UMK105CG030CW-F

Notice for TAIYO YUDEN products  1 Please read this notice before using the TAIYO YUDEN products. ■ Product information in this catalog is as of October 2008. All of the contents specified herein are subject to change without notice due to technical improvements, etc. Therefore, please check for the latest information carefully before practical application or usage of the Products. Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those specified in this catalog or individual specification. INFORMATION ON THE GENERAL CATALOG REMINDERS ■ Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual specification is available. ■ Please conduct validation and verification of products in actual condition of mounting and operating environment before commercial shipment of the equipment. ■ All electronic components or functional modules listed in this catalog are developed, designed and intended for use in general electronics equipment.(for AV, office automation, household, office supply, information service, telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have direct influence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance. Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, submarine system, military, etc. where higher safety and reliability are especially required. In addition, even electronic components or functional modules that are used for the general electronic equipment, if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliability evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to install a protective circuit is strongly recommended at customer's design stage. ■ The contents of this catalog are applicable to the products which are purchased from our sales offices or distributors (so called“TAIYO YUDEN’s official sales channel”). It is only applicable to the products purchased from any of TAIYO YUDEN’s official sales channel. ■ Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may occur in connection with a third party's intellectual property rights and other related rights arising from your usage of products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights. ■ Caution for export Certain items in this catalog may require specific procedures for export according to“Foreign Exchange and Foreign Trade Control Law”of Japan,“U.S. Export Administration Regulations” , and other applicable regulations. Should you have any question or inquiry on this matter, please contact our sales staff. Should you have any question or inquiry on this matter, please contact our sales staff. ！ 当社カタログをご使用の際には 「当社製品に関するお断り」を必ずお読みください。 △ 9 ！ Please read the "Notice for TAIYO YUDEN products" before using this catalog. △ 3 一般積層セラミックコンデンサ （温度補償用・Class 1） STANDARD MULTILAYER CERAMIC CAPACITORS (CLASS1 : TEMPERATURE COMPENSATING DIELECTRIC TYPE) OPERATING TEMP. −55∼＋125℃ 特長 FEATURES ・実装密度の向上が図れます ・モノリシックの構造のため、信頼性が高い ・同一形状、静電容量範囲が広い ・Improve Higher Mounting Densities. ・Multilayer block structure provides higher reliability ・A wide range of capacitance values available in standard case sizes. 用途 APPLICATIONS ・General electronic equipment ・Communication equipment（cellular phone, PHS, other wireless applications, etc.） ・一般電子機器用 ・通信機器用（携帯電話、PHS、コードレス電話 etc.） 形名表記法 ORDERING CODE 1 4 6 7 9 定格電圧〔VDC〕 形状寸法 （EIA）L×W 〔mm〕 公称静電容量〔pF〕 容量許容差 個別仕様 E T U 042（01005） 063（0201） 105（0402） 16 25 50 2 C D F J K 0.5 1 10 温度特性〔ppm/℃〕 積層コンデンサ C□ R□ S□ T□ U□ SL 3 端子電極 メッキ品 K 例 0R5 010 100 ※R＝小数点 5 シリーズ名 M 0.4×0.2 0.6×0.3 1.0×0.5 −150：CG、CH、CJ、CK −220：RH、 −330：SH、SJ、SK G −470：TJ、TK H −750：UJ、UK J ＋350∼−1000 K ± 0.25 ± 0.5 ± 1 ± 5 ± 10  pF pF pF % % − 標準 10 包装 F 8 φ178mm テーピング （2mmピッチ） 製品厚み〔mm〕 C P V W ±30 ±60 ±120 ±250 0.2 0.3 0.5 0.5 11 当社管理記号 △ □＝許容差 標準品 △＝スペース U M K 1 0 5 C H 1 0 1 J V _ F △ 1 3 2 6 5 4 7 9 10 1 4 6 7 9 Rated voltage 〔VDC〕 Dimensions（case size） （EIA）L×W〔mm〕 Nominal capacitance 〔pF〕 Capacitance tolerance   Special code E T U Multilayer ceramic capacitor 3 End termination   K 0.4×0.2 0.6×0.3 1.0×0.5 Plated example 0R5 010 100 C D F J K 0.5 1 10 *R=decimal point 5 Series name M 042（01005） 063（0201） 105（0402） 16 25 50 2 C□ R□ S□ T□ U□ SL −150：CG、CH、CJ、CK −220：RH、 −330：SH、SJ、SK G −470：TJ、TK H −750：UJ、UK J ＋350∼−1000 K ！ 当社カタログをご使用の際には 「当社製品に関するお断り」を必ずお読みください。 △ ± 0.25 ± 0.5 ± 1 ± 5 ± 10  pF pF pF % % − 11 Standard Products 10 Packaging  F 8 Temperature characteristics 〔ppm/℃〕 φ178mm Taping （2mm pitch） Thickness[mm] C P V W ±30 ±60 ±120 ±250 □＝Tolerance 56 8 0.2 0.3 0.5 0.5 11 Internal code △ Standard Products △＝Blank space 9 ！ Please read the "Notice for TAIYO YUDEN products" before using this catalog. △ 外形寸法 EXTERNAL DIMENSIONS Type（EIA） L W T e □MK042 0.4±0.02 0.2±0.02 0.2±0.02 0.1±0.03 C （01005） （0.016±0.001）（0.008±0.001）（0.008±0.001） （0.004±0.001） □MK063 0.6±0.03 0.3±0.03 0.3±0.03 0.15±0.05 P （0201） （0.024±0.001）（0.012±0.001）（0.012±0.001） （0.006±0.002） □MK105 1.0±0.05 0.5±0.05 0.5±0.05 0.25±0.10 （0402） （0.039±0.002）（0.020±0.002） （0.020±0.002） W, V （0.010±0.004） Unit：mm（inch） CAPACITORS 概略バリエーション AVAILABLE CAPACITANCE RANGE Type 042 063 Temp.char. C□ C□ U□ C□ U□ Cap VDC 16V 25V [ pF ]［pF：3digits］ 0.5 1 1.5 2 3 4 5 6 7 8 9 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 1000 0R5 010 1R5 020 030 040 050 060 070 080 090 100 120 150 180 220 270 330 390 470 560 680 820 101 121 151 181 221 271 331 391 471 561 681 821 102 105 SL R□ S□ 温度特性 Temperature Characteristics 温度特性 Temperature char.（EIA） T□ 50V W P C W W W W P 0±250 C J（C0J） 0±120 C H（C0H） 0±60 C G（C0G） 0±30 R H（R2H） −220±60 S K（S2K） −330±250 S J（S2J） −330±120 S H（S2H） −330±60 T K（T2K） −470±250 T J（T2J） −470±120 U K（U2K） −750±250 −55∼＋125℃ −750±120 −1000∼＋350 SL V 温度係数範囲 使用温度範囲 〔ppm/℃〕※1 Temperature coefficient range Operating Temp. range C K（C0K） U J（U2J） V 4 ※1：20℃における静電容量を基準。    Based on the capacitance at 20℃ 静電容量許容差 Capacitance Tolerance Symbol V 記号 Symbol 注：グラフの記号は製品の厚み記号です。 