B57621C5103J062

NTC thermistors for temperature measurement SMD NTC thermistors, EIA case size 1206 (3216), standard series Series/Type: B57621C5 Date: February 2019 © TDK Electronics AG 2019. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without TDK Electronics' prior express consent is prohibited. Temperature measurement and compensation B57621C5 SMD NTC thermistors, case size 1206 (3216) Standard series Applications Temperature measurement and compensation Dimensional drawing Features Multilayer SMD NTC with/ without inner electrodes Nickel barrier termination For temperature measurement up to 125 °C Excellent long-term aging stability in high temperature environment High mechanical robustness Short response time 100% Pb free Dimensions in mm Approx. weight 24 mg Options Alternative resistance ratings, resistance tolerances and B value tolerances available on request. Delivery mode Blister tape, 180-mm reel (standard) General technical data Operating temperature range Max. power Resistance tolerance Rated temperature Dissipation factor Thermal cooling time constant Heat capacity Top (at 25 °C, on PCB) P251) ∆RR/RR TR (on PCB) δth1) (on PCB) τc1) Cth1) 55 ... 125 300 ±5, ±10 25 approx. 5 approx. 10 approx. 50 °C mW % °C mW/K s mJ/K Electrical specification and ordering codes R25 Ω 1.0 k 4.7 k 10 k ∆RR/RR % ±5, ±10 ±5, ±10 ±5, ±10 No. of R/T characteristic 3206 1309 1010 B25/50 K 3420 3430 3470 B25/85 K 3440 3500 3510 + = Resistance tolerance J = ±5% K = ±10% 1) Depends on mounting situation Please read Cautions and warnings and Important notes at the end of this document. Page 2 of 25 B25/100 K 3450 ±3% 3520 ±3% 3530 ±3% Ordering code B57621C5102+062 B57621C5472+062 B57621C5103+062 Temperature measurement and compensation B57621C5 SMD NTC thermistors, case size 1206 (3216) Standard series Reliability data SMD NTC thermistors are tested in accordance with IEC 60068. The parts are mounted on a standardized PCB in accordance with IEC 60539-1. Test Standard Storage in dry heat IEC 60068-2-2 JIS C 0021 Storage in damp heat, steady state Rapid temperature cycling Endurance Solderability Test conditions Storage at upper category temperature T: (125 ±2) °C t: 1000 h IEC Temperature of air: (40 ±2) °C 60068-2-78 Relative humidity of air: JIS C 0022 (93 +2/3)% Duration: 21 days IEC Lower test temperature: 55 °C 60068-2-14 Upper test temperature: 125 °C JIS C 0025 Number of cycles: 10 Pmax: 300 mW T: (65 ±2) °C t: 1000 h IEC Solderability: 60068-2-58 (215 ±3) °C, (3 ±0.3) s JIS C 0054 (245 ±5) °C, (3 ±0.3) s Resistance drift after soldering Resistance to soldering heat: (260 ±5) °C, (10 ±1) s Reflow soldering profile Wave soldering profile 1) Except type B57621C5102+062 and B57621C5472+062 ∆R25/R25: < 6% Please read Cautions and warnings and Important notes at the end of this document. Page 3 of 25 ∆R25/R25 (typical) < 3%1) Remarks < 3% No visible damage < 3% < 5% 95% of terminations wetted < 5% Temperature measurement and compensation B57621C5 SMD NTC thermistors, case size 1206 (3216) Standard series R/T characteristics R/T No. T (°C) 1010 1309 3206 B25/100 = 3530 K B25/100 = 3520 K B25/100 = 3450 K RT/R25 α (%/K) RT/R25 α (%/K) RT/R25 α (%/K) 55.0 50.0 45.0 40.0 35.0 52.826 38.643 28.574 21.346 16.1 6.4 6.1 5.9 5.7 5.5 48.46 35.8 26.694 20.085 15.247 6.1 6.0 5.8 5.6 5.4 59.147 42.651 31.088 22.903 17.052 6.7 6.4 6.2 6.0 5.8 30.0 25.0 20.0 15.0 10.0 12.256 9.4071 7.2862 5.6835 4.4698 5.4 5.2 5.0 4.9 4.7 11.674 9.0124 7.0136 5.5001 4.3451 5.3 5.1 4.9 4.8 4.6 12.827 9.7461 7.477 5.7897 4.5234 5.6 5.4 5.2 5.0 4.9 