TSL2550T

r r TSL2550 AMBIENT LIGHT SENSOR WITH SMBus INTERFACE TAOS029L − OCTOBER 2007 D Converts Light Intensity to Digital Signal D Infrared Compensation to Approximate Human Eye Response PACKAGE D 8-LEAD SOIC (TOP VIEW) D D D D D D D D Companding A/D for Wide Dynamic Range Rejects 50 Hz/60 Hz Lighting Ripple Two-Wire SMBus Serial Interface Single Supply Operation (2.7 V to 5.5 V) Low Active Power (1 mW typ) Power Down Mode Low-Profile Surface-Mount Packages RoHS Compliant VDD 1 NC 2 NC 3 GND 4 8 SMBData 7 NC 6 NC 5 SMBCLK PACKAGE T 4-LEAD SMD (TOP VIEW) Description The TSL2550 is a digital-output light sensor with a two-wire, SMBus serial interface. It combines two photodiodes and a companding analog-todigital converter (ADC) on a single CMOS integrated circuit to provide light measurements over an effective 12-bit dynamic range with a response similar to that of the human eye. VDD 1 GND 2 4 SMBData 3 SMBCLK The TSL2550 is designed for use with broad wavelength light sources. One of the photodiodes (channel 0) is sensitive to visible and infrared light, while the second photodiode (channel 1) is sensitive primarily to infrared light. An integrating ADC converts the photodiode currents to channel 0 and channel 1 digital outputs. Channel 1 digital output is used to compensate for the effect of the infrared component of ambient light on channel 0 digital output. The ADC digital outputs of the two channels are used to obtain a value that approximates the human eye response in the commonly used unit of Lux. This device is intended primarily for use in applications in which measurement of ambient light is used to control display backlighting such as laptop computers, PDAs, camcorders, and GPS systems. Other applications include contrast control in LED signs and displays, camera exposure control, lighting controls, etc. The integrating conversion technique used by the TSL2550 effectively eliminates the effect of flicker from AC-powered lamps, increasing the stability of the measurement. Functional Block Diagram Channel 0 Photodiode Channel 1 Photodiode VDD = 2.7 V to 5.5 V Integrating A/D Converter Control Logic Output Registers SMBCLK SMBData Two-Wire Serial Interface The LUMENOLOGY r Company Texas Advanced Optoelectronic Solutions Inc. 1001 Klein Road S Suite 300 S Plano, TX 75074 S (972) 673-0759 r www.taosinc.com 1 r Copyright E 2007, TAOS Inc. TSL2550 AMBIENT LIGHT SENSOR WITH SMBus INTERFACE TAOS029L − OCTOBER 2007 Terminal Functions TERMINAL NAME GND SMBCLK SMBData VDD D PKG NO. 4 5 8 1 T PKG NO. 2 3 4 1 I I/O TYPE DESCRIPTION Power supply ground. All voltages are referenced to GND. SMBus serial clock input terminal — clock signal for SMBus serial data. SMBus serial data I/O terminal — serial data I/O for SMBus. Supply voltage. Available Options DEVICE TSL2550 TSL2550 TA − 40°C to 85° −40°C to 85° PACKAGE − LEADS SOIC−8 T−4 PACKAGE DESIGNATOR D T ORDERING NUMBER TSL2550D TSL2550T Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage, VDD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 V Digital output voltage range, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to +6 V Digital output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 10 mA SMBus input/output current, I(SMBIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −1 mA to 20 mA Operating free-air temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 40°C to 85°C ESD tolerance, human body model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2000 V Solder conditions in accordance with JEDEC J−STD−020A, maximum temperature (see Note 2) . . . 