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CGA3E3X8R1H104K080AE

CGA3E3X8R1H104K080AE

  • 厂商:

    TDK(东电化)

  • 封装:

    0603

  • 描述:

    贴片电容(MLCC) 0603 100nF ±10% 50V X8R

  • 详情介绍
  • 数据手册
  • 价格&库存
CGA3E3X8R1H104K080AE 数据手册
1 of 3 Creation Date : November 16, 2017 (GMT) Multilayer Ceramic Chip Capacitors CGA3E3X8R1H104K080AE TDK item description CGA3E3X8R1H104KT***S Applications Automotive Grade 150°C High Temperature Application Feature Soft Soft Termination AEC-Q200 AEC-Q200 Series CGA3(1608) [EIA 0603] Status Production Size Length(L) 1.60mm +0.20,-0.10mm Width(W) 0.80mm +0.15,-0.10mm Thickness(T) 0.80mm +0.15,-0.10mm Terminal Width(B) 0.20mm Min. Terminal Spacing(G) 0.30mm Min. 0.70mm to 1.00mm(Flow Soldering) Recommended Land Pattern (PA) 0.60mm to 0.80mm(Reflow Soldering) 0.80mm to 1.00mm(Flow Soldering) Recommended Land Pattern (PB) 0.60mm to 0.80mm(Reflow Soldering) 0.60mm to 0.80mm(Flow Soldering) Recommended Land Pattern (PC) 0.60mm to 0.80mm(Reflow Soldering) Electrical Characteristics Capacitance 100nF ±10% Rated Voltage 50VDC Temperature Characteristic X8R(±15%) Dissipation Factor (Max.) 3% Insulation Resistance (Min.) 5000MΩ Other Soldering Method Wave (Flow) Reflow AEC-Q200 Yes Packing Punched (Paper)Taping [180mm Reel] Package Quantity 4000pcs ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 2 of 3 Creation Date : November 16, 2017 (GMT) Multilayer Ceramic Chip Capacitors CGA3E3X8R1H104K080AE Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.) Impedance CGA3E3X8R1H104K080AE ESR CGA3E3X8R1H104K080AE Capacitance CGA3E3X8R1H104K080AE CGA3E3X8R1H104K080AE Temperature Characteristic CGA3E3X8R1H104K080AE(No Bias) DC Bias Characteristic CGA3E3X8R1H104K080AE(DC Bias = 25V) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. Ripple Temperature Rising CGA3E3X8R1H104K080AE(100kHz) CGA3E3X8R1H104K080AE(500kHz) CGA3E3X8R1H104K080AE(1MHz) Multilayer Ceramic Chip Capacitors CGA3E3X8R1H104K080AE Associated Images Land Pattern (Terminal Connection) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 3 of 3 Creation Date : November 16, 2017 (GMT)
CGA3E3X8R1H104K080AE
物料型号:CGA3E3X8R1H104K080AE

器件简介:这是TDK公司生产的多层陶瓷片式电容器,适用于150°C高温环境,具有软终止特性,符合AEC-Q200标准。

引脚分配:电容器尺寸为长1.60mm、宽0.80mm、厚0.80mm,端头宽度至少0.20mm,端头间距至少0.30mm。推荐的焊盘图案尺寸为0.70mm至1.00mm(波峰焊接)或0.60mm至0.80mm(回流焊接)。

参数特性: - 电容值:100nF±10% - 额定电压:50VDC - 温度特性:X8R(±15%) - 最大损耗角正切值:3% - 最小绝缘电阻:5000MΩ

功能详解:文档提供了电容器的阻抗、等效串联电阻(ESR)和直流偏置特性图,这些图表是参考数据,不保证产品特性。

应用信息:适用于汽车级应用,150°C高温应用。

封装信息:包装方式为纸带卷装,每卷4000个。
CGA3E3X8R1H104K080AE 价格&库存

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CGA3E3X8R1H104K080AE
    •  国内价格
    • 50+0.87096

    库存:50

    CGA3E3X8R1H104K080AE
    •  国内价格
    • 10+0.97768
    • 100+0.58495
    • 500+0.54579
    • 1000+0.50664
    • 2000+0.47223
    • 4000+0.43782
    • 20000+0.39274
    • 40000+0.36782

    库存:30900

    CGA3E3X8R1H104K080AE
    •  国内价格
    • 50+0.71913
    • 500+0.64625
    • 5000+0.54907
    • 30000+0.52477
    • 90000+0.50048

    库存:0