5.0 0.0 5.0 10.0 15.0 3.5385 2.8222 2.2649 1.83 1.4872 4.6 4.5 4.3 4.2 4.1 3.4569 2.7688 2.2321 1.8105 1.4773 4.5 4.4 4.2 4.1 4.0 3.5643 2.8316 2.2671 1.8287 1.4855 4.7 4.5 4.4 4.2 4.1 20.0 25.0 30.0 35.0 40.0 1.2161 1.0000 0.82677 0.68708 0.57401 4.0 3.9 3.8 3.6 3.5 1.2122 1.0000 0.82924 0.69105 0.57861 3.9 3.8 3.7 3.6 3.5 1.2149 1.0000 0.82816 0.68985 0.57784 4.0 3.8 3.7 3.6 3.5 45.0 50.0 55.0 60.0 65.0 0.48181 0.40638 0.34427 0.29296 0.25035 3.5 3.4 3.3 3.2 3.1 0.48666 0.4111 0.34872 0.29699 0.2539 3.4 3.3 3.3 3.2 3.1 0.48658 0.41181 0.3502 0.29918 0.25672 3.4 3.3 3.2 3.1 3.0 70.0 75.0 80.0 85.0 90.0 0.21478 0.18501 0.15995 0.13881 0.12088 3.0 2.9 2.9 2.8 2.7 0.21786 0.18759 0.16208 0.1405 0.12217 3.0 3.0 2.9 2.8 2.8 0.2212 0.19136 0.16618 0.14484 0.12668 2.9 2.9 2.8 2.7 2.7 95.0 100.0 105.0 110.0 115.0 0.10563 0.092597 0.081442 0.071842 0.063571 2.7 2.6 2.5 2.5 2.4 0.10656 0.093213 0.081767 0.071922 0.063428 2.7 2.6 2.6 2.5 2.5 0.11117 0.09787 0.086428 0.076549 0.067992 2.6 2.5 2.5 2.4 2.3 120.0 125.0 0.056407 0.050196 2.4 2.3 0.056078 0.049702 2.4 2.4 0.060555 0.054073 2.3 2.2 Please read Cautions and warnings and Important notes at the end of this document. Page 4 of 25 Temperature measurement and compensation B57621C5 SMD NTC thermistors, case size 1206 (3216) Standard series Taping and packing 1 Taping of SMD NTC thermistors Tape and reel packing according to IEC 60286-3. Tape material: Cardboard or blister, tape width 8 ±0.30 mm 2 Reel packing Dimensions in mm 8-mm tape 180-mm reel 330-mm reel A 180 +0/3 330 +0/2.0 W1 8.4 +1.5/0 8.4 +1.5/0 W2 14.4 max. 14.4 max. Leader, trailer Please read Cautions and warnings and Important notes at the end of this document. Page 5 of 25 Temperature measurement and compensation B57621C5 SMD NTC thermistors, case size 1206 (3216) Standard series Packing units for discrete chip Case size Chip thickness inch/mm 0402/1005 0603/1608 0805/2012 1206/3216 3 th 0.5 mm 0.8 mm 0.8 mm 1.2 mm 0.8 mm 1.2 mm Cardboard tape Blister tape W 8 mm 8 mm     W  8 mm 8 mm 8 mm 8 mm 8 mm ∅ 180-mm reel ∅ 330-mm reel pcs. 10000 4000 2000/ 4000 3000 2000 4000 pcs. 50000 16000 16000 12000 12000 12000 Packing codes The last two digits of the complete ordering code state the packing mode: Last two digits 60 SMD Cardboard tape 180-mm reel packing 62 SMD Blister tape 180-mm reel packing 70 SMD Cardboard tape 330-mm reel packing 72 SMD Blister tape 330-mm reel packing Please read Cautions and warnings and Important notes at the end of this document. Page 6 of 25 Temperature measurement and compensation B57621C5 SMD NTC thermistors, case size 1206 (3216) 4 Standard series Taping of radial leaded NTC thermistors Dimensions and tolerances Lead spacing F = 2.5 mm and 5.0 mm (taping to IEC 60286-2) Dimensions (mm) w th d P0 P1 F ∆h ∆p W W0 W1 W2 H H0 H1 D0 t L L1 Lead spacing 2.5 mm 11.0 5.0 0.5/0.6 12.7 5.1 2.5 0 0 18.0 5.5 9.0 3.0 18.0 16.0 32.2 4.0 0.9 11.0 4.0 Lead spacing 5 mm 11.5 6.0 0.5/0.6 12.7 3.85 5.0 0 0 18.0 5.5 9.0 3.0 18.0 16.0 32.2 4.0 0.9 11.0 4.0 Please read Cautions and warnings and Important notes at the end of this document. Tolerance of lead spacing 2.5/5 mm max. max. ±0.05 ±0.3 ±0.7 +0.6/0.1 ±2.0 ±1.3 ±0.5 min. +0.75/0.5 max. +2.0/0 ±0.5 max. ±0.2 max. max. max. Remarks ±1 mm / 20 sprocket holes measured at top of component body peel-off force ≥5 N without wires Page 7 of 25 Temperature measurement and compensation B57621C5 SMD NTC thermistors, case size 1206 (3216) Standard series Types of packing Ammo packing Ammo type x y z I 80 240 210 Packing unit: 1000 - 2000 pcs./reel Reel packing Packing unit: 1000 - 2000 pcs./reel Reel dimensions (in mm) Reel type d f n w I 360 max. 31 ±1 approx. 