B57221V2103J060

NTC thermistors for temperature measurement SMD NTC thermistors, case size 0402 (1005), standard series Series/Type: B572**V2 Date: December 2016 © EPCOS AG 2016. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited. EPCOS AG is a TDK Group Company. Temperature measurement and compensation B572**V2 SMD NTC thermistors, case size 0402 (1005) Applications Temperature measurement and compensation Standard series Dimensional drawing Features Multilayer SMD NTC with inner electrodes Nickel barrier termination Excellent long-term aging stability in high temperature environment Short response time UL approval (E69802) Options Alternative resistance ratings, resistance tolerances and B value tolerances available on request. Dimensions in mm Approx. weight 4.5 mg Delivery mode Cardboard tape, 180-mm reel General technical data Operating temperature range Max. power Resistance tolerance Rated temperature Dissipation factor Thermal cooling time constant Heat capacity Top (at 25 °C, on PCB) P251) ∆RR/RR TR (on PCB) δth1) (on PCB) τc1) Cth1) 1) Depends on mounting situation Please read Cautions and warnings and Important notes at the end of this document. Page 2 of 20 55 ... 125 150 ±1, ±3, ±5 25 approx. 2.5 approx. 3 approx. 7.5 °C mW % °C mW/K s mJ/K Temperature measurement and compensation B572**V2 SMD NTC thermistors, case size 0402 (1005) Standard series Electrical specification and ordering codes R25 Ω 3.3 k 4.7 k 10 k 10 k 22 k 33 k 47 k 47 k 100 k ∆RR/RR % ±5 ±5 ±1, ±3, ±5 ±5 ±5 ±5 ±5 ±1, ±3, ±5 ±1, ±3, ±5 No. of R/T characteristic 8502 8502 8509 8502 8506 8506 8502 8551 8552 B25/50 K 3940 3940 3380 3940 4473 4473 3940 4050 4250 B25/85 K 3980 3980 3435 3980 4548 4548 3980 4108 4311 + = Resistance tolerance F = ±1% H = ±3% J = ±5% Please read Cautions and warnings and Important notes at the end of this document. Page 3 of 20 B25/100 K 4000 ±3% 4000 ±3% 3455 ±1% 4000 ±3% 4575 ±3% 4575 ±3% 4000 ±3% 4131 ±1% 4334 ±1% Ordering code B57221V2332J060 B57221V2472J060 B57230V2103+260 B57221V2103J060 B57261V2223J060 B57261V2333J060 B57221V2473J060 B57250V2473+560 B57250V2104+360 Temperature measurement and compensation B572**V2 SMD NTC thermistors, case size 0402 (1005) Standard series Reliability data SMD NTC thermistors are tested in accordance with IEC 60068. The parts are mounted on a standardized PCB in accordance with IEC 60539-1. Test Standard Storage in dry heat IEC 60068-2-2 JIS C 0021 Storage in damp heat, steady state Rapid temperature cycling Endurance Solderability Test conditions Storage at upper category temperature T: (125 ±2) °C t: 1000 h IEC Temperature of air: (40 ±2) °C 60068-2-78 Relative humidity of air: JIS C 0022 (93 +2/3)% Duration: 56 days IEC Lower test temperature: 55 °C 60068-2-14 Upper test temperature: 125 °C JIS C 0025 Number of cycles: 100 Pmax: 150 mW T: (65 ±2) °C t: 1000 h IEC Solderability: 60068-2-58 (215 ±3) °C, (3 ±0.3) s JIS C 0054 (245 ±5) °C, (3 ±0.3) s Resistance drift after soldering Please read Cautions and warnings and Important notes at the end of this document. Resistance to soldering heat: (260 ±5) °C, (10 ±1) s Reflow soldering profile Page 4 of 20 ∆R25/R25 (typical) < 2% Remarks < 2% < 2% < 2% 95% of terminations wetted < 1% Temperature measurement and compensation B572**V2 SMD NTC thermistors, case size 0402 (1005) Standard series R/T characteristics R/T No. T (°C) 8502 8506 8509 B25/100 = 4000 K B25/100 = 4575 K B25/100 = 3455 K RT/R25 α (%/K) RT/R25 α (%/K) RT/R25 α (%/K) 55.0 50.0 45.0 40.0 35.0 96.158 66.892 47.127 33.606 24.243 7.4 7.1 6.9 6.6 6.4 30.0 25.0 20.0 15.0 10.0 17.681 13.032 9.702 7.2923 5.5314 6.2 6.0 5.8 5.6 5.4 5.0 0.0 5.0 10.0 15.0 4.2325 3.2657 2.54 1.9907 1.5716 20.0 25.0 30.0 35.0 40.0 8.0 7.7 7.5 7.2 7.0 44.605 33.281 25.044 19.003 14.536 5.9 5.8 5.6 5.4 5.3 24.471 17.503 12.646 9.2241 6.7905 6.8 6.6 6.4 6.2 6.0 11.206 8.7041 6.8104 5.3665 4.2576 5.1 5.0 4.8 4.7 4.6 5.3 5.1 4.9 4.8 4.7 5.0433 3.7775 2.8525 2.1709 1.6647 5.9 5.7 5.5 5.4 5.2 3.4001 2.7326 2.2096 1.7973 1.4703 4.4 4.3 4.2 4.1 4.0 1.2494 1.0000 0.80552 0.65288 0.53229 4.5 4.4 4.3 4.1 4.0 1.2857 1.0000 0.783 0.61707 0.48934 5.1 5.0 4.8 4.7 4.6 1.2093 1.0000 0.83113 0.69418 0.58255 3.9 3.7 3.6 3.6 3.5 45.0 50.0 55.0 60.0 65.0 0.43645 0.35981 0.29819 0.24837 0.20787 3.9 3.8 3.7 3.6 3.5 0.39039 0.31326 0.25277 0.20507 0.16724 4.5 4.3 4.2 4.1 4.0 0.49112 0.41587 0.35365 0.30197 0.25888 3.4 3.3 3.2 3.1 3.0 70.0 75.0 80.0 85.0 90.0 0.17479 0.14763 0.12523 0.10667 0.091227 3.4 3.3 3.2 3.2 3.1 0.13707 0.1129 0.093421 0.077657 0.064837 3.9 3.8 3.7 3.7 3.6 0.22278 0.19243 0.16681 0.1451 0.12663 3.0 2.9 2.8 2.8 2.7 95.0 100.0 105.0 110.0 115.0 0.078319 0.067488 0.058363 0.050647 0.044098 3.0 2.9 2.9 2.8 2.7 0.054364 0.045769 0.038687 0.032827 0.027958 3.5 3.4 3.3 3.2 3.2 0.11088 0.097381 0.085788 0.075795 0.067155 2.6 2.6 2.5 2.4 2.4 120.0 125.0 130.0 135.0 140.0 0.03852 0.033752 0.029663 0.026146 0.023111 2.7 2.6 2.6 2.5 2.4    0.023897 0.020498 3.1 3.0    0.059663 0.053146 0.047463 0.042493 0.038134 2.3 2.3 2.2 2.2 2.1 145.0 150.0 0.020484 0.018203 2.4 2.3     0.034302 0.030925 2.1 2.1 Please read Cautions and warnings and Important notes at the end of this document. 154.6 104.37 71.361 49.386 34.574 Page 5 of 20 Temperature measurement and compensation B572**V2 SMD NTC thermistors, case size 0402 (1005) Standard series R/T characteristics R/T No. T (°C) 8551 8552 B25/100 = 4131 K B25/100 = 4334 K RT/R25 α (%/K) RT/R25 α (%/K) 55.0 50.0 45.0 40.0 35.0 111.73 76.28 52.88 37.187 26.498 7.8 7.5 7.2 6.9 6.7 30.0 25.0 20.0 15.0 10.0 19.117 13.954 10.297 7.677 5.780 6.4 6.2 6.0 5.8 5.6 21.969 15.812 11.509 8.4659 6.2899 6.7 6.5 6.2 6.0 5.8 138.15 92.920 63.468 43.979 30.888 8.1 7.8 7.5 7.2 6.9 5.0 0.0 5.0 10.0 15.0 4.3916 3.3661 2.6014 2.0262 1.5901 5.4 5.2 5.1 4.9 4.8 4.7178 3.5705 2.7255 2.0974 1.6266 5.7 5.5 5.3 5.2 5.0 20.0 25.0 30.0 35.0 40.0 1.2567 1.0000 0.8009 0.6454 0.5232 4.6 4.5 4.4 4.3 4.1 1.2709 1.0000 0.79218 0.63161 0.50672 4.9 4.7 4.6 4.5 4.3 45.0 50.0 55.0 60.0 65.0 0.42650 0.34959 0.28804 0.23851 0.19844 4.0 3.9 3.8 3.7 3.6 0.40894 0.33191 0.27087 0.22222 0.18322 4.2 4.1 4.0 3.9 3.8 70.0 75.0 80.0 85.0 90.0 0.16587 0.13926 0.11742 0.09941 0.08449 3.5 3.5 3.4 3.3 3.2 0.15181 0.12637 0.10566 0.088735 0.074831 3.7 3.6 3.5 3.4 3.4 95.0 100.0 105.0 110.0 115.0 0.07209 0.06174 0.05305 0.04575 0.039583 3.1 3.1 3.0 2.9 2.9 0.063360 0.053856 0.045950 0.039346 0.033810 3.3 3.2 3.1 3.1 3.0 120.0 125.0 130.0 135.0 140.0 0.034356 0.029912 0.026120 0.022875 0.020089 2.8 2.7 2.7 2.6 2.6 0.029151 0.025217 0.021882 0.019047 0.016628 2.9 2.9 2.8 2.7 2.7 145.0 150.0 0.017690 0.015619 2.5 2.5 0.014559 0.012782 2.6 2.6 Please read Cautions and warnings and Important notes at the end of this document. Page 