No abnormality
Temperature
Compensating（Class1）
Specified
Value
High Permittivity （Class2）
Appearance
: No abnormality
Capacitance change
: Within ±7.5% （BJ, B7, C6, C7, D7, LD(※)）
Dissipation factor
: Initial value
Insulation resistance
: Initial value
Withstanding voltage
（between terminals） : No abnormality
Note: ※LD Low distortion high value multilayer ceramic capacitor
Note 1
Class 1
Preconditioning
Test
Methods and
Remarks
1 cycle
Number of cycles
Recovery
Class 2
Thermal treatment （at 150℃ for 1 hr）
Note 2
None
Step
1
2
3
4
Temperature（℃）
Minimum operating temperature
Normal temperature
Maximum operating temperature
Normal temperature
Time（min.）
30±3
2 to 3
30±3
2 to 3
5 times
6 to 24 hrs （Standard condition） Note 5
24±2 hrs （Standard condition） Note 5
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_c_mlcc_reli_e-E09R01
15. Humidity （Steady State）
Appearance
Capacitance change
Q
Standard
Temperature
Compensating（Class1）
Specified
Value
High Frequency Type
High Permittivity （Class2）
Insulation resistance
: No abnormality
: Within ±5% or ±0.5pF, whichever is larger.
: C＜10pF : Q≧200＋10C
10≦C＜30pF : Q≧275＋2.5C
C≧30pF:Q≧350（C：Nominal capacitance）
: 1000 MΩ min.
Appearance
Capacitance change
Insulation resistance
: No abnormality
: Within ±0.5pF,
: 1000 MΩ min.
Appearance
: No abnormality
Capacitance change
: Within ±12.5% （BJ, B7, C6, C7, D7, LD(※)）
Dissipation factor
: 5.0% max.（BJ, B7, C6, C7, D7, LD(※)）
Insulation resistance
: 50 MΩμF or 1000 MΩ whichever is smaller.
Note: ※LD Low distortion high value multilayer ceramic capacitor
Note 1
Class 1
Standard
Test
Methods and
Remarks
Preconditioning
Temperature
Humidity
Duration
Recovery
Class 2
All items
Thermal treatment（ at 150℃ for 1 hr） Note 2
40±2℃
90 to 95%RH
500＋24/－0 hrs
24±2 hrs （Standard condition） Note 5
High Frequency Type
None
40±2℃
60±2℃
90 to 95%RH
500＋24/－0 hrs
6 to 24 hrs （Standard condition） Note 5
16. Humidity Loading
Appearance
Capacitance change
Q
Standard
Temperature
Compensating（Class1）
Specified
Value
Insulation resistance
High Frequency Type
Appearance
Capacitance change
Insulation resistance
High Permittivity （Class2）
Note 1
Appearance
: No abnormality
Capacitance change
: Within ±12.5% （BJ, B7, C6, C7, D7, LD(※)）
Dissipation factor
: 5.0% max. （BJ, B7, C6, C7, D7, LD(※)）
Insulation resistance
: 25 MΩμF or 500 MΩ, whichever is smaller.
Note: ※LD Low distortion high value multilayer ceramic capacitor
90 to 95%RH
500＋24/－0 hrs
Rated voltage
50mA max.
50mA max.
6 to 24 hrs （Standard condition） Note 5
24±2 hrs（Standard condition） Note 5
Preconditioning
Temperature
Humidity
Duration
Applied voltage
Charge/discharge
current
Recovery
: No abnormality
: C≦2pF：Within ±0.4 pF
C＞2pF：Within ±0.75 pF （C：Nominal capacitance）
: 500 MΩ min.
Class 2
All items
Voltage treatment
（Rated voltage are applied for 1 hour at 40℃） Note 3
40±2℃
90 to 95%RH
500＋24/－0 hrs
Rated voltage
Standard
Test
Methods and
Remarks
: No abnormality
: Within ±7.5% or ±0.75pF, whichever is larger.
: C＜30pF：Q≧100＋10C/3
C≧30pF：Q≧200 （C：Nominal capacitance）
: 500 MΩ min.
Class 1
High Frequency Type
None
40±2℃
60±2℃
17. High Temperature Loading
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_c_mlcc_reli_e-E09R01
Appearance
Capacitance change
Q
Standard
Temperature
Compensating（Class1）
Specified
Value
High Frequency Type
High Permittivity （Class2）
Test
Methods and
Remarks
Temperature
Duration
Applied voltage
Charge/discharge
current
Recovery
Appearance
Capacitance change
Insulation resistance
: No abnormality
: Within ±3% or ±0.3pF, whichever is larger.
