SMD NTC Thermistors (EPCOS)
Series/Type:
B57261V2
The following products presented in this data sheet are being withdrawn.
Ordering Code
B57261V2223J060
Substitute Product
Date of
Withdrawal
2020-10-02
Deadline Last Last
Orders
Shipments
2021-01-08
2021-04-09
Please contact your nearest TDK sales office if you need support in selecting a suitable
substitute. The addresses of our worldwide sales network are presented at www.tdkelectronics.tdk.com/sales.
Temperature measurement and compensation
B572**V2
SMD NTC thermistors, case size 0402 (1005)
Applications
Temperature measurement and
compensation
Standard series
Dimensional drawing
Features
Multilayer SMD NTC with inner electrodes
Nickel barrier termination
For temperature measurement up to 125 °C
Excellent long-term aging stability in high
temperature environment
High mechanical robustness
Short response time
100% Pb free
UL approval (E69802)
Dimensions in mm
Approx. weight 2 mg
Options
Alternative resistance ratings, resistance
tolerances and B value tolerances available
on request.
Delivery mode
Cardboard tape, 180-mm reel
General technical data
Operating temperature range
Max. power
Resistance tolerance
Rated temperature
Dissipation factor
Thermal cooling time constant
Heat capacity
Top
(at 25 °C, on PCB) P251)
∆RR/RR
TR
(on PCB)
δth1)
(on PCB)
τc1)
Cth1)
1) Depends on mounting situation
Please read Cautions and warnings and
Important notes at the end of this document.
Page 2 of 27
55 ... 125
150
±1, ±3, ±5
25
approx. 2.5
approx. 3
approx. 7.5
°C
mW
%
°C
mW/K
s
mJ/K
Temperature measurement and compensation
B572**V2
SMD NTC thermistors, case size 0402 (1005)
Standard series
Electrical specification and ordering codes
R25
Ω
3.3 k
4.7 k
10 k
10 k
22 k
47 k
47 k
100 k
∆RR/RR
%
±5
±5
±1, ±3, ±5
±5
±5
±5
±1, ±3, ±5
±1, ±3, ±5
No. of R/T
characteristic
8502
8502
8509
8502
8506
8502
8551
8552
B25/50
K
3940
3940
3380
3940
4473
3940
4050
4250
B25/85
K
3980
3980
3435
3980
4548
3980
4108
4311
+ = Resistance tolerance
F = ±1%
H = ±3%
J = ±5%
Please read Cautions and warnings and
Important notes at the end of this document.
Page 3 of 27
B25/100
K
4000 ±3%
4000 ±3%
3455 ±1%
4000 ±3%
4575 ±3%
4000 ±3%
4131 ±1%
4334 ±1%
Ordering code
B57221V2332J060
B57221V2472J060
B57230V2103+260
B57221V2103J060
B57261V2223J060
B57221V2473J060
B57250V2473+560
B57250V2104+360
Temperature measurement and compensation
B572**V2
SMD NTC thermistors, case size 0402 (1005)
Standard series
Reliability data
SMD NTC thermistors are tested in accordance with IEC 60068. The parts are mounted on a
standardized PCB in accordance with IEC 60539-1.
Test
Standard
Storage in
dry heat
IEC
60068-2-2
JIS C 0021
Storage in damp
heat, steady state
Rapid temperature
cycling
Endurance
Solderability
Test conditions
Storage at upper
category temperature
T: (125 ±2) °C
t: 1000 h
IEC
Temperature of air: (40 ±2) °C
60068-2-78 Relative humidity of air:
JIS C 0022 (93 +2/3)%
Duration: 56 days
IEC
Lower test temperature: 55 °C
60068-2-14 Upper test temperature: 125 °C
JIS C 0025 Number of cycles: 100
Pmax: 150 mW
T: (65 ±2) °C
t: 1000 h
IEC
Solderability:
60068-2-58 (215 ±3) °C, (3 ±0.3) s
JIS C 0054 (245 ±5) °C, (3 ±0.3) s
Resistance drift
after soldering
Please read Cautions and warnings and
Important notes at the end of this document.
