PTC thermistors
Series/Type:
T1550, T1509, T1735, T1535
The following products presented in this data sheet are being withdrawn.
Ordering Code
B59735T1150A062
B59550T1120A262
B59550T1120A062
Substitute Product
Date of
Withdrawal
2019-03-01
2019-03-01
2019-03-01
Deadline Last
Orders
2019-06-07
2019-06-07
2019-06-07
Last
Shipments
2019-09-07
2019-09-07
2019-09-07
Ordering Code
B59535T1120A262
B59535T1120A062
B59509T1120A062
Substitute Product
Date of
Withdrawal
2019-03-01
2019-03-01
2019-03-01
Deadline Last
Orders
2019-06-07
2019-06-07
2019-06-07
Last
Shipments
2019-09-07
2019-09-07
2019-09-07
Please contact your nearest TDK sales office if you need support in selecting a suitable
substitute. The addresses of our worldwide sales network are presented at www.tdkelectronics.tdk.com/sales.
Overcurrent protection for telecom
Telecom pair protector (TPP), SMD
Applications
Overcurrent protection for telecom applications
Suitable for line card applications e.g. POTS, access
networks, customer premises equipment (CPE) or integrated
voice data (IVD)
Internal circuit
Features
Two resistance-matched PTCs in a plastic housing
Compliant with ITU-T standards
basic-level lightning surges (10/700 µs)
basic-level power induction (600 V, 1 A, 0.2 s)
power contact criteria A/B (230 V, 15 min.)
Compliant with GR-1089 AC power contact 120 V, 25 A, 15
min.
Suitable for continuous connection to mains voltages of
110/230 V AC in tripped (high-ohmic) condition
Housing material to UL94-V0
UL approval to UL 1434 (file number E69802) for selected
types
Tight resistance matching maintained after switching
Negligible resistance drift after reflow soldering or switching
Marked with manufacturer's logo, type designation and date
code
RoHS-compatible
Options
Alternative tolerances and resistances on request
Delivery mode
T15** and T16**: Blister tape, 330-mm reel with 16-mm tape, taping to IEC 60286-3
T17** and T18**: Blister tape, 380-mm reel with 24-mm tape, taping to IEC 60286-3
General technical data
Maximum fault voltage1)
Max. operating voltage
Operating temperature range
(V = 0)
Operating temperature range
(V = Vmax)
Insulating test voltage between PTC1 and PTC2
Resistance matching in one housing
VF,max
Vmax
Top
Top
Vins
R2 R1
245
135
20/+125
0/+70
>3
< 1.0
V AC
V AC
°C
°C
kV
Ω
1) The maximum fault voltage VF,max is the highest voltage that is permitted to be applied across the PTC thermistor in protection mode.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 2 of 13
Overcurrent protection for telecom
Telecom pair protector (TPP), SMD
Electrical specifications and ordering codes
Type
RR
∆RR
Ω
%
IR
IR
IS
ISmax
@ 25 °C @ 70 °C @ 25 °C
mA
mA
mA
A
Component height max. 7.3
T1535 35
+15/20 100
T1550 50
±15
80
Component height max. 8.3
T1509 9
±10
180
T1535 35
+15/20 110
T1550 50
±15
90
Component height max. 9.9
T1635 35
+15/20 110
T1650 50
±15
90
Component height max. 10.5
T1735 35
+15/20 110
T1735 35
+15/20 130
T1750 50
±15
90
Component height max. 11.5
T1835 35
+15/20 115
Approvals
Ordering code
65
50
210
170
2.5
2.5
B59535T1120A262
B59550T1120A262
120
70
60
360
230
190
1.0
4.6
2.5
B59509T1120A062
B59535T1120A062
B59550T1120A062
70
60
230
190
4.6
2.5
X
X
B59635T1120A062
B59650T1120A062
70
95
60
230
270
190
4.6
3.6
2.5
X
X
B59735T1120A062
B59735T1150A062
B59750T1120A062
75
240
4.6
X
B59835T1120A062
Switching times and ordering codes
Type
tS (typ.)
@ ISmax
s
tS (typ.)
@1A
s
Component height max. 7.3
T1535
0.07
0.4
T1550
0.05
0.3
Component height max. 8.3
T1509
4
4
T1535
0.04
0.8
T1550
0.1
0.6
Component height max. 9.9
T1635
0.04
0.8
T1650
0.1
0.6
Component height max. 10.5
T1735
0.04
0.8
T1735
0.1
1.1
T1750
0.1
0.6
Component height max. 11.5
T1835
0.06
1.1
Please read Cautions and warnings and
Important notes at the end of this document.
tS (typ.)
