Inductors
VHF chokes
Series/Type:
B82111E
Date:
June 2012
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© EPCOS AG 2015. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
EPCOS AG is a TDK Group Company.
VHF chokes
B82111E
Rated voltage 500 V AC/DC
Rated current 0.1 ... 6 A
Rated inductance 7 ... 1200 µH
Construction
■ Ferrite cylinder core
■ Winding: single-layer, enamel copper wire
■ Polyester insulating sleeve
Features
■
■
■
■
■
High resonant frequency
Wide inductance range
Design complies with EN 60938
Suitable for wave soldering
RoHS-compatible
Applications
■ RF blocking and filtering
■ Interference suppression in small appliances
■ Decoupling in telecommunications
and entertainment electronics
Terminals
■ Central axial leads
■ Base material Cu
■ Hot-dip tinned with pure tin
Marking
LR and IR in clear text
Delivery mode and packing unit
■ Taped and reeled
■ Packing unit: 1000 pcs./reel
Please read Cautions and warnings and
Important notes at the end of this document.
2
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VHF chokes
B82111E
Dimensional drawing
73 _ 1
*)
*)
IND0151-A
1.2 max.
27.4 max.
*)
30 min.
10±0.5 10±0.5
d max.
9±0.5
ø0.8
26 max.
Tolerance over 10 spacings ±2 mm
Dimensions in mm
IND0150-S-E
Reel packing
325
B82111E*C020, C029
97+1
109 max.
IND0625-B
ø30.5±0.15
ø360 _ 1
ø126+1
ø133
B82111E*C021 … C028
30
95+1
30
Label
107 max.
IND0451-4-E
Dimensions in mm
Please read Cautions and warnings and
Important notes at the end of this document.
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VHF chokes
B82111E
Technical data and measuring conditions
Test voltage Vtest
2500 V AC, 1 min
Rated inductance LR
Measured with LCR meter Agilent 4284A
or impedance analyzer Agilent 4294A
Measuring frequency:
LR 10 H
= 1 MHz
10 H < LR 1000 H = 100 kHz
LR 1000 H
= 10 kHz
Measuring voltage:
1V
Measuring temperature: +20 °C
Inductance tolerance
20%
Rated temperature TR
+60 °C
Rated current IR
Maximum permissible DC current at rated temperature
DC resistance Rtyp
Measured at +20 C, tolerance 20%, typical values
Resonance frequency fres
Measured with Agilent 4294A or 8753ES, +20 °C,
tolerance 30%
Solderability (lead-free)
Sn95.5Ag3.8Cu0.7: +(245 5) °C, (3 0.3) s
Wetting of soldering area 90%
(to IEC 60068-2-20, test Ta)
Resistance to soldering heat
(wave soldering)
+(260 5) °C, 10 s
(to IEC 60068-2-20, test Tb)
Tensile strength of leads
30 N (to IEC 60068-2-21, test Ua)
Climatic category
55/125/56 (to IEC 60068-1)
Storage conditions
Mounted: –55 °C … +125 °C
Packaged: –25 °C … +40 °C, 75% RH
Mounting information
When bending the leads, take care that the bending point is at least 3 mm apart from the face ends
of the core and that the start-of-winding areas are not subjected to any mechanical stress.
Please read Cautions and warnings and
Important notes at the end of this document.
4
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VHF chokes
B82111E
Characteristics and ordering codes
Dimensions
dmax
mm
IR
LR
Rtyp
fres
Approx.