: 1000 MΩ min.
Appearance
: No abnormality
Capacitance change
: Within ±12.5% （BJ, B7, C6, C7, D7, LD(※)）
Dissipation factor
: 5.0% max.（BJ, B7, C6, C7, D7, LD(※)）
Insulation resistance
: 50 MΩμF or 1000 MΩ, whichever is smaller.
Note: ※LD Low distortion high value multilayer ceramic capacitor
Note 1
Maximum operating temperature
1000＋48/－0 hrs
Rated voltage×2
Class 2
BJ, LD(※)
C6
B7, C7, D7
Voltage treatment（Twice the rated voltage shall be applied for
1 hour at 85℃, 105℃ or 125℃） Note 3, 4
Maximum operating temperature
1000＋48/－0 hrs
Rated voltage×2 Note 4
50mA max.
50mA max.
6 to 24hr （Standard condition） Note 5
24±2 hrs （Standard condition） Note 5
Standard
Preconditioning
Insulation resistance
: No abnormality
: Within ±3% or ±0.3pF, whichever is larger.
: C＜10pF： Q≧200＋10C
10≦C＜30pF：Q≧275＋2.5C
C≧30pF： Q≧350（C：Nominal capacitance）
: 1000 MΩ min.
Class 1
High Frequency Type
None
Note: ※LD Low distortion high value multilayer ceramic capacitor
Note 1 The figures indicate typical specifications. Please refer to individual specifications in detail.
Note 2 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 150＋0/－10℃ for an hour and kept at room temperature for
24±2hours.
Note 3 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in
the test conditions, and kept at room temperature for 24±2hours.
Note 4 150% of rated voltage is applicable to some items. Please refer to their specifications for further information.
Note 5 Standard condition: Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa When there are questions concerning
measurement results, in order to provide correlation data, the test shall be conducted under the following condition.
Temperature: 20±2℃, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa Unless otherwise specified, all the tests are conducted under the
"standard condition".
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_c_mlcc_reli_e-E09R01
Precautions on the use of Multilayer Ceramic Capacitors
■PRECAUTIONS
1. Circuit Design
Precautions
◆Verification of operating environment, electrical rating and performance
1. A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have
severe social ramifications.
Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from
them used in general purpose applications.
◆Operating Voltage （Verification of Rated voltage）
1. The operating voltage for capacitors must always be their rated voltage or less.
If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less.
For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less.
2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC
voltage or a pulse voltage having rapid rise time is used in a circuit.
2. PCB Design
Precautions
◆Pattern configurations （Design of Land-patterns）
1. When capacitors are mounted on PCBs, the amount of solder used （size of fillet） can directly affect the capacitor performance.
Therefore, the following items must be carefully considered in the design of land patterns:
（1）Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider
appropriate land-patterns for proper amount of solder.
（2）When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by
solder-resist.
◆Pattern configurations （Capacitor layout on PCBs）
After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes （PCB
cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.）. For this reason, land
pattern configurations and positions of capacitors shall be carefully considered to minimize stresses.
◆Pattern configurations （Design of Land-patterns）
The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts.
（1）Recommended land dimensions for typical chip capacitors
Land patterns for PCBs
●Multilayer Ceramic Capacitors : Recommended land dimensions
Land pattern
（unit: mm）
Solder-resist
Wave-soldering
Chip capacitor
Type
107
212
316
325
L
1.6
2.0
3.2
3.2
C
Size
W
0.8
1.25
1.6
2.5
A
0.8 to 1.0
1.0 to 1.4
1.8 to 2.5
1.8 to 2.5
B
0.5 to 0.8
0.8 to 1.5
0.8 to 1.7
0.8 to 1.7
B
A
B
C
0.6 to 0.8
0.9 to 1.2
1.2 to 1.6
1.8 to 2.5
Chip capacitor
W
L
Technical
considerations
Reflow-soldering
Type
042
063
105
L
0.4
0.6
1.0
Size
W
0.2
0.3
0.5
A
0.15 to 0.25
0.20 to 0.30
0.45 to 0.55
B
0.15 to 0.20
0.20 to 0.30
0.40 to 0.50
C
0.15 to 0.30
0.25 to 0.40
0.45 to 0.55
Note：Recommended land size might be different according
107
212
316
1.6
2.0
3.2
0.8
1.25
1.6
0.8 to 1.0
0.8 to 1.2
1.8 to 2.5
0.6 to 0.8
0.8 to 1.2
1.0 to 1.5
0.6 to 0.8
0.9 to 1.6
1.2 to 2.0
to the allowance of the size of the product.