260°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values are with respect to GND. 2. Package D only: The device may be hand soldered provided that heat is applied only to the solder pad and no contact is made between the tip of the solder iron and the device lead. The maximum time heat should be applied to the device is 5 seconds. Recommended Operating Conditions MIN Supply voltage, VDD Operating free-air temperature, TA SMBus input low voltage @ VDD = 3.3 V ± 5%, VIL SMBus input high voltage @ VDD = 3.3 V ± 5%, VIH SMBus operating frequency, f(SMBCLK) 2.1 10 100 2.7 0 MAX 5.5 70 0.8 UNIT V °C V V kHz Copyright E 2007, TAOS Inc. r r The LUMENOLOGY r Company 2 www.taosinc.com TSL2550 AMBIENT LIGHT SENSOR WITH SMBus INTERFACE TAOS029L − OCTOBER 2007 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VOL SMBus output low voltage IO = 50 μA IO = 4 mA Active, VSMBCLK and VSMDATA = VDD, VDD = 3.3 V ± 5% Power down, VSMBCLK and VSMDATA = VDD, VDD = 3.3 V ± 5% VI = VDD VI = 0 0.35 TEST CONDITIONS MIN TYP 0.01 0.4 0.6 10 5 −5 MAX UNIT V mA μA μA μA IDD IIH IIL Supply current High level input current Low level input current Operating Characteristics, VDD = 3.3 V, TA = 255C (unless otherwise noted) (see Notes 2, 3, 4) PARAMETER TEST CONDITIONS Ee = 0 ADC count value standard mode value, λp = 640 nm Ee = 72 μW/cm2 λp = 940 nm Ee = 140 μW/cm2 Ee = 0 ADC count value extended mode value, λp = 640 nm Ee = 72 μW/cm2 λp = 940 nm Ee = 140 μW/cm2 ADC count value ratio: Ch1/Ch0, Ch1/Ch0, standard mode λp = 640 nm, Ee = 72 μW/cm2 λp = 940 nm, Ee = 140 λp = 640 nm Ee = 72 μW/cm2 λp = 940 nm Ee = 140 μW/cm2 Fluorescent light source: 300 Lux Rv Illuminance responsivity standard mode responsivity, Incandescent light source: 50 Lux (Sensor Lux) / (actual Lux), standard mode Lux), standard (Note 5) Fluorescent light source: 300 Lux Incandescent light source: 50 Lux μW/cm2 Ch0 Ch1 Ch0 Ch1 Ch0 Ch1 Ch0 Ch1 0.65 0.5 CHANNEL Ch0 Ch1 Ch0 Ch1 Ch0 Ch1 Ch0 Ch1 Ch0 Ch1 Ch0 Ch1 0.070 0.70 155 16 155 139 0.106 0.88 11.1 1.2 5.7 5 2.8 0.23 19 13 1 1 1.35 1.5 counts/ lux counts/ (μW/ cm cm2) 0.175 1.20 511 639 799 85 799 703 1 1 counts 1039 MIN TYP MAX 1 1 959 counts UNIT Re Irradiance responsivity standard mode responsivity, NOTES: 3. Optical measurements are made using small-angle incident radiation from light-emitting diode optical sources. Visible 640 nm LEDs and infrared 940 nm LEDs are used for final product testing for compatibility with high volume production. 4. The 640 nm irradiance Ee is supplied by an AlInGaP light-emitting diode with the following characteristics: peak wavelength λp = 640 nm and spectral halfwidth Δλ½ = 17 nm. 5. The 940 nm irradiance Ee is supplied by a GaAs light-emitting diode with the following characteristics: peak wavelength λp = 940 nm and spectral halfwidth Δλ½ = 40 nm. 6. The sensor Lux is calculated using the empirical formula shown on p. 11 of this data sheet based on measured Ch0 and Ch1 ADC count values for the light source specified. Actual Lux is obtained with a commercial luxmeter. The range of the (sensor Lux) / (actual Lux) ratio is estimated based on the variation of the 640 nm and 940 nm optical parameters. Devices are not 100% tested with fluorescent or incandescent light sources. The LUMENOLOGY r Company r r Copyright E 2007, TAOS Inc. www.taosinc.com 3 TSL2550 AMBIENT LIGHT SENSOR WITH SMBus INTERFACE TAOS029L − OCTOBER 2007 AC Electrical Characteristics, VDD = 3.3 V, TA = 255C (unless otherwise noted) PARAMETER t(CONV) t(CONV) f(SMBCLK) t(BUF) t(HDSTA) t(SUSTA) t(SUSTO) t(HDDAT) t(SUDAT) t(LOW) t(HIGH) t(TIMEOUT) tF tR Ci Conversion time, per channel, standard mode Conversion time, per channel, extended mode Clock frequency Bus free time between start and stop condition Hold time after (repeated) start condition. After this period, the first clock is generated. Repeated start condition setup time Stop condition setup time Data hold time Data setup time SMBCLK clock low period SMBCLK clock high period Detect clock/data low timeout Clock/data fall time Clock/data rise time Input pin capacitance 4.7 4 4.7 4 300 250 4.7 4 25 35 300 1000 10 TEST CONDITIONS MIN TYP 400 80 100 MAX UNIT ms ms kHz μs μs μs μs ns ns μs μs ms ns ns pF Copyright E 2007, TAOS Inc. r r