6 of 20 Temperature measurement and compensation B572**V2 SMD NTC thermistors, case size 0402 (1005) Standard series Taping and packing 1 Taping of SMD NTC thermistors Tape and reel packing according to IEC 60286-3. Tape material: Cardboard or blister, tape width 8 ±0.30 mm 2 Reel packing Dimensions in mm 8-mm tape 180-mm reel 330-mm reel A 180 +0/3 330 +0/2.0 W1 8.4 +1.5/0 8.4 +1.5/0 W2 14.4 max. 14.4 max. Please read Cautions and warnings and Important notes at the end of this document. Page 7 of 20 Temperature measurement and compensation B572**V2 SMD NTC thermistors, case size 0402 (1005) Standard series Leader, trailer Packing units for discrete chip Case size Chip thickness inch/mm 0402/1005 0603/1608 0805/2012 1206/3216 3 th 0.5 mm 0.8 mm 0.8 mm 1.2 mm 0.8 mm 1.2 mm Cardboard tape Blister tape W 8 mm 8 mm     W  8 mm 8 mm 8 mm 8 mm 8 mm ∅ 180-mm reel ∅ 330-mm reel pcs. 10000 4000 4000 3000 3000 3000 pcs. 50000 16000 16000 12000 12000 12000 Packing codes The last two digits of the complete ordering code state the packing mode: Last two digits 60 SMD Cardboard tape 180-mm reel packing 62 SMD Blister tape 180-mm reel packing 70 SMD Cardboard tape 330-mm reel packing 72 SMD Blister tape 330-mm reel packing Please read Cautions and warnings and Important notes at the end of this document. Page 8 of 20 Temperature measurement and compensation SMD NTC thermistors, case size 0402 (1005) B572**V2 Standard series Mounting instructions 1 Soldering 1.1 SMD NTC thermistors SMD NTC thermistors can be provided with a nickel barrier termination or on special request with silver-palladium termination. The usage of mild, non-activated fluxes for soldering is recommended as well as a proper cleaning of the PCB. The nickel barrier layer of the silver/nickel/tin termination (see figure 1) prevents leaching of the silver base metalization layer. This allows great flexibility in the selection of soldering parameters. The tin prevents the nickel layer from oxidizing and thus ensures better wetting by the solder. The nickel barrier termination is suitable for all commonly-used soldering methods. Note: SMD NTCs with AgPd termination are not approved for lead-free soldering. Figure 1 SMD NTC thermistors, structure of nickel barrier termination Please read Cautions and warnings and Important notes at the end of this document. Page 9 of 20 Temperature measurement and compensation SMD NTC thermistors, case size 0402 (1005) 1.2 Wave soldering Temperature characteristic at component terminal with dual wave soldering Solder joint profiles for silver/nickel/tin terminations Please read Cautions and warnings and Important notes at the end of this document. Page 10 of 20 B572**V2 Standard series Temperature measurement and compensation SMD NTC thermistors, case size 0402 (1005) 1.3 B572**V2 Standard series Reflow soldering Recommended temperature characteristic for reflow soldering following JEDEC J-STD-020D Profile feature Preheat and soak - Temperature min - Temperature max - Time Average ramp-up rate Liquidous temperature Time at liquidous Peak package body temperature Time (tP)3) within 5 °C of specified classification temperature (Tc) Average ramp-down rate Time 25 °C to peak temperature Sn-Pb eutectic assembly Pb-free assembly Tsmin Tsmax tsmin to tsmax TL to Tp TL tL Tp1) 100 °C 150 °C 60 ... 120 s 3 °C/ s max. 183 °C 60 ... 150 s 220 °C ... 