B57232V5103F360

NTC thermistors for temperature measurement SMD NTC thermistors, EIA case size 0402 (1005), automotive series Series/Type: B572**V5 Date: February 2019 © TDK Electronics AG 2019. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without TDK Electronics' prior express consent is prohibited. Temperature measurement and compensation B572**V5 SMD NTC thermistors, case size 0402 (1005) Applications Temperature measurement and compensation Automotive series Dimensional drawing Features Qualification based on AEC-Q200 Rev-D Multilayer SMD NTC with inner electrodes Nickel barrier termination For temperature measurement up to 150 °C Excellent long-term aging stability in high temperature and high humidity environment High mechanical robustness Short response time 100% Pb free UL approval (E69802) Dimensions in mm Approx. weight 2 mg Options Alternative resistance ratings, resistance tolerances and B value tolerances available on request. Delivery mode Cardboard tape, 180-mm reel General technical data Operating temperature range Max. power Resistance tolerance Rated temperature Dissipation factor Thermal cooling time constant Heat capacity Top (at 25 °C, on PCB) P251) ∆RR/RR TR (on PCB) δth1) (on PCB) τc1) Cth1) 1) Depends on mounting situation Please read Cautions and warnings and Important notes at the end of this document. Page 2 of 28 40 ... 150 150 ±1, ±3, ±5 25 approx. 2.5 approx. 3 approx. 7.5 °C mW % °C mW/K s mJ/K Temperature measurement and compensation B572**V5 SMD NTC thermistors, case size 0402 (1005) Automotive series Electrical specification and ordering codes R Ω ∆RR/RR % 4.7 k 10 k 10 k 47 k 100 k ±5 ±1, ±3, ±5 ±5 ±1, ±3, ±5 ±1, ±3, ±5 No. of R/T characteristic 8502 8509 8502 8551 8552 B25/50 K 3940 3380 3940 4050 4250 B25/85 K 3980 3435 3980 4108 4311 + = Resistance tolerance F = ±1% H = ±3% J = ±5% Please read Cautions and warnings and Important notes at the end of this document. Page 3 of 28 B25/100 K 4000 ±3% 3455 ±1% 4000 ±3% 4131 ±1% 4334 ±1% Ordering code B57251V5472J060 B57232V5103+360 B57251V5103J060 B57256V5473+360 B57254V5104+360 Temperature measurement and compensation SMD NTC thermistors, case size 0402 (1005) B572**V5 Automotive series Reliability data Tests of SMD NTC thermistors are based on AEC-Q200 Rev-D. The parts are mounted on standardized PCB. Test Pre- and post-stress electrical test High temperature exposure (storage) Standard ∆R25/R25 (typical) / Remarks Resistance at: 25 °C and 100 °C MIL-STD-202, method 108 Temperature cycling JESD22, method JA-104 Biased humidity MIL-STD-202, method 103 Operational life MIL-STD-202, method 108 External visual MIL-STD-883E, method 2009 JESD22, method JB-100 Physical dimensions Test conditions Resistance to solvents MIL-STD-202, method 215 Mechanical shock MIL-STD-202, method 213 Please read Cautions and warnings and Important notes at the end of this document. Test temperature: 150 °C Duration: 1000 h Unpowered Except B57232V5103+360 B57256V5473+360 B57254V5104+360 Lower test temperature: 40 °C Upper test temperature: 150 °C Number of cycles: 1000 Transfer time: < 10 s Dwell time: 15 min Air  Air Test temperature: 85 °C Rel. humidity of air: 85% Duration: 1000 h Test voltage: VNTC = 0.3 V DC Test temperature: 150 °C Pmax = 0.35 mW Duration: 1000 h Visual inspection < 5% Measured with calipers Within the specified values Not applicable for SMD thermistors (component has no marking, color coding or coating) Peak value: 1500 g Half sine Condition F Page 4 of 28 < 1% < 1% < 2% < 5% < 5% < 5% < 5% Temperature measurement and compensation SMD NTC thermistors, case size 0402 (1005) Test Standard Test conditions Vibration MIL-STD-202, method 204 Resistance to soldering heat MIL-STD-202, method 210 Acceleration: 5 g Sweep time: 20 min Frequency range: 10 ... 