B57150K1242J000

NTC thermistors for temperature measurement Leadless NTCs Series/Type: B57150K1 Date: January 2018 © EPCOS AG 2018. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited. EPCOS AG is a TDK Group Company. Temperature measurement and compensation B57150K1 Leadless NTCs K1150 Dimensional drawing Applications Temperature measurement and compensation Features Washer shape Front surfaces silver-plated For clamp contacting Delivery mode Bulk Dimensions in mm Approx. weight 140 mg General technical data Climatic category Max. power Resistance tolerance Rated temperature Dissipation factor Thermal cooling time constant Heat capacity (IEC 60068-1) (at 25 °C) (in air) (in air) P25 ∆RR/RR TR δth1) τc1) Cth1) 55/155/21 180 ±5 100 approx. 3.2 approx. 30 approx. 96 mW % °C mW/K s mJ/K Electrical specification and ordering codes R100 Ω 144 R25 Ω 2394 No. of R/T characteristic 2911 1) Depends on mounting situation Please read Cautions and warnings and Important notes at the end of this document. Page 2 of 19 B25/100 K 4170 ±1.5% Ordering code B57150K1242J000 Temperature measurement and compensation B57150K1 Leadless NTCs K1150 Reliability data Test Standard Storage in dry heat IEC 60068-2-2 Storage in damp heat, steady state Rapid temperature cycling Endurance Long-term stability (empirical value) Test conditions Storage at upper category temperature T: 155 °C t: 1000 h IEC Temperature of air: 40 °C 60068-2-78 Relative humidity of air: 93% Duration: 21 days IEC Lower test temperature: 55 °C 60068-2-14 Upper test temperature: 155 °C Number of cycles: 100 Pmax: 180 mW t: 1000 h Temperature: 70°C t: 10000 h ∆R25/R25 (typical) < 3% Remarks < 3% No visible damage < 3% No visible damage < 3% No visible damage No visible damage < 5% No visible damage Note Contact of NTC thermistors with any liquids and solvents shall be prevented. It must be ensured that no water enters the NTC thermistors (e.g. through plug terminals). Avoid dewing and condensation unless thermistor is specified for these conditions. Please read Cautions and warnings and Important notes at the end of this document. Page 3 of 19 Temperature measurement and compensation B57150K1 Leadless NTCs K1150 R/T characteristics R/T No. 2911 T (°C) B25/100 = 4170 K T (°C) RT/R25 α (%/K) 55.0 50.0 45.0 40.0 35.0 120.7 82.419 57.035 39.975 28.36 B25/100 = 4170 K T (°C) RT/R25 α (%/K) B25/100 = 4170 K RT/R25 α (%/K) 7.8 7.5 7.2 7.0 6.7 20.0 25.0 30.0 35.0 40.0 1.2625 1.0000 0.79751 0.6402 0.51716 4.7 4.6 4.5 4.3 4.2 95.0 100.0 105.0 110.0 115.0 0.070207 0.060152 0.051734 0.044657 0.038685 3.1 3.1 3.0 2.9 2.8 30.0 25.0 20.0 15.0 10.0 20.355 14.773 10.836 8.0287 6.0067 6.5 6.3 6.1 5.9 5.7 45.0 50.0 55.0 60.0 65.0 0.4203 0.34356 0.2824 0.23338 0.19386 4.1 4.0 3.9 3.8 3.7 120.0 125.0 130.0 135.0 140.0 0.033627 0.029326 0.025658 0.022517 0.01982 2.8 2.7 2.6 2.6 2.5 5.0 0.0 5.0 10.0 15.0 4.5358 3.4555 2.655 2.0565 1.6053 5.5 5.4 5.2 5.0 4.9 70.0 75.0 80.0 85.0 90.0 0.16183 0.13573 0.11437 0.096793 0.082267 3.6 3.5 3.4 3.3 3.2 145.0 150.0 155.0   0.017496 0.015488 0.013747   2.5 2.4 2.4   Please read Cautions and warnings and Important notes at the end of this document. Page 4 of 19 Temperature measurement and compensation B57150K1 Leadless NTCs K1150 Mounting instructions 1 Soldering 1.1 Leaded NTC thermistors Leaded thermistors comply with the solderability requirements specified by CECC. When soldering, care must be taken that the NTC thermistors are not damaged by excessive heat. The following maximum temperatures, maximum time spans and minimum distances have to be observed: Bath temperature Dip soldering Iron soldering max. 260 °C max. 360 °C Soldering time max. 4 s max. 2 s Distance from thermistor min. 6 mm min. 6 mm Under more severe soldering conditions the resistance may change. 