Resistance to soldering heat:
(260 ±5) °C, (10 ±1) s
Reflow soldering profile
Page 4 of 27
∆R25/R25
(typical)
< 2%
Remarks
< 2%
< 2%
< 2%
95% of
terminations
wetted
< 1%
Temperature measurement and compensation
B572**V2
SMD NTC thermistors, case size 0402 (1005)
Standard series
R/T characteristics
R/T No.
T (°C)
8502
8506
8509
B25/100 = 4000 K
B25/100 = 4575 K
B25/100 = 3455 K
RT/R25
α (%/K) RT/R25
α (%/K) RT/R25
α (%/K)
55.0
50.0
45.0
40.0
35.0
96.158
66.892
47.127
33.606
24.243
7.4
7.1
6.9
6.6
6.4
30.0
25.0
20.0
15.0
10.0
17.681
13.032
9.702
7.2923
5.5314
6.2
6.0
5.8
5.6
5.4
5.0
0.0
5.0
10.0
15.0
4.2325
3.2657
2.54
1.9907
1.5716
20.0
25.0
30.0
35.0
40.0
8.0
7.7
7.5
7.2
7.0
44.605
33.281
25.044
19.003
14.536
5.9
5.8
5.6
5.4
5.3
24.471
17.503
12.646
9.2241
6.7905
6.8
6.6
6.4
6.2
6.0
11.206
8.7041
6.8104
5.3665
4.2576
5.1
5.0
4.8
4.7
4.6
5.3
5.1
4.9
4.8
4.7
5.0433
3.7775
2.8525
2.1709
1.6647
5.9
5.7
5.5
5.4
5.2
3.4001
2.7326
2.2096
1.7973
1.4703
4.4
4.3
4.2
4.1
4.0
1.2494
1.0000
0.80552
0.65288
0.53229
4.5
4.4
4.3
4.1
4.0
1.2857
1.0000
0.783
0.61707
0.48934
5.1
5.0
4.8
4.7
4.6
1.2093
1.0000
0.83113
0.69418
0.58255
3.9
3.7
3.6
3.6
3.5
45.0
50.0
55.0
60.0
65.0
0.43645
0.35981
0.29819
0.24837
0.20787
3.9
3.8
3.7
3.6
3.5
0.39039
0.31326
0.25277
0.20507
0.16724
4.5
4.3
4.2
4.1
4.0
0.49112
0.41587
0.35365
0.30197
0.25888
3.4
3.3
3.2
3.1
3.0
70.0
75.0
80.0
85.0
90.0
0.17479
0.14763
0.12523
0.10667
0.091227
3.4
3.3
3.2
3.2
3.1
0.13707
0.1129
0.093421
0.077657
0.064837
3.9
3.8
3.7
3.7
3.6
0.22278
0.19243
0.16681
0.1451
0.12663
3.0
2.9
2.8
2.8
2.7
95.0
100.0
105.0
110.0
115.0
0.078319
0.067488
0.058363
0.050647
0.044098
3.0
2.9
2.9
2.8
2.7
0.054364
0.045769
0.038687
0.032827
0.027958
3.5
3.4
3.3
3.2
3.2
0.11088
0.097381
0.085788
0.075795
0.067155
2.6
2.6
2.5
2.4
2.4
120.0
125.0
130.0
135.0
140.0
0.03852
0.033752
0.029663
0.026146
0.023111
2.7
2.6
2.6
2.5
2.4
0.023897
0.020498
3.1
3.0
0.059663
0.053146
0.047463
0.042493
0.038134
2.3
2.3
2.2
2.2
2.1
145.0
150.0
0.020484
0.018203
2.4
2.3
0.034302
0.030925
2.1
2.1
Please read Cautions and warnings and
Important notes at the end of this document.
154.6
104.37
71.361
49.386
34.574
Page 5 of 27
Temperature measurement and compensation
B572**V2
SMD NTC thermistors, case size 0402 (1005)
Standard series
R/T characteristics
R/T No.
