AC11010002
DELIVERY SPECIFICATION
To
SPEC. No. A-General-i
D A T E : Jun, 2020
Upon the acceptance of this spec. previous spec.
(C2014-0057) shall be abolished.
Non-Controlled Copy
CUSTOMER’S PRODUCT NAME
TDK'S PRODUCT NAME
Multilayer Ceramic Chip Capacitors
Bulk and Tape packaging 【RoHS compliant】
CGA1,CGA2,CGA3,CGA4,CGA5,CGA6,CGA8,CGA9Type
C0G,NP0,X7R,X7S,X7T,X8R,X8L Characteristics
Please return this specification to TDK representatives with your signature.
If orders are placed without returned specification, please allow us to j udge that specification is
accepted by your side.
RECEIPT CONFIRMATION
DATE:
YEAR
MONTH
DAY
Test conditions in this specification based on AEC-Q200 for automotive application.
TDK Corporation
Sales
Electronic Components
Sales & Marketing Group
APPROVED
Person in charge
Engineering
Electronic Components Business Company
Ceramic Capacitors Business Group
APPROVED
CHECKED
Person in charge
AC11010002
■CATALOG NUMBER CONSTRUCTION
CGA
6
P
1
X7R
1N
106
M
250
A
C
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
(11)
(1) Series
(6) Rated voltage (DC)
(2) Dimensions L x W (mm)
Code
Voltage (DC)
0G
0J
4V
6.3V
Code
EIA
Length
Width
Terminal
width
1
2
3
CC0201
CC0402
CC0603
0.60
1.00
1.60
0.30
0.50
0.80
0.10
0.10
0.20
1A
1C
1E
1V
10V
16V
25V
35V
4
CC0805
2.00
1.25
0.20
1H
50V
5
6
8
9
CC1206
CC1210
CC1812
CC2220
3.20
3.20
4.50
5.70
1.60
2.50
3.20
5.00
0.20
0.20
0.20
0.20
1N
75V
(3) Thickness code
Code
Thickness
A
0.30mm
B
0.50mm
C
0.60mm
E
0.80mm
F
0.85mm
H
1.15mm
J
1.25mm
L
1.60mm
M
2.00mm
N
2.30mm
P
2.50mm
Q
2.80mm
R
3.20mm
(7) Nominal capacitance (pF)
The capacitance is expressed in three digit
codes and in units of pico Farads (pF). The first
and second digits identify the first and second
significant figures of the capacitance. The third
digit identifies the multiplier. R designates a
decimal point.
(Example)
0R5 = 0.5pF
101 = 100pF
225 = 2,200,000pF = 2.2μF
(8) Capacitance tolerance
Code
Tolerance
C
±0.25pF
D
±0.50pF
J
±5%
K
±10%
M
±20%
(4) Voltage condition for life test
Symbol
1
2
Condition
1 x R.V.
2 x R.V.
(9) Thickness
Code
Thickness
030
0.30mm
3
1.5 x R.V.
050
060
0.50mm
0.60mm
(5) Temperature characteristics
080
0.80mm
Temperature
characteristics
Temperature coefficient Temperature
or capacitance change
range
085
115
0.85mm
1.15mm
C0G
0±30ppm/℃
-55 to +125℃
125
1.25mm
X5R
±15%
-55 to +85℃
160
1.60mm
X7R
X7S
±15%
±22%
-55 to +125℃
-55 to +125℃
200
230
2.00mm
2.30mm
X7T
+22,-33%
-55 to +125℃
250
2.50mm
280
320
2.80mm
3.20mm
(10) Packaging style
Code
Style
A
B
178mm reel, 4mm pitch
178mm reel, 2mm pitch
K
178mm reel, 8mm pitch
(11) Special reserved code
Code
Description
A,B,C
—1—
TDK internal code
AC11010002
■CATALOG NUMBER CONSTRUCTION
CGA
9
P
3
X7S
2A
156
M
250
K
B
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
(11)
(1) Series
(6) Rated voltage (DC)
Code
Voltage (DC)
(2) Dimensions L x W (mm)
Code
EIA
Length
Width
Terminal
width
2
3
4
5
6
8
9
CC0402
CC0603
CC0805
CC1206
CC1210
CC1812
CC2220
1.00
1.60
2.00
3.20
3.20
4.50
5.70
0.50
0.80
1.25
1.60
2.50
3.20
5.00
0.10
0.20
0.20
0.20
0.20
0.20
0.20
(3) Thickness code
Code
Thickness
B
0.50mm
C
0.60mm
E
0.80mm
F
0.85mm
H
1.15mm
J
1.25mm
K
1.30mm
L
1.60mm
M
2.00mm
N
2.30mm
P
2.50mm
Q
2.80mm
R
3.20mm
(4) Voltage
Symbol
1
2
3
4
2A
100V
2E
250V
2W
2J
450V
630V
(7) Nominal capacitance (pF)
The capacitance is expressed in three digit
codes and in units of pico Farads (pF). The first
and second digits identify the first and second
significant figures of the capacitance. The third
digit identifies the multiplier. R designates a
decimal point.
(Example)
0R5 = 0.5pF
101 = 100pF
225 = 2,200,000pF = 2.2μF
(8) Capacitance tolerance
Code
Tolerance
C
±0.25pF
D
±0.50pF
J
±5%
K
±10%
M
±20%
(9) Thickness
Code
Thickness
050
0.50mm
060
0.60mm
080
0.80mm
085
0.85mm
115
1.15mm
condition for life test
Condition
1 x R.V.
2 x R.V.
1.5 x R.V.
1.2 x R.V.
(5) Temperature characteristics
125
130
160
1.25mm
1.30mm
1.60mm
Temperature
characteristics
Temperature coefficient
or capacitance change
Temperature
range
200
230
2.00mm
2.30mm
C0G
0±30ppm/℃
-55 to +125℃
250
2.50mm
X7R
X7S
±15%
±22%
-55 to +125℃
-55 to +125℃
280
320
2.80mm
3.20mm
X7T
+22,-33%
-55 to +125℃
(10) Packaging style
Code
Style
A
B
K
178mm reel, 4mm pitch
178mm reel, 2mm pitch
178mm reel, 8mm pitch
(11) Special reserved code
—2—
Code
Description
A,B,C,N
TDK internal code
AC11010002
■CATALOG NUMBER CONSTRUCTION
CGA
6
P
1
X8L
1C
226
M
250
A
C
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
(11)
(1) Series
(2) Dimensions L x W (mm)
Code
EIA
Length
Width
2
3
4
5
6
8
9
CC0402
CC0603
CC0805
CC1206
CC1210
CC1812
CC2220
1.00
1.60
2.00
3.20
3.20
4.50
5.70
0.50
0.80
1.25
1.60
2.50
3.20
5.00
Terminal
width
0.10
0.20
0.20
0.20
0.20
0.20
0.20
3
4
(Example)
0R5 = 0.5pF
101 = 100pF
225 = 2,200,000pF = 2.2μF
(8) Capacitance tolerance
Code
Tolerance
C
±0.25pF
D
±0.50pF
J
±5%
K
±10%
M
±20%
(3) Thickness code
Code
Thickness
B
0.50mm
C
0.60mm
E
0.80mm
F
0.85mm
H
1.15mm
J
1.25mm
L
1.60mm
M
2.00mm
N
2.30mm
P
2.50mm
Q
2.80mm
R
3.20mm
(4) Voltage
Symbol
1
2
(7) Nominal capacitance (pF)
The capacitance is expressed in three digit
codes and in units of pico Farads (pF). The first
and second digits identify the first and second
significant figures of the capacitance. The third
digit identifies the multiplier. R designates a
decimal point.
(9) Thickness
Code
Thickness
050
0.50mm
060
0.60mm
080
0.80mm
085
0.85mm
115
1.15mm
125
1.25mm
160
1.60mm
200
2.00mm
230
2.30mm
250
2.50mm
condition for life test
Condition
1 x R.V.
2 x R.V.
1.5 x R.V.
1.2 x R.V.
