CeraLink
Capacitor for fast-switching semiconductors
Series/Type:
Ordering code:
Flex Assembly (FA) series
B58035U*
Date:
Version:
2019-09-25
6.2
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Identification/Classification 1
CeraLink
(header 1 + top left bar):
Identification/Classification 2
Capacitor for fast-switching semiconductors
(header 2 + bottom left header bar):
Ordering code: (top right header bar)
B58035U*
Series/Type: (bottom right header bar)
Flex Assembly (FA) series
Preliminary data (optional):
Department:
PPD PI AE/IE
Date:
2019-09-25
Version:
6.2
Prepared by:
Dr. Hopfer
Signed by:
Dr. Hopfer, Mr. Kastl, Dr. Paulitsch
Modifications/Remarks:
p22 – schematics of part orientation added
TDK Electronics AG 2019. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without TDK Electronics' prior express consent is prohibited.
CeraLink
Capacitor for fast-switching semiconductors
B58035U*
Flex Assembly (FA) series
Applications
Power converters and inverters
DC link/snubber capacitor for power converters and inverters
Features
High ripple current capability
High temperature robustness
Low equivalent serial inductance (ESL)
Low equivalent serial resistance (ESR)
Low power loss
Low dielectric absorption
Optimized for high frequencies up to several MHz
Increasing capacitance with DC bias up to operating voltage
High capacitance density
Minimized dielectric loss at high temperatures
Qualification based on AEC-Q200 rev. D
Suitable for reflow soldering only
Construction
RoHS-compatible PLZT ceramic (lead lanthanum zirconium titanate)
Copper inner electrodes
Silver outer electrodes
Silver coated copper-invar lead frame
Epoxy resin adhesive
General technical data
1)
Dissipation factor
tan 𝛿
< 0.02
Insulation resistance
Rins, typ1)
> 0.1
GΩ
Operating device temperature
Tdevice
-40 … +150
°C
Typical insulation resistance, measured at operating voltage Vop and measurement time > 240s, +25 °C
PPD PI AE/IE
Please read Cautions and warnings and
Important notes at the end of this document.
2019-09-25
Page 2 of 31
CeraLink
Capacitor for fast-switching semiconductors
B58035U*
Flex Assembly (FA) series
Overview of available types
Cnom, typ (µF)
VR (VDC)
500
700
900
0.5
0.75
FA3
1
FA2
1.5
FA3
2
FA2
2.5
FA10
3
FA3
5
FA10
10
FA10
FA2
Electrical specifications and ordering codes
Type
Vpk, max
V
VR
V
Vop
V
Cnom, typ
µF
Ceff
µF
C0
µF
Ordering code
FA2
650
500
400
2
1.20 ±20%
0.70 ±20%
B58035U5205M062
B58035U5205M052 *)
FA3
650
500
400
3
1.80 ±20%
1.05 ±20%
B58035U5305M062
B58035U5305M052 *)
FA10
650
500
400
10
6.00 ±20%
3.50 ±20%
B58035U5106M001
FA2
1000
700
600
1
0.50 ±20%
0.28 ±20%
B58035U7105M062
B58035U7105M052 *)
FA3
1000
700
600
1.5
0.75 ±20%
0.42 ±20%
B58035U7155M062
B58035U7155M052 *)
FA10
1000
700
600
5
2.50 ±20%
1.40 ±20%
B58035U7505M001
FA2
1300
900
800
0.5
0.26 ±20%
0.14 ±20%
B58035U9504M062
B58035U9504M052 *)
FA3
1300
900
800
0.75
0.39 ±20%
0.21 ±20%
B58035U9754M062
B58035U9754M052 *)
FA10
1300
900
800
2.5
1.30 ±20%
0.70 ±20%
B58035U9255M001
*) smaller packaging unit (180-mm reel), see section “Packaging” for details
PPD PI AE/IE
Please read Cautions and warnings and
Important notes at the end of this document.
2019-09-25
Page 3 of 31
CeraLink
Capacitor for fast-switching semiconductors
B58035U*
Flex Assembly (FA) series
Typical values as a design reference for CeraLink® applications
ESR
0 VDC,
0.5 VRMS,
25°C, 1MHz
mΩ
ESL
Iop 1)
100 kHz,
TA = 85°C
Iop 1)
100 kHz,
TA = 105°C
G
ESR
0 VDC,
0.5 VRMS,
25°C, 1kHz
Ω
nH
ARMS
ARMS
500
2.3
3
5
3
17
14
FA3
500
3.5
2
4
3
20
17
FA10
500
11.5
1
3
2
47
38
FA2
700
2.3
6
17
3
12
11
FA3
700
3.5
4
12
3
16
13
FA10
700
11.5
1
5
2
39
30
FA2
900
2.3
11
29
3
8
7
FA3
900
3.5
7
20
3
11
9
FA10
900
11.5
2
7
2
32
23
Type
1)
VR
Weight
V
FA2
Normal operating current without forced cooling at Tdevice = +150 °C. Higher values permissible at reduced lifetime.