T (°C)
8551
8552
B25/100 = 4131 K
B25/100 = 4334 K
RT/R25
α (%/K) RT/R25
α (%/K)
55.0
50.0
45.0
40.0
35.0
111.73
76.28
52.88
37.187
26.498
7.8
7.5
7.2
6.9
6.7
30.0
25.0
20.0
15.0
10.0
19.117
13.954
10.297
7.677
5.780
6.4
6.2
6.0
5.8
5.6
21.969
15.812
11.509
8.4659
6.2899
6.7
6.5
6.2
6.0
5.8
138.15
92.920
63.468
43.979
30.888
8.1
7.8
7.5
7.2
6.9
5.0
0.0
5.0
10.0
15.0
4.3916
3.3661
2.6014
2.0262
1.5901
5.4
5.2
5.1
4.9
4.8
4.7178
3.5705
2.7255
2.0974
1.6266
5.7
5.5
5.3
5.2
5.0
20.0
25.0
30.0
35.0
40.0
1.2567
1.0000
0.8009
0.6454
0.5232
4.6
4.5
4.4
4.3
4.1
1.2709
1.0000
0.79218
0.63161
0.50672
4.9
4.7
4.6
4.5
4.3
45.0
50.0
55.0
60.0
65.0
0.42650
0.34959
0.28804
0.23851
0.19844
4.0
3.9
3.8
3.7
3.6
0.40894
0.33191
0.27087
0.22222
0.18322
4.2
4.1
4.0
3.9
3.8
70.0
75.0
80.0
85.0
90.0
0.16587
0.13926
0.11742
0.09941
0.08449
3.5
3.5
3.4
3.3
3.2
0.15181
0.12637
0.10566
0.088735
0.074831
3.7
3.6
3.5
3.4
3.4
95.0
100.0
105.0
110.0
115.0
0.07209
0.06174
0.05305
0.04575
0.039583
3.1
3.1
3.0
2.9
2.9
0.063360
0.053856
0.045950
0.039346
0.033810
3.3
3.2
3.1
3.1
3.0
120.0
125.0
130.0
135.0
140.0
0.034356
0.029912
0.026120
0.022875
0.020089
2.8
2.7
2.7
2.6
2.6
0.029151
0.025217
0.021882
0.019047
0.016628
2.9
2.9
2.8
2.7
2.7
145.0
150.0
0.017690
0.015619
2.5
2.5
0.014559
0.012782
2.6
2.6
Please read Cautions and warnings and
Important notes at the end of this document.
Page 6 of 27
Temperature measurement and compensation
B572**V2
SMD NTC thermistors, case size 0402 (1005)
Standard series
Taping and packing
1
Taping of SMD NTC thermistors
Tape and reel packing according to IEC 60286-3.
Tape material: Cardboard or blister, tape width 8 ±0.30 mm
2
Reel packing
Dimensions in mm
8-mm tape
180-mm reel
330-mm reel
A
180 +0/3
330 +0/2.0
W1
8.4 +1.5/0
8.4 +1.5/0
W2
14.4 max.
14.4 max.
Leader, trailer
Please read Cautions and warnings and
Important notes at the end of this document.
Page 7 of 27
Temperature measurement and compensation
B572**V2
SMD NTC thermistors, case size 0402 (1005)
Standard series
Packing units for discrete chip
Case size
Chip thickness
inch/mm
0402/1005
0603/1608
0805/2012
1206/3216
3
th
0.5 mm
0.8 mm
0.8 mm
1.2 mm
0.8 mm
1.2 mm
Cardboard tape Blister tape
W
8 mm
8 mm
W
8 mm
8 mm
8 mm
8 mm
8 mm
∅ 180-mm reel ∅ 330-mm reel
pcs.
10000
4000
2000/ 4000
3000
2000
4000
pcs.
50000
16000
16000
12000
12000
12000
Packing codes
The last two digits of the complete ordering code state the packing mode:
Last two digits
60
SMD
Cardboard tape
180-mm reel packing
62
SMD
Blister tape
180-mm reel packing
70
SMD
Cardboard tape
330-mm reel packing
72
SMD
Blister tape
330-mm reel packing
Please read Cautions and warnings and
Important notes at the end of this document.
