SPECIFICATION
SPEC. No. A-150°C-c
D A T E : 2016 Oct.
To
Non-Controlled Copy
Upon the acceptance of this spec.
previous spec. (C2014-0057) shall
be abolished.
CUSTOMER’S PRODUCT NAME
TDK'S PRODUCT NAME
Multilayer Ceramic Chip Capacitors
CGA Series/ Automotive grade
High Temperature Application
Please return this specification to TDK representatives with your signature.
If orders are placed without returned specification, please allow us to judge that specification is
accepted by your side.
RECEIPT CONFIRMATION
DATE:
YEAR
MONTH
DAY
Test conditions in this specification based on AEC-Q200 for automotive application.
TDK Corporation
Sales
Electronic Components
Sales & Marketing Group
APPROVED
Person in charge
Engineering
Electronic Components Business Company
Ceramic Capacitors Business Group
APPROVED
CHECKED
Person in charge
1. SCOPE
This specification is applicable to chip type multilayer ceramic capacitors with a priority over the
other relevant specifications.
Production places defined in this specification shall be TDK Corporation Japan,
TDK(Suzhou)Co.,Ltd and TDK Components U.S.A. Inc.
EXPLANATORY NOTE:
This specification warrant the quality of the ceramic chip capacitor. The chips should be evaluated
or confirmed a state of mounted on your product.
If the use of the chips go beyond the bounds of this specification, we can not afford to guarantee.
2. CODE CONSTRUCTION
(Example)
Catalog Number
(Web)
Item Description
CGA
(1)
2
(2)
B
(3)
2
(4)
X8R
(5)
1 E
(6)
103
(7)
K
(8)
050
(9)
CGA
(1)
2
(2)
B
(3)
2
(4)
X8R
(5)
1 E
(6)
103
(7)
K
(8)
T
○○○○
(12)
(13)
(1) Series
(2) Case size symbol
B
(10)
Symbol
Series
CGA
For automotive application
Terminal electrode
B
L
G
W
B
T
Internal electrode
Ceramic dielectric
Symbol
2
3
4
5
Type
(EIA style)
CC0402
CC0603
CC0805
CC1206
Symbol
6
8
9
Type
(EIA style)
CC1210
CC1812
CC2220
*As for dimensions of each product, please refer to detailed inforamtion on TDK web.
(3) Thickness
Symbol
B
C
E
F
H
J
Dimension(mm)
0.50
0.60
0.80
0.85
1.15
1.25
—1—
A
(11)
Symbol
L
M
N
P
Q
R
Dimension(mm)
1.60
2.00
2.30
2.50
2.80
3.20
(4) Voltage condition in the life test
(Details are shown in table 1 No.16 at 8.PERFORMANCE.)
Condition
Symbol
1
Rated Voltage
2
Rated Voltage x 2
3
Rated Voltage x 1.5
4
Rated Voltage x 1.2
(5) Temperature Characteristics
(Details are shown in table 1 No.6 and No.7 at 8.PERFORMANCE.)
(6) Rated Voltage
Symbol
Rated Voltage
Symbol
Rated Voltage
2J
DC 630 V
1H
DC 50 V
2W
DC 450 V
1E
DC 25 V
2E
DC 250 V
1C
DC 16 V
2A
DC 100 V
Symbol
Rated
Capacitance
(7) Rated Capacitance
Stated in three digits and in units of pico farads (pF).
The first and Second digits identify the first and second
significant figures of the capacitance, the third digit
identifies the multiplier.
R is designated for a decimal point.
(8) Capacitance tolerance
2R2
2.2pF
105
1,000,000pF
(=1μF)
Symbol
Tolerance
C
± 0.25 pF
D
± 0.5 pF
J
±5%
K
± 10 %
M
± 20 %
Capacitance
10pF and under
Over 10pF
(9) Thickness code (Only catalog number)
(10) Package code (Only catalog number)
(11) Special code (Only catalog number)
(12) Packaging (Only item description)
(Bulk is not applicable for CGA2(CC0402) type.)
(13) TDK internal code (Only item description)
—2—
Symbol
Packaging
B
Bulk
T
Taping
3. RATED CAPACITANCE AND TOLERANCE
3.1 Standard combination of rated capacitance and tolerances
Class
Temperature
Characteristics
Capacitance tolerance
10pF and
under
1
NP0
2
12pF to
10,000pF
Over
10,000pF
C (±0.25pF)
1, 1.5, 2, 2.2, 3, 3.3, 4, 4.7, 5
D (±0.5pF)
6, 6.8, 7, 8, 9, 10
E – 12 series
J (±
5 %)
E – 6 series
K (± 10 %)
M (± 20 %)
X8R
Rated capacitance
E – 6 series
3.2 Capacitance Step in E series
Capacitance Step
E series
E- 6
E-12
1.0
1.0
1.5
1.2
1.5
1.8
2.2
2.2
2.7
4. OPERATING TEMPERATURE RANGE
Min. operating
Max. operating
T.C.
Temperature
Temperature
NP0,X8R
-55°C
150°C
3.3
3.3
4.7
3.9
4.7
5.6
6.8
6.8
8.2
Reference
Temperature
25°C
5. STORING CONDITION AND TERM
5 to 40°C at 20 to 70%RH
6 months Max.
6. P.C. BOARD
When mounting on an aluminum substrate, large case size such as CGA6(CC1210),
CGA8(CC1812) and CGA9(CC2220) types are more likely to be affected by heat stress from
the substrate.
Please inquire separate specification for the large case sizes when mounted on the substrate.
7. INDUSTRIAL WASTE DISPOSAL
Dispose this product as industrial waste in accordance with the Industrial Waste Law.
—3—
8. PERFORMANCE
table 1
No.
Item
Performance
Test or inspection method
1
External Appearance
No defects which may affect
performance.
2
Insulation Resistance
Apply rated voltage for 60s.
10,000MΩ or 500MΩ·μF min.