280
320
(5) Temperature characteristics
Temperature
characteristics
Temperature coefficient Temperature
or capacitance change range
NP0
X8R
0±30ppm/℃
±15%
-55 to +150℃
-55 to +150℃
X8L
+15,-40%
-55 to +150℃
2.80mm
3.20mm
(10) Packaging style
Code
Style
A
B
K
178mm reel, 4mm pitch
178mm reel, 2mm pitch
178mm reel, 8mm pitch
(11) Special reserved code
(6) Rated voltage (DC)
Code
Description
Code
0G
Voltage (DC)
4V
A,B,C,N
TDK internal code
0J
1A
1C
6.3V
10V
16V
1E
25V
1H
2A
50V
100V
2E
250V
2W
2J
450V
630V
—3—
AC11010002
SCOPE
This delivery specification shall be applied to Multilayer ceramic chip capacitors to be delivered to
.
PRODUCTION PLACES
Production places defined in this specification shall be TDK Corporation, TDK(Suzhou)Co.,Ltd
and TDK Components U.S.A.,Inc.
PRODUCT NAME
The name of the product to be defined in this specifications shall be
CGA◇◇◇○○○△△□□□×.
REFERENCE STANDARD
JIS C 5101－1：2010
C 5101－21：2014
Fixed capacitors for use in electronic equipment-Part 1: Generic specification
Fixed capacitors for use in electronic equipment-Part21 : Sectional specification
: Fixed surface mount multilayer capacitors of ceramic dielectric,Class1
Fixed capacitors for use in electronic equipment-Part22 : Sectional specification
: Fixed surface mount multilayer capacitors of ceramic dielectric,Class 2
C 0806－3：2014
Packaging of components for automatic handling - Part 3: Packaging of
surface mount components on continuous tapes
JEITA RCR－2335 C 2014 Safety application guide for fixed ceramic capacitors for use in electronic
C 5101－22：2014
equipment
CONTENTS
1. CODE CONSTRUCTION
2. COMBINATION OF RATED CAPACITANCE
AND TOLERANCE
3. OPERATING TEMPERATURE RANGE
4. STORING CONDITION AND TERM
5. P.C. BOARD
6. INDUSTRIAL WASTE DISPOSAL
7. PERFORMANCE
8. INSIDE STRUCTURE AND MATERIAL
9. PACKAGING
10. RECOMMENDATION
11. SOLDERING CONDITION
12. CAUTION
13. TAPE PACKAGING SPECIFICATION
When the mistrust in the spec arises, this specification is given priority. And it will be confirmed by written
spec change after conference of both posts involved.
This specification warrants the quality of the ceramic chip capacitor. Capacitors should be evaluated or
confirmed a state of mounted on your product.
If the use of the capacitors goes beyond the bounds of this specification, we can not afford to guarantee.
Division
Ceramic Capacitors Business Group
Date
Jun, 2020
—4—
SPEC. No.
A-General-i
AC11010002
1. CODE CONSTRUCTION
(Example)
CGA
CGA
(1)
2
6
(2)
B
P
(3)
3
3
(4)
X7R
X7S
(5)
1E
1H
(6)
104
106
(7)
(1) Series
(2) Case size
K
K
(8)
T
T
(9)
○○○○
○○○○
(10)
Symbol
Series
CGA
For automotive application
Terminal electrode
B
L
W
G
B
T
Internal electrode
Ceramic dielectric
Case size Case size
Symbol
(EIA style)
1
CGA1
(CC0201)
2
CGA2
(CC0402)
3
CGA3
(CC0603)
4
CGA4
(CC0805)
L
0.60±0.03
+0.10
0.60
-0.03
1.00±0.05
1.00±0.10
+0.10
1.00
-0.05
1.60±0.10
1.60±0.15
1.60±0.20
1.60 +0.30
-0.10
2.00±0.20
2.00 +0.25
-0.15
5
CGA5
(CC1206)
3.20±0.20
3.20 +0.30
-0.10
6
CGA6
(CC1210)
3.20±0.40
3.20 +0.45
-0.40
8
CGA8
(CC1812)
4.50±0.40
*As for each item, please refer to
Dimensions (mm)
W
T
0.30±0.03
0.30±0.03
+0.10
+0.10
0.30
0.30
-0.03
-0.03
0.50±0.05
0.50±0.05
0.50±0.10
0.50±0.10
+0.10
+0.10
0.50
0.50
-0.05
-0.05
0.80±0.10
0.80±0.10
0.80±0.15
0.80±0.15
0.80±0.20
0.80±0.20
+0.30
0.80
0.80 +0.30
-0.10
-0.10
0.60±0.15
1.25±0.20
0.85±0.15
1.25±0.20
1.25 +0.25
1.25 +0.25
-0.15
-0.15
0.60±0.15
0.85±0.15
1.60±0.20
1.15±0.15
1.30±0.20
1.60±0.20
+0.30
1.60
1.60 +0.30
-0.10
-0.10
1.25±0.20
1.60±0.20
2.50±0.30
2.00±0.20
2.30±0.20
2.50±0.30
+0.35
2.50
2.50 +0.35
-0.30
-0.30
1.60±0.20
2.00±0.20
3.20±0.40
2.30±0.20
2.50±0.30
3.20±0.30
detail page on TDK web.
—5—
B
G
0.10 min.
0.20 min.
0.10 min.
0.30 min.
0.20 min.
0.30 min.
0.20 min.
0.50 min.
0.20 min.
1.00 min.
0.20 min.
――
0.20 min.
――
AC11010002
Case size Case size
Symbol (EIA style)
Dimensions (mm)
L
W
T
1.60±0.20
2.00±0.20
CGA9
9
5.70±0.40
5.00±0.40
2.30±0.20
(CC2220)
2.50±0.30
2.80±0.30
*As for each item, please refer to detail page on TDK web..
B
G
0.20 min.
――
(3) Thickness
Symbol
A
B
C
E
F
H
J
Dimension(mm)
0.30
0.50
0.60
0.80
0.85
1.15
1.25
(4) Voltage condition in the life test
* Details are shown in table 1 No.16 at 7.PERFORMANCE.
Dimension(mm)
1.30
1.60
2.00
2.30
2.50
2.80
3.20
Symbol
K
L
M
N
P
Q
R
Condition
Symbol
1
Rated Voltage
2
Rated Voltage x 2
3
Rated Voltage x 1.5
4
Rated Voltage x 1.2
(5) Temperature Characteristics
* Details are shown in table 1 No.6 and No.7 at 7.PERFORMANCE.
(6) Rated Voltage
Symbol
Rated Voltage
Symbol
Rated Voltage
2J
DC 630 V
1V
DC 35 V
2W
DC 450 V
1E
DC 25 V
2E
DC 250 V
1C
DC 16 V
2A
DC 100 V
1A
DC 10 V
1N
DC 75 V
0J
DC 6.3 V
1H
DC 50 V
0G
DC 4 V
Symbol
Rated
Capacitance
(Example)
(7) Rated Capacitance
Stated in three digits and in units of pico farads (pF).
The first and Second digits identify the first and
second significant figures of the capacitance, the
third digit identifies the multiplier.
R is designated for a decimal point.
(8) Capacitance tolerance
* M tolerance shall be standard for over 10uF.
—6—
2R 2
2.2 pF
1 04
100,000 pF
Symbol
Tolerance
C
± 0.25 pF
D
± 0.5
pF
J
± 5%
K
± 10 %
*M
± 20 %
Capacitance
10pF and under
Over 10pF
AC11010002
(9) Packaging
* CGA1 and CGA2 types are applicable to tape packaging only.
(10) TDK internal code
—7—
Symbol
Packaging
B
Bulk
T
Taping
AC11010002
2. COMBINATION OF RATED CAPACITANCE AND TOLERANCE
Class
Temperature
Characteristics
Capacitance tolerance
10pF and
under
C0G
NP0
1
X7R
X7S
X7T
X8R
X8L
2
Rated capacitance
C (±0.25pF)
1, 1.5, 2, 2.2, 3, 3.3, 4, 4.7, 5
D (±0.5pF)
6, 6.8, 7, 8, 9, 10
12pF to
10,000pF
Over
10,000pF
J (±
0.1uF and
under
K (± 10 %)
Over 0.1uF
K (± 10 %)
M (± 20 %)
E – 12 series
5 %)
E – 6 series
E – 6 series
Capacitance Step in E series
Capacitance Step
E series
1.0
E- 6
1.0
E-12
1.5
1.2
1.5
2.2
1.8
2.2
3.3
2.7
3.3
4.7
3.9
4.7
6.8
5.6
6.8
8.2
3. OPERATING TEMPERATURE RANGE
Max. operating
Temperature
Reference
Temperature
C0G
Min. operating
Temperature
oper
-55°C
125°C
25°C
NP0
-55°C
150°C
25°C
X7R/X7S/X7T
-55°C
125°C
25°C
X8R/X8L
-55°C
150°C
25°C
T.C.