The LUMENOLOGY r Company 4 www.taosinc.com TSL2550 AMBIENT LIGHT SENSOR WITH SMBus INTERFACE TAOS029L − OCTOBER 2007 PARAMETER MEASUREMENT INFORMATION t(LOW) t(R) t(F) SMBCLK VIH VIL t(HDSTA) t(BUF) t(HDDAT) VIH VIL t(HIGH) t(SUSTA) t(SUDAT) t(SUSTO) SMBDATA P Stop Condition S Start Condition Start S t(LOWSEXT) SMBCLKACK SMBCLKACK t(LOWMEXT) t(LOWMEXT) Stop P t(LOWMEXT) SMBCLK SMBDATA Figure 1. SMBus Timing Diagrams 1 SMBCLK 9 1 9 SMBDATA Start by Master A6 A5 A4 A3 A2 A1 A0 R/W ACK by TSL2550 D7 D6 D5 D4 D3 D2 D1 D0 ACK by Stop by TSL2550 Master Frame 1 SMBus Slave Address Byte Frame 2 Command Byte Figure 2. SMBus Timing Diagram for Send Byte Format 1 SMBCLK 9 1 9 SMBDATA Start by Master A6 A5 A4 A3 A2 A1 A0 R/W ACK by TSL2550 D7 D6 D5 D4 D3 D2 D1 D0 NACK by Stop by Master Master Frame 1 SMBus Slave Address Byte Frame 2 Data Byte From TSL2550 Figure 3. SMBus Timing Diagram for Receive Byte Format The LUMENOLOGY r Company r r Copyright E 2007, TAOS Inc. www.taosinc.com 5 TSL2550 AMBIENT LIGHT SENSOR WITH SMBus INTERFACE TAOS029L − OCTOBER 2007 TYPICAL CHARACTERISTICS NORMALIZED ADC OUTPUT vs. SUPPLY VOLTAGE 1.8 1.6 Normalized ADC Output 0.8 Relative Responsivity Channel 0 Photodiode 1.4 1.2 1 0.8 0.6 0.4 0.2 0 400 0 SPECTRAL RESPONSIVITY 1 0.6 0.4 Channel 1 Photodiode 0.2 500 600 700 800 900 1000 1100 2.5 3 3.5 4 4.5 5 5.5 6 λ − Wavelength − nm VDD − Supply Voltage − V Figure 4 Figure 5 Copyright E 2007, TAOS Inc. r r The LUMENOLOGY r Company 6 www.taosinc.com TSL2550 AMBIENT LIGHT SENSOR WITH SMBus INTERFACE TAOS029L − OCTOBER 2007 PRINCIPLES OF OPERATION Analog-to-Digital Converter The TSL2550 contains an integrating analog-to-digital converter (ADC) that integrates a photodiode current. First it integrates channel 0 photodiode current and then it integrates channel 1 photodiode current. At the end of the conversion cycle for each channel, the conversion result is transferred to the appropriate channel 0 or channel 1 ADC register. The transfer is double-buffered to ensure that invalid data is not read during the transfer. After the data is transferred, the TSL2550 automatically begins the next conversion cycle. A VALID bit is used to indicate that data has been written to the ADC register after ADC is enabled. Interface to the ADC and control of other device functions is accomplished using the standard 2-wire System Management Bus (SMBus) interface. Both versions 1.1 and 2.0 of the SMBus are supported. The ADC has two operating modes: standard and extended. In standard mode, the integration time is 400 mS for each channel or 800 mS for both channel 0 and channel 1. Extended mode shortens the integration time by a factor of five with a corresponding decrease in responsivity of 5 ×. The extended range allows the device to operate at higher light levels, extending the overall dynamic range by a factor of five. Digital Interface The TSL2550 contains an 8-bit command register that can be written and read via the SMBus. The command register controls the overall operation of the device. There are two read-only registers that contain the latest converted value of each of the two ADC channels. The SMBus slave address is hardwired internally as 0111001 (MSB to LSB, A6 to A0). Both the send byte protocol and the receive byte protocol are implemented in the TSL2550. The send byte protocol allows single bytes of data to be written to the device (see Figure 6). The written byte is called the COMMAND byte. The receive byte protocol allows single bytes of data to be read from the device (see Figure 7). The receive data can be either the previously written COMMAND byte or the data from one of the ADC channels. In Figure 6 and Figure 7, the clear area represents data sent by the host and the shaded area represents data returned by the ambient light sensor or slave device. 