NTC thermistors for
temperature measurement
Glass-encapsulated sensors,
standard type
Series/Type:
B57550G1
Date:
January 2016
© EPCOS AG 2015. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
EPCOS AG is a TDK Group Company.
Temperature measurement
B57550G1
Glass-encapsulated sensors
G1550
Applications
Temperature measurement
Dimensional drawing
Features
Glass-encapsulated, heat-resistive and
highly stable
For temperature measurement up to
300 °C
Very short response time
Small dimensions
Leads: dumet wires (copper-clad FeNi)
Options
Leads: nickel-plated dumet wires
Alternative dimensions available on request
Dimensions in mm
Approx. weight 40 mg
Delivery mode
Bulk
General technical data
Climatic category
Max. power
Resistance tolerance
Rated temperature
Dissipation factor
Thermal cooling time constant
Heat capacity
Please read Cautions and warnings and
Important notes at the end of this document.
(IEC 60068-1)
(at 25 °C)
(in air)
(in air)
P25
∆RR/RR
TR
δth
τc
Cth
Page 2 of 25
55/300/56
32
±1, ±2, ±3
25
approx. 0.75
approx. 7
approx. 5
mW
%
°C
mW/K
s
mJ/K
Temperature measurement
B57550G1
Glass-encapsulated sensors
G1550
Electrical specification and ordering codes
R25
Ω
2k
2.5 k
5k
10 k
10 k
20 k
30 k
50 k
100 k
230 k
No. of R/T
characteristic
8320
7006
8326
7003
8307
8332
8344
8344
8304
8350
B25/85
K
3406
3546
3483
3612
3478
3993
3992
3992
4072
4240
B0/100
K
3379
3517
3456
3586
3450
3965
3965
3965
4036
4198
+ = Resistance tolerance
F = ±1%
G = ±2%
H = ±3%
Please read Cautions and warnings and
Important notes at the end of this document.
Page 3 of 25
B25/100
K
3420 ±1%
3560 ±1%
3497 ±1%
3625 ±1%
3492 ±1%
4006 ±1%
4006 ±1%
4006 ±1%
4092 ±1%
4264 ±1%
Ordering code
B57550G1202+000
B57550G1252+000
B57550G1502+000
B57550G1103+005
B57550G1103+000
B57550G1203+000
B57550G1303+000
B57550G1503+000
B57550G1104+000
B57550G1234+000
Temperature measurement
B57550G1
Glass-encapsulated sensors
G1550
Reliability data
Test
Standard
Storage in
dry heat
IEC
60068-2-2
Storage in damp
heat, steady state
Rapid temperature
cycling
Test conditions
Storage at upper
category temperature
T: 300 °C
t: 1000 h
IEC
Temperature of air: 85 °C
60068-2-67 Relative humidity of air: 85%
Duration: 1000 h
IEC
Lower test temperature: 55 °C
60068-2-14 Upper test temperature: 200 °C
Number of cycles: 1000
Please read Cautions and warnings and
Important notes at the end of this document.
Page 4 of 25
∆R25/R25
(typical)
< 3%
Remarks
< 2%
No visible
damage
< 2%
No visible
damage
No visible
damage
Temperature measurement
B57550G1
Glass-encapsulated sensors
G1550
Reliability data according to AEC-Q200, Rev. D
Test
Standard
High temperature
exposure (storage)
Operational life
MIL-STD-202,
method 108
MIL-STD-202,
method 108
Temperature
cycling
Terminal strength
(leaded)
Test conditions
Storage at T = +125 °C
t = 1000 h
1000 h / +125 °C
Test voltage max. 0.3 V DC on
NTC1)
JESD 22,
Lower test temperature: 55 °C
method JA-104 Upper test temperature: 125 °C
1000 cycles
Dwell time: max. 30 min at each
temperature
Transition time in air: max. 1 min
MIL-STD-202, Test leaded device integrity
method 211
Condition A: 2.27 N2)
Mechanical shock
MIL-STD-202,
method 213,
condition C
Vibration
MIL-STD-202,
method 204
Acceleration: 40 g 2)
Pulse duration: 6 ms
Number of bumps: 3, each
direction
Acceleration: 5 g
t = 20 min
12 cycles in each of 3 directions
Frequency range: 10 to 2000 Hz
∆R25/R25
(typical)
< 2%
< 2%
Remarks
No visible
damage
No visible
damage
< 2%
No visible
damage
< 1%
No visible
damage
< 1%
No visible
damage
< 1%
No visible
damage
1) Self heating of the NTC thermistor must not exceed 0.2 K, steady state. Test conditions deviating from AEC Q200, Rev. D.