Dimensional drawings
FA 2
FA 3
9.0 ±0.5
6.0 ±0.5
PPD PI AE/IE
Please read Cautions and warnings and
Important notes at the end of this document.
2019-09-25
Page 4 of 31
CeraLink
Capacitor for fast-switching semiconductors
B58035U*
Flex Assembly (FA) series
FA 10
30.0 ±0.5
Dimensions in mm
Recommended solder pads
Type
a
b
c
FA2
7
2.85
5
FA3
10
2.85
5
FA10
31
2.85
5
Dimensions in mm
PPD PI AE/IE
Please read Cautions and warnings and
Important notes at the end of this document.
2019-09-25
Page 5 of 31
CeraLink
Capacitor for fast-switching semiconductors
B58035U*
Flex Assembly (FA) series
Polarity and marking of components
FAX Y µF
ZV
Manufacturer’s logo
X = CeraLink FA type (e.g. FA2)
Y = Nominal capacitance
Z = Rated voltage
Note that polarity is only for incoming inspection purposes and it does not affect operation. If put under reverse
rated voltage VR, CeraLink is repoled and works identically.
PPD PI AE/IE
Please read Cautions and warnings and
Important notes at the end of this document.
2019-09-25
Page 6 of 31
CeraLink
Capacitor for fast-switching semiconductors
B58035U*
Flex Assembly (FA) series
Typical characteristics as a function of temperature and voltage VR = 500 V
(VAC = 0.5 VRMS, frequency = 1 kHz)
All given temperatures are device temperatures.
The curves show the relative changes of the capacitance, dissipation factor and ESR. The 100%
values correspond to Ceff, typ and tan δ which are given on pages 2, 3 and 4 of this data sheet.
120
120
T [°C ]
-25
25
85
125
110
100
Capacitance [%]
Capacitance [%]
100
90
80
70
Bias
[VDC ]
0
400
500
110
90
80
70
60
60
50
50
40
0
100
200
300
400
500
-50
-25
0
Voltage [VDC]
600
50
75
100
125
150
600
T [°C ]
-25
25
85
125
400
300
200
Bias
[VDC ]
0
400
500
500
Dissipation factor [%]
500
Dissipation factor [%]
25
Temperature [°C]
100
400
300
200
100
0
0
0
100
200
300
400
500
-50
-25
0
Voltage [VDC]
25
50
75
100
125
150
Temperature [°C]
500
600
T [°C ]
-25
25
85
125
400
Bias
[VDC ]
0
400
500
500
ESR [%]
ESR [%]
400
300
200
300
200
100
100
0
0
0
100
200
300
400
500
-50
Voltage [VDC]
0
25
50
75
100
125
150
Temperature [°C]
PPD PI AE/IE
Please read Cautions and warnings and
Important notes at the end of this document.
-25
2019-09-25
Page 7 of 31
CeraLink
Capacitor for fast-switching semiconductors
B58035U*
Flex Assembly (FA) series
Application Notes
Further typical electrical characteristics as a design reference for CeraLink applications.
Typical capacitance values as a function of voltage VR = 500 V – valid for FA2, FA3 and FA10
Large signal capacitance:
225
Variable
large signal
small signal
200
The nominal capacitance is defined as the large
signal capacitance at Vop.
175
Capacitance [%]
Quasistatic (slow variation of the voltage), +25 °C
150
See glossary for further information.
125
100
Small signal capacitance:
75
0.5 VRMS, 1 kHz, +25 °C
50
0
100
200
300
Voltage [VDC]
400
500
The effective capacitance is defined as the small
signal capacitance at Vop.
PPD PI AE/IE
Please read Cautions and warnings and
Important notes at the end of this document.
2019-09-25
Page 8 of 31
CeraLink
Capacitor for fast-switching semiconductors
B58035U*
Flex Assembly (FA) series
Typical impedance, ESR and permissible current as a function of frequency VR = 500 V
VDC = 0 V,
VAC = 0.5 VRMS,
Tdevice = +25 °C
Measurements performed at Vop.
The values correspond to a device temperature of
+150 °C. No forced cooling was used.