(As for the capacitors of rated
As for the capacitor of rated voltage 630V DC,
voltage 16V DC and,10,000 MΩ or
apply 500V DC.
100MΩ·μF min.,) whichever smaller.
3
Voltage Proof
Withstand test voltage without
insulation breakdown or other
damage.
Inspect with magnifying glass (3×)
T.C.
NP0
X8R
Rated
voltage(RV)
Apply voltage
RV≦100V
3 × rated voltage
100V<RV≦500V 1.5 × rated voltage
500V<RV
1.3 × rated voltage
RV≦100V
2.5 × rated voltage
100V<RV≦500V 1.5 × rated voltage
500V<RV
1.3 × rated voltage
Above DC voltage shall be applied for 1s.
Charge / discharge current shall not
exceed 50mA.
4
Capacitance
Within the specified tolerance.
Q
(NP0)
Dissipation Factor
(X8R)
6
Temperature
Characteristics
of Capacitance
(NP0)
As for spec of each product, please
refer to detailed inforamtion on TDK
web.
Temperature Coefficient
0 ± 30 (ppm/°C)
Capacitance drift within ± 0.2% or
± 0.05pF, whichever larger.
—4—
Measuring
voltage
Capacitance
NP0
1000pF
1MHz±10%
and under
0.5 - 5 Vrms.
Over 1000pF 1kHz±10%
X8R
5
Measuring
frequency
T.C.
All
1kHz±10% 1.0±0.2Vrms
For information which product has which
measuring voltage, please contact with our
sales representative.
See No.4 in this table for measuring
condition.
Temperature coefficient shall be calculated
based on values at 25°C and 85°C
temperature.
Measuring temperature below 20°C shall
be -10°C and -25°C.
(continued)
No.
7
Item
Temperature
Characteristics
of Capacitance
(X8R)
Performance
Capacitance Change
No voltage applied
±15(%)
8
Robustness of
Terminations
No sign of termination coming off,
breakage of ceramic, or other
abnormal signs.
Test or inspection method
Capacitance shall be measured by the
steps shown in the following table after
thermal equilibrium is obtained for each
step.
∆C be calculated ref. STEP3 reading
Step
Temperature(°C)
1
25 ± 2
2
-55 ± 2
3
25 ± 2
4
150 ± 2
Reflow solder the capacitors on
a P.C. board shown in Appendix2 and
apply a pushing force of 17.7N with
10±1s.
(2N is applied for CGA2(CC0402) type)
Pushing force
P.C. board
Capacitor
9
Bending
No mechanical damage.
Reflow solder the capacitors on
a P.C. board shown in Appendix1
and bend it for 2mm. (1mm is applied
for 0.85mm thickness of X8R items.)
20
50
F
R230
45
2
45
(Unit : mm)
10
Solderability
New solder to cover over 75% of
termination.
25% may have pin holes or rough
spots but not concentrated in one
spot.
Ceramic surface of A sections
shall not be exposed due to
melting or shifting of termination
material.
A section
—5—
Completely soak both terminations
in solder at the following conditions.
Solder : Sn-3.0Ag-0.5Cu or Sn-37Pb
Temperature : 245±5°C(Sn-3.0Ag-0.5Cu)
235±5°C(Sn-37Pb)
Soaking time : 3±0.3s(Sn-3.0Ag-0.5Cu)
2±0.2s(Sn-37Pb)
Flux: Isopropyl alcohol (JIS K 8839)
Rosin (JIS K 5902) 25% solid
solution.
(continued)
No.
11
Item
Performance
Resistance External
No cracks are allowed and
to solder
appearance terminations shall be covered at
heat
least 60% with new solder.
Capacitance
Q
(NP0)
12
Vibration
Characteristics
Change from the
value before test
NP0
± 2.5% or ± 0.25pF,
whichever larger.
X8R
± 7.5 %
D.F.
(X8R)
Meet the initial spec.
Insulation
Resistance
Meet the initial spec.
Voltage
proof
No insulation breakdown or
other damage.
External
appearance
No mechanical damage.
Q
Preheating condition
Temp.: 110 ~ 140°C
Time : 30 ~ 60s.
Solder : Sn-3.0Ag-0.5Cu or Sn-37Pb
Leave the capacitors in ambient
condition for 6 to 24h (NP0) or
24±2h (X8R) before measurement.
Characteristics
Change from the
value before test
NP0
± 2.5% or ± 0.25pF,
whichever larger.
X8R
± 7.5 %
Meet the initial spec.
(NP0)
D.F.
(X8R)
Completely soak both terminations in
solder at the following conditions.
260±5°C for 10±1s.
Flux : Isopropyl alcohol (JIS K 8839)
Rosin (JIS K 5902) 25% solid
solution.
Meet the initial spec.
Capacitance
Test or inspection method
Meet the initial spec.
—6—
Reflow solder the capacitors on
a P.C. board shown in Appendix2
before testing.
Vibrate the capacitors with following
conditions.
Applied force : 5G max.
Frequency : 10-2,000Hz
Duration : 20 min.
Cycle : 12 cycles in each 3 mutually
perpendicular directions.
(continued)
No.
Item
13
Temperature External
appearance
cycle
Performance
Test or inspection method
No mechanical damage.
Capacitance
Characteristics
Change from the
value before test
NP0
± 2.5% or ± 0.25pF,
whichever larger.
X8R
± 7.5 %
Reflow solder the capacitors on
a P.C. board shown in Appendix2 before
testing.
Expose the capacitors in the condition
step1 through step 4 and repeat 1,000
times consecutively.
Leave the capacitors in ambient
condition for 6 to 24h (NP0) or 24±2h
(X8R) before measurement.
Step
Q
1
Meet the initial spec.
(NP0)
14
2
3
D.F.
(X8R)
Meet the initial spec.
Insulation
Resistance
Meet the initial spec.
Voltage
proof
No insulation breakdown or
other damage.
4
Moisture
No mechanical damage.
External
appearance
Resistance
(Steady
Capacitance
Change from the
Characteristics
State)
value before test
Q
(NP0)
D.F.
