GC11010004
SPEC. No. C-General-j
DELIVERY SPECIFICATION
D A T E :
Oct, 20 20
To
Non-Controlled Copy
Upon the acceptance of this spec. previous
spec. (C2011-0454) shall be abolished.
CUSTOMER’S PRODUCT NAME
TDK’S PRODUCT NAME
Multilayer Ceramic Chip Capacitors
Bulk and tape packaging【RoHS compliant】
C0402,C0603,C1005,C1608,C2012,C3216,
C3225,C4532,C5750 Type
C0G,CH,X5R,X6S,X7R,X7S,X7T,B Characteristics
Please return this specification to TDK representatives with your signature.
If orders are placed without returned specification, please allow us to judge that specification is
accepted by your side.
RECEIPT CONFIRMATION
DATE:
TDK Corporation
Sales
Electronic Components
Sales & Marketing Group
APPROVED
Person in charge
YEAR
MONTH
DAY
Engineering
Electronic Components Business Company
Ceramic Capacitors Business Group
APPROVED
CHECKED
Person in charge
GC11010004
Regarding C0603 to C5750 type products, please refer to page 2 and after.
C0603 to C5750 type
Regarding C0402 type products, please refer to page 42 and after .
C0402 type
—1—
GC11010004
C0603 to C5750 type
■CATALOG NUMBER CONSTRUCTION
C
(1)
3216
(2)
X5R
1A
(3)
107
(4)
(5)
M
(6)
160
(7)
A
(8)
C
(9)
(1) Series
(2) Dimensions L x W (mm)
Code
EIA
Length
Width
0603
1005
1608
2012
3216
3225
4532
5750
CC0201
CC0402
CC0603
CC0805
CC1206
CC1210
CC1812
CC2220
0.60
1.00
1.60
2.00
3.20
3.20
4.50
5.70
0.30
0.50
0.80
1.25
1.60
2.50
3.20
5.00
(3) Temperature characteristics
Temperature
Temperature coefficient
characteristics
or capacitance change
CH
0±60 ppm/℃
0±30 ppm/℃
C0G
JB
±10%
X5R
±15%
X6S
±22%
X7R
±15%
X7S
±22%
Temperature
range
-25 to +85℃
-55 to +125℃
-25 to +85℃
-55 to +85℃
-55 to +105℃
-55 to +125℃
-55 to +125℃
(4) Rated voltage (DC)
Code
Voltage (DC)
0G
4V
0J
6.3V
1A
10V
1C
16V
1E
25V
1V
35V
1H
50V
75V
1N
(6) Capacitance tolerance
Code
Tolerance
B
±0.10pF
C
±0.25pF
D
±0.50pF
F
±1%
G
±2%
J
±5%
K
±10%
M
±20%
(7) Thickness
Code
Thickness
020
0.20mm
030
0.30mm
050
0.50mm
060
0.60mm
080
0.80mm
085
0.85mm
115
1.15mm
125
1.25mm
130
1.30mm
160
1.60mm
200
2.00mm
230
2.30mm
250
2.50mm
280
2.80mm
320
3.20mm
(8) Packaging style
Code
A
B
K
(5) Nominal capacitance (pF)
The capacitance is expressed in three digit codes and in
units of pico Farads (pF). The first and second digits
identify the first and second significant figures of the
capacitance. The third digit identifies the multiplier. R
designates a decimal point.
(Example)
Terminal
width
0.10
0.10
0.20
0.20
0.20
0.20
0.20
0.20
0R5 = 0.5pF
101 = 100pF
225 = 2,200,000pF = 2.2μF
—2—
Style
178mm reel, 4mm pitch
178mm reel, 2mm pitch
178mm reel, 8mm pitch
(9) Special reserved code
Code
Description
A,B,C
TDK internal code
GC11010004
■CATALOG NUMBER CONSTRUCTION
C
(1)
5750
(2)
X7S
2A
(3)
226
(4)
(5)
M
(6)
280
(7)
K
(8)
B
(9)
(1) Series
(2) Dimensions L x W (mm)
Code
EIA
Length
Width
1005
1608
2012
3216
3225
4532
5750
CC0402
CC0603
CC0805
CC1206
CC1210
CC1812
CC2220
1.00
1.60
2.00
3.20
3.20
4.50
5.70
0.50
0.80
1.25
1.60
2.50
3.20
5.00
Terminal
width
0.10
0.20
0.20
0.20
0.20
0.20
0.20
(3) Temperature characteristics
Temperature
Temperature coefficient Temperature
range
characteristics
or capacitance change
CH
0±60 ppm/℃
-25 to +85℃
0±30 ppm/℃
-55 to +125℃
C0G
-25 to +85℃
JB
±10%
-55 to +85℃
X5R
±15%
X6S
±22%
-55 to +105℃
X7R
±15%
-55 to +125℃
X7S
±22%
-55 to +125℃
X7T
+22,-33%
-55 to +125℃
(4) Rated voltage (DC)
Code
Voltage (DC)
2A
100V
2E
250V
(6) Capacitance tolerance
Code
Tolerance
C
±0.25pF
D
±0.50pF
F
±1%
G
±2%
J
±5%
K
±10%
M
±20%
(7) Thickness
Code
Thickness
050
0.50mm
060
0.60mm
080
0.80mm
085
0.85mm
115
1.15mm
125
1.25mm
130
1.30mm
160
1.60mm
200
2.00mm
230
2.30mm
250
2.50mm
280
2.80mm
320
3.20mm
(8) Packaging style
2V
350V
Code
Style
2W
450V
A
178mm reel, 4mm pitch
2J
630V
B
K
178mm reel, 2mm pitch
178mm reel, 8mm pitch
(5) Nominal capacitance (pF)
The capacitance is expressed in three digit codes and in
units of pico Farads (pF). The first and second digits
identify the first and second significant figures of the
capacitance. The third digit identifies the multiplier. R
designates a decimal point.
(Example)
0R5 = 0.5pF
101 = 100pF
225 = 2,200,000pF = 2.2μF
—3—
(9) Special reserved code
Code
Description
A,B,C,N
TDK internal code
GC11010004
SCOPE
This delivery specification shall be applied to Multilayer ceramic chip capacitors to be delivered to
.
PRODUCTION PLACES
Production places defined in this specification shall be TDK Corporation, TDK(Suzhou)Co.,Ltd
and TDK Components U.S.A.,Inc.
PRODUCT NAME
The name of the product to be defined in this specifications shall be C◇◇◇◇○○○△△□□□×.
REFERENCE STANDARD
JIS C 5101－1：2010
C 5101－21：2014
Fixed capacitors for use in electronic equipment-Part 1: Generic specification
Fixed capacitors for use in electronic equipment-Part 21 : Sectional specification
: Fixed surface mount multilayer capacitors of ceramic dielectric,Class1
C 5101－22：2014 Fixed capacitors for use in electronic equipment-Part 22 : Sectional specification
: Fixed surface mount multilayer capacitors of ceramic dielectric,Class2
Packaging of components for automatic handling - Part 3: Packaging of
C 0806－3：2014
surface mount components on continuous tapes
JEITA RCR－2335 C 2014 Safety application guide for fixed ceramic capacitors for use in electronic
equipment
CONTENTS
1. CODE CONSTRUCTION
2. COMBINATION OF RATED CAPACITANCE AND TOLERANCE
3. OPERATING TEMPERATURE RANGE
4. STORING CONDITION AND TERM
5. P.C. BOARD
6. INDUSTRIAL WASTE DISPOSAL
7. PERFORMANCE
8. INSIDE STRUCTURE AND MATERIAL
9. PACKAGING
10. RECOMMENDATION
11. SOLDERING CONDITION
12. CAUTION
13. TAPE PACKAGING SPECIFICATION
When the mistrust in the spec arises, this specification is given priority. And it will be confirmed by written
spec change after conference of both posts involved.
This specification warrants the quality of the ceramic chip capacitor. Capacitors should be evaluated or
confirmed a state of mounted on your product.
If the use of the capacitors goes beyond the bounds of this specification, we can not afford to guarantee.
Division
Date
SPEC. No.
Ceramic Capacitors Business Group
Oct, 2020
C-General-j
—4—
GC11010004
1. CODE CONSTRUCTION
(Example)
C2012
(1)
X7R
(2)
1E
(3)
225
(4)
K
(5)
(1) Case size
T
(6)
ΟΟΟΟ
(7)
Terminal electrode
B
L
G
W
B
T
Internal electrode
Ceramic dielectric
Dimensions (mm)
W
T
0.30±0.03
0.30±0.03
C0603
(CC0201)
0.30±0.05
0.30±0.05
0.50±0.05
0.50±0.05
C1005
0.50±0.10
0.50±0.10
[CC0402]
+0.15
+0.15
0.50
0.50
- 0.10
- 0.10
0.80±0.10
0.80±0.10
C1608
+0.15
+0.15
0.80
0.80
- 0.10
- 0.10
[CC0603]
0.80±0.20
0.80±0.20
0.60±0.15
2.00±0.20
1.25±0.20
0.85±0.15
C2012
1.25±0.20
[CC0805]
+0.25
+0.25
+0.25
2.00
1.25
1.25
- 0.15
- 0.15
- 0.15
0.60±0.15
0.85±0.15
3.20±0.20
1.60±0.20
1.15±0.15
C3216
1.30±0.20
[CC1206]
1.60±0.20
+0.30
+0.30
+0.30
3.20
1.60
1.60
- 0.10
- 0.10
- 0.10
1.25±0.20
1.60±0.20
2.00±0.20
3.20±0.40
2.50±0.30
C3225
2.30±0.20
[CC1210]
2.50±0.30
+0.45
+0.35
+0.35
3.20
2.50
2.50
- 0.40
- 0.30
- 0.30
1.60±0.20
2.00±0.20
2.30±0.20
C4532
4.50±0.40
3.20±0.40
[CC1812]
2.50±0.30
2.80±0.30
3.20±0.30
* As for each item, please refer to detail page on TDK web.
Case size
[EIA style]
L
0.60±0.03
0.60±0.05
1.00±0.05
1.00±0.10
+0.15
1.00
- 0.10
1.60±0.10
+0.15
1.60
- 0.10
1.60±0.20
—5—
B
G
0.10 min.
0.20 min.
0.10 min.
0.30 min.
0.20 min.
0.30 min.
0.20 min.
0.50 min.
0.20 min.
1.00 min.
0.20 min.
――
0.20 min.
――
GC11010004
Case size
[EIA style]
L
C5750
[CC2220]
5.70±0.40
Dimensions (mm)
T
1.60±0.20
2.00±0.20
2.30±0.20
5.00±0.40
2.50±0.30
2.80±0.30
W
B
G
0.20 min.
――
* As for each item, please refer to detail page on TDK web.
(2) Temperature Characteristics
* Details are shown in table 1 No.6 and No.7 at 7.PERFORMANCE
(3) Rated Voltage
Symbol
Rated Voltage
Symbol
Rated Voltage
2J
DC 630 V
1V
DC 35 V
2W
DC 450 V
1E
DC 25 V
2V
DC 350 V
1C
DC 16 V
2E
DC 250 V
1A
DC 10 V
2A
DC 100 V
0J
DC 6.3 V
1N
DC 75 V
0G
DC 4 V
1H
DC 50 V
(4) Rated Capacitance
Stated in three digits and in units of pico farads (pF).
The first and Second digits identify the first and second
significant figures of the capacitance, the third digit
identifies the multiplier.
R is designated for a decimal point.
(5) Capacitance tolerance
* M tolerance shall be standard
for over 10uF.
—6—
Symbol
Rated
Capacitance
2R2
2.2 pF
225
2,200,000 pF
Symbol
Tolerance
C
± 0.25 pF
D
± 0.5 pF
J
± 5%
K
± 10 %
*M
± 20 %
(6) Packaging
* C0603,C1005 type is applicable to tape packaging only.
