Notice for TAIYO YUDEN Products
[ For High Quality and/or Reliability Equipment
(Automotive Electronic Equipment / Industrial Equipment) ]
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
■ Product information in this catalog is as of October 2018. All of the contents specified herein are subject to change
without notice due to technical improvements, etc. Therefore, please check for the latest information carefully
before practical application or use of our products.
Please note that TAIYO YUDEN shall not be in any way responsible for any damages and defects in products or
equipment incorporating our products, which are caused under the conditions other than those specified in this
catalog or individual product specification sheets.
■ Please contact TAIYO YUDEN for further details of product specifications as the individual product specification
sheets are available.
■ Please conduct validation and verification of our products in actual condition of mounting and operating
environment before using our products.
■ The products listed in this catalog are intended for use in general electronic equipment (e.g., AV equipment, OA
equipment, home electric appliances, office equipment, information and communication equipment), medical
equipment classified as Class I or II by IMDRF, industrial equipment, and automotive interior applications, etc.
Please be sure to contact TAIYO YUDEN for further information before using the products for any equipment which
may directly cause loss of human life or bodily injury (e.g., transportation equipment including, without limitation,
automotive powertrain control system, train control system, and ship control system, traffic signal equipment,
medical equipment classified as Class III by IMDRF).
Please do not incorporate our products into any equipment requiring high levels of safety and/or reliability (e.g.,
aerospace equipment, aviation equipment*, medical equipment classified as Class IV by IMDRF, nuclear control
equipment, undersea equipment, military equipment).
*Note: There is a possibility that our products can be used only for aviation equipment that does not directly affect the safe operation of aircraft (e.g.,
in-flight entertainment, cabin light, electric seat, cooking equipment) if such use meets requirements specified separately by TAIYO YUDEN.
Please be sure to contact TAIYO YUDEN for further information before using our products for such aviation equipment.
When our products are used even for high safety and/or reliability-required devices or circuits of general electronic
equipment, it is strongly recommended to perform a thorough safety evaluation prior to use of our products and to
install a protection circuit as necessary.
Please note that unless you obtain prior written consent of TAIYO YUDEN, TAIYO YUDEN shall not be in any way
responsible for any damages incurred by you or third parties arising from use of the products listed in this catalog
for any equipment requiring inquiry to TAIYO YUDEN or prohibited for use by TAIYO YUDEN as described above.
■ Information contained in this catalog is intended to convey examples of typical performances and/or applications
of our products and is not intended to make any warranty with respect to the intellectual property rights or any
other related rights of TAIYO YUDEN or any third parties nor grant any license under such rights.
■ Please note that the scope of warranty for our products is limited to the delivered our products themselves and
TAIYO YUDEN shall not be in any way responsible for any damages resulting from a fault or defect in our products.
Notwithstanding the foregoing, if there is a written agreement (e.g., supply and purchase agreement, quality
assurance agreement) signed by TAIYO YUDEN and your company, TAIYO YUDEN will warrant our products in
accordance with such agreement.
■ The contents of this catalog are applicable to our products which are purchased from our sales offices or
authorized distributors (hereinafter“TAIYO YUDEN’
s official sales channel”). Please note that the contents of this
catalog are not applicable to our products purchased from any seller other than TAIYO YUDEN’
s official sales
channel.
■ Caution for Export
Some of our products listed in this catalog may require specific procedures for export according to“U.S. Export
Administration Regulations”
,“Foreign Exchange and Foreign Trade Control Law”of Japan, and other applicable
regulations. Should you have any questions on this matter, please contact our sales staff.
19
Automotive Application Guide
We classify automotive electronic equipment into the following four application categories and set usable
application categories for each of our products. When using our products for automotive electronic
equipment, please be sure to check such application categories and use our products accordingly. Should
you have any questions on this matter, please contact us.
Category
SAFETY
・ABS (Anti-Lock Brake System)
・ESC (Electronic Stability Control)
・Airbag
・ADAS (Equipment that directly controls running, turning and stopping), etc.
BODY & CHASSIS
・Wiper
・Automatic Door
・Power Window
・Keyless Entry System