1 S 7 Slave Address 1 WR 1 A 8 Data Byte 1 A 1 P S = Start Condition P = Stop Condition Shaded = Slave Transmission Figure 6. Send Byte Protocol 1 S 7 Slave Address 1 RD 1 A 8 Data Byte 1 A 1 P S = Start Condition P = Stop Condition Shaded = Slave Transmission Figure 7. Receive Byte Protocol The LUMENOLOGY r Company r r Copyright E 2007, TAOS Inc. www.taosinc.com 7 TSL2550 AMBIENT LIGHT SENSOR WITH SMBus INTERFACE TAOS029L − OCTOBER 2007 Command Register The command register is used primarily to: D Select which ADC register will be read during a read cycle D Switch the dynamic range of the device between standard and extended range modes D Power the device up for operation or power it down for minimum power consumption Table 1 shows the six primary commands used to control the TSL2550. Table 1. Command Summary COMMAND 0x00h 0x03h 0x1Dh 0x18h 0x43h 0x83h Power-down state Power-up state/Read command register Write command to assert extended range mode Write command to reset or return to standard range mode Read ADC channel 0 Read ADC channel 1 FUNCTION The content of the command register defaults to 0x00h when power is applied to the device, placing the device into the power-down mode. Once the TSL2550 is set to the standard range mode (0x18h) or the extended range mode (0x1Dh), the device remains in that mode until it is powered down or the mode is changed via the command register. The 0x03h command has two purposes: It is used to power up the device and can also be used to check that the device is communicating properly. The value returned during a read cycle should be 0x03h. ADC Register The TSL2550 contains two ADC registers (channel 0 and channel 1). Each ADC register contains two component fields that are used to determine the logarithmic ADC count value: CHORD bits and STEP bits. The CHORD bits correspond to the most significant portion of the ADC value and specifies a segment of the piece-wise linear approximation. The STEP bits correspond to the least significant portion of the ADC count value and specifies a linear value within a segment. CHORD and STEP bits all equal to 0 corresponds to a condition in which the light level is below the detection limit of the sensor. CHORD and STEP bits all equal to 1 corresponds to an overflow condition. Each of the two ADC value registers contain seven data bits and a valid bit as described in Table 2. Table 2. ADC Register Data Format VALID B7 VALID B6 C2 CHORD BITS B5 C1 B4 C0 B3 S3 STEP BITS B2 S2 B1 S1 B0 S0 FIELD VALID CHORD STEP BITS 7 6 to 4 3 to 0 DESCRIPTION ADC channel data is valid. One indicates that the ADC has written data into the channel data register, since ADCEN was asserted in the COMMAND register. CHORD number. STEP number. Copyright E 2007, TAOS Inc. r r The LUMENOLOGY r Company 8 www.taosinc.com TSL2550 AMBIENT LIGHT SENSOR WITH SMBus INTERFACE TAOS029L − OCTOBER 2007 The specific ADC value register read depends on the last read command written to the command register, as described above and in the Operation section, below. The MSB of the ADC register (VALID bit B7) is used to indicate that data has been written to the ADC register after the device is powered up as described in Command Register section. Bits 6 through 0 contain the 7-bit code representing the ADC count value, which is proportional to a photodetector current. In this code, the ADC count value is represented by a piece-wise linear approximation to a log function. The transfer function is broken into 8 chords of 16 steps each. (This code is very similar to μ-law code used in audio compression — it differs in that it does not have a sign bit and it is not inverted.) Table 3 shows the relationship between the CHORD and STEP bits and the CHORD and STEP numbers and values. These are used to calculate the ADC count value. Table 3. CHORD and STEP Numbers and Values vs Register Bits CHORD BITS B6, B5, B4 000 001 010 011 100 101 110 111 C, CHORD NUMBER 0 1 2 3 4 5 6 7 CHORD VALUE (Note A) 0 16 49 115 247 511 1039 2095 STEP VALUE (Note B) 1 2 4 8 16 32 64 128 STEP BITS B3, B2, B1, B0 0000 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111 NOTES: A. CHORD VALUE = INT (16.5 × ((2C) − 1)) B. STEP VALUE = 2C S, STEP NUMBER 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 The ADC count value is obtained by adding the CHORD VALUE and the product of the STEP NUMBER and STEP VALUE (which depends on CHORD NUMBER). ADC Count Value + ((Chord Value) ) (Step Value) The ADC count value can also be expressed as a formula: ADC Count Value + (INT (16.5 where: C is the CHORD NUMBER (0 to 7) S is the STEP NUMBER (0 to 15) as defined in Table 3. (Step Number)) ((2 C * 1))) ) (S (2 C)) The LUMENOLOGY r Company r r Copyright E 2007, TAOS Inc. www.taosinc.com 9 TSL2550 AMBIENT LIGHT SENSOR WITH SMBus INTERFACE TAOS029L − OCTOBER 2007 Operation After applying VDD, the device will initially be in the power down state. To operate the device, issue an SMBus Send Byte protocol with the device address and the appropriate command byte to read ADC channel 0 or ADC channel 1 (see Table 1). To obtain the conversion result, issue an SMBus Receive Byte protocol with the device address. The data byte received will correspond to the value in the ADC register (0 or 1) specified by the previous command. If a conversion has not been completed since power up (either through VDD or power up command), the valid bit will be 0, and the data will not be valid. If there is a valid conversion result available, the valid bit will be set (1), and the remaining 7 bits will represent valid data from the previously selected ADC register. Data may be read repeatedly from the currently selected ADC register, and although it will remain valid, the ADC register will not be updated until a new conversion completes for that channel (800 ms total since there are two serial 400 ms per channel conversion times in standard mode). Note also that the command register itself may be read, as a check to be sure that the device is communicating properly. To power down the device for reduced power consumption, issue an SMBus Send Byte protocol with the device address followed by 0 as indicated in Table 1. Copyright E 2007, TAOS Inc. r r The LUMENOLOGY r Company 10 www.taosinc.com TSL2550 AMBIENT LIGHT SENSOR WITH SMBus INTERFACE TAOS029L − OCTOBER 2007 APPLICATION INFORMATION The TSL2550 is intended for use in ambient light detection applications, such as display backlight control, where adjustments are made to display brightness or contrast based on the brightness of the ambient light, as perceived by the human eye. Conventional silicon detectors respond strongly to infrared light, which the human eye does not see. This can lead to significant error when the infrared content of the ambient light is high, such as with incandescent lighting, due to the difference between the silicon detector response and the brightness perceived by the human eye. This problem is overcome in the TSL2550 through the use of two photodiodes. One of the photodiodes (channel 0) is sensitive to both visible and infrared light, while the second photodiode (channel 1) is sensitive primarily to infrared light. An integrating ADC converts the photodiode currents to channel 0 and channel 1 digital outputs. Channel 1 digital output is used to compensate for the effect of the infrared component of light on the channel 0 digital output. The ADC digital outputs from the two channels are used in a formula to obtain a value that approximates the human eye response in the commonly used Illuminance unit of Lux. For standard mode: Light Level (lux) + (Ch0 * Ch1) where: 0.39 e (*0.181R 2) R = Ch1 Counts / (Ch0 Counts − Ch1 Counts) The formula above was obtained by optical testing with fluorescent and incandescent light sources. The light level calculated from the formula will be slightly higher than the actual light level for sunlight and will be slightly lower than the