B57351V5103J060

NTC thermistors for temperature measurement SMD NTC thermistors, case size 0603 (1608), automotive series Series/Type: B573**V5 Date: June 2012 © EPCOS AG 2012. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited. Temperature measurement and compensation B573**V5 SMD NTC thermistors, case size 0603 (1608) Applications Temperature measurement and compensation Automotive series Dimensional drawing Features Qualification based on AEC-Q200 Rev-D Multilayer SMD NTC with inner electrodes Nickel barrier termination For temperature measurement up to 150 °C Excellent long-term aging stability in high temperature and high humidity environment Options Alternative resistance ratings, resistance tolerances and B value tolerances available on request. Delivery mode Cardboard tape, 180-mm reel Dimensions in mm Approx. weight 6 mg General technical data Operating temperature range Max. power Resistance tolerance Rated temperature Dissipation factor Thermal cooling time constant Heat capacity Top (at 25 °C, on PCB) P251) ∆RR/RR TR (on PCB) δth1) (on PCB) τc1) Cth1) 1) Depends on mounting situation Please read Cautions and warnings and Important notes at the end of this document. Page 2 of 24 40 ... 150 180 ±1, ±3, ±5 25 approx. 3 approx. 4 approx. 12 °C mW % °C mW/K s mJ/K Temperature measurement and compensation B573**V5 SMD NTC thermistors, case size 0603 (1608) Automotive series Electrical specification and ordering codes R25 Ω 10 k 10 k 10 k 10 k 10 k 22 k 22 k 47 k 100 k 100 k 100 k No. of R/T characteristic 8500 8502 8507 8509 8509 8502 8507 8507 8507 8507 8507 B25/50 K 3590 3940 4386 3380 3380 3940 4386 4386 4386 4386 4386 B25/85 K 3635 3980 4455 3435 3435 3980 4455 4455 4455 4455 4455 B25/100 K 3650 ±3% 4000 ±3% 4480 ±3% 3455 ±1% 3455 ±1% 4000 ±3% 4480 ±3% 4480 ±3% 4480 ±1% 4480 ±1% 4480 ±3% + = Resistance tolerance F = ±1% (only for type B57332V5103F360 and B57352V5104F360) H = ±3% J = ±5% Please read Cautions and warnings and Important notes at the end of this document. Page 3 of 24 Ordering code B57342V5103+060 B57351V5103+060 B57352V5103+060 B57332V5103+360 B57332V5103F360 B57351V5223+060 B57352V5223+060 B57352V5473+060 B57352V5104+360 B57352V5104F360 B57352V5104+060 Temperature measurement and compensation SMD NTC thermistors, case size 0603 (1608) B573**V5 Automotive series Reliability data only for type B57332V5103F360 Tests of SMD NTC thermistors are based on AEC-Q200 Rev-D. The parts are mounted on standardized PCB. Test Pre- and post-stress electrical test High temperature exposure (storage) Temperature cycling Standard Test conditions ∆R25/R25 Remarks (typical) Resistance at: 25 °C and 100 °C Test temperature: 150 °C Duration: 1000 h Unpowered JESD22, Lower test temperature: 40 °C method JA-104 Upper test temperature: 150 °C Number of cycles: 1000 Transfer time: < 10 s Dwell time: 15 min Air  Air < 1% < 3% Physical dimensions Test temperature: 85 °C Rel. humidity of air: 85% Duration: 1000 h Test voltage: VNTC = 0.3 V DC MIL-STD-202, Test temperature: 150 °C method 108 Pmax = 0.35 mW Duration: 1000 h MIL-STD-883E, Visual inspection method 2009 JESD22, Measured with calibers method