@ 500 mA
s
Ordering code
1.7
1.2
B59535T1120A262
B59550T1120A262
20
3.4
2.4
B59509T1120A062
B59535T1120A062
B59550T1120A062
3.4
2.4
B59635T1120A062
B59650T1120A062
3.4
4.5
2.4
B59735T1120A062
B59735T1150A062
B59750T1120A062
4.5
B59835T1120A062
Page 3 of 13
Overcurrent protection for telecom
Telecom pair protector (TPP), SMD
Internal circuit
Dimensional drawings in mm
Maximum component height 7.3 mm
Solder pad
Maximum component height 8.3 mm
Please read Cautions and warnings and
Important notes at the end of this document.
Solder pad
Page 4 of 13
Overcurrent protection for telecom
Telecom pair protector (TPP), SMD
Dimensional drawings in mm
Maximum component height 9.9 mm
Solder pad
Maximum component height 10.5 mm
Solder pad
Maximum component height 11.5 mm
Solder pad
Please read Cautions and warnings and
Important notes at the end of this document.
Page 5 of 13
Overcurrent protection for telecom
Telecom pair protector (TPP), SMD
Reliability data
Test
Electrical endurance,
cycling
Electrical endurance,
constant
Damp heat
Standard
IEC 60738-1
Rapid change
of temperature
IEC 60738-1
Vibration
IEC 60738-1
Shock
IEC 60738-1
Climatic sequence
IEC 60738-1
IEC 60738-1
IEC 60738-1
Please read Cautions and warnings and
Important notes at the end of this document.
Test conditions
Room temperature, ISmax; Vmax
Number of cycles: 10
Storage at Vmax and Top,max (@ Vmax)
Test duration: 1000 h
Temperature of air: 40 °C
Relative humidity of air: 93%
Duration: 56 days
Test according to IEC 60068-2-78
T1 = Top,min (0 V), T2 = Top,max (0 V)
Number of cycles: 5
Test duration: 30 min
Test according to IEC 60068-2-14, test Na
Frequency range: 10 to 55 Hz
Displacement amplitude: 0.75 mm
Test duration: 3 × 2 h
Test according to IEC 60068-2-6, test Fc
Acceleration: 400 m/s2
Pulse duration: 6 ms; 6 × 5000 pulses
Dry heat: T = Top,max (0 V)
Test duration: 16 h
Damp heat first cycle
Cold: T = Top,min (0 V)
Test duration: 2 h
Damp heat 5 cycles
Tests performed according to
IEC 60068-2-30
Page 6 of 13
∆R25/R25
< 20%
< 25%
< 10%
< 10%
< 5%
< 5%
< 10%
Overcurrent protection for telecom
Telecom pair protector (TPP), SMD
ITU performance overview and fault conditions
Test
no.
Power induction
Power contact
Lightning surge
Power induction
Power contact
Lightning surge
1
2
3
4
5
A
B
C
D
E
F
G
H
I
ITU K20
Basic
test level
A
B
D
F
H
Enhanced
test level
A
C
E
G
H
ITU K21
Basic
test level
A
B
D
G
H
Enhanced
test level
A
C
E
G
I
ITU K45
Basic
test level
A
B
D
G
H
Enhanced
test level
A
C
E
G
H
600 V AC, R = 600 Ω, t = 0.2 s, criteria A
600 V AC, R = 600 Ω, t = 1.0 s, with GDT, criteria A
1500 V AC, R = 200 Ω, t = 2.0 s, with GDT, criteria A
230 V AC, t = 15 min, R = 10 ... 1000 Ω, criteria B
230 V AC, t = 15 min, R = 10, 20, 40, 80, 1000 Ω, criteria B,
R = 160, 300, 600 Ω, criteria A
Vc(max) = 1.0 kV, R = 25 Ω, t = 10/700 µs, without GDT, criteria A
Vc(max) = 1.5 kV, R = 25 Ω, t = 10/700 µs, without GDT, criteria A
Vc(max) = 4.0 kV, R = 25 Ω, t = 10/700 µs, with GDT, criteria A
Vc(max) = 6.0 kV, R = 25 Ω, t = 10/700 µs, with GDT, criteria A
Note: Use a GDT (gas discharge tube) with adequate electrical properties in order to
ensure reliable operation at enhanced test levels (power induction, lightning surge).