・Electric Door Mirror
・Interior Lighting
・LED Headlight
・TPMS (Tire Pressure Monitoring System)
・Anti-Theft Device (Immobilizer), etc.
INFOTAINMENT
・Car Infotainment System
・ITS/Telematics System
・Instrument Cluster
・ADAS (Sensor, Equipment that is not interlocked with safety equipment or powertrain), etc.
Automotive Application Guide
POWERTRAIN
Automotive Electronic Equipment (Typical Example)
・Engine ECU (Electronically Controlled Fuel Injector)
・Cruise Control Unit
・4WS (4 Wheel Steering)
・Automatic Transmission
・Power Steering
・HEV/PHV/EV Core Control (Battery, Inverter, DC-DC)
・Automotive Locator (Car location information providing device), etc.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
19
15
MULTILAYER
CERAMIC
CAPACITORS
MULTILAYER CERAMIC
CAPACITORS
REFLOW
REFLOW
AEC-Q200
AECQ200
■PART NUMBER
J M K
① ② ③
3
1 6
④
CERAMIC CAPACITORS
①Rated voltage
Code
A
J
L
E
T
G
U
H
Q
S
②Series name
Code
M
V
W
△
⑤
B
J
1
⑥
0 6
⑦
M L H T △
⑧ ⑨ ⑩ ⑪ ⑫
③End termination
Code
End termination
K
Plated
J
Soft Termination
S
Cu Internal Electrodes (For High Frequency)
F
High Reliability Application
Rated voltage［VDC］
4
6.3
10
16
25
35
50
100
250
630
④Dimension（L×W）
Dimensions
（L×W）［mm］
063
0.6 × 0.3
1.0 × 0.5
105
0.52× 1.0 ※
1.6 × 0.8
107
0.8 × 1.6 ※
2.0 × 1.25
212
1.25× 2.0 ※
316
3.2 × 1.6
325
3.2 × 2.5
432
4.5 × 3.2
Note : ※LW reverse type（□WK） only
Type
Series name
Multilayer ceramic capacitor
Multilayer ceramic capacitor for high frequency
LW reverse type multilayer capacitor
⑤Dimension tolerance
Code
Type
△
ALL
063
105
107
A
212
L［mm］
Standard
W［mm］
Standard
0.6±0.05
1.0±0.10
1.6＋0.15/－0.05
0.3±0.05
0.5±0.10
0.8＋0.15/－0.05
2.0＋0.15/－0.05
1.25＋0.15/－0.05
316
325
105
107
3.2±0.20
3.2±0.30
1.0＋0.15/－0.05
1.6＋0.20/－0
1.6±0.20
2.5±0.30
0.5＋0.15/－0.05
0.8＋0.20/－0
212
2.0＋0.20/－0
1.25＋0.20/－0
C
316
105
107
212
212
3.2±0.30
1.0＋0.20/－0
1.6＋0.25/－0
2.0＋0.25/－0
2.0±0.15
1.6±0.30
0.5＋0.20/－0
0.8＋0.25/－0
1.25＋0.25/－0
1.25±0.15
K
316
3.2±0.20
1.6±0.20
B
325
EIA（inch）
0201
0402
0204
0603
0306
0805
0508
1206
1210
1812
T［mm］
Standard
0.3±0.05
0.5±0.10
0.8＋0.15/－0.05
0.85±0.10
1.25＋0.15/－0.05
1.6±0.20
2.5±0.30
0.5＋0.15/－0.05
0.8＋0.20/－0
0.85±0.10
1.25＋0.20/－0
1.6±0.30
0.5＋0.20/－0
0.8＋0.25/－0
1.25＋0.25/－0
0.85±0.15
1.15±0.20
1.6±0.20
2.5±0.30
3.2±0.50
2.5±0.30
Note: ｃｆ. STANDARD EXTERNAL DIMENSIONS
⑥Temperature characteristics code
■High dielectric type
Applicable
Temperature
Code
standard
range［℃］
△＝Blank space
△= Blank space
Ref. Temp.［℃］
Capacitance change
BJ
EIA
X5R
－55～＋ 85
25
±15％
C6
EIA
X6S
－55～＋105
25
±22％
B7
EIA
X7R
－55～＋125
25
±15％
C7
EIA
X7S
－55～＋125
25
±22％
D7
EIA
X7T
－55～＋125
25
＋22％/－33％
Capacitance
tolerance
±10％
±20％
±10％
±20％
±10％
±20％
±10％
±20％
±10％
±20％
Tolerance
code
K
M
K
M
K
M
K
M
K
M
hq_c_mlcc_e-E07R01
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
18
19
■Temperature compensating type
Applicable
Code
standard
JIS
Temperature
range［℃］
CG
CG
Ref. Temp.［℃］
20
－55～＋125
EIA
⑧Capacitance tolerance
Code
A
B
C
D
G
J
K
M
C0G
0±30ppm/℃
25
Nominal capacitance
0.5pF
1pF
10pF
100pF
1,000pF
0.01μF
0.1μF
1.0μF
10μF
100μF
Capacitance tolerance
±0.05pF
±0.1pF
±0.25pF
±0.5pF
±2％
±5％
±10％
±20％
⑨Thickness
Code
P
T
V
C
A
D
F
G
L
N
M
Capacitance
tolerance
±0.1pF
±0.25pF
±0.5pF
±1pF
±2％
±5％
Tolerance
code
B
C
D
F
G
J
Thickness［mm］
0.3
0.5
0.7(107type or more)
0.8
0.85(212type or more)
1.15
1.25
1.6
1.9
2.5
⑩Special code
Code
H
⑪Packaging
Code
F
R
T
CERAMIC CAPACITORS
⑦Nominal capacitance
Code
（example）
0R5
010
100
101
102
103
104
105
106
107
Note : R＝Decimal point
Capacitance change
Special code
MLCC for Industrial and Automotive
Packaging
φ178mm Taping （2mm pitch）
φ178mm Embossed Taping （4mm pitch）
φ178mm Taping （4mm pitch）
φ178mm Taping （4mm pitch, 1000 pcs/reel）
325 type（Thickness code M）
P
⑫Internal code
Code
△
Internal code
Standard
hq_c_mlcc_e-E07R01
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
19
19
■STANDARD EXTERNAL DIMENSIONS
W
Type( EIA )
L
T
□MK063（0201）
□MK105（0402）
□MF105（0402）
e
□WK105（0204）※
□MK107（0603）
□MF107（0603）
L
□MJ107（0603）
W
□VS107（0603）
CERAMIC CAPACITORS
□WK107（0306）※
L
0.6±0.03
(0.024±0.001)
1.0±0.05
(0.039±0.002)
0.52±0.05
(0.020±0.002)
1.6±0.10
(0.063±0.004)
1.6±0.10
(0.063±0.004)
1.6±0.10
(0.063±0.004)
0.8±0.10
(0.031±0.004)
T
e
□MK212（0805）
□MF212（0805）
2.0±0.10
(0.079±0.004)
□MJ212（0805）
2.0±0.10
(0.079±0.004)
※ LW reverse type
□VS212（0805）
□WK212（0508）※
2.0±0.10
(0.079±0.004)
1.25±0.15
(0.049±0.006)
Dimension [mm] （inch）
W
T
0.3±0.03
0.3±0.03
(0.012±0.001)
(0.012±0.001)
0.5±0.05
0.5±0.05
(0.020±0.002)
(0.020±0.002)
1.0±0.05
0.3±0.05
(0.039±0.002)
(0.012±0.002)
0.8±0.10
0.8±0.10
(0.031±0.004)
(0.031±0.004)
0.8±0.10
0.8±0.10
(0.031±0.004)
(0.031±0.004)
0.8±0.10
0.7±0.10
(0.031±0.004)
(0.028±0.004)
1.6±0.10
0.5±0.05
(0.063±0.004)
(0.020±0.002)
0.85±0.10
(0.033±0.004)
1.25±0.10
(0.049±0.004)
1.25±0.10
(0.049±0.004)
0.85±0.10
(0.033±0.004)
1.25±0.10
(0.049±0.004)
1.25±0.10
(0.049±0.004)
1.25±0.10
0.85±0.10
(0.049±0.004)
(0.033±0.004)
2.0±0.15
0.85±0.10
(0.079±0.006)
(0.033±0.004)
□MK316（1206）
□MF316（1206）
3.2±0.15
(0.126±0.006)
1.6±0.15
(0.063±0.006)
□MJ316（1206）
3.2±0.15
(0.126±0.006)
1.6±0.15
(0.063±0.006)
□MK325（1210）
□MF325（1210）
□MJ325（1210）