JB-100 Resistance to solvents MIL-STD-202, method 215 Mechanical shock MIL-STD-202, method 213 Biased humidity Operational life External visual MIL-STD-202, method 108 MIL-STD-202, method 103 Please read Cautions and warnings and Important notes at the end of this document. < 3% < 3% Not applicable for SMD thermistors (component has no marking, color coding or coating) Peak value: 1500 g < 1% Half sine Condition F Page 4 of 24 Temperature cycling is performed acc. MIL-STD-202, method 107. No warrant will be assumed for the reliability of solder joint. Within the specified values Temperature measurement and compensation SMD NTC thermistors, case size 0603 (1608) Test Standard Vibration MIL-STD-202, method 204 Resistance to soldering heat ESD Solderability Electrical characterization Flammability Board flex Terminal strength Resistance drift after soldering Test conditions Acceleration: 5 g Sweep time: 20 min Frequency range: 10 ... 2000 Hz 3 × 12 cycles MIL-STD-202, Dip: 260 °C; 10 s method 210 1 heat cycle AEC-Q200-002, Discharge capacitance: 150 pF method -002 Discharge resistance: 2 kΩ Charging voltage: 6 kV Contact discharge 2 pulses in each polarity J-STD-002 a) Dip: 235 °C; 5 s: aging 4 h @ 155 °C b) Dip: 215 °C; 5 s: steam aging 8 h @ 92 °C c) Dip: 260 °C; 7 s: steam aging 8 h @ 92 °C R(25 °C), R(100 °C), B(25/100) UL-94, V-0 or V-1 B573**V5 Automotive series ∆R25/R25 Remarks (typical) < 1% < 1% < 3% Not applicable for SMD thermistors (component is not coated or encapsulated with plastic materials) AEC-Q200-005, Max. bending: 2 mm < 2% method -005 Duration @ max. bending: 60 s AEC-Q200-006, Max. F: 10 N < 2% method -006 Reflow soldering profile < 1% Wave soldering profile Please read Cautions and warnings and Important notes at the end of this document. Page 5 of 24 95% of termination wetted Within the specified values Temperature measurement and compensation SMD NTC thermistors, case size 0603 (1608) B573**V5 Automotive series Reliability data Tests of SMD NTC thermistors are based on AEC-Q200 Rev-D. The parts are mounted on standardized PCB. Test Pre- and post-stress electrical test High temperature exposure (storage) Temperature cycling Standard Test conditions Resistance at: 25 °C and 100 °C Physical dimensions Test temperature: 150 °C Duration: 1000 h Unpowered JESD22, Lower test temperature: 40 °C method JA-104 Upper test temperature: 150 °C Number of cycles: 1000 Transfer time: < 10 s Dwell time: 15 min Air  Air MIL-STD-202, Test temperature: 85 °C method 103 Rel. humidity of air: 85% Duration: 1000 h Test voltage: VNTC = 0.3 V DC MIL-STD-202, Test temperature: 150 °C method 108 Pmax = 0.35 mW Duration: 1000 h MIL-STD-883E, Visual inspection method 2009 JESD22, Measured with calibers method JB-100 Resistance to solvents MIL-STD-202, method 215 Mechanical shock MIL-STD-202, method 213 Vibration MIL-STD-202, method 204 Resistance to soldering heat MIL-STD-202, method 210 Biased humidity Operational life External visual ∆R25/R25 Remarks (typical) MIL-STD-202, method 108 Please read Cautions and warnings and Important notes at the end of this document. < 5% < 5% < 5% < 5% Not applicable for SMD thermistors (component has no marking, color coding or coating) Peak value: 1500 g < 5% Half sine Condition F Acceleration: 5 g < 5% Sweep time: 20 min Frequency range: 10 ... 