4. STORING CONDITION AND TERM
Storing temperature
Storing humidity
Storing term
5~40°C
20~70%RH
Within 6 months
upon receipt.
5. P.C. BOARD
When mounting on an aluminum substrate, large case size such as CGA6 [CC1210] and larger
are more likely to be affected by heat stress from the substrate.
Please inquire separate specification for the large case sizes when mounted on the substrate.
6. INDUSTRIAL WASTE DISPOSAL
Dispose this product as industrial waste in accordance with the Industrial Waste Law.
—8—
AC11010002
7. PERFORMANCE
Table 1
No.
Item
Performance
Test or inspection method
1
External Appearance
No defects which may affect
performance.
Inspect with magnifying glass (3×)
In case of CGA1[CC0201] type, with
magnifying glass(10×).
2
Insulation Resistance
10,000MΩ or 500MΩ·μF min.
(As for the capacitors of rated
voltage 16V DC and lower,
10,000 MΩ or 100MΩ·μF min.),
whichever smaller.
Measuring voltage：Rated voltage
(As for the capacitor of rated voltage 630V
DC, apply 500V DC.)
Voltage application time：60s.
3
Voltage Proof
Withstand test voltage without
insulation breakdown or other
damage.
Class
1
2
Rated
voltage(RV)
Apply voltage
RV≦100V
3 × rated voltage
100V＜RV≦500V 1.5 × rated voltage
500V＜RV
1.3 × rated voltage
RV≦100V
2.5 × rated voltage
100V＜RV≦500V 1.5 × rated voltage
500V＜RV
1.3 × rated voltage
Voltage application time : 1s.
Charge / discharge current : 50mA or lower
4
Capacitance
Within the specified tolerance.
《Cl a ss 1》
Capacitance
Measuring
frequency
1000pF and
under
1MHz±10%
Over 1000pF
1kHz±10%
Measuring
voltage
0.5 ~ 5 Vrms.
《Cl a ss 2》
Capacitance
Measuring
frequency
Measuring
voltage
10uF and
under
1kHz±10%
1.0±0.2Vrms
Over 10uF
120Hz±20% 0.5±0.2Vrms.
As for the capacitors of rated voltage 6.3V
DC, 0.5Vrms is applied.
As an exception, 1.0Vrms is applied for
10uF and under on X8L characteristics.
5
6
Q
Class1
Dissipation
Factor
Class2
Temperature
Characteristics
of Capacitance
(Class1)
Please refer to detail page on TDK
web.
T.C.
Temperature Coefficient
(ppm/°C)
C0G
0 ± 30
NP0
0 ± 30
Capacitance Within ± 0.2% or
± 0.05pF,
drift
whichever larger.
—9—
See No.4 in this table for measuring
condition.
Temperature coefficient shall be calculated
based on values at 25°C and 85°C
temperature.
Measuring temperature below 25°C shall
be -10°C and -25°C.
AC11010002
(continued)
No.
7
Item
Temperature
Characteristics
of Capacitance
(Class2)
Performance
Capacitance Change (%)
No voltage applied
X7R : ± 15
X7S : ± 22
+22
X7T : -33
X8R : ± 15
X8L : +15
-40
Test or inspection method
Capacitance shall be measured by the
steps shown in the following table after
thermal equilibrium is obtained for each
step.
∆C be calculated ref. STEP3 reading
Step
Temperature(°C)
1
Reference temp. ± 2
2
Min. operating temp. ± 2
3
Reference temp. ± 2
4
Max. operating temp. ± 2
As for Min./ Max. operating temp. and
Reference temp., please refer to
"3.OPERATING TEMPERATURE RANGE".
As for measuring voltage, please contact
with our sales representative.
8
Robustness of
Terminations
No sign of termination coming off,
breakage of ceramic, or other
abnormal signs.
Reflow solder the capacitors on a
P.C.Board shown in Appendix 2.
Apply a pushing force gradually at the
center of a specimen in a horizontal
direction of P.C.board.
Pushing force : 17.7N
(2N is applied for CGA1 and CGA2 type.)
Holding time : 10±1s.
Pushing force
P.C.Board
Capacitor
9
Bending
No mechanical damage.
Reflow solder the capacitors on
a P.C.Board shown in Appendix 1.
(1mm is applied for 0.85mm thickness of
Class2 items.)
20
50
F
R230
2
45
45
(Unit : mm)
10
Solderability
New solder to cover over 75% of
termination.
25% may have pin holes or rough
spots but not concentrated in one
spot.
Ceramic surface of A sections
shall not be exposed due to
melting or shifting of termination
material.
A section
— 10 —
Solder :
Sn-3.0Ag-0.5Cu
Flux :
Isopropyl alcohol (JIS K
8839) Rosin (JIS K 5902)
25% solid solution.
Solder temp. : 245±5°C
Dwell time :
3±0.3s.
Solder
position :
Until both terminations are
completely soaked.
AC11010002
(continued)
No.
11
Item
Performance
Resistance External
No cracks are allowed and
to solder
appearance terminations shall be covered at
heat
least 60% with new solder.
Test or inspection method
Solder :
Sn-3.0Ag-0.5Cu
Flux :
Isopropyl alcohol (JIS K
8839) Rosin (JIS K 5902)
25% solid solution.
Solder temp. :
260±5°C
Dwell time :
10±1s.
Solder
position :
Until both terminations
are completely soaked.
Pre-heating :
Temp. ― 110~140°C
Time ― 30～60s.
Capacitance
Characteristics
Q
Class1
C0G
NP0
Class2
X7R
X7S
X7T
X8R
X8L
Change from the
value before test
± 2.5% or ± 0.25pF,
whichever larger.
± 7.5 %
Meet the initial spec.
(Class1)
12
Vibration
Leave the capacitors in ambient
condition for
Class 1 : 6~24h
Class 2 : 24±2h before measurement.
D.F.
(Class2)
Meet the initial spec.
Insulation
Resistance
Meet the initial spec.
Voltage
proof
No insulation breakdown or
other damage.
External
appearance
No mechanical damage.
Capacitance
Characteristics
Q
Class1
C0G
NP0
Class2
X7R
X7S
X7T
X8R
X8L
Change from the
value before test
± 2.5% or ± 0.25pF,
whichever larger.
Reciprocating sweep time : 20 min.
Cycle : 12 cycles in each 3 mutually
perpendicular directions.
Reflow solder the capacitors on a
P.C.Board shown in Appendix 2 before
± 7.5 %
Meet the initial spec.
(Class1)
D.F.
(Class2)
Applied force : 5G max.
Frequency : 10~2,000Hz
Meet the initial spec.
— 11 —
testing.
AC11010002
(continued)
No.
Item
13
Temperature External
appearance
cycle
Performance
No mechanical damage.
Capacitance
Characteristics
Change from the
value before test
Test or inspection method
Expose the capacitors in the condition
step1 through step 4 listed in the
following table.
Temp. cycle：1,000 cycles
Step
Class1
Class2
C0G
NP0
X7R
X7S
X7T
X8R
X8L
1
Please contact
with our sales
representative.
2
3
4
Q
Meet the initial spec.
Ambient Temp.
Max. operating
temp. ±2
Ambient Temp.
30 ± 3
2~5
30 ± 2
2~5
D.F.
(Class2)
Meet the initial spec.
Insulation
Resistance
Meet the initial spec.
Voltage
proof
No insulation breakdown or
other damage.
Reflow solder the capacitors on a
P.C.Board shown in Appendix 2 before
testing.
No mechanical damage.
Test temp.：40±2°C
Test humidity：90~95%RH
Test time：500 +24,0h
Moisture
External
appearance
Resistance
(Steady
State)
Min. operating
temp. ±3
Time (min.)