(7) TDK internal code
(Example)
Capacitance
10pF and under
Over 10pF
Symbol
Packaging
B
Bulk
T
Taping
GC11010004
2. COMBINATION OF RATED CAPACITANCE AND TOLERANCE
Class
Temperature
Characteristics
Capacitance tolerance
Rated capacitance
C (± 0.25pF)
1, 2, 3, 4, 5
D (± 0.5pF)
6, 7, 8, 9, 10
Over 10pF
J (± 5 %)
E – 6 series
E – 12 series
10uF and under
K (± 10 %)
M (± 20 %)
10pF and under
C0G
CH
1
X5R
X6S
X7R
X7S
X7T
B
2
E – 6 series
Over 10uF
M (± 20 %)
Capacitance Step in E series
Capacitance Step
E series
1.0
E- 6
E-12
1.0
1.5
1.2
1.5
2.2
1.8
2.2
3.3
2.7
3.3
4.7
3.9
4.7
6.8
5.6
6.8
8.2
3. OPERATING TEMPERATURE RANGE
T.C.
Min. operating
Temperature
Max. operating
Temperature
Reference
Temperature
CH/B
-25°C
85°C
20°C
X5R
-55°C
85°C
25°C
X6S
-55°C
105°C
25°C
C0G/X7R/X7S/X7T
-55°C
125°C
25°C
4. STORING CONDITION AND TERM
Storing temperature
Storing humidity
Storing term
5~40°C
20~70%RH
Within 6 months
upon receipt.
5. P.C. BOARD
When mounting on an aluminum substrate, large case sizes such as C3225[CC1210] and larger
are more likely to be affected by heat stress from the substrate.
Please inquire separate specification for the large case sizes when mounted on the substrate.
6. INDUSTRIAL WASTE DISPOSAL
Dispose this product as industrial waste in accordance with the Industrial Waste Law.
—7—
GC11010004
7. PERFORMANCE
table 1
No.
Item
Performance
Test or inspection method
1
External Appearance
No defects which may affect
performance.
2
Insulation Resistance
Please refer to detail page on TDK Measuring voltage：Rated voltage
web.
(As for the capacitor of rated voltage
630V DC, apply 500V DC.)
Voltage application time：60s.
3
Voltage Proof
Withstand test voltage without
insulation breakdown or other
damage.
Inspect with magnifying glass (3×), in case
of C0603 type, with magnifying glass (10×)
Class
Rated
voltage(RV)
RV≦100V
3 × rated voltage
1
100V＜RV≦500V
1.5 × rated voltage
500V＜RV
1.3 × rated voltage
RV≦100V
2.5 × rated voltage
100V＜RV≦500V
1.5 × rated voltage
500V＜RV
1.3 × rated voltage
2
Apply voltage
Voltage application time : 1s.
Charge / discharge current : 50mA or lower
4
Capacitance
5
Q
Class1
Dissipation
Factor
Class2
Within the specified tolerance.
As for measuring condition, please contact
with our sales representative.
As for measuring condition, please
contact with our sales
representative.
See No.4 in this table for measuring
condition.
—8—
GC11010004
(continued)
No.
6
Item
Temperature
Characteristics
of Capacitance
(Class1)
Performance
T.C.
Temperature Coefficient
(ppm/°C)
C0G
0 ± 30
CH
0 ± 60
Capacitance
drift
7
Temperature
Characteristics
of Capacitance
(Class2)
Temperature coefficient shall be calculated
based on values at 25°C(CH:20°C) and
85°C temperature.
Measuring temperature below
25°C(CH:20°C) shall be -10°C and -25°C.
Within ± 0.2% or
± 0.05pF,
whichever larger.
Capacitance Change (%)
No voltage
applied
X5R : ±15
X6S : ±22
X7R : ±15
X7S : ±22
X7T : +22
- 33
B : ±10
Test or inspection method
With voltage
Applied
Please contact
with our sales
representative.
Capacitance shall be measured by the steps
shown in the following table after thermal
equilibrium is obtained for each step.
∆C be calculated ref. STEP3 reading
Step
Temperature(°C)
1
Reference temp. ± 2
2
Min. operating temp. ± 2
3
Reference temp. ± 2
4
Max. operating temp. ± 2
As for Min./Max. operating temp and
Reference temp., please refer to
“3. OPERATING TEMPERATURE RANGE”
Apply a voltage of 1/2 rated voltage.
As for measuring voltage , please contact
with our sales representative.
8
Robustness of
Terminations
No sign of termination coming off,
breakage of ceramic, or other
abnormal signs.
Reflow solder the capacitors on a
P.C.Board shown in Appendix 2.
Apply a pushing force gradually at the center
of a specimen in a horizontal direction of
P.C.board.
Pushing force : 5N
(2N is applied for C0603,C1005 type.)
Holding time : 10±1s
Pushing force
P.C.Board
Capacitor
9
Bending
No mechanical damage.
Reflow solder the capacitors on a P.C.Board
shown in Appendix1 and bend it for 1mm.
20
50
F
R230
1
45
45
(Unit : mm)
—9—
GC11010004
(continued)
No.
10
Item
Solderability
Performance
New solder to cover over 75% of
termination.
25% may have pin holes or rough
spots but not concentrated in one
spot.
Ceramic surface of A sections shall
not be exposed due to melting or
shifting of termination material.
Test or inspection method
Solder :
Sn-3.0Ag-0.5Cu
Flux :
Isopropyl alcohol (JIS K
8839) Rosin (JIS K 5902)
25% solid solution.
Solder temp. :
245±5°C
Dwell time :
3±0.3s.
Solder
position :
Until both terminations are
completely soaked.
A section
11
Resistance
to solder
heat
External
appearance
Solder :
Sn-3.0Ag-0.5Cu
Flux :
Isopropyl alcohol (JIS K
8839) Rosin (JIS K 5902)
25% solid solution.
Change from the
value before test
Solder temp. :
260±5°C
Capacitance drift
within ±2.5% or
±0.25pF,
whichever larger.
Dwell time :
10±1s.
No cracks are allowed and
terminations shall be covered at
least 60% with new solder.
Capacitance
Characteristics
Class
1
C0G
CH
Class
2
X5R
X6S
X7R
X7S
X7T
B
Solder
position :
± 7.5 %
Pre-heating :
Q
(Class1)
Meet the initial spec.
D.F.
Meet the initial spec.
(Class2)
Insulation
Resistance
Meet the initial spec.
Voltage
proof
No insulation breakdown or other
damage.
— 10 —
Until both terminations
are completely soaked.
Temp. ― 110~140°C
Time ― 30～60s.
Leave the capacitors in ambient
condition for
Class 1 : 6~24h
Class 2 : 24±2h before measurement.
GC11010004
(continued)
No.
12
Item
Vibration
External
Performance
Test or inspection method
No mechanical damage.
Frequency : 10~55~10Hz
Reciprocating sweep time : 1 min.
Amplitude : 1.5mm
Repeat this for 2h each in 3
perpendicular directions(Total 6h).
appearance
Capacitance
Characteristics
Class1
Class2
13
C0G
CH
X5R
X6S
X7R
X7S
X7T
B
Change from the
value before test
±2.5% or ±0.25pF,
whichever larger.
± 7.5 %
Q
(Class1)
Meet the initial spec.
D.F.
(Class2)
Meet the initial spec.
Temperature External
cycle
appearance
No mechanical damage.
Capacitance
Characteristics
Class1
Class2
C0G
CH
X5R
X6S
X7R
X7S
X7T
B
Change from the
value before test
Reflow solder the capacitors on a
P.C.Board shown in Appendix 2 before
testing.
Expose the capacitors in the condition
step1 through step 4 listed in the
following table.
Temp. cycle : 5 cycles
Step
Please contact
with our sales
representative.
Q
(Class1)
Meet the initial spec.
D.F.
(Class2)
Meet the initial spec.
Insulation
Resistance
Meet the initial spec.
Voltage
proof
No insulation breakdown or other
damage.
Temperature(°C)
Time (min.)
1
Min. operating
temp.±3
30 ± 3
2
Ambient Temp.
2~5
3
Max. operating
temp.±2
30 ± 2
4
Ambient Temp.
2~5
As for Min./Max. operating temp.,
please refer to “3. OPERATING
TEMPERATURE RANGE”
Leave the capacitors in ambient
condition for
Class 1 : 6~24h
Class 2 : 24±2h before measurement.
Reflow solder the capacitors on a
P.C.Board shown in Appendix2 before
testing.
— 11 —
GC11010004
(continued)
No.
14
Item
Moisture
Resistance
(Steady
State)
External
appearance
Performance
No mechanical damage.
Capacitance
Characteristics
Change from the
value before test
C0G
CH
X5R
X6S
X7R
X7S
X7T
B
Please contact
with our sales
representative.
Class1
Class2
Q
(Class1)
Test or inspection method
Capacitance
Q
30pF and over
350 min.
10pF and over
under 30pF
275+5/2×C min.
Under 10pF
200+10×C min.
C : Rated capacitance (pF)
D.F.
(Class2)
200% of initial spec. max.
Insulation
Resistance
Please contact with our sales
representative.
— 12 —
Test temp. : 40±2°C
Test humidity : 90~95%RH
Test time : 500 +24,0h
Leave the capacitors in ambient
condition for
Class 1 : 6~24h
Class 2 : 24±2h before measurement.
Reflow solder the capacitors on a
P.C.Board shown in Appendix2 before
testing.
GC11010004
(continued)
No.
15
Item
Moisture
Resistance
External
appearance
Performance
No mechanical damage.
Capacitance
Characteristics
Change from the
value before test
C0G
CH
X5R
X6S
X7R
X7S
X7T
B
Please contact
with our sales
representative.
Class1
Class2
Q
(Class1)
Test or inspection method
Test temp. : 40±2°C
Test humidity : 90~95%RH
Applied voltage : Rated voltage
Test time : 500 +24,0h
Charge/discharge current : 50mA or
lower
Leave the capacitors in ambient
condition for
Class 1 : 6~24h
Class 2 : 24±2h before measurement.
Reflow solder the capacitors on a
P.C.Board shown in Appendix2 before
testing.
Capacitance
Q
30pF and over
200 min.
Under 30pF
100+10/3×C min.
C : Rated capacitance (pF)
D.F.
(Class2)
200% of initial spec. max.
Insulation
Resistance
Please contact with our sales
representative.
— 13 —
Initial value setting (only for class 2)
Voltage conditioning 《After voltage
treat the capacitors under testing
temperature and voltage for 1 hour,》
leave the capacitors in ambient
condition for 24±2h before
measurement.
Use this measurement for initial value.
GC11010004
(continued)
No.
16
Item
Life
External
appearance
Performance
No mechanical damage.
Capacitance
Characteristics
Change from the
value before test
C0G
CH
X5R
X6S
X7R
X7S
X7T
B
Please contact
with our sales
representative.
Class1
Class2
Q
(Class1)
Test or inspection method
Test temp. : Maximum operating
temperature±2°C
Applied voltage : Please contact with
our sales representative.
Test time : 1,000 +48,0h
Charge/discharge current : 50mA or
lower
Leave the capacitors in ambient
condition for
Class 1 : 6~24h
Class 2 : 24±2h before measurement.
Reflow solder the capacitors on a
P.C.Board shown in Appendix2 before
testing.
Capacitance
Q
30pF and over
350 min.
10pF and over
under 30pF
Under 10pF
275+5/2×C min.
200+10×C min.
C : Rated capacitance (pF)
D.F.
(Class2)
200% of initial spec. max.
Insulation
Resistance
Please contact
representative.
Initial value setting (only for class 2)
Voltage conditioning 《After voltage
treat the capacitors under testing
temperature and voltage for 1 hour,》
leave the capacitors in ambient
condition for 24±2h before
measurement.
Use this measurement for initial value.
with our sales
*As for the initial measurement of capacitors (Class2) on number 7,11,12,13 and 14, leave capacitors at
150 0,-10°C for 1 hour and measure the value after leaving capacitors for 24 ± 2h in ambient condition.
— 14 —
GC11010004
Appendix1
P.C.Board for bending test
(C0603,C1005)
(C1608,C2012,C3216,C3225,C4532,C5750)
100
100
b
b
40
40
Solder resist
a
Solder resist
a
1.0
1.0
c
c
Copper
Copper
Appendix2
P.C. Board for reliability test
100
c
b
40
a
Copper
Solder resist
*Slit
* It is recommended to provide a slit on P.C.Board for C3225,C4532 and C5750.