Note: Letters in the table indicate thickness. 許容差 Tolerance 区分 Item C ±0.25pF ∼5pF D ±0.5 pF ∼10pF F ±1pF 6∼10 pF J ±5 % 11pF∼ K ±10 % 11pF∼ Q 区分 Item Q※2 Symbol ≧400＋20・C※1 ∼27pF ≧1000  30pF∼ ※1：C＝公称静電容量 Nominal capacitance〔pF〕 ※2：測定周波数 Measurement Frequency= 1±0.1MHz（C≦1000pF） 1±0.1kHz（C＞1000pF） 測定電圧 Measurement voltage = 0.5∼5Vrms（C≦1000pF） 1±0.2Vrms（C＞1000pF） セレクションガイド Selection Guide P.12 etc アイテム一覧 Part Numbers 特性図 Electrical Characteristics P.58 ！ 当社カタログをご使用の際には 「当社製品に関するお断り」を必ずお読みください。 △ ̶̶̶̶̶̶ 梱包 Packaging 信頼性 Reliability Data P.98 P.102 9 使用上の注意 Precautions P.108 ！ Please read the "Notice for TAIYO YUDEN products" before using this catalog. △ 57 アイテム一覧 PART NUMBERS 042TYPE Class 1 定格電圧 Rated 形 名 Voltage Ordering code (DC) 16V EMK0 4 2 EMK0 4 2 EMK0 4 2 EMK0 4 2 EMK0 4 2 EMK0 4 2 EMK0 4 2 EMK0 4 2 EMK0 4 2 EMK0 4 2 EMK0 4 2 EMK0 4 2 EMK0 4 2 EMK0 4 2 EMK0 4 2 EMK04 2 EMK04 2 EMK04 2 EMK04 2 EMK04 2 EMK04 2 EMK04 2 EMK04 2 EMK04 2 温度特性 公称静電 EHS 静電容量 厚み 容  量 許 容 差 Temperature characteristics (EIA) (Environmental Thicknees Hazardous CK CJ CH CG PK PJ PH RK RJ RH SK SJ SH TK TJ TH UK UJ Capacitance Capacitance [mm] SL Substances) (C0K) (C0J) (C0H) (C0G) (P2K) (P2J) (P2H) (R2K) (R2J) (R2H) (S2K) (S2J) (S2H) (T2K) (T2J) (T2H) (U2K) ( U2J) tolerance (inch) [pF] △ 0 R 5 □C △ 0 1 0 □C △ 1 R 5 □C △ 0 2 0 □C △ 0 3 0 □C △ 0 4 0□C △ 0 5 0 □C △ 0 6 0 □C △ 0 7 0 □C △ 0 8 0□C △ 0 9 0 □C △ 1 0 0 □C △ 1 2 0 □C △ 1 5 0□C △ 1 8 0□P △ 2 2 0 □P △ 2 7 0□P △ 3 3 0□P △ 3 9 0□P △ 4 7 0□P △ 5 6 0□P △ 6 8 0□P △ 8 2 0□P △ 1 0 1□P RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● 0.5 1 1.5 2 3 4 5 6 7 8 9 10 12 15 18 22 27 33 39 47 56 68 82 100 ±0.25pF ±0.5pF ±0.5pF ±1pF 0.2±0.02 (0.008±0.001) ±5% ±10% 注：形名の△には温度特性、□には静電容量許容差記号が入ります。 △ Please specify the temperature characteristics code and □ the capacitance tolerance code. 063TYPE Class 1 定格電圧 Rated 形 名 Voltage Ordering code （DC） 25V TMK0 6 3 TMK0 6 3 TMK0 6 3 TMK0 6 3 TMK0 6 3 TMK0 6 3 TMK0 6 3 TMK0 6 3 TMK0 6 3 TMK0 6 3 TMK0 6 3 TMK0 6 3 TMK0 6 3 TMK0 6 3 TMK0 6 3 TMK0 6 3 TMK0 6 3 TMK0 6 3 TMK0 6 3 TMK0 6 3 TMK0 6 3 TMK0 6 3 TMK0 6 3 TMK0 6 3 △ 0 R 5□P △ 0 1 0□P △ 1 R 5□P △ 0 2 0□P △ 0 3 0□P △ 0 4 0□P △ 0 5 0□P △ 0 6 0□P △ 0 7 0□P △ 0 8 0□P △ 0 9 0□P △ 1 0 0□P △ 1 2 0□P △ 1 5 0□P △1 8 0□P △ 2 2 0 □P △ 2 7 0 □P △3 3 0□P △ 3 9 0 □P △ 4 7 0 □P △5 6 0□P △ 6 8 0 □P △ 8 2 0 □P △ 1 0 1 □P 温度特性 公称静電 EHS 静電容量 厚み 容  量 許 容 差 Temperature characteristics（EIA） （Environmental Thicknees Hazardous CK CJ CH CG PK PJ PH RK RJ RH SK SJ SH TK TJ TH UK UJ Capacitance Capacitance [mm] SL tolerance （inch） Substances） （C0K）（C0J）（C0H）（C0G）（P2K）（P2J）（P2H）（R2K）（R2J）（R2H）（S2K）（S2J）（S2H）（T2K）（T2J）（T2H）（U2K）（U2J） [pF] RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● 0.5 1 1.5 2 3 4 5 6 7 8 9 10 12 15 18 22 27 33 39 47 56 68 82 100 ±0.25pF ±0.5pF ±0.5pF ±1pF 0.3±0.03 ± （0.012±0.001） ± ±5% ±10% 注：形名の△には温度特性、□には静電容量許容差記号が入ります。 △ Please specify the temperature characteristics code and □ the capacitance tolerance code. 58 ！ 当社カタログをご使用の際には 「当社製品に関するお断り」を必ずお読みください。 △ ！ Please read the "Notice for TAIYO YUDEN products" before using this catalog. △ アイテム一覧 PART NUMBERS 105TYPE Class 1 定格電圧 Rated 形 名 Voltage Ordering code （DC） △ 0R5□W △ 0 1 0□W △ 1R5□W △ 0 2 0□W △ 0 3 0□W △ 0 4 0□W △ 0 5 0□W △ 0 6 0□W △ 0 7 0□W △ 0 8 0 □○ △ 0 9 0 □○ △ 1 0 0 □○ △ 1 2 0 □○ △ 1 5 0 □○ △ 1 8 0 □○ △ 2 2 0□ V △ 2 7 0□ V △ 3 3 0□ V △ 3 9 0□ V △ 4 7 0□ V △ 5 6 0□ V △ 6 8 0□ V △ 8 2 0□ V △ 1 0 1□ V △ 1 2 1□ V △ 1 5 1□ V △ 1 8 1□ V △ 2 2 1□ V △ 2 7 1□ V △ 3 3 1□ V SL 1 2 1 □ V SL 1 5 1 □ V SL 1 8 1 □ V SL 2 2 1 □ V SL 2 7 1 □ V SL 3 3 1 □ V RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● 0.5 1 1.5 2 3 4 5 6 7 8 9 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 120 150 180 220 270 330 ±0.25pF ±0.5pF ±0.5pF ±1pF 4 CAPACITORS 50V UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 温度特性 公称静電 EHS 静電容量 厚み Temperature characteristics（EIA） 容  量 許 容 差 （Environmental Thicknees Hazardous CK CJ CH CG PK PJ PH RK RJ RH SK SJ SH TK TJ TH UK UJ Capacitance Capacitance [mm] SL tolerance （inch） Substances） （C0K）（C0J）（C0H）（C0G）（P2K）（P2J）（P2H）（R2K）（R2J）（R2H）（S2K）（S2J）（S2H）（T2K）（T2J）（T2H）（U2K）（U2J） [pF] 0.5±0.05 （0.020±0.002） ±5% ±10% 注：形名の△には温度特性、□には静電容量許容差記号、○にはCHの時には 「V」、UJの時は 「W」 が入ります。 △ Please specify the temperature characteristics code. □ Please specify the capacitance tolerance code. ○ comes to“V”when △ is“ＣＨ”and“W”when △ is“UJ” . 105TYPE Class 1 定格電圧 Rated 形 名 Voltage Ordering code （DC） 50V UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 UMK10 5 温度特性 公称静電 EHS 静電容量 厚み Temperature characteristics（EIA） 容  量 許 容 差 （Environmental Thicknees Hazardous CK CJ CH CG PK PJ PH RK RJ RH SK SJ SH TK TJ TH UK UJ Capacitance Capacitance [mm] SL tolerance （inch） Substances） （C0K）（C0J）（C0H）（C0G）（P2K）（P2J）（P2H）（R2K）（R2J）（R2H）（S2K）（S2J）（S2H）（T2K）（T2J）（T2H）（U2K）（U2J） [pF] △ 0 R 5 BW △ 0 1 0 BW △ 1 R 2 BW △ 1 R 5 BW △ 1 R 8 BW △ 2R2 J W △ 2R7 J W △ 3R3 J W △ 3R9 J W △ 4R7 J W △ 5R6 J W △ 6R8 J W △ 8R2 J W △ 1 0 0 JW △ 1 2 0 JW △ 1 5 0 JW △ 1 8 0 JW △ 2 0 0 JW RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● 0.5 1 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 20 ±0.1pF 0.5±0.05 （0.020±0.002） ±5% 注：形名の△には温度特性が入ります。 △ Please specify the temperature characteristics code. ！ 当社カタログをご使用の際には 「当社製品に関するお断り」を必ずお読みください。 △ ！ Please read the "Notice for TAIYO YUDEN products" before using this catalog. △ 59 梱包 PACKAGING ①最小受注単位数 Minimum Quantity ■テーピング梱包  Taped packaging  形式 （EIA ） Type 標準数量 Standard quantity [ pcs ] 製品厚み Thickness 紙テープ paper エンボステープ Embossed tape C 15000 ̶ P 15000 ̶ 10000 ̶ 10000 ̶ 10000 ̶ mm （inch） code □MK042 （01005） 0.2 （0.008） □MK063 （0201） 0.3 （0.012） 0.3 （0.012） P 0.45 （0.018） K □2K096 （0302） □WK105 （0204） □MK105 （0402） □VK105（0402） 0.3 （0.012） 0.5 （0.020） P V, W W 0.45 （0.018） K 4000 ̶ 0.5 （0.020） V ̶ 4000 0.8 （0.031） A 4000 ̶ 0.5 （0.020） V 4000 ̶ 0.8 （0.031） A 4000 ̶ 0.6 （0.024） B 4000 ̶ 0.45 （0.018） K 4000 ̶ 0.85 （0.033） D 4000 ̶ 1.25 （0.049） G ̶ 3000 □4K212 （0805） 0.85 （0.033） D 4000 ̶ □2K212 （0805） 0.85 （0.033） D 4000 ̶ 0.85 （0.033） D 4000 ̶ 1.15 （0.045） F 1.25 （0.049） G ̶ 3000 1.6 （0.063） L ̶ 2000 0.85 （0.033） D ̶ 2000 □MK107 （0603） □WK107 （0306） □2K110 （0504） □MK212 （0805） □WK212 （0508） □MK316 （1206） □MK325 （1210） □MK432 （1812） 1.15 （0.045） F 1.5 （0.059） H 1.9 （0.075） N 2.0max （0.079） Y ̶ ③バルクカセット Bulk Cassette 2000 2.5 （0.098） M ̶ 500（Ｔ）, 1000（Ｐ） 2.5 （0.098） M ̶ 500 ②テーピング材質 Taping material ※□WK ※プレスポケットタイプは、  ボトムテープ無し。 Unit：mm（inch） 105, 107, 212形状で個別対応致しますのでお問い合せ下さい。 Please contact any of our offices for accepting your requirement according to dimensions 0402, 0603, 0805.(inch) ※□WK 98 ！ 当社カタログをご使用の際には 「当社製品に関するお断り」を必ずお読みください。 △ ！ Please read the "Notice for TAIYO YUDEN products" before using this catalog. △ 梱包 PACKAGING ③テーピング寸法 Taping dimensions   紙テープ Paper Tape（8mm幅） （0.315inches wide） エンボステープ Embossed tape（8mm幅） （0.315inches wide） 部品挿入角穴 4 2.0±0.05 テープ厚み 挿入ピッチ Insertion Pitch Tape Thickness チップ挿入部 Chip Cavity Type （ＥＩＡ） Ａ Ｂ Ｆ Ｔ T1 0.25 □MK042 （01005） （0.010） 2.0±0.05 0.36max. 0.27max. 0.45 （0.018） （0.079±0.002） （0.014） （0.011） 0.37 □MK063 （0201） （0.016） 2.0±0.05 0.45max. 0.42max. 0.67 （0.027） （0.079±0.002） （0.018） （0.017） 0.65 □WK105 （0204） （0.026） 2.0±0.05 0.45max 0.42max 1.15 （0.045） （0.079±0.002）（0.018max）（0.017max） チップ挿入部 Type □WK107（0306） □MK212（0805） Unit：mm（inch） □MK316（1206） 部品挿入角穴 □MK325（1210） テープ厚み Insertion Pitch Tape Thickness Chip cavity （EIA） 挿入ピッチ CAPACITORS T1 2.0±0.05 A B 1.0 1.8 F 1.3max. 0.25±0.1 K T （0.039） （0.071） （0.051max.） （0.01±0.004） 1.655 2.4 （0.065） （0.094） 2.0 3.6 （0.079） （0.142） 2.8 3.6 （0.110） （0.142） 4.0±0.1 （0.157±0.004）3.4max. 0.6max. （0.134max.）（0.024max.） Unit：mm（inch） エンボステープ Embossed tape（12mm幅） （0.472inches wide） 2.0±0.05 2.0±0.05 Type （EIA） □2K096 （0302） チップ挿入部 挿入ピッチ Chip Cavity Insertion Pitch Tape Thickness A B 0.72 1.02 （0.028） □MK105 （0402） 0.655 □VK105 （0402） （0.026） F テープ厚み T 52.0±0.05 0.45max.(0.018max) （0.040） （0.079±0.002）0.6max.(0.024max) 1.155 52.0±0.05 0.8max. （0.045） （0.079±0.002）（0.031max.） Unit：mm（inch） Type （EIA） □MK432（1812） チップ挿入部 A 3.7 （0.146） 挿入ピッチ テープ厚み Insertion Pitch Tape Thickness Chip cavity B F 4.9 8.0±0.1 K T 4.0max. 0.6max. （0.193） （0.315±0.004） （0.157max.）（0.024max.） Unit：mm（inch） Type （EIA） チップ挿入部 挿入ピッチ Chip Cavity Insertion Pitch Tape Thickness A □MK107 （0603） 1.0 （0306） （0.039） □WK107 □2K110 （0504） 1.15 （0.045） B F T 1.8 4.0±0.1 1.1max. （0.071） （0.157±0.004） （0.043max.） 1.55 4.0±0.1 1.0max. （0.061） （0.157±0.004） （0.039max.） □MK212 （0805） □WK212 （0508） 1.655 2.4 □4K212 （0805） （0.065） （0.094） 4.0±0.1 1.1max. （0.157±0.004） （0.043max.） □2K212 （0805） □MK316 （1206） テープ厚み 2.0 3.6 （0.079） （0.142） Unit：mm（inch） ！ 当社カタログをご使用の際には 「当社製品に関するお断り」を必ずお読みください。 △ ！ Please read the "Notice for TAIYO YUDEN products" before using this catalog. △ 99 梱包 PACKAGING ④リーダー部／空部 Leader and Blank portion  160mm以上 （6.3inches or more） 100mm以上 （3.94inches or more） 引き出し方向 Direction of tape feed 400mm以上 （15.7inches or more） ⑤リール寸法 Reel size  ⑥トップテープ強度 Top Tape Strength  トップテープのはがし力は下図矢印方向にて0.1∼0.7Nとなります。 The top tape requires a peel-off force of 0.1∼0.7N in the direction of the arrow as illustrated below. 100 ！ 当社カタログをご使用の際には 「当社製品に関するお断り」を必ずお読みください。 △ ！ Please read the "Notice for TAIYO YUDEN products" before using this catalog. △ 1/3 RELIABILITY DATA Multilayer Ceramic Capacitor Chips Specified Value Item Standard 1.Operating Temperature High Permitivity（Class 2） Temperature Compensating（Class 1） High Frequency Type Standard Note1 BJ：−55 to ＋125℃ −55 to ＋125℃ Test Methods and Remarks High Value −25 to ＋85℃ High Capacitance Type BJ（X7R） ：−55∼＋125℃, BJ（X5R） ：−55∼＋85℃ −25 to ＋85℃ High Capacitance Type BJ（X7R） ：−55∼＋125℃, BJ（X5R） ：−55∼＋85℃ F：−25 to ＋85℃ Range 2. S t o r a g e Te m p e r a t u r e BJ：−55 to ＋125℃ −55 to ＋125℃ E（Y5U）：−30∼＋85℃, F（Y5V）：−30∼＋85℃ F：−25 to ＋85℃ Range 50VDC,25VDC, 16VDC 16VDC 50VDC No breakdown or No abnormality 50VDC,25VDC E（Y5U）：−30∼＋85℃, F（Y5V）：−30∼＋85℃ 50VDC,35VDC,25VDC 16VDC,10VDC,6.3VDC 4DVC, 2.5VDC 4.Withstanding Voltage Between terminals Applied voltage: Rated voltage×3 （Class 1） No breakdown or damage Rated voltage×2.5（Class 2） damage Duration: 1 to 5 sec. Charge/discharge current: 50mA max.（Class 1,2） 5.Insulation Resistance 500 MΩμF. or 10000 MΩ., whichever is the Applied voltage: Rated voltage 10000 MΩ min. Duration: 60±5 sec. smaller. Charge/discharge current: 50mA max. Note 5 6.Capacitance（Tolerance） 0.5 to 5 pF: ±0.25 pF 0.5 to 2 pF : ±0.1 pF BJ: ±10%, ±20% BJ：±10％、±20％ 1 to 10pF: ±0.5 pF 2.2 to 5.1 pF : ±5% F：＋80% F：−20％／＋80％ 5 to 10 pF: ±1 pF −20 11 pF or over: ± 5% ±10% 105TYPER△, S△, T△, U△ only 0.5∼2pF: ±0.1pF 2.2∼20pF: ±5% 7.Q or Tangent of Loss Angle Under 30 pF R e f e r t o d e t a i l e d BJ: 2.5% max.（50V, 25V） BJ：2.5％ max. （tan δ） : Q≧400 ＋ 20C specification F: 5.0% max.（50V, 25V） F：7％ max. Note 4 30 pF or over : Q≧1000 Note 4 C= Nominal capacitance Measuring frequency： Class1： 1ＭHz±10%（C≦1000pF） 1ｋHz±10%（C＞1000pF） Class2： 1ｋHz±10%（C≦10μF） 120Hz±10Hz（C＞10μF） Measuring voltage： Note 4 Class1：0.5∼5Vrms（C≦1000pF） 1±0.2Vrms（C＞1000pF） Class2： 1±0.2Vrms（C≦10μF） 0.5±0.1Vrms（C＞10μF） Bias application: None Multilayer: Measuring frequency： Class1： 1ＭHz±10%（C≦1000pF） 1ｋHz±10%（C＞1000pF） Class2： 1ｋHz±10%（C≦10μF） 120Hz±10Hz（C＞10μF） Measuring voltage： Note 4     Class1：0.5∼5Vrms（C≦1000pF） 1±0.2Vrms（C＞1000pF） Class2： 1±0.2Vrms（C≦10μF） 0.5±0.1Vrms（C＞10μF） Bias application: None HighーFrequencyーMultilayer: Measuring frequency: 1GHz Measuring equipment: HP4291A Measuring jig: HP16192A 8.Temperature （Without CK：0±250 CH：0±60 BJ：±10％（−25∼85℃） BJ：±10％ According to JIS C 5102 clause 7.12. Characteristic voltage ap- CJ：0±120 RH：−220±60 F： ＋30％（−25∼85℃）   （−25∼＋85℃） Temperature compensating: BJ（X7R） ：±15％ F：＋30％／−80％ Measurement