As for Min./ Max. operating temp., please
refer to "3.OPERATING TEMPERATURE
RANGE".
(Class1)
14
Temperature(°C)
Capacitance
Characteristics
Q
(Class1)
D.F.
(Class2)
Insulation
Resistance
Class1
C0G
NP0
Class2
X7R
X7S
X7T
X8R
X8L
Leave the capacitors in ambient
condition for
Class 1 : 6~24h
Class 2 : 24±2h before measurement.
Change from the
value before test
Please contact
with our sales
representative
Capacitance
Q
30pF and over
350 min.
10pF and over
under 30pF
275+5/2×C min.
Under 10pF
200+10×C min.
C : Rated capacitance (pF)
200% of initial spec. max.
1,000MΩ or 50MΩ·μF min.
(As for the capacitors of rated
voltage 16V DC and lower,
1,000 MΩ or 10MΩ·μF min.),
whichever smaller.
— 12 —
Leave the capacitors in ambient
condition for
Class 1 : 6~24h
Class 2 : 24±2h before measurement.
Reflow solder the capacitors on a
P.C.Board shown in Appendix2 before
testing.
AC11010002
(continued)
No.
Item
15
Moisture
External
Resistance appearance
Performance
No mechanical damage.
Capacitance
Characteristics
Q
(Class1)
D.F.
(Class2)
Insulation
Resistance
16
Life
External
appearance
Test or inspection method
Class1
C0G
NP0
Class2
X7R
X7S
X7T
X8R
X8L
Change from the
value before test
Charge/discharge current：50mA or lower
Please contact
with our sales
representative.
Capacitance
Q
30pF and over
200 min.
Under 30pF
100+10/3×C min.
C : Rated capacitance (pF)
200% of initial spec. max.
500MΩ or 25MΩ·μF min.
(As for the capacitors of rated
voltage 16V DC and lower,
500 MΩ or 5MΩ·μF min.),
whichever smaller.
No mechanical damage.
Capacitance
Characteristics
Class1
Class2
Q
(Class1)
Change from the
value before test
C0G
NP0
X7R
X7S
X7T
X8R
X8L
Q
30pF and over
350 min.
10pF and over to
275+5/2×C min.
under 30pF
D.F.
(Class2)
Insulation
Resistance
Leave the capacitors in ambient
condition for
Class 1 : 6~24h
Class 2 : 24±2h before measurement.
Reflow solder the capacitors on a
P.C.Board shown in Appendix2 before
testing.
Initial value setting (only for class 2)
Voltage conditioning 《After voltage treat
the capacitors under testing temperature
and voltage for 1 hour,》 leave the
capacitors in ambient condition for 24±2h
before measurement.
Use this measurement for initial value.
Test temp.：Maximum operating
temperature±2°C
Applied voltage：Please contact with our
sales representative.
Test time：1,000 +48,0h
Charge/discharge current：50mA or lower
Please contact
with our sales
representative.
Capacitance
Under 10pF
Test temp.：85±2°C
Test humidity：85%RH
Applied voltage：Rated voltage
Test time：1,000 +48,0h
200+10×C min.
C : Rated capacitance (pF)
200% of initial spec. max.
1,000MΩ or 50MΩ·μF min.
(As for the capacitors of rated
voltage 16V DC and lower,
1,000 MΩ or 10MΩ·μF min.),
whichever smaller.
Leave the capacitors in ambient
condition for
Class 1 : 6~24h
Class 2 : 24±2h before measurement.
Reflow solder the capacitors on a
P.C.Board shown in Appendix2 before
testing.
Initial value setting (only for class 2)
Voltage conditioning 《After voltage treat
the capacitors under testing temperature
and voltage for 1 hour,》 leave the
capacitors in ambient condition for 24±2h
before measurement.
Use this measurement for initial value.
*As for the initial measurement of capacitors (Class2) on number 7,11,12,13 and 14 leave capacitors at
150 0,–10°C for 1 hour and measure the value after leaving capacitors for 24±2h in ambient condition.
— 13 —
AC11010002
Appendix1
P.C.Board for bending test
(CGA1,CGA2)
(CGA3,CGA4,CGA5,CGA6,CGA8,CGA9)
100
100
b
b
40
Solder resist
40
a
a
Solder resist
1.0
1.0
c
c
Copper
Copper
Appendix2
P.C. Board for reliability test
100
c
40
b a
*Slit
Solder resist
Copper
* It is recommended to provide a slit on P.C.Board for CGA6,CGA8 and CGA9.
（Unit：mm）
Symbol
a
b
c
CGA1 (CC0201)
0.3
0.8
0.3
CGA2 (CC0402)
0.4
1.5
0.5
CGA3 (CC0603)
1.0
3.0
1.2
CGA4 (CC0805)
1.2
4.0
1.65
CGA5 (CC1206)
2.2
5.0
2.0
CGA6 (CC1210)
2.2
5.0
2.9
CGA8 (CC1812)
3.5
7.0
3.7
CGA9 (CC2220)
4.5
8.0
5.6
Case size
1. Material
Dimensions
: Glass Epoxy(As per JIS C6484 GE4)
2. Thickness : Appendix 1 ― 0.8mm
― 1.6mm
: Appendix 2 ― 1.6mm
(CGA1,CGA2)
(CGA3,CGA4,CGA5,CGA6,CGA8,CGA9)
Copper(Thickness:0.035mm)
Solder resist
— 14 —
AC11010002
8. INSIDE STRUCTURE AND MATERIAL
3
4
5
2
1
MATERIAL
No.
NAME
1
Dielectric
2
Electrode
Nickel (Ni)
Copper (Cu)
Termination
Nickel (Ni)
Class1
Class2
CaZrO 3
BaTiO 3
3
4
5
Tin (Sn)
9. PACKAGING
Packaging shall be done to protect the components from the damage during transportation and storing,
and a label which has the following information shall be attached.
9.1 Each plastic bag for bulk packaging contains 1000pcs. And the minimum quantity for
Bulk packaging is 1000pcs.
9.2 Tape packaging is as per 13. TAPE PACKAGING SPECIFICATION.
* CGA1 [CC0201] and CGA2 [CC0402] types are applicable to tape packaging only.
1) Inspection No.
2) TDK P/N
3) Customer's P/N
4) Quantity
*Composition of Inspection No.
F 0 A – 23 – 001
(a) (b) (c)
(d)
(e)
Line code
Last digit of the year
Month and A for January and B for February and so on. (Skip I)
Inspection Date of the month.
Serial No. of the day
Example
(a)
(b)
(c)
(d)
(e)
*Composition of new Inspection No.
(Implemented on and after May 1, 2019 in sequence)
Example
I
F
0
E
(a) (b) (c) (d)
2 3
A 0
0 1
(e)
(f)
(g)
(a) Prefix
(b) Line code
(c) Last digit of the year
(d) Month and A for January and B for F ebruary and so on. (Skip I)
(e) Inspection Date of the month.
(f) Serial No. of the day(00 ~ ZZ)
(g) Suffix(00 ~ ZZ)
* It was shifted to the new inspection No. on and after May 2019, but the implementation timing may be
different depending on shipment bases.
Until the shift is completed, either current or new composition of inspection No. will be applied.
— 15 —
AC11010002
10. RECOMMENDATION
As for CGA6 [CC1210] and larger, It is recommended to provide a slit (about 1mm width)
in the board under the components to improve washing Flux. And please make sure to dry
detergent up completely before.
11. SOLDERING CONDITION
As for CGA1 [CC0201], CGA2 [CC0402], CGA6 [CC1210] and larger, reflow soldering only.
For other case sizes than the above, reflow soldering is recommended.
— 16 —
AC11010002
12. CAUTION
No.
1
Process
Operating
Condition
(Storage, Use,
Transportation)
Condition
1-1. Storage, Use
The capacitors must be stored in an ambient temperature of 5 to 40°C with a
relative humidity of 20 to 70%RH. JIS C 60721-3-1 Class 1K2 should be followed
for the other climatic conditions.
1) High temperature and humidity environment may affect a capacitor's solder ability
because it accelerates terminal oxidization. They also deteriorate performance of
taping and packaging. Therefore, SMD capacitors shall be used within 6 months.