3.2±0.30
(0.126±0.012)
3.2±0.30
(0.126±0.012)
2.5±0.20
(0.098±0.008)
2.5±0.20
(0.098±0.008)
4.5±0.40
3.2±0.30
□MK432（1812）
(0.177±0.016)
(0.126±0.012)
Note : ※. LW reverse type, *1.Thickness code
*1
T
V
P
A
A
C
V
D
G
D
G
D
D
1.15±0.10
(0.045±0.004)
Ｆ
1.6±0.20
(0.063±0.008)
L
1.15±0.10
(0.045±0.004)
Ｆ
1.6±0.20
(0.063±0.008)
1.15±0.10
(0.045±0.004)
1.9±0.20
(0.075±0.008)
2.5±0.20
(0.098±0.008)
1.9±0.20
(0.075±0.008)
2.5±0.20
(0.098±0.008)
2.5±0.20
(0.098±0.008)
L
e
0.15±0.05
(0.006±0.002)
0.25±0.10
(0.010±0.004)
0.18±0.08
(0.007±0.003)
0.35±0.25
(0.014±0.010)
0.35＋0.3/－0.25
(0.014＋0.012/－0.010)
0.35±0.25
(0.014±0.010)
0.25±0.15
(0.010±0.006)
0.5±0.25
(0.020±0.010)
0.5＋0.35/－0.25
（0.020＋0.014/－0.010）
0.5±0.25
(0.020±0.010)
0.3±0.2
(0.012±0.008)
0.5＋0.35/－0.25
（0.020＋0.014/－0.010）
0.6＋0.4/－0.3
（0.024＋0.016/－0.012）
F
N
0.6±0.3
(0.024±0.012)
M
N
M
M
0.6＋0.4/－0.3
（0.024＋0.016/－0.012）
0.9±0.6
(0.035±0.024)
hq_c_mlcc_e-E07R01
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
20
19
■STANDARD QUANTITY
Type
063
105
107
EIA（inch）
0201
0402
0204 ※
0603
0306 ※
212
0805
316
1206
325
1210
432
1812
Note : ※.LW Reverse type（□WK）
Code
T
V
P
C
A
0.8
Standard quantity［pcs］
Paper tape
Embossed tape
15000
－
10000
－
4000
－
A
3000
（Soft Termination）
－
0.8
A
－
0.50
0.85
1.25
V
D
G
－
4000
－
1.25
G
－
0.85
1.15
1.6
1.15
1.9
2.5
2.5
D
F
L
F
N
M
M
4000
－
－
3000
（Soft Termination）
4000
－
3000
2000
（Soft Termination）
－
3000
2000
－
2000
－
－
500（T），1000（P）
500
CERAMIC CAPACITORS
0508 ※
Dimension
［ｍｍ］
0.3
0.5
0.30
0.7
0.8
hq_c_mlcc_e-E07R01
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
19
21
■PART NUMBER
Medium-High Voltage Multilayer Ceramic Capacitors
●107TYPE (Dimension:1.6×0.8mm JIS:1608 EIA:0603）
【Temperature Characteristic B7 : X7R（－55～＋125℃）, C7 : X7S（－55～＋125℃）】 0.8mm thickness（A）
Part number 1
B7102[]AHT
B7152[]AHT
B7222[]AHT
B7332[]AHT
B7472[]AHT
B7682[]AHT
B7103[]AHT
B7153[]AHT
B7223[]AHT
B7333[]AHT
B7473[]AHT
B7104[]AHT
C7224[]AHTE
Rated voltage
[V]
100
Temperature
characteristics
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7S
Capacitance
[F]
1000
1500
2200
3300
4700
6800
0.01
0.015
0.022
0.033
0.047
0.1
0.22
p
p
p
p
p
p
μ
μ
μ
μ
μ
μ
μ
Capacitance
tolerance [％]
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
tanδ
[％]
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
HTLT
Rated voltage x ％
200
200
200
200
200
200
200
200
200
200
200
200
150
Thickness*3 [mm]
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
Note
*1,
*1,
*1,
*1,
*1,
*1,
*1,
*1,
*1,
*1,
*1,
*1,
*1,
*2
*2
*2
*2
*2
*2
*2
*2
*2
*2
*2
*2
*2
●212TYPE (Dimension:2.0×1.25mm JIS:2012 EIA:0805）
【Temperature Characteristic B7 : X7R（－55～＋125℃）, C7 : X7S（－55～＋125℃）】 1.25mm thickness（G）
Part number 1
Part number 2
HMK212 B7472[]GHT
HMK212 B7682[]GHT
HMK212 B7103[]GHT
HMK212 B7153[]GHT
HMK212 B7223[]GHT
HMK212 B7333[]GHT
HMK212 B7473[]GHT
HMK212 B7683[]GHT
HMK212 B7104[]GHT
HMK212 B7224[]GHT
HMK212 C7474[]GHTE
HMK212BC7105[]GHTE
QMK212 B7472[]GHT
QMK212 B7682[]GHT
QMK212 B7103[]GHT
QMK212 B7153[]GHT
QMK212 B7223[]GHT
Rated voltage
[V]
100
250
Temperature
characteristics
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7S
X7S
X7R
X7R
X7R
X7R
X7R
Capacitance
[F]
4700
6800
0.01
0.015
0.022
0.033
0.047
0.068
0.1
0.22
0.47
1
4700
6800
0.01
0.015
0.022
p
p
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
p
p
μ
μ
μ
Capacitance
tolerance [％]
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
tanδ
[％]
2.5
2.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
2.5
2.5
2.5
2.5
2.5
HTLT
Rated voltage x ％
200
200
200
200
200
200
200
200
200
200
150
150
150
150
150
150
150
Thickness*3 [mm]
Note
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25+0.20/-0
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
Thickness*3 [mm]
Note
0.85±0.10
0.85±0.10
0.85±0.10
0.85±0.10
0.85±0.10
0.85±0.10
0.85±0.10
0.85±0.10
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
Thickness*3 [mm]
Note
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
*1, *2
CERAMIC CAPACITORS
HMK107
HMK107
HMK107
HMK107
HMK107
HMK107
HMK107
HMK107
HMK107
HMK107
HMK107
HMK107
HMK107
Part number 2
【Temperature Characteristic B7 : X7R（－55～＋125℃）】 0.85mm thickness（D）
Part number 1
Part number 2
HMK212 B7102[]DHT
HMK212 B7152[]DHT
HMK212 B7222[]DHT
HMK212 B7332[]DHT
QMK212 B7102[]DHT
QMK212 B7152[]DHT
QMK212 B7222[]DHT
QMK212 B7332[]DHT
Rated voltage
[V]
100
250
Temperature
characteristics
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
1000
1500
2200
3300
1000
1500
2200
3300
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
p
p
p
p
p
p
p
p
HTLT
Rated voltage x ％
200
200
200
200
150
150
150
150
●316TYPE (Dimension:3.2×1.6mm JIS:3216 EIA:1206）
【Temperature Characteristic B7 : X7R（－55～＋125℃）, C7 : X7S（－55～＋125℃）】 1.6mm thickness（L）
Part number 1
HMK316 B7473[]LHT
HMK316 B7683[]LHT
HMK316 B7104[]LHT
HMK316 B7154[]LHT
HMK316 B7224[]LHT
HMK316 B7334[]LHT
HMK316 B7474[]LHT
HMK316 B7105[]LHT
HMK316AC7225[]LHTE
QMK316 B7223[]LHT
QMK316 B7333[]LHT
QMK316 B7473[]LHT
QMK316 B7683[]LHT
QMK316 B7104[]LHT
SMK316 B7153[]LHT
SMK316 B7223[]LHT
Part number 2
Rated voltage
[V]
100
250
630
Temperature
characteristics
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7S