of capacitance at 20℃ and 85℃ shall be F（Y5V） ：＋22   ％   （−25∼＋85℃） made to calculate temperature characteristic by the fol- of Capacitance plication） CH：0±60 4 CAPACITORS 3.Rated Voltage （ppm/℃） CG：0±30 −80 −82 RH：−220±60 BJ（X7R、X5R） ： SK：−330±250   ±15％ SJ：−330±120 F（Y5V） ： SH：−330±60   ＋22％／−82％ lowing equation. （C85ー C20） × 106 （ppm/℃） C20×△T High permitivity: TK：−470±250 Change of maximum capacitance deviation in step 1 to 5 TJ：−470±120 Temperature at step 1: ＋20℃ UK：−750±250 Temperature at step 2: minimum operating temperature UJ：−750±120 Temperature at step 3: ＋20℃（Reference temperature） S L ： ＋ 350 t o ー 1000 Temperature at step 4: maximum operating temperature Temperature at step 5: ＋20℃ （ppm/℃） Reference temperature for X7R, X5R, Y5U and Y5V shall be ＋25℃ 9.Resistance to Flexure of Substrate Appearance: Appearance: Appearance: No abnormality No abnormality No abnormality Capacitance change: Capacitance change: Capacitance change: Within ±5% or ±0.5 pF, Within±0.5 pF BJ：Within ±12.5% whichever is larger. ！ 当社カタログをご使用の際には 「当社製品に関するお断り」を必ずお読みください。 △ Warp: 1mm Testing board: glass epoxyーresin substrate Thickness: 1.6mm（063 TYPE : 0.8mm） The measurement shall be made with board in the bent position. F：Within ±30% ！ Please read the "Notice for TAIYO YUDEN products" before using this catalog. △ 103 2/3 RELIABILITY DATA Multilayer Ceramic Capacitor Chips Specified Value Temperature Compensating（Class 1） Item Standard 10.Body Strength High Frequency Type High Permittivity（Class 2） Standard Note1 Test Methods and Remarks High Value No mechanical dam- High Frequency Multilayer: age. Applied force: 5N 4 Duration: 10 sec. A 11.Adhesion of Electrode No separation or indication of separation of electrode. A （LW Reverse） Applied force: 5N （01005, 0201, 0302 TYPE 2N） Duration: 30±5 sec. 12.Solderability At least 95% of terminal electrode is covered by new solder. Solder temperature: 230±5℃ 13.Resistance to soldering Appearance: No ab- Appearance: No ab- Appearance: No abnormality normality Capacitance change: Within ±7.5%（BJ） CAPACITORS A Duration: 4±1 sec. normality Preconditioning: Thermal treatment（at 150℃ for 1 hr） Within ±20%（F） Capacitance change: Capacitance change: W i t h i n ± 2 . 5 % o r Within ±2.5% tan δ: Initial value ±0.25pF, whichever is Q: Initial value Insulation resistance: Initial value larger. Insulation resistance: Withstanding voltage（between terminals） : No Q: Initial value Initial value abnormality Note 4 Duration: 3±0.5 sec. Preheating conditions: 80 to 100℃, 2 to 5 min. or 5 to 10 min. 150 to 200℃, 2 to 5 min. or 5 to 10 min. Recovery: Recovery for the following period under the Insulation resistance: Withstanding voltage standard condition after the test. 6∼24 hrs（Class 1） （between terminals）: Initial value （Applicable to Class 2.） Solder temperature: 270±5℃ 24±2 hrs（Class 2） Withstanding voltage No abnormality （between terminals）: No abnormality 14.Thermal shock Appearance: No ab- Appearance: No abnormality normality Preconditioning: Thermal treatment（at 150℃ for 1 hr） Appearance: No abnormality Capacitance change: Within ±7.5%（BJ） Within ±20%（F） Capacitance change: Capacitance change: （Applicable to Class 2.） Conditions for 1 cycle: 0 ℃ 30±3 min. Step 1: Minimum operating temperature ＋ −3 W i t h i n ± 2 . 5 % o r Within ±0.25pF tan δ: Initial value ±0.25pF, whichever is Q: Initial value Insulation resistance: Initial value Step 2: Room temperature larger. Insulation resistance: Withstanding voltage（between terminals） : No 0 ℃ 30±3 min. Step 3: Maximum operating temperature − ＋ Q: Initial value Initial value abnormality Step 4: Room temperature Note 4 2 to 3 min. Number of cycles: 5 times Insulation resistance: Withstanding voltage Recovery after the test: 6∼24 hrs（Class 1） （between terminals）: Initial value 2 to 3 min. 3 24±2 hrs（Class 2） Withstanding voltage No abnormality （between terminals）: No abnormality 15.Damp Heat（steady state） Appearance: No ab- Appearance: No ab- Multilayer： normality normality Preconditioning: Thermal treatment（at 150℃ for 1 hr） Capacitance change: Capacitance change: Capacitance change: Capacitance change: Within ±5% or ±0.5pF, Within ±0.5pF, BJ: Within ±12.5% BJ:Within ±12.5% Temperature: 40±2℃ whichever is larger. Insulation resistance: F: Within ±30% Note 4 Humidity: 90 to 95% RH Q: 1000 MΩ min. tan δ: BJ: 5.0% max. tan δ: Duration: 500 ＋24 −0 hrs BJ: 5.0% max. Note 4. Recovery: Recovery for the following period under the standard condition after the removal from test chamber. Appearance: No ab- Appearance: No abnormality normality C≧30 pF F: 7.5% max. : Q≧350 10 ≦ C ＜ 30 p F : Q ≧ Note 4 F: 11.0% max. 275 ＋ 2.5C Insulation resistance: Insulation resistance: C＜10 pF : Q≧200 50 MΩμF or 1000 MΩ 50 MΩμF or 1000 MΩ （Applicable to Class 2.） 6∼24 hrs（Class 1） 24±2 hrs（Class 2） ＋ 10C whichever is smaller. whichever is smaller. HighーFrequency Multilayer: C: Nominal capacitance Note 5 Note 5 Temperature: 60±2℃ Insulation resistance: Humidity: 90 to 95% RH 1000 MΩ min. ＋24 hrs Duration: 500 − 0 Recovery: Recovery for the following period under the standard condition after the removal from test chamber. 6∼24 hrs（Class 1） ！ 当社カタログをご使用の際には 「当社製品に関するお断り」を必ずお読みください。 △ ！ Please read the "Notice for TAIYO YUDEN products" before using this catalog. △ 105 3/3 RELIABILITY DATA Multilayer Ceramic Capacitor Chips Specified Value Item 16.Loading under Damp Heat High Permittivity（Class 2） Test Methods and Remarks Standard High Frequency Type Standard Note1 High Value Appearance: No abnormality Capacitance change: Within ± 7.5% or ± 0.75pF, whichever is larger. Q: C≧30 pF: Q≧200 C＜30 pF: Q≧100 ＋ 10C/3 C ： Nominal capacitance Insulation resistance: 500 MΩ min. Appearance: No abnormality Capacitance change: C≦2 pF: Within ±0.4 pF C＞2 pF: Within ±0.75 pF C ： Nominal capacitance Insulation resistance: 500 MΩ min. Appearance: No abnormality Capacitance change: BJ: Within ±12.5% F: Within ±30% Note 4 tan δ: BJ: 5.0% max. F: 7.5% max. Note 4 Insulation resistance: 25 MΩμF or 500 MΩ, whichever is the smaller. Note 5 Appearance: No abnormality Capacitance change: BJ：Within±12.5％ F：Within±30％ Note 4 tanδ： BJ：5.0％max. F：11％max. Note 4 Insulation resistance: 25 MΩμF or 500 MΩ, whichever is the smaller. Note 5 According to JIS C 5102 Clause 9. 