17,5
Variable
Z
ESR
FA2
|Z|, ESR [Ohm]
100
10
1
0,1
Normal Operation Current [Arms]
1000
0,01
10000
100000
1000000
Frequency [Hz]
Variable
Z
ESR
100
|Z|, ESR [Ohm]
10
FA3
12,5
10,0
7,5
5,0
10000000
1
0,1
0,01
0,001
0
20
20,0
Normal Operation Current [Arms]
1000
Tamb [°C]
85.0
105.0
15,0
40
60
Frequency [kHz]
80
100
80
100
Tamb [°C]
85.0
105.0
17,5
15,0
12,5
10,0
7,5
5,0
0,0001
1000
10000
100000
1000000
Frequency [Hz]
10000000
0
100
0,1
0,01
10000
100000
1000000
Frequency [Hz]
10000000
Normal Operation Current [Arms]
|Z|, ESR [Ohm]
1
0,001
1000
40
60
Frequency [kHz]
50
Variable
Z
ESR
10
FA10
20
Tamb [°C]
85.0
105.0
40
30
20
10
0
20
40
60
Frequency [kHz]
80
100
Aging
The capacitance has an aging behavior which shows a decrease of capacitance with time.
The typical aging rate is about 2.5% per logarithmic decade in hours.
PPD PI AE/IE
Please read Cautions and warnings and
Important notes at the end of this document.
2019-09-25
Page 9 of 31
CeraLink
Capacitor for fast-switching semiconductors
B58035U*
Flex Assembly (FA) series
Typical characteristics as a function of temperature and voltage VR = 700 V
(VAC = 0.5 VRMS, frequency = 1 kHz)
All given temperatures are device temperatures.
The curves show the relative changes of the capacitance, dissipation factor and ESR. The 100%
values correspond to Ceff, typ and tan δ which are given on pages 2, 3 and 4 of this data sheet.
130
110
100
90
80
70
Bias
[VDC ]
0
600
700
120
Capacitance [%]
Capacitance [%]
140
T/°C
-25
25
75
125
120
100
80
60
60
40
50
40
20
0
100
200
300
400
Voltage [VDC]
500
600
700
T/°C
-25
25
75
125
600
400
300
200
0
50
Temperature [°C]
100
150
Bias
[VDC ]
0
600
700
600
500
Dissipation factor [%]
500
Dissipation factor [%]
-50
100
400
300
200
100
0
0
0
100
200
300
400
Voltage [VDC]
500
600
700
500
-50
50
Temperature [°C]
100
150
600
T/°C
-25
25
75
125
400
0
Bias
[VDC ]
0
600
700
500
ESR [%]
ESR [%]
400
300
200
300
200
100
100
0
0
0
100
200
300
400
Voltage [VDC]
500
600
700
-50
PPD PI AE/IE
Please read Cautions and warnings and
Important notes at the end of this document.
0
50
Temperature [°C]
100
150
2019-09-25
Page 10 of 31
CeraLink
Capacitor for fast-switching semiconductors
B58035U*
Flex Assembly (FA) series
Application Notes
Further typical electrical characteristics as a design reference for CeraLink applications.
Typical capacitance values as a function of voltage VR = 700 V – valid for FA2, FA3 and FA10
Large signal capacitance:
Variable
large signal * V
small signal * Bias [V]
200
Capacitance [%]
175
Quasistatic (slow variation of the voltage), +25 °C
150
The nominal capacitance is defined as the large
signal capacitance at Vop.
125
See glossary for further information.
100
Small signal capacitance:
75
0.5 VRMS, 1 kHz, +25 °C
50
0
100
200
300
400
500
Voltage [VDC]
600
700
The effective capacitance is defined as the small
signal capacitance at Vop.
PPD PI AE/IE
Please read Cautions and warnings and
Important notes at the end of this document.
2019-09-25
Page 11 of 31
CeraLink
Capacitor for fast-switching semiconductors
B58035U*
Flex Assembly (FA) series
Typical impedance, ESR and permissible current as a function of frequency VR = 700 V
VDC = 0 V,
VAC = 0.5 VRMS,
Tdevice = +25 °C
Measurements performed at Vop.
The values correspond to a device temperature of
+150 °C. No forced cooling was used.
1000
Variable
Z
ESR
12
Normal Operation Current [Arms]
FA2
|Z|, ESR [Ohm]
100
10
1
0,1
Tamb [°C]
Temp: 85
Temp: 105
10
8
6
4
0,01
1000
10000
100000
1000000
Frequency [Hz]
2
10000000
0
20
40
60
Frequency [kHz]
80
100
Variable
Z
ESR
10
1
0,1
0,01
0,001
1000
10000
100000
1000000
Frequency [Hz]
Variable
Z
ESR
|Z|, ESR [Ohm]
10
1
0,1
0,01
Tamb [°C]
Temp: 85
Temp: 105
12,5
10,0
7,5
5,0
0
40
100
FA10
15,0
10000000
Normal Operation Current [Arms]
FA3
|Z|, ESR [Ohm]
100
Normal Operation Current [Arms]
1000
20
40
60
Frequency [kHz]
80
100
Tamb [°C]
Temp: 85
Temp: 105
35
30
25
20
15
10
0,001
1000
10000
100000
1000000
Frequency [Hz]
10000000
0
20
40
60
Frequency [kHz]
80
100
Aging
The capacitance has an aging behavior which shows a decrease of capacitance with time.