45 54 max. Please read Cautions and warnings and Important notes at the end of this document. Page 8 of 25 Temperature measurement and compensation SMD NTC thermistors, case size 1206 (3216) B57621C5 Standard series Cassette packing Packing unit: 1000 - 2000 pcs./cassette Bulk packing The components are packed in cardboard boxes, the size of which depends on the order quantity. Please read Cautions and warnings and Important notes at the end of this document. Page 9 of 25 Temperature measurement and compensation B57621C5 SMD NTC thermistors, case size 1206 (3216) 5 Standard series Packing codes The last two digits of the complete ordering code state the packing mode: Last two digits 00, 01, 02, 03,04, 05, 06, 07, 08  Bulk  40, 41  Bulk  45  Bulk  50 Radial leads, kinked Cardboard tape Cassette packing 51 Radial leads, kinked Cardboard tape 360-mm reel packing 52 Radial leads, straight Cardboard tape Cassette packing 53 Radial leads, straight Cardboard tape 360-mm reel packing 54 Radial leads, kinked Cardboard tape AMMO packing 55 Radial leads, straight Cardboard tape AMMO packing (If no packing code is indicated, this corresponds to 40) Example 1: B57164K0102J000 B57164K0102J052 Bulk Cardboard tape, cassette packing Example 2: B57881S0103F002 B57881S0103F251 Bulk Cardboard tape, reel packing Please read Cautions and warnings and Important notes at the end of this document. Page 10 of 25 Temperature measurement and compensation B57621C5 SMD NTC thermistors, case size 1206 (3216) Standard series Mounting instructions 1 Soldering 1.1 Leaded NTC thermistors Leaded thermistors comply with the solderability requirements specified by CECC. When soldering, care must be taken that the NTC thermistors are not damaged by excessive heat. The following maximum temperatures, maximum time spans and minimum distances have to be observed: Dip soldering Iron soldering Bath temperature max. 260 °C max. 360 °C Soldering time max. 4 s max. 2 s Distance from thermistor min. 6 mm min. 6 mm Under more severe soldering conditions the resistance may change. 1.1.1 Wave soldering Temperature characteristic at component terminal with dual wave soldering Please read Cautions and warnings and Important notes at the end of this document. Page 11 of 25 Temperature measurement and compensation B57621C5 SMD NTC thermistors, case size 1206 (3216) 1.2 Standard series Leadless NTC thermistors In case of NTC thermistors without leads, soldering is restricted to devices which are provided with a solderable metallization. The temperature shock caused by the application of hot solder may produce fine cracks in the ceramic, resulting in changes in resistance. To prevent leaching of the metallization, solder with silver additives or with a low tin content should be used. In addition, soldering methods should be employed which permit short soldering times. 1.3 SMD NTC thermistors SMD NTC thermistors can be provided with a nickel barrier termination or on special request with silver-palladium termination. The use of no-clean solder products is recommended. In any case mild, non-activated fluxes should be used. Flux residues after soldering should be minimized. SMD NTCs with AgPd termination are not approved for lead-free soldering. Nickel barrier termination Figure 1 SMD NTC thermistors, structure of nickel barrier termination The nickel barrier layer of the silver/nickel/tin termination (see figure 1) prevents leaching of the silver base