2000 Hz 3 × 12 cycles Dip: 260 °C; 10 s < 3% 1 heat cycle Page 6 of 24 Within the specified values Temperature measurement and compensation SMD NTC thermistors, case size 0603 (1608) Test Standard ESD AEC-Q200-002, Discharge capacitance: 150 pF method -002 Discharge resistance: 2 kΩ Charging voltage: 6 kV Contact discharge 2 pulses in each polarity J-STD-002 a) Dip: 235 °C; 5 s: aging 4 h @ 155 °C b) Dip: 215 °C; 5 s: steam aging 8 h @ 92 °C c) Dip: 260 °C; 7 s: steam aging 8 h @ 92 °C R(25 °C), R(100 °C), B(25/100) Solderability Electrical characterization Flammability Board flex Terminal strength Resistance drift after soldering Test conditions UL-94 V-0 or V-1 B573**V5 Automotive series ∆R25/R25 Remarks (typical) < 5% Not applicable for SMD thermistors (component is not coated or encapsulated with plastic materials) AEC-Q200-005, Max. bending: 2 mm < 5% method -005 Duration @ max. bending: 60 s AEC-Q200-006, Max. F: 10 N < 5% method -006 Reflow soldering profile < 1% Wave soldering profile Please read Cautions and warnings and Important notes at the end of this document. Page 7 of 24 95% of termination wetted Within the specified values Temperature measurement and compensation B573**V5 SMD NTC thermistors, case size 0603 (1608) Automotive series R/T characteristics R/T No. T (°C) 8500 8502 8507 B25/100 = 3650 K B25/100 = 4000 K B25/100 = 4480 K RT/R25 α (%/K) RT/R25 α (%/K) RT/R25 α (%/K) 55.0 50.0 45.0 40.0 35.0 63.917 45.889 33.344 24.504 18.201 6.8 6.5 6.3 6.1 5.8 96.158 66.892 47.127 33.606 24.243 7.4 7.1 6.9 6.6 6.4 30.0 25.0 20.0 15.0 10.0 13.657 10.347 7.9114 6.1019 4.7454 5.6 5.5 5.3 5.1 4.9 17.681 13.032 9.702 7.2923 5.5314 6.2 6.0 5.8 5.6 5.4 23.213 16.686 12.115 8.8803 6.5692 6.7 6.5 6.3 6.1 5.9 5.0 0.0 5.0 10.0 15.0 3.7198 2.938 2.3372 1.8722 1.5096 4.8 4.6 4.5 4.4 4.2 4.2325 3.2657 2.54 1.9907 1.5716 5.3 5.1 4.9 4.8 4.7 4.9025 3.6896 2.7994 2.1406 1.6492 5.8 5.6 5.4 5.3 5.1 20.0 25.0 30.0 35.0 40.0 1.2249 1.0000 0.82111 0.67798 0.56279 4.1 4.0 3.9 3.8 3.7 1.2494 1.0000 0.80552 0.65288 0.53229 4.5 4.4 4.3 4.1 4.0 1.2798 1.0000 0.78663 0.62277 0.4961 5.0 4.9 4.7 4.6 4.5 45.0 50.0 55.0 60.0 65.0 0.46958 0.39374 0.33171 0.28073 0.23863 3.6 3.5 3.4 3.3 3.2 0.43645 0.35981 0.29819 0.24837 0.20787 3.9 3.8 3.7 3.6 3.5 0.39757 0.32044 0.2597 0.21161 0.17331 4.4 4.3 4.1 4.0 3.9 70.0 75.0 80.0 85.0 90.0 0.2037 0.17459 0.15022 0.12975 0.11247 3.1 3.0 3.0 2.9 2.8 0.17479 0.14763 0.12523 0.10667 0.091227 3.4 3.3 3.2 3.2 3.1 0.14265 0.11799 0.098035 0.081823 0.068589 3.8 3.8 3.7 3.6 3.5 95.0 100.0 105.0 110.0 115.0 0.097838 0.085396 0.074781 0.065691 0.057883 2.8 2.7 2.6 2.6 2.5 0.078319 0.067488 0.058363 0.050647 0.044098 3.0 2.9 2.9 2.8 2.7 0.057735 0.048796 0.041403 0.035263 0.030143 3.4 3.3 3.2 3.2 3.1 120.0 125.0 130.0 135.0 140.0 0.051153 0.045335 0.040289 0.0359 0.032071 2.4 2.4 2.3 2.3 2.2 0.03852 0.033752 0.029663 0.026146 0.023111 2.7 2.6 2.6 2.5 2.4 0.025858 0.022258 0.019223 0.016655 0.014476 3.0 3.0 2.9 2.8 2.8 145.0 150.0 