The typical aging rate is about 2.5% per logarithmic decade in hours.
PPD PI AE/IE
Please read Cautions and warnings and
Important notes at the end of this document.
2019-09-25
Page 12 of 31
CeraLink
Capacitor for fast-switching semiconductors
B58035U*
Flex Assembly (FA) series
Typical characteristics as a function of temperature and voltage VR = 900 V
(VAC = 0.5 VRMS, frequency = 1 kHz)
All given temperatures are device temperatures.
The curves show the relative changes of the capacitance, dissipation factor and ESR. The 100%
values correspond to Ceff, typ and tan δ which are given on pages 2, 3 and 4 of this data sheet.
140
100
80
Bias [V]
0
800
900
120
110
Capacitance [%]
120
Capacitance [%]
130
T/°C
-25
25
75
125
100
90
80
70
60
60
50
0
100
200
300
400
500
Voltage [VDC]
600
700
800
T/°C
-25
25
75
125
600
500
400
300
200
50
Temperature [°C]
100
150
Bias [V]
0
800
900
600
500
400
300
200
100
100
0
0
700
700
Dissipation Factor [%]
40
-50
900
Dissipation Factor [%]
40
0
100
200
300
400
500
Voltage [VDC]
600
700
800
0
-50
900
500
50
Temperature [°C]
100
150
600
T/°C
-25
25
75
125
400
0
Bias [V]
0
800
900
500
ESR [%]
ESR [%]
400
300
200
300
200
100
100
0
0
100
200
300
400
500
Voltage [VDC]
600
700
800
0
-50
900
PPD PI AE/IE
Please read Cautions and warnings and
Important notes at the end of this document.
0
50
Temperature [°C]
100
150
2019-09-25
Page 13 of 31
CeraLink
Capacitor for fast-switching semiconductors
B58035U*
Flex Assembly (FA) series
Application Notes
Further typical electrical characteristics as a design reference for CeraLink applications.
Typical capacitance values as a function of voltage VR = 900 V – valid for FA2, FA3 and FA10
Large signal capacitance:
Variable
large signal
small signal
200
Capacitance [%]
175
Quasistatic (slow variation of the voltage), +25 °C
150
The nominal capacitance is defined as the large
signal capacitance at Vop.
125
See glossary for further information.
100
Small signal capacitance:
75
0.5 VRMS, 1 kHz, +25 °C
50
0
100
200
300
400
500
600
Voltage [VDC]
700
800
900
The effective capacitance is defined as the small
signal capacitance at Vop.
PPD PI AE/IE
Please read Cautions and warnings and
Important notes at the end of this document.
2019-09-25
Page 14 of 31
CeraLink
Capacitor for fast-switching semiconductors
B58035U*
Flex Assembly (FA) series
Typical impedance, ESR and permissible current as a function of frequency VR = 900 V
VDC = 0 V,
VAC = 0.5 VRMS,
Tdevice = +25 °C
Measurements performed at Vop.
The values correspond to a device temperature of
+150 °C. No forced cooling was used.
Variable
Z
ESR
FA2
|Z|, ESR [Ohm]
100
10
1
0,1
Normal Operation Current [Arms]
8
1000
0,01
100000
1000000
Frequency [Hz]
1000
|Z|, ESR [Ohm]
10000000
Variable
Z
ESR
100
FA3
10
1
0,1
10000
100000
1000000
Frequency [Hz]
20
40
60
Frequency [kHz]
80
100
60
Frequency [kHz]
80
100
40
60
Frequency [kHz]
80
Tamb [°C]
85.0
105.0
10
9
8
7
6
5
4
3
0
20
40
35
10
1
0,1
0,01
10000
100000
1000000
Frequency [Hz]
Normal Operation Current [Arms]
|Z|, ESR [Ohm]
3
2
10000000
Variable
Z
ESR
100
1000
4
11
1000
FA10
5
0
0,01
1000
6
2
10000
Normal Operation Current [Arms]
1000
Tamb [°C]
85.0
105.0
7
10000000
Tamb [°C]
85.0
105.0
30
25
20
15
10
0
20
100
Aging
The capacitance has an aging behavior which shows a decrease of capacitance with time.