(X8R)
Insulation
Resistance
NP0
± 5% or ± 0.5pF,
whichever larger.
X8R
± 12.5 %
Capacitance
Q
30pF and over
350 min.
10pF and over
under 30pF
275+5/2×C min.
Under 10pF
200+10×C min.
C : Rated capacitance (pF)
200% of initial spec. max.
1,000MΩ or 50MΩ·μF min.
(As for the capacitors of rated
voltage 16V DC, 1,000 MΩ or
10MΩ·μF min.,) whichever
smaller.
—7—
Temperature(°C)
-55 ±3
25
150 ±2
25
Time (min.)
30 ± 3
2-5
30 ± 2
2-5
Reflow solder the capacitors on
a P.C. board shown in Appendix2
before testing.
Leave at temperature 40±2°C, 90 to
95%RH for 500 +24,0h.
Leave the capacitors in ambient
condition for 6 to 24h (NP0) or
24±2h (X8R) before measurement.
(continued)
No.
Item
15
Moisture
External
Resistance appearance
Performance
No mechanical damage.
Capacitance
Q
(NP0)
D.F.
(X8R)
16
Life
Test or inspection method
Reflow solder the capacitors on a P.C.
board shown in Appendix2 before testing.
Characteristics
Change from the
value before test
Apply the rated voltage at temperature
85°C and 85%RH for 1,000 +48,0h.
NP0
±7.5% or ±0.75pF,
whichever larger.
Charge/discharge current shall not
X8R
± 12.5 %
Capacitance
Q
30pF and over
200 and over
Under 30pF
100+10/3×C min.
C : Rated capacitance (pF)
200% of initial spec. max.
Insulation
Resistance
500MΩ or 25MΩ·μF min.
(As for the capacitors of rated
voltage 16V DC, 500 MΩ or
5MΩ·μF min.,) whichever smaller.
External
appearance
No mechanical damage.
Capacitance
Characteristics
NP0
X8R
Change from the
value before test
± 3% or ± 0.3pF,
whichever larger.
± 15 %
exceed 50mA.
Leave the capacitors in ambient condition
for 6 to 24h (NP0) or 24±2h (X8R) before
measurement.
Voltage conditioning (only for X8R)
Voltage treat the capacitors under testing
temperature and voltage for 1 hour.
Leave the capacitors in ambient condition
for 24±2h before measurement.
Use this measurement for initial value.
Reflow solder the capacitors on
a P.C. board shown in Appendix2 before
testing.
Below the voltage shall be applied at
150 ±2°C for 1,000 +48,0h.
Applied Voltage
Rated voltage x2
Q
(NP0)
Capacitance
Q
30pF and over
350 and over
10pF and over to
275+5/2×C min.
under 30pF
Under 10pF
D.F.
(X8R)
Insulation
Resistance
200+10×C min.
C : Rated capacitance (pF)
200% of initial spec. max.
1,000MΩ or 50MΩ·μF min.
(As for the capacitors of rated
voltage 16V DC,1,000 MΩ or
10MΩ·μF min.,) whichever
smaller.
Rated voltage x1.5
Rated voltage x1.2
Rated voltage x1
As for applied voltage, please contact
with our sales representative.
Charge/discharge current shall not
exceed 50mA.
Leave the capacitors in ambient condition
for 6 to 24h (NP0) or 24±2h (X8R) before
measurement.
Voltage conditioning (only for X8R)
Voltage treat the capacitors under testing
temperature and voltage for 1 hour.
Leave the capacitors in ambient condition
for 24±2h before measurement.
Use this measurement for initial value.
*As for the initial measurement of capacitors (X8R) on number 7,11,12,13 and 14 leave capacitors at
150 –10,0°C for 1 hour and measure the value after leaving capacitors for 24±2h in ambient condition.
—8—
Appendix1
P.C. board for bending test
(CGA2)
(CGA3,CGA4,CGA5,CGA6,CGA8,CGA9)
100
100
b
b
40
40
c
1.0
1.0
a
a
Solder resist
Copper
c
Solder resist
Copper
Appendix2
P.C. Board for reliability test
100
40
a
b
c
Slit
Solder resist
Copper
(It is recommended to provide a slit on P.C. board for CGA6,CGA8 and CGA9.)
(Unit:mm)
Type
Dimensions
TDK(EIA style)
a
b
c
CGA2 (CC0402)
0.4
1.5
0.5
CGA3 (CC0603)
1.0
3.0
1.2
CGA4 (CC0805)
1.2
4.0
1.65
CGA5 (CC1206)
2.2
5.0
2.0
CGA6 (CC1210)
2.2
5.0
2.9
CGA8 (CC1812)
3.5
7.0
3.7
CGA9 (CC2220)
4.5
8.0
5.6
1. Material : Glass Epoxy(As per JIS C6484 GE4)
2. Thickness : Appendix 1 ― 0.8mm
― 1.6mm
: Appendix 2 ― 1.6mm
Copper(Thickness:0.035mm)
Solder resist
(CGA2)
(CGA3,CGA4,CGA5,CGA6,CGA8,CGA9)
—9—
9. INSIDE STRUCTURE AND MATERIAL
3
4
5
2
1
MATERIAL
No.
NAME
1
Dielectric
2
Electrode
NP0
X8R
CaZrO 3
BaTiO 3
Nickel (Ni)
3
Copper (Cu)
4
Nickel (Ni)
Termination
5
Tin (Sn)
10. PACKAGING
Packaging shall be done to protect the components from the damage during transportation and storing,
and a label which has the following information shall be attached.
1) Total number of components in a plastic bag for bulk packaging : 1000pcs
2) Tape packaging is as per 14. TAPE PACKAGING SPECIFICATION.
(CGA2 [CC0402] types are applicable only to tape packaging.)
1)
2)
3)
4)
Inspection No.
TDK P/N
Customer's P/N
Quantity
*Composition of Inspection No.