X7R
X7R
X7R
X7R
X7R
X7R
X7R
Capacitance
[F]
0.047
0.068
0.1
0.15
0.22
0.33
0.47
1
2.2
0.022
0.033
0.047
0.068
0.1
0.015
0.022
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
Capacitance
tolerance [％]
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
tanδ
[％]
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
HTLT
Rated voltage x ％
200
200
200
200
200
200
200
200
150
150
150
150
150
150
120
120
hq_c_mlcc_e-E07R01
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
19
29
■PART NUMBER
【Temperature Characteristic B7 : X7R（－55～＋125℃）】 1.15mm thickness（F）
Part number 1
SMK316
SMK316
SMK316
SMK316
SMK316
SMK316
SMK316
Part number 2
B7102[]FHT
B7152[]FHT
B7222[]FHT
B7332[]FHT
B7472[]FHT
B7682[]FHT
B7103[]FHT
Rated voltage
[V]
630
Temperature
characteristics
X7R
X7R
X7R
X7R
X7R
X7R
X7R
Capacitance
[F]
1000
1500
2200
3300
4700
6800
0.01
p
p
p
p
p
p
μ
Capacitance
tolerance [％]
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±20
±20
±20
±20
±20
±20
±20
tanδ
[％]
2.5
2.5
2.5
2.5
2.5
2.5
2.5
HTLT
Rated voltage x ％
120
120
120
120
120
120
120
Thickness*3 [mm]
1.15±0.10
1.15±0.10
1.15±0.10
1.15±0.10
1.15±0.10
1.15±0.10
1.15±0.10
Note
*1,
*1,
*1,
*1,
*1,
*1,
*1,
*2
*2
*2
*2
*2
*2
*2
●325TYPE (Dimension:3.2×2.5mm JIS:3225 EIA:1210）
【Temperature Characteristic B7 : X7R（－55～＋125℃）, C7 : X7S（－55～＋125℃）】 2.5mm thickness（M）
Part number 1
Part number 2
HMK325 B7225[]MHP
HMK325 C7475[]MHPE
Rated voltage
[V]
100
Temperature
characteristics
Capacitance
[F]
X7R
X7S
2.2 μ
4.7 μ
CERAMIC CAPACITORS
Capacitance
tolerance [％]
tanδ
[％]
±10, ±20
±10, ±20
3.5
3.5
Capacitance
tolerance [％]
tanδ
[％]
HTLT
Rated voltage x ％
200
150
Thickness*3 [mm]
Note
2.5±0.20
2.5±0.20
*1, *2
*1, *2
Thickness*3 [mm]
Note
【Temperature Characteristic B7 : X7R（－55～＋125℃）】 1.9mm thickness（N）
Part number 1
Part number 2
HMK325 B7224[]NHT
HMK325 B7474[]NHT
HMK325 B7684[]NHT
HMK325 B7105[]NHT
QMK325 B7473[]NHT
QMK325 B7104[]NHT
QMK325 B7154[]NHT
QMK325 B7224[]NHT
SMK325 B7223[]NHT
SMK325 B7333[]NHT
SMK325 B7473[]NHT
Rated voltage
[V]
100
250
630
Temperature
characteristics
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
Capacitance
[F]
0.22
0.47
0.68
1
0.047
0.1
0.15
0.22
0.022
0.033
0.047
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
3.5
3.5
3.5
3.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
HTLT
Rated voltage x ％
200
200
200
200
150
150
150
150
120
120
120
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
*1,
*1,
*1,
*1,
*1,
*1,
*1,
*1,
*1,
*1,
*1,
*2
*2
*2
*2
*2
*2
*2
*2
*2
*2
*2
【Temperature Characteristic B7 : X7R（－55～＋125℃）】 1.15mm thickness（F）
Part number 1
Part number 2
HMK325 B7104[]FHT
Rated voltage
[V]
100
Temperature
characteristics
Capacitance
[F]
X7R
0.1 μ
Capacitance
tolerance [％]
tanδ
[％]
±10, ±20
3.5
Capacitance
tolerance [％]
tanδ
[％]
HTLT
Rated voltage x ％
200
Thickness*3 [mm]
Note
1.15±0.10
*1, *2
●432TYPE (Dimension:4.5×3.2mm JIS:4532 EIA:1812）
【Temperature Characteristic B7 : X7R（－55～＋125℃）】 2.5mm thickness（M）
Part number 1
HMK432 B7474[]MHT
HMK432 B7105[]MHT
HMK432 B7155[]MHT
HMK432 B7225[]MHT
QMK432 B7104[]MHT
QMK432 B7224[]MHT
QMK432 B7334[]MHT
QMK432 B7474[]MHT
SMK432 B7473[]MHT
SMK432 B7683[]MHT
SMK432 B7104[]MHT
Part number 2
Rated voltage
[V]
100
250
630
Temperature
characteristics
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
Capacitance
[F]
0.47
1
1.5
2.2
0.1
0.22
0.33
0.47
0.047
0.068
0.1
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±10,
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
3.5
3.5
3.5
3.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
HTLT
Rated voltage x ％
200
200
200
200
150
150
150
150
120
120
120
Thickness*3 [mm]
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
Note
*1,
*1,
*1,
*1,
*1,
*1,
*1,
*1,
*1,
*1,
*1,
*2
*2
*2
*2
*2
*2
*2
*2
*2
*2
*2
hq_c_mlcc_e-E07R01
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
30
19
Multilayer Ceramic Capacitors
■PACKAGING
①Minimum Quantity
●Taped package
Thickness
Type(EIA)
□MK021(008004)
□VS021(008004)
□MK042(01005)
□VS042(01005)
□MK063(0201)
□WK105(0204) ※
□MK105(0402)
□MF105(0402)
□VK105(0402)
□MK107(0603)
□WK107(0306) ※
□MF107(0603)
□VS107(0603)
□MJ107(0603)
□MK212(0805)
□WK212(0508) ※
□MF212(0805)
□VS212(0805)
□MJ212(0805)
□MK316(1206)
□MF316(1206)
□MJ316(1206)
□MK325(1210)
□MF325(1210)
□MJ325(1210)
□MK432(1812)
Note : ※ LW Reverse type.
mm
code
0.125
K
0.2
0.2
0.3
0.3
0.13
0.18
0.2
0.3
0.5
0.5
0.45
0.5
0.8
0.7
0.8
0.45
0.85
1.25
0.85
0.85
1.25
0.85
1.15
1.6
1.15
1.6
0.85
1.15
1.9
2.0max.
2.5
1.9
2.5
2.5
C, D
C
P,T
P
H
E
C
P
V
W
K
V
A
C
A
K
D
G
D
D
G
D
F
L
F
L
D
F
N
Y
M
N
M
M
Standard quantity [pcs]
Paper tape
Embossed tape
－
50000
－
40000
15000
10000
－
－
20000
15000
10000
10000
4000
－
4000
4000
3000
－
－
20000
15000
－
－
－
－
－
4000
－
－
3000
4000
－
－
4000
4000
－
4000
－
－
－
－
3000
－
－
2000
－
3000
2000
3000
2000
－
2000
－
－
－
－
1000
2000
500(T), 1000(P)
500
②Taping material
※No bottom tape for pressed carrier tape
●Card board carrier tape
●Embossed tape
Top tape
Top tape
Base tape
Sprocket hole
Sprocket hole
Bottom tape
Chip cavity
Base tape
Chip cavity
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E06R01
Chip filled
Chip
※ LW Reverse type.
