CGA6M3X7R1C106KT0Y0N

AUT-GEN-004 DELIVERY SPECIFICATION SPEC. No. A-General-g D A T E : Jun, 2019 To Non-Controlled Copy Upon the acceptance of this spec. previous spec. (C2014-0057) shall be abolished. CUSTOMER’S PRODUCT NAME TDK'S PRODUCT NAME Multilayer Ceramic Chip Capacitors Bulk and Tape packaging 【RoHS compliant】 CGA1,CGA2,CGA3,CGA4,CGA5,CGA6,CGA8,CGA9Type C0G,NP0,X7R,X7S,X7T,X8R,X8L Characteristics Please return this specification to TDK representatives with your signature. If orders are placed without returned specification, please allow us to judge that specification is accepted by your side. RECEIPT CONFIRMATION DATE: YEAR MONTH DAY Test conditions in this specification based on AEC-Q200 for automotive application. TDK Corporation Sales Electronic Components Sales & Marketing Group APPROVED Person in charge Engineering Electronic Components Business Company Ceramic Capacitors Business Group APPROVED CHECKED Person in charge AUT-GEN-004 —1— AUT-GEN-004 —2— AUT-GEN-004 —3— AUT-GEN-004 SCOPE This delivery specification shall be applied to Multilayer ceramic chip capacitors to be delivered to . PRODUCTION PLACES Production places defined in this specification shall be TDK Corporation, TDK(Suzhou)Co.,Ltd and TDK Components U.S.A.,Inc. PRODUCT NAME The name of the product to be defined in this specifications shall be CGA◇◇◇○○○△△□□□×. REFERENCE STANDARD JIS C 5101－1：2010 C 5101－21：2014 Fixed capacitors for use in electronic equipment-Part 1: Generic specification Fixed capacitors for use in electronic equipment-Part21 : Sectional specification : Fixed surface mount multilayer capacitors of ceramic dielectric,Class1 C 5101－22：2014 Fixed capacitors for use in electronic equipment-Part22 : Sectional specification : Fixed surface mount multilayer capacitors of ceramic dielectric,Class 2 C 0806－3：2014 Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes JEITA RCR－2335 C 2014 Safety application guide for fixed ceramic capacitors for use in electronic equipment CONTENTS 1. CODE CONSTRUCTION 2. COMBINATION OF RATED CAPACITANCE AND TOLERANCE 3. OPERATING TEMPERATURE RANGE 4. STORING CONDITION AND TERM 5. P.C. BOARD 6. INDUSTRIAL WASTE DISPOSAL 7. PERFORMANCE 8. INSIDE STRUCTURE AND MATERIAL 9. PACKAGING 10. RECOMMENDATION 11. SOLDERING CONDITION 12. CAUTION 13. TAPE PACKAGING SPECIFICATION When the mistrust in the spec arises, this specification is given priority. And it will be confirmed by written spec change after conference of both posts involved. This specification warrants the quality of the ceramic chip capacitor. Capacitors should be evaluated or confirmed a state of mounted on your product. If the use of the capacitors goes beyond the bounds of this specification, we can not afford to guarantee. Division Date SPEC. No. Ceramic Capacitors Business Group Jun. 2019 A-General-g —4— AUT-GEN-004 1. CODE CONSTRUCTION (Example) CGA CGA (1) 2 6 (2) B P (3) 3 3 (4) X7R X7S (5) 1E 1H (6) 104 106 (7) (1) Series (2) Case size K K (8) T T (9) ○○○○ ○○○○ (10) Symbol Series CGA For automotive application Terminal electrode L B W G B T Internal electrode Ceramic dielectric Dimensions (Unit : mm) L W T 0.60±0.03 0.30±0.03 0.30±0.03 CGA1 1 (CC0201) 0.60 +0.10 0.30 +0.10 0.30 +0.10 -0.03 -0.03 -0.03 1.00±0.05 0.50±0.05 0.50±0.05 CGA2 2 (CC0402) 1.00±0.10 0.50±0.10 0.50±0.10 1.60±0.10 0.80±0.10 0.80±0.10 1.60±0.15 0.80±0.15 0.80±0.15 CGA3 3 1.60±0.20 0.80±0.20 0.80±0.20 (CC0603) +0.30 +0.30 1.60 0.80 0.80 +0.30 -0.10 -0.10 -0.10 0.60±0.15 2.00±0.20 1.25±0.20 0.85±0.15 CGA4 4 1.25±0.20 (CC0805) +0.25 +0.25 2.00 1.25 1.25 +0.25 -0.15 -0.15 -0.15 0.60±0.15 0.85±0.15 3.20±0.20 1.60±0.20 1.15±0.15 CGA5 5 1.30±0.20 (CC1206) 1.60±0.20 +0.30 +0.30 3.20 1.60 1.60 +0.30 -0.10 -0.10 -0.10 1.25±0.20 1.60±0.20 CGA6 3.20±0.40 2.50±0.30 2.00±0.20 6 (CC1210) 2.30±0.20 2.50±0.30 1.60±0.20 2.00±0.20 CGA8 4.50±0.40 3.20±0.40 8 2.30±0.20 (CC1812) 2.50±0.30 3.20±0.30 1.60±0.20 2.00±0.20 CGA9 5.70±0.40 5.00±0.40 9 2.30±0.20 (CC2220) 2.50±0.30 2.80±0.30 *As for each item, please refer to detail page on TDK Web. Case size Case size Symbol (EIA style) —5— B G 0.10 min. 0.20 min. 0.10 min. 0.30 min. 0.20 min. 0.30 min. 0.20 min. 0.50 min. 0.20 min. 1.00 min. 0.20 min. ―― 0.20 min. ―― 0.20 min. ―― AUT-GEN-004 (3) Thickness Symbol A B C E F H J Dimension(mm) 0.30 0.50 0.60 0.80 0.85 1.15 1.25 (4) Voltage condition in the life test * Details are shown in table 1 No.16 at 7.PERFORMANCE. Dimension(mm) 1.30 1.60 2.00 2.30 2.50 2.80 3.20 Symbol K L M N P Q R Condition Symbol 1 Rated Voltage 2 Rated Voltage x 2 3 Rated Voltage x 1.5 4 Rated Voltage x 1.2 (5) Temperature Characteristics * Details are shown in table 1 No.6 and No.7 at 7.PERFORMANCE. (6) Rated Voltage Symbol Rated Voltage Symbol Rated Voltage 2J DC 630 V 1V DC 35 V 2W DC 450 V 1E DC 25 V 2E DC 250 V 1C DC 16 V 2A DC 100 V 1A DC 10 V 1N DC 75 V 0J DC 6.3 V 1H DC 50 V 0G DC 4 V Symbol Rated Capacitance (Example) (7) Rated Capacitance Stated in three digits and in units of pico farads (pF). The first and Second digits identify the first and second significant figures of the capacitance, the third digit identifies the multiplier. R is designated for a decimal point. (8) Capacitance tolerance * M tolerance shall be standard for over 10uF. 1 04 100,000 pF Tolerance C ± 0.25 pF D ± 0.5 pF J ± 5% K ± 10 % *M ± 20 % * CGA1 and CGA2 types are applicable to tape packaging only. —6— 2.2 pF Symbol (9) Packaging (10) TDK internal code 2R 2 Capacitance 10pF and under Over 10pF Symbol Packaging B Bulk T Taping AUT-GEN-004 2. COMBINATION OF RATED CAPACITANCE AND TOLERANCE Class Temperature Characteristics Capacitance tolerance 10pF and under C0G NP0 1 X7R X7S X7T X8R X8L 2 Rated capacitance C (±0.25pF) 1, 1.5, 2, 2.2, 3, 3.3, 4, 4.7, 5 D (±0.5pF) 6, 6.8, 7, 8, 9, 10 12pF to 10,000pF Over 10,000pF J (± 0.1uF and under K (± 10 %) Over 0.1uF K (± 10 %) M (± 20 %) E – 12 series 5 %) E – 6 series E – 6 series Capacitance Step in E series Capacitance Step E series 1.0 E- 6 1.0 E-12 1.5 1.2 1.5 2.2 1.8 2.2 3.3 2.7 3.3 4.7 3.9 4.7 6.8 5.6 6.8 8.2 3. OPERATING TEMPERATURE RANGE T.C. Min. operating Temperature Max. operating Temperature Reference Temperature C0G -55°C 125°C 25°C NP0 -55°C 150°C 25°C X7R/X7S/X7T -55°C 125°C 25°C X8R/X8L -55°C 150°C 25°C 4. STORING CONDITION AND TERM Storing temperature Storing humidity Storing term 5~40°C 20~70%RH Within 6 months upon receipt. 5. P.C. BOARD When mounting on an aluminum substrate, large case size such as CGA6 [CC1210] and larger are more likely to be affected by heat stress from the substrate. Please inquire separate specification for the large case sizes when mounted on the substrate. 6. INDUSTRIAL WASTE DISPOSAL Dispose this product as industrial waste in accordance with the Industrial Waste Law. —7— AUT-GEN-004 7. PERFORMANCE Table 1 No. Item Performance Test or inspection method 1 External Appearance No defects which may affect performance. Inspect with magnifying glass (3×) In case of CGA1[CC0201] type, with magnifying glass(10×). 