metallization layer. This allows great flexibility in the selection of soldering parameters. The tin prevents the nickel layer from oxidizing and thus ensures better wetting by the solder. The nickel barrier termination is tested for all commonly-used soldering methods according to IEC 60068-2-58. Insufficient preheating may cause ceramic cracks. Rapid cooling by dipping in solvent is not recommended. The following test and process conditions apply for nickel barrier termination. Please read Cautions and warnings and Important notes at the end of this document. Page 12 of 25 Temperature measurement and compensation SMD NTC thermistors, case size 1206 (3216) 1.3.1 B57621C5 Standard series Solderability (test to IEC 60068-2-58) Preconditioning: Immersion into flux F-SW 32. Evaluation criterion: Wetting of soldering areas ≥95%. Solder Bath temperature (°C) Dwell time (s) SnPb 60/40 215 ±3 3 ±0.3 SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9) 245 ±3 3 ±0.3 1.3.2 Resistance to soldering heat (test to IEC 60068-2-58) Preconditioning: Immersion into flux F-SW 32. Evaluation criterion: Leaching of side edges ≤1/3. Solder Bath temperature (°C) Dwell time (s) SnPb 60/40 260 ±5 10 ±1 SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9) 260 ±5 10 ±1 1.3.3 Reflow soldering Temperature ranges for reflow soldering acc. to IEC 60068-2-58 recommendations. Please read Cautions and warnings and Important notes at the end of this document. Page 13 of 25 Temperature measurement and compensation SMD NTC thermistors, case size 1206 (3216) Profile feature Preheat and soak - Temperature min - Temperature max - Time B57621C5 Standard series Sn-Pb eutectic assembly Pb-free assembly Tsmin Tsmax tsmin to tsmax 100 °C 150 °C 60 ... 120 s 150 °C 200 °C 60 ... 120 s Average ramp-up rate Tsmax to Tp 3 °C/ s max. 3 °C/ s max. Liquidous temperature Time at liquidous TL tL 183 °C 40 ... 150 s 217 °C 40 ... 150 s Peak package body temperature Tp 215 °C ... 260 °C1) 235 °C ... 260 °C Time above (TP 5 °C) tp 10 ... 40 s 10 ... 40 s Average ramp-down rate Tp to Tsmax 6 °C/ s max. 6 °C/ s max. max. 8 minutes max. 8 minutes Time 25 °C to peak temperature 1) Depending on package thickness. Notes: All temperatures refer to topside of the package, measured on the package body surface. Number of reflow cycles: 3 Iron soldering should be avoided, hot air methods are recommended for repair purposes. Solder joint profiles for silver/nickel/tin terminations Please read Cautions and warnings and Important notes at the end of this document. Page 14 of 25 Temperature measurement and compensation SMD NTC thermistors, case size 1206 (3216) 1.3.4 B57621C5 Standard series Recommended geometry of solder pads Recommended maximum dimensions (mm) Case size inch/mm A B C 0402/1005 0.6 0.6 1.7 0603/1608 1.0 1.0 3.0 0805/2012 1.3 1.2 3.4 1206/3216 1.8 1.2 4.5 2 Conductive adhesion An alternative to soldering for silver-palladium terminated components is the gluing of thermistors with conductive adhesives. The benefit of this method is that it involves no thermal stress. The adhesives used must be chemically inert. 3 Clamp contacting Pressure contacting by means of clamps is particularly suitable for applications involving frequent switching and high turn-on powers. 