（Unit：mm）
Symbol
a
b
c
C0603 [CC0201]
0.3
0.8
0.3
C1005 [CC0402]
0.4
1.5
0.5
C1608 [CC0603]
1.0
3.0
1.2
C2012 [CC0805]
1.2
4.0
1.65
C3216 [CC1206]
2.2
5.0
2.0
C3225 [CC1210]
2.2
5.0
2.9
C4532 [CC1812]
3.5
7.0
3.7
C5750 [CC2220]
4.5
8.0
5.6
Case size
1. Material
: Glass Epoxy(As per JIS C6484 GE4)
2. Thickness : Appendix 1 ― 0.8mm
― 1.6mm
: Appendix 2 ― 1.6mm
(C0603,C1005)
(C1608,C2012,C3216,C3225,C4532,C5750)
Copper(Thickness:0.035mm)
Solder resist
— 15 —
GC11010004
8. INSIDE STRUCTURE AND MATERIAL
3
4
5
2
1
MATERIAL
No.
NAME
1
Dielectric
2
Electrode
Class1
Class2
CaZrO 3
BaTiO 3
Nickel (Ni)
3
4
Copper (Cu)
Nickel (Ni)
Termination
5
Tin (Sn)
— 16 —
GC11010004
9. PACKAGING
Packaging shall be done to protect the components from the damage during transportation and storing, and a
label which has the following information shall be attached.
9.1 Each plastic bag for bulk packaging contains 1000pcs. And the minimum quantity for
Bulk packaging is 1000pcs.
9.2 Tape packaging is as per 13. TAPE PACKAGING SPECIFICATION.
* C0603[CC0201],C1005[CC0402] type is applicable to tape packaging only.
1) Inspection No.*
2) TDK P/N
3) Customer's P/N
4) Quantity
*Composition of Inspection No.
Example
F 0 A – 23 – 001
(a) (b) (c)
(d)
(e)
(a) Line code
(b) Last digit of the year
(c) Month and A for January and B for February and so on. (Skip I)
(d) Inspection Date of the month.
(e) Serial No. of the day
*Composition of new Inspection No.
(Implemented on and after May 1, 2019 in sequence)
Example
I
F
0
E
(a) (b) (c) (d)
2 3
A 0
0 1
(e)
(f)
(g)
(a) Prefix
(b) Line code
(c) Last digit of the year
(d) Month and A for January and B for February and so on. (Skip I)
(e) Inspection Date of the month.
(f) Serial No. of the day(00 ~ ZZ)
(g) Suffix(00 ~ ZZ)
* It was shifted to the new inspection No. on and after May 2019, but the implementation timing may be
different depending on shipment bases. Until the shift is completed, either current or new composition
of inspection No. will be applied.
10. RECOMMENDATION
As for C3225[CC1210] and larger, It is recommended to provide a slit (about 1mm width)
in the board under the components to improve washing Flux. And please make sure to dry
detergent up completely before.
11. SOLDERING CONDITION
As for C0603 [CC0201], C1005[CC0402], C3225[CC1210] and larger, reflow soldering only.
For other case sizes than the above, reflow soldering is recommended.
— 17 —
GC11010004
12. CAUTION
No.
Process
Condition
1
Operating
Condition
(Storage, Use,
Transportation)
1-1. Storage, Use
The capacitors must be stored in an ambient temperature of 5 to 40°C with a
relative humidity of 20 to 70%RH. JIS C 60721-3-1 Class 1K2 should be followed for
the other climatic conditions.
1) High temperature and humidity environment may affect a capacitor's solder ability
because it accelerates terminal oxidization. They also deteriorate performance of
taping and packaging. Therefore, SMD capacitors shall be used within 6 months.
For capacitors with terminal electrodes consisting of silver or silver-palladium which
tend to become oxidized or sulfurized, use as soon as possible, such as within one
month after opening the bag.
2) When capacitors are stored for a longer time period than 6 months, confirm the
solderability of the capacitors prior to use.
During storage, keep the minimum packaging unit in its original packaging without
opening it.
Do not deviate from the above temperature and humidity conditions even for a
short term.
3) Corrosive gasses in the air or atmosphere may result in deterioration of the
reliability, such as poor solderability of the terminal electrodes. Do not store
capacitors where they will be exposed to corrosive gas (e.g., hydrogen sulfide,
sulfur dioxide, chlorine ammonia etc.)
4) Solderability and electrical performance may deteriorate due to photochemical
change in the terminal electrode if stored in direct sunlight, or due to condensation
from rapid changes in humidity.
The capacitors especially which use resin material must be operated and stored in
an environment free of dew condensation, as moisture absorption due to
condensation may affect the performance.
5) Refer to JIS C 60721-3-1, class 1K2 for other climate conditions.
1-2. Handling in transportation
In case of the transportation of the capacitors, the performance of the capacitors
may be deteriorated depending on the transportation condition.
(Refer to JEITA RCR-2335C 9.2 Handling in transportation)
2
Circuit design
! Caution
△
E
A
2-1. Operating temperature
1) Upper category temperature (maximum operating temperature) is specified.
It is necessary to select a capacitor whose rated temperature us higher than the
operating temperature. Also, it is necessary to consider the temperature
distribution in the equipment and seasonal temperature variation.
2) Do not use capacitors above the maximum allowable operating temperature.
Surface temperature including self heating should be below maximum operating
temperature.
(Due to dielectric loss, capacitors will heat itself when AC is applied. Especially at
high frequencies around its SRF, the heat might be so extreme that it may damage
itself or the product mounted on. Please design the circuit so that the maximum
temperature of the capacitors including the self heating to be below the maximum
allowable operating temperature. Temperature rise at capacitor surface shall be
below 20°C)
3) The electrical characteristics of the capacitors will vary depending on the
temperature. The capacitors should be selected and designed in taking the
temperature into consideration.
2-2. When overvoltage is applied
Applying overvoltage to a capacitor may cause dielectric breakdown and result in
a short circuit. The duration until dielectric breakdown depends on the applied
voltage and the ambient temperature.
— 18 —
GC11010004
No.
2
Process
Circuit design
! Caution
△
A
E
A
Condition
2-3. Operating voltage
1) Operating voltage across the terminals should be below the rated voltage.
When AC and DC are super imposed, V0-P must be below the rated voltage.
— (1) and (2)
AC or pulse with overshooting, VP-P must be below the rated voltage.
— (3), (4) and (5)
When the voltage is started to apply to the circuit or it is stopped applying, the
irregular voltage may be generated for a transit period because of resonance or
switching. Be sure to use the capacitors within rated voltage containing these
Irregular voltage.
Voltage
(1) DC voltage
Positional
Measurement V 0-P
(Rated voltage)
V 0-P
R
R
0
Voltage
(2) DC+AC voltage
(3) AC voltage
V P-P 0
R
0
(4) Pulse voltage (A) (5) Pulse voltage (B)
Positional
Measurement V P-P
(Rated voltage)
V P-P 0
R
R
0
2) Even below the rated voltage, if repetitive high frequency AC or pulse is applied, the
reliability of the capacitors may be reduced.
3) The effective capacitance will vary depending on applied DC and AC voltages.
The capacitors should be selected and designed in taking the voltages into
consideration.
4) Abnormal voltage (surge voltage, static electricity, pulse voltage, etc.) shall not
exceed the rated voltage.
5) When capacitors are used in a series connection, it is necessary to add a balancing
circuit such as voltage dividing resistors in order to avoid an imbalance in the voltage
applied to each capacitor.
2-4. Frequency
When the capacitors (Class 2) are used in AC and/or pulse voltages, the
capacitors may vibrate themselves and generate audible sound.
— 19 —
GC11010004
No.
3
Process
Designing
P.C.board
Condition
The amount of solder at the terminations has a direct effect on the reliability of the
capacitors.
1) The greater the amount of solder, the higher the stress on the chip capacitors,
and the more likely that it will break. When designing a P.C.board, determine the
shape and size of the solder lands to have proper amount of solder on the
terminations.
2) Avoid using common solder land for multiple terminations and provide individual
solder land for each terminations.
3) Size and recommended land dimensions.
Chip capacitors
Solder land
C
B
Reflow soldering
Case size
Solder resist
A
C0603
[CC0201]
C1005
[CC0402]
C1608
[CC0603]
(Unit : mm)
C2012
[CC0805]
A
0.25 ~ 0.35
0.3 ~ 0.5
0.6 ~ 0.8
0.9 ~ 1.2
B
0.2 ~ 0.3
0.35 ~ 0.45
0.6 ~ 0.8
0.7 ~ 0.9
C
0.25 ~ 0.35
0.4 ~ 0.6
0.6 ~ 0.8
0.9 ~ 1.2
Case size
C3216
[CC1206]
C3225
[CC1210]
C4532
[CC1812]
C5750
[CC2220]
A
2.0 ~ 2.4
2.0 ~ 2.4
3.1 ~ 3.7
4.1 ~ 4.8
B
1.0 ~ 1.2
1.0 ~ 1.2
1.2 ~ 1.4
1.2 ~ 1.4
C
1.1 ~ 1.6
1.9 ~ 2.5
2.4 ~ 3.2
4.0 ~ 5.0
Symbol
Symbol
Flow soldering (Unrecommend)
Case size
C1608
[CC0603]
Symbol
(Unit : mm)
C2012
[CC0805]
C3216
[CC1206]
A
0.7 ~ 1.0
1.0 ~ 1.3
2.1 ~ 2.5
B
0.8 ~ 1.0
1.0 ~ 1.2
1.1 ~ 1.3
C
0.6 ~ 0.8
0.8 ~ 1.1
1.0 ~ 1.3
— 20 —
GC11010004
No.
3
Process
Designing
P.C.board
Condition
4) Recommended chip capacitors layout is as following.
Disadvantage against
bending stress
Advantage against
bending stress
Perforation or slit
Perforation or slit
Break P.C.board with
mounted side up.
Break P.C.board with
mounted side down.
Mounting
face
Mount perpendicularly to
perforation or slit
Perforation or slit
Mount in parallel with
perforation or slit
Perforation or slit
Chip
arrangement
(Direction)
Closer to slit is higher stress
ℓ1
Away from slit is less stress
ℓ2
Distance from
slit
( ℓ1 < ℓ2 )
— 21 —
( ℓ1 < ℓ2 )
GC11010004
No.
3
Process
Designing
P.C.board
Condition
5) Mechanical stress varies according to location of chip capacitors on the P.C.board.
E
Perforation
D
C
B
A
Slit
Stress force
A＞B＞E
A＞D＞E
A＞C
When dividing printed wiring boards, the intensities of mechanical stress applied to
capacitors are different according to each dividing method in the order of :
Push-back < Slit < V-groove < Perforation. Therefore consider not only position of
capacitors, but also the way of the dividing the printed wiring boards.
6) Layout recommendation
Example
Use of common
solder land
Lead wire
Chip
Solder
Soldering with
chassis
Use of common
solder land with
other SMD
Chassis
Excessive solder
Solder
land
Need to
avoid
Excessive solder
PCB Adhesive
Solder land
ℓ1
Missing solder
Solder
land
Lead wire
Solder resist
Solder resist
Recommendation
Solder resist
ℓ2
ℓ2 > ℓ1
— 22 —
GC11010004
No.
4
Process
Mounting
Condition
4-1. Stress from mounting head
If the mounting head is adjusted too low, it may induce excessive stress in the chip
capacitors to result in cracking. Please take following precautions.
1) Adjust the bottom dead center of the mounting head to reach on the P.C.board
surface and not press it.
2) Adjust the mounting head pressure to be 1 to 3N of static weight.
3) To minimize the impact energy from mounting head, it is important to provide
support from the bottom side of the P.C.board.
See following examples.
Not recommended
Single-sided
mounting
Recommended
Crack
Support pin
A support pin
is not to be
underneath
the capacitor.