weight
g
A
H
MHz
0.1
1200
34
16
2.2
6.0
B82111E0000C029
0.2
680
14
19
2.2
6.0
B82111E0000C028
0.3
470
6.5
25
2.3
6.0
B82111E0000C027
0.5
220
2.6
32
2.3
6.5
B82111E0000C026
1
100
0.65
55
2.5
6.5
B82111E0000C025
1.5
56
0.30
70
2.7
6.5
B82111E0000C024
2
40
0.18
90
3.0
7.0
B82111E0000C023
3
22
0.07
110
3.3
7.0
B82111E0000C022
4
12
0.04
140
3.5
7.5
B82111E0000C021
6
7
0.02
180
3.6
7.5
B82111E0000C020
Current derating Iop/IR
versus ambient temperature TA
(rated temperature TR = +60 °C)
Impedance |Z| versus frequency f
measured with impedance analyzer Agilent
4294A or S-parameter network analyzer
Agilent 8753ES, typical values at +20 °C
Ω
Z|
10 5
I op
IR
B82111E
C029
C028
C027
C026
IND0143-T-E
1.2
IND0152-S
10 6
Ordering code
1.0
0.8
0.6
10 4
0.4
C025
C024
C023
C022
C021
C020
10 3
10 2 6
10
0.2
0
10 7
10 8
Hz
f
Please read Cautions and warnings and
Important notes at the end of this document.
0
10 9
20
40
60
80
100
˚C
TA
5
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140
Cautions and warnings
■ Please note the recommendations in our Inductors data book (latest edition) and in the data
sheets.
– Particular attention should be paid to the derating curves given there.
– The soldering conditions should also be observed. Temperatures quoted in relation to wave
soldering refer to the pin, not the housing.
■ If the components are to be washed varnished it is necessary to check whether the washing
varnish agent that is used has a negative effect on the wire insulation, any plastics that are used,
or on glued joints. In particular, it is possible for washing varnish agent residues to have a
negative effect in the long-term on wire insulation.
Washing processes may damage the product due to the possible static or cyclic mechanical
loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,
which might lead to reduced reliability or lifetime.
■ The following points must be observed if the components are potted in customer applications:
– Many potting materials shrink as they harden. They therefore exert a pressure on the plastic
housing or core. This pressure can have a deleterious effect on electrical properties, and in
extreme cases can damage the core or plastic housing mechanically.
– It is necessary to check whether the potting material used attacks or destroys the wire
insulation, plastics or glue.
– The effect of the potting material can change the high-frequency behaviour of the components.
■ Ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to
breakage of the core.
■ Even for customer-specific products, conclusive validation of the component in the circuit can
only be carried out by the customer.
Please read Cautions and warnings and
Important notes at the end of this document.
6
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Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for certain
areas of application. These statements are based on our knowledge of typical requirements that are
often placed on our products in the areas of application concerned. We nevertheless expressly point
out that such statements cannot be regarded as binding statements about the suitability of our
products for a particular customer application. As a rule we are either unfamiliar with individual
customer applications or less familiar with them than the customers themselves. For these reasons, it is
always ultimately incumbent on the customer to check and decide whether a product with the properties
described in the product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or failure
before the end of their usual service life cannot be completely ruled out in the current state of the
art, even if they are operated as specified. In customer applications requiring a very high level of
operational safety and especially in customer applications in which the malfunction or failure of an
electronic component could endanger human life or health (e.g. in accident prevention or life-saving
systems), it must therefore be ensured by means of suitable design of the customer application or other
action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or
damage is sustained by third parties in the event of malfunction or failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this publication
may contain substances subject to restrictions in certain jurisdictions (e.g. because they are
classed as hazardous). Useful information on this will be found in our Material Data Sheets on the
Internet (www.tdk-electronics.tdk.com/material). Should you have any more detailed questions, please
contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications contained
in this publication are still applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products. Consequently, we
cannot guarantee that all products named in this publication will always be available. The
aforementioned does not apply in the case of individual agreements deviating from the foregoing for
customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms and
Conditions of Supply.
7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard. The
IATF certifications confirm our compliance with requirements regarding the quality management system
in the automotive industry. Referring to customer requirements and customer specific requirements
(“CSR”) TDK always has and will continue to have the policy of respecting individual agreements. Even
if IATF 16949 may appear to support the acceptance of unilateral requirements, we hereby like to
emphasize that only requirements mutually agreed upon can and will be implemented in our
Quality Management System. For clarification purposes we like to point out that obligations from IATF
16949 shall only become legally binding if individually agreed upon.
8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS,
DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, MotorCap,
PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI,
SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap are
trademarks registered or pending in Europe and in other countries. Further information will be found
on the Internet at www.tdk-electronics.tdk.com/trademarks.
Release 2018-10
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