2000 Hz 3 × 12 cycles Dip: 260 °C; 10 s 1 heat cycle Except B57232V5103+360 B57254V5104+360 B57256V5473+360 Discharge capacitance: 150 pF Discharge resistance: 2 kΩ Charging voltage: 6 kV Contact discharge 2 pulses in each polarity a) Dip: 235 °C; 5 s: aging 4 h @ 155 °C b) Dip: 215 °C; 5 s: steam aging 8 h @ 92 °C c) Dip: 260 °C; 7 s: steam aging 8 h @ 92 °C R(25 °C), R(100 °C), B(25/100) ESD AEC-Q200-002, method -002 Solderability J-STD-002 Electrical characterization Flammability UL-94, V-0 or V-1 Board flex AEC-Q200-005, method -005 AEC-Q200-006, method -006 Terminal strength Resistance drift after soldering Please read Cautions and warnings and Important notes at the end of this document. B572**V5 Automotive series Not applicable for SMD thermistors (component is not coated or encapsulated with plastic materials) Max. bending: 1 mm Duration @ max. bending: 60 s Max. F: 5 N Reflow soldering profile Wave soldering profile Page 5 of 28 ∆R25/R25 (typical) / Remarks < 1% < 3% < 1% < 1% < 1% < 5% 95% of termination wetted Within the specified values < 2% < 2% < 1% Temperature measurement and compensation B572**V5 SMD NTC thermistors, case size 0402 (1005) Automotive series R/T characteristics R/T No. T (°C) 8502 8509 B25/100 = 4000 K B25/100 = 3455 K RT/R25 α (%/K) RT/R25 α (%/K) 55.0 50.0 45.0 40.0 35.0 96.158 66.892 47.127 33.606 24.243 7.4 7.1 6.9 6.6 6.4 44.605 33.281 25.044 19.003 14.536 5.9 5.8 5.6 5.4 5.3 30.0 25.0 20.0 15.0 10.0 17.681 13.032 9.702 7.2923 5.5314 6.2 6.0 5.8 5.6 5.4 11.206 8.7041 6.8104 5.3665 4.2576 5.1 5.0 4.8 4.7 4.6 5.0 0.0 5.0 10.0 15.0 4.2325 3.2657 2.54 1.9907 1.5716 5.3 5.1 4.9 4.8 4.7 3.4001 2.7326 2.2096 1.7973 1.4703 4.4 4.3 4.2 4.1 4.0 20.0 25.0 30.0 35.0 40.0 1.2494 1.0000 0.80552 0.65288 0.53229 4.5 4.4 4.3 4.1 4.0 1.2093 1.0000 0.83113 0.69418 0.58255 3.9 3.7 3.6 3.6 3.5 45.0 50.0 55.0 60.0 65.0 0.43645 0.35981 0.29819 0.24837 0.20787 3.9 3.8 3.7 3.6 3.5 0.49112 0.41587 0.35365 0.30197 0.25888 3.4 3.3 3.2 3.1 3.0 70.0 75.0 80.0 85.0 90.0 0.17479 0.14763 0.12523 0.10667 0.091227 3.4 3.3 3.2 3.2 3.1 0.22278 0.19243 0.16681 0.1451 0.12663 3.0 2.9 2.8 2.8 2.7 95.0 100.0 105.0 110.0 115.0 0.078319 0.067488 0.058363 0.050647 0.044098 3.0 2.9 2.9 2.8 2.7 0.11088 0.097381 0.085788 0.075795 0.067155 2.6 2.6 2.5 2.4 2.4 120.0 125.0 130.0 135.0 140.0 0.03852 0.033752 0.029663 0.026146 0.023111 2.7 2.6 2.6 2.5 2.4 0.059663 0.053146 0.047463 0.042493 0.038134 2.3 2.3 2.2 2.2 2.1 145.0 150.0 0.020484 0.018203 2.4 2.3 0.034302 0.030925 2.1 2.1 Please read Cautions and warnings and Important notes at the end of this document. Page 6 of 28 Temperature measurement and compensation B572**V5 SMD NTC thermistors, case size 0402 (1005) Automotive series R/T characteristics R/T No. T (°C) 8551 8552 B25/100 = 4131 K B25/100 = 4334 K RT/R25 α (%/K) RT/R25 α (%/K) 55.0 50.0 45.0 40.0 35.0 111.73 76.28 52.88 37.187 26.498 7.8 7.5 7.2 6.9 6.7 30.0 25.0 20.0 15.0 10.0 19.117 13.954 10.297 7.677 5.780 6.4 6.2 6.0 5.8 5.6 21.969 15.812 11.509 8.4659 6.2899 6.7 6.5 6.2 6.0 5.8 138.15 92.920 63.468 43.979 30.888 8.1 7.8 7.5 7.2 6.9 5.0 0.0 5.0 10.0 15.0 4.3916 3.3661 2.6014 2.0262 1.5901 5.4 5.2 5.1 4.9 4.8 4.7178 3.5705 2.7255 2.0974 1.6266 5.7 5.5 5.3 