Double-sides
mounting
Solder
peeling
Crack
Support pin
When the centering jaw is worn out, it may give mechanical impact on the
capacitors to cause crack. Please control the close up dimension of the centering
jaw and provide sufficient preventive maintenance and replacement of it.
4-2. Amount of adhesive
a
a
b
c
c
Example : C2012 [CC0805], C3216 [CC1206]
a
0.2mm min.
b
70 ~ 100μm
c
Do not touch the solder land
— 23 —
GC11010004
No.
Process
Condition
5
Soldering
5-1. Flux selection
Flux can seriously affect the performance of capacitors. Confirm the following to
select the appropriate flux.
1) It is recommended to use a mildly activated rosin flux (less than 0.1wt% chlorine).
Strong flux is not recommended.
2) Excessive flux must be avoided. Please provide proper amount of flux.
3) When water-soluble flux is used, enough washing is necessary.
5-2. Recommended soldering profile : Reflow method
Refer to the following temperature profile at Reflow soldering.
Reflow soldering
Preheating
Soldering
Natural cooling
Temp.. (°C)
Peak
Temp
∆T
0
Over 60 sec.
Peak Temp time
Reflow soldering is recommended for C1608,C2012,C3216 types, but only reflow
soldering is allowed for other case sizes.
5-3. Recommended soldering peak temp and peak temp duration for Reflow soldering
Pb free solder is recommended, but if Sn-37Pb must be used, refer to below.
Temp./Duration
Reflow soldering
Peak temp(°C)
Duration(sec.)
Lead Free Solder
260 max.
10 max.
Sn-Pb Solder
230 max.
20 max.
Solder
Recommended solder compositions
Lead Free Solder : Sn-3.0Ag-0.5Cu
— 24 —
GC11010004
Process
5
Soldering
Condition
5-4. Soldering profile : Flow method (Unrecommend)
Refer to the following temperature profile at Flow soldering.
Flow soldering
Soldering
Preheating
Natural cooling
Peak
Temp
Temp. (°C)
No.
△T
0
Over 60 sec.
Over 60 sec.
Peak Temp time
Reflow soldering is recommended for C1608,C2012,C3216 types.
5-5. Recommended soldering peak temp and peak temp duration for Flow soldering
Pb free solder is recommended, but if Sn-37Pb must be used, refer to below.
Temp./Duration
Flow soldering
Peak temp(°C)
Duration(sec.)
Lead Free Solder
260 max.
5 max.
Sn-Pb Solder
250 max.
3 max.
Solder
Recommended solder compositions
Lead Free Solder : Sn-3.0Ag-0.5Cu
5-6. Avoiding thermal shock
1) Preheating condition
Soldering
Reflow soldering
Flow soldering
2)
Case size
C0603(CC0201),C1005(CC0402),
C1608(CC0603),C2012(CC0805),
C3216(CC1206)
C3225(CC1210), C4532(CC1812),
C5750(CC2220)
C1608(CC0603),C2012(CC0805),
C3216(CC1206)
Temp. (°C)
∆T ≦ 150
∆T ≦ 130
∆T ≦ 150
Cooling condition
Natural cooling using air is recommended. If the chips are dipped into a solvent for
cleaning, the temperature difference (∆T) must be less than 100°C.
— 25 —
GC11010004
No.
Process
Condition
5
Soldering
5-7. Amount of solder
Excessive solder will induce higher tensile force in chip capacitors when
temperature changes and it may result in chip cracking. In sufficient solder may
detach the capacitors from the P.C.board.
Higher tensile force in
chip capacitors to cause
crack
Excessive
solder
Maximum amount
Minimum amount
Adequate
Low robustness may
cause contact failure or
chip capacitors come off
the P.C.board.
Insufficient
solder
5-8. Sn-Zn solder
Sn-Zn solder affects product reliability.
Please contact TDK in advance when utilize Sn-Zn solder.
5-9. Countermeasure for tombstone
The misalignment between the mounted positions of the capacitors and the land
patterns should be minimized. The tombstone phenomenon may occur especially
the capacitors are mounted (in longitudinal direction) in the same direction of the
reflow soldering.
(Refer to JEITA RCR-2335C Annex A (Informative), Recommendations to prevent
the tombstone phenomenon.)
— 26 —
GC11010004
No.
Process
6
Solder repairing
Condition
Solder repairing is unavoidable, refer to below.
6-1.Soldering rework using spot heater
Heat stress during rework may possibly be reduced by using a spot heater
(also called a “blower”) rather than a soldering iron.
It is applied only to adding solder in the case of insufficient solder amount.
1) Reworking using a spot heater may suppress the occurrence of cracks in the
capacitor compared to using a soldering iron. A spot heater can heat up a
capacitor uniformly with a small heat gradient which leads to lower thermal
stress caused by quick heating and cooling or localized heating.
Moreover, where ultra-small capacitors are mounted close together on a printed
circuit board, reworking with a spot heater can eliminate the risk of direct contact
between the tip of a soldering iron and a capacitor.
2) Rework condition
If the blower nozzle of a spot heater is too close to a capacitor, a crack in the
capacitor may occur due to heat stress. Below are recommendations for avoiding
such an occurrence.
Keep more than 5mm between a capacitor and a spot heater nozzle.
The blower temperature of the spot heater shall be lower than 400°C.
The airflow shall be set as weak as possible.
The diameter of the nozzle is recommended to be 2mm(one-outlet type).The size
is standard and common.
Duration of blowing hot air is recommended to be 10s or less for C1608(CC0603),
C2012(CC0805) and C3216(CC1206), and 30s or less for C3225(CC1210),
C4532(CC1812) and C5750(CC2220), considering surface area of the capacitor
and melting temperature of solder.
The angle between the nozzle and the capacitor is recommended to be
45degrees in order to work easily and to avoid partial area heating.
As is the case when using a soldering iron, preheating reduces thermal stress on
capacitors and improves operating efficiency.
・Recommended rework condition（Consult the component manufactures for details.）
Distance from nozzle
5mm and over
Nozzle angle
45degrees
Nozzle temp.
400°C and less
Set as weak as possible
(The airflow shall be the minimum value necessary for
solder to melt in the conditions mentioned above.)
⌀2mm（one-outlet type）
Airflow
Nozzle diameter
Blowing duration
10s and less (C1608[CC0603], C2012[CC0805], C3216[CC1206])
30s and less (C3225[CC1210], C4532[CC1812], C5750[CC2220])
・Example of recommended spot heater use
One-outlet type nozzle
Angle : 45degrees
3) Amount of solder should be suitable to from a proper fillet shape.
Excess solder causes mechanical and thermal stress on a capacitor and results
in cracks. Insufficient solder causes weak adherence of the capacitor to the
substrate and may result in detachment of a capacitor and deteriorate reliability
of the printed wiring board.
See the example of appropriate solder fillet shape for 5-5.Amount of solder.
— 27 —
GC11010004
Process
6
Solder repairing
Condition
6-2. Solder repair by solder iron
1) Selection of the soldering iron tip
Tip temperature of solder iron varies by its type, P.C.board material and
solder
land size. The higher the tip temperature, the quicker the operation. However,
heat shock may cause a crack in the chip capacitors.
Please make sure the tip temp. before soldering and keep the peak temp and
time in accordance with following recommended condition.
Manual soldering
(Solder iron)
Peak
Temp
Temp.. (°C)
No.
∆T
Preheating
0
3sec. (As short as possible)
Recommended solder iron condition (Sn-Pb Solder and Lead Free Solder)
Case size
C0603(CC0201)
C1005(CC0402)
C1608(CC0603)
C2012(CC0805)
C3216(CC1206)
C3225(CC1210)
C4532(CC1812)
C5750(CC2220)
Temp. (°C)
Duration (sec.)
Wattage (W)
Shape (mm)
3 max.
20 max.
⌀3.0 max.
350 max.
280 max.
* Please preheat the chip capacitors with the condition in 6-3 to avoid the thermal
shock.
2) Direct contact of the soldering iron with ceramic dielectric of chip capacitors
may cause crack. Do not touch the ceramic dielectric and the terminations by
solder iron.
6-3. Avoiding thermal shock
Preheating condition
Soldering
Manual soldering
Case size
C0603(CC0201),C1005(CC0402),
C1608(CC0603),C2012(CC0805),
C3216(CC1206)
C3225(CC1210), C4532(CC1812),
C5750(CC2220)
— 28 —
Temp. (°C)
∆T ≦ 150
∆T ≦ 130
GC11010004
No.
Process
Condition
7
Cleaning
1) If an unsuitable cleaning fluid is used, flux residue or some foreign articles may
stick to chip capacitors surface to deteriorate especially the insulation resistance.
2) If cleaning condition is not suitable, it may damage the chip capacitors.
2)-1. Insufficient washing
(1) Terminal electrodes may corrode by Halogen in the flux.
(2) Halogen in the flux may adhere on the surface of capacitors, and lower the
insulation resistance.
(3) Water soluble flux has higher tendency to have above mentioned problems
(1) and (2).
2)-2. Excessive washing
When ultrasonic cleaning is used, excessively high ultrasonic energy output
can affect the connection between the ceramic chip capacitor's body and the
terminal electrode. To avoid this, following is the recommended condition.
Power : 20 W/ℓ max.
Frequency : 40 kHz max.
Washing time : 5 minutes max.
2)-3. If the cleaning fluid is contaminated, density of Halogen increases, and it may
bring the same result as insufficient cleaning.
8
Coating and
molding of the
P.C.board
1) When the P.C.board is coated, please verify the quality influence on the product.
2) Please verify carefully that there is no harmful decomposing or reaction gas
emission during curing which may damage the chip capacitors.
3) Please verify the curing temperature.
— 29 —
GC11010004
No.
9
Process
Handling after
chip mounted
△Caution
!
E
Condition
1) Please pay attention not to bend or distort the P.C.board after soldering in
handling otherwise the chip capacitors may crack.
Bend
A
Twist
2) Printed circuit board cropping should not be carried out by hand, but by using the
proper tooling. Printed circuit board cropping should be carried out using a board
cropping jig as shown in the following figure or a board cropping apparatus to
prevent inducing mechanical stress on the board.
(1)Example of a board cropping jig
Recommended example: The board should be pushed from the back side,
close to the cropping jig so that the board is not bent and the stress applied to
the capacitor is compressive.
Unrecommended example: If the pushing point is far from the cropping jig and
the pushing direction is from the front side of the board, large tensile stress is
applied to the capacitor, which may cause cracks.
Outline of jig
Printed
circuit
board
Recommended
V-groove
Printed
circuit
board
Board
cropping jig
V-groove
— 30 —
Direction
of load
Load point
Components
Load point
Slot
Unrecommended
Direction of
load
Slot
Printed
circuit
board
Slot
Components
V-groove
GC11010004
No.
9
Process
Handling after
chip mounted
△Caution
!
E
A
Condition
(2)Example of a board cropping machine
An outline of a printed circuit board cropping machine is shown below. The
top and bottom blades are aligned with one another along the lines with the
V-grooves on printed circuit board when cropping the board.
Unrecommended example: Misalignment of blade position between top and
bottom, right and left, or front and rear blades may cause a crack in the
capacitor.
Outline of machine
Principle of operation
Top blade
Top
blade
Printed circuit board
V-groove
Bottom blade
Printed circuit board
Cross-section diagram
Top blade
Printed circuit board
V-groove
Bottom blade
Unrecommended
Recommended
Top-bottom
misalignment
Left-right
misalignment
Front-rear
misalignment
Top blade
Top blade
Top blade
Bottom blade
Bottom blade
Bottom blade
Top blade
Board
Bottom blade
3) When functional check of the P.C.board is performed, check pin pressure tends
to be adjusted higher for fear of loose contact. But if the pressure is excessive
and bend the P.C.board, it may crack the chip capacitors or peel the
terminations off. Please adjust the check pins not to bend the P.C.board.
Item
Not recommended
Termination
peeling
Recommended
Support pin
Board
bending
Check pin
— 31 —
Check pin
GC11010004
No.
Process
Condition
10
Handling of loose
chip capacitors
1) If dropped the chip capacitors may crack. Once dropped do not use it. Especially,
the large case sized chip capacitors are tendency to have cracks easily, so
please handle with care.