actual light level for composite fluorescent and incandescent light sources. NOTE: Please see TAOS application notes for additional information, including implementing a display brightness control system with the TSL2550, and for a simple implementation of the equation shown above suitable for use in embedded microcontrollers. Table 4 contains a summary of the typical sensor outputs for several common light sources. Table 4. Sensor Output Summary (Standard Mode) LIGHT SOURCE Fluorescent Daylight (shade) Incandescent ILLUMINANCE (LUX) 297 201 42 CHANNEL 0 (COUNTS) 831 895 959 CHANNEL 1 (COUNTS) 68 343 671 RATIO: CH1/CH0 0.082 0.383 0.7 LUX per CH0 COUNT 0.36 0.22 0.04 Light from 50 or 60 Hz sources, and especially fluorescent lighting, has a high harmonic content. Since the TSL2550 integrates the ambient light over an approximately 400 millisecond interval (per channel), this light ripple is typically reduced to less than ¼ LSB. Power Supply Decoupling The power supply lines must be decoupled with a 0.1 μF capacitor placed as close to the device package as possible. The bypass capacitor should have low effective series resistance (ESR) and effective series inductance (ESI), such as the common ceramic types, which provide a low impedance path to ground at high frequencies to handle transient currents caused by internal logic switching. The LUMENOLOGY r Company r r Copyright E 2007, TAOS Inc. www.taosinc.com 11 TSL2550 AMBIENT LIGHT SENSOR WITH SMBus INTERFACE TAOS029L − OCTOBER 2007 APPLICATION INFORMATION PCB Pad Layout Suggested PCB pad layout guidelines for the D package and T package are shown in Figure 8 and Figure 9. 4.65 6.90 1.27 0.50 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. 2.25 Figure 8. Suggested D Package PCB Layout 2.90 1.50 1.00 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. 0.90 Figure 9. Suggested T Package PCB Layout Copyright E 2007, TAOS Inc. r r The LUMENOLOGY r Company 12 www.taosinc.com TSL2550 AMBIENT LIGHT SENSOR WITH SMBus INTERFACE TAOS029L − OCTOBER 2007 MECHANICAL DATA PACKAGE D TOP VIEW BOTTOM VIEW Plastic Small-Outline PIN 1 PIN 1 6 y 1.27 SIDE VIEW NOTE B j 2.8 TYP CLEAR WINDOW 8 y 0.510 0.330 END VIEW 0.50 0.25 5.00 4.80 0.88 TYP TOP OF SENSOR DIE A 5.3 MAX 455 1.75 1.35 4.00 3.80 6.20 5.80 DETAIL A 0.25 0.19 Pb 1.27 0.41 0.25 0.10 NOTES: A. All linear dimensions are in millimeters. B. The center of the 1234 μm by 282 μm photo-active area is typically located in the center of the package in the long dimension and 269 μm off center in the short dimension. C. Package is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55. D. This drawing is subject to change without notice. Figure 10. Package D — Plastic Small Outline IC Packaging Configuration The LUMENOLOGY r Company r r Copyright E 2007, TAOS Inc. www.taosinc.com 13 TSL2550 AMBIENT LIGHT SENSOR WITH SMBus INTERFACE TAOS029L − OCTOBER 2007 MECHANICAL DATA PACKAGE T TOP VIEW PIN 1 Four-Lead Surface Mount Device PHOTODIODE ACTIVE AREA LOCATION 1.46 PIN 4 0.67 0.28 1.50 1.23 0.55 SIDE VIEW 0.50 1.35 0.35 3.10 DETAIL A: TYPICAL PACKAGE TERMINAL 2 y 75 0.10 0.90 BOTTOM VIEW A 0.78 0.78 R 0.25 2.60 PIN 1 PIN 4 3.80 NOTES: A. B. C. D. All linear dimensions are in millimeters. Terminal finish is gold. Dimension tolerance is ± 0.15 mm. This drawing is subject to change without notice. Pb Figure 11. Package T — Four-Lead Surface Mount Device Packaging Configuration Copyright E 2007, TAOS Inc. r r The LUMENOLOGY r Company 14 www.taosinc.com TSL2550 AMBIENT LIGHT SENSOR WITH SMBus INTERFACE TAOS029L − OCTOBER 2007 MECHANICAL DATA SIDE VIEW Ko 2.11 + 0.10 [0.083 + 0.004] 0.292 + 0.013 [0.0115 + 0.0005] TOP VIEW j 1.50 8 + 0.1 [0.315 + 0.004] 4 + 0.1 [0.157 + 0.004] 2 + 0.05 [0.079 + 0.002] 1.75 + 0.10 [0.069 + 0.004] END VIEW B 5.50 + 0.05 [0.217 + 0.002] 12 + 0.3 − 0.1 [0.472 + 0.12 − 0.004] A A B DETAIL A DETAIL B Ao NOTES: A. B. C. D. E. F. G. 6.45 + 0.10 [0.254 + 0.004] Bo 5.13 + 0.10 [0.202 + 0.004] All linear dimensions are in millimeters [inches]. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly. Symbols on drawing Ao, Bo, and Ko are defined in ANSI EIA Standard 481−B 2001. Each reel is 178 millimeters in diameter and contains 1000 parts. TAOS packaging tape and reel conform to the requirements of EIA Standard 481−B. In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape. This drawing is subject to change without notice. Figure 12. Package D Carrier Tape The LUMENOLOGY r Company r r Copyright E 2007, TAOS Inc. www.taosinc.com 15 TSL2550 AMBIENT LIGHT SENSOR WITH SMBus INTERFACE TAOS029L − OCTOBER 2007 MECHANICAL DATA 0.30 + 0.050 2.10 SIDE VIEW 1.75 + 0.100 8 Typ B j 1.50 4 + 0.100 2 + 0.100 END VIEW TOP VIEW 5.50 + 0.100 j 1.50 R 0.20 TYP B A A 12 + 0.100 DETAIL A 2.90 + 0.100 Ao 3.09 MAX DETAIL B R 0.20 TYP R 0.20 TYP 4.29 MAX 4.10 + 0.100 Bo 1.80 Ko NOTES: A. B. C. D. E. F. G. All linear dimensions are in millimeters. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly. Symbols on drawing Ao, Bo, and Ko are defined in ANSI EIA Standard 481−B 2001. Each reel is 178 millimeters in diameter and contains 1000 parts. TAOS packaging tape and reel conform to the requirements of EIA Standard 481−B. In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape. This drawing is subject to change without notice. Figure 13. Package T Carrier Tape Copyright E 2007, TAOS Inc. r r The LUMENOLOGY r Company 16 www.taosinc.com TSL2550 AMBIENT LIGHT SENSOR WITH SMBus INTERFACE TAOS029L − OCTOBER 2007 MANUFACTURING INFORMATION The D and T packages have been tested and have demonstrated an ability to be reflow soldered to a PCB substrate. The process, equipment, and materials used in these test are detailed below. The solder reflow profile describes the expected maximum heat exposure of components during the solder reflow process of product on a PCB. Temperature is measured on top of component. The components should be limited to a maximum of three passes through this solder reflow profile. Table 5. TSL2550 Solder Reflow Profile PARAMETER Average temperature gradient in preheating Soak time Time above 217°C Time above 230°C Time above Tpeak −10°C Peak temperature in reflow Temperature gradient in cooling tsoak t1 t2 t3 Tpeak REFERENCE TSL2550D/TSL2550T 2.5°C/sec 2 to 3 minutes Max 60 sec Max 50 sec Max 10 sec 260° C (−0°C/+5°C) Max −5°C/sec Tpeak Not to scale — for reference only T3 T2 T1 Temperature (5C) Time (sec) tsoak t3 t2 t1 Figure 14. TSL2550D/TSL2550T Solder Reflow Profile Graph The LUMENOLOGY r Company r r Copyright E 2007, TAOS Inc. www.taosinc.com 17 TSL2550 AMBIENT LIGHT SENSOR WITH SMBus INTERFACE TAOS029L − OCTOBER 2007 MANUFACTURING INFORMATION Moisture Sensitivity Optical characteristics of the device can be adversely affected during the soldering process by the release and vaporization of moisture that has been previously absorbed into the package molding compound. Package D To ensure the package molding compound contains the smallest amount of absorbed moisture possible, all devices shipped in carrier tape have been pre-baked and shipped in a sealed moisture-barrier bag. No further action is necessary if these devices are processed through solder reflow within 24 hours of the seal being broken on the moisture-barrier bag. However, for all devices shipped in tubes or if the seal on the moisture barrier bag has been broken for 24 hours or longer, it is recommended that the following procedures be used to ensure the package molding compound contains the smallest amount of absorbed moisture possible. For devices shipped in tubes: 1. Remove devices from tubes 2. Bake devices for 4 hours, at 90°C 3. After cooling, load devices back into tubes 4. Perform solder reflow within 24 hours after bake Bake only a quantity of devices that can be processed through solder reflow in 24 hours. Devices can be