C2012X8R1E154K/1.25

C Series High Temperature Application Type: C1005 [EIA CC0402] C1608 [EIA CC0603] C2012 [EIA CC0805] C3216 [EIA CC1206] C3225 [EIA CC1210] Issue date: April 2011 TDK MLCC US Catalog Version B11 REMINDERS Please read before using this product SAFETY REMINDERS REMINDERS 1. 2. 3. 4. 5. 6. 7. If you intend to use a product listed in this catalog for a purpose that may cause loss of life or other damage, you must contact our company’s sales window. We may modify products or discontinue production of a product listed in this catalog without prior notification. We provide “Delivery Specification” that explain precautions for the specifications and safety of each product listed in this catalog. We strongly recommend that you exchange these delivery specifications with customers that use one of these products. If you plan to export a product listed in this catalog, keep in mind that it may be a restricted item according to the “Foreign Exchange and Foreign Trade Control Law”. In such cases, it is necessary to acquire export permission in harmony with this law. Any reproduction or transferring of the contents of this catalog is prohibited without prior permission from our company. We are not responsible for problems that occur related to the intellectual property rights or other rights of our company or a third party when you use a product listed in this catalog. We do not grant license of these rights. This catalog only applies to products purchased through our company or one of our company’s official agencies. This catalog does not apply to products that are purchased through other third parties. TDK MLCC US Catalog Page 118 Version B11 C Series High Temperature Application Type: C1005, C1608, C2012, C3216, C3225 Features • These products have no polarity. • Their electrostatic capacity temperature response is stable at 15% even in high temperature ranges (up to 150°C). Parameters Specifications Temperature Characteristics Operating Temperature Dissipation Factor Insulation Resistance -55 to +150ºC ΔC/C = ±15% -55 to +150ºC 3% maximum 10 GΩ or 500 MΩ • µF minimum Voltage Proof 2.5 • rated voltage for 1 to 5 seconds Charge/Discharge ≤ 50 mA Applications • Automotive (underhood) • Measurement instruments used at high temperature environments • LCD display • Sensor Module Shape & Dimensions L W T B Body Length Body Width Body Height Terminal Width Dimensions in mm Part Number Construction C Series Name Dimensions L x W (mm) Case Code C1005 C1608 C2012 C3216 C3225 Length 1.00 ± 0.05 1.60 ± 0.10 2.00 ± 0.20 3.20 ± 0.20 3.20 ± 0.40 Temperature Characteristic Temperature Characteristics X8R Capacitance Change ± 15% 3225 X8R 1E 335 K T XXXX Width 0.50 ± 0.05 0.80 ± 0.10 1.25 ± 0.20 1.60 ± 0.20 2.50 ± 0.30 Style Tape & Reel Tolerance Code K Tolerance ± 10% Nominal Capacitance (pF) The capacitance is expressed in three digit codes and in units of pico Farads (pF). The first and second digits identify the first and second significant figures of the capacitance. The third digit identifies the multiplier. R designates a decimal point. Temperature