Crack
Floor
2) Piling the P.C.board after mounting for storage or handling, the corner of the P.C.
board may hit the chip capacitors of another board to cause crack.
P.C.board
Crack
11
Capacitance aging The capacitors (Class 2) have aging in the capacitance. They may not be used in
precision time constant circuit. In case of the time constant circuit, the evaluation
should be done well.
12
Estimated life and
estimated failure
rate of capacitors
As per the estimated life and the estimated failure rate depend on the temperature
and the voltage. This can be calculated by the equation described in JEITA
RCR-2335C Annex F (Informative) Calculation of the estimated lifetime and the
estimated failure rate ( Voltage acceleration coefficient : 3 multiplication rule,
Temperature acceleration coefficient : 10°C rule)
The failure rate can be decreased by reducing the temperature and the voltage but
they will not be guaranteed.
— 32 —
GC11010004
No.
13
Process
Caution during
operation of
equipment
Condition
1) A capacitor shall not be touched directly with bare hands during operation in
order to avoid electric shock.
Electric energy held by the capacitor may be discharged through the human
body when touched with a bare hand.
Even when the equipment is off, a capacitor may stay charged. The capacitor
should be handled after being completely discharged using a resistor.
2) The terminals of a capacitor shall not be short-circuited by any accidental
contact with a conductive object. A capacitor shall not be exposed to a
conductive liquid such as an acid or alkali solution. A conductive object or liquid,
such as acid and alkali, between the terminals may lead to the breakdown of a
capacitor due to short circuit.
3) Confirm that the environment to which the equipment will be exposed during
transportation and operation meets the specified conditions. Do not to use the
equipment in the following environments.
(1) Environment where a capacitor is spattered with water or oil
(2) Environment where a capacitor is exposed to direct sunlight
(3) Environment where a capacitor is exposed to Ozone, ultraviolet rays or
radiation
(4) Environment where a capacitor exposed to corrosive gas(e.g. hydrogen
sulfide, sulfur dioxide, chlorine. ammonia gas etc.)
(5) Environment where a capacitor exposed to vibration or mechanical shock
exceeding the specified limits.
(6) Atmosphere change with causes condensation
14
Others
△Caution
!
E
A
The products listed on this specification sheet are intended for use in general
electronic equipment (AV equipment, telecommunications equipment, home
appliances, amusement equipment, computer equipment, personal equipment, office
equipment, measurement equipment, industrial robots) under a normal operation and
use condition.
The products are not designed or warranted to meet the requirements of the
applications listed below, whose performance and/or quality require a more stringent
level of safety or reliability, or whose failure, malfunction or trouble could cause
serious damage to society, person or property. Please understand that we are not
responsible for any damage or liability caused by use of the products in any of the
applications below or for any other use exceeding the range or conditions set forth in
this specification sheet. If you intend to use the products in the applications listed
below or if you have special requirements exceeding the range or conditions set forth
in this specification, please contact us.
(1) Aerospace/Aviation equipment
(2) Transportation equipment (cars, electric trains, ships, etc.)
(3) Medical equipment (Excepting Pharmaceutical Affairs Law classification Class1, 2)
(4) Power-generation control equipment
(5) Atomic energy-related equipment
(6) Seabed equipment
(7) Transportation control equipment
(8) Public information-processing equipment
(9) Military equipment
(10) Electric heating apparatus, burning equipment
(11) Disaster prevention/crime prevention equipment
(12) Safety equipment
(13) Other applications that are not considered general-purpose applications
When designing your equipment even for general-purpose applications, you are
kindly requested to take into consideration securing protection circuit/device or
providing backup circuits in your equipment.
— 33 —
GC11010004
13. TAPE PACKAGING SPECIFICATION
1. CONSTRUCTION AND DIMENSION OF TAPING
1-1. Dimensions of carrier tape
Dimensions of paper tape shall be according to Appendix 3, 4, 5.
Dimensions of plastic tape shall be according to Appendix 6, 7.
1-2. Bulk part and leader of taping
Chips
Trailer(Empty)
160mm min.
Empty
160mm min.
Leader
Drawing direction
400mm min
1-3. Dimensions of reel
Dimensions of ⌀178 reel shall be according to Appendix 8, 9.
Dimensions of ⌀330 reel shall be according to Appendix 10, 11.
1-4. Structure of taping
Top cover tape
Top cover tape
Pitch hole
Pitch hole
Cavity (Chip insert)
Paper carrier tape
Bottom cover tape
(Bottom cover tape is not always applied)
Cavity (Chip insert)
Plastic carrier tape
2. CHIP QUANTITY
Please refer to detail page on TDK web.
— 34 —
GC11010004
3. PERFORMANCE SPECIFICATIONS
3-1. Fixing peeling strength (top tape)
0.05N < Peeling strength < 0.7N
Direction of cover tape pulling
Top cover tape
Carrier tape
0～15°
Direction of pulling
Paper tape should not adhere to top
cover tape when pull the cover tape.
Direction of pulling
Top cover tape
Carrier tape
0～15°
Direction of pulling
3-2. Carrier tape shall be flexible enough to be wound around a minimum radius
of 30mm with components in tape.
3-3. The missing of components shall be less than 0.1%
3-4. Components shall not stick to fixing tape.
3-5. When removing the cover tape, there shall not be difficulties by unfitting clearance
gap, burrs and crushes of cavities. Also the sprocket holes shall not be covered
by absorbing dust into the suction nozzle.
— 35 —
GC11010004
Appendix 3
Paper Tape
Pitch hole
Cavity(Press formed type)
J
E
A
D
B
K
H
G
C
F
T
（Unit：mm）
Symbol
Case size
C0603
(CC0201)
A
B
( 0.38 )
*( 0.40 )
( 0.68 )
*( 0.70 )
C
D
E
F
8.00±0.30
3.50±0.05
1.75±0.10
2.00±0.05
K
T
0.35±0.02
*0.38±0.02
0.40 min.
Symbol
G
H
J
Case size
C0603
+0.10
2.00±0.05
4.00±0.10 ⌀ 1.50 0
(CC0201)
(
) Reference value.
* Applied to thickness, 0.30±0.05mm products.
Appendix 4
Paper Tape
Pitch hole
J
Cavity (Chip insert)
E
D
A
C
B
H
T
G
F
(Unit：mm)
Symbol
Case size
A
B
C
D
E
F
C1005
[CC0402]
( 0.65 )
* ( 0.73 )
( 1.15 )
* ( 1.23 )
8.00 ± 0.30
3.50 ± 0.05
1.75 ± 0.10
2.00 ± 0.05
Symbol
Case size
G
H
J
T
C1005
[CC0402]
2.00 ± 0.05
4.00 ± 0.10
0.60±0.05
+0.10
⌀ 1.50 0
* 0.68±0.05
(
) Reference value.
* Applied to thickness, 0.50±0.10mm and 0.50 +0.15,-0.10mm products.
— 36 —
GC11010004
Appendix 5
Paper Tape
Pitch hole
Cavity (Chip insert)
J
E
A
D
B
T
H
G
C
F
(Unit：mm)
Symbol
Case size
C1608
[CC0603]
C2012
[CC0805]
C3216
[CC1206]
A
B
( 1.10 )
( 1.90 )
( 1.50 )
( 2.30 )
( 1.90 )
( 3.50 )
Symbol
G
Case size
C1608
[CC0603]
C2012
2.00 ± 0.05
[CC0805]
C3216
[CC1206]
(
) Reference value.
H
4.00 ± 0.10
C
D
E
F
8.00 ± 0.30
3.50 ± 0.05
1.75 ± 0.10
4.00 ± 0.10
J
T
+0.10
⌀ 1.50 0
— 37 —
1.20 max.
GC11010004
Appendix 6
Plastic Tape
Cavity (Chip insert)
J
Pitch hole
E
A
D
B
T
H
G
C
Q
F
K
(Unit : mm)
Symbol
Case size
C2012
[CC0805]
C3216
[CC1206]
C3225
[CC1210]
A
B
( 1.50 )
( 2.30 )
( 1.90 )
( 3.50 )
( 2.90 )
C
D
8.00 ± 0.30
3.50 ± 0.05
*12.00 ± 0.30
*5.50 ± 0.05
E
F
1.75 ± 0.10
4.00 ± 0.10
( 3.60 )
Symbol
G
H
J
K
T
Case size
C2012
[CC0805]
2.50 max.
C3216
+0.10
0.60 max.
2.00 ± 0.05 4.00 ± 0.10 ⌀ 1.50 0
[CC1206]
C3225
3.40 max.
[CC1210]
(
) Reference value.
* Applied to thickness, 2.5mm products.
Exceptionally no hole in the cavity is applied. Please inquire if hole in cavity is mandatory.
— 38 —
Q
⌀ 0.50 min.
GC11010004
Appendix 7
Plastic Tape
Pitch hole
Cavity (Chip insert)
J
E
A
D
B
T
Q
G
H
C
F
K
(Unit : mm)
Symbol
Case size
C4532
[CC1812]
C5750
[CC2220]
Symbol
Case size
A
B
( 3.60 )
( 4.90 )
( 5.40 )
( 6.10 )
G
H
C
D
E
F
12.00 ± 0.30
5.50 ± 0.05
1.75 ± 0.10
8.00 ± 0.10
J
K
T
Q
C4532
[CC1812]
+0.10
2.00 ± 0.05 4.00 ± 0.10 ⌀ 1.50 0
6.50 max.
0.60 max.
C5750
[CC2220]
(
) Reference value.
Exceptionally no hole in the cavity is applied. Please inquire if hole in cavity is mandatory.
— 39 —
⌀ 1.50 min.
GC11010004
Appendix 8
Dimensions of reel (Material : Polystyrene)
C0603, C1005, C1608, C2012, C3216, C3225
W2
E
C
B
D
R
W1
A
(Unit : mm)
Symbol
A
B
C
D
E
W1
Dimension
⌀ 13 ± 0.5
⌀ 21 ± 0.8
9.0 ± 0.3
W2
⌀ 60 ± 2.0
2.0 ± 0.5
Symbol
⌀ 178 ± 2.0
Dimension
13.0 ± 1.4
1.0
R
Appendix 9
Dimensions of reel (Material : Polystyrene)
C3225(2.5mm thickness products), C4532, C5750
W2
E
C
B
D
R
W1
A
(Unit : mm)
Symbol
A
B
C
D
E
W1
Dimension
⌀ 13 ± 0.5
⌀ 21 ± 0.8
13.0 ± 0.3
W2
⌀ 60 ± 2.0
2.0 ± 0.5
Symbol
⌀ 178 ± 2.0
Dimension
17.0 ± 1.4
1.0
R
— 40 —
GC11010004
Appendix 10
Dimensions of reel (Material : Polystyrene)
C0603, C1005, C1608, C2012, C3216, C3225
E
C
B
D
R
A
W
t
(Unit : mm)
Symbol
A
B
C
D
E
W
⌀ 13 ± 0.5
⌀ 21 ± 0.8
10.0 ± 1.5
t
⌀ 50 min.
2.0 ± 0.5
Symbol
⌀ 382 max.
(Nominal ⌀ 330)
Dimension
2.0 ± 0.5
1.0
Dimension
R
Appendix 11
Dimensions of reel (Material : Polystyrene)
C3225(2.5mm thickness products), C4532, C5750
E
C
B
D
R
W
A
t
(Unit : mm)
Symbol
A
B
C
D
E
W
⌀ 13 ± 0.5
⌀ 21 ± 0.8
14.0 ± 1.5
t
⌀ 50 min.
2.0 ± 0.5
Symbol
⌀ 382 max.