The typical aging rate is about 2.5% per logarithmic decade in hours.
PPD PI AE/IE
Please read Cautions and warnings and
Important notes at the end of this document.
2019-09-25
Page 15 of 31
CeraLink
Capacitor for fast-switching semiconductors
B58035U*
Flex Assembly (FA) series
Reliability
A. Preconditioning:
Reflow solder the capacitor on a PCB using the recommended soldering profile
Check of external appearance
Measurement of electrical parameters Rins, C0, tan δ
o Apply Vpk,max for 7 seconds and measure Rins at room temperature:
Isolation resistance (@ Vpk,max, 7 s, 25 °C)
Rins > 100 MΩ
o Measure C0 and tan δ within 10 minutes to 1 hour afterwards:
Initial capacitance (@ 0 VDC, 0.5 VRMS, 1 kHz, 25 °C)
Dissipation factor (@ 0 VDC, 0.5 VRMS, 1 kHz, 25 °C)
B. Performance of a specific reliability test.
C. After performing a specific test:
Check the external appearance again
Repeat the measurement of the electrical parameters
o Apply Vpk,max for 7 seconds and measure Rins at room temperature:
Isolation resistance (@ Vpk,max, 7 s, 25 °C)
Rins > 10 MΩ
o Measure C and tan δ:
Change of initial capacitance (@ 0 VDC, 0.5 VRMS, 1 kHz, 25 °C)
|ΔC0 / C0| < 15%
tan δ < 0.05
o Dissipation factor (@ 0 VDC, 0.5 VRMS, 1 kHz, 25 °C)
Test
Standard
External
appearance
Test conditions
Criteria
Visual inspection with magnifying glass
No defects that might affect
performance
High
temperature
operating life
MIL-STD-202,
method 108
+150 °C, VR, 1000 hours
No mechanical damage
|ΔC0 / C0|, tan δ and Rins within
defined limits
Biased
humidity
MIL-STD-202,
method 103
+85 °C, 85% rel. hum., VR, 1000 hours
No mechanical damage
|ΔC0 / C0|, tan δ and Rins within
defined limits
Temperature
shock
IEC 60384-9,
4.8
-55 °C to +150 °C
20 seconds transfer time
15 minutes dwell time
1000 cycles
No mechanical damage
Terminal
strength test
AEC-Q200-005 Apply a force of 17.7 N for 60 seconds
PPD PI AE/IE
Please read Cautions and warnings and
Important notes at the end of this document.
|ΔC0 / C0|, tan δ and Rins within
defined limits
No detaching of termination.
No rupture of ceramic
|ΔC0 / C0|, tan δ and Rins within
defined limits
2019-09-25
Page 16 of 31
CeraLink
Capacitor for fast-switching semiconductors
Test
Standard
Test conditions
Board flex
AEC-Q200-005 Bending of 2 mm for 60 seconds
B58035U*
Flex Assembly (FA) series
Criteria
No mechanical damage
|ΔC0 / C0|, tan δ and Rins within
defined limits
Dimensions in mm
Vibration
MIL-STD-202,
method 204
5 g/ 20 min, 12 cycles, 3 axis
10 Hz to 2000 Hz
No mechanical damage
|ΔC0 / C0|, tan δ and Rins within
defined limits
Mechanical
shock
MIL-STD-202,
method 213
Acceleration 400 m/s²
Half sine pulse duration 6 milliseconds
4000 bumps
No mechanical damage
|ΔC0 / C0|, tan δ and Rins within
defined limits
3 times recommended reflow soldering
profile
No mechanical damage
Proper solder coating of
contact areas
|ΔC0 / C0|, tan δ and Rins within
defined limits
Reflow test
Leaching test
(lead frame
only)
MIL-STD-202,
method 210,
condition B
Dip test of contact areas in solder bath
(+260 °C for 10 seconds)
No damage of lead frame
silver coating
Solderability
(lead frame
only)
J-STD-002,
method A @
+235 °C,
category 3
Dip test of contact areas in solder bath
+(235 °C for 5 ± 0.5 seconds)
> 95% wettability of lead frame
Resistance to
solvent
Dipping and cleaning with isopropanol
Marking must be legible
|ΔC0 / C0|, tan δ and Rins within
defined limits
Geometry
Using a caliper
Within specified tolerance in
the chapter construction
PPD PI AE/IE
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CeraLink
Capacitor for fast-switching semiconductors
B58035U*
Flex Assembly (FA) series
Packaging
The CeraLink FA2 type is delivered in a blister tape (taping to IEC 60286-3, 180-mm / 330-mm reel available
with 110 / 500 pieces per reel).