4 Robustness of terminations (leaded types) The leads meet the requirements of IEC 60068-2-21. They may not be bent closer than 4 mm from the solder joint on the thermistor body or from the point at which they leave the feedthroughs. During bending, any mechanical stress at the outlet of the leads must be removed. The bending radius should be at least 0.75 mm. Please read Cautions and warnings and Important notes at the end of this document. Page 15 of 25 Temperature measurement and compensation SMD NTC thermistors, case size 1206 (3216) Tensile strength: B57621C5 Standard series Test Ua1: Value of applied force for Ua1 test: Diameter (d) of Force with tolerance of ±10% corresponding round leads ∅ ≤ 0.25 mm 1.0 N 0.25 < ∅ ≤ 0.35 mm 2.5 N 0.35 < ∅ ≤ 0.50 mm 5.0 N 0.50 < ∅ ≤ 0.80 mm 10.0 N Bending strength: Test Ub: Two 90°-bends in opposite directions Value of applied force for Ub test: Diameter (d) of Force with tolerance of ±10% corresponding round leads ∅ ≤ 0.25 mm 0.5 N 0.25 < ∅ ≤ 0.35 mm 1.25 N 0.35 < ∅ ≤ 0.50 mm 2.5 N 0.50 < ∅ ≤ 0.80 mm 5N Torsional strength: Test Uc: severity 2 The lead is bent by 90° at a distance of 6 to 6.5 mm from the thermistor body. The bending radius of the leads should be approx. 0.75 mm. Two torsions of 180° each (severity 2). When subjecting leads to mechanical stress, the following should be observed: Tensile stress on leads During mounting and operation tensile forces on the leads are to be avoided. Bending of leads Bending of the leads directly on the thermistor body is not permissible. A lead may be bent at a minimum distance of twice the wire's diameter +4 mm from the solder joint on the thermistor body. During bending the wire must be mechanically relieved at its outlet. The bending radius should be at least 0.75 mm. Please read Cautions and warnings and Important notes at the end of this document. Page 16 of 25 Temperature measurement and compensation SMD NTC thermistors, case size 1206 (3216) 5 B57621C5 Standard series Sealing and potting Sealing or potting processes can affect the reliability of the component. When thermistors are sealed, potted or overmolded, there must be no mechanical stress caused by thermal expansion during the production process (curing / overmolding process) and during later operation. The upper category temperature of the thermistor must not be exceeded. Ensure that the materials used (sealing / potting compound and plastic material) are chemically neutral. As thermistors are temperature sensitive components it should be considered that molding can affect the thermal surrounding and may influence e.g. the response time. Extensive testing is encouraged in order to determine whether overmolding or potting influences the functionality and/ or reliability of the component. 6 Cleaning Cleaning processes can affect the reliability of the component. If cleaning is necessary, mild cleaning agents are recommended. Cleaning agents based on water are not allowed. Washing processes may damage the product due to the possible static or cyclic mechanical loads (e.g. ultrasonic cleaning). They may cause cracks which might lead to reduced reliability and/ or lifetime. 7 Storage In order to maintain their solderability, thermistors must be stored in a non-corrosive atmosphere. Humidity, temperature and container materials are critical factors. Do not store SMDs where they are exposed to heat or direct sunlight. Otherwise, the packing material may be deformed or SMDs may stick together, causing problems during mounting. After opening the factory seals, such as polyvinyl-sealed packages, use the SMDs as soon as possible. The components should be left in the original packing. Touching the metallization of unsoldered thermistors may change their soldering properties. Storage temperature: 25 °C up to 45 °C Relative humidity (without condensation): ≤75% annual mean