B72660M0251K093

Ceramic transient voltage suppressors SMD Varistors, Monolithic (CU) Series/Type: Ordering code: CU4032K250G2K1 B72660M0251K093 Date: Version: 2009-02-16 1 Content of header bars 1 and 2 of data sheet will be automatically entered in headers and footers! Please fill in the table and then change the color to "white". This ensures that the table disappears (invisible) for the customer PDF. Don't change formatting when entering or pasting text in the table and don't add any cell or line in and to it! Identification/Classification 1 (header 1 + top left header bar): Ceramic transient voltage suppressors Identification/Classification 2 (header 2 + bottom left header bar): SMD Varistors, Monolithic (CU) Ordering code: (top right header bar) B72660M0251K093 Series/Type: (top right header bar) CU4032K250G2K1 Preliminary data (optional): (if necessary) Department: KB VS PE Date: 2009-02-16 Version: 1 Prepared by: Fr. Koholka Release signed by: Dr. Engel Release signed QS: Hr. Schlauer Modifications/Remarks: New cautions and warnings added; old issue c xxxx xxxx xxxx  EPCOS AG 2009. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited Ceramic transient voltage suppressors SMD Varistors, Monolithic (CU) B72660M0251K093 CU4032K250G2K1 Designation system CU 4032 K 250 G2 K1 = = = = = = Chip encapsulated 40/100’’ x 32/100’’ = 10.0 mm x 8.0 mm Tolerance of Vv at 1 mA: ± 10 % Max. AC voltage Taped and reeled (1000 pcs/reel ) Sealed type Electrical data: Maximum Ratings (85°C): Max. operating AC voltage Max. operating DC voltage Surge current (8/20µs) 1 time Energy absorption (2ms) 1 time Average power dissipation VRMS VDC Imax Wmax Pmax = = = = = 250V 320V 1200A 19.0J 0.25W VV VC,max C = = = 390V ± 10% 650V 105pF < 0.5 ns -40 ... +85 °C -40 ... +125 °C Characteristics (25°C): Varistor voltage at 1mA Clamping voltage at 10A (8/20µs) Typ. capacitance at 1 kHz Response time Operating temperature Storage temperature (mounted parts) KB VS PE Please read Cautions and warnings and Important notes at the end of this document. 2009-02-16 Page 2 of 13 Ceramic transient voltage suppressors SMD Varistors, Monolithic (CU) B72660M0251K093 CU4032K250G2K1 V/I characteristic VAR9343A 5000 v 4000 V 2000 1000 800 600 400 200 100 80 60 50 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 10 2 10 3 A 10 4 i Derating 10000 i max. tr 1000 1x 100 2x 10 x 10^2 x 10^3 x 10^4 x 10^5 x 10^6 x 10 inf.. 1 0,1 10 100 1000 10000 祍] t r [祍 KB VS PE Please read Cautions and warnings and Important notes at the end of this document. 2009-02-16 Page 3 of 13 Ceramic transient voltage suppressors SMD Varistors, Monolithic (CU) B72660M0251K093 CU4032K250G2K1 Temperature derating Max. current, energy, operating voltage and average power dissipation dissipation depending on ambient temperature % 100 90 80 70 60 50 40 30 20 10 0 -55 70 80 90 100 110 120 Ambient temperature 130 140 150 °C Part dimensions L H X AL L = 10,2 +/- 0,3 mm B = 8,0 +/- 0,3 mm H = 4,5 +/- 0,3 mm AL = 1,5 +/- 0,3 mm Xmax = 0,3 mm B Recommended solder pad layout B C A B A A = 3.5 mm B = 2.8 mm C = 6.5 mm D = 12.1 mm D KB VS PE Please read Cautions and warnings and Important notes at the end of this document. 2009-02-16 Page 4 of 13 Ceramic transient voltage suppressors SMD Varistors, Monolithic (CU) B72660M0251K093 CU4032K250G2K1 Recommended soldering temperature profiles Reflow soldering temperature profile tp Tp Temperature Ramp-up Critical zone TL to Tp TL tL T Smax T Smin Ramp-down t S Preheat 25 t 25 ˚C to peak Time TPT0892-3-E Profile feature Sn-Pb eutectic assembly Pb-free assembly Average ramp-up rate (TSmax to Tp) 3 °C/ second max. 3 °C/ second max. Preheat - Temperature min (TSmin) - Temperature max (TSmax) - Time (tSmin to tSmax) 100 °C 150 °C 60 … 120 seconds 150 °C 200 °C 60 … 180 seconds Time maintained above - Temperature min (TL) - Time (tL) 183 °C 60 … 150 seconds 217 °C 60 … 150 seconds Peak classification temperature (Tp) 220 °C … 240 °C 240 °C … 260 °C Time within 5 °C of actual peak temperature (tp) 10 … 30 seconds 20 … 40 seconds Ramp-down rate 6 °C/ second max. 6 °C/ second max. Time 25 °C to peak temperature 6 minutes max. 8 min utes max. Notes: All temperatures refer to topside of the package, measured on the package body surface. Max. number of reflow cycles: 3 KB VS PE Please read Cautions and warnings and Important notes at the end of this document. 2009-02-16 Page 5 of 13 Ceramic transient voltage suppressors SMD Varistors, Monolithic (CU) B72660M0251K093 CU4032K250G2K1 Wave soldering temperature profile Temperature characteristic at component terminal with dual-wave soldering 300 Normal curve Limit curves 10 s ˚C Temperature 250 235 ˚C ... 260 ˚C 2nd wave 200 1st wave 5 K/s 2 K/s approx. 200 K/s 150 100 ˚C ... 130 ˚C 100 50 2 K/s Forced cooling 0 0 50 100 150 200 s 250 Time KKE0144-J-E Soldering guidelines The usage of mild, non-activated fluxes for soldering is recommended, as well as proper cleaning of the PCB. The components are suitable for reflow soldering to JEDEC J-STD-020C. Storage condition
As far as possible, the components should be employed within 24 months after delivery from EPCOS.