The CeraLink FA3 type is delivered in a blister tape (taping to IEC 60286-3, 180-mm / 330-mm reel available
with 100 / 350 pieces per reel).
The CeraLink FA10 type is delivered in a cardboard box with 100 pieces per box.
Blister tape for FA2
Part orientation
The part-orientation/polarity is the same for all CeraLink FA2 capacitors within the blister tape.
Component marking on this side
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CeraLink
Capacitor for fast-switching semiconductors
B58035U*
Flex Assembly (FA) series
Blister tape for FA3
Part orientation
The part-orientation/polarity is the same for all CeraLink FA3 capacitors within the blister tape.
Component marking on this side
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CeraLink
Capacitor for fast-switching semiconductors
B58035U*
Flex Assembly (FA) series
Taping information
Trailer: There is a minimum of 160 mm of carrier tape with empty compartments and sealed by the cover tape.
Leader: There is a minimum of 400 mm of cover tape, which includes at least 100 mm of carrier tape with empty
compartments.
Fixing peeling strength (top tape)
The peeling strength is 0.1 … 1.3 N.
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CeraLink
Capacitor for fast-switching semiconductors
B58035U*
Flex Assembly (FA) series
Reel packing
FA2 & FA3 Type FA2 & FA3 Type
330-mm reel
180-mm reel
A
330 ±2
180 ±3
B
62 ±1
62 ±1
C
12.8 +0.7
13.1 ±0.5
D
19.1 min.
19.1 min.
E
1.6 ±0.5
2.1 ±0.5
W
16.4 +2
17.0 -0.5 / +2
Dimensions in mm
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CeraLink
Capacitor for fast-switching semiconductors
B58035U*
Flex Assembly (FA) series
Cardboard box for FA10
Top cover
Base support tray
Dimensions in mm
Part orientation
The part-orientation/polarity is the same for all CeraLink FA10 capacitors within the tray. Parts are placed with
leadframes facing base support tray as shown.
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CeraLink
Capacitor for fast-switching semiconductors
B58035U*
Flex Assembly (FA) series
Recommended reflow soldering profile
Profile feature
Preheat and soak
- Temperature min
- Temperature max
- Time
Average ramp-up rate
Liquidus temperature
Time at liquidus temperature
Peak package body temperature
Time (tp)3) within +5 °C of specified
classification temperature (Tc)
Average ramp-down rate
Time +25 °C to peak temperature
SAC, Sn95.5Ag3.8Cu0.7 @ N2 atmosphere
Tsmin
Tsmax
tsmin to tsmax
TL to Tp
TL
tL
Tp1)
+150 °C
+200 °C
60 … 120 seconds
3 °C/ second max.
+217 °C
60 … 150 seconds
245 °C … 260 °C max.2)
30 seconds3)
Tp to TL
+6 °C/ second max.
maximum 8 minutes
1) Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
2) Depending on package thickness (cf. JEDEC J-STD-020D).
3) Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Notes:
All temperatures refer to topside of the package, measured on the package body surface.
Max. number of reflow cycles: 3
After the soldering process, the capacitance is lowered. Applying VR to the device will re-establish the capacitance.
The proposed soldering profile is based on IEC 60068-2-58 (respectively JEDEC J-STD-020D) recommendations
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CeraLink
Capacitor for fast-switching semiconductors
B58035U*
Flex Assembly (FA) series
General technical information
Storage
Only store CeraLink capacitors in their original packaging. Do not open the package prior to
processing.
Storage conditions in original packaging: temperature −25 °C to +45 °C, relative humidity ≤ 75%
annual average, maximum 95%, dew precipitation is inadmissible.
Do not store CeraLink capacitors where they are exposed to heat or direct sunlight. Otherwise the
packaging material may be deformed or CeraLink may stick together, causing problems during
mounting.
Avoid contamination of the CeraLink surface during storage, handling and processing.
Avoid storing CeraLink devices in harmful environments where they are exposed to corrosive
gases (e.g. SOx, Cl).
Use CeraLink as soon as possible after opening factory seals such as polyvinyl-sealed packages.
Solder CeraLink components within 6 months after shipment.
Handling
Do not drop CeraLink components or allow them to be chipped.
Do not clamp CeraLink components on the face sides (e.g. during pick-and-place). A vacuumbased pick-and-place process picking the component on the top side is recommended.
Do not touch CeraLink with your bare hands - gloves are recommended.
Avoid contamination of the CeraLink surface during handling.
The CeraLink FA series was tested to withstand the board flex test defined in the AEC-Q200 rev D,
method 005.
The CeraLink FA series uses copper-invar lead frames to prevent mechanical stress to the ceamic.