Example
F
6
A
(a) (b) (c)
a)
b)
c)
d)
e)
–
ΟΟ
(d)
–
ΟΟΟ
(e)
Line code
Last digit of the year
Month and A for January and B for February and so on. (Skip I)
Inspection Date of the month.
Serial No. of the day
11. RECOMMENDATION
As for CGA6 [CC1210] and larger, It is recommended to provide a slit (about 1mm width)
in the board under the components to improve washing Flux. And please make sure to dry
detergent up completely before.
12. SOLDERING CONDITION
As for CGA2 [CC0402], CGA6 [CC1210] and larger, reflow soldering only.
— 10 —
13. Caution
No.
Process
Condition
1
Operating
Condition
(Storage,
Transportation)
1-1. Storage
1) The capacitors must be stored in an ambient temperature of 5 to 40°C with a
relative humidity of 20 to 70%RH. The products should be used within 6 months
upon receipt.
2) The capacitors must be operated and stored in an environment free of dew
condensation and these gases such as Hydrogen Sulphide, Hydrogen Sulphate,
Chlorine, Ammonia and sulfur.
3) Avoid storing in sun light and falling of dew.
4) Do not use capacitors under high humidity and high and low atmospheric pressure
which may affect capacitors reliability.
5) Capacitors should be tested for the solderability when they are stored for long time.
1-2. Handling in transportation
In case of the transportation of the capacitors, the performance of the capacitors
may be deteriorated depending on the transportation condition.
(Refer to JEITA RCR-2335C 9.2 Handling in transportation)
2
Circuit design
Caution
2-1. Operating temperature
Operating temperature should be followed strictly within this specification, especially
be careful with maximum temperature.
1) Do not use capacitors above the maximum allowable operating temperature.
2) Surface temperature including self heating should be below maximum operating
temperature.
(Due to dielectric loss, capacitors will heat itself when AC is applied. Especially at
high frequencies around its SRF, the heat might be so extreme that it may damage
itself or the product mounted on. Please design the circuit so that the maximum
temperature of the capacitors including the self heating to be below the maximum
allowable operating temperature. Temperature rise at capacitor surface shall be
below 20°C)
3) The electrical characteristics of the capacitors will vary depending on the
temperature. The capacitors should be selected and designed in taking the
temperature into consideration.
2-2. Operating voltage
1) Operating voltage across the terminals should be below the rated voltage.
When AC and DC are super imposed, V0-P must be below the rated voltage.
— (1) and (2)
AC or pulse with overshooting, VP-P must be below the rated voltage.
— (3), (4) and (5)
When the voltage is started to apply to the circuit or it is stopped applying, the
irregular voltage may be generated for a transit period because of resonance or
switching. Be sure to use the capacitors within rated voltage containing these
Irregular voltage.
Voltage
(1) DC voltage
Positional
Measurement V0-P
(Rated voltage)
0
(4) Pulse voltage (A) (5) Pulse voltage (B)
Positional
Measurement VP-P
(Rated voltage)
0
VP-P
— 12 —
(3) AC voltage
VP-P
V0-P
0
Voltage
(2) DC+AC voltage
0
0
No.
Process
Condition
2
Circuit design
Caution
2) Even below the rated voltage, if repetitive high frequency AC or pulse is applied, the
reliability of the capacitors may be reduced.
3) The effective capacitance will vary depending on applied DC and AC voltages.
The capacitors should be selected and designed in taking the voltages into
consideration.
2-3. Frequency
When the capacitors (Class 2) are used in AC and/or pulse voltages, the
capacitors may vibrate themselves and generate audible sound.
3
Designing
P.C. board
The amount of solder at the terminations has a direct effect on the reliability of the
capacitors.
1) The greater the amount of solder, the higher the stress on the chip capacitors,
and the more likely that it will break. When designing a P.C. board, determine the
shape and size of the solder lands to have proper amount of solder on the
terminations.
2) Avoid using common solder land for multiple terminations and provide individual
solder land for each terminations.
3) Size and recommended land dimensions.
Chip capacitors
Solder land
C
B
Solder resist
A
Flow soldering
Type
(mm)
CGA3
(CC0603)
CGA4
(CC0805)
CGA5
(CC1206)
A
0.7 - 1.0
1.0 - 1.3
2.1 - 2.5
B
0.8 - 1.0
1.0 - 1.2
1.1 - 1.3
C
0.6 - 0.8
0.8 - 1.1
1.0 - 1.3
Symbol
Reflow soldering
CGA2
Type
Symbol
(CC0402)
CGA3
(CC0603)
(mm)
CGA4
(CC0805)
A
0.3 - 0.5
0.6 - 0.8
0.9 - 1.2
B
0.35 - 0.45
0.6 - 0.8
0.7 - 0.9
C
0.4 - 0.6
0.6 - 0.8
0.9 - 1.2
CGA5
(CC1206)
CGA6
(CC1210)
CGA8
(CC1812)
CGA9
(CC2220)
A
2.0 - 2.4
2.0 - 2.4
3.1 - 3.7
4.1 - 4.8
B
1.0 - 1.2
1.0 - 1.2
1.2 - 1.4
1.2 - 1.4
C
1.1 - 1.6
1.9 - 2.5
2.4 - 3.2
4.0 - 5.0
Type
Symbol
— 13 —
No.
3
Process
Designing
P.C. board
Condition
4) Recommended chip capacitors layout is as following.
Disadvantage against
bending stress
Advantage against
bending stress
Perforation or slit
Perforation or slit
Mounting
face
Break P.C. board with
mounted side up.
Mount perpendicularly to
perforation or slit
Perforation or slit
Break P.C. board with
mounted side down.
Mount in parallel with
perforation or slit
Perforation or slit
Chip
arrangement
(Direction)
Closer to slit is higher stress
Away from slit is less stress
ℓ2
ℓ1
Distance from
slit
( ℓ1< ℓ2 )
— 14 —
( ℓ1< ℓ2 )
No.