235 °C2) 150 °C 200 °C 60 ... 120 s 3 °C/ s max. 217 °C 60 ... 150 s 245 °C ... 260 °C2) tP 20 s3) 30 s3) Tp to TL 6 °C/ s max. maximum 6 min 6 °C/ s max. maximum 8 min 1) Tolerance for peak profile temperature (TP) is defined as a supplier minimum and a user maximum. 2) Depending on package thickness. For details please refer to JEDEC J-STD-020D. 3) Tolerance for time at peak profile temperature (tP) is defined as a supplier minimum and a user maximum. Note: All temperatures refer to topside of the package, measured on the package body surface. Number of reflow cycles: 3 Please read Cautions and warnings and Important notes at the end of this document. Page 11 of 20 Temperature measurement and compensation SMD NTC thermistors, case size 0402 (1005) B572**V2 Standard series Solder joint profiles for silver/nickel/tin terminations 1.3.1 Recommended geometry of solder pads Recommended maximum dimensions (mm) Case size inch/mm A B C 0402/1005 0.6 0.6 1.7 0603/1608 1.0 1.0 3.0 0805/2012 1.3 1.2 3.4 1206/3216 1.8 1.2 4.5 1.3.2 Notes Iron soldering should be avoided, hot air methods are recommended for repair purposes. Please read Cautions and warnings and Important notes at the end of this document. Page 12 of 20 Temperature measurement and compensation SMD NTC thermistors, case size 0402 (1005) 2 B572**V2 Standard series Conductive adhesion An alternative to soldering is the gluing of thermistors with conductive adhesives. The benefit of this method is that it involves no thermal stress. The adhesives used must be chemically inert. 3 Clamp contacting Pressure contacting by means of clamps is particularly suitable for applications involving frequent switching and high turn-on powers. 4 Cleaning, sealing and potting Cleaning, sealing or potting processes can affect the reliability of components. If cleaning is necessary, mild cleaning agents such as ethyl alcohol and cleaning gasoline are recommended. Cleaning agents based on water are not allowed. When thermistors are sealed, potted or overmolded, there must be no mechanical stress caused by thermal expansion during the production process (curing/ overmolding process) and during later operation. The upper category temperature of the thermistor must not be exceeded. Ensure that the materials used (sealing/ potting compound and plastic material) are chemically neutral. As thermistors are temperature sensitive components it should be considered that molding can affect the thermal surrounding and may influence e.g. the response time. Extensive testing is encouraged in order to determine whether overmolding or potting influences the functionality and/ or reliability of the component. 5 Storage In order to maintain their solderability, thermistors must be stored in a non-corrosive atmosphere. Humidity, temperature and container materials are critical factors. Do not store SMDs where they are exposed to heat or direct sunlight. Otherwise, the packing material may be deformed or SMDs may stick together, causing problems during mounting. After opening the factory seals, such as polyvinyl-sealed packages, use the SMDs as soon as possible. The components should be left in the original packing. Touching the metallization of unsoldered thermistors may change their soldering properties. Storage temperature: 25 °C up to 45 °C Relative humidity (without condensation): ≤75% annual mean