2) Deviating from AEC Q200, Rev. D.
Note
Contact of NTC thermistors with any liquids and solvents shall be prevented. It must be
ensured that no water enters the NTC thermistors (e.g. through plug terminals).
Avoid dewing and condensation unless thermistor is specified for these conditions.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 5 of 25
Temperature measurement
B57550G1
Glass-encapsulated sensors
G1550
R/T characteristics
R/T No.
T (°C)
7003
7006
8304
B25/100 = 3625 K
B25/100 = 3560 K
B25/100 = 4092 K
RT/R25
α (%/K) RT/R25
α (%/K) RT/R25
α (%/K)
55.0
50.0
45.0
40.0
35.0
63.225
45.46
33.07
24.324
18.081
6.7
6.5
6.3
6.0
5.8
55.947
40.765
30.014
22.321
16.760
6.4
6.2
6.0
5.8
5.6
30.0
25.0
20.0
15.0
10.0
13.575
10.29
7.8716
6.0739
4.7258
5.6
5.4
5.3
5.1
4.9
12.700
9.7089
7.4853
5.8179
4.5572
5.5
5.3
5.1
5.0
4.8
18.275
13.443
9.9853
7.4867
5.6636
6.2
6.0
5.9
5.7
5.5
5.0
0.0
5.0
10.0
15.0
3.7062
2.9287
2.3311
1.8684
1.5075
4.8
4.6
4.5
4.4
4.2
3.5965
2.8586
2.2878
1.8431
1.4943
4.7
4.5
4.4
4.3
4.1
4.3212
3.324
2.5769
2.0127
1.5834
5.3
5.2
5.0
4.9
4.7
20.0
25.0
30.0
35.0
40.0
1.224
1.0000
0.82176
0.67909
0.56422
4.1
4.0
3.9
3.8
3.7
1.2188
1.0000
0.82508
0.68444
0.57073
4.0
3.9
3.8
3.7
3.6
1.2542
1.0000
0.80239
0.64776
0.52598
4.6
4.5
4.3
4.2
4.1
45.0
50.0
55.0
60.0
65.0
0.47122
0.3955
0.33355
0.2826
0.24049
3.6
3.5
3.4
3.3
3.2
0.47829
0.40276
0.34072
0.28953
0.24709
3.5
3.4
3.3
3.2
3.1
0.4295
0.35262
0.291
0.24136
0.20114
4.0
3.9
3.8
3.7
3.6
70.0
75.0
80.0
85.0
90.0
0.20553
0.17637
0.15195
0.13141
0.11406
3.1
3.0
2.9
2.9
2.8
0.21174
0.18217
0.15734
0.13639
0.11866
3.0
3.0
2.9
2.8
2.8
0.16841
0.14164
0.11963
0.10147
0.086407
3.5
3.4
3.3
3.3
3.2
95.0
100.0
105.0
110.0
115.0
0.099352
0.086837
0.076149
0.066989
0.059112
2.7
2.7
2.6
2.5
2.5
0.10358
0.090727
0.079722
0.070269
0.062124
2.7
2.6
2.6
2.5
2.4
0.073867
0.063383
0.054584
0.04717
0.040901
3.1
3.0
3.0
2.9
2.8
120.0
125.0
130.0
135.0
140.0
0.052316
0.046433
0.041327
0.03688
0.032998
2.4
2.4
2.3
2.3
2.2
0.055081
0.048974
0.043662
0.039029
0.034975
2.4
2.3
2.3
2.2
2.2
0.035581
0.03105
0.027179
0.023861
0.021008
2.8
2.7
2.6
2.6
2.5
145.0
150.0
155.0
0.029598
0.026612
0.023984
2.2
2.1
2.1
0.031420
0.028293
0.025536
2.1
2.1
2.0
0.018548
0.016419
0.014573
2.5
2.4
2.4
Please read Cautions and warnings and
Important notes at the end of this document.