5.2 5.0 20.0 25.0 30.0 35.0 40.0 1.2567 1.0000 0.8009 0.6454 0.5232 4.6 4.5 4.4 4.3 4.1 1.2709 1.0000 0.79218 0.63161 0.50672 4.9 4.7 4.6 4.5 4.3 45.0 50.0 55.0 60.0 65.0 0.42650 0.34959 0.28804 0.23851 0.19844 4.0 3.9 3.8 3.7 3.6 0.40894 0.33191 0.27087 0.22222 0.18322 4.2 4.1 4.0 3.9 3.8 70.0 75.0 80.0 85.0 90.0 0.16587 0.13926 0.11742 0.09941 0.08449 3.5 3.5 3.4 3.3 3.2 0.15181 0.12637 0.10566 0.088735 0.074831 3.7 3.6 3.5 3.4 3.4 95.0 100.0 105.0 110.0 115.0 0.07209 0.06174 0.05305 0.04575 0.039583 3.1 3.1 3.0 2.9 2.9 0.063360 0.053856 0.045950 0.039346 0.033810 3.3 3.2 3.1 3.1 3.0 120.0 125.0 130.0 135.0 140.0 0.034356 0.029912 0.026120 0.022875 0.020089 2.8 2.7 2.7 2.6 2.6 0.029151 0.025217 0.021882 0.019047 0.016628 2.9 2.9 2.8 2.7 2.7 145.0 150.0 0.017690 0.015619 2.5 2.5 0.014559 0.012782 2.6 2.6 Please read Cautions and warnings and Important notes at the end of this document. Page 7 of 28 Temperature measurement and compensation B572**V5 SMD NTC thermistors, case size 0402 (1005) Automotive series Taping and packing 1 Taping of SMD NTC thermistors Tape and reel packing according to IEC 60286-3. Tape material: Cardboard or blister, tape width 8 ±0.30 mm 2 Reel packing Dimensions in mm 8-mm tape 180-mm reel 330-mm reel A 180 +0/3 330 +0/2.0 W1 8.4 +1.5/0 8.4 +1.5/0 W2 14.4 max. 14.4 max. Leader, trailer Please read Cautions and warnings and Important notes at the end of this document. Page 8 of 28 Temperature measurement and compensation B572**V5 SMD NTC thermistors, case size 0402 (1005) Automotive series Packing units for discrete chip Case size Chip thickness inch/mm 0402/1005 0603/1608 0805/2012 1206/3216 3 th 0.5 mm 0.8 mm 0.8 mm 1.2 mm 0.8 mm 1.2 mm Cardboard tape Blister tape W 8 mm 8 mm     W  8 mm 8 mm 8 mm 8 mm 8 mm ∅ 180-mm reel ∅ 330-mm reel pcs. 10000 4000 2000/ 4000 3000 2000 4000 pcs. 50000 16000 16000 12000 12000 12000 Packing codes The last two digits of the complete ordering code state the packing mode: Last two digits 60 SMD Cardboard tape 180-mm reel packing 62 SMD Blister tape 180-mm reel packing 70 SMD Cardboard tape 330-mm reel packing 72 SMD Blister tape 330-mm reel packing Please read Cautions and warnings and Important notes at the end of this document. Page 9 of 28 Temperature measurement and compensation B572**V5 SMD NTC thermistors, case size 0402 (1005) 4 Automotive series Taping of radial leaded NTC thermistors Dimensions and tolerances Lead spacing F = 2.5 mm and 5.0 mm (taping to IEC 60286-2) Dimensions (mm) w th d P0 P1 F ∆h ∆p W W0 W1 W2 H H0 H1 D0 t L L1 Lead spacing 2.5 mm 11.0 5.0 0.5/0.6 12.7 5.1 2.5 0 0 18.0 5.5 9.0 3.0 18.0 16.0 32.2 4.0 0.9 11.0 4.0 Lead spacing 5 mm 11.5 6.0 0.5/0.6 12.7 3.85 5.0 0 0 18.0 5.5 9.0 3.0 18.0 16.0 32.2 4.0 0.9 11.0 4.0 Please read Cautions and warnings and Important notes at the end of this document. Tolerance of lead spacing 2.5/5 mm max. max. ±0.05 ±0.3 ±0.7 +0.6/0.1 ±2.0 ±1.3 ±0.5 min. +0.75/0.5 max. +2.0/0 ±0.5 max. ±0.2 max. max. max. Remarks ±1 mm / 20 sprocket holes measured at top of component body peel-off force ≥5 N without wires Page 10 of 28 Temperature measurement and compensation B572**V5 SMD NTC thermistors, case size 0402 (1005) Automotive series Types of packing Ammo packing Ammo type x y z I 80 240 210 Packing unit: 1000 - 2000 pcs./reel Reel packing Packing unit: 1000 - 2000 pcs./reel Reel dimensions (in mm) Reel type d f n w I 360 max. 31 ±1 approx. 