Process
3
Designing
P.C. board
Condition
5) Mechanical stress varies according to location of chip capacitors on the P.C. board.
E
Perforation
D
C
B
A
Slit
The stress in capacitors is in the following order.
A>B=C>D>E
6) Layout recommendation
Example
Use of common
solder land
Soldering with
chassis
Lead wire Chassis
chip
Solder
Use of common
solder land with
other SMD
Solder
land
Excessive solder
Need to
avoid
Excessive solder
PCB Adhesive
Solder land
ℓ1
Missing
solder
Lead wire
Solder land
Solder resist
Solder resist
Recommendation
Solder resist
ℓ2
ℓ2 >ℓ1
— 15 —
4
Process
Mounting
Condition
4-1. Stress from mounting head
If the mounting head is adjusted too low, it may induce excessive stress in the chip
capacitors to result in cracking. Please take following precautions.
1) Adjust the bottom dead center of the mounting head to reach on the P.C. board
surface and not press it.
2) Adjust the mounting head pressure to be 1 to 3N of static weight.
3) To minimize the impact energy from mounting head, it is important to provide
support from the bottom side of the P.C. board.
See following examples.
Not recommended
Single sided
mounting
Recommended
Crack
Support pin
Double-sides
mounting
Solder
peeling
Crack
Support pin
When the centering jaw is worn out, it may give mechanical impact on the capacitors
to cause crack. Please control the close up dimension of the centering jaw and
provide sufficient preventive maintenance and replacement of it.
4-2. Amount of adhesive
a
a
c
c
b
No.
Example : CGA4 (CC0805), CGA5 (CC1206)
a
0.2mm min.
b
70 - 100μm
c
Do not touch the solder land
— 16 —
Soldering
5-1. Flux selection
Although highly-activated flux gives better solderability, substances which increase
activity may also degrade the insulation of the chip capacitors. To avoid such
degradation, it is recommended following.
1) It is recommended to use a mildly activated rosin flux (less than 0.1wt% chlorine).
Strong flux is not recommended.
2) Excessive flux must be avoided. Please provide proper amount of flux.
3) When water-soluble flux is used, enough washing is necessary.
5-2. Recommended soldering profile by various methods
Reflow soldering
Wave soldering
Soldering
Preheating
Peak
Temp
Peak
Temp
△T
0
Soldering
Natural cooling
Preheating
Natural cooling
Temp.. (°C)
5
Condition
Temp. (°C)
Process
Over 60 sec.
Over 60 sec.
∆T
0
Over 60 sec.
Peak Temp time
Peak Temp time
Manual soldering
(Solder iron)
APPLICATION
As for CGA3 (CC0603), CGA4 (CC0805) and
Peak
Temp
CGA5 (CC1206), applied to wave soldering
and reflow soldering.
Temp.. (°C)
No.
As for CGA2 (CC0402), CGA6 (CC1210),
∆T
CGA8 (CC1812) and CGA9 (CC2220),
applied only to reflow soldering.
Preheating
0
3sec. (As short as possible)
※ As for peak temperature of manual soldering, please refer“5-6. Solder repair by solder iron”.
5-3. Recommended soldering peak temp and peak temp duration
Temp./Duration
Wave soldering
Reflow soldering
Peak temp(°C) Duration(sec.)
Peak temp(°C)
Duration(sec.)
Sn-Pb Solder
250 max.
3 max.
230 max.
20 max.
Lead Free Solder
260 max.
5 max.
260 max.
10 max.
Solder
Recommended solder compositions
Sn-37Pb (Sn-Pb solder)
Sn-3.0Ag-0.5Cu (Lead Free Solder)
— 17 —
No.
Process
5
Soldering
Condition
5-4. Avoiding thermal shock
1) Preheating condition
Soldering
Type
Wave soldering
Reflow soldering
Manual soldering
2)
Temp. (°C)
CGA3(CC0603), CGA4(CC0805),
CGA5(CC1206)
CGA2(CC0402), CGA3(CC0603),
CGA4(CC0805), CGA5(CC1206)
CGA6(CC1210), CGA8(CC1812),
CGA9(CC2220)
CGA2(CC0402), CGA3(CC0603),
CGA4(CC0805), CGA5(CC1206)
CGA6(CC1210), CGA8(CC1812),
CGA9(CC2220)
∆T ≤ 150
∆T ≤ 150
∆T ≤ 130
∆T ≤ 150
∆T ≤ 130
Cooling condition
Natural cooling using air is recommended. If the chips are dipped into a solvent for
cleaning, the temperature difference (∆T) must be less than 100°C.
5-5. Amount of solder
Excessive solder will induce higher tensile force in chip capacitors when
temperature changes and it may result in chip cracking. In sufficient solder may
detach the capacitors from the P.C. board.
Higher tensile force in
chip capacitors to cause
crack
Excessive
solder
Maximum amount
Minimum amount
Adequate
Low robustness may
cause contact failure or
chip capacitors come off
the P.C. board.
Insufficient
solder
5-6. Solder repair by solder iron
1) Selection of the soldering iron tip
Tip temperature of solder iron varies by its type, P.C. board material and solder
land size. The higher the tip temperature, the quicker the operation. However,
heat shock may cause a crack in the chip capacitors.
Please make sure the tip temp. before soldering and keep the peak temp and
time in accordance with following recommended condition. (Please preheat the
chip capacitors with the condition in 5-4 to avoid the thermal shock.)
Recommended solder iron condition (Sn-Pb Solder and Lead Free Solder)
Type
Temp. (°C)
CGA2(CC0402)
CGA3(CC0603)
CGA4(CC0805)
CGA5(CC1206)
350 max.
CGA6(CC1210)
CGA8(CC1812)
CGA9(CC2220)
280 max.
— 18 —
Duration (sec.)
Wattage (W)
Shape (mm)
3 max.
20 max.
Ø 3.0 max.
No.
Process
5
Soldering
Condition
2) Direct contact of the soldering iron with ceramic dielectric of chip capacitors
may cause crack. Do not touch the ceramic dielectric and the terminations by
solder iron.