Page 6 of 25
100.11
69.56
48.945
34.853
25.102
7.4
7.2
6.9
6.7
6.5
Temperature measurement
B57550G1
Glass-encapsulated sensors
R/T No.
T (°C)
160.0
165.0
7003
G1550
7006
8304
B25/100 = 3625 K
B25/100 = 3560 K
B25/100 = 4092 K
RT/R25
α (%/K) RT/R25
α (%/K) RT/R25
α (%/K)
0.021665
2.0
0.023099
2.0
0.012967
2.3
0.019613
2.0
0.020939
1.9
0.011566
2.3
170.0
175.0
180.0
185.0
190.0
0.017793
0.016176
0.014735
0.013448
0.012297
1.9
1.9
1.8
1.8
1.8
0.019022
0.017315
0.015774
0.014407
0.013189
1.9
1.9
1.8
1.8
1.7
0.010341
0.0092664
0.0083224
0.0074907
0.0067564
2.2
2.2
2.1
2.1
2.0
195.0
200.0
205.0
210.0
215.0
0.011265
0.010338
0.009504
0.0087516
0.0080718
1.7
1.7
1.7
1.6
1.6
0.012099
0.011120
0.010236
0.0094369
0.0087121
1.7
1.7
1.6
1.6
1.6
0.0061064
0.0055299
0.0050175
0.0045611
0.0041537
2.0
2.0
1.9
1.9
1.9
220.0
225.0
230.0
235.0
240.0
0.0074567
0.0068989
0.0063925
0.0059318
0.005512
1.6
1.5
1.5
1.5
1.5
0.0080536
0.0074542
0.0069079
0.0064094
0.0059539
1.6
1.5
1.5
1.5
1.5
0.0037895
0.0034631
0.0031701
0.0029067
0.0026693
1.8
1.8
1.8
1.7
1.7
245.0
250.0
255.0
260.0
265.0
0.005129
0.004779
0.0044586
0.004165
0.0038955
1.4
1.4
1.4
1.4
1.3
0.0055376
0.0051566
0.0048079
0.0044885
0.0041957
1.4
1.4
1.4
1.4
1.3
0.0024551
0.0022615
0.0020862
0.0019273
0.0017829
1.7
1.6
1.6
1.6
1.5
270.0
275.0
280.0
285.0
290.0
0.0036478
0.0034199
0.0032098
0.003016
0.002837
1.3
1.3
1.3
1.2
1.2
0.0039274
0.0036812
0.0034554
0.0032481
0.0030579
1.3
1.3
1.3
1.2
1.2
0.0016516
0.0015319
0.0014228
0.0013231
0.0012319
1.5
1.5
1.5
1.4
1.4
295.0
300.0
0.0026714
0.002518
1.2
1.2
0.0028831
0.0027226
1.2
1.1
0.0011483
0.0010716
1.4
1.4
Please read Cautions and warnings and
Important notes at the end of this document.
Page 7 of 25
Temperature measurement
B57550G1
Glass-encapsulated sensors
G1550
R/T characteristics
R/T No.