45 54 max. Please read Cautions and warnings and Important notes at the end of this document. Page 11 of 28 Temperature measurement and compensation SMD NTC thermistors, case size 0402 (1005) B572**V5 Automotive series Cassette packing Packing unit: 1000 - 2000 pcs./cassette Bulk packing The components are packed in cardboard boxes, the size of which depends on the order quantity. Please read Cautions and warnings and Important notes at the end of this document. Page 12 of 28 Temperature measurement and compensation B572**V5 SMD NTC thermistors, case size 0402 (1005) 5 Automotive series Packing codes The last two digits of the complete ordering code state the packing mode: Last two digits 00, 01, 02, 03,04, 05, 06, 07, 08  Bulk  40, 41  Bulk  45  Bulk  50 Radial leads, kinked Cardboard tape Cassette packing 51 Radial leads, kinked Cardboard tape 360-mm reel packing 52 Radial leads, straight Cardboard tape Cassette packing 53 Radial leads, straight Cardboard tape 360-mm reel packing 54 Radial leads, kinked Cardboard tape AMMO packing 55 Radial leads, straight Cardboard tape AMMO packing (If no packing code is indicated, this corresponds to 40) Example 1: B57164K0102J000 B57164K0102J052 Bulk Cardboard tape, cassette packing Example 2: B57881S0103F002 B57881S0103F251 Bulk Cardboard tape, reel packing Please read Cautions and warnings and Important notes at the end of this document. Page 13 of 28 Temperature measurement and compensation B572**V5 SMD NTC thermistors, case size 0402 (1005) Automotive series Mounting instructions 1 Soldering 1.1 Leaded NTC thermistors Leaded thermistors comply with the solderability requirements specified by CECC. When soldering, care must be taken that the NTC thermistors are not damaged by excessive heat. The following maximum temperatures, maximum time spans and minimum distances have to be observed: Dip soldering Iron soldering Bath temperature max. 260 °C max. 360 °C Soldering time max. 4 s max. 2 s Distance from thermistor min. 6 mm min. 6 mm Under more severe soldering conditions the resistance may change. 1.1.1 Wave soldering Temperature characteristic at component terminal with dual wave soldering Please read Cautions and warnings and Important notes at the end of this document. Page 14 of 28 Temperature measurement and compensation B572**V5 SMD NTC thermistors, case size 0402 (1005) 1.2 Automotive series Leadless NTC thermistors In case of NTC thermistors without leads, soldering is restricted to devices which are provided with a solderable metallization. The temperature shock caused by the application of hot solder may produce fine cracks in the ceramic, resulting in changes in resistance. To prevent leaching of the metallization, solder with silver additives or with a low tin content should be used. In addition, soldering methods should be employed which permit short soldering times. 1.3 SMD NTC thermistors SMD NTC thermistors can be provided with a nickel barrier termination or on special request with silver-palladium termination. The use of no-clean solder products is recommended. In any case mild, non-activated fluxes should be used. Flux residues after soldering should be minimized. SMD NTCs with AgPd termination are not approved for lead-free soldering. Nickel barrier termination Figure 1 SMD NTC thermistors, structure of nickel barrier termination The nickel barrier layer of the silver/nickel/tin termination (see figure 1) prevents leaching of the silver base metallization layer. This allows great flexibility in the selection of soldering parameters. The tin prevents the nickel layer from oxidizing