●LWDC: Recommended land dimensions for reflow-soldering
（unit: mm）
Type
105
107
212
L
0.52
0.8
1.25
Size
W
1.0
1.6
2.0
A
0.18 to 0.22
0.25 to 0.3
0.5 to 0.7
B
0.2 to 0.25
0.3 to 0.4
0.4 to 0.5
C
0.9 to 1.1
1.5 to 1.7
1.9 to 2.1
325
3.2
2.5
1.8 to 2.5
1.0 to 1.5
1.8 to 3.2
432
4.5
3.2
2.5 to 3.5
1.5 to 1.8
2.3 to 3.5
LWDC
W
L
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_c_mlcc_prec_e-E07R01
（2）Examples of good and bad solder application
Items
Not eommended
Lead wire of component
Recommended
Solder-resist
Mixed mounting of SMD and
leaded components
Chassis
Solder (for grounding)
Solder-resist
Component placement close to
the chassis
Electrode pattern
Lead wire of component
Soldering iron
Hand-soldering of leaded
Components near mounted
components
Solder-resist
Solder-resist
Horizontal component
placement
◆Pattern configurations （Capacitor layout on PCBs）
1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any
stresses from board warp or deflection.
Items
Not recommended
Recommended
possible mechanical
Place the product at a right
angle to the direction of the
anticipated mechanical
stress.
Deflection of board
1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below.
E
D
Perforation
C
A
B
Slit
Magnitude of stress
A＞B＝C＞D＞E
1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods
are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB,
split methods as well as chip location.
3. Mounting
Precautions
◆Adjustment of mounting machine
1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them.
2. Maintenance and inspection of mounting machines shall be conducted periodically.
◆Selection of Adhesives
1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the
following factors are appropriately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and
hardening period. Therefore, please contact us for further information.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_c_mlcc_prec_e-E07R01
◆Adjustment of mounting machine
1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid
this, the following points shall be considerable.
（1）The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection.
（2）The pressure of nozzle shall be adjusted between 1 and 3 N static loads.
（3）To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be
used on the other side of the PCB. The following diagrams show some typical examples of good and bad pick-up nozzle
placement:
Items
Single-sided mounting
Not recommended
Recommended
chipping
or cracking
supporting pins
or back-up pins
Double-sided mounting
chipping
or cracking
Technical
considerations
supporting pins
or back-up pins
2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical
impact on the capacitors.
To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of
the pin shall be conducted periodically.
◆Selection of Adhesives
Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in
stresses on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect
components. Therefore, the following precautions shall be noted in the application of adhesives.
（1）Required adhesive characteristics
a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive shall have sufficient strength at high temperatures.
c. The adhesive shall have good coating and thickness consistency.
d. The adhesive shall be used during its prescribed shelf life.
e. The adhesive shall harden rapidly.
f. The adhesive shall have corrosion resistance.
g. The adhesive shall have excellent insulation characteristics.
h. The adhesive shall have no emission of toxic gasses and no effect on the human body.
（2）The recommended amount of adhesives is as follows;
Amount adhesive
After capacitor are bonded
［Recommended condition］
a
a
Figure
212/316 case sizes as examples
a
0.3mm min
b
b
100 to 120μm
c
Adhesives shall not contact land
c
c
4. Soldering
Precautions
◆Selection of Flux
Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use;
（1）Flux used shall be less than or equal to 0.1 wt%（ in Cl equivalent） of halogenated content. Flux having a strong acidity content shall
not be applied.
（2）When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level.
（3）When water-soluble flux is used, special care shall be taken to properly clean the boards.
◆Soldering
Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions.
Sn-Zn solder paste can adversely affect MLCC reliability.
Please contact us prior to usage of Sn-Zn solder.
Technical
considerations
◆Selection of Flux
1-1. When too much halogenated substance（Chlorine, etc.） content is used to activate flux, or highly acidic flux is used, it may lead to
corrosion of terminal electrodes or degradation of insulation resistance on the surfaces of the capacitors.
1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted
and may adversely affect the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high
humidity conditions may cause a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning
methods and the capability of the machines used shall also be considered carefully when water-soluble flux is used.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_c_mlcc_prec_e-E07R01
◆Soldering
･ Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling.
･ Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal
shock.
･ Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within
100 to 130℃.
･ Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100℃.
［Reflow soldering］
【Recommended conditions for eutectic soldering】
【Recommended condition for Pb-free soldering】
300
300
Peak
260℃ Max.
Within 10sec.
230℃
Within 10sec.
60sec. 60sec
Min.
200 Min.
Slow cooling
100
Temperature（℃）
Temperature（℃）
Preheating
200
100
0
0
Slow
cooling
Preheating150℃ Heating above
230℃
60sec. Min.
40sec. Max.
1/2T～1/3T
Capacitor
Caution
①The ideal condition is to have solder mass（fillet）controlled to 1/2 to 1/3 of the
thickness of a capacitor.
②Because excessive dwell times can adversely affect solderability, soldering duration shall
be kept as close to recommended times as possible.
③Allowable number of reflow soldering : 2 times max.
Solder
T
PC board
［Wave soldering］
【Recommended conditions for eutectic soldering】
【Recommended condition for Pb-free soldering】
300
Preheating
120sec. Min.
Peak
260℃ Max.
Within 10sec.
230～250℃
Within 3sec.
200
Slow cooling
100
Temperature（℃）
Temperature（℃）
300
0
200
120sec. Min.
Preheating
150℃
100
Slow
cooling
0
Caution
①Wave soldering must not be applied to capacitors designated as for reflow soldering only.
②Allowable number of wave soldering : 1 times max.
［Hand soldering］
【Recommended condition for Pb-free soldering】
400
400
300
200
Slow cooling
100
0
Preheating
60sec. Min.
Temperature（℃）
Temperature（℃）
300
⊿T
Slow cooling
200
Preheating
150℃ Min.
100
0
400
Peak
350℃ Max.
Within 3sec.
230～280℃
Within 3sec.
316type or less
200
0
Slow cooling
⊿T
Preheating
150℃ Min.
100
60sec. Min.
⊿T
⊿T≦150℃
Peak
280℃ Max.
Within 3sec.
300
温度（℃）
【Recommended conditions for eutectic soldering】
60sec. Min.
325type or more
⊿T
⊿T≦130℃
Caution
①Use a 50W soldering iron with a maximum tip diameter of 1.0 mm.
②The soldering iron shall not directly touch capacitors.
③Allowable number of hand soldering : 1 times max.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_c_mlcc_prec_e-E07R01
5. Cleaning
Precautions
Technical
considerations
◆Cleaning conditions
1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use
of the cleaning. （e.g. to remove soldering flux or other materials from the production process.）
2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect
capacitor's characteristics.
1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate
their outer coating, resulting in a degradation of the capacitor's electrical properties （especially insulation resistance）.
2. Inappropriate cleaning conditions（ insufficient or excessive cleaning） may adversely affect the performance of
the capacitors.
In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead
to the
cracking of capacitors or the soldered portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall
be carefully checked;
Ultrasonic output :
20 W/ℓ or less
Ultrasonic frequency :
40 kHz or less
Ultrasonic washing period : 5 min. or less
6. Resin coating and mold
Precautions
1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the
hardening period or
while left under normal storage conditions resulting in the deterioration of the capacitor's performance.
2. When a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat
may lead to damage or destruction of capacitors.
The use of such resins, molding materials etc. is not recommended.
7. Handling
◆Splitting of PCB
1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board.
2. Board separation shall not be done manually, but by using the appropriate devices.
Precautions
◆Mechanical considerations
Be careful not to subject capacitors to excessive mechanical shocks.
（1）If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used.
（2）Please be careful that the mounted components do not come in contact with or bump against other boards or
components.
8. Storage conditions
Precautions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control
temperature and humidity in the storage area. Humidity should especially be kept as low as possible.
・Recommended conditions
Ambient temperature : Below 30℃
Humidity
: Below 70% RH
The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of capacitor is deteriorated as
time passes, so capacitors shall be used within 6 months from the time of delivery.
・Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air.
2. The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time, so
care shall be
taken to design circuits . Even if capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at
150℃ for 1hour.
Technical
considerations
If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and
quality loss of taping/packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the
above period, please check solderability before using the capacitors.
※RCR-2335B（Safety Application Guide for fixed ceramic capacitors for use in electronic equipment）is published by JEITA.
Please check the guide regarding precautions for deflection test, soldering by spot heat, and so on.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_c_mlcc_prec_e-E07R01
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