2 Insulation Resistance 10,000MΩ or 500MΩ·μF min. (As for the capacitors of rated voltage 16V DC and lower, 10,000 MΩ or 100MΩ·μF min.), whichever smaller. Measuring voltage：Rated voltage (As for the capacitor of rated voltage 630V DC, apply 500V DC.) Voltage application time：60s. 3 Voltage Proof Withstand test voltage without insulation breakdown or other damage. Class 1 2 Rated voltage(RV) Apply voltage RV≦100V 3 × rated voltage 100V＜RV≦500V 1.5 × rated voltage 500V＜RV 1.3 × rated voltage RV≦100V 2.5 × rated voltage 100V＜RV≦500V 1.5 × rated voltage 500V＜RV 1.3 × rated voltage Voltage application time : 1s. Charge / discharge current : 50mA or lower 4 Capacitance Within the specified tolerance. 《Cl a ss 1》 Capacitance Measuring frequency 1000pF and under 1MHz±10% Over 1000pF 1kHz±10% Measuring voltage 0.5 ~ 5 Vrms. 《Cl a ss 2》 Capacitance Measuring frequency Measuring voltage 10uF and under 1kHz±10% 1.0±0.2Vrms Over 10uF 120Hz±20% 0.5±0.2Vrms. As for the capacitors of rated voltage 6.3V DC, 0.5Vrms is applied. As an exception, 1.0Vrms is applied for 10uF and under on X8L characteristics. 5 6 Q Class1 Dissipation Factor Class2 Temperature Characteristics of Capacitance (Class1) Please refer to detail page on TDK Web. T.C. Temperature Coefficient (ppm/°C) C0G 0 ± 30 NP0 0 ± 30 Capacitance Within ± 0.2% or ± 0.05pF, drift whichever larger. —8— See No.4 in this table for measuring condition. Temperature coefficient shall be calculated based on values at 25°C and 85°C temperature. Measuring temperature below 25°C shall be -10°C and -25°C. AUT-GEN-004 (continued) No. 7 Item Temperature Characteristics of Capacitance (Class2) Performance Capacitance Change (%) No voltage applied X7R : ± 15 X7S : ± 22 +22 X7T : -33 X8R : ± 15 X8L : +15 -40 Test or inspection method Capacitance shall be measured by the steps shown in the following table after thermal equilibrium is obtained for each step. ∆C be calculated ref. STEP3 reading Step Temperature(°C) 1 Reference temp. ± 2 2 Min. operating temp. ± 2 3 Reference temp. ± 2 4 Max. operating temp. ± 2 As for Min./ Max. operating temp. and Reference temp., please refer to "4.OPERATING TEMPERATURE RANGE". As for measuring voltage, please contact with our sales representative. 8 Robustness of Terminations No sign of termination coming off, breakage of ceramic, or other abnormal signs. Reflow solder the capacitors on a P.C.Board shown in Appendix 2. Apply a pushing force gradually at the center of a specimen in a horizontal direction of P.C.board. Pushing force : 17.7N (2N is applied for CGA1 and CGA2 type.) Holding time : 10±1s. Pushing force Capacitor 9 Bending No mechanical damage. P.C.Board Reflow solder the capacitors on a P.C.Board shown in Appendix 1. (1mm is applied for 0.85mm thickness of Class2 items.) 20 50 F R230 2 45 10 Solderability New solder to cover over 75% of termination. 25% may have pin holes or rough spots but not concentrated in one spot. Ceramic surface of A sections shall not be exposed due to melting or shifting of termination material. A section —9— Solder : Flux : 45 (Unit : mm) Sn-3.0Ag-0.5Cu or Sn-37Pb Isopropyl alcohol (JIS K 8839) Rosin (JIS K 5902) 25% solid solution. Solder temp. : 245±5°C (Sn-3.0Ag-0.5Cu) 235±5°C (Sn-37Pb) Dwell time : 3±0.3s.(Sn-3.0Ag-0.5Cu) 2±0.2s.(Sn-37Pb) Solder position : Until both terminations are completely soaked. AUT-GEN-004 (continued) No. 11 Item Performance Resistance External No cracks are allowed and to solder appearance terminations shall be covered at least 60% with new solder. heat Capacitance Characteristics Q Class1 C0G NP0 Class2 X7R X7S X7T X8R X8L Vibration ± 2.5% or ± 0.25pF, whichever larger. ± 7.5 % Meet the initial spec. Meet the initial spec. Insulation Resistance Meet the initial