(Nominal ⌀ 330)
Dimension
2.0 ± 0.5
1.0
Dimension
R
— 41 —
GC11010004
C0402 type
■CATALOG NUMBER CONSTRUCTION
C
(1)
0402
(2)
X5R
1A
(3)
222
(4)
(5)
K
(6)
020
(7)
B
(8)
C
(9)
(1) Series
(2) Dimensions L x W (mm)
Code
EIA
Length
Width
0402
CC01005
0.40
0.20
Terminal
width
0.07
(6) Capacitance tolerance
Code
Tolerance
D
±0.50pF
J
±5%
K
±10%
(3) Temperature characteristics
Temperature
Temperature coefficient
characteristics
or capacitance change
0±30 ppm/℃
C0G
X5R
±15%
Temperature
range
-55 to +125℃
-55 to +85℃
(7) Thickness
Code
Thickness
020
0.20mm
X7R
-55 to +125℃
(8) Packaging style
Code
Style
±15%
(4) Rated voltage (DC)
Code
Voltage (DC)
1A
10V
B
1C
Code
C
(9) Special reserved code
16V
(5) Nominal capacitance (pF)
The capacitance is expressed in three digit codes and in
units of pico Farads (pF). The first and second digits
identify the first and second significant figures of the
capacitance. The third digit identifies the multiplier. R
designates a decimal point.
(Example)
178mm reel, 2mm pitch
0R5 = 0.5pF
101 = 100pF
225 = 2,200,000pF = 2.2μF
— 42 —
Description
TDK internal code
GC11010004
SCOPE
This delivery specification shall be applied to Multilayer ceramic chip capacitors to be delivered to
.
PRODUCTION PLACES
Production places defined in this specification shall be TDK Corporation, TDK(Suzhou)Co.,Ltd
and TDK Components U.S.A.,Inc.
PRODUCT NAME
The name of the product to be defined in this specifications shall be C0402○○○△△□□□×.
REFERENCE STANDARD
Fixed capacitors for use in electronic equipment-Part 1: Generic specification
Fixed capacitors for use in electronic equipment-Part 21 : Sectional specification
: Fixed surface mount multilayer capacitors of ceramic dielectric,Class1
C 5101－22：2014 Fixed capacitors for use in electronic equipment-Part 22 : Sectional specification
: Fixed surface mount multilayer capacitors of ceramic dielectric,Class2
Packaging of components for automatic handling - Part 3: Packaging of
C 0806－3：2014
surface mount components on continuous tapes
JEITA RCR－2335 C 2014 Safety application guide for fixed ceramic capacitors for use in electronic
JIS C 5101－1：2010
C 5101－21：2014
equipment
CONTENTS
1. CODE CONSTRUCTION
2. COMBINATION OF RATED CAPACITANCE AND TOLERANCE
3. OPERATING TEMPERATURE RANGE
4. STORING CONDITION AND TERM
5. INDUSTRIAL WASTE DISPOSAL
6. PERFORMANCE
7. INSIDE STRUCTURE AND MATERIAL
8. PACKAGING
9. SOLDERING CONDITION
10. CAUTION
11. TAPE PACKAGING SPECIFICATION
When the mistrust in the spec arises, this specification is given priority. And it will be confirmed by written
spec change after conference of both posts involved.
This specification warrants the quality of the ceramic chip capacitor. Capacitors should be evaluated or
confirmed a state of mounted on your product.
If the use of the capacitors goes beyond the bounds of this specification, we can not afford to guarantee.
Division
Date
SPEC. No.
Ceramic Capacitors Business Group
Oct, 2020
C-General-j
— 43 —
GC11010004
1. CODE CONSTRUCTION
(Example)
C0402
(1)
X5R
(2)
1A
(3)
102
(4)
K
(5)
ΟΟΟΟ
(7)
T
(6)
(1) Case size
Terminal electrode
L
B
W
G
B
T
Internal electrode
Ceramic dielectric
Type
Dimensions (Unit : mm)
TDK (EIA style)
L
W
T
B
G
C0402
(CC01005)
0.40±0.02
0.20±0.02
0.20±0.02
0.70 min.
0.14 min.
*As for each item, please refer to detail page on TDK web.
(2) Temperature Characteristics
* Details are shown in table 1 No.6 and 7 at 6.PERFORMANCE)
(3) Rated Voltage
(4) Rated Capacitance
Stated in three digits and in units of pico farads (pF).
The first and second digits identify the first and second
significant figures of the capacitance, the third digit
identifies the multiplier.
Symbol
Rated Voltage
1 C
DC 16 V
1 A
DC 10 V
(Example)
Symbol
Rated
Capacitance
100
10 pF
102
1,000 pF
(5) Capacitance tolerance
Symbol
Tolerance
Capacitance
D
±0.5 pF
10pF and
under
J
±5 %
K
±10 %
Over 10pF
(6) Packaging
(7) TDK internal code
— 44 —
Symbol
Packaging
T
Taping
GC11010004
2. COMBINATION OF RATED CAPACITANCE AND TOLERANCE
Temperature
Characteristics
Class
1
Capacitance tolerance
Rated capacitance
10pF and under
D (± 0.5pF)
Over 10pF
J (± 5 %)
10
C0G
X5R
X7R
2
E – 3 series
K (± 10 %)
E – 3 series
Capacitance Step in E series
Capacitance Step
E series
1.0
E- 3
2.2
4.7
3. OPERATING TEMPERATURE RANGE
T.C.
Min. operating
Temperature
Max. operating
Temperature
Reference
Temperature
X5R
-55°C
85°C
25°C
C0G/X7R
-55°C
125°C
25°C
4. STORING CONDITION AND TERM
Storing temperature
Storing humidity
Storing term
5~40°C
20~70%RH
Within 6 months
upon receipt.
5. INDUSTRIAL WASTE DISPOSAL
Dispose this product as industrial waste in accordance with the Industrial Waste Law.
— 45 —
GC11010004
6. PERFORMANCE
table 1
No.
Item
Performance
Test or inspection method
1
External Appearance
No defects which may affect
performance.
Inspect with magnifying glass(10×)
2
Insulation Resistance
10,000MΩ or 100MΩ·μF min.
whichever smaller.
Measuring voltage：Rated voltage
Voltage application time：60s.
3
Voltage Proof
Withstand test voltage without
insulation breakdown or other
damage.
Class 1 :
3 times of rated voltage
Class 2 : 2.5 times of rated voltage
Voltage application time : 1s.
Charge / discharge current : 50mA or
lower
4
Capacitance
Within the specified tolerance.
As for measuring condition, please refer
to detail page on TDK web.
5
Q
Class1
Please refer to detail page on
TDK web.
See No.4 in this table for measuring
condition.
Dissipation
Factor
Class2
6
7
Temperature
Characteristics
of Capacitance
(Class1)
Temperature
Characteristics
of Capacitance
(Class2)
Temperature Coefficient (ppm/°C)
C0G
:
0 ± 30
Capacitance drift
Within ±0.2% or ±0.05pF,
whichever larger.
Capacitance Change (%)
No voltage applied
X5R : ±15
X7R : ±15
Temperature Coefficient shall be
calculated based on values at 25°C and
85°C temperature.
Measuring temperature below 20°C
shall be -10°C and -25°C
Capacitance shall be measured by the
steps shown in the following table, after
thermal equilibrium is obtained for each
step.
ΔC be calculated ref. STEP3 reading.
Step
Temperature(°C)
1
Reference temp. ± 2
2
Min. operating temp. ± 2
3
Reference temp. ± 2
4
Max. operating temp. ± 2
As for Min./Max operating temp and
Reference temp., please refer to
“3. OPERATING TEMPERATURE RANGE”
As for measuring voltage, please contact
with our sales representative.
— 46 —
GC11010004
(continued)
Item
No.
8
Bending
Performance
No mechanical damage.
Test or inspection method
Reflow solder the capacitor on a P.C.
Board shown in Appendix1 and bend it
for 1mm.
20
50
F
R230
1
45
45
（Unit：mm）
9
Solderability
Both end faces and the contact
areas shall be covered with a
smooth and bright solder coating
with no more than a small amount of
scattered imperfections such as
pinholes or un-wetted or de-wetted
areas.
These imperfections shall not be
concentrated in one area.
Solder : Sn-3.0Ag-0.5Cu
Flux : Isopropyl alcohol(JIS K 8839)
Rosin(JIS K 5902) 25% solid
solution.
Preheating condition
Temp. : 110 ~ 140°C
Time : 30 ~ 60s.
Reflow profile
A section
Temp.(°C)
245
ΔT≦150
0
Over 60～120s.
Resistance
to solder
heat
External
appearance
No cracks are allowed and
terminations shall be covered at
least 60% with new solder.
Capacitance
Characteristics
Change from the
value before test
2.5% or ±0.25pF
Class1 C0G max. whichever
larger
Class2
Q
X5R
X7R
±7.5 %
Solder : Sn-3.0Ag-0.5Cu
Flux : Isopropyl alcohol(JIS K 8839)
Rosin(JIS K 5902) 25% solid
solution.
Preheating condition
Temp. : 110 ~ 140°C
Time : 30 ~ 60s.
Leave the capacitors in ambient
condition for 6 to 24h (Class1) or
24±2h (Class2) before measurement.
Reflow profile
Meet the initial spec.
(Class1)
260
D.F.
(Class2)
Meet the initial spec.
Insulation
Resistance
Meet the initial spec.
Voltage
proof
No insulation breakdown or other
damage.
— 47 —
Temp.(°C)
10
3±0.3s
ΔT≦150
0
Over 60～120s.
10±1s
GC11010004
(continued)
Item
No.
11
Vibration
External
appearance
Performance
No mechanical damage.
Capacitance
Characteristics
Change from the
value before test
Class1 C0G
2.5% or ±0.25pF
max. whichever
larger
Class2
Q
X5R
X7R
±7.5 %
Test or inspection method
Frequency : 10~55~10Hz
Reciprocating sweep time : 1 min.
Amplitude : 1.5mm
Repeat this for 2h each in 3
perpendicular directions(Total 6h).
Reflow solder the capacitors on a
P.C.Board shown in Appendix 2 before
testing.
Meet the initial spec.
(Class1)
D.F.
(Class2)
12
Temperature External
cycle
appearance
Meet the initial spec.
No mechanical damage.
Capacitance
Characteristics
Change from the
value before test
Expose the capacitors in the condition
step1 through step 4 listed in the
following table.
Temp. cycle : 5 cycles
Step
Class1 C0G Please contact
Temperature(°C)
Time (min.)
1
Min. operating
temp.±3
30 ± 3
2
Ambient Temp.
2~5
Meet the initial spec.
3
Max. operating
temp.±2
30 ± 2
D.F.
(Class2)
Meet the initial spec.
4
Ambient Temp.
2~5
Insulation
Resistance
Meet the initial spec.
Voltage
proof
No insulation breakdown or other
damage.
X5R
Class2
X7R
Q
(Class1)
with our sales
representative.
As for Min./Max. operating temp.,
please refer to “3. OPERATING
TEMPERATURE RANGE”
Leave the capacitors in ambient
condition for
Class 1 : 6~24h
Class 2 : 24±2h before measurement.
Reflow solder the capacitors on a
P.C.Board shown in Appendix2 before
testing.
— 48 —
GC11010004
(continued)
Item
No.
13
Moisture
Resistance
(Steady
state)
External
appearance
Performance
Test or inspection method
No mechanical damage.
Capacitance
Characteristics
Change from the
value before test
Class1 C0G Please contact
with our sales
Class2
X5R
representative.
X7R
Test temp. : 40±2°C
Test humidity : 90~95%RH
Test time : 500 +24,0h
Leave the capacitors in ambient
condition for
Class 1 : 6~24h
Class 2 : 24±2h before measurement.
Reflow solder the capacitors on a
Q
(Class1)
Capacitance
Q
30pF and over
350 min.
10pF and over
under 30pF
275+5/2×C min.
Under 10pF
200+10×C min.
P.C.Board shown in Appendix2 before
testing.
C : Rated capacitance (pF)
14
Moisture
Resistance
D.F.
(Class2)
200% of initial spec max.
Insulation
Resistance
1,000MΩ or 10MΩ·μF min.
whichever smaller.
External
appearance
No mechanical damage.
Capacitance
Characteristics
Class1 C0G
Class2
X5R
X7R
Change from the
value before test
Please contact
with our sales
representative.
Q
(Class1)
Capacitance
Q
30pF and over
200 min.
Under 30pF
100+10/3×C min.
C : Rated capacitance (pF)
D.F.