5-7.Soldering rework using spot heater
Heat stress during rework may possibly be reduced by using a spot heater
(also called a “blower”) rather than a soldering iron.
It is applied only to adding solder in the case of insufficient solder amount.
1) Reworking using a spot heater may suppress the occurrence of cracks in the
capacitor compared to using a soldering iron. A spot heater can heat up a capacitor
uniformly with a small heat gradient which leads to lower thermal
stress caused by quick heating and cooling or localized heating.
Moreover, where ultra-small capacitors are mounted close together on a printed
circuit board, reworking with a spot heater can eliminate the risk of direct contact
between the tip of a soldering iron and a capacitor.
2) Rework condition
If the blower nozzle of a spot heater is too close to a capacitor, a crack in the
capacitor may occur due to heat stress. Below are recommendations for avoiding
such an occurrence.
Keep more than 5mm between a capacitor and a spot heater nozzle.
The blower temperature of the spot heater shall be lower than 400°C.
The airflow shall be set as weak as possible.
The diameter of the nozzle is recommended to be 2mm(one-outlet type).The size is
standard and common.
Duration of blowing hot air is recommended to be 10s or less for CGA3 (CC0603),
CGA4 (CC0805) and CGA5 (CC1206), and 30s or less for CGA6 (CC1210),
CGA8(CC1812) and CGA9 (CC2220), considering surface area of the capacitor
and melting temperature of solder.
The angle between the nozzle and the capacitor is recommended to be 45degrees
in order to work easily and to avoid partial area heating.
As is the case when using a soldering iron, preheating reduces thermal stress on
capacitors and improves operating efficiency.
・Recommended rework condition(Consult the component manufactures for details.)
Distance from nozzle
5mm and over
Nozzle angle
45degrees
Nozzle temp.
400°C and less
Set as weak as possible
(The airflow shall be the minimum value necessary for
solder to melt in the conditions mentioned above.)
φ2mm(one-outlet type)
Airflow
Nozzle diameter
Blowing duration
10s and less (CGA3 [CC0603], CGA4 [CC0805], CGA5 [CC1206])
30s and less (CGA6 [CC1210], CGA8 [CC1812], CGA9 [CC2220])
・Example of recommended spot heater use
One-outlet type nozzle
Angle : 45degrees
— 19 —
No.
Process
5
Soldering
Condition
3) Amount of solder should be suitable to from a proper fillet shape.
Excess solder causes mechanical and thermal stress on a capacitor and
results in cracks. Insufficient solder causes weak adherence of the capacitor
to the substrate and may result in detachment of a capacitor and deteriorate
reliability of the printed wiring board.
See the example of appropriate solder fillet shape for 5-5.Amount of solder.
5-8. Sn-Zn solder
Sn-Zn solder affects product reliability.
Please contact TDK in advance when utilize Sn-Zn solder.
5-9. Countermeasure for tombstone
The misalignment between the mounted positions of the capacitors and the land
patterns should be minimized. The tombstone phenomenon may occur especially
the capacitors are mounted (in longitudinal direction) in the same direction of the
reflow soldering.
(Refer to JEITA RCR-2335C Annex A (Informative) Recommendations to prevent the
tombstone phenomenon)
6
Cleaning
1) If an unsuitable cleaning fluid is used, flux residue or some foreign articles may
stick to chip capacitors surface to deteriorate especially the insulation resistance.
2) If cleaning condition is not suitable, it may damage the chip capacitors.
2)-1. Insufficient washing
(1) Terminal electrodes may corrode by Halogen in the flux.
(2) Halogen in the flux may adhere on the surface of capacitors, and lower the
insulation resistance.
(3) Water soluble flux has higher tendency to have above mentioned
problems (1) and (2).
2)-2. Excessive washing
When ultrasonic cleaning is used, excessively high ultrasonic energy output
can affect the connection between the ceramic chip capacitor's body and the
terminal electrode. To avoid this, following is the recommended condition.
Power : 20 W/ max.
Frequency : 40 kHz max.
Washing time : 5 minutes max.
2)-3. If the cleaning fluid is contaminated, density of Halogen increases, and it may
bring the same result as insufficient cleaning.
— 20 —
No.
7
Process
Coating and
molding of the
P.C. board
Condition
1) When the P.C. board is coated, please verify the quality influence on the product.
2) Please verify carefully that there is no harmful decomposing or reaction gas
emission during curing which may damage the chip capacitors.
3) Please verify the curing temperature.
8
Handling after
chip mounted
Caution
1) Please pay attention not to bend or distort the P.C. board after soldering
in handling otherwise the chip capacitors may crack.
Bend
Twist
2) Printed circuit board cropping should not be carried out by hand, but by using the
proper tooling. Printed circuit board cropping should be carried out using a board
cropping jig as shown in the following figure or a board cropping apparatus to
prevent inducing mechanical stress on the board.
(1)Example of a board cropping jig
Recommended example: The board should be pushed from the back side,
close to the cropping jig so that the board is not bent and the stress applied to
the capacitor is compressive.
Unrecommended example: If the pushing point is far from the cropping jig and
the pushing direction is from the front side of the board, large tensile stress is
applied to the capacitor, which may cause cracks.
Outline of jig
Printed
circuit
board
Recommended
V-groove
Printed
circuit
board
Direction of
load
Components
Load point
Slot
Board
cropping jig
V-groove
— 21 —
Slot
Unrecommended
Direction
of load
Load point
Printed
circuit
board
Components
V-groove
Slot
No.
8
Process
Handling after
chip mounted
Caution
Condition
(2)Example of a board cropping machine
An outline of a printed circuit board cropping machine is shown below. The
top and bottom blades are aligned with one another along the lines with the
V-grooves on printed circuit board when cropping the board.
Unrecommended example: Misalignment of blade position between top and
bottom, right and left, or front and rear blades may cause a crack in the
capacitor.