T (°C)
8307
8320
8326
B25/100 = 3492 K
B25/100 = 3420 K
B25/100 = 3497 K
RT/R25
α (%/K) RT/R25
α (%/K) RT/R25
α (%/K)
55.0
50.0
45.0
40.0
35.0
52.624
38.452
28.401
21.194
15.972
6.4
6.2
6.0
5.8
5.6
48.459
35.668
26.524
19.920
15.103
6.2
6
5.8
5.6
5.4
53.680
39.112
28.817
21.459
16.142
6.4
6.2
6.0
5.8
5.6
30.0
25.0
20.0
15.0
10.0
12.149
9.3246
7.2181
5.6332
4.4308
5.4
5.2
5.0
4.9
4.7
11.554
8.9165
6.9383
5.4421
4.3012
5.3
5.1
4.9
4.8
4.6
12.259
9.3959
7.2644
5.6633
4.4503
5.4
5.2
5.1
4.9
4.7
5.0
0.0
5.0
10.0
15.0
3.5112
2.8024
2.252
1.8216
1.4827
4.6
4.4
4.3
4.2
4.1
3.4243
2.7454
2.2158
1.7999
1.4711
4.5
4.4
4.2
4.1
4
3.5236
2.8102
2.2567
1.8243
1.4841
4.6
4.5
4.3
4.2
4.1
20.0
25.0
30.0
35.0
40.0
1.2142
1.0000
0.82818
0.68954
0.57703
3.9
3.8
3.7
3.6
3.5
1.2095
1.0000
0.83132
0.69471
0.58346
3.9
3.7
3.6
3.5
3.4
1.2147
1.0000
0.82785
0.68900
0.57639
3.9
3.8
3.7
3.6
3.5
45.0
50.0
55.0
60.0
65.0
0.48525
0.41
0.34798
0.29663
0.25392
3.4
3.3
3.2
3.2
3.1
0.49239
0.41746
0.35551
0.30405
0.26111
3.3
3.3
3.2
3.1
3
0.48457
0.40931
0.34731
0.29599
0.25332
3.4
3.3
3.2
3.2
3.1
70.0
75.0
80.0
85.0
90.0
0.21824
0.1883
0.16307
0.14174
0.12362
3.0
2.9
2.8
2.8
2.7
0.22512
0.19484
0.16925
0.14754
0.12905
2.9
2.9
2.8
2.7
2.6
0.21768
0.18779
0.16261
0.14131
0.12324
3.0
2.9
2.8
2.8
2.7
95.0
100.0
105.0
110.0
115.0
0.10818
0.094973
0.08364
0.073881
0.06545
2.6
2.6
2.5
2.5
2.4
0.11325
0.099707
0.088049
0.077984
0.069267
2.6
2.5
2.5
2.4
2.3
0.10783
0.094663
0.083361
0.073638
0.065240
2.6
2.6
2.5
2.5
2.4
120.0
125.0
130.0
135.0
140.0
0.058144
0.051794
0.046259
0.04142
0.037179
2.3
2.3
2.2
2.2
2.1
0.061694
0.055095
0.049329
0.044277
0.039838
2.3
2.2
2.2
2.1
2.1
0.057964
0.051640
0.046128
0.041309
0.037085
2.3
2.3
2.2
2.2
2.1
145.0
150.0
155.0
0.033451
0.030166
0.027264
2.1
2.0
2.0
0.035927
0.032474
0.029417
2
2
2
0.033373
0.030102
0.027213
2.1
2.0
2.0
Please read Cautions and warnings and
Important notes at the end of this document.
Page 8 of 25
Temperature measurement
B57550G1
Glass-encapsulated sensors
R/T No.