For capacitors with terminal electrodes consisting of silver or silver-palladium
which tend to become oxidized or sulfurized, use as soon as possible, such as
within one month after opening the bag.
2) When capacitors are stored for a longer time period than 6 months, confirm the
solderability of the capacitors prior to use.
During storage, keep the minimum packaging unit in its original packaging without
opening it.
Do not deviate from the above temperature and humidity conditions even for a
short term.
3) Corrosive gasses in the air or atmosphere may result in deterioration of the
reliability, such as poor solderability of the terminal electrodes. Do not store
capacitors where they will be exposed to corrosive gas (e.g., hydrogen sulfide,
sulfur dioxide, chlorine ammonia etc.)
4) Solderability and electrical performance may deteriorate due to photochemical
change in the terminal electrode if stored in direct sunlight, or due to condensation
from rapid changes in humidity.
The capacitors especially which use resin material must be operated and stored in
an environment free of dew condensation, as moisture absorption due to
condensation may affect the performance.
5) Refer to JIS C 60721-3-1, class 1K2 for other climate conditions.
1-2. Handling in transportation
In case of the transportation of the capacitors, the performance of the capacitors
may be deteriorated depending on the transportation condition.
(Refer to JEITA RCR-2335C 9.2 Handling in transportation)
2
Circuit design
△Caution
!
2-1. Operating temperature
1) Upper category temperature (maximum operating temperature) is specified.
It is necessary to select a capacitor whose rated temperature us higher than the
operating temperature. Also, it is necessary to consider the temperature
distribution in the equipment and seasonal temperature variation.
2) Do not use capacitors above the maximum allowable operating temperature.
Surface temperature including self heating should be below maximum operating
temperature.
(Due to dielectric loss, capacitors will heat itself when AC is applied. Especially at
high frequencies around its SRF, the heat might be so extreme that it may damage
itself or the product mounted on. Please design the circuit so that the maximum
temperature of the capacitors including the self heating to be below the maximum
allowable operating temperature. Temperature rise at capacitor surface shall be
below 20°C)
3) The electrical characteristics of the capacitors will vary depending on the
temperature. The capacitors should be selected and designed in taking the
temperature into consideration.
2-2. When overvoltage is applied
Applying overvoltage to a capacitor may cause dielectric breakdown and result in
a short circuit. The duration until dielectric breakdown depends on the applied
voltage and the ambient temperature.
— 17 —
AC11010002
No.
Process
Condition
2
Circuit design
! Caution
2-3. Operating voltage
1) Operating voltage across the terminals should be below the rated voltage.
When AC and DC are super imposed, V0-P must be below the rated voltage.
— (1) and (2)
AC or pulse with overshooting, VP-P must be below the rated voltage.
— (3), (4) and (5)
When the voltage is started to apply to the circuit or it is stopped applying, the
irregular voltage may be generated for a transit period because of resonance or
switching. Be sure to use the capacitors within rated voltage containing these
Irregular voltage.
△
Voltage
(1) DC voltage
Positional
Measurement V0-P
(Rated voltage)
V0-P
0
Voltage
(2) DC+AC voltage
(3) AC voltage
VP-P
0
0
(4) Pulse voltage (A) (5) Pulse voltage (B)
Positional
Measurement VP-P
(Rated voltage)
VP-P
0
0
2) Even below the rated voltage, if repetitive high frequency AC or pulse is applied,
the reliability of the capacitors may be reduced.
3) The effective capacitance will vary depending on applied DC and AC voltages.
The capacitors should be selected and designed in taking the voltages into
consideration.
4) Abnormal voltage (surge voltage, static electricity, pulse voltage, etc.) shall not
exceed the rated voltage.
5) When capacitors are used in a series connection, it is necessary to add a balancing
circuit such as voltage dividing resistors in order to avoid an imbalance in the voltage
applied to each capacitor.
2-4. Frequency
When the capacitors (Class 2) are used in AC and/or pulse voltages, the
capacitors may vibrate themselves and generate audible sound.
— 18 —
AC11010002
No.
3
Process
Designing
P.C.board
Condition
The amount of solder at the terminations has a direct effect on the reliability of the
capacitors.
1) The greater the amount of solder, the higher the stress on the chip capacitors,
and the more likely that it will break. When designing a P.C.board, determine the
shape and size of the solder lands to have proper amount of solder on the
terminations.
2) Avoid using common solder land for multiple terminations and provide individual
solder land for each terminations.
3) Size and recommended land dimensions.
Chip capacitors
Solder land
C
B
Reflow soldering
Case size
CGA1
(CC0201)
Symbol
Solder resist
A
CGA2
(CC0402)
CGA3
(CC0603)
(mm)
CGA4
(CC0805)
A
0.25 ~ 0.35
0.3 ~ 0.5
0.6 ~ 0.8
0.9 ~ 1.2
B
0.20 ~ 0.30
0.35 ~ 0.45
0.6 ~ 0.8
0.7 ~ 0.9
C
0.25 ~ 0.35
0.4 ~ 0.6
0.6 ~ 0.8
0.9 ~ 1.2
CGA5
(CC1206)
CGA6
(CC1210)
CGA8
(CC1812)
CGA9
(CC2220)
A
2.0 ~ 2.4
2.0 ~ 2.4
3.1 ~ 3.7
4.1 ~ 4.8
B
1.0 ~ 1.2
1.0 ~ 1.2
1.2 ~ 1.4
1.2 ~ 1.4
C
1.1 ~ 1.6
1.9 ~ 2.5
2.4 ~ 3.2
4.0 ~ 5.0
Flow soldering (Unrecommend)
Case size
CGA3
CGA4
(CC0603)
(CC0805)
Symbol
(mm)
Case size
Symbol
CGA5
(CC1206)
A
0.7 ~ 1.0
1.0 ~ 1.3
2.1 ~ 2.5
B
0.8 ~ 1.0
1.0 ~ 1.2
1.1 ~ 1.3
C
0.6 ~ 0.8
0.8 ~ 1.1
1.0 ~ 1.3
— 19 —
AC11010002
No.
3
Process
Designing
P.C.board
Condition
4) Recommended chip capacitors layout is as following.
Disadvantage against
bending stress
Advantage against
bending stress
Perforation or slit
Perforation or slit
Break P.C.board with
mounted side up.
Break P.C.board with
mounted side down.
Mounting
face
Mount perpendicularly to
perforation or slit
Perforation or slit
Mount in parallel with
perforation or slit
Perforation or slit
Chip
arrangement
(Direction)
Closer to slit is higher stress
ℓ1
Away from slit is less stress
ℓ2
Distance from
slit
( ℓ1< ℓ2 )
— 20 —
( ℓ1< ℓ2 )
AC11010002
No.
3
Process
Designing
P.C.board
Condition
5) Mechanical stress varies according to location of chip capacitors on the P.C.board.
E
D
Perforation
C
B
A
Stress force
A＞B＞E
A＞D＞E
A＞C
Slit
When dividing printed wiring boards, the intensities of mechanical stress applied to
capacitors are different according to each dividing method in the order of :
Push-back < Slit < V-groove < Perforation. Therefore consider not only position of
capacitors, but also the way of the dividing the printed wiring boards.
6) Layout recommendation
Example
Use of common
solder land
Soldering with
chassis
Use of common
solder land with
other SMD
Lead wire Chassis
Chip
Solder
land
Excessive solder
Solder
Need to
avoid
Excessive solder
PCB Adhesive
Solder land
ℓ1
Missing
solder
Lead wire
Solder land
Solder resist
Solder resist
Recommendation
Solder resist
ℓ2
ℓ 2 >ℓ 1
— 21 —
AC11010002
No.
4
Process
Mounting
Condition
4-1. Stress from mounting head
If the mounting head is adjusted too low, it may induce excessive stress in the chip
capacitors to result in cracking. Please take following precautions.
1) Adjust the bottom dead center of the mounting head to reach on the P.C.board
surface and not press it.
2) Adjust the mounting head pressure to be 1 to 3N of static weight.
3) To minimize the impact energy from mounting head, it is important to provide
support from the bottom side of the P.C.board.
See following examples.
Not recommended
Recommended
Crack
Single-sided
mounting
Support pin
A support pin
is not to be
underneath the
capacitor.