Range -55 to +150ºC Voltage (DC) 25V 50V 100V TDK MLCC US Catalog Packaging Code T Capacitance Tolerance Rated Voltage (DC) Voltage Code 1E 1H 2A Internal Codes Packaging Style Capacitance Code 0R5 010 102 105 Page 119 Capacitance 0.5pF 1pF 1,000pF (1nF) 1,000,000pF (1µF) Version B11 Capacitance Range Chart C1005 [EIA CC0402] Capacitance Range Chart Temperature Characteristics: X8R (± 15%) Rated Voltage: 50V (1H), 25V (1E) Capacitance (pF) X8R Cap Code 150 220 330 470 680 1,000 1,500 2,200 3,300 4,700 6,800 10,000 151 221 331 471 681 102 152 222 332 472 682 103 Tolerance 1H (50V) 1E (25V) K: ± 10% Standard Thickness 0.50 mm Capacitance Range Table C1005 [EIA CC0402] Class 2 (Temperature Stable) Temperature Characteristics: X8R (-55 to +150ºC, ±15%) TDK Part Number (Ordering Code) Temperature Characteristics Rated Voltage Capacitance (pF) Capacitance Tolerance Thickness (mm) C1005X8R1E682K X8R 25V 6,800 ± 10% 0.50 ± 0.05 C1005X8R1E103K X8R 25V 10,000 ± 10% 0.50 ± 0.05 C1005X8R1H151K X8R 50V 150 ± 10% 0.50 ± 0.05 C1005X8R1H221K X8R 50V 220 ± 10% 0.50 ± 0.05 C1005X8R1H331K X8R 50V 330 ± 10% 0.50 ± 0.05 C1005X8R1H471K X8R 50V 470 ± 10% 0.50 ± 0.05 C1005X8R1H681K X8R 50V 680 ± 10% 0.50 ± 0.05 C1005X8R1H102K X8R 50V 1,000 ± 10% 0.50 ± 0.05 C1005X8R1H152K X8R 50V 1,500 ± 10% 0.50 ± 0.05 C1005X8R1H222K X8R 50V 2,200 ± 10% 0.50 ± 0.05 C1005X8R1H332K X8R 50V 3,300 ± 10% 0.50 ± 0.05 C1005X8R1H472K X8R 50V 4,700 ± 10% 0.50 ± 0.05 TDK MLCC US Catalog Page 120 Version B11 Capacitance Range Chart C1608 [EIA CC0603] Capacitance Range Chart Temperature Characteristics: X8R (± 15%) Rated Voltage: 100V (2A), 50V (1H), 25V (1E) Capacitance (pF) X8R Cap Code 1,000 1,500 2,200 3,300 4,700 6,800 10,000 15,000 22,000 33,000 47,000 68,000 100,000 102 152 222 332 472 682 103 153 223 333 473 683 104 Tolerance 2A (100V) 1H (50V) 1E (25V) K: ± 10% Standard Thickness 0.80 mm Capacitance Range Table C1608 [EIA CC0603] Class 2 (Temperature Stable) Temperature Characteristics: X8R (-55 to +150ºC, ±15%) TDK Part Number Temperature Rated (Ordering Code) Characteristics Voltage Capacitance (pF) Capacitance Tolerance Thickness (mm) C1608X8R1E683K X8R 25V 68,000 ± 10% 0.80 ± 0.10 C1608X8R1E104K X8R 25V 100,000 ± 10% 0.80 ± 0.10 C1608X8R1H102K X8R 50V 1,000 ± 10% 0.80 ± 0.10 C1608X8R1H152K X8R 50V 1,500 ± 10% 0.80 ± 0.10 C1608X8R1H222K X8R 50V 2,200 ± 10% 0.80 ± 0.10 C1608X8R1H332K X8R 50V 3,300 ± 10% 0.80 ± 0.10 C1608X8R1H472K X8R 50V 4,700 ± 10% 0.80 ± 0.10 C1608X8R1H682K X8R 50V 6,800 ± 10% 0.80 ± 0.10 C1608X8R1H103K X8R 50V 10,000 ± 10% 0.80 ± 0.10 C1608X8R1H153K X8R 50V 15,000 ± 10% 0.80 ± 0.10 C1608X8R1H223K X8R 50V 22,000 ± 10% 0.80 ± 0.10 C1608X8R1H333K X8R 50V 33,000 ± 10% 0.80 ± 0.10 C1608X8R1H473K X8R 50V 47,000 ± 10% 0.80 ± 0.10 C1608X8R2A102K X8R 100V 1,000 ± 10% 0.80 ± 0.10 C1608X8R2A152K X8R 100V 1,500 ± 10% 0.80 ± 0.10 C1608X8R2A222K X8R 100V 2,200 ± 10% 0.80 ± 0.10 C1608X8R2A332K X8R 100V 3,300 ± 10% 0.80 ± 0.10 C1608X8R2A472K X8R 100V 4,700 ± 10% 0.80 ± 0.10 C1608X8R2A682K X8R 100V 6,800 ± 10% 0.80 ± 0.10 C1608X8R2A103K X8R 100V 10,000 ± 10% 0.80 ± 0.10 C1608X8R2A153K