T (°C)
160.0
165.0
8307
G1550
8320
8326
B25/100 = 3492 K
B25/100 = 3420 K
B25/100 = 3497 K
RT/R25
α (%/K) RT/R25
α (%/K) RT/R25
α (%/K)
0.024694
2.0
0.026703
1.9
0.024654
2.0
0.022414
1.9
0.024290
1.9
0.022384
1.9
170.0
175.0
180.0
185.0
190.0
0.020385
0.018577
0.016961
0.015514
0.014216
1.9
1.8
1.8
1.8
1.7
0.022139
0.020217
0.018497
0.016953
0.015566
1.8
1.8
1.8
1.7
1.7
0.020364
0.018564
0.016955
0.015515
0.014223
1.9
1.8
1.8
1.8
1.7
195.0
200.0
205.0
210.0
215.0
0.013049
0.011999
0.011051
0.010194
0.0094181
1.7
1.7
1.6
1.6
1.6
0.014317
0.013189
0.012159
0.011231
0.010391
1.7
1.6
1.6
1.6
1.5
0.013063
0.012017
0.011074
0.010222
0.0094500
1.7
1.7
1.6
1.6
1.6
220.0
225.0
230.0
235.0
240.0
0.0087144
0.0080751
0.0074933
0.0069631
0.0064791
1.5
1.5
1.5
1.5
1.4
0.0096285
0.0089347
0.0083021
0.0077243
0.0071956
1.5
1.5
1.5
1.4
1.4
0.0087502
0.0081144
0.0075359
0.0070087
0.0065276
1.5
1.5
1.5
1.4
1.4
245.0
250.0
255.0
260.0
265.0
0.0060366
0.0056316
0.0052602
0.0049193
0.0046059
1.4
1.4
1.4
1.3
1.3
0.0067110
0.0062662
0.0058573
0.0054811
0.0051346
1.4
1.4
1.3
1.3
1.3
0.0060877
0.0056850
0.0053159
0.0049770
0.0046654
1.4
1.4
1.3
1.3
1.3
270.0
275.0
280.0
285.0
290.0
0.0043173
0.0040514
0.003806
0.0035793
0.0033696
1.3
1.3
1.2
1.2
1.2
0.0048149
0.0045199
0.0042472
0.0039950
0.0037616
1.3
1.3
1.2
1.2
1.2
0.0043786
0.0041143
0.0038703
0.0036449
0.0034363
1.3
1.2
1.2
1.2
1.2
295.0
300.0
0.0031753
0.0029952
1.2
1.2
0.0035453
0.0033448
1.2
1.2
0.0032431
0.0030640
1.1
1.1
Please read Cautions and warnings and
Important notes at the end of this document.
Page 9 of 25
Temperature measurement
B57550G1
Glass-encapsulated sensors
G1550
R/T characteristics
R/T No.
T (°C)
8332
8344
8350
B25/100 = 4006 K
B25/100 = 4006 K
B25/100 = 4264 K
RT/R25
α (%/K) RT/R25
α (%/K) RT/R25
α (%/K)
55.0
50.0
45.0
40.0
35.0
97.675
67.930
47.838
34.093
24.576
7.4
7.1
6.9
6.7
6.4
99.651
69.067
48.490
34.465
24.786
7.5
7.2
6.9
6.7
6.5
30.0
25.0
20.0
15.0
10.0
17.909
13.186
9.8062
7.3621
5.5776
6.2
6
5.8
5.6
5.5
18.026
13.251
9.8411
7.3803
5.5866
6.3
6.1
5.9
5.7
5.5
20.096
14.661
10.798
8.0269
6.0195
6.4
6.2
6
5.8
5.7
5.0
0.0
5.0
10.0
15.0
4.2625
3.2848
2.5517
1.9974
1.5750
5.3
5.1
5
4.8
4.7
4.2667
3.2865
2.5522
1.9974
1.5749
5.3
5.1
5
4.8
4.7
4.5526
3.4713
2.6676
2.0654
1.6108
5.5
5.3
5.2
5
4.9
20.0
25.0
30.0
35.0
40.0
1.2508
1.0000
0.80472
0.65163
0.53084
4.5
4.4
4.3
4.2
4
1.2507
1.0000
0.80481
0.65179
0.53105
4.5
4.4
4.3
4.2
4
1.2649
1.0000
0.79564
0.63697
0.51297
4.8
4.6
4.5
4.4
4.3
45.0
50.0
55.0
60.0
65.0
0.43494
0.35834
0.29681
0.24711
0.20676
3.9
3.8
3.7
3.6
3.5
0.43517
0.35858
0.29705
0.24733
0.20695
3.9
3.8
3.7
3.6
3.5
0.41548
0.33837
0.27704
0.22798
0.18854
4.2
4.1
3.9
3.8
3.8
70.0
75.0
80.0
85.0
90.0
0.17381
0.14679
0.12451
0.10607
0.090731
3.4
3.3
3.2
3.2
3.1
0.17398
0.14693
0.12462
0.10615
0.090781
3.4
3.3
3.3
3.2
3.1
0.15666
0.13077
0.10964
0.092312
0.078045
3.7
3.6
3.5
3.4
3.3
95.0
100.0
105.0
110.0
115.0
0.077916
0.067168
0.058116
0.050462
0.043967
3
2.9
2.9
2.8
2.7
0.077940
0.067168
0.058094
0.050422
0.043911
3
2.9
2.9
2.8
2.7
0.066245
0.056445
0.048274
0.041434
0.035686
3.2
3.2
3.1
3
3
120.0
125.0
130.0
135.0
140.0
0.038435
0.033707
0.029651
0.026162
0.023151
2.7
2.6
2.5
2.5
2.4
0.038365
0.033625
0.029589
0.026110
0.023099
2.7
2.6
2.5
2.5
2.4
0.030839
0.026737
0.023253
0.020285
0.017747
2.9
2.8
2.8
2.7
2.6
145.0
150.0
155.0
0.020543
0.018279
0.016307
2.4
2.3
2.3
0.020487
0.018215
0.016235
2.4
2.3
2.3
0.015571
0.013700
0.012086
2.6
2.5
2.5
Please read Cautions and warnings and
Important notes at the end of this document.