Too much bending causes open mode. Avoid high mechanical stress like twisting after soldering
on a PCB.
bending
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Page 24 of 31
CeraLink
Capacitor for fast-switching semiconductors
B58035U*
Flex Assembly (FA) series
Mounting
Do not subject CeraLink devices to mechanical stress when encapsulating them with sealing
material or overmolding with plastic material. Encapsulation may lead to worse heat dissipation
too. Please ask for further information.
Do not scratch the electrodes before, during or after the mounting process.
Make sure contacts and housings used for assembly with CeraLink components are clean before
mounting.
The surface temperature of an operating CeraLink can be higher than the ambient temperature.
Ensure that adjacent components are placed at a sufficient distance from a CeraLink to allow
proper cooling.
Avoid contamination of the CeraLink surface during processing.
Soldering guidelines
The use of mild, non-activated fluxes for soldering is recommended, as well as proper cleaning of
the PCB.
Complete removal of flux is recommended to avoid surface contamination that can result in an
instable and/or high leakage current.
Use resin-type or non-activated flux.
Bear in mind that insufficient preheating may cause ceramic cracks.
Rapid cooling by dipping in solvent is not recommended, otherwise a component may crack.
Excessive usage of solder paste can reduce the mechanical robustness of the device, whereas
insufficient solder may cause the CeraLink to detach from the PCB. Use an adequate amount of
solder paste, but on the landing pads only.
If an unsuitable cleaning fluid is used, flux residue or foreign particles may stick to the CeraLink
surface and deteriorate its insulation resistance. Insufficient or improper cleaning of the CeraLink
may cause damage to the component.
Excessive washing like ultrasonic cleaning, can affect the connection between the ceramic chip
and the outer electrode. To avoid this, we give the following recommendation:
o Power: 20 W/l max.
o Frequency: 40 kHz max.
o Washing time: 5 minutes max.
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CeraLink
Capacitor for fast-switching semiconductors
B58035U*
Flex Assembly (FA) series
Glossary
Initial capacitance C0:
Is the value at the origin of the hysteresis without any applied direct
voltage.
Effective capacitance Ceff:
Occurs at Vop and is measured with an applied ripple voltage of
0.5 VRMS and 1 kHz. The CeraLink is designed to have its highest
capacitance value at the operating voltage Vop.
Nominal capacitance Cnom:
Is the value derived by the tangent of the mean hysteresis as the
derivative of the mean hysteresis is dQ/dV ~ C.
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CeraLink
Capacitor for fast-switching semiconductors
B58035U*
Flex Assembly (FA) series
Symbols and terms
AC
Alternating current
C0
Initial capacitance @ 0 VDC, 0.5 VRMS, 1 kHz, +25 °C
Ceff,typ
Typical effective capacitance @ Vop, 0.5 VRMS, 1 kHz, +25 °C
Cnom,typ
Typical nominal capacitance @ Vop, quasistatic, +25 °C. See glossary for
definition of the nominal capacitance
DC
Direct current
ESL
Equivalent serial inductance
ESR
Equivalent serial resistance
Iop
Operating ripple current, root mean square value of sinusoidal AC current
LP
Low profile
PCB
Printed circuit board
PLZT
Lead lanthanum zirconium titanate
Rins
Insulation resistance @ Vpk,max, measurement time t = 7 s, +25 °C
Rins, typ
Insulation resistance @ Vop, measurement time t > 240 s, +25 °C
SAC
Tin silver copper alloy; lead-free solder paste
Tamb
Ambient temperature
tan δ
Dissipation factor @ 0 VDC, 0.5 VRMS,1 kHz, +25°C
Tdevice
Device temperature. Tdevice = Tamb + ΔT (ΔT defines the self-heating of the device
due to applied current).
Vop
Operating voltage at maximum attenuation capability
VR
Rated voltage. Reference DC voltage for reliability tests.
VRMS
Root mean square value of sinusoidal AC voltage
Vpk,max
Maximum peak operating voltage
ΔT
Increase of temperature during operation
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Page 27 of 31
CeraLink
Capacitor for fast-switching semiconductors
B58035U*
Flex Assembly (FA) series
Cautions and warnings
General
Not for use in resonant circuits, where a voltage of alternating polarity occurs.
Not for AC applications. Consult our local representative for further details.
If used in snubber circuits, ensure that the sum of all voltages remains at the same polarity.
Some parts of this publication contain statements about the suitability of our CeraLink components for
certain areas of application, including recommendations about incorporation/design-in of these
products into customer applications. The statements are based on our knowledge of typical
requirements often made of our CeraLink devices in the particular areas. We nevertheless expressly
point out that such statements cannot be regarded as binding statements about the suitability of our
CeraLink components for a particular customer application. As a rule, TDK is either unfamiliar with
individual customer applications or less familiar with them than the customers themselves. For these
reasons, it is always incumbent on the customer to check and decide whether the CeraLink devices
with the properties described in the product specification are suitable for use in a particular customer
application.