X8R 100V 15,000 ± 10% 0.80 ± 0.10 TDK MLCC US Catalog Page 121 Version B11 Capacitance Range Chart C2012 [EIA CC0805] Capacitance Range Chart Temperature Characteristics: X8R (± 15%) Rated Voltage: 100V (2A), 50V (1H), 25V (1E) Capacitance (pF) 22,000 68,000 100,000 150,000 220,000 330,000 X8R Cap Code 223 683 104 154 224 334 Tolerance 2A (100V) 1H (50V) 1E (25V) K: ± 10% Standard Thickness 0.85 mm 1.25 mm Capacitance Range Table C2012 [EIA CC0805] Class 2 (Temperature Stable) Temperature Characteristics: X8R (-55 to +150ºC, ±15%) TDK Part Number Temperature Rated (Ordering Code) Characteristics Voltage Capacitance (pF) Capacitance Tolerance Thickness (mm) C2012X8R1E154K/0.85 X8R 25V 150,000 ± 10% 0.85 ± 0.10 C2012X8R1E224K X8R 25V 220,000 ± 10% 1.25 ± 0.20 C2012X8R1E334K X8R 25V 330,000 ± 10% 1.25 ± 0.20 C2012X8R1H683K X8R 50V 68,000 ± 10% 1.25 ± 0.20 C2012X8R1H104K X8R 50V 100,000 ± 10% 1.25 ± 0.20 C2012X8R2A223K X8R 100V 22,000 ± 10% 1.25 ± 0.20 TDK MLCC US Catalog Page 122 Version B11 Capacitance Range Chart C3216 [EIA CC1206] Capacitance Range Chart Temperature Characteristics: X8R (± 15%) Rated Voltage: 100V (2A), 50V (1H), 25V (1E) Capacitance (pF) 33,000 47,000 68,000 100,000 150,000 220,000 330,000 470,000 680,000 1,000,000 X8R Cap Code 333 473 683 104 154 224 334 474 684 105 Tolerance 2A (100V) 1H (50V) 1E (25V) K: ± 10% Standard Thickness 0.85 mm 1.15 mm 1.60 mm Capacitance Range Table C3216 [EIA CC1206] Class 2 (Temperature Stable) Temperature Characteristics: X8R (-55 to +150ºC, ±15%) TDK Part Number Temperature Rated (Ordering Code) Characteristics Voltage Capacitance (pF) Capacitance Tolerance Thickness (mm) C3216X8R1E334K X8R 25V 330,000 ± 10% 0.85 ± 0.10 C3216X8R1E474K X8R 25V 470,000 ± 10% 0.85 ± 0.10 C3216X8R1E684K X8R 25V 680,000 ± 10% 1.15 ± 0.10 C3216X8R1E105K X8R 25V 1,000,000 ± 10% 1.60 ± 0.30 C3216X8R1H154K X8R 50V 150,000 ± 10% 0.85 ± 0.10 C3216X8R1H224K X8R 50V 220,000 ± 10% 1.15 ± 0.10 C3216X8R1H334K X8R 50V 330,000 ± 10% 1.60 ± 0.30 C3216X8R1H474K X8R 50V 470,000 ± 10% 1.60 ± 0.30 C3216X8R2A333K X8R 100V 33,000 ± 10% 0.85 ± 0.10 C3216X8R2A473K X8R 100V 47,000 ± 10% 0.85 ± 0.10 C3216X8R2A683K X8R 100V 68,000 ± 10% 1.15 ± 0.10 C3216X8R2A104K X8R 100V 100,000 ± 10% 1.15 ± 0.10 C3216X8R2A154K X8R 100V 150,000 ± 10% 1.60 ± 0.30 TDK MLCC US Catalog Page 123 Version B11 Capacitance Range Chart C3225 [EIA CC1210] Capacitance Range Chart Temperature Characteristics: X8R (± 15%) Rated Voltage: 100V (2A), 50V (1H), 25V (1E) Capacitance (pF) 1,500,000 2,200,000 3,300,000 X8R Cap Code 155 225 335 Tolerance 2A (100V) 1H (50V) 1E (25V) Standard Thickness 1.60 mm 2.00 mm K: ± 10% 2.50 mm Capacitance Range Table C3225 [EIA CC1210] Class 2 (Temperature Stable) Temperature Characteristics: X8R (-55 to +150ºC, ±15%) TDK Part Number Temperature Rated (Ordering Code) Characteristics Voltage Capacitance (pF) Capacitance Tolerance Thickness (mm) C3225X8R1E155K X8R 25V 1,500,000 ± 10% 1.60 ± 0.30 C3225X8R1E225K X8R 25V 2,200,000 ± 10% 2.00 ± 0.20 C3225X8R1E335K X8R 25V 3,300,000 ± 10% 2.50 ± 0.30 TDK MLCC US Catalog Page 124 Version B11 General Specifications C Series – High Temperature Application No. Item Performance Test or Inspection Method 1 External Appearance No defects which may affect performance. Inspect with magnifying glass (3×). 