Outline of machine
Principle of operation
Top
blade
Top blade
Printed circuit board
Printed circuit board
Bottom blade
V-groove
Cross-section diagram
Top blade
Printed circuit board
Bottom blade
V-groove
Unrecommended
Recommended
Top-bottom
misalignment
Left-right
misalignment
Front-rear
misalignment
Top blade
Top blade
Top blade
Bottom blade
Bottom blade
Bottom blade
Top blade
Board
Bottom blade
3) When functional check of the P.C. board is performed, check pin pressure tends
to be adjusted higher for fear of loose contact. But if the pressure is excessive
and bend the P.C. board, it may crack the chip capacitors or peel the
terminations off. Please adjust the check pins not to bend the P.C. board.
Item
Not recommended
Termination
peeling
Board
bending
Check pin
— 22 —
Recommended
Support pin
Check pin
No.
9
Process
Handling of loose
chip capacitors
Condition
1) If dropped the chip capacitors may crack. Once dropped do not use it. Especially,
the large case sized chip capacitors are tendency to have cracks easily, so please
handle with care.
Crack
Floor
2) Piling the P.C. board after mounting for storage or handling, the corner of the P.C.
board may hit the chip capacitors of another board to cause crack.
P.C.board
Crack
10
Capacitance aging
The capacitors (Class 2) have aging in the capacitance. They may not be used in
precision time constant circuit. In case of the time constant circuit, the evaluation
should be done well.
11
Estimated life and
estimated failure
rate of capacitors
As per the estimated life and the estimated failure rate depend on the temperature
and the voltage. This can be calculated by the equation described in JEITA
RCR-2335C Annex F (Informative) Calculation of the estimated lifetime and the
estimated failure rate ( Voltage acceleration coefficient : 3 multiplication rule,
Temperature acceleration coefficient : 10°C rule)
The failure rate can be decreased by reducing the temperature and the voltage but
they will not be guaranteed.
— 23 —
No.
12
Process
Caution during
operation of
equipment
Condition
1) A capacitor shall not be touched directly with bare hands during operation in
order to avoid electric shock.
Electric energy held by the capacitor may be discharged through the human
body when touched with a bare hand.
Even when the equipment is off, a capacitor may stay charged. The capacitor
should be handled after being completely discharged using a resistor.
2) The terminals of a capacitor shall not be short-circuited by any accidental
contact with a conductive object. A capacitor shall not be exposed to a
conductive liquid such as an acid or alkali solution. A conductive object or liquid,
such as acid and alkali, between the terminals may lead to the breakdown of a
capacitor due to short circuit
3) Confirm that the environment to which the equipment will be exposed during
transportation and operation meets the specified conditions. Do not to use the
equipment in the following environments.
(1) Environment where a capacitor is spattered with water or oil
(2) Environment where a capacitor is exposed to direct sunlight
(3) Environment where a capacitor is exposed to Ozone, ultraviolet rays or
radiation
(4) Environment where a capacitor exposed to corrosive gas(e.g. hydrogen
sulfide, sulfur dioxide, chlorine. ammonia gas etc.)
(5) Environment where a capacitor exposed to vibration or mechanical shock
exceeding the specified limits.
(6) Atmosphere change with causes condensation
13
Others
Caution
The products listed on this specification sheet are intended for use in general
electronic equipment (AV equipment, telecommunications equipment, home
appliances, amusement equipment, computer equipment, personal equipment, office
equipment, measurement equipment, industrial robots) and automotive application
under a normal operation and use condition.
The products are not designed or warranted to meet the requirements of the
applications listed below, whose performance and/or quality require a more stringent
level of safety or reliability, or whose failure, malfunction or trouble could cause
serious damage to society, person or property. Please understand that we are not
responsible for any damage or liability caused by use of the products in any of the
applications below or for any other use exceeding the range or conditions set forth in
this specification sheet. If you intend to use the products in the applications listed
below or if you have special requirements exceeding the range or conditions set forth
in this specification, please contact us.
(1) Aerospace/Aviation equipment
(2) Transportation equipment (electric trains, ships, etc. except automotive application)
(3) Medical equipment (Excepting Pharmaceutical Affairs Law classification Class1, 2)
(4) Power-generation control equipment
(5) Atomic energy-related equipment
(6) Seabed equipment
(7) Transportation control equipment
(8) Public information-processing equipment
(9) Military equipment
(10) Electric heating apparatus, burning equipment
(11) Disaster prevention/crime prevention equipment
(12) Safety equipment
(13) Other applications that are not considered general-purpose applications
When designing your equipment even for general-purpose applications, you are
kindly requested to take into consideration securing protection circuit/device or
providing backup circuits in your equipment.
— 24 —
14. TAPE PACKAGING SPECIFICATION
1. CONSTRUCTION AND DIMENSION OF TAPING
1-1. Dimensions of carrier tape
Dimensions of paper tape shall be according to Appendix 3, 4.
Dimensions of plastic tape shall be according to Appendix 5, 6.
1-2. Bulk part and leader of taping
Bulk
Bulk
160mm min.
Chips
160mm min.
Leader
Drawing direction
400mm min
1-3. Dimensions of reel
Dimensions of Ø178 reel shall be according to Appendix 7, 8.
Dimensions of Ø330 reel shall be according to Appendix 9, 10.
1-4. Structure of taping
(a) Paper
(b) Plastic
Top cover tape
Top cover tape
Pitch hole
Paper carrier tape
Bottom cover tape
(Bottom cover tape is not always applied.)
Plastic carrier tape
2. CHIP QUANTITY
As for chip quantity and taping material of each product, please refer to detailed
inforamtion on TDK web.
— 25 —
3. PERFORMANCE SPECIFICATIONS
3-1. Fixing peeling strength (top tape)
0.05-0.7N. (See the following figure.)
〈Paper〉
Direction of cover tape pulling
Top cover tape
Carrier tape
0~15°
Direction of pulling
Paper tape should not adhere to top
cover tape when pull the cover tape.