Page 8 of 27
Temperature measurement and compensation
B572**V2
SMD NTC thermistors, case size 0402 (1005)
4
Standard series
Taping of radial leaded NTC thermistors
Dimensions and tolerances
Lead spacing F = 2.5 mm and 5.0 mm (taping to IEC 60286-2)
Dimensions (mm)
w
th
d
P0
P1
F
∆h
∆p
W
W0
W1
W2
H
H0
H1
D0
t
L
L1
Lead
spacing
2.5 mm
11.0
5.0
0.5/0.6
12.7
5.1
2.5
0
0
18.0
5.5
9.0
3.0
18.0
16.0
32.2
4.0
0.9
11.0
4.0
Lead
spacing
5 mm
11.5
6.0
0.5/0.6
12.7
3.85
5.0
0
0
18.0
5.5
9.0
3.0
18.0
16.0
32.2
4.0
0.9
11.0
4.0
Please read Cautions and warnings and
Important notes at the end of this document.
Tolerance of
lead spacing
2.5/5 mm
max.
max.
±0.05
±0.3
±0.7
+0.6/0.1
±2.0
±1.3
±0.5
min.
+0.75/0.5
max.
+2.0/0
±0.5
max.
±0.2
max.
max.
max.
Remarks
±1 mm / 20 sprocket holes
measured at top of component body
peel-off force ≥5 N
without wires
Page 9 of 27
Temperature measurement and compensation
B572**V2
SMD NTC thermistors, case size 0402 (1005)
Standard series
Types of packing
Ammo packing
Ammo
type
x
y
z
I
80
240
210
Packing unit: 1000 - 2000 pcs./reel
Reel packing
Packing unit: 1000 - 2000 pcs./reel
Reel dimensions (in mm)
Reel type
d
f
n
w
I
360 max.
31 ±1
approx. 45
54 max.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 10 of 27
Temperature measurement and compensation
SMD NTC thermistors, case size 0402 (1005)
B572**V2
Standard series
Cassette packing
Packing unit: 1000 - 2000 pcs./cassette
Bulk packing
The components are packed in cardboard boxes, the size of which depends on the order quantity.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 11 of 27
Temperature measurement and compensation
B572**V2
SMD NTC thermistors, case size 0402 (1005)
5
Standard series
Packing codes
The last two digits of the complete ordering code state the packing mode:
Last two digits
00, 01, 02, 03,04,
05, 06, 07, 08
Bulk
40, 41
Bulk
45
Bulk
50
Radial leads, kinked
Cardboard tape
Cassette packing
51
Radial leads, kinked
Cardboard tape
360-mm reel packing
52
Radial leads, straight
Cardboard tape
Cassette packing
53
Radial leads, straight
Cardboard tape
360-mm reel packing
54
Radial leads, kinked
Cardboard tape
AMMO packing
55
Radial leads, straight
Cardboard tape
AMMO packing
(If no packing code is indicated, this corresponds to 40)
Example 1:
B57164K0102J000
B57164K0102J052
Bulk
Cardboard tape, cassette packing
Example 2:
B57881S0103F002
B57881S0103F251
Bulk
Cardboard tape, reel packing
Please read Cautions and warnings and
Important notes at the end of this document.
Page 12 of 27
Temperature measurement and compensation
B572**V2
SMD NTC thermistors, case size 0402 (1005)
Standard series
Mounting instructions
1
Soldering
1.1
Leaded NTC thermistors
Leaded thermistors comply with the solderability requirements specified by CECC.
When soldering, care must be taken that the NTC thermistors are not damaged by excessive
heat. The following maximum temperatures, maximum time spans and minimum distances have
to be observed:
Dip soldering
Iron soldering
Bath temperature
max. 260 °C
max. 360 °C
Soldering time
max. 4 s
max. 2 s
Distance from thermistor
min. 6 mm
min. 6 mm
Under more severe soldering conditions the resistance may change.
1.1.1
Wave soldering
Temperature characteristic at component terminal with dual wave soldering
Please read Cautions and warnings and
Important notes at the end of this document.