9. Multilayer: Preconditioning: Voltage treatment（Class 2） Temperature: 40±2℃ Humidity: 90 to 95% RH Duration: 500 ＋24 hrs −0 Applied voltage: Rated voltage Charge and discharge current: 50mA max.（Class 1,2） Recovery: Recovery for the following period under the standard condition after the removal from test chamber. 6∼24 hrs（Class 1） 24±2 hrs（Class 2） HighーFrequency Multilayer: Temperature: 60±2℃ Humidity: 90 to 95% RH ＋24 Duration: 500 − hrs 0 Applied voltage: Rated voltage Charge and discharge current: 50mA max. Recovery: 6∼24 hrs of recovery under the standard condition after the removal from test chamber. Appearance: No abnormality Capacitance change: Within ±3% or ±0.3pF, whichever is larger. Q: C≧30 pF : Q≧350 10≦C＜30 pF: Q≧275 ＋ 2.5C C＜10 pF: Q≧200 ＋ 10C C：Nominal capacitance Insulation resistance: 1000 MΩ min. Appearance: No abnormality Capacitance change: Within ±3% or ± 0.3pF, whichever is larger. Insulation resistance: 1000 MΩ min. Appearance: No abnormality Capacitance change: BJ：Within±12.5％ Within±20％※※ Within±25％※※ F：Within±30％ Note 4 tanδ： BJ：5.0％max. F：11％max.  Note 4 Insulation resistance: 50 MΩμF or 1000 MΩ, whichever is smaller. Note 5 According to JIS C 5102 clause 9.10. Multilayer: Preconditioning: Voltage treatment（Class 2） Temperature:125±3℃（Class 1, Class 2: B, BJ（X7R） ） 85±2℃（Class 2: BJ,F） ＋48 Duration: 1000 − 0 hrs Applied voltage: Rated voltage×2 Note 6 Recovery: Recovery for the following period under the standard condition after the removal from test chamber.    6∼24 hrs（Class 1）     24±2 hrs（Class 2） HighーFrequency Multilayer: Temperature: 125±3℃（Class 1） Duration: 1000＋48 hrs −0 Applied voltage: Rated voltage×2 Recovery: 6∼24 hrs of recovery under the standard condition after the removal from test chamber. Appearance: No abnormality Capacitance change: BJ: Within ±12.5% F: Within ±30% Note 4 tan δ: BJ: 4.0% max. F: 7.5% max. Note 4 Insulation resistance: 50 MΩμF or 1000 MΩ, whichever is smaller. Note 5 4 CAPACITORS 17.Loading at High Temperature Temperature Compensating（Class 1） Note 1 :For 105 type, specified in "High value". Note 2 :Thermal treatment（Multilayer） : 1 hr of thermal treatment at 150 ＋0 /−10 ℃ followed by 24±2 hrs of recovery under the standard condition shall be performed before the measurement. Note 3 :Voltage treatment（Multilayer）: 1 hr of voltage treatment under the specified temperature and voltage for testing followed by 24±2 hrs of recovery under the standard condition shall be performed before the measurement. Note 4, 5 :The figure indicates typical inspection. Please refer to individual specifications. Note 6 :Some of the parts are applicable in rated voltage×1.5. Please refer to individual specifications. Note on standard condition: "standard condition" referred to herein is defined as follows: 5 to 35℃ of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure. When there are questions concerning measurement results: In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition." ！ 当社カタログをご使用の際には 「当社製品に関するお断り」を必ずお読みください。 △ ！ Please read the "Notice for TAIYO YUDEN products" before using this catalog. △ 107 1/6 PRECAUTIONS Precautions on the use of Multilayer Ceramic Capacitors Stages 1.Circuit Design Precautions Technical considerations Verification of operating environment, electrical rating and performance 1. A malfunction in medical equipment, spacecraft, nuclear 4 reactors, etc. may cause serious harm to human life or have severe social ramifications. As such, any capacitors to be CAPACITORS used in such equipment may require higher safety and/or reliability considerations and should be clearly differentiated from components used in general purpose applications. Operating Voltage（Verification of Rated voltage） 1. The operating voltage for capacitors must always be lower than their rated values. If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages should be lower than the rated value of the capacitor chosen. For a circuit where both an AC and a pulse voltage may be present, the sum of their peak voltages should also be lower than the capacitor's rated voltage. 2. Even if the applied voltage is lower than the rated value, the reliability of capacitors might be reduced if either a high frequency AC voltage or a pulse voltage having rapid rise time is present in the circuit. 2.PCB Design Pattern configurations （Design of Land-patterns） 1. When capacitors are mounted on a PCB, the amount of solder used（size of fillet）can directly affect capacitor per- 1.The following diagrams and tables show some examples of recommended patterns to prevent excessive solder amourts.