1.1.1 Wave soldering Temperature characteristic at component terminal with dual wave soldering 1.2 Leadless NTC thermistors In case of NTC thermistors without leads, soldering is restricted to devices which are provided with a solderable metallization. The temperature shock caused by the application of hot solder may produce fine cracks in the ceramic, resulting in changes in resistance. To prevent leaching of the metallization, solder with silver additives or with a low tin content Please read Cautions and warnings and Important notes at the end of this document. Page 5 of 19 Temperature measurement and compensation B57150K1 Leadless NTCs K1150 should be used. In addition, soldering methods should be employed which permit short soldering times. 1.3 SMD NTC thermistors SMD NTC thermistors can be provided with a nickel barrier termination or on special request with silver-palladium termination. The use of no-clean solder products is recommended. In any case mild, non-activated fluxes should be used. Flux residues after soldering should be minimized. SMD NTCs with AgPd termination are not approved for lead-free soldering. Nickel barrier termination Figure 1 SMD NTC thermistors, structure of nickel barrier termination The nickel barrier layer of the silver/nickel/tin termination (see figure 1) prevents leaching of the silver base metallization layer. This allows great flexibility in the selection of soldering parameters. The tin prevents the nickel layer from oxidizing and thus ensures better wetting by the solder. The nickel barrier termination is tested for all commonly-used soldering methods according to IEC 60068-2-58. Insufficient preheating may cause ceramic cracks. Rapid cooling by dipping in solvent is not recommended. The following test and process conditions apply for nickel barrier termination. Please read Cautions and warnings and Important notes at the end of this document. Page 6 of 19 Temperature measurement and compensation B57150K1 Leadless NTCs 1.3.1 K1150 Solderability (test to IEC 60068-2-58) Preconditioning: Immersion into flux F-SW 32. Evaluation criterion: Wetting of soldering areas ≥95%. Solder Bath temperature (°C) Dwell time (s) SnPb 60/40 215 ±3 3 ±0.3 SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9) 245 ±3 3 ±0.3 1.3.2 Resistance to soldering heat (test to IEC 60068-2-58) Preconditioning: Immersion into flux F-SW 32. Evaluation criterion: Leaching of side edges ≤1/3. Solder Bath temperature (°C) Dwell time (s) SnPb 60/40 260 ±5 10 ±1 SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9) 260 ±5 10 ±1 1.3.3 Reflow soldering Temperature ranges for reflow soldering acc. to IEC 60068-2-58 recommendations. Please read Cautions and warnings and Important notes at the end of this document. Page 7 of 19 Temperature measurement and compensation B57150K1 Leadless NTCs Profile feature Preheat and soak - Temperature min - Temperature max - Time K1150 Sn-Pb eutectic assembly Pb-free assembly Tsmin Tsmax tsmin to tsmax 100 °C 150 °C 60 ... 120 s 150 °C 200 °C 60 ... 120 s Average ramp-up rate Tsmax to Tp 3 °C/ s max. 3 °C/ s max. Liquidous temperature Time at liquidous TL tL 183 °C 40 ... 150 s 217 °C 40 ... 150 s Peak package body temperature Tp 215 °C ... 260 °C1) 235 °C ... 260 °C Time above (TP 5 °C) tp 10 ... 40 s 10 ... 40 s Average ramp-down rate Tp to Tsmax 6 °C/ s max. 6 °C/ s max. max. 8 minutes max. 8 minutes Time 25 °C to peak temperature 1) Depending on package thickness. Notes: All temperatures refer to topside of the package, measured on the package body surface. Number of reflow cycles: 3 Iron soldering should be avoided, hot air methods are recommended for repair purposes. Solder joint profiles for silver/nickel/tin terminations Please read Cautions and warnings and Important notes at the end of this document. Page 8 of 19 Temperature measurement and compensation Leadless NTCs 1.3.4 B57150K1 K1150 Recommended geometry of solder pads Recommended maximum dimensions (mm) Case size inch/mm A B C 0402/1005 0.6 0.6 1.7 0603/1608 1.0 1.0 3.0 0805/2012 1.3 1.2 3.4 1206/3216 1.8 1.2 4.5 2 Conductive adhesion An alternative to soldering for silver-palladium terminated components is the gluing of thermistors with conductive adhesives. The benefit of this method is that it involves no thermal stress. The adhesives used must be chemically inert. 