2 Insulation Resistance 10,000MΩ or 500 MΩ・μF min. Apply rated voltage for 60s. 3 Voltage Proof Withstand test voltage without insulation breakdown or other damage. 2.5 x VDC rated voltage shall be applied for 1～5s. Charge / discharge current shall not exceed 50mA. 4 Capacitance Within the specified tolerance. 5 6 Dissipation Factor Temperature Characteristics of Capacitance T.C. D.F. X8R 0.03 max. Measuring Frequency Measuring Voltage 1kHz±10% 1.0±0.2Vrms See No.4 in this table for measuring condition. Capacitance Change (%) Capacitance shall be measured by the steps shown in the following table after thermal equilibrium is obtained for each step. ∆C be calculated ref. STEP3 reading No Voltage Applied X8R: ± 15% Step 7 Robustness of Terminations No sign of termination coming off, breakage of ceramic, or other abnormal signs. Temperature (ºC) 1 Reference temp. ± 2 2 Min. operating temp. ± 2 3 Reference temp. ± 2 4 Max. operating temp. ± 2 Reflow solder the capacitor on a P.C. board (shown in Appendix 1) and apply a pushing force of 5N (C1608, C2012, C3216, C3225 type) and 2N (C1005 type) for 10±1s. Pushing force P.C. board Capacitor 8 Bending No mechanical damage. Reflow solder the capacitor on a P.C. board (shown in Appendix 2) and bend 1mm as illustrated: 20 50 F R230 1 45 45 Unit: mm TDK MLCC US Catalog Page 125 Version B11 General Specifications C Series – High Temperature Application No. Item Performance Test or Inspection Method 9 Solderability New solder to cover over 75% of termination. Completely soak both terminations in solder at 235±5ºC for 2±0.5s. 25% may have pinholes or rough spots but not concentrated in one spot. Solder: H63A (JIS Z 3282) Ceramic surface of ”A sections” shall not be exposed due to melting or shifting of termination material. Flux: Isopropyl alcohol (JIS K 8839) Rosin (JIS K 5902) 25% solid solution. A section 10 Resistance to solder heat External appearance Capacitance 11 No cracks are allowed and terminations shall be covered at least 60% with new solder. Characteristics Change from the value before test Class 2 ± 7.5 % X8R D.F. (Class 2) Meet the initial spec. Insulation Resistance Meet the initial spec. Voltage Proof No insulation breakdown or other damage. Capacitance D.F. (Class 2) TDK MLCC US Catalog Flux: Isopropyl alcohol (JIS K 8839) Rosin (JIS K 5902) 25% solid solution. Leave the capacitor in ambient conditions for 48±4h before measurement. Reflow solder the capacitor on a P.C. board (shown in Appendix 1) before testing. No mechanical damage. Characteristics Change from the value before test Class 2 ± 7.5 % X8R Preheating condition Temp. : 150±10ºC Time : 1～2min. Solder: H63A(JIS Z 3282) Vibration External appearance Completely soak both terminations in solder at 260±5ºC for 5±1s. Vibrate the capacitor with amplitude of 1.5mm P-P sweeping the frequencies from 10Hz to 55Hz and back to 10Hz in after 