(Class2)
200% of initial spec max.
Insulation
Resistance
500MΩ or 5MΩ·μF min.
whichever smaller.
— 49 —
Test temp. : 40±2°C
Test humidity : 90~95%RH
Applied voltage : Rated voltage
Test time : 500 +24,0h
Charge/discharge current : 50mA or
lower
Leave the capacitors in ambient
condition for
Class 1 : 6~24h
Class 2 : 24±2h before measurement.
Reflow solder the capacitors on a
P.C.Board shown in Appendix2 before
testing.
Initial value setting (only for class 2)
Voltage conditioning 《After voltage treat
the capacitors under testing temperature
and voltage for 1 hour,》 leave the
capacitors in ambient condition for 24±2h
before measurement.
Use this measurement for initial value.
GC11010004
(continued)
Item
No.
15
Life
External
Performance
Test or inspection method
No mechanical damage.
appearance
Capacitance
Characteristics
Class1 C0G
Class2
Q
(Class1)
X5R
X7R
Change from the
value before test
Please contact
with our sales
representative.
Capacitance
Q
30pF and over
350 min.
10pF and over
under 30pF
275+5/2×C min.
Under 10pF
200+10×C min.
C : Rated capacitance (pF)
D.F.
(Class2)
200% of initial spec max.
Insulation
Resistance
1,000MΩ or 10MΩ·μF min.
whichever smaller.
Test temp. : Maximum operating
temperature±2°C
Applied voltage : Please contact with our
sales representative.
Test time : 1,000 +48,0h
Charge/discharge current : 50mA or
lower
Leave the capacitors in ambient
condition for
Class 1 : 6~24h
Class 2 : 24±2h before measurement.
Reflow solder the capacitors on a
P.C.Board shown in Appendix2 before
testing.
Initial value setting (only for class 2)
Voltage conditioning 《After voltage treat
the capacitors under testing temperature
and voltage for 1 hour,》 leave the
capacitors in ambient condition for 24±2h
before measurement.
Use this measurement for initial value.
*As for the initial measurement of capacitors (Class2) on number 7,10,11,12 and 13 leave capacitors at 150 -10,0°C
for 1h and measure the value after leaving capacitors for 24±2h in ambient condition.
— 50 —
GC11010004
Appendix 1
Appendix 2
P.C.Board for bending test
P.C. Board for reliability test
100
100
c
b
b a
40
Solder resist
40
Solder resist
a
Copper
1.0
c
Copper
(Unit : mm)
Symbol
Case size
C0402
(CC01005)
a
b
c
0.2
0.8
0.2
1. Material : Glass Epoxy(As per JIS C6484 GE4)
2. Thickness : Appendix 1 ― 0.8mm
Appendix 2 ― 1.6mm
— 51 —
Copper(Thickness:0.035mm)
Solder resist
GC11010004
7. INSIDE STRUCTURE AND MATERIAL
3
4
5
2
1
MATERIAL
No.
NAME
1
Dielectric
2
Electrode
Class1
Class2
CaZrO 3
BaTiO 3
Nickel (Ni)
3
4
Copper (Cu)
Nickel (Ni)
Termination
5
Tin (Sn)
— 52 —
GC11010004
8. PACKAGING
Packaging shall be done to protect the components from the damage during transportation and storing, and a
label which has the following information shall be attached.
Tape packaging is as per 11. TAPE PACKAGING SPECIFICATION.
1) Inspection No.*
2) TDK P/N
3) Customer's P/N
4) Quantity
*Composition of Inspection No.
Example
F 0 A – 23 – 001
(a) (b) (c)
(d)
(e)
(a) Line code
(b) Last digit of the year
(c) Month and A for January and B for February and so on. (Skip I)
(d) Inspection Date of the month.
(e) Serial No. of the day
*Composition of new Inspection No.
(Implemented on and after May 1, 2019 in sequence)
Example
I
F
0
E
(a) (b) (c) (d)
2 3
A 0
0 1
(e)
(f)
(g)
(a) Prefix
(b) Line code
(c) Last digit of the year
(d) Month and A for January and B for February and so on. (Skip I)
(e) Inspection Date of the month.
(f) Serial No. of the day(00 ~ ZZ)
(g) Suffix(00 ~ ZZ)
* It was shifted to the new inspection No. on and after May 2019, but the implementation timing may be
different depending on shipment bases. Until the shift is completed, either current or new composition
of inspection No. will be applied.
9. SOLDERING CONDITION
Reflow soldering only.
— 53 —
GC11010004
10. CAUTION
No.
Process
Condition
1
Operating
Condition
(Storage, Use,
Transportation)
1-1. Storage, Use
The capacitors must be stored in an ambient temperature of 5 to 40°C with a
relative humidity of 20 to 70%RH. JIS C 60721-3-1 Class 1K2 should be followed for
the other climatic conditions.
1) High temperature and humidity environment may affect a capacitor's solder ability
because it accelerates terminal oxidization. They also deteriorate performance of
taping and packaging. Therefore, SMD capacitors shall be used within 6 months.
For capacitors with terminal electrodes consisting of silver or silver-palladium which
tend to become oxidized or sulfurized, use as soon as possible, such as within one
month after opening the bag.
2) When capacitors are stored for a longer time period than 6 months, confirm the
solderability of the capacitors prior to use.
During storage, keep the minimum packaging unit in its original packaging without
opening it.
Do not deviate from the above temperature and humidity conditions even for a
short term.
3) Corrosive gasses in the air or atmosphere may result in deterioration of the
reliability, such as poor solderability of the terminal electrodes. Do not store
capacitors where they will be exposed to corrosive gas (e.g., hydrogen sulfide,
sulfur dioxide, chlorine ammonia etc.)
4) Solderability and electrical performance may deteriorate due to photochemical
change in the terminal electrode if stored in direct sunlight, or due to condensation
from rapid changes in humidity.
The capacitors especially which use resin material must be operated and stored in
an environment free of dew condensation, as moisture absorption due to
condensation may affect the performance.
5) Refer to JIS C 60721-3-1, class 1K2 for other climate conditions.
1-2. Handling in transportation
In case of the transportation of the capacitors, the performance of the capacitors
may be deteriorated depending on the transportation condition.
(Refer to JEITA RCR-2335C 9.2 Handling in transportation)
2
Circuit design
! Caution
△
E
A
2-1. Operating temperature
1) Upper category temperature (maximum operating temperature) is specified.
It is necessary to select a capacitor whose rated temperature us higher than the
operating temperature. Also, it is necessary to consider the temperature
distribution in the equipment and seasonal temperature variation.
2) Do not use capacitors above the maximum allowable operating temperature.
Surface temperature including self heating should be below maximum operating
temperature.
(Due to dielectric loss, capacitors will heat itself when AC is applied. Especially at
high frequencies around its SRF, the heat might be so extreme that it may damage
itself or the product mounted on. Please design the circuit so that the maximum
temperature of the capacitors including the self heating to be below the maximum
allowable operating temperature. Temperature rise at capacitor surface shall be
below 20°C)
3) The electrical characteristics of the capacitors will vary depending on the
temperature. The capacitors should be selected and designed in taking the
temperature into consideration.
2-2. When overvoltage is applied
Applying overvoltage to a capacitor may cause dielectric breakdown and result in
a short circuit. The duration until dielectric breakdown depends on the applied
voltage and the ambient temperature.
— 54 —
GC11010004
No.
2
Process
Circuit design
! Caution
△
A
E
A
Condition
2-3. Operating voltage
1) Operating voltage across the terminals should be below the rated voltage.
When AC and DC are super imposed, V0-P must be below the rated voltage.
— (1) and (2)
AC or pulse with overshooting, VP-P must be below the rated voltage.
— (3), (4) and (5)
When the voltage is started to apply to the circuit or it is stopped applying, the
irregular voltage may be generated for a transit period because of resonance or
switching. Be sure to use the capacitors within rated voltage containing these
Irregular voltage.
Voltage
(1) DC voltage
Positional
Measurement V 0-P
(Rated voltage)
V 0-P
R
R
0
Voltage
(2) DC+AC voltage
(3) AC voltage
V P-P 0
R
0
(4) Pulse voltage (A) (5) Pulse voltage (B)
Positional
Measurement V P-P
(Rated voltage)
V P-P 0
R
R
0
2) Even below the rated voltage, if repetitive high frequency AC or pulse is applied, the
reliability of the capacitors may be reduced.
3) The effective capacitance will vary depending on applied DC and AC voltages.
The capacitors should be selected and designed in taking the voltages into
consideration.
4) Abnormal voltage (surge voltage, static electricity, pulse voltage, etc.) shall not
exceed the rated voltage.
5) When capacitors are used in a series connection, it is necessary to add a balancing
circuit such as voltage dividing resistors in order to avoid an imbalance in the voltage
applied to each capacitor.
2-4. Frequency
When the capacitors (Class 2) are used in AC and/or pulse voltages, the
capacitors may vibrate themselves and generate audible sound.
— 55 —
GC11010004
No.
3
Process
Designing
P.C.board
Condition
The amount of solder at the terminations has a direct effect on the reliability of the
capacitors.
1) The greater the amount of solder, the higher the stress on the chip capacitors,
and the more likely that it will break. When designing a P.C.board, determine the
shape and size of the solder lands to have proper amount of solder on the
terminations.
2) Avoid using common solder land for multiple terminations and provide individual
solder land for each terminations.
3) Size and recommended land dimensions.
Chip capacitors
Solder land
C
B
Reflow soldering
Case size
Symbol
Solder resist
A
(Unit : mm)
C0402
(CC01005)
A
0.15 ~ 0.25
B
0.15 ~ 0.25
C
0.15 ~ 0.25
— 56 —
GC11010004
No.
3
Process
Designing
P.C.board
Condition
4) Recommended chip capacitors layout is as following.
Disadvantage against
bending stress
Advantage against
bending stress
Perforation or slit
Perforation or slit
Break P.C.board with
mounted side up.
Break P.C.board with
mounted side down.
Mounting
face
Mount perpendicularly to
perforation or slit
Perforation or slit
Mount in parallel with
perforation or slit
Perforation or slit
Chip
arrangement
(Direction)
Closer to slit is higher stress
ℓ1
Away from slit is less stress
ℓ2
Distance from
slit
( ℓ1 < ℓ2 )
— 57 —
( ℓ1 < ℓ2 )
GC11010004
No.
3
Process
Designing
P.C.board
Condition
5) Mechanical stress varies according to location of chip capacitors on the P.C.board.
E
Perforation
D
C
B
A
Slit
Stress force
A＞B＞E
A＞D＞E
A＞C
When dividing printed wiring boards, the intensities of mechanical stress applied to
capacitors are different according to each dividing method in the order of :
Push-back < Slit < V-groove < Perforation. Therefore consider not only position of
capacitors, but also the way of the dividing the printed wiring boards.
6) Layout recommendation
Example
Use of common
solder land
Lead wire
Chip
Solder
Soldering with
chassis
Use of common
solder land with
other SMD
Chassis
Excessive solder
Solder
land
Need to
avoid
Excessive solder
PCB
ℓ1
Solder land
Missing solder
Solder
land
Lead wire
Solder resist
Solder resist
Recommendation
Solder resist
ℓ2
ℓ2 > ℓ1
— 58 —
GC11010004
No.
4
Process
Mounting
Condition
4-1. Stress from mounting head
If the mounting head is adjusted too low, it may induce excessive stress in the chip
capacitors to result in cracking. Please take following precautions.
1) Adjust the bottom dead center of the mounting head to reach on the P.C.board
surface and not press it.
2) Adjust the mounting head pressure to be 1 to 3N of static weight.
3) To minimize the impact energy from mounting head, it is important to provide
support from the bottom side of the P.C.board.
See following examples.
Not recommended
Single-sided
mounting
Recommended
Crack
Support pin
A support pin
is not to be
underneath
the capacitor.
Double-sides
mounting
Solder
peeling
Crack
Support pin
When the centering jaw is worn out, it may give mechanical impact on the
capacitors to cause crack. Please control the close up dimension of the centering
jaw and provide sufficient preventive maintenance and replacement of it.