Criteria A: no damage, function must be fulfilled.
Criteria B: no fire hazard.
Electrical requirements according to GR-1089 standard for AC power contact
AC voltage: 120 V, 50 Hz, short circuit current 25 A, time 15 min, criteria A.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 7 of 13
Overcurrent protection for telecom
Telecom pair protector (TPP), SMD
Cautions and warnings
General
EPCOS thermistors are designed for specific applications and should not be used for purposes
not identified in our specifications, application notes and data books unless otherwise agreed
with EPCOS during the design-in-phase.
Ensure suitability of thermistor through reliability testing during the design-in phase. The thermistors should be evaluated taking into consideration worst-case conditions.
Storage
Store thermistors only in original packaging. Do not open the package prior to processing.
Storage conditions in original packaging: storage temperature 25 °C ... +45 °C, relative humidity ≤75% annual mean, maximum 95%, dew precipitation is inadmissible.
Avoid contamination of thermistors surface during storage, handling and processing.
Avoid storage of thermistor in harmful environment with effect on function on long-term operation (examples given under operation precautions).
Use thermistor within the following period after delivery:
Through-hole devices (housed and leaded PTCs): 24 months
Motor protection sensors, glass-encapsulated sensors and probe assemblies: 24 months
Telecom pair and quattro protectors (TPP, TQP): 24 months
Leadless PTC thermistors for pressure contacting: 12 months
Leadless PTC thermistors for soldering: 6 months
SMDs in EIA sizes 3225 and 4032, and for PTCs with metal tags: 24 months
SMDs in EIA sizes 1210 and smaller: 12 months
Handling
PTCs must not be dropped. Chip-offs must not be caused during handling of PTCs.
The ceramic and metallization of the components must not be touched with bare hands. Gloves
are recommended.
Avoid contamination of thermistor surface during handling.
Soldering (where applicable)
Use rosin-type flux or non-activated flux.
Insufficient preheating may cause ceramic cracks.
Rapid cooling by dipping in solvent is not recommended.
Complete removal of flux is recommended.
Standard PTC heaters are not suitable for soldering.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 8 of 13
Overcurrent protection for telecom
Telecom pair protector (TPP), SMD
Mounting
Electrode must not be scratched before/during/after the mounting process.
Contacts and housing used for assembly with thermistor have to be clean before mounting. Especially grease or oil must be removed.
When PTC thermistors are encapsulated with sealing material, the precautions given in chapter
"Mounting instructions", "Sealing and potting" must be observed.
When the thermistor is mounted, there must not be any foreign body between the electrode of
the thermistor and the clamping contact.
The minimum force and pressure of the clamping contacts pressing against the PTC must be
10 N and 50 kPa, respectively. In case the assembly is exposed to mechanical shock and/ or
vibration this force should be higher in order to avoid movement of the PTC during operation.
During operation, the thermistor’s surface temperature can be very high. Ensure that adjacent
components are placed at a sufficient distance from the thermistor to allow for proper cooling at
the thermistors.
Ensure that adjacent materials are designed for operation at temperatures comparable to the
surface temperature of thermistor. Be sure that surrounding parts and materials can withstand
this temperature.
Avoid contamination of thermistor surface during processing.
Operation
Use thermistors only within the specified temperature operating range.
Use thermistors only within the specified voltage and current ranges.
Environmental conditions must not harm the thermistors. Use thermistors only in normal atmospheric conditions. Avoid use in deoxidizing gases (chlorine gas, hydrogen sulfide gas, ammonia gas, sulfuric acid gas etc), corrosive agents, humid or salty conditions. Contact with any
liquids and solvents should be prevented.
Be sure to provide an appropriate fail-safe function to prevent secondary product damage
caused by abnormal function (e.g. use VDR for limitation of overvoltage condition).
This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.
Display of ordering codes for EPCOS products
The ordering code for one and the same EPCOS product can be represented differently in data
sheets, data books, other publications, on the EPCOS website, or in order-related documents
such as shipping notes, order confirmations and product labels. The varying representations of
the ordering codes are due to different processes employed and do not affect the
specifications of the respective products. Detailed information can be found on the Internet
under www.epcos.com/orderingcodes
Please read Cautions and warnings and
Important notes at the end of this document.