1min. Repeat this for 2h each in 3 perpendicular directions. Meet the initial spec. Page 126 Version B11 General Specifications No. Item 12 Temperature cycle External appearance C Series – High Temperature Application Performance 13 Characteristics Change from the value before test Class 2 ± 7.5 % X8R Meet the initial spec. Insulation Resistance Meet the initial spec. Voltage Proof No insulation breakdown or other damage. Moisture Resistance (Steady State) External appearance Capacitance 14 Reflow solder the capacitors on P.C. board (shown in Appendix 1) before testing. No mechanical damage. Capacitance D.F. (Class 2) Test or Inspection Method Characteristics Change from the value before test Class 2 ± 12.5 % D.F. (Class 2) 200% of initial spec max. Insulation Resistance 1,000MΩ or 50 MΩ・μF min. Moisture Resistance External appearance Capacitance Characteristics Change from the value before test Class 2 ± 12.5 % D.F. (Class 2) 200% of initial spec max. Insulation Resistance 500MΩ or 25 MΩ・μF min. Step Temperature (ºC) Time (min.) 1 Min. operating temp. ±3 30 ± 3 2 Reference Temp. 2–5 3 Max. operating temp. ± 2 30 ± 2 4 Reference Temp. 2-5 Leave at temperature 40±2ºC, 90 to 95%RH for 500 +24,0h. Leave the capacitor in ambient conditions for 48±4h before measurement. Reflow solder the capacitor on P.C. board (shown in Appendix 1) before testing. No mechanical damage. X8R Leave the capacitors in ambient conditions for 48±4h before measurement. Reflow solder the capacitor on P.C. board (shown in Appendix 1) before testing. No mechanical damage. X8R Expose the capacitor in the condition step 1 through 4, and repeat 5 times consecutively. Apply the rated voltage at temperature 40±2ºC and 90 to 95%RH for 500+24,0h. Charge/discharge current shall not exceed 50mA. Leave the capacitor in ambient conditions for 48±4h before measurement. Voltage conditioning: Voltage treats the capacitor under testing temperature and voltage for 1 hour. Leave the capacitor in ambient condition for 48±4h before measurement. Use this measurement for initial value. TDK MLCC US Catalog Page 127 Version B11 General Specifications No. Item 15 Life External appearance Capacitance C Series – High Temperature Application Performance Test or Inspection Method Reflow solder the capacitor on P.C. board (shown in Appendix 1) before testing. No mechanical damage. Apply 2× rated voltage at maximum operating temperature ±3ºC for 1,000 +48.0h. Characteristics Change from the value before test Class 2 ± 15 % X8R Charge/discharge current shall not exceed 50mA. Leave the capacitor in ambient conditions for 48±4h before measurement. D.F. (Class 2) Characteristics X8R: 200% of initial spec. max Insulation Resistance 1,000MΩ or 50 MΩ・μF min. Voltage conditioning : Voltage treats the capacitor under testing temperature and voltage for 1 hour. Leave the capacitor in ambient conditions for 48±4h before measurement. Use this measurement for initial value. *As for the initial measurement of capacitors on number 6,10,11,12 and 13, leave capacitor at 150 –10, 0°C for 1h and measure the value after leaving