③Representative taping dimensions
●Paper Tape（8mm wide）
●Pressed carrier tape（ 2mm pitch）
Unit：mm（inch）
A
B
T
8.0±0.3
(0.315±0.012)
Sprocket hole
1.75±0.1
(0.069±0.004）
3.5±0.05
(0.138±0.002)
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
T1
2.0±0.05
(0.079±0.002)
F
4.0±0.1
(0.157±0.004)
Chip Cavity
Type(EIA)
Ａ
0.37
Insertion Pitch
Ｆ
Ｂ
0.67
□MK063(0201)
□WK105(0204) ※
0.65
1.15
□MK105(0402) （*1 C）
□MK105(0402) （*1 P）
Note *1 Thickness, C：0.2mm ,P：0.3mm. ※ LW Reverse type.
2.0±0.05
●Punched carrier tape （2mm pitch）
0.45max.
0.42max.
0.4max.
0.45max.
0.3max.
0.42max.
Unit：mm
T
8.0±0.3
(0.315±0.012)
B
2.0±0.05
(0.079±0.002)
1.75±0.1
(0.069±0.004）
3.5±0.05
(0.138±0.002)
A
F
T1
Unit：mm（inch）
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
Sprocket hole
Tape Thickness
Ｔ
4.0±0.1
(0.157±0.004)
Ａ
Chip Cavity
Ｂ
Insertion Pitch
Ｆ
Tape Thickness
Ｔ
0.65
1.15
2.0±0.05
0.8max.
Type(EIA)
□MK105 (0402)
□MF105 (0402)
□VK105 (0402)
Unit：mm
●Punched carrier tape （4mm pitch）
B
T
8.0±0.3
(0.315±0.012)
A
F
Unit：mm（inch）
1.75±0.1
(0.069±0.004）
3.5±0.05
(0.138±0.002)
Sprocket hole
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
4.0±0.1
(0.157±0.004)
2.0±0.1
(0.079±0.004)
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E06R01
Chip Cavity
Type(EIA)
Ａ
Insertion Pitch
Ｆ
Ｂ
□MK107(0603)
□WK107(0306) ※
1.0
1.8
□MF107(0603)
4.0±0.1
□MK212(0805)
1.65
2.4
□WK212(0508) ※
□MK316(1206)
2.0
3.6
Note：Taping size might be different depending on the size of the product. ※ LW Reverse type.
●Embossed tape（4mm wide）
Unit：mm
4.0±0.05
(0.157±0.002)
B
1.0±0.02
(0.039±0.001)
1.1max.
0.9±0.05
(0.035±0.002)
1.8±0.02
(0.071±0.001)
A
F
1.1max.
Unit：mm（inch）
φ0.8±0.04
(φ0.031±0.002)
Sprocket hole
Tape Thickness
Ｔ
2.0±0.04
(0.079±0.002)
Chip Cavity
Type(EIA)
□MK021(008004)
□VS021(008004)
□MK042(01005)
□VS042(01005)
Ａ
Ｂ
0.135
0.27
0.23
0.43
Insertion Pitch
Ｆ
K
Tape Thickness
T
1.0±0.02
0.5max.
0.25max.
Unit：mm
●Embossed tape（8mm wide）
Unit：mm（inch）
3.5±0.05
(0.138±0.002)
Sprocket hole
A
B
F
1.75±0.1
(0.069±0.004）
8.0±0.3
(0.315±0.012)
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
4.0±0.1
(0.157±0.004)
2.0±0.1
(0.079±0.004)
Type(EIA)
□MK105(0402)
□WK107(0306) ※
□MK212(0805)
□MF212(0805)
□MK316(1206)
□MF316(1206)
□MK325(1210)
□MF325(1210)
Note： ※ LW Reverse type.
Chip Cavity
Ａ
0.6
1.0
Ｂ
1.1
1.8
1.65
2.4
2.0
3.6
2.8
3.6
Insertion Pitch
Ｆ
2.0±0.1
4.0±0.1
Tape Thickness
K
0.6max
1.3max.
T
0.2±0.1
0.25±0.1
3.4max.
0.6max.
Unit：mm
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E06R01
●Embossed tape（12mm wide）
Unit：mm（inch）
5.5±0.05
(0.217±0.002)
Sprocket hole
A
B
4.0±0.1
(0.157±0.004)
12.0±0.3
(0.472±0.012)
1.75±0.1
(0.069±0.004）
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
2.0±0.1
(0.079±0.004)
F
Chip Cavity
Type(EIA)
Ａ
3.1
3.7
□MK325(1210)
□MK432(1812)
Ｂ
4.0
4.9
Insertion Pitch
Ｆ
8.0±0.1
8.0±0.1
K
4.0max.
4.0max.
Tape Thickness
E
2.0±0.5
T
0.6max.
0.6max.
Unit：mm
④Trailer and Leader
Blank portion
Chip cavity
Blank portion
Leader
100mm or more
(3.94inches or more)
160mm or more
(6.3inches or more)
Direction of tape feed
400mm or more
(15.7inches or more)
⑤Reel size
t
E
C
R
B
A
D
W
A
φ178±2.0
B
φ50min.
C
φ13.0±0.2
D
φ21.0±0.8
4mm wide tape
8mm wide tape
12mm wide tape
T
1.5max.
2.5max.
2.5max.
W
5±1.0
10±1.5
14±1.5
Unit：mm
R
1.0
⑥Top Tape Strength
The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow as illustrated below.
Pull direction
0～20°
Top tape
Base tape
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E06R01
Medium-High Voltage Multilayer Ceramic Capacitor
■RELIABILITY DATA
1. Operating Temperature Range
Temperature Compensating(High Frequency type)
CG(C0G)
: －55 to ＋125℃
Specified Value
High permittivity
X7R, X7S : －55 to ＋125℃
X5
: －55 to ＋85℃
B
: －25 to ＋85℃
2. Storage Temperature Range
Temperature Compensating(High Frequency type)
CG(C0G)
: －55 to ＋125℃
Specified Value
High permittivity
X7R, X7S : －55 to ＋125℃
X5R
: －55 to ＋85℃
B
: －25 to ＋85℃
3. Rated Voltage
Specified Value
100VDC(HMK,HMJ), 250VDC(QMK,QMJ,QVS), 630VDC(SMK,SMJ)
4. Withstanding Voltage（Between terminals）
Specified Value
No breakdown or damage
Test Methods and
Remarks
Applied voltage
Duration
Carge/discharge current
: Rated voltage×2.5（HMK,HMJ）, Rated voltage×2（QMK,QMJ,QVS）, Rated voltage×1.2（SMK,SMJ）
: 1 to 5sec.