Page 13 of 27
Temperature measurement and compensation
B572**V2
SMD NTC thermistors, case size 0402 (1005)
1.2
Standard series
Leadless NTC thermistors
In case of NTC thermistors without leads, soldering is restricted to devices which are provided
with a solderable metallization. The temperature shock caused by the application of hot solder
may produce fine cracks in the ceramic, resulting in changes in resistance.
To prevent leaching of the metallization, solder with silver additives or with a low tin content
should be used. In addition, soldering methods should be employed which permit short soldering
times.
1.3
SMD NTC thermistors
SMD NTC thermistors can be provided with a nickel barrier termination or on special request with
silver-palladium termination. The use of no-clean solder products is recommended. In any case
mild, non-activated fluxes should be used. Flux residues after soldering should be minimized.
SMD NTCs with AgPd termination are not approved for lead-free soldering.
Nickel barrier termination
Figure 1
SMD NTC thermistors, structure of nickel
barrier termination
The nickel barrier layer of the silver/nickel/tin termination (see figure 1) prevents leaching of the
silver base metallization layer. This allows great flexibility in the selection of soldering parameters.
The tin prevents the nickel layer from oxidizing and thus ensures better wetting by the solder. The
nickel barrier termination is tested for all commonly-used soldering methods according to
IEC 60068-2-58. Insufficient preheating may cause ceramic cracks. Rapid cooling by dipping in
solvent is not recommended.
The following test and process conditions apply for nickel barrier termination.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 14 of 27
Temperature measurement and compensation
SMD NTC thermistors, case size 0402 (1005)
1.3.1
B572**V2
Standard series
Solderability (test to IEC 60068-2-58)
Preconditioning: Immersion into flux F-SW 32.
Evaluation criterion: Wetting of soldering areas ≥95%.
Solder
Bath temperature (°C)
Dwell time (s)
SnPb 60/40
215 ±3
3 ±0.3
SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9)
245 ±3
3 ±0.3
1.3.2
Resistance to soldering heat (test to IEC 60068-2-58)
Preconditioning: Immersion into flux F-SW 32.
Evaluation criterion: Leaching of side edges ≤1/3.
Solder
Bath temperature (°C)
Dwell time (s)
SnPb 60/40
260 ±5
10 ±1
SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9)
260 ±5
10 ±1
1.3.3
Reflow soldering
Temperature ranges for reflow soldering acc. to IEC 60068-2-58 recommendations.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 15 of 27
Temperature measurement and compensation
SMD NTC thermistors, case size 0402 (1005)
Profile feature
Preheat and soak
- Temperature min
- Temperature max
- Time
B572**V2
Standard series
Sn-Pb eutectic assembly
Pb-free assembly
Tsmin
Tsmax
tsmin to tsmax
100 °C
150 °C
60 ... 120 s
150 °C
200 °C
60 ... 120 s
Average ramp-up rate
Tsmax to Tp
3 °C/ s max.
3 °C/ s max.
Liquidous temperature
Time at liquidous
TL
tL
183 °C
40 ... 150 s
217 °C
40 ... 150 s
Peak package body temperature
Tp
215 °C ... 260 °C1)
235 °C ... 260 °C
Time above (TP 5 °C)
tp
10 ... 40 s
10 ... 40 s
Average ramp-down rate
Tp to Tsmax
6 °C/ s max.
6 °C/ s max.
max. 8 minutes
max. 8 minutes
Time 25 °C to peak temperature
1) Depending on package thickness.
Notes:
All temperatures refer to topside of the package, measured on the package body
surface.
Number of reflow cycles: 3
Iron soldering should be avoided, hot air methods are recommended for repair
purposes.
Solder joint profiles for silver/nickel/tin terminations
Please read Cautions and warnings and
Important notes at the end of this document.