the capacitor for 48±4h in ambient conditions. TDK MLCC US Catalog Page 128 Version B11 General Specifications Appendix - 1a Appendix - 1b P.C. Board for reliability test Applied for C1005, C1608, C2012, C3216 P.C. Board for reliability test Applied for C3225 c c Solder Resist 40 mm b 100 mm a 40 mm 100 mm a Copper Solder Resist Slit Copper Appendix - 2a Appendix - 2b P.C. Board for bending test Applied for C1005 P.C. Board for bending test Applied for C1608, C2012, C3216, C3225 100 mm a c 40 mm a Solder resist b 40 mm b 1.0 mm 100 mm 1.0 mm b C Series – High Temperature Application Copper Solder Resist c b Copper Material : Glass Epoxy (As per JIS C6484 GE4) P.C. Board thickness : Appendix-2a Appendix-1a, 1b, 2b Case Code 0.8mm 1.6mm Copper (thickness 0.035mm) Solder resist TDK MLCC US Catalog Page 129 Dimensions (mm) JIS EIA a b c C1005 CC0402 0.4 1.5 0.5 C1608 CC0603 1.0 3.0 1.2 C2012 CC0805 1.2 4.0 1.65 C3216 CC1206 2.2 5.0 2.0 C3225 CC1210 2.2 5.0 2.9 Version B11 Soldering Information C Series – High Temperature Application • Recommended Soldering Land Pattern Chip capacitor • Recommended Soldering Profile Reflow Soldering Solder land Preheating Wave Soldering Unit: mm C1608 [CC0603] C2012 [CC0805] C3216 [CC1206] A 0.7 - 1.0 1.0 - 1.3 2.1 - 2.5 B 0.8 - 1.0 1.0 - 1.2 1.1 - 1.3 C 0.6 - 0.8 0.8 - 1.1 1.0 - 1.3 C1005 [CC0402] C1608 [CC0603] C2012 [CC0805] A 0.3 - 0.5 0.6 - 0.8 0.9 - 1.2 B 0.35 - 0.45 0.6 - 0.8 0.7 - 0.9 C 0.4 - 0.6 0.6 - 0.8 0.9 - 1.2 Type Reflow Soldering Type Symbol Reflow Soldering Unit: mm C3225 [CC1210] 2.0 - 2.4 2.0 - 2.4 B 1.0 - 1.2 1.0 - 1.2 C 1.1 - 1.6 1.9 - 2.5 Symbol A Adequate solder Insufficient solder TDK MLCC US Catalog Temp (ºC) ∆T 0 Over 60 sec. Preheating Peak Temp time 3sec. (As short as possible) Manual soldering (Solder iron) 300 ∆T 0 Preheating 3sec. (As short as possible) Recommended soldering duration Temp./ Dura. Higher tensile force on the chip capacitor may cause cracking. Maximum amount Minimum amount Small solder fillet may cause contact failure or failure to hold the chip capacitor to the P.C. board. Wave Soldering Reflow Soldering Peak temp (°C) Duration (sec.) Peak temp (°C) Duration (sec.) Sn-Pb Solder 250 max. 3 max. 230 max. 20 max. Lead-Free Solder 260 max. 5 max. 260 max. 10 max. Solder • Recommended Solder Amount Excessive solder 0 Unit: mm C3216 [CC1206] Type ∆T Temp (ºC) Solder resist Temp (ºC) A B Symbol 300 Peak Temp C Manual soldering (Solder iron) Soldering Natural cooling Recommended solder compositions Sn-37Pb (Sn-Pb solder) Sn-3.0Ag-0.5Cu (Lead Free Solder) Preheating Condition Soldering Wave soldering Reflow soldering Manual soldering Page 130 Case Size - JIS (EIA) Temp. (ºC) C1608(CC0603), C2012(CC0805), C3216(CC1206) ∆T ≤ 150 C1005(CC0402), C1608(CC0603), C2012(CC0805), C3216(CC1206) ∆T ≤ 150 C3225(CC1210) ∆T ≤ 130 C1005(CC0402), C1608(CC0603), C2012(CC0805), C3216(CC1206) ∆T ≤ 150 C3225(CC1210) ∆T ≤ 130 Version B11 Packaging Information C Series – High Temperature Application • Carrier Tape Configuration Bulk 160mm min. Bulk 160mm min Chips Leader Drawing direction 400mm min • Peel Back Force (Top Tape) Carrier tape Direction & angle of pull Top cover tape • Carrier tape shall be flexible enough to be wound around a minimum radius of 30mm with components in tape. • The missing of components shall be less than 0.1% • Components shall not stick to the cover tape. • The cover tape shall not protrude beyond the edges of the carrier tape not shall cover the sprocket holes. 