: 50mA max.
５．Insulation Resistance
Temperature Compensating(High Frequency type)
10000MΩ min
Specified Value
High permittivity
100MΩμF or 10GΩ, whichever is smaller.
Test Methods and
Remarks
Applied voltage
Duration
Charge/discharge current
: Rated voltage（HMK,HMJ, QMK,QMJ,QVS）, 500V（SMK,SMJ）
: 60±5sec.
: 50mA max.
6．Capacitance （Tolerance）
Temperature Compensating(High Frequency type)
±0.1pF (C＜5pF) ±0.25pF (C＜10pF) ±0.5pF (5pF≦C＜10pF) ±2%(C=10pF) ±5%(C≧10pF)
Specified Value
High permittivity
±10%, ±20%
Test Methods and
Remarks
Temperature Compensating(High Frequency type)
Measuring frequency
: 1MHz±10%
Measuring voltage
: 0.5 to 5Vrms
Bias application
: None
High permittivity
Measuring frequency
Measuring voltage
Bias application
: 1kHz±10%
: 1±0.2Vrms
: None
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_c_mlcc_mhv_reli_e-E06R01
7．Q or Dissipation Factor
Temperature Compensating(High Frequency type)
C＜30pF : Q≧800＋20C
C≧30pF : Q≧1400
C:Normal Capacitance(/pF)
Specified Value
High permittivity
3.5%max（HMK,HMJ）
2.5%max（QMK,QMJ, SMK,SMJ）
Test Methods and
Remarks
Temperature Compensating(High Frequency type)
Measuring frequency
: 1MHz±10%
Measuring voltage
: 0.5 to 5Vrms
Bas application
: None
High permittivity
Measuring frequency
Measuring voltage
Bas application
: 1kHz±10%
: 1±0.2Vrms
: None
8．Temperature Characteristic of Capacitance
Temperature Compensating(High Frequency type)
C0G
:±30ppm（25 to ＋125℃）
Specified Value
Test Methods and
Remarks
High permittivity
B
: ±10%（－25 to ＋85℃）
X5R
: ±15%（－55 to ＋85℃）
X7R
: ±15%（－55 to ＋125℃）
X7S
: ±22%（－55 to ＋125℃）
Temperature Compensating(High Frequency type)
Capacitance at 25℃ and 85℃ shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the
ｆollowing equation.
（C85－C25）
×106×[ppm/℃]
C25×ΔT
High permittivity
Capacitance value at each step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the
following equation.
Step
B
X5R、X7R、X7S
1
Minimum operating tempeature
2
20℃
25℃
3
Maximum operating temperature
（C－C2）
×100（%）
C2
C : Capacitance value in Step 1 or Step 3
C2 : Capacitance value in Step 2
9．Deflection
Temperature Compensating(High Frequency type)
Appearance
: No abnormality
Capacitance change
:±5% or ±0.5pF, whichever is larger.
Specified Value
High permittivity
Appearance
Capacitance change
Test Methods and
Remarks
Warp
Duration
Test board
Thicknss
:
:
:
:
: No abnormality
: Within±10%
1mm （Soft Termination type:3mm）
10sec.
Glass epoxy-resin substrate
1.6mm
Capacitance measurement shall be conducted with the board bent.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_c_mlcc_mhv_reli_e-E06R01
10．Adhesive Strength of Terminal Electrodes
Specified Value
No terminal separation or its indication.
Temperature Compensating(High Frequency type)
Applied force
: 2N
Duration
: 10±5sec.
Test Methods and
Remarks
High permittivity
Applied force
: 5N
Duration
: 30±5sec.
11．Solderability
Specified Value
Test Methods and
Remarks
At least 95% of terminal electrode is covered by new solder
Eutectic solder
H60A or H63A
230±5℃
Solder type
Solder temperature
Duration
Lead-free solder
Sn-3.0Ag-0.5Cu
245±3℃
4±1 sec.
12．Resistance to Soldering
Temperature Compensating(High Frequency type)
Appearance
: No abnormality
Capacitance change
: C※≦10pF :±0.25pF C※＞10pF :±2.5%
Insulation resistance
: Initial value
Withstanding voltage
（between terminals） : No abnormality
Specified Value
Test Methods and
Remarks
※Normal capacitance
High permittivity
Appearance
Capacitance change
Dissipation factor
Insulation resistance
Withstanding voltage
: No abnormality
: Within±15%（HMK,HMJ）, ±10%（QMK,QMJ, SMK,SMJ）
: Inital value
: Initial value
（between terminals） : No abnormality
Preconditioning
Solder temperature
Duration
Preheating conditions
Recovery
:
:
:
:
:
Thermal treatment（at 150℃ for 1hr） Note1 (Only High permittivity)
270±5℃
3±0.5sec.
80 to 100℃, 2 to 5 min.
150 to 200℃, 2 to 5min.
24±2hrs under the stadard condition Note3
13．Temperature Cycle （Thermal Shock）
Temperature Compensating(High Frequency type)
Appearance
: No abnormality
Capacitance change
: C※≦10pF :±0.25% C※＞10pF :±2.5%
Insulation resistance
: Initial value
Withstanding voltage
（between terminals） : No abnormality
Specified Value
Test Methods and
Remarks
High permittivity
Appearance
Capacitance change
Dissipation factor
Insulation resistance
Withstanding voltage
: No abnormality
: Within±15%（HMK,HMJ）, ±7.5%（QMK,QMJ, SMK,SMJ）
: Initial value
: Initial value
（between terminals） : No abnormality
Preconditioning : Thermal treatment （at 150℃ for 1hr） Note1
Conditions for 1 cycle
Step
temperature（℃）
1
Minimum operating temperature
2
Normal temperature
3
Maximum operating temperature
4
Normal temperature
Number of cycles : 5 times
Recovery : 24±2hrs under the standard condition Note3
Time（min.）
30±3min.
2 to 3min.
30±3min.
2 to 3min.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_c_mlcc_mhv_reli_e-E06R01
14．Humidity （Steady state）
Temperature Compensating(High Frequency type)
Appearance
: No abnormality
Capacitance change
: C※≦10pF :±0.5pF
Insulation resistance
: 1000MΩmin
Specified Value
Test Methods and
Remarks
C※＞10pF :±5% ※Normal capacitance
High permittivity
Appearance
Capacitance change
Dissipation factor
Insulation resistance
:
:
:
:
No abnormality
Within±15%
7%max（HMK,HMJ）, 5%max（QMK,QMJ, SMK,SMJ）.
25MΩμF or 1000MΩ, whichever is smaller.