Page 10 of 25
113.81
78.679
55.027
38.917
27.821
7.5
7.3
7
6.8
6.6
Temperature measurement
B57550G1
Glass-encapsulated sensors
R/T No.
T (°C)
160.0
165.0
8332
G1550
8344
8350
B25/100 = 4006 K
B25/100 = 4006 K
B25/100 = 4264 K
RT/R25
α (%/K) RT/R25
α (%/K) RT/R25
α (%/K)
0.014585
2.2
0.014504
2.2
0.010690
2.4
0.013077
2.2
0.012989
2.2
0.0094790 2.4
170.0
175.0
180.0
185.0
190.0
0.011753
0.010588
0.0095600
0.0086500
0.0078436
2.1
2.1
2
2
1.9
0.011659
0.010488
0.0094560
0.0085436
0.0077352
2.1
2.1
2
2
2
0.0084257
0.0075072
0.0067043
0.0060006
0.0053824
2.3
2.3
2.2
2.2
2.2
195.0
200.0
205.0
210.0
215.0
0.0071269
0.0064887
0.0059191
0.0054097
0.0049532
1.9
1.9
1.8
1.8
1.7
0.0070175
0.0063789
0.0058096
0.0053008
0.0048453
1.9
1.9
1.9
1.8
1.8
0.0048381
0.0043578
0.0039330
0.0035564
0.0032220
2.1
2.1
2
2
2
220.0
225.0
230.0
235.0
240.0
0.0045432
0.0041744
0.0038420
0.0035419
0.0032704
1.7
1.7
1.6
1.6
1.6
0.0044367
0.0040694
0.0037386
0.0034402
0.0031706
1.7
1.7
1.7
1.6
1.6
0.0029244
0.0026590
0.0024219
0.0022096
0.0020193
1.9
1.9
1.9
1.8
1.8
245.0
250.0
255.0
260.0
265.0
0.0030243
0.0028010
0.0025980
0.0024131
0.0022445
1.5
1.5
1.5
1.5
1.4
0.0029264
0.0027049
0.0025038
0.0023207
0.0021539
1.6
1.6
1.5
1.5
1.5
0.0018483
0.0016944
0.0015557
0.0014305
0.0013173
1.8
1.7
1.7
1.7
1.6
270.0
275.0
280.0
285.0
290.0
0.0020905
0.0019496
0.0018205
0.0017021
0.0015934
1.4
1.4
1.4
1.3
1.3
0.0020016
0.0018624
0.0017350
0.0016182
0.0015109
1.5
1.4
1.4
1.4
1.4
0.0012147
0.0011216
0.0010371
0.00096018
0.00089010
1.6
1.6
1.6
1.5
1.5
295.0
300.0
0.0014933
0.0014012
1.3
1.3
0.0014124
0.0013216
1.3
1.3
0.00082616 1.5
0.00076774 1.5
Please read Cautions and warnings and
Important notes at the end of this document.