Page 9 of 13
Overcurrent protection for telecom
Telecom pair protector (TPP), SMD
Symbols and terms
Symbol
A
C
Cth
f
I
Imax
IR
Ires
IPTC
Ir
Ir,oil
Ir,air
IRMS
IS
ISmax
LCT
N
Nc
Nf
P
P25
Pel
Pdiss
RG
Rmin
RR
∆RR
RP
RPTC
Rref
RS
R25
R25,match
∆R25
Term
Area
Capacitance
Heat capacity
Frequency
Current
Maximum current
Rated current
Residual current
PTC current
Residual currrent
Residual currrent in oil (for level sensors)
Residual currrent in air (for level sensors)
Root-mean-square value of current
Switching current
Maximum switching current
Lower category temperature
Number (integer)
Operating cycles at Vmax, charging of capacitor
Switching cycles at Vmax, failure mode
Power
Maximum power at 25 °C
Electrical power
Dissipation power
Generator internal resistance
Minimum resistance
Rated resistance @ rated temperature TR
Tolerance of RR
Parallel resistance
PTC resistance
Reference resistance
Series resistance
Resistance at 25 °C
Resistance matching per reel/ packing unit at 25 °C
Tolerance of R25
Please read Cautions and warnings and
Important notes at the end of this document.
Page 10 of 13
Overcurrent protection for telecom
Telecom pair protector (TPP), SMD
T
t
TA
ta
TC
tE
TR
Tsense
Top
TPTC
tR
Tref
TRmin
tS
Tsurf
UCT
V or Vel
Vc(max)
VF,max
VRMS
VBD
Vins
Vlink,max
Vmax
Vmax,dyn
Vmeas
Vmeas,max
VR
VPTC
α
∆
δth
τth
λ
Temperature
Time
Ambient temperature
Thermal threshold time
Ferroelectric Curie temperature
Settling time (for level sensors)
Rated temperature @ 25 °C or otherwise specified in the data sheet
Sensing temperature
Operating temperature
PTC temperature
Response time
Reference temperature
Temperature at minimum resistance
Switching time
Surface temperature
Upper category temperature
Voltage (with subscript only for distinction from volume)
Maximum DC charge voltage of the surge generator
Maximum voltage applied at fault conditions in protection mode
Root-mean-square value of voltage
Breakdown voltage
Insulation test voltage
Maximum link voltage
Maximum operating voltage
Maximum dynamic (short-time) operating voltage
Measuring voltage
Maximum measuring voltage
Rated voltage
Voltage drop across a PTC thermistor
Temperature coefficient
Tolerance, change
Dissipation factor
Thermal cooling time constant
Failure rate
Lead spacing (in mm)
Please read Cautions and warnings and
Important notes at the end of this document.
Page 11 of 13
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical
requirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application. As a
rule we are either unfamiliar with individual customer applications or less familiar with them than
the customers themselves. For these reasons, it is always ultimately incumbent on the customer
to check and decide whether a product with the properties described in the product specification is
suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or failure
before the end of their usual service life cannot be completely ruled out in the current state
of the art, even if they are operated as specified. In customer applications requiring a very high
level of operational safety and especially in customer applications in which the malfunction or
failure of an electronic component could endanger human life or health (e.g. in accident
prevention or life-saving systems), it must therefore be ensured by means of suitable design of the
customer application or other action taken by the customer (e.g. installation of protective circuitry
or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or
failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as hazardous). Useful information on this will be found in our Material
Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have any more
detailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products. Consequently,
we cannot guarantee that all products named in this publication will always be available.
The aforementioned does not apply in the case of individual agreements deviating from the
foregoing for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms
and Conditions of Supply.
7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard.
The IATF certifications confirm our compliance with requirements regarding the quality
management system in the automotive industry. Referring to customer requirements and
customer specific requirements (“CSR”) TDK always has and will continue to have the policy of
respecting individual agreements. Even if IATF 16949 may appear to support the acceptance of
unilateral requirements, we hereby like to emphasize that only requirements mutually agreed
upon can and will be implemented in our Quality Management System. For clarification
purposes we like to point out that obligations from IATF 16949 shall only become legally binding if
individually agreed upon.
Page 12 of 13
Important notes
8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS,
DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK,
MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar,
SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse,
WindCap are trademarks registered or pending in Europe and in other countries. Further
information will be found on the Internet at www.tdk-electronics.tdk.com/trademarks.
Release 2018-10
Page 13 of 13