3 Clamp contacting Pressure contacting by means of clamps is particularly suitable for applications involving frequent switching and high turn-on powers. 4 Robustness of terminations (leaded types) The leads meet the requirements of IEC 60068-2-21. They may not be bent closer than 4 mm from the solder joint on the thermistor body or from the point at which they leave the feedthroughs. During bending, any mechanical stress at the outlet of the leads must be removed. The bending radius should be at least 0.75 mm. Please read Cautions and warnings and Important notes at the end of this document. Page 9 of 19 Temperature measurement and compensation Leadless NTCs Tensile strength: B57150K1 K1150 Test Ua1: Value of applied force for Ua1 test: Diameter (d) of Force with tolerance of ±10% corresponding round leads ∅ ≤ 0.25 mm 1.0 N 0.25 < ∅ ≤ 0.35 mm 2.5 N 0.35 < ∅ ≤ 0.50 mm 5.0 N 0.50 < ∅ ≤ 0.80 mm 10.0 N Bending strength: Test Ub: Two 90°-bends in opposite directions Value of applied force for Ub test: Diameter (d) of Force with tolerance of ±10% corresponding round leads ∅ ≤ 0.25 mm 0.5 N 0.25 < ∅ ≤ 0.35 mm 1.25 N 0.35 < ∅ ≤ 0.50 mm 2.5 N 0.50 < ∅ ≤ 0.80 mm 5N Torsional strength: Test Uc: severity 2 The lead is bent by 90° at a distance of 6 to 6.5 mm from the thermistor body. The bending radius of the leads should be approx. 0.75 mm. Two torsions of 180° each (severity 2). When subjecting leads to mechanical stress, the following should be observed: Tensile stress on leads During mounting and operation tensile forces on the leads are to be avoided. Bending of leads Bending of the leads directly on the thermistor body is not permissible. A lead may be bent at a minimum distance of twice the wire's diameter +4 mm from the solder joint on the thermistor body. During bending the wire must be mechanically relieved at its outlet. The bending radius should be at least 0.75 mm. Please read Cautions and warnings and Important notes at the end of this document. Page 10 of 19 Temperature measurement and compensation Leadless NTCs 5 B57150K1 K1150 Sealing and potting Sealing or potting processes can affect the reliability of the component. When thermistors are sealed, potted or overmolded, there must be no mechanical stress caused by thermal expansion during the production process (curing / overmolding process) and during later operation. The upper category temperature of the thermistor must not be exceeded. Ensure that the materials used (sealing / potting compound and plastic material) are chemically neutral. As thermistors are temperature sensitive components it should be considered that molding can affect the thermal surrounding and may influence e.g. the response time. Extensive testing is encouraged in order to determine whether overmolding or potting influences the functionality and/ or reliability of the component. 6 Cleaning Cleaning processes can affect the reliability of the component. If cleaning is necessary, mild cleaning agents are recommended. Cleaning agents based on water are not allowed. Washing processes may damage the product due to the possible static or cyclic mechanical loads (e.g. ultrasonic cleaning). They may cause cracks which might lead to reduced reliability and/ or lifetime. 7 Storage In order to maintain their solderability, thermistors must be stored in a non-corrosive atmosphere. Humidity, temperature and container materials are critical factors. Do not store SMDs where they are exposed to heat or direct sunlight. Otherwise, the packing material may be deformed or SMDs may stick together, causing problems during mounting. After opening the factory seals, such as polyvinyl-sealed packages, use the SMDs as soon as possible. The components should be left in the original packing. Touching the metallization of unsoldered thermistors may change their soldering properties. Storage temperature: 25 °C up to 45 °C Relative humidity (without condensation): ≤75% annual mean