Page 11 of 25
Temperature measurement
B57550G1
Glass-encapsulated sensors
G1550
Mounting instructions
1
Soldering
1.1
Leaded NTC thermistors
Leaded thermistors comply with the solderability requirements specified by CECC.
When soldering, care must be taken that the NTC thermistors are not damaged by excessive
heat. The following maximum temperatures, maximum time spans and minimum distances have
to be observed:
Dip soldering
Iron soldering
Bath temperature
max. 260 °C
max. 360 °C
Soldering time
max. 4 s
max. 2 s
Distance from thermistor
min. 6 mm
min. 6 mm
Under more severe soldering conditions the resistance may change.
1.2
Leadless NTC thermistors
In case of NTC thermistors without leads, soldering is restricted to devices which are provided
with a solderable metallization. The temperature shock caused by the application of hot solder
may produce fine cracks in the ceramic, resulting in changes in resistance.
To prevent leaching of the metallization, solder with silver additives or with a low tin content
should be used. In addition, soldering methods should be employed which permit short soldering
times.
1.3
SMD NTC thermistors
SMD NTC thermistors can be provided with a nickel barrier termination or on special request with
silver-palladium termination. The usage of mild, non-activated fluxes for soldering is recommended as well as a proper cleaning of the PCB.
Nickel barrier termination
The nickel barrier layer of the silver/nickel/tin termination (see figure 1) prevents leaching of the
silver base metalization layer. This allows great flexibility in the selection of soldering parameters.
The tin prevents the nickel layer from oxidizing and thus ensures better wetting by the solder. The
nickel barrier termination is suitable for all commonly-used soldering methods.
Note: SMD NTCs with AgPd termination are not approved for lead-free soldering.
Figure 1
SMD NTC thermistors, structure of nickel barrier
termination
Please read Cautions and warnings and
Important notes at the end of this document.
Page 12 of 25
Temperature measurement
B57550G1
Glass-encapsulated sensors
1.3.1
G1550
Solderability (test to IEC 60068-2-58)
Preconditioning: Immersion into flux F-SW 32.
Evaluation criterion: Wetting of soldering areas ≥95%.
Solder
Bath temperature (°C)
Dwell time (s)
SnPb 60/40
215 ±3
3 ±0.3
SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9)
245 ±3
3 ±0.3
1.3.2
Resistance to soldering heat (test to IEC 60068-2-58)
Preconditioning: Immersion into flux F-SW 32.
Evaluation criterion: Leaching of side edges ≤1/3.
Solder
Bath temperature (°C)
Dwell time (s)
SnPb 60/40
260 ±5
10 ±1
SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9)
260 ±5
10 ±1
Please read Cautions and warnings and
Important notes at the end of this document.
Page 13 of 25
Temperature measurement
B57550G1
Glass-encapsulated sensors
G1550
Wave soldering
Temperature characteristic at component terminal with dual wave soldering
Solder joint profiles for silver/nickel/tin terminations
Please read Cautions and warnings and
Important notes at the end of this document.
Page 14 of 25
Temperature measurement
B57550G1
Glass-encapsulated sensors
G1550
Reflow soldering
Recommended temperature characteristic for reflow soldering following JEDEC J-STD-020D
Profile feature
Preheat and soak
- Temperature min
- Temperature max
- Time
Average ramp-up rate
Liquidous temperature
Time at liquidous
Peak package body temperature
Time (tP)3) within 5 °C of specified
classification temperature (Tc)
Average ramp-down rate
Time 25 °C to peak temperature
Tsmin
Tsmax
tsmin to tsmax
Tsmax to Tp
TL
tL
Tp1)
Tp to Tsmax
Sn-Pb eutectic assembly
Pb-free assembly
100 °C
150 °C
60 ... 120 s
3 °C/ s max.
183 °C
60 ... 150 s
220 °C ... 235 °C2)
150 °C
200 °C
60 ... 180 s
3 °C/ s max.