Double-sides
mounting
Solder
peeling
Crack
Support pin
When the centering jaw is worn out, it may give mechanical impact on the capacitors
to cause crack. Please control the close up dimension of the centering jaw and
provide sufficient preventive maintenance and replacement of it.
4-2. Amount of adhesive
a
a
b
c
c
Example : CGA4 (CC0805), CGA5 (CC1206)
a
0.2mm min.
b
70 ~ 100μm
c
Do not touch the solder land
— 22 —
AC11010002
No.
Process
Condition
5
Soldering
5-1. Flux selection
Flux can seriously affect the performance of capacitors. Confirm the following to
select the appropriate flux.
1) It is recommended to use a mildly activated rosin flux (less than 0.1wt% chlorine).
Strong flux is not recommended.
2) Excessive flux must be avoided. Please provide proper amount of flux.
3) When water-soluble flux is used, enough washing is necessary.
5-2. Recommended soldering profile : Reflow method
Refer to the following temperature profile at Reflow soldering.
Reflow soldering
Preheating
Soldering
Natural cooling
Temp.. (°C)
Peak
Temp
∆T
0
Over 60 sec.
Peak Temp time
Reflow soldering is recommended for CGA3,CGA4,CGA5 types, but only reflow
soldering is allowed for other case sizes.
5-3. Recommended soldering peak temp and peak temp duration for Reflow soldering
Pb free solder is recommended, but if Sn-37Pb must be used, refer to below.
Temp./Duration
Reflow soldering
Peak temp(°C)
Duration(sec.)
Lead Free Solder
260 max.
10 max.
Sn-Pb Solder
230 max.
20 max.
Solder
Recommended solder compositions
Lead Free Solder : Sn-3.0Ag-0.5Cu
— 23 —
AC11010002
Process
5
Soldering
Condition
5-4. Soldering profile : Flow method (Unrecommend)
Refer to the following temperature profile at Flow soldering.
Flow soldering
Soldering
Preheating
Natural cooling
Peak
Temp
Temp. (°C)
No.
△T
0
Over 60 sec.
Over 60 sec.
Peak Temp time
Reflow soldering is recommended for CGA3,CGA4,CGA5 types.
5-5. Recommended soldering peak temp and peak temp duration for Flow soldering
Pb free solder is recommended, but if Sn-37Pb must be used, refer to below.
Temp./Duration
Flow soldering
Peak temp(°C)
Duration(sec.)
Lead Free Solder
260 max.
5 max.
Sn-Pb Solder
250 max.
3 max.
Solder
Recommended solder compositions
Lead Free Solder : Sn-3.0Ag-0.5Cu
5-6. Avoiding thermal shock
1) Preheating condition
Soldering
Reflow soldering
Flow soldering
2)
Case size
CGA1(CC0201),CGA2(CC0402)
CGA3(CC0603),CGA4(CC0805)
CGA5(CC1206)
CGA6(CC1210), CGA8(CC1812),
CGA9(CC2220)
CGA3(CC0603), CGA4(CC0805),
CGA5(CC1206)
Temp. (°C)
∆T ≦ 150
∆T ≦ 130
∆T ≦ 150
Cooling condition
Natural cooling using air is recommended. If the chips are dipped into a solvent for
cleaning, the temperature difference (∆T) must be less than 100°C.
— 24 —
AC11010002
No.
Process
Condition
5
Soldering
5-7. Amount of solder
Excessive solder will induce higher tensile force in chip capacitors when
temperature changes and it may result in chip cracking. In sufficient solder may
detach the capacitors from the P.C.board.
Higher tensile force in
chip capacitors to cause
crack
Excessive
solder
Maximum amount
Minimum amount
Adequate
Low robustness may
cause contact failure or
chip capacitors come off
the P.C.board.
Insufficient
solder
5-8. Sn-Zn solder
Sn-Zn solder affects product reliability.
Please contact TDK in advance when utilize Sn-Zn solder.
5-9. Countermeasure for tombstone
The misalignment between the mounted positions of the capacitors and the land
patterns should be minimized. The tombstone phenomenon may occur especially
the capacitors are mounted (in longitudinal direction) in the same direction of the
reflow soldering.
(Refer to JEITA RCR-2335C Annex A (Informative), Recommendations to prevent
the tombstone phenomenon.)
— 25 —
AC11010002
No.
Process
6
Solder repairing
Condition
Solder repairing is unavoidable, refer to below.
6-1.Soldering rework using spot heater
Heat stress during rework may possibly be reduced by using a spot heater
(also called a “blower”) rather than a soldering iron.
It is applied only to adding solder in the case of insufficient solder amount.
1) Reworking using a spot heater may suppress the occurrence of cracks in the
capacitor compared to using a soldering iron. A spot heater can heat up a capacitor
uniformly with a small heat gradient which leads to lower thermal
stress caused by quick heating and cooling or localized heating.
Moreover, where ultra-small capacitors are mounted close together on a printed
circuit board, reworking with a spot heater can eliminate the risk of direct contact
between the tip of a soldering iron and a capacitor.
2) Rework condition
If the blower nozzle of a spot heater is too close to a capacitor, a crack in the
capacitor may occur due to heat stress. Below are recommendations for avoiding
such an occurrence.
Keep more than 5mm between a capacitor and a spot heater nozzle.
The blower temperature of the spot heater shall be lower than 400°C.
The airflow shall be set as weak as possible.
The diameter of the nozzle is recommended to be 2mm(one-outlet type).The size is
standard and common.
Duration of blowing hot air is recommended to be 10s or less for CGA3 (CC0603),
CGA4 (CC0805) and CGA5 (CC1206), and 30s or less for CGA6 (CC1210),
CGA8(CC1812) and CGA9 (CC2220), considering surface area of the capacitor
and melting temperature of solder.
The angle between the nozzle and the capacitor is recommended to be 45degrees
in order to work easily and to avoid partial area heating.
As is the case when using a soldering iron, preheating reduces thermal stress on
capacitors and improves operating efficiency.
・Recommended rework condition（Consult the component manufactures for details.）
Distance from nozzle
5mm and over
Nozzle angle
45degrees
Nozzle temp.
400°C and less
Set as weak as possible
(The airflow shall be the minimum value necessary for
solder to melt in the conditions mentioned above.)
Airflow
Nozzle diameter
φ2mm（one-outlet type）
Blowing duration
10s and less (CGA3 [CC0603], CGA4 [CC0805], CGA5 [CC1206])
30s and less (CGA6 [CC1210], CGA8 [CC1812], CGA9 [CC2220])
・Example of recommended spot heater use
One-outlet type nozzle
Angle : 45degrees
3) Amount of solder should be suitable to from a proper fillet shape.
Excess solder causes mechanical and thermal stress on a capacitor and
results in cracks. Insufficient solder causes weak adherence of the capacitor to
the substrate and may result in detachment of a capacitor and deteriorate
reliability of the printed wiring board.
See the example of appropriate solder fillet shape for 5-5.Amount of solder.
— 26 —
AC11010002
Process
6
Solder repairing
Condition
6-2. Solder repair by solder iron
1) Selection of the soldering iron tip
Tip temperature of solder iron varies by its type, P.C.board material and solder
land size. The higher the tip temperature, the quicker the operation. However,
heat shock may cause a crack in the chip capacitors.
Please make sure the tip temp. before soldering and keep the peak temp and
time in accordance with following recommended condition.
Manual soldering
(Solder iron)
Peak
Temp
Temp.. (°C)
No.
∆T
Preheating
0
3sec. (As short as possible)
Recommended solder iron condition (Sn-Pb Solder and Lead Free Solder)
Case size
Temp. (°C)
CGA1(CC0201)
CGA2(CC0402)
CGA3(CC0603)
CGA4(CC0805)
CGA5(CC1206)
350 max.
CGA6(CC1210)
CGA8(CC1812)
CGA9(CC2220)
280 max.
Duration (sec.)
Wattage (W)
Shape (mm)
3 max.
20 max.
Ø 3.0 max.
* Please preheat the chip capacitors with the condition in 6-3 to avoid the thermal shock.
2) Direct contact of the soldering iron with ceramic dielectric of chip capacitors
may cause crack. Do not touch the ceramic dielectric and the terminations by
solder iron.