— 59 —
GC11010004
No.
Process
Condition
5
Soldering
5-1. Flux selection
Flux can seriously affect the performance of capacitors. Confirm the following to
select the appropriate flux.
1) It is recommended to use a mildly activated rosin flux (less than 0.1wt% chlorine).
Strong flux is not recommended.
2) Excessive flux must be avoided. Please provide proper amount of flux.
3) When water-soluble flux is used, enough washing is necessary.
5-2. Recommended soldering profile : Reflow method
Refer to the following temperature profile at Reflow soldering.
Reflow soldering
Preheating
Soldering
Natural cooling
Temp.. (°C)
Peak
Temp
∆T
0
Over 60 sec.
Peak Temp time
5-3. Recommended soldering peak temp and peak temp duration for Reflow soldering
Pb free solder is recommended, but if Sn-37Pb must be used, refer to below.
Temp./Duration
Reflow soldering
Peak temp(°C)
Duration(sec.)
Lead Free Solder
260 max.
10 max.
Sn-Pb Solder
230 max.
20 max.
Solder
Recommended solder compositions
Lead Free Solder : Sn-3.0Ag-0.5Cu
5-4. Avoiding thermal shock
1) Preheating condition
2)
Soldering
Temp. (°C)
Reflow soldering
∆T ≦ 150
Cooling condition
Natural cooling using air is recommended. If the chips are dipped into a solvent for
cleaning, the temperature difference (∆T) must be less than 100°C.
— 60 —
GC11010004
No.
Process
Condition
5
Soldering
5-5. Amount of solder
Excessive solder will induce higher tensile force in chip capacitors when
temperature changes and it may result in chip cracking. In sufficient solder may
detach the capacitors from the P.C.board.
Higher tensile force in
chip capacitors to cause
crack
Excessive
solder
Maximum amount
Minimum amount
Adequate
Low robustness may
cause contact failure or
chip capacitors come off
the P.C.board.
Insufficient
solder
5-6. Sn-Zn solder
Sn-Zn solder affects product reliability.
Please contact TDK in advance when utilize Sn-Zn solder.
5-7. Countermeasure for tombstone
The misalignment between the mounted positions of the capacitors and the land
patterns should be minimized. The tombstone phenomenon may occur especially
the capacitors are mounted (in longitudinal direction) in the same direction of the
reflow soldering.
(Refer to JEITA RCR-2335C Annex A (Informative), Recommendations to prevent
the tombstone phenomenon.)
— 61 —
GC11010004
No.
Process
Condition
6
Cleaning
1) If an unsuitable cleaning fluid is used, flux residue or some foreign articles may
stick to chip capacitors surface to deteriorate especially the insulation resistance.
2) If cleaning condition is not suitable, it may damage the chip capacitors.
2)-1. Insufficient washing
(1) Terminal electrodes may corrode by Halogen in the flux.
(2) Halogen in the flux may adhere on the surface of capacitors, and lower the
insulation resistance.
(3) Water soluble flux has higher tendency to have above mentioned problems
(1) and (2).
2)-2. Excessive washing
When ultrasonic cleaning is used, excessively high ultrasonic energy output
can affect the connection between the ceramic chip capacitor's body and the
terminal electrode. To avoid this, following is the recommended condition.
Power : 20 W/ℓ max.
Frequency : 40 kHz max.
Washing time : 5 minutes max.
2)-3. If the cleaning fluid is contaminated, density of Halogen increases, and it may
bring the same result as insufficient cleaning.
7
Coating and
molding of the
P.C.board
1) When the P.C.board is coated, please verify the quality influence on the product.
2) Please verify carefully that there is no harmful decomposing or reaction gas
emission during curing which may damage the chip capacitors.
3) Please verify the curing temperature.
— 62 —
GC11010004
No.
8
Process
Handling after
chip mounted
△Caution
!
E
Condition
1) Please pay attention not to bend or distort the P.C.board after soldering in
handling otherwise the chip capacitors may crack.
Bend
A
Twist
2) Printed circuit board cropping should not be carried out by hand, but by using the
proper tooling. Printed circuit board cropping should be carried out using a board
cropping jig as shown in the following figure or a board cropping apparatus to
prevent inducing mechanical stress on the board.
(1)Example of a board cropping jig
Recommended example: The board should be pushed from the back side,
close to the cropping jig so that the board is not bent and the stress applied to
the capacitor is compressive.
Unrecommended example: If the pushing point is far from the cropping jig and
the pushing direction is from the front side of the board, large tensile stress is
applied to the capacitor, which may cause cracks.
Outline of jig
Printed
circuit
board
Recommended
V-groove
Printed
circuit
board
Board
cropping jig
V-groove
— 63 —
Direction
of load
Load point
Components
Load point
Slot
Unrecommended
Direction of
load
Slot
Printed
circuit
board
Slot
Components
V-groove
GC11010004
No.
8
Process
Handling after
chip mounted
△Caution
!
E
A
Condition
(2)Example of a board cropping machine
An outline of a printed circuit board cropping machine is shown below. The
top and bottom blades are aligned with one another along the lines with the
V-grooves on printed circuit board when cropping the board.
Unrecommended example: Misalignment of blade position between top and
bottom, right and left, or front and rear blades may cause a crack in the
capacitor.
Outline of machine
Principle of operation
Top blade
Top
blade
Printed circuit board
Bottom blade
V-groove
Printed circuit board
Cross-section diagram
Top blade
Printed circuit board
V-groove
Bottom blade
Unrecommended
Recommended
Top-bottom
misalignment
Left-right
misalignment
Front-rear
misalignment
Top blade
Top blade
Top blade
Bottom blade
Bottom blade
Bottom blade
Top blade
Board
Bottom blade
3) When functional check of the P.C.board is performed, check pin pressure tends
to be adjusted higher for fear of loose contact. But if the pressure is excessive
and bend the P.C.board, it may crack the chip capacitors or peel the
terminations off. Please adjust the check pins not to bend the P.C.board.
Item
Not recommended
Termination
peeling
Recommended
Support pin
Board
bending
Check pin
— 64 —
Check pin
GC11010004
No.
Process
Condition
9
Handling of loose
chip capacitors
1) If dropped the chip capacitors may crack. Once dropped do not use it. Especially,
the large case sized chip capacitors are tendency to have cracks easily, so
please handle with care.
Crack
Floor
2) Piling the P.C.board after mounting for storage or handling, the corner of the P.C.
board may hit the chip capacitors of another board to cause crack.
P.C.board
Crack
10
Capacitance aging The capacitors (Class 2) have aging in the capacitance. They may not be used in
precision time constant circuit. In case of the time constant circuit, the evaluation
should be done well.
11
Estimated life and
estimated failure
rate of capacitors
As per the estimated life and the estimated failure rate depend on the temperature
and the voltage. This can be calculated by the equation described in JEITA
RCR-2335C Annex F (Informative) Calculation of the estimated lifetime and the
estimated failure rate ( Voltage acceleration coefficient : 3 multiplication rule,
Temperature acceleration coefficient : 10°C rule)
The failure rate can be decreased by reducing the temperature and the voltage but
they will not be guaranteed.
— 65 —
GC11010004
No.
12
Process
Caution during
operation of
equipment
Condition
1) A capacitor shall not be touched directly with bare hands during operation in
order to avoid electric shock.
Electric energy held by the capacitor may be discharged through the human
body when touched with a bare hand.
Even when the equipment is off, a capacitor may stay charged. The capacitor
should be handled after being completely discharged using a resistor.
2) The terminals of a capacitor shall not be short-circuited by any accidental
contact with a conductive object. A capacitor shall not be exposed to a
conductive liquid such as an acid or alkali solution. A conductive object or liquid,
such as acid and alkali, between the terminals may lead to the breakdown of a
capacitor due to short circuit.
3) Confirm that the environment to which the equipment will be exposed during
transportation and operation meets the specified conditions. Do not to use the
equipment in the following environments.
(1) Environment where a capacitor is spattered with water or oil
(2) Environment where a capacitor is exposed to direct sunlight
(3) Environment where a capacitor is exposed to Ozone, ultraviolet rays or
radiation
(4) Environment where a capacitor exposed to corrosive gas(e.g. hydrogen
sulfide, sulfur dioxide, chlorine. ammonia gas etc.)
(5) Environment where a capacitor exposed to vibration or mechanical shock
exceeding the specified limits.
(6) Atmosphere change with causes condensation
13
Others
△Caution
!
E
A
The products listed on this specification sheet are intended for use in general
electronic equipment (AV equipment, telecommunications equipment, home
appliances, amusement equipment, computer equipment, personal equipment, office
equipment, measurement equipment, industrial robots) under a normal operation and
use condition.
The products are not designed or warranted to meet the requirements of the
applications listed below, whose performance and/or quality require a more stringent
level of safety or reliability, or whose failure, malfunction or trouble could cause
serious damage to society, person or property. Please understand that we are not
responsible for any damage or liability caused by use of the products in any of the
applications below or for any other use exceeding the range or conditions set forth in
this specification sheet. If you intend to use the products in the applications listed
below or if you have special requirements exceeding the range or conditions set forth
in this specification, please contact us.
(1) Aerospace/Aviation equipment
(2) Transportation equipment (cars, electric trains, ships, etc.)
(3) Medical equipment (Excepting Pharmaceutical Affairs Law classification Class1, 2)
(4) Power-generation control equipment
(5) Atomic energy-related equipment
(6) Seabed equipment
(7) Transportation control equipment
(8) Public information-processing equipment
(9) Military equipment
(10) Electric heating apparatus, burning equipment
(11) Disaster prevention/crime prevention equipment
(12) Safety equipment
(13) Other applications that are not considered general-purpose applications
When designing your equipment even for general-purpose applications, you are
kindly requested to take into consideration securing protection circuit/device or
providing backup circuits in your equipment.
— 66 —
GC11010004
11. TAPE PACKAGING SPECIFICATION
1. CONSTRUCTION AND DIMENSION OF TAPING
1-1. Dimensions of carrier tape
Dimensions of paper tape shall be according to Appendix 3.
1-2. Bulk part and leader of taping
Trailer(Empty)
160mm min.
Chips
Empty
160mm min.
Leader
Drawing direction
400mm min
1-3. Dimensions of reel
Dimensions of ⌀178 reel shall be according to Appendix 4.
1-4. Structure of taping
Top cover tape
Pitch hole
Cavity (Chip insert)
Paper carrier tape
2. CHIP QUANTITY
Please refer to detail page on TDK web.
— 67 —
GC11010004
3. PERFORMANCE SPECIFICATIONS
3-1. Fixing peeling strength (top tape)
0.05-0.7N. (See the following figure.)
Direction of cover tape pulling
Top cover tape
Carrier tape
0～15°
Direction of pulling
Paper tape should not adhere to top cover tape
When pull the cover tape.
3-2. Carrier tape shall be flexible enough to be wound around a minimum radius
of 30mm with components in tape.
3-3. The missing of components shall be less than 0.1%
3-4. Components shall not stick to fixing tape.
3-5. When get cover tape off, there shall not be difficulties by unfitting clearance, burrs and
crushes of cavities, also the sprocket holes shall not be covered by absorbing dust into
the suction nozzle.
— 68 —
GC11010004
Appendix 3
Paper Tape
Pitch hole
Cavity (Chip insert)
J
E
D
A
C
B
K
H
G
F
T
(
Symbol
A
B
C
D
E
Dimension
(0.25)
(0.45)
8.00±0.30
3.50±0.05
1.75±0.10
Symbol
G
H
J
K
T
Dimension
2.00±0.05
4.00±0.05
0.23±0.02
0.29 min.
) Reference value.
⌀1.50
+0.10
0
（Unit：mm）
F
2.00±0.05
Appendix 4
Dimensions of reel (Material : Polystyrene)
W2
E
C
B
D
R
W1
A
（Unit：mm）
Symbol
A
B
C
D
E
W1
Dimension
⌀178±2.0
⌀60±2.0
⌀13±0.5
⌀21±0.8
2.0±0.5
9.0±0.3
13.0±1.4
1.0
Symbol
Dimension
W2
R
— 69 —
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