217 °C
60 ... 150 s
245 °C ... 260 °C2)
20 s3)
30 s3)
6 °C/ s max.
max. 6 minutes
6 °C/ s max.
max. 8 minutes
1) Tolerance for peak profile temperature (TP) is defined as a supplier minimum and a user maximum.
2) Depending on package thickness. For details please refer to JEDEC J-STD-020D.
3) Tolerance for time at peak profile temperature (tP) is defined as a supplier minimum and a user maximum.
Note: All temperatures refer to topside of the package, measured on the package body surface.
Number of reflow cycles: 3
Please read Cautions and warnings and
Important notes at the end of this document.
Page 15 of 25
Temperature measurement
B57550G1
Glass-encapsulated sensors
G1550
Solder joint profiles for silver/nickel/tin terminations
1.3.3
Recommended geometry of solder pads
Recommended maximum dimensions (mm)
Case size
inch/mm
A
B
C
0402/1005
0.6
0.6
1.7
0603/1608
1.0
1.0
3.0
0805/2012
1.3
1.2
3.4
1206/3216
1.8
1.2
4.5
1.3.4
Notes
Iron soldering should be avoided, hot air methods are recommended for repair purposes.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 16 of 25
Temperature measurement
B57550G1
Glass-encapsulated sensors
2
G1550
Conductive adhesion
An alternative to soldering is the gluing of thermistors with conductive adhesives. The benefit of
this method is that it involves no thermal stress. The adhesives used must be chemically inert.
3
Clamp contacting
Pressure contacting by means of clamps is particularly suitable for applications involving frequent
switching and high turn-on powers.
4
Robustness of terminations (leaded types)
The leads meet the requirements of IEC 60068-2-21. They may not be bent closer than 4 mm
from the solder joint on the thermistor body or from the point at which they leave the feedthroughs. During bending, any mechanical stress at the outlet of the leads must be removed. The
bending radius should be at least 0.75 mm.
Tensile strength:
Test Ua1:
Leads
0.25 <
0.35 <
0.50 <
0.80 <
∅ ≤0.25 mm = 1.0 N
∅ ≤0.35 mm = 2.5 N
∅ ≤0.50 mm = 5.0 N
∅ ≤0.80 mm = 10.0 N
∅ ≤1.25 mm = 20.0 N
Bending strength: Test Ub:
Two 90°-bends in opposite directions at a weight of 0.25 kg.
Torsional strength: Test Uc: severity 2
The lead is bent by 90° at a distance of 6 to 6.5 mm from the thermistor body.
The bending radius of the leads should be approx. 0.75 mm. Two torsions of
180° each (severity 2).
When subjecting leads to mechanical stress, the following should be observed:
Tensile stress on leads
During mounting and operation tensile forces on the leads are to be avoided.
Bending of leads
Bending of the leads directly on the thermistor body is not permissible.
A lead may be bent at a minimum distance of twice the wire's diameter +2 mm from the solder
joint on the thermistor body. During bending the wire must be mechanically relieved at its outlet.
The bending radius should be at least 0.75 mm.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 17 of 25
Temperature measurement
B57550G1
Glass-encapsulated sensors
5
G1550
Sealing and potting
When thermistors are sealed, potted or overmolded, there must be no mechanical stress caused
by thermal expansion during the production process (curing / overmolding process) and during
later operation. The upper category temperature of the thermistor must not be exceeded. Ensure
that the materials used (sealing / potting compound and plastic material) are chemically neutral.
6
Cleaning
Washing processes may damage the product due to the possible static or cyclic mechanical
loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,
which might lead to reduced reliability or lifetime.
7
Storage
In order to maintain their solderability, thermistors must be stored in a non-corrosive atmosphere.
Humidity, temperature and container materials are critical factors.
Do not store SMDs where they are exposed to heat or direct sunlight. Otherwise, the packing material may be deformed or SMDs may stick together, causing problems during mounting. After
opening the factory seals, such as polyvinyl-sealed packages, use the SMDs as soon as possible.
The components should be left in the original packing. Touching the metallization of unsoldered
thermistors may change their soldering properties.
Storage temperature:
25 °C up to 45 °C
Relative humidity (without condensation):
≤75% annual mean
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