6-3. Avoiding thermal shock
Preheating condition
Soldering
Manual soldering
Case size
CGA1(CC0201),CGA2(CC0402)
CGA3(CC0603),CGA4(CC0805)
CGA5(CC1206)
CGA6(CC1210), CGA8(CC1812),
CGA9(CC2220)
— 27 —
Temp. (°C)
∆T ≦ 150
∆T ≦ 130
AC11010002
No.
Process
7
Cleaning
Condition
1) If an unsuitable cleaning fluid is used, flux residue or some foreign articles may
stick to chip capacitors surface to deteriorate especially the insulation resistance.
2) If cleaning condition is not suitable, it may damage the chip capacitors.
2)-1. Insufficient washing
(1) Terminal electrodes may corrode by Halogen in the flux.
(2) Halogen in the flux may adhere on the surface of capacitors, and lower the
insulation resistance.
(3) Water soluble flux has higher tendency to have above mentioned
problems (1) and (2).
2)-2. Excessive washing
When ultrasonic cleaning equipment is used, excessive ultrasonic power or
direct vibration transfer to a printed wiring board may generate a resonant
vibration in the board. This may cause a crack in a capacitor or its solder joints
to the board and degradation in the terminal strength of the capacitor. In order
to avoid this, the following cleaning conditions are recommended.
Power : 20 W/ ℓ max.
Frequency : 40 kHz max.
Washing time : 5 minutes max.
2)-3. If the cleaning fluid is contaminated, density of Halogen increases, and it may
bring the same result as insufficient cleaning.
8
Coating and
1) When the P.C.board is coated, please verify the quality influence on the product.
molding of the
P.C.board
2) Please verify carefully that there is no harmful decomposing or reaction gas
emission during curing which may damage the chip capacitors.
3) Please verify the curing temperature.
9
Handling after
chip mounted
! Caution
△
1) Please pay attention not to bend or distort the P.C.board after soldering in handling
otherwise the chip capacitors may crack.
Bend
— 28 —
Twist
AC11010002
No.
9
Process
Handling after
chip mounted
! Caution
△
Condition
2) Printed circuit board cropping should not be carried out by hand, but by using the
proper tooling. Printed circuit board cropping should be carried out using a board
cropping jig as shown in the following figure or a board cropping apparatus to
prevent inducing mechanical stress on the board.
(1)Example of a board cropping jig
Recommended example: The board should be pushed from the back side,
close to the cropping jig so that the board is not bent and the stress applied to
the capacitor is compressive.
Unrecommended example: If the pushing point is far from the cropping jig and
the pushing direction is from the front side of the board, large tensile stress is
applied to the capacitor, which may cause cracks.
Outline of jig
Recommended
V-groove
Printed
circuit
board
Unrecommended
Direction of
load
Printed
circuit
board
Direction
of load
Load point
Components
Printed
circuit
board
Load point
Slot
Board
cropping jig
V-groove
Components
V-groove
Slot
Slot
(2)Example of a board cropping machine
An outline of a printed circuit board cropping machine is shown below. The
top and bottom blades are aligned with one another along the lines with the
V-grooves on printed circuit board when cropping the board.
Unrecommended example: Misalignment of blade position between top and
bottom, right and left, or front and rear blades may cause a crack in the
capacitor.
Outline of machine
Principle of operation
Top
blade
Top blade
Printed circuit board
Printed circuit board
Bottom blade
V-groove
Cross-section
diagram
Printed circuit board
V-groove
Top blade
Bottom blade
Unrecommended
Recommended
Top-bottom
misalignment
Left-right
misalignment
Front-rear
misalignment
Top blade
Top blade
Top blade
Bottom blade
Bottom blade
Bottom blade
Top blade
Board
Bottom blade
— 29 —
AC11010002
No.
9
Process
Handling after
chip mounted
! Caution
△
Condition
3) When functional check of the P.C.board is performed, check pin pressure tends
to be adjusted higher for fear of loose contact. But if the pressure is excessive
and bend the P.C.board, it may crack the chip capacitors or peel the terminations
off. Please adjust the check pins not to bend the P.C.board.
Item
Not recommended
Recommended
Termination
peeling
Support pin
Board
bending
Check pin
Check pin
10
Handling of loose
chip capacitors
1) If dropped the chip capacitors may crack. Once dropped do not use it. Especially,
the large case sized chip capacitors are tendency to have cracks easily, so please
handle with care.
Crack
Floor
2) Piling the P.C.board after mounting for storage or handling, the corner of the P.C.
board may hit the chip capacitors of another board to cause crack.
P.C.board
Crack
11
Capacitance aging
The capacitors (Class 2) have aging in the capacitance. They may not be used in
precision time constant circuit. In case of the time constant circuit, the evaluation
should be done well.
12
Estimated life and
estimated failure
As per the estimated life and the estimated failure rate depend on the temperature
and the voltage. This can be calculated by the equation described in JEITA
RCR-2335C Annex F (Informative) Calculation of the estimated lifetime and the
estimated failure rate ( Voltage acceleration coefficient : 3 multiplication rule,
Temperature acceleration coefficient : 10°C rule)
The failure rate can be decreased by reducing the temperature and the voltage but
they will not be guaranteed.
rate of capacitors
— 30 —
AC11010002
No.
13
Process
Caution during
operation of
equipment
Condition
1) A capacitor shall not be touched directly with bare hands during operation in
order to avoid electric shock.
Electric energy held by the capacitor may be discharged through the human
body when touched with a bare hand.
Even when the equipment is off, a capacitor may stay charged. The capacitor
should be handled after being completely discharged using a resistor.
2) The terminals of a capacitor shall not be short-circuited by any accidental
contact with a conductive object. A capacitor shall not be exposed to a
conductive liquid such as an acid or alkali solution. A conductive object or liquid,
such as acid and alkali, between the terminals may lead to the breakdown of a
capacitor due to short circuit
3) Confirm that the environment to which the equipment will be exposed during
transportation and operation meets the specified conditions. Do not to use the
equipment in the following environments.
(1) Environment where a capacitor is spattered with water or oil
(2) Environment where a capacitor is exposed to direct sunlight
(3) Environment where a capacitor is exposed to Ozone, ultraviolet rays or
radiation
(4) Environment where a capacitor exposed to corrosive gas(e.g. hydrogen
sulfide, sulfur dioxide, chlorine. ammonia gas etc.)
(5) Environment where a capacitor exposed to vibration or mechanical shock
exceeding the specified limits.
(6) Atmosphere change with causes condensation
14
Others
△Caution
!
The product listed in this specification is intended for use in automotive applications
under normal operation and usage conditions.
The product is not designed or warranted to meet the requirements of application
listed below, whose performance and/or quality requires a more stringent level of
safety or reliability, or whose failure, malfunction or defect could cause serious
damage to society, person or property. Please understand that we are not
responsible for any damage or liability caused by use of the products in any of the
applications below or for any other use exceeding the range or conditions set forth in
this specification sheet. If you intend to use the products in the applications listed
below or if you have special requirements exceeding the range or conditions set forth
in this specification, please contact us.
(1) Aerospace/Aviation equipment
(2) Transportation equipment (electric trains, ships etc.)
(3) Medical equipment (Excepting Pharmaceutical Affairs Law classification Class1, 2)
(4) Power-generation control equipment
(5) Atomic energy-related equipment
(6) Seabed equipment
(7) Transportation control equipment
(8) Public information-processing equipment
(9) Military equipment
(10) Electric heating apparatus, burning equipment
(11) Disaster prevention/crime prevention equipment
(12) Safety equipment
(13) Other applications that are not considered general-purpose applications
When designing your equipment even for general-purpose applications, you are
kindly requested to take into consideration securing protection circuit/device or
providing backup circuits in your equipment.
In addition, although the product listed in this specification is intended for use in
automotive applications as described above, it is not prohibited to use for general
electronic equipment, whose performance and/or quality doesn’t require a more
stringent level of safety or reliability, or whose failure, malfunction or defect could not
cause serious damage to society, person or property.
Therefore, the description of this caution will be applied, when the product is used in
general electronic equipment under a normal operation and usage conditions.