（larger fillets which extend above the component end terminations） Examples of improper pattern designs are also shown. formance. Therefore, the following items must be carefully considered in the design of solder land patterns: （1）Recommended land dimensions for a typical chip capacitor land patterns for PCBs （1）The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or cracking. Therefore, when designing land-patterns it is necessary to consider the appropriate size and configuration of the solder pads which in turn determines the amount of solder necessary to form the fillets. Recommended land dimensions for wave-soldering （unit: mm） （2）When more than one part is jointly soldered onto the Type 107 212 316 L 1.6 2.0 3.2 3.2 W 0.8 51.25 1.6 2.5 same land or pad, the pad must be designed so that each component's soldering point is separated by solder-resist. Size 325 A 0.8∼1.0 1.0∼1.4 1.8∼2.5 1.8∼2.5 B 0.5∼0.8 0.8∼1.5 0.8∼1.7 0.8∼1.7 C 0.6∼0.8 0.9∼1.2 1.2∼1.6 1.8∼2.5 Recommended land dimensions for reflow-soldering （unit: mm） Type Size 042 063 105 107 212 316 325 L 0.4 0.6 1.0 1.6 2.0 3.2 3.2 432 4.5 W 0.2 0.3 0.5 0.8 51.25 1.6 2.5 3.2 A 0.15∼0.25 0.20∼0.30 0.45∼0.55 0.8∼1.0 0.8∼1.2 1.8∼2.5 1.8∼2.5 2.5∼3.5 B 0.10∼0.20 0.20∼0.30 0.40∼0.50 0.6∼0.8 0.8∼1.2 1.0∼1.5 1.0∼1.5 1.5∼1.8 C 0.15∼0.30 0.25∼0.40 0.45∼0.55 0.6∼0.8 0.9∼1.6 1.2∼2.0 1.8∼3.2 2.3∼3.5 Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore, please take proper precautions when designing land-patterns. Size Type 2.0 W 1.25 a 0.5∼0.6 b 0.5∼0.6 c 0.2∼0.3 d 0.5 Type 212（2 circuits） 110（2 circuits）096（2 circuits） L 2.0 1.37 W 1.25 1.0 0.6 a 0.5∼0.6 0.35∼0.45 0.25∼0.35 b 0.5∼0.6 0.55∼0.65 0.15∼0.25 c 0.5∼0.6 0.3∼0.4 0.15∼0.25 d 1.0 0.64 0.45 Size ！ 当社カタログをご使用の際には 「当社製品に関するお断り」を必ずお読みください。 △ 212（4 circuits） L 0.9 ！ Please read the "Notice for TAIYO YUDEN products" before using this catalog. △ 109 2/6 PRECAUTIONS Precautions on the use of Multilayer Ceramic Capacitors Stages Precautions Technical considerations LWDC Recommended land dimensions for reflow-soldering 4 Size L 107 212 50.8 1.25 1.0 1.6 2.0 W A 0.18∼0.22 0.25∼0.3 0.5∼0.7 B 0.2∼0.25 0.3∼0.4 C 0.9∼1.1 1.5∼1.7 CAPACITORS 105 0.52 Type 0.4∼0.5 1.9∼2.1 （unit: mm） （2）Examples of good and bad solder application 2.PCB Design Not recommended Items Recommended Mixed mounting of SMD and leaded components Component placement close to the chassis Hand-soldering of leaded components near mounted components Horizontal component placement Pattern configurations （Capacitor layout on panelized [breakaway] PC boards） 1-1. The following are examples of good and bad capacitor layout; SMD capacitors should be located to minimize any possible mechanical stresses from board warp or deflection. 1. After capacitors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent Not recommended Recommended manufacturing processes（PCB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered boards etc.） For this reason, Deflection of planning pattern configurations and the position of SMD ca- the board pacitors should be carefully performed to minimize stress. 1-2. To layout the capacitors for the breakaway PC board, it should be noted that the amount of mechanical stresses given will vary depending on capacitor layout. The example below shows recommendations for better design. 1-3. When breaking PC boards along their perforations, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, any ideal SMD capacitor layout must also consider the PCB splitting procedure. ！ 当社カタログをご使用の際には 「当社製品に関するお断り」を必ずお読みください。 △ ！ Please read the "Notice for TAIYO YUDEN products" before using this catalog. △ 111 3/6 PRECAUTIONS Precautions on the use of Multilayer Ceramic Capacitors Stages 3.Considerations for automatic placement Precautions Adjustment of mounting machine 1. Excessive impact load should not be imposed on the capacitors when mounting onto the PC boards. 2. The maintenance and inspection of the mounters should be conducted periodically. Technical considerations 1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the capacitors, causing damage. To avoid this, the following points should be considered before lowering the pick-up nozzle: （1）The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC board after correcting for deflection of the board. （2）The pick-up pressure should be adjusted between 1 and 3 N static loads. nozzle, supporting pins or back-up pins should be used under the PC board. The following diagrams show some typical examples of good pick-up nozzle placement: Not recommended Recommended Single-sided 4 CAPACITORS （3）To reduce the amount of deflection of the board caused by impact of the pick-up mounting Double-sided mounting 2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the capacitors because of mechanical impact on the capacitors. To avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance, inspection and replacement of the pin should be conducted periodically. Selection of Adhesives 1. Some adhesives may cause reduced insulation resistance. The difference between 1. Mounting capacitors with adhesives in preliminary assembly, the shrinkage percentage of the adhesive and that of the capacitors may result in before the soldering stage, may lead to degraded capacitor stresses on the capacitors and lead to cracking. Moreover, too little or too much characteristics unless the following factors are appropriately adhesive applied to the board may adversely affect component placement, so the fol- checked; the size of land patterns, type of adhesive, amount lowing precautions should be noted in the application of adhesives. applied, hardening temperature and hardening period. Therefore, it is imperative to consult the manufacturer of the adhesives on proper usage and amounts of adhesive to use. （1） Required adhesive characteristics a. The adhesive should be strong enough to hold parts on the board during the mounting & solder process. b. The adhesive should have sufficient strength at high temperatures. c. The adhesive should have good coating and thickness consistency. d. The adhesive should be used during its prescribed shelf life. e. The adhesive should harden rapidly f. The adhesive must not be contaminated. g. The adhesive should have excellent insulation characteristics. h. The adhesive should not be toxic and have no emission of toxic gasses. （2） The recommended amount of adhesives is as follows; Figure ！ 当社カタログをご使用の際には 「当社製品に関するお断り」を必ずお読みください。 △ 212/316 case sizes as examples a 0.3mm min b 100 ∼120 μm c Adhesives should not contact the pad ！ Please read the "Notice for TAIYO YUDEN products" before using this catalog. △ 113 4/6 PRECAUTIONS Precautions on the use of Multilayer Ceramic Capacitors Stages 4. Soldering Precautions Technical considerations 1-1. When too much halogenated substance（Chlorine, etc.）content is used to activate Selection of Flux 1. Since flux may have a significant effect on the performance the flux, or highly acidic flux is used, an excessive amount of residue after soldering of capacitors, it is necessary to verify the following condi- may lead to corrosion of the terminal electrodes or degradation of insulation resis- tions prior to use; tance on the surface of the capacitors. （1）Flux used should be with less than or equal to 0.1 wt% 1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a （equivelent to chroline）of halogenated content. Flux large amount of flux gas may be emitted and may detrimentally affect solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system. 1-3. Since the residue of water-soluble flux is easily dissolved by water content in the flux applied should be controlled at the optimum level. air, the residue on the surface of capacitors in high humidity conditions may cause a （3）When using water-soluble flux, special care should be degradation of insulation resistance and therefore affect the reliability of the compo- taken to properly clean the boards. nents. The cleaning methods and the capability of the machines used should also be considered carefully when selecting water-soluble flux. Soldering 1-1. Preheating when soldering Temperature, time, amount of solder, etc. are specified in ac- Heating: Ceramic chip components should be preheated to within 100 to 130℃ of the CAPACITORS having a strong acidity content should not be applied. （2）When soldering capacitors on the board, the amount of 4 soldering. cordance with the following recommended conditions. Cooling: The temperature difference between the components and cleaning process should not be greater than 100℃. Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. Therefore, the soldering process must be conducted with great care so as to prevent malfunction of the components due to excessive thermal shock. Recommended conditions for soldering Sn-Zn solder paste can affect MLCC reliability performance. [Reflow soldering] Please contact us prior to usage. 温度 （℃） 300 Temperature profile Peak 260℃ max 10 sec max 200 200 徐冷 Gradually cooling Preheating 100 100 0 予熱150℃ 60秒以上 本加熱230℃以上 40秒迄 0 ※チップとはんだ温度との差が100∼１３０℃以下になるよ  うに十分予熱を行ってください。 ※回数は２回迄の保証となります。 温度 （℃） 300 Caution 150℃ 60 sec min Heating above 230℃ 40 sec max ※Ceramic chip components should be preheated to within 100 to 130℃ of the soldering. ※Assured to be reflow soldering for 2 times. （Pb free soldering） Temperature （℃） 300 1. The ideal condition is to have solder mass （fillet） controlled tomax 1/2 to 1/3 of the Peak 260℃ ピーク260℃以下 10 sec max 10秒迄 thickness of the capacitor, as shown below: 200 （Pb free soldering） Temperature （℃） 300 ピーク260℃以下 10秒迄 予熱150℃ 200 Gradually cooling Preheating 150℃ 徐冷 100 （Pb free soldering） Temperature （℃） 300 Capacitor 120秒以上 Peak 260℃ ピーク260℃以下 120 sec min max 10 sec max 10秒迄 0 0 Solder 200 ※Ceramic chip components should be preheated to 200 ※チップとはんだ温度との差が１００∼１３０℃以下になるよ 100 温度 （℃） 300 100  うに十分予熱を行ってください。 ※回数は１回迄の保証となります。 ※リフロー仕様アイテムは除きます。 徐冷 PC board 100 within 100 to 130℃ of the soldering. Gradually ※Assured to be wave soldering for 1 time. cooling ※Except for reflow soldering type. Preheating 2. Because dwell times can detrimentally affect solderability, soldering 150℃ 予熱150℃ excessive Heating abovedu230℃ 本加熱230℃以上 60 sec min （Pb free 60秒以上 40 sec max 40秒迄 soldering） Temperature 温度 （℃） 0 （℃） 0 ration should be kept as close to recommended as possible. 400 times 400 ※チップとはんだ温度との差が100∼ ※Ceramic chip components should be preheated to １３０℃以下になるよ 350℃以下 3秒迄  うに十分予熱を行ってください。 [Wave soldering] 300 ※回数は２回迄の保証となります。 ⊿Ｔ Temperature 200 温度 （℃） 100 300 profile 徐冷 350℃ max within 100 to 130℃ of the soldering. 3 sec max ※Assured to be reflow soldering for 2 times. Gradually ⊿Ｔ cooling 300 200 （Pb free soldering） Temperature （℃） 100 300 ピーク260℃以下 60秒以上 10秒迄 60 secmax min Peak 260℃ 10 sec max 0 200（※⊿Ｔ≦190℃（3216タイプ以下）、⊿Ｔ≦130℃（3225以上）。） 0 200（※⊿Ｔ≦190℃（3216Type max）, ⊿Ｔ≦130℃（3225 100 100 ※The soldering iron should not directly touch the 0 ※はんだコテは20Wで先端が1φ以下のものを推奨致します。 予熱150℃ 徐冷 ※コテ先がチップに直接触れないようにご留意下さい。 ※回数は1回迄の保証となります。 注：上記温度プロファイルは最大許容条件であり、   常にこれを推奨するものではございません。 120秒以上 ※チップとはんだ温度との差が１００∼１３０℃以下になるよ  うに十分予熱を行ってください。 ※回数は１回迄の保証となります。 ※リフロー仕様アイテムは除きます。 温度 （℃） 400 Caution Gradually Type min） ） Preheating cooling ※It is recommended to use 20W soldering iron and 150℃ the tip is 1φ or less. 0 components. secsoldering min ※Assured120 to be iron for 1 time. ※Ceramic chip components should be preheated to Note: The above profiles are the maximum allowable within 100 to condition, 130℃ of the soldering. soldering therefore these profiles are ※Assured to be wave soldering for 1 time. not always recommended. ※Except for reflow soldering type. （Pb free soldering） Temperature （℃） 400 350℃以下 1. Make sure the capacitors are preheated sufficiently. 350℃ max 3 sec max 3秒迄 300 and melted solder should not be 2. The temperature difference between the capacitor Gradually 300 ⊿Ｔ 200 100 徐冷 greater than 100 to 130℃ ⊿Ｔ 200 cooling 3. Cooling after soldering should be as gradual as 100possible. 60 sec min 0 4. Wave60秒以上 soldering must not be applied to the capacitors designated as for reflow sol0 イプ以下） 、 ⊿Ｔ≦130℃ （3225以上） 。） （※⊿Ｔ≦190℃ （3216タ dering only. ※はんだコテは20Wで先端が1φ以下のものを推奨致します。 ※コテ先がチップに直接触れないようにご留意下さい。 ※回数は1回迄の保証となります。 注：上記温度プロファイルは最大許容条件であり、   常にこれを推奨するものではございません。 , ⊿Ｔ≦130℃（3225 （※⊿Ｔ≦190℃（3216Type max） Type min） ） ※It is recommended to use 20W soldering iron and the tip is 1φ or less. ※The soldering iron should not directly touch the components. ※Assured to be soldering iron for 1 time. Note: The above profiles are the maximum allowable soldering condition, therefore these profiles are not always recommended. ！ 