Do not use CeraLink components for purposes not identified in our specifications.
Ensure the suitability of a CeraLink in particular by testing it for reliability during design-in.
Always evaluate a CeraLink component under worst-case conditions.
Pay special attention to the reliability of CeraLink devices intended for use in safety-critical
applications (e.g. medical equipment, automotive, spacecraft, nuclear power plant).
Design notes
Consider derating at higher operating temperatures. As a rule, lower temperatures and voltages
increase the life time of CeraLink devices.
If steep surge current edges are to be expected, make sure your design is as low-inductive as
possible.
In some cases the malfunctioning of passive electronic components or failure before the end of
their service life cannot be completely ruled out in the current state of the art, even if they are
operated as specified. In applications requiring a very high level of operational safety and
especially when the malfunction or failure of a passive electronic component could endanger
human life or health (e.g. in accident prevention, life-saving systems, or automotive battery line
applications such as clamp 30), ensure by suitable design of the application or other measures
(e.g. installation of protective circuitry, fuse or redundancy) that no injury or damage is sustained
by third parties in the event of such a malfunction or failure.
Specified values only apply to CeraLink components that have not been subject to prior electrical,
mechanical or thermal damage. The use of CeraLink devices in line-to-ground applications is
therefore not advisable, and it is only allowed together with safety countermeasures such as
thermal fuses.
PPD PI AE/IE
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Page 28 of 31
CeraLink
Capacitor for fast-switching semiconductors
B58035U*
Flex Assembly (FA) series
Operation
Use CeraLink only within the specified operating temperature range.
Use CeraLink only within specified voltage and current ranges.
The CeraLink has to be operated in a dry atmosphere, which must not contain any additional
chemical vapors or substances.
Environmental conditions must not harm the CeraLink. Use the capacitors under normal
atmospheric conditions only. A reduction of the oxygen partial pressure to below 1 mbar is not
permissible.
Prevent a CeraLink from contacting liquids and solvents.
Avoid dewing and condensation.
During operation, the CeraLink can produce audible noise due to its piezoelectric characteristic.
CeraLink components are mainly designed for encased applications. Under all circumstances
avoid exposure to:
o direct sunlight
o rain or condensation
o steam, saline spray
o corrosive gases
o atmosphere with reduced oxygen content
This listing does not claim to be complete, but merely reflects the experience of the manufacturer.
Display of ordering codes for TDK Electronics products
The ordering code for one and the same product can be represented differently in data sheets, data books,
other publications, on the company website, or in order-related documents such as shipping notes, order
confirmations and product labels. The varying representations of the ordering codes are due to
different processes employed and do not affect the specifications of the respective products.
Detailed information can be found on the Internet under www.tdk-electronics.tdk.com/orderingcodes.
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Page 29 of 31
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical
requirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application. As a
rule we are either unfamiliar with individual customer applications or less familiar with them than
the customers themselves. For these reasons, it is always ultimately incumbent on the customer
to check and decide whether a product with the properties described in the product specification is
suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or failure
before the end of their usual service life cannot be completely ruled out in the current state
of the art, even if they are operated as specified. In customer applications requiring a very high
level of operational safety and especially in customer applications in which the malfunction or
failure of an electronic component could endanger human life or health (e.g. in accident
prevention or life-saving systems), it must therefore be ensured by means of suitable design of the
customer application or other action taken by the customer (e.g. installation of protective circuitry
or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or
failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as hazardous). Useful information on this will be found in our Material
Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have any more
detailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products. Consequently,
we cannot guarantee that all products named in this publication will always be available.
The aforementioned does not apply in the case of individual agreements deviating from the
foregoing for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms
and Conditions of Supply.
7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard.
The IATF certifications confirm our compliance with requirements regarding the quality
management system in the automotive industry. Referring to customer requirements and
customer specific requirements (“CSR”) TDK always has and will continue to have the policy of
respecting individual agreements. Even if IATF 16949 may appear to support the acceptance of
unilateral requirements, we hereby like to emphasize that only requirements mutually agreed
upon can and will be implemented in our Quality Management System. For clarification
purposes we like to point out that obligations from IATF 16949 shall only become legally binding if
individually agreed upon.
Page 30 of 31
Important notes
8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS,
DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK,
MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar,
SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse,
WindCap are trademarks registered or pending in Europe and in other countries. Further
information will be found on the Internet at www.tdk-electronics.tdk.com/trademarks.
Release 2018-10
Page 31 of 31
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