and thus ensures better wetting by the solder. The nickel barrier termination is tested for all commonly-used soldering methods according to IEC 60068-2-58. Insufficient preheating may cause ceramic cracks. Rapid cooling by dipping in solvent is not recommended. The following test and process conditions apply for nickel barrier termination. Please read Cautions and warnings and Important notes at the end of this document. Page 15 of 28 Temperature measurement and compensation SMD NTC thermistors, case size 0402 (1005) 1.3.1 B572**V5 Automotive series Solderability (test to IEC 60068-2-58) Preconditioning: Immersion into flux F-SW 32. Evaluation criterion: Wetting of soldering areas ≥95%. Solder Bath temperature (°C) Dwell time (s) SnPb 60/40 215 ±3 3 ±0.3 SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9) 245 ±3 3 ±0.3 1.3.2 Resistance to soldering heat (test to IEC 60068-2-58) Preconditioning: Immersion into flux F-SW 32. Evaluation criterion: Leaching of side edges ≤1/3. Solder Bath temperature (°C) Dwell time (s) SnPb 60/40 260 ±5 10 ±1 SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9) 260 ±5 10 ±1 1.3.3 Reflow soldering Temperature ranges for reflow soldering acc. to IEC 60068-2-58 recommendations. Please read Cautions and warnings and Important notes at the end of this document. Page 16 of 28 Temperature measurement and compensation B572**V5 SMD NTC thermistors, case size 0402 (1005) Automotive series Profile feature Preheat and soak - Temperature min - Temperature max - Time Sn-Pb eutectic assembly Pb-free assembly Tsmin Tsmax tsmin to tsmax 100 °C 150 °C 60 ... 120 s 150 °C 200 °C 60 ... 120 s Average ramp-up rate Tsmax to Tp 3 °C/ s max. 3 °C/ s max. Liquidous temperature Time at liquidous TL tL 183 °C 40 ... 150 s 217 °C 40 ... 150 s Peak package body temperature Tp 215 °C ... 260 °C1) 235 °C ... 260 °C Time above (TP 5 °C) tp 10 ... 40 s 10 ... 40 s Average ramp-down rate Tp to Tsmax 6 °C/ s max. 6 °C/ s max. max. 8 minutes max. 8 minutes Time 25 °C to peak temperature 1) Depending on package thickness. Notes: All temperatures refer to topside of the package, measured on the package body surface. Number of reflow cycles: 3 Iron soldering should be avoided, hot air methods are recommended for repair purposes. Solder joint profiles for silver/nickel/tin terminations Please read Cautions and warnings and Important notes at the end of this document. Page 17 of 28 Temperature measurement and compensation SMD NTC thermistors, case size 0402 (1005) 1.3.4 B572**V5 Automotive series Recommended geometry of solder pads Recommended maximum dimensions (mm) Case size inch/mm A B C 0402/1005 0.6 0.6 1.7 0603/1608 1.0 1.0 3.0 0805/2012 1.3 1.2 3.4 1206/3216 1.8 1.2 4.5 2 Conductive adhesion An alternative to soldering for silver-palladium terminated components is the gluing of thermistors with conductive adhesives. The benefit of this method is that it involves no thermal stress. The adhesives used must be chemically inert. 3 Clamp contacting Pressure contacting by means of clamps is particularly suitable for applications involving frequent switching and high turn-on powers. 