当社カタログをご使用の際には 「当社製品に関するお断り」を必ずお読みください。 △ ！ Please read the "Notice for TAIYO YUDEN products" before using this catalog. △ 115 ※Ceramic chip components should be preheated to within 100 to 130℃ of the soldering. ※Assured to be reflow soldering for 2 times. ※チップとはんだ温度との差が100∼１３０℃以下になるよ  うに十分予熱を行ってください。 ※回数は２回迄の保証となります。 温度 （℃） 300 PRECAUTIONS Peak 260℃ max 10 sec max 200 200 Precautions on the use of Multilayer Ceramic Capacitors Stages 予熱150℃ 100 120秒以上 0 4. Soldering 5/6 Gradually cooling Preheating 150℃ 徐冷 100 Precautions （Pb free soldering） Temperature （℃） 300 ピーク260℃以下 10秒迄 Technical considerations 0 ※チップとはんだ温度との差が１００∼１３０℃以下になるよ  うに十分予熱を行ってください。 なります。 ※回数は １回迄の保証と [Hand soldering] ※リフロー仕様アイテムは除きます。  Temperature profile 温度 （℃） 400 ⊿Ｔ 300 徐冷 200 （Pb free soldering） Temperature （℃） 400 350℃以下 3秒迄 300 120 sec min ※Ceramic chip components should be preheated to within 100 to 130℃ of the soldering. ※Assured to be wave soldering for 1 time. ※Except for reflow soldering type. 350℃ max 3 sec max ⊿Ｔ 200 Gradually cooling 60 sec min 60秒以上 0 0 、 ⊿Ｔ≦130℃ （3225以上） 。） （※⊿Ｔ≦190℃ （3216タイプ以下） ※はんだコテは20Wで先端が1φ以下のものを推奨致します。 ※コテ先がチップに直接触れないようにご留意下さい。 ※回数は1回迄の保証となります。 注：上記温度プロファイルは最大許容条件であり、   常にこれを推奨するものではございません。 , ⊿Ｔ≦130℃（3225 （※⊿Ｔ≦190℃（3216Type max） Type min） ） ※It is recommended to use 20W soldering iron and the tip is 1φ or less. ※The soldering iron should not directly touch the components. ※Assured to be soldering iron for 1 time. Note: The above profiles are the maximum allowable soldering condition, therefore these profiles are not always recommended. CAPACITORS 100 100 4 Caution 1. Use a 20W soldering iron with a maximum tip diameter of 1.0 mm. 2. The soldering iron should not directly touch the capacitor. 5.Cleaning Cleaning conditions 1. When cleaning the PC board after the capacitors are all 1. The use of inappropriate solutions can cause foreign substances such as flux residue to adhere to the capacitor or deteriorate the capacitor's outer coating, resulting in a mounted, select the appropriate cleaning solution according degradation of the capacitor's electrical properties（especially insulation resistance） . to the type of flux used and purpose of the cleaning（e.g. 2. Inappropriate cleaning conditions（insufficient or excessive cleaning）may detrimen- to remove soldering flux or other materials from the produc- tally affect the performance of the capacitors. tion process.） 2. Cleaning conditions should be determined after verifying, through a test run, that the cleaning process does not affect the capacitor's characteristics. （1） Excessive cleaning In the case of ultrasonic cleaning, too much power output can cause excessive vibration of the PC board which may lead to the cracking of the capacitor or the soldered portion, or decrease the terminal electrodes' strength. Thus the following conditions should be carefully checked; Ultrasonic output Below 20 W/ℓ Ultrasonic frequency Below 40 kHz Ultrasonic washing period 5 min. or less 6.Post cleaning processes 1. With some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal storage conditions resulting in the deterioration of the capacitor's performance. 2. When a resin's hardening temperature is higher than the capacitor's operating temperature, the stresses generated by the excess heat may lead to capacitor damage or destruction. The use of such resins, molding materials etc. is not recommended. 7.Handling Breakaway PC boards（splitting along perforations） 1. When splitting the PC board after mounting capacitors and other components, care is required so as not to give any stresses of deflection or twisting to the board. 2. Board separation should not be done manually, but by using the appropriate devices. Mechanical considerations 1. Be careful not to subject the capacitors to excessive mechanical shocks. （1）If ceramic capacitors are dropped onto the floor or a hard surface, they should not be used. （2）When handling the mounted boards, be careful that the mounted components do not come in contact with or bump against other boards or components. ！ 当社カタログをご使用の際には 「当社製品に関するお断り」を必ずお読みください。 △ ！ Please read the "Notice for TAIYO YUDEN products" before using this catalog. △ 117 6/6 PRECAUTIONS Precautions on the use of Multilayer Ceramic Capacitors Stages 8.Storage conditions Precautions Technical considerations 1. If the parts are stored in a high temperature and humidity environment, problems Storage 1. To maintain the solderability of terminal electrodes and to such as reduced solderability caused by oxidation of terminal electrodes and dete- keep the packaging material in good condition, care must rioration of taping/packaging materials may take place. For this reason, components be taken to control temperature and humidity in the storage should be used within 6 months from the time of delivery. If exceeding the above area. Humidity should especially be kept as low as possible. period, please check solderability before using the capacitors. ・Recommended conditions Below 30℃ Humidity Below 70% RH 4 CAPACITORS Ambient temperature The ambient temperature must be kept below 40℃. Even under ideal storage conditions capacitor electrode solderability decreases as time passes, so should be used within 6 months from the time of delivery. ・Ceramic chip capacitors should be kept where no chlorine or sulfur exists in the air. 2. The capacitance value of high dielectric constant capacitors （type 2 &3）will gradually decrease with the passage of time, so this should be taken into consideration in the circuit design. If such a capacitance reduction occurs, a heat treatment of 150℃ for 1hour will return the capacitance to its initial level. ！ 当社カタログをご使用の際には 「当社製品に関するお断り」を必ずお読みください。 △ ！ Please read the "Notice for TAIYO YUDEN products" before using this catalog. △ 119