0.028723 0.025786 2.2 2.1 0.020484 0.018203 2.4 2.3 0.012619 0.011033 2.7 2.7 Please read Cautions and warnings and Important notes at the end of this document. Page 8 of 24 142.71 96.913 66.637 46.366 32.629 7.9 7.6 7.4 7.1 6.9 Temperature measurement and compensation B573**V5 SMD NTC thermistors, case size 0603 (1608) Automotive series R/T characteristics R/T No. 8509 T (°C) B25/100 = 3455 K T (°C) RT/R25 α (%/K) B25/100 = 3455 K T (°C) RT/R25 α (%/K) B25/100 = 3455 K RT/R25 α (%/K) 55.0 50.0 45.0 40.0 35.0 44.605 33.281 25.044 19.003 14.536 5.9 5.8 5.6 5.4 5.3 15.0 20.0 25.0 30.0 35.0 1.4703 1.2093 1.0000 0.83113 0.69418 4.0 3.9 3.7 3.6 3.6 85.0 90.0 95.0 100.0 105.0 0.1451 0.12663 0.11088 0.097381 0.085788 2.8 2.7 2.6 2.6 2.5 30.0 25.0 20.0 15.0 10.0 11.206 8.7041 6.8104 5.3665 4.2576 5.1 5.0 4.8 4.7 4.6 40.0 45.0 50.0 55.0 60.0 0.58255 0.49112 0.41587 0.35365 0.30197 3.5 3.4 3.3 3.2 3.1 110.0 115.0 120.0 125.0 130.0 0.075795 0.067155 0.059663 0.053146 0.047463 2.4 2.4 2.3 2.3 2.2 5.0 0.0 5.0 10.0 3.4001 2.7326 2.2096 1.7973 4.4 4.3 4.2 4.1 65.0 70.0 75.0 80.0 0.25888 0.22278 0.19243 0.16681 3.0 3.0 2.9 2.8 135.0 140.0 145.0 150.0 0.042493 0.038134 0.034302 0.030925 2.2 2.1 2.1 2.1 Please read Cautions and warnings and Important notes at the end of this document. Page 9 of 24 Temperature measurement and compensation SMD NTC thermistors, case size 0603 (1608) B573**V5 Automotive series Taping and packing 1 Taping of SMD NTC thermistors 1.1 Cardboard tape for case size 0402 and 0603 (taping to IEC 60286-3) Dimensions (mm) Case size 0402 (8-mm tape) Case size 0603 (8-mm tape) Tolerance A0 × B0 0.60 × 1.15 0.95 × 1.80 ±0.2 T2 0.70 1.10 T 0.60 0.90 max. D0 1.50 1.50 ±0.10 P0 4.00 4.00 ±0.101) P2 2.00 2.00 ±0.05 P1 2.00 4.00 ±0.10 W 8.00 8.00 ±0.30 E 1.75 1.75 ±0.10 F 3.50 3.50 ±0.05 G 0.75 0.75 min. 1) ≤0.2 mm over 10 sprocket holes. Please read Cautions and warnings and Important notes at the end of this document. Page 10 of 24 Temperature measurement and compensation SMD NTC thermistors, case size 0603 (1608) 1.2 Blister tape for case size 0805 and 1206 (taping to IEC 60286-3) Dimensions (mm) Case size 0805 (8-mm tape) Case size 1206 (8-mm tape) Tolerance A0 × B0 1.60 × 2.40 1.90 × 3.50 ±0.2 K0 1.40 1.40 max. T2 2.5 2.5 max. D0 1.50 1.50 +0.10/–0 D1 1.00 1.00 min. P0 4.00 4.00 ±0.102) P2 2.00 2.00 ±0.05 P1 4.00 4.00 ±0.10 W 8.00 8.00 ±0.30 E 1.75 1.75 ±0.10 F 3.50 3.50 ±0.05 G 0.75 0.75 min. 2) ≤0.2 mm over 10 sprocket holes. Please read Cautions and warnings and Important notes at the end of this document. Page 11 of 24 B573**V5 Automotive series Temperature measurement and compensation B573**V5 SMD NTC thermistors, case size 0603 (1608) 1.3 Automotive series Reel packing Packing survey Case size Chip 8-mm tape thickness3) Reel dimensions Packing units mm mm pcs./reel Blister Card- A board Tol. W1 Tol. W2 180-mm 330-mm reel reel 0402 0.5 x 180 3/+0 8.4 +1.5/0 14.4 max. 10000  0603 0.8 x 180 3/+0 8.4 +1.5/0 14.4 max. 4000  330 ±2.0 12.4 +1.5/0 18.4 max.  16000 0805 0.8 x 8.4 12.4 +1.5/0 +1.5/0 14.4 max. 18.4 max. 16000 x 3/+0 ±2.0 4000 1.2 180 330 3000 12000 0.8 x 180 2/+0 8.4 +1.5/0 14.4 max. 4000  1.2 x 180 