0.05 – 0.7 N 0~15° • Chip Quantity Per Reel and Structure of Reel (Paper & Plastic) Paper Carrier Tape & Reel Top cover tape Plastic Carrier Tape & Reel Top cover tape Pitch hole Bottom cover tape Case Code JIS EIA C1005 CC0402 C1608 CC0603 C2012 CC0805 C3216 CC1206 C3225 CC1210 TDK MLCC US Catalog Pitch hole Plastic carrier tape Paper carrier tape Chip Thickness 0.50 mm 0.80 mm 0.85 mm 1.25 mm 0.85 mm 1.15 mm 1.60 mm 1.60 mm 2.00 mm 2.50 mm Taping Material Paper Paper Paper Plastic Paper Plastic Plastic Chip quantity (pcs.) φ178mm (7”) reel φ330mm (13”) reel 10,000 50,000 4,000 10,000 4,000 10,000 2,000 4,000 10,000 2,000 8,000 2,000 8,000 1,000 Page 131 5,000 Version B11 Additional Information C Series – High Temperature Application • Shape & Dimensions • Environmental Information Terminal electrode L B B W G T TDK Corporation established internal product environmental assurance standards that include the six hazardous substances banned by the EU RoHS Directive1 enforced on July 1, 2006 along with additional substances independently banned by TDK and has successfully completed making general purpose electronic components conform to the RoHS Directive2. 1. Abbreviation for Restriction on Hazardous Substances, which refers to the regulation EU Directive 2002/95/EC on hazardous substances by the European Union (EU) effective from July 1, 2006. The Directive bans the use of six specific hazardous substances in electric and electronic devices and products handled within the EU. The six substances are lead, mercury, cadmium, hexavalent chromium, PBB (polybrominated biphenyls), and PBDE (polybrominated diphenyl ethers). 2. This means that, in conformity with the EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. Internal electrode Ceramic dielectric Case Code JIS EIA C1005 CC0402 C1608 CC0603 L 1.00 1.60 C2012 CC0805 2.00 C3216 CC1206 3.20 C3225 CC1210 3.20 Dimensions (mm) W T B 0.50 0.50 0.25 0.80 0.80 0.20 min. 0.85 1.20 0.20 min. 1.25 0.85 1.60 1.15 0.20 min. 1.60 1.60 2.50 2.00 0.20 min. 2.50 G 0.35 min. 0.30 min. 0.50 min. 1.00 min. 1.00 min • Inside Structure & Material System 3 4 NAME (1) Ceramic Dielectric (2) Internal Electrode (3) (4) 5 2 1 No. For REACH (SVHC : 15 substances according to ECHA / October 2008) : All TDK MLCC do not contain these 15 substances. For European Directive 2000/53/CE and 2005/673/CE : Cadmium, Hexavalent Chromium, Mercury, Lead are not contained in all TDK MLCC. For European Directive 2003/11/CE : Pentabromodiphenyl-ether, Octabromodiphenyl-ether are not contained in all TDK MLCC. MATERIAL Class 1 Class 2 CaZrO3 BaTiO3 Nickel (Ni) Copper (Cu) Termination (5) TDK MLCC US Catalog Nickel (Ni) Tin (Sn) Page 132 Version B11