re-baked for 4 hours, at 90°C for a cumulative total of 12 hours (3 bakes for 4 hours at 90°C). For devices shipped in carrier tape: 1. Bake devices for 4 hours, at 90°C in the tape 2. Perform solder reflow within 24 hours after bake Bake only a quantity of devices that can be processed through solder reflow in 24 hours. Devices can be re−baked for 4 hours in tape, at 90°C for a cumulative total of 12 hours (3 bakes for 4 hours at 90°C). Package T To ensure the package molding compound contains the smallest amount of absorbed moisture possible, each device is dry-baked prior to being packed for shipping. Devices are packed in a sealed aluminized envelope with silica gel to protect them from ambient moisture during shipping, handling, and storage before use. The T package has been assigned a moisture sensitivity level of MSL 3 and the devices should be stored under the following conditions: Temperature Range Relative Humidity Total Time Opened Time 5°C to 50°C 60% maximum 6 months from the date code on the aluminized envelope — if unopened 168 hours or fewer Rebaking will be required if the devices have been stored unopened for more than 6 months or if the aluminized envelope has been open for more than 168 hours. If rebaking is required, it should be done at 90°C for 4 hours. Copyright E 2007, TAOS Inc. r r The LUMENOLOGY r Company 18 www.taosinc.com TSL2550 AMBIENT LIGHT SENSOR WITH SMBus INTERFACE TAOS029L − OCTOBER 2007 PRODUCTION DATA — information in this document is current at publication date. Products conform to specifications in accordance with the terms of Texas Advanced Optoelectronic Solutions, Inc. standard warranty. Production processing does not necessarily include testing of all parameters. LEAD-FREE (Pb-FREE) and GREEN STATEMENT Pb-Free (RoHS) TAOS’ terms Lead-Free or Pb-Free mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TAOS Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br) TAOS defines Green to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material). Important Information and Disclaimer The information provided in this statement represents TAOS’ knowledge and belief as of the date that it is provided. TAOS bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TAOS has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TAOS and TAOS suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. NOTICE Texas Advanced Optoelectronic Solutions, Inc. (TAOS) reserves the right to make changes to the products contained in this document to improve performance or for any other purpose, or to discontinue them without notice. Customers are advised to contact TAOS to obtain the latest product information before placing orders or designing TAOS products into systems. TAOS assumes no responsibility for the use of any products or circuits described in this document or customer product design, conveys no license, either expressed or implied, under any patent or other right, and makes no representation that the circuits are free of patent infringement. TAOS further makes no claim as to the suitability of its products for any particular purpose, nor does TAOS assume any liability arising out of the use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS, INC. PRODUCTS ARE NOT DESIGNED OR INTENDED FOR USE IN CRITICAL APPLICATIONS IN WHICH THE FAILURE OR MALFUNCTION OF THE TAOS PRODUCT MAY RESULT IN PERSONAL INJURY OR DEATH. USE OF TAOS PRODUCTS IN LIFE SUPPORT SYSTEMS IS EXPRESSLY UNAUTHORIZED AND ANY SUCH USE BY A CUSTOMER IS COMPLETELY AT THE CUSTOMER’S RISK. LUMENOLOGY, TAOS, the TAOS logo, and Texas Advanced Optoelectronic Solutions are registered trademarks of Texas Advanced Optoelectronic Solutions Incorporated. The LUMENOLOGY r Company r r Copyright E 2007, TAOS Inc. www.taosinc.com 19 TSL2550 AMBIENT LIGHT SENSOR WITH SMBus INTERFACE TAOS029L − OCTOBER 2007 Copyright E 2007, TAOS Inc. r r The LUMENOLOGY r Company 20 www.taosinc.com