2/+0 8.4 +1.5/0 14.4 max. 2000  1206 3) Chip thickness depends on the resistance value. Please read Cautions and warnings and Important notes at the end of this document. Page 12 of 24 Temperature measurement and compensation B573**V5 SMD NTC thermistors, case size 0603 (1608) 2 Automotive series Packing codes The last two digits of the complete ordering code state the packing mode: Last two digits 60 SMD Cardboard tape 180-mm reel packing 62 SMD Blister tape 180-mm reel packing 70 SMD Cardboard tape 330-mm reel packing 72 SMD Blister tape 330-mm reel packing Please read Cautions and warnings and Important notes at the end of this document. Page 13 of 24 Temperature measurement and compensation SMD NTC thermistors, case size 0603 (1608) B573**V5 Automotive series Mounting instructions 1 Soldering 1.1 SMD NTC thermistors SMD NTC thermistors can be provided with a nickel barrier termination or on special request with silver-palladium termination. The usage of mild, non-activated fluxes for soldering is recommended as well as a proper cleaning of the PCB. The nickel barrier layer of the silver/nickel/tin termination (see figure 1) prevents leaching of the silver base metalization layer. This allows great flexibility in the selection of soldering parameters. The tin prevents the nickel layer from oxidizing and thus ensures better wetting by the solder. The nickel barrier termination is suitable for all commonly-used soldering methods. Note: SMD NTCs with AgPd termination are not approved for lead-free soldering. Figure 1 SMD NTC thermistors, structure of nickel barrier termination 1.1.1 Solderability (test to IEC 60068-2-58) Preconditioning: Immersion into flux F-SW 32. Evaluation criterion: Wetting of soldering areas ≥95%. Solder Bath temperature (°C) Dwell time (s) SnPb 60/40 215 ±3 3 ±0.3 SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9) 245 ±3 3 ±0.3 1.1.2 Resistance to soldering heat (test to IEC 60068-2-58) Preconditioning: Immersion into flux F-SW 32. Evaluation criterion: Leaching of side edges ≤1/3. Solder Bath temperature (°C) Dwell time (s) SnPb 60/40 260 ±5 10 ±1 SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9) 260 ±5 10 ±1 Please read Cautions and warnings and Important notes at the end of this document. Page 14 of 24 Temperature measurement and compensation SMD NTC thermistors, case size 0603 (1608) Wave soldering Temperature characteristic at component terminal with dual wave soldering Solder joint profiles for silver/nickel/tin terminations Please read Cautions and warnings and Important notes at the end of this document. Page 15 of 24 B573**V5 Automotive series Temperature measurement and compensation SMD NTC thermistors, case size 0603 (1608) B573**V5 Automotive series Reflow soldering Recommended temperature characteristic for reflow soldering following JEDEC J-STD-020D Profile feature Preheat and soak - Temperature min - Temperature max - Time Average ramp-up rate Liquidous temperature Time at liquidous Peak package body temperature Time (tP)3) within 5 °C of specified classification temperature (Tc) Average ramp-down rate Time 25 °C to peak temperature Tsmin Tsmax tsmin to tsmax Tsmax to Tp TL tL Tp1) Tp to Tsmax Sn-Pb eutectic assembly Pb-free assembly 100 °C 150 °C 60 ... 