— 31 —
AC11010002
13. TAPE PACKAGING SPECIFICATION
1. CONSTRUCTION AND DIMENSION OF TAPING
1-1. Dimensions of carrier tape
Dimensions of paper tape shall be according to Appendix 3, 4, 5.
Dimensions of plastic tape shall be according to Appendix 6, 7.
1-2. Bulk part and leader of taping
Trailer(Empty)
Empty
160mm min.
Chips
160mm min.
Leader
Drawing direction
400mm min
1-3. Dimensions of reel
Dimensions of Ø178 reel shall be according to Appendix 8, 9.
Dimensions of Ø330 reel shall be according to Appendix 10, 11.
1-4. Structure of taping
〈Paper〉
〈Plastic〉
Top cover tape
Top cover tape
Pitch hole
Cavity (Chip insert)
Paper carrier tape
Bottom cover tape
(Bottom cover tape is not always applied.)
2. CHIP QUANTITY
Please refer to detail page on TDK web.
— 32 —
Pitch hole
Cavity (Chip insert)
Plastic carrier tape
AC11010002
3. PERFORMANCE SPECIFICATIONS
3-1. Fixing peeling strength (top tape)
0.05N < Peeling strength < 0.7N
〈Paper〉
Direction of cover tape pulling
Top cover tape
Carrier tape
0～15°
Direction of pulling
Paper tape should not adhere to top
cover tape when pull the cover tape.
〈Plastic〉
Direction of pulling
Top cover tape
Carrier tape
0～15°
Direction of pulling
3-2. Carrier tape shall be flexible enough to be wound around a minimum radius
of 30mm with components in tape.
3-3. The missing of components shall be less than 0.1%
3-4. Components shall not stick to fixing tape.
3-5. When removing the cover tape, there shall not be difficulties by unfitting clearance gap,
burrs and crushes of cavities. Also the sprocket holes shall not be covered by
absorbing dust into the suction nozzle.
— 33 —
AC11010002
Appendix 3
Paper Tape
Pitch hole
Cavity(Chip insert)
J
E
D
A
C
B
K
H
G
F
T
（Unit：mm）
Symbol
Case size
CGA1
(CC0201)
Symbol
Case size
CGA1
(CC0201)
A
B
( 0.38 )
( 0.68 )
* ( 0.45 )
* ( 0.75 )
G
H
2.00 ± 0.05
4.00 ± 0.05
C
D
E
F
8.00 ± 0.30
3.50 ± 0.05
1.75 ± 0.10
2.00 ± 0.05
J
K
T
Ø 1.50
+0.10 0.35 ± 0.02
0
* 0.43 ± 0.02
0.40 min.
* 0.47 min.
(
) Reference value.
* Applied to 100nF.
Appendix 4
Paper Tape
Pitch hole
Cavity(Chip insert)
J
E
A
D
C
B
H
T
G
F
(Unit : mm)
Symbol
Case size
CGA2
(CC0402)
Symbol
Case size
CGA2
(CC0402)
(
A
B
C
D
E
F
( 0.65 )
( 1.15 )
8.00 ± 0.30
3.50 ± 0.05
1.75 ± 0.10
2.00 ± 0.05
G
H
J
T
2.00 ± 0.05
4.00 ± 0.10 Ø 1.50
+0.10
0
) Reference value.
— 34 —
0.60±0.15
AC11010002
Appendix 5
Paper Tape
Pitch hole
Cavity(Chip insert)
J
E
A
D
B
T
H
G
C
F
(Unit : mm)
Symbol
Case size
CGA3
(CC0603)
CGA4
(CC0805)
CGA5
(CC1206)
Symbol
Case size
CGA3
(CC0603)
CGA4
(CC0805)
CGA5
(CC1206)
(
A
B
( 1.10 )
( 1.90 )
( 1.50 )
( 2.30 )
( 1.90 )
( 3.50 )
G
H
2.00 ± 0.05
4.00 ± 0.10
C
D
E
F
8.00 ± 0.30
3.50 ± 0.05
1.75 ± 0.10
4.00 ± 0.10
J
T
Ø 1.50
+0.10
0
) Reference value.
— 35 —
1.20 max.
AC11010002
Appendix 6
Plastic Tape
Pitch hole
Cavity(Chip insert)
J
E
A
D
C
B
T
H
Q
F
G
K
(Unit : mm)
Symbol
Case size
CGA3
(CC0603)
CGA4
(CC0805)
CGA5
(CC1206)
CGA6
(CC1210)
Symbol
Case size
CGA3
(CC0603)
CGA4
(CC0805)
CGA5
(CC1206)
CGA6
(CC1210)
(
A
B
( 1.10 )
( 1.90 )
( 1.50 )
( 2.30 )
( 1.90 )
( 3.50 )
( 2.90 )
( 3.60 )
G
H
C
D
8.00 ± 0.30
3.50 ± 0.05
E
F
1.75 ± 0.10
4.00 ± 0.10
T
Q
0.60 max.
Ø 0.50 min.
* 12.00 ± 0.30 * 5.50 ± 0.05
J
K
1.60 max.
2.00 ± 0.05
4.00 ± 0.10
Ø 1.50
+0.10
0
2.50 max.
3.40 max.
) Reference value.
Exceptionally no hole in the cavity is applied. Please inquire if hole in cavity is mandatory.
* Applied to thickness, 2.5mm products.
— 36 —
AC11010002
Appendix 7
Plastic Tape
Pitch hole
Cavity(Chip insert)
J
E
A
D
C
B
T
H
G
Q
F
K
(Unit : mm)
Symbol
Case size
CGA8
(CC1812)
CGA9
(CC2220)
Symbol
Case size
CGA8
(CC1812)
CGA9
(CC2220)
(
A
B
( 3.60 )
( 4.90 )
( 5.40 )
( 6.10 )
G
H
2.00 ± 0.05
4.00 ± 0.10
C
D
E
F
12.00 ± 0.30
5.50 ± 0.05
1.75 ± 0.10
8.00 ± 0.10
J
K
T
Q
6.50 max.
0.60 max.
Ø 1.50 min.
Ø 1.50
+0.10
0
) Reference value.
Exceptionally no hole in the cavity is applied. Please inquire if hole in cavity is mandatory.
— 37 —
AC11010002
Appendix 8
Dimensions of reel (Material : Polystyrene)
CGA1, CGA2, CGA3, CGA4, CGA5, CGA6
W2
E
C
B
D
R
W1
A
(Unit : mm)
Symbol
A
B
C
D
E
W1
Dimension
Ø178 ± 2.0
Ø60 ± 2.0
Ø13 ± 0.5
Ø21 ± 0.8
2.0 ± 0.5
9.0 ± 0.3
Symbol
W2
R
Dimension
13.0 ± 1.4
1.0
Appendix 9
Dimensions of reel (Material : Polystyrene)
CGA6(2.5mm thickness products), CGA8, CGA9
W2
E
C
B
D
R
W1
A
(Unit : mm)
Symbol
A
B
C
D
E
W1
Dimension
Ø178 ± 2.0
Ø60 ± 2.0
Ø13 ± 0.5
Ø21 ± 0.8
2.0 ± 0.5
13.0 ± 0.3
Symbol
W2
R
Dimension
17.0 ± 1.4
1.0
— 38 —
AC11010002
Appendix 10
Dimensions of reel (Material : Polystyrene)
CGA1, CGA2, CGA3, CGA4, CGA5, CGA6
E
C
B
D
R
t
W
A
(Unit : mm)
Symbol
Dimension
A
Ø382 max.
(Nominal
Ø330)
B
C
D
E
W
Ø50 min.
Ø13 ± 0.5
Ø21 ± 0.8
2.0 ± 0.5
10.0 ± 1.5
Symbol
t
R
Dimension
2.0 ± 0.5
1.0
Appendix 11
Dimensions of reel (Material : Polystyrene)
CGA6(2.5mm thickness products), CGA8, CGA9
E
C
B
D
R
W
A
t
(Unit : mm)
Symbol
Dimension
A
Ø382 max.
(Nominal
Ø330)
B
C
D
E
W
Ø50 min.
Ø13 ± 0.5
Ø21 ± 0.8
2.0 ± 0.5
14.0 ± 1.5
Symbol
t
R
Dimension
2.0 ± 0.5
1.0
— 39 —
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