Preconditioning
Temperature
Humidity
Duration
Recovery
:
:
:
:
:
Thermal treatment（at 150℃ for 1hr） Note1 (Only High permittivity)
40±2℃
90 to 95%RH
500 ＋24/－0 hrs
24±2hrs under the standard condition Note3
15．Humidity Loading
Temperature Compensating(High Frequency type)
Appearance
: No abnormality
Capacitance change
: C※≦2.0pF :±0.4pF 2.0pF＜C≦10pF : ±0.75pF C※＞10pF :±7.5%
: ※Normal capacitance
Insulation resistance
: 500MΩmin
Specified Value
High permittivity
Appearance
Capacitance change
Dissipation factor
Insulation resistance
Test Methods and
Remarks
:
:
:
:
No abnormality
Within±15%
7%max（HMK,HMJ）, 5%max（QMK,QMJ, SMK,SMJ）.
10MΩμF or 500MΩ, whichever is smaller.
According to JIS 5102 clause 9.9.
Preconditioning
: Voltage treatment Note2 (Only High permittivity)
Temperature
: 40±2℃
Humidity
: 90 to 95%RH
Applied voltage
: Rated voltage
Charge/discharge current
: 50mA max.
Duration
: 500 ＋24/－0 hrs
Recovery
: 24±2hrs under the standard condition Note3
16．High Temperature Loading
Temperature Compensating(High Frequency type)
Appearance
: No abnormality
Capacitance change
: C※≦10pF :±0.3pF
Insulation resistance
:1000MΩmin
Specified Value
Test Methods and
Remarks
High permittivity
Appearance
Capacitance change
Dissipation factor
Insulation resistance
:
:
:
:
C※＞10pF :±3%
No abnormality
Within±15%
7%max（HMK,HMJ）, 5%max（QMK,QMJ, SMK,SMJ）.
50MΩμF or 1000MΩ, whichever is smaller.
According to JIS 5102 clause 9.10.
Preconditioning
: Voltage treatment Note2 (Only High permittivity)
Temperature
: Maximum operating temperature
Applied voltage
: Rated voltage×2（HMK,HMJ,QVS） Rated voltage×1.5（QMK,QMJ） Rated voltage×1.2（SMK,SMJ）
Charge/discharge current
: 50mA max.
Duration
: 1000 ＋24/－0 hrs
Recovery
: 24±2hrs under the standard condition Note3
Note1 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 150＋0/－10℃ for an hour and kept at room temperature
for 24±2hours.
Note2 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in
the test conditions, and kept at room temperature for 24±2hours.
Note3 Standard condition : Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa
When there are questions concerning measurement results, in order to provide correlation data, the test shall be conducted
under the following condition.
Temperature: 20±2℃, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa
Unless otherwise specified, all the tests are conducted under the "standard condition".
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_c_mlcc_mhv_reli_e-E06R01
Precautions on the use of Multilayer Ceramic Capacitors
■PRECAUTIONS
1. Circuit Design
Precautions
◆Verification of operating environment, electrical rating and performance
1. A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have
severe social ramifications.
Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from
them used in general purpose applications.
◆Operating Voltage （Verification of Rated voltage）
1. The operating voltage for capacitors must always be their rated voltage or less.
If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less.
For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less.
2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC
voltage or a pulse voltage having rapid rise time is used in a circuit.
2. PCB Design
Precautions
◆Pattern configurations （Design of Land-patterns）
1. When capacitors are mounted on PCBs, the amount of solder used （size of fillet） can directly affect the capacitor performance.
Therefore, the following items must be carefully considered in the design of land patterns:
（1）Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider
appropriate land-patterns for proper amount of solder.
（2）When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by
solder-resist.
◆Pattern configurations （Capacitor layout on PCBs）
After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes （PCB
cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.）. For this reason, land
pattern configurations and positions of capacitors shall be carefully considered to minimize stresses.
◆Pattern configurations （Design of Land-patterns）
The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts.
（1）Recommended land dimensions for typical chip capacitors
Land patterns for PCBs
●Multilayer Ceramic Capacitors : Recommended land dimensions
Land pattern
（unit: mm）
Solder-resist
Wave-soldering
Chip capacitor
Type
107
212
316
325
L
1.6
2.0
3.2
3.2
C
Size
W
0.8
1.25
1.6
2.5
A
0.8 to 1.0
1.0 to 1.4
1.8 to 2.5
1.8 to 2.5
B
0.5 to 0.8
0.8 to 1.5
0.8 to 1.7
0.8 to 1.7
B
A
B
C
0.6 to 0.8
0.9 to 1.2
1.2 to 1.6
1.8 to 2.5
Chip capacitor
W
L
Technical
considerations
Reflow-soldering
Type
042
063
105
L
0.4
0.6
1.0
Size
W
0.2
0.3
0.5
A
0.15 to 0.25
0.20 to 0.30
0.45 to 0.55
B
0.15 to 0.20
0.20 to 0.30
0.40 to 0.50
C
0.15 to 0.30
0.25 to 0.40
0.45 to 0.55
Note：Recommended land size might be different according
107
212
316
1.6
2.0
3.2
0.8
1.25
1.6
0.8 to 1.0
0.8 to 1.2
1.8 to 2.5
0.6 to 0.8
0.8 to 1.2
1.0 to 1.5
0.6 to 0.8
0.9 to 1.6
1.2 to 2.0
to the allowance of the size of the product.
●LWDC: Recommended land dimensions for reflow-soldering
（unit: mm）
Type
105
107
212
L
0.52
0.8
1.25
Size
W
1.0
1.6
2.0
A
0.18 to 0.22
0.25 to 0.3
0.5 to 0.7
B
0.2 to 0.25
0.3 to 0.4
0.4 to 0.5
C
0.9 to 1.1
1.5 to 1.7
1.9 to 2.1
325
3.2
2.5
1.8 to 2.5
1.0 to 1.5
1.8 to 3.2
432
4.5
3.2
2.5 to 3.5
1.5 to 1.8
2.3 to 3.5
LWDC
W
L
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_c_mlcc_prec_e-E07R01
（2）Examples of good and bad solder application
Items
Not eommended
Lead wire of component
Recommended
Solder-resist
Mixed mounting of SMD and
leaded components
Chassis
Solder (for grounding)
Solder-resist
Component placement close to
the chassis
Electrode pattern
Lead wire of component
Soldering iron
Hand-soldering of leaded
Components near mounted
components
Solder-resist
Solder-resist
Horizontal component
placement
◆Pattern configurations （Capacitor layout on PCBs）
1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any
stresses from board warp or deflection.
Items
Not recommended
Recommended
possible mechanical
Place the product at a right
angle to the direction of the
anticipated mechanical
stress.
Deflection of board
1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below.
E
D
Perforation
C
A
B
Slit
Magnitude of stress
A＞B＝C＞D＞E
1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods
are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB,
split methods as well as chip location.
3. Mounting
Precautions
◆Adjustment of mounting machine
1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them.