〈Plastic〉
Direction of pulling
Top cover tape
Carrier tape
0~15°
Direction of pulling
3-2. Carrier tape shall be flexible enough to be wound around a minimum radius
of 30mm with components in tape.
3-3. The missing of components shall be less than 0.1%
3-4. Components shall not stick to fixing tape.
3-5. The fixing tapes shall not protrude beyond the edges of the carrier tape
not shall cover the sprocket holes.
— 26 —
Appendix 3
Paper Tape
Pitch hole
Cavity(Chip insert)
J
E
A
D
B
G
H
T
F
(Unit : mm)
Symbol
Type
CGA2
(CC0402)
Symbol
Type
CGA2
(CC0402)
(
A
B
C
D
E
F
( 0.65 )
( 1.15 )
8.00 ± 0.30
3.50 ± 0.05
1.75 ± 0.10
2.00 ± 0.05
G
H
J
T
2.00 ± 0.05
4.00 ± 0.10 Ø 1.50
+0.10
0
) Reference value.
— 27 —
0.60±0.15
Appendix 4
Paper Tape
(Paper tape shall be used for parts having a thickness of less than 1.0mm)
Pitch hole
Cavity(Chip insert)
J
E
A
D
B
T
H
G
C
F
(Unit : mm)
Symbol
Type
CGA3
(CC0603)
CGA4
(CC0805)
CGA5
(CC1206)
Symbol
Type
CGA3
(CC0603)
CGA4
(CC0805)
CGA5
(CC1206)
(
A
B
( 1.10 )
( 1.90 )
( 1.50 )
( 2.30 )
( 1.90 )
( 3.50 )
G
H
2.00 ± 0.05
4.00 ± 0.10
C
D
E
F
8.00 ± 0.30
3.50 ± 0.05
1.75 ± 0.10
4.00 ± 0.10
J
T
Ø 1.50
+0.10
0
) Reference value.
— 28 —
1.20 max.
Appendix 5
Plastic Tape
Pitch hole
Cavity(Chip insert)
J
E
A
D
C
B
t
H
K
Q
F
G
(Unit : mm)
Symbol
Type
CGA4
(CC0805)
CGA5
(CC1206)
CGA6
(CC1210)
Symbol
Type
CGA4
(CC0805)
CGA5
(CC1206)
CGA6
(CC1210)
(
A
B
( 1.50 )
( 2.30 )
( 1.90 )
( 3.50 )
C
D
8.00 ± 0.30
3.50 ± 0.05
E
F
1.75 ± 0.10
4.00 ± 0.10
t
Q
0.60 max.
Ø 0.50 min.
* 12.00 ± 0.30 * 5.50 ± 0.05
( 2.90 )
( 3.60 )
G
H
2.00 ± 0.05
4.00 ± 0.10
J
Ø 1.50
K
+0.10
0
2.50 max.
3.40 max.
) Reference value.
Exceptionally no hole in the cavity is applied. Please inquire if hole in cavity is mandatory.
* Applied to thickness, 2.5mm products.
— 29 —
Appendix 6
Plastic Tape
Pitch hole
Cavity(Chip insert)
J
E
A
D
B
t
H
G
C
Q
F
K
(Unit : mm)
Symbol
Type
CGA8
(CC1812)
CGA9
(CC2220)
Symbol
Type
CGA8
(CC1812)
CGA9
(CC2220)
(
A
B
( 3.60 )
( 4.90 )
( 5.40 )
( 6.10 )
G
H
2.00 ± 0.05
4.00 ± 0.10
C
D
E
F
12.00 ± 0.30
5.50 ± 0.05
1.75 ± 0.10
8.00 ± 0.10
J
K
t
Q
6.50 max.
0.60 max.
Ø 1.50 min.
Ø 1.50
+0.10
0
) Reference value.
— 30 —
Appendix 7
CGA2, CGA3, CGA4, CGA5, CGA6
( As for CGA6 type, any thickness of the item except 2.5mm )
(Material : Polystyrene)
W2
E
C
B
D
r
W1
A
(Unit : mm)
Symbol
A
B
C
D
E
W1
Dimension
Ø178 ± 2.0
Ø60 ± 2.0
Ø13 ± 0.5
Ø21 ± 0.8
2.0 ± 0.5
9.0 ± 0.3
Symbol
W2
r
Dimension
13.0 ± 1.4
1.0
Appendix 8
CGA6, CGA8, CGA9 ( As for CGA6 type, applied to 2.5mm thickness products )
(Material : Polystyrene)
W2
E
C
B
D
r
W1
A
(Unit : mm)
Symbol
A
B
C
D
E
W1
Dimension
Ø178 ± 2.0
Ø60 ± 2.0
Ø13 ± 0.5
Ø21 ± 0.8
2.0 ± 0.5
13.0 ± 0.3
Symbol
W2
r
Dimension
17.0 ± 1.4
1.0
— 31 —
Appendix 9
CGA2, CGA3, CGA4, CGA5, CGA6
( As for CGA6 type, any thickness of the item except 2.5mm )
(Material : Polystyrene)
E
C
B
D
r
t
W
A
(Unit : mm)
Symbol
A
B
C
D
E
W
Dimension
Ø382 max.
(Nominal
Ø330)
Ø50 min.
Ø13 ± 0.5
Ø21 ± 0.8
2.0 ± 0.5
10.0 ± 1.5
Symbol
t
r
Dimension
2.0 ± 0.5
1.0
Appendix 10
CGA6, CGA8, CGA9 ( As for CGA6 type, applied to 2.5mm thickness products )
(Material : Polystyrene)
E
C
B
D
r
W
A
t
(Unit : mm)
Symbol
A
B
C
D
E
W
Dimension
Ø382 max.
(Nominal
Ø330)
Ø50 min.
Ø13 ± 0.5
Ø21 ± 0.8
2.0 ± 0.5
14.0 ± 1.5
Symbol
t
r
Dimension
2.0 ± 0.5
1.0
— 32 —