4 Robustness of terminations (leaded types) The leads meet the requirements of IEC 60068-2-21. They may not be bent closer than 4 mm from the solder joint on the thermistor body or from the point at which they leave the feedthroughs. During bending, any mechanical stress at the outlet of the leads must be removed. The bending radius should be at least 0.75 mm. Please read Cautions and warnings and Important notes at the end of this document. Page 18 of 28 Temperature measurement and compensation SMD NTC thermistors, case size 0402 (1005) Tensile strength: B572**V5 Automotive series Test Ua1: Value of applied force for Ua1 test: Diameter (d) of Force with tolerance of ±10% corresponding round leads ∅ ≤ 0.25 mm 1.0 N 0.25 < ∅ ≤ 0.35 mm 2.5 N 0.35 < ∅ ≤ 0.50 mm 5.0 N 0.50 < ∅ ≤ 0.80 mm 10.0 N Bending strength: Test Ub: Two 90°-bends in opposite directions Value of applied force for Ub test: Diameter (d) of Force with tolerance of ±10% corresponding round leads ∅ ≤ 0.25 mm 0.5 N 0.25 < ∅ ≤ 0.35 mm 1.25 N 0.35 < ∅ ≤ 0.50 mm 2.5 N 0.50 < ∅ ≤ 0.80 mm 5N Torsional strength: Test Uc: severity 2 The lead is bent by 90° at a distance of 6 to 6.5 mm from the thermistor body. The bending radius of the leads should be approx. 0.75 mm. Two torsions of 180° each (severity 2). When subjecting leads to mechanical stress, the following should be observed: Tensile stress on leads During mounting and operation tensile forces on the leads are to be avoided. Bending of leads Bending of the leads directly on the thermistor body is not permissible. A lead may be bent at a minimum distance of twice the wire's diameter +4 mm from the solder joint on the thermistor body. During bending the wire must be mechanically relieved at its outlet. The bending radius should be at least 0.75 mm. Please read Cautions and warnings and Important notes at the end of this document. Page 19 of 28 Temperature measurement and compensation SMD NTC thermistors, case size 0402 (1005) 5 B572**V5 Automotive series Sealing and potting Sealing or potting processes can affect the reliability of the component. When thermistors are sealed, potted or overmolded, there must be no mechanical stress caused by thermal expansion during the production process (curing / overmolding process) and during later operation. The upper category temperature of the thermistor must not be exceeded. Ensure that the materials used (sealing / potting compound and plastic material) are chemically neutral. As thermistors are temperature sensitive components it should be considered that molding can affect the thermal surrounding and may influence e.g. the response time. Extensive testing is encouraged in order to determine whether overmolding or potting influences the functionality and/ or reliability of the component. 6 Cleaning Cleaning processes can affect the reliability of the component. If cleaning is necessary, mild cleaning agents are recommended. Cleaning agents based on water are not allowed. Washing processes may damage the product due to the possible static or cyclic mechanical loads (e.g. ultrasonic cleaning). They may cause cracks which might lead to reduced reliability and/ or lifetime. 7 Storage In order to maintain their solderability, thermistors must be stored in a non-corrosive atmosphere. Humidity, temperature and container materials are critical factors. Do not store SMDs where they are exposed to heat or direct sunlight. Otherwise, the packing material may be deformed or SMDs may stick together, causing problems during mounting. After opening the factory seals, such as polyvinyl-sealed packages, use the SMDs as soon as possible. The components should be left in the original packing. Touching the metallization of unsoldered thermistors may change their soldering properties. Storage temperature: 25 °C up to 45 °C Relative humidity (without condensation): ≤75% annual mean