2. Maintenance and inspection of mounting machines shall be conducted periodically.
◆Selection of Adhesives
1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the
following factors are appropriately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and
hardening period. Therefore, please contact us for further information.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_c_mlcc_prec_e-E07R01
◆Adjustment of mounting machine
1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid
this, the following points shall be considerable.
（1）The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection.
（2）The pressure of nozzle shall be adjusted between 1 and 3 N static loads.
（3）To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be
used on the other side of the PCB. The following diagrams show some typical examples of good and bad pick-up nozzle
placement:
Items
Single-sided mounting
Not recommended
Recommended
chipping
or cracking
supporting pins
or back-up pins
Double-sided mounting
chipping
or cracking
Technical
considerations
supporting pins
or back-up pins
2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical
impact on the capacitors.
To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of
the pin shall be conducted periodically.
◆Selection of Adhesives
Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in
stresses on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect
components. Therefore, the following precautions shall be noted in the application of adhesives.
（1）Required adhesive characteristics
a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive shall have sufficient strength at high temperatures.
c. The adhesive shall have good coating and thickness consistency.
d. The adhesive shall be used during its prescribed shelf life.
e. The adhesive shall harden rapidly.
f. The adhesive shall have corrosion resistance.
g. The adhesive shall have excellent insulation characteristics.
h. The adhesive shall have no emission of toxic gasses and no effect on the human body.
（2）The recommended amount of adhesives is as follows;
Amount adhesive
After capacitor are bonded
［Recommended condition］
a
a
Figure
212/316 case sizes as examples
a
0.3mm min
b
b
100 to 120μm
c
Adhesives shall not contact land
c
c
4. Soldering
Precautions
◆Selection of Flux
Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use;
（1）Flux used shall be less than or equal to 0.1 wt%（ in Cl equivalent） of halogenated content. Flux having a strong acidity content shall
not be applied.
（2）When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level.
（3）When water-soluble flux is used, special care shall be taken to properly clean the boards.
◆Soldering
Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions.
Sn-Zn solder paste can adversely affect MLCC reliability.
Please contact us prior to usage of Sn-Zn solder.
Technical
considerations
◆Selection of Flux
1-1. When too much halogenated substance（Chlorine, etc.） content is used to activate flux, or highly acidic flux is used, it may lead to
corrosion of terminal electrodes or degradation of insulation resistance on the surfaces of the capacitors.
1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted
and may adversely affect the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high
humidity conditions may cause a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning
methods and the capability of the machines used shall also be considered carefully when water-soluble flux is used.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_c_mlcc_prec_e-E07R01
◆Soldering
･ Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling.
･ Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal
shock.
･ Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within
100 to 130℃.
･ Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100℃.
［Reflow soldering］
【Recommended conditions for eutectic soldering】
【Recommended condition for Pb-free soldering】
300
300
Peak
260℃ Max.
Within 10sec.
230℃
Within 10sec.
60sec. 60sec
Min.
200 Min.
Slow cooling
100
Temperature（℃）
Temperature（℃）
Preheating
200
100
0
0
Slow
cooling
Preheating150℃ Heating above
230℃
60sec. Min.
40sec. Max.
1/2T～1/3T
Capacitor
Caution
①The ideal condition is to have solder mass（fillet）controlled to 1/2 to 1/3 of the
thickness of a capacitor.
②Because excessive dwell times can adversely affect solderability, soldering duration shall
be kept as close to recommended times as possible.
③Allowable number of reflow soldering : 2 times max.
Solder
T
PC board
［Wave soldering］
【Recommended conditions for eutectic soldering】
【Recommended condition for Pb-free soldering】
300
Preheating
120sec. Min.
Peak
260℃ Max.
Within 10sec.
230～250℃
Within 3sec.
200
Slow cooling
100
Temperature（℃）
Temperature（℃）
300
0
200
120sec. Min.
Preheating
150℃
100
Slow
cooling
0
Caution
①Wave soldering must not be applied to capacitors designated as for reflow soldering only.
②Allowable number of wave soldering : 1 times max.
［Hand soldering］
【Recommended condition for Pb-free soldering】
400
400
300
200
Slow cooling
100
0
Preheating
60sec. Min.
Temperature（℃）
Temperature（℃）
300
⊿T
Slow cooling
200
Preheating
150℃ Min.
100
0
400
Peak
350℃ Max.
Within 3sec.
230～280℃
Within 3sec.
316type or less
200
0
Slow cooling
⊿T
Preheating
150℃ Min.
100
60sec. Min.
⊿T
⊿T≦150℃
Peak
280℃ Max.
Within 3sec.
300
温度（℃）
【Recommended conditions for eutectic soldering】
60sec. Min.
325type or more
⊿T
⊿T≦130℃
Caution
①Use a 50W soldering iron with a maximum tip diameter of 1.0 mm.
②The soldering iron shall not directly touch capacitors.
③Allowable number of hand soldering : 1 times max.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_c_mlcc_prec_e-E07R01
5. Cleaning
Precautions
Technical
considerations
◆Cleaning conditions
1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use
of the cleaning. （e.g. to remove soldering flux or other materials from the production process.）
2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect
capacitor's characteristics.
1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate
their outer coating, resulting in a degradation of the capacitor's electrical properties （especially insulation resistance）.
2. Inappropriate cleaning conditions（ insufficient or excessive cleaning） may adversely affect the performance of
the capacitors.
In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead
to the
cracking of capacitors or the soldered portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall
be carefully checked;
Ultrasonic output :
20 W/ℓ or less
Ultrasonic frequency :
40 kHz or less
Ultrasonic washing period : 5 min. or less
6. Resin coating and mold
Precautions
1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the
hardening period or
while left under normal storage conditions resulting in the deterioration of the capacitor's performance.
2. When a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat
may lead to damage or destruction of capacitors.
The use of such resins, molding materials etc. is not recommended.
7. Handling
◆Splitting of PCB
1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board.
2. Board separation shall not be done manually, but by using the appropriate devices.
Precautions
◆Mechanical considerations
Be careful not to subject capacitors to excessive mechanical shocks.
（1）If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used.
（2）Please be careful that the mounted components do not come in contact with or bump against other boards or
components.
8. Storage conditions
Precautions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control
temperature and humidity in the storage area. Humidity should especially be kept as low as possible.
・Recommended conditions
Ambient temperature : Below 30℃
Humidity
: Below 70% RH
The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of capacitor is deteriorated as
time passes, so capacitors shall be used within 6 months from the time of delivery.
・Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air.
2. The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time, so
care shall be
taken to design circuits . Even if capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at
150℃ for 1hour.
Technical
considerations
If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and
quality loss of taping/packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the
above period, please check solderability before using the capacitors.
※RCR-2335B（Safety Application Guide for fixed ceramic capacitors for use in electronic equipment）is published by JEITA.
Please check the guide regarding precautions for deflection test, soldering by spot heat, and so on.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_c_mlcc_prec_e-E07R01
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