Page 16 of 27
Temperature measurement and compensation
SMD NTC thermistors, case size 0402 (1005)
1.3.4
B572**V2
Standard series
Recommended geometry of solder pads
Recommended maximum dimensions (mm)
Case size
inch/mm
A
B
C
0402/1005
0.6
0.6
1.7
0603/1608
1.0
1.0
3.0
0805/2012
1.3
1.2
3.4
1206/3216
1.8
1.2
4.5
2
Conductive adhesion
An alternative to soldering for silver-palladium terminated components is the gluing of thermistors
with conductive adhesives. The benefit of this method is that it involves no thermal stress. The
adhesives used must be chemically inert.
3
Clamp contacting
Pressure contacting by means of clamps is particularly suitable for applications involving frequent
switching and high turn-on powers.
4
Robustness of terminations (leaded types)
The leads meet the requirements of IEC 60068-2-21. They may not be bent closer than 4 mm
from the solder joint on the thermistor body or from the point at which they leave the feedthroughs. During bending, any mechanical stress at the outlet of the leads must be removed. The
bending radius should be at least 0.75 mm.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 17 of 27
Temperature measurement and compensation
SMD NTC thermistors, case size 0402 (1005)
Tensile strength:
B572**V2
Standard series
Test Ua1:
Value of applied force for Ua1 test:
Diameter (d) of
Force with tolerance of ±10%
corresponding round leads
∅ ≤ 0.25 mm
1.0 N
0.25 < ∅ ≤ 0.35 mm
2.5 N
0.35 < ∅ ≤ 0.50 mm
5.0 N
0.50 < ∅ ≤ 0.80 mm
10.0 N
Bending strength: Test Ub:
Two 90°-bends in opposite directions
Value of applied force for Ub test:
Diameter (d) of
Force with tolerance of ±10%
corresponding round leads
∅ ≤ 0.25 mm
0.5 N
0.25 < ∅ ≤ 0.35 mm
1.25 N
0.35 < ∅ ≤ 0.50 mm
2.5 N
0.50 < ∅ ≤ 0.80 mm
5N
Torsional strength: Test Uc: severity 2
The lead is bent by 90° at a distance of 6 to 6.5 mm from the thermistor body.
The bending radius of the leads should be approx. 0.75 mm. Two torsions of
180° each (severity 2).
When subjecting leads to mechanical stress, the following should be observed:
Tensile stress on leads
During mounting and operation tensile forces on the leads are to be avoided.
Bending of leads
Bending of the leads directly on the thermistor body is not permissible.
A lead may be bent at a minimum distance of twice the wire's diameter +4 mm from the solder
joint on the thermistor body. During bending the wire must be mechanically relieved at its outlet.
The bending radius should be at least 0.75 mm.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 18 of 27
Temperature measurement and compensation
SMD NTC thermistors, case size 0402 (1005)
5
B572**V2
Standard series
Sealing and potting
Sealing or potting processes can affect the reliability of the component.
When thermistors are sealed, potted or overmolded, there must be no mechanical stress caused
by thermal expansion during the production process (curing / overmolding process) and during
later operation. The upper category temperature of the thermistor must not be exceeded. Ensure
that the materials used (sealing / potting compound and plastic material) are chemically neutral.
As thermistors are temperature sensitive components it should be considered that molding can affect the thermal surrounding and may influence e.g. the response time.
Extensive testing is encouraged in order to determine whether overmolding or potting influences
the functionality and/ or reliability of the component.
6
Cleaning
Cleaning processes can affect the reliability of the component.
If cleaning is necessary, mild cleaning agents are recommended. Cleaning agents based on water are not allowed. Washing processes may damage the product due to the possible static or
cyclic mechanical loads (e.g. ultrasonic cleaning). They may cause cracks which might lead to reduced reliability and/ or lifetime.
7
Storage
In order to maintain their solderability, thermistors must be stored in a non-corrosive atmosphere.
Humidity, temperature and container materials are critical factors.
Do not store SMDs where they are exposed to heat or direct sunlight. Otherwise, the packing material may be deformed or SMDs may stick together, causing problems during mounting. After
opening the factory seals, such as polyvinyl-sealed packages, use the SMDs as soon as possible.
The components should be left in the original packing. Touching the metallization of unsoldered
thermistors may change their soldering properties.
Storage temperature:
25 °C up to 45 °C
Relative humidity (without condensation):
≤75% annual mean