120 s 3 °C/ s max. 183 °C 60 ... 150 s 220 °C ... 235 °C2) 150 °C 200 °C 60 ... 180 s 3 °C/ s max. 217 °C 60 ... 150 s 245 °C ... 260 °C2) 20 s3) 30 s3) 6 °C/ s max. maximum 6 min 6 °C/ s max. maximum 8 min 1) Tolerance for peak profile temperature (TP) is defined as a supplier minimum and a user maximum. 2) Depending on package thickness. For details please refer to JEDEC J-STD-020D. 3) Tolerance for time at peak profile temperature (tP) is defined as a supplier minimum and a user maximum. Note: All temperatures refer to topside of the package, measured on the package body surface. Number of reflow cycles: 3 Please read Cautions and warnings and Important notes at the end of this document. Page 16 of 24 Temperature measurement and compensation SMD NTC thermistors, case size 0603 (1608) B573**V5 Automotive series Solder joint profiles for silver/nickel/tin terminations 1.1.3 Recommended geometry of solder pads Recommended maximum dimensions (mm) Case size inch/mm A B C 0402/1005 0.6 0.6 1.7 0603/1608 1.0 1.0 3.0 0805/2012 1.3 1.2 3.4 1206/3216 1.8 1.2 4.5 1.1.4 Notes Iron soldering should be avoided, hot air methods are recommended for repair purposes. Please read Cautions and warnings and Important notes at the end of this document. Page 17 of 24 Temperature measurement and compensation SMD NTC thermistors, case size 0603 (1608) 2 B573**V5 Automotive series Conductive adhesion An alternative to soldering is the gluing of thermistors with conductive adhesives. The benefit of this method is that it involves no thermal stress. The adhesives used must be chemically inert. 3 Clamp contacting Pressure contacting by means of clamps is particularly suitable for applications involving frequent switching and high turn-on powers. 4 Sealing and potting When thermistors are sealed, potted or overmolded, there must be no mechanical stress caused by thermal expansion during the production process (curing / overmolding process) and during later operation. The upper category temperature of the thermistor must not be exceeded. Ensure that the materials used (sealing / potting compound and plastic material) are chemically neutral. 5 Cleaning If cleaning is necessary, mild cleaning agents such as ethyl alcohol and cleaning gasoline are recommended. Cleaning agents based on water are not allowed. Ultrasonic cleaning methods are permissible. 6 Storage In order to maintain their solderability, thermistors must be stored in a non-corrosive atmosphere. Humidity, temperature and container materials are critical factors. Do not store SMDs where they are exposed to heat or direct sunlight. Otherwise, the packing material may be deformed or SMDs may stick together, causing problems during mounting. After opening the factory seals, such as polyvinyl-sealed packages, use the SMDs as soon as possible. The components should be left in the original packing. Touching the metallization of unsoldered thermistors may change their soldering properties. Storage temperature: 25 °C up to 45 °C Relative humidity (without condensation): ≤75% annual mean