They should be left in their original packings to avoid soldering problems due to oxidized contacts.
Storage temperature: − 25 up to + 45°C.
Relative humidity: < 75 % annual average, < 95 % on max. 30 days in a year. Taping and packaging KB VS PE Please read Cautions and warnings and Important notes at the end of this document. 2009-02-16 Page 6 of 13 Ceramic transient voltage suppressors SMD Varistors, Monolithic (CU) B72660M0251K093 CU4032K250G2K1 Tape and reel packing according to IEC 60286-3 P 0 T P 2 D 0 F G B 0 W E Tape material: Blister T 1 T T A 0 1 P 1 2 Direction of unreeling Dimensions and tolerances Definition Symbol Dimension Tolerance [mm] [mm] Compartment width A0 8.6 ±0.2 Compartment length B0 10.6 ±0.2 Sprocket hole diameter D0 1.5 +0.1 /-0 Sprocket hole pitch P0 4.0 ±0.1 1) Distance center hole to center compartment P2 2.0 ±0.05 Pitch of the component compartments P1 12.0 ±0.1 Tape width Distance edge to center of hole Distance center hole to center compartment Distance compartment to edge Overall thickness W E F G T2 16.0 1.75 7.5 0.75 5.5 ±0.3 ±0.1 ±0.05 min. max. Thickness tape T 0.3 max. ≤ ± 0.2 mm over any 10 pitches Package: 16-mm tape 1) Packing Packing material: Plastic KB VS PE Please read Cautions and warnings and Important notes at the end of this document. 2009-02-16 Page 7 of 13 Ceramic transient voltage suppressors SMD Varistors, Monolithic (CU) B72660M0251K093 CU4032K250G2K1 Reel dimensions 40 min. empty cavities A Direction of unreeling Tape end (trailer) Leader W1 13±0.2 25 min. empty cavities _0 ø60 +2 W2 300 mm cover tape KKE0058-I Dinition Symbol Dimension Tolerance [mm] [mm] A 330 +0 / -2 Reel width (inside) W1 16.4 +1.5 /-0 Reel width (outside) W2 22.4 max. Reel diameter Packing unit: 1000 pcs. / reel KB VS PE Please read Cautions and warnings and Important notes at the end of this document. 2009-02-16 Page 8 of 13 Ceramic transient voltage suppressors SMD Varistors, Monolithic (CU) B72660M0251K093 CU4032K250G2K1 Cautions and warnings General Some parts of this publication contain statements about the suitability of our ceramic transient voltage suppressor (CTVS) components (multilayer varistors (MLVs), CeraDiodes, ESD/EMI filters, SMD disk varistors (CU types), leaded transient voltage/ RFI suppressors (SHCV types)) for certain areas of application, including recommendations about incorporation/design-in of these products into customer applications. The statements are based on our knowledge of typical requirements often made of our CTVS devices in the particular areas. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our CTVS components for a particular customer application. As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always incumbent on the customer to check and decide whether the CTVS devices with the properties described in the product specification are suitable for use in a particular customer application. • Do not use EPCOS CTVS components for purposes not identified in our specifications, application notes and data books. • Ensure the suitability of a CTVS in particular by testing it for reliability during design-in. Always evaluate a CTVS component under worst-case conditions. • Pay special attention to the reliability of CTVS devices intended for use in safety-critical applications (e.g. medical equipment, automotive, spacecraft, nuclear power plant). Design notes • Always connect a CTVS in parallel with the electronic circuit to be protected. • Consider maximum rated power dissipation if a CTVS has insufficient time to cool down between a number of pulses occurring within a specified isolated time period. Ensure that electrical characteristics do not degrade. • Consider derating at higher operating temperatures. Choose the highest voltage class compatible with derating at higher temperatures. • Surge currents beyond specified values will puncture a CTVS. In extreme cases a CTVS will burst. • If steep surge current edges are to be expected, make sure your design is as low-inductance as possible. • In some cases the malfunctioning of passive electronic components or failure before the end of their service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In applications requiring a very high level of operational safety and especially when the malfunction or failure of a passive electronic component could endanger human life or health (e.g. in accident prevention, life-saving systems, or automotive battery line applications such as clamp 30), ensure by suitable design of the application or other measures (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of such a malfunction or failure. Only use CTVS components from the AUTO series in safety-relevant applications. KB VS PE Please read Cautions and warnings and Important notes at the end of this document. 2009-02-16 Page 9 of 13 Ceramic transient voltage suppressors SMD Varistors, Monolithic (CU) • B72660M0251K093 CU4032K250G2K1 Specified values only apply to CTVS components that have not been subject to prior electrical, mechanical or thermal damage. The use of CTVS devices in line-to-ground applications is therefore not advisable, and it is only allowed together with safety countermeasures like thermal fuses. Storage • Only store CTVS in their original packaging. Do not open the package before storage. • Storage conditions in original packaging: temperature −25 to +45°C, relative humidity ≤75% annual average, maximum 95%, dew precipitation is inadmissible. • Do not store CTVS devices where they are exposed to heat or direct sunlight. Otherwise the packaging material may be deformed or CTVS may stick together, causing problems during mounting. • Avoid contamination of the CTVS surface during storage, handling and processing. • Avoid storing CTVS devices in harmful environments where they are exposed to corrosive gases for example (SOx, Cl). • Use CTVS as soon as possible after opening factory seals such as polyvinyl-sealed packages. • Solder CTVS components after shipment from EPCOS within the time specified: o CTVS with Ni barrier termination, 12 months o CTVS with AgPd termination, 6 months o SHCV and CU series, 24 months Handling • Do not drop CTVS components and allow them to be chipped. • Do not touch CTVS with your bare hands - gloves are recommended. • Avoid contamination of the CTVS surface during handling. Mounting • When CTVS devices are encapsulated with sealing material or overmolded with plastic material, be sure to observe the precautions in “Mounting instructions”, “Sealing, potting and overmolding”. • Make sure an electrode is not scratched before, during or after the mounting process. • Make sure contacts and housings used for assembly with CTVS components are clean before mounting. KB VS PE Please read Cautions and warnings and Important notes at the end of this document. 2009-02-16 Page 10 of 13 Ceramic transient voltage suppressors SMD Varistors, Monolithic (CU) B72660M0251K093 CU4032K250G2K1 • The surface temperature of an operating CTVS can be higher. Ensure that adjacent components are placed at a sufficient distance from a CTVS to allow proper cooling. • Avoid contamination of the CTVS surface during processing. • Multilayer varistors (MLVs) with AgPd termination are not approved for lead-free soldering. Soldering • Complete removal of flux is recommended to avoid surface contamination that can result in an instable and/or high leakage current. • Use resin-type or non-activated flux. • Bear in mind that insufficient preheating may cause ceramic cracks. • Rapid cooling by dipping in solvent is not recommended, otherwise a component may crack. Conductive adhesive gluing • Only multilayer varistors (MLVs) with an AgPd termination are approved for conductive adhesive gluing. Operation • Use CTVS only within the specified operating temperature range. • Use CTVS only within specified voltage and current ranges. • Environmental conditions must not harm a CTVS. Only use them in normal atmospheric conditions. Reducing the atmosphere (e.g. hydrogen or nitrogen atmosphere) is prohibited. • Prevent a CTVS from contacting liquids and solvents. Make sure that no water enters a CTVS (e.g. through plug terminals). • Avoid dewing and condensation. • EPCOS CTVS components are mainly designed for encased applications. Under all circumstances avoid exposure to: o direct sunlight o rain or condensation o steam, saline spray o corrosive gases o atmosphere with reduced oxygen content KB VS PE Please read Cautions and warnings and Important notes at the end of this document. 2009-02-16 Page 11 of 13 Ceramic transient voltage suppressors SMD Varistors, Monolithic (CU) B72660M0251K093 CU4032K250G2K1 • EPCOS CTVS devices are not suitable for switching applications or voltage stabilization where static power dissipation is required. • Multilayer varistors (MLVs) are designed for ESD protection and transient suppression. CeraDiodes are designed for ESD protection only, ESD/EMI filters are designed for ESD and EMI protection only. This listing does not claim to be complete, but merely reflects the experience of EPCOS AG. KB VS PE Please read Cautions and warnings and Important notes at the end of this document. 2009-02-16 Page 12 of 13 Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether an EPCOS product with the properties described in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more detailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 6. Unless otherwise agreed in individual contracts, all orders are subject to the current version of the “General Terms of Delivery for Products and Services in the Electrical Industry” published by the German Electrical and Electronics Industry Association (ZVEI). 7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CSMP, CSSP, CTVS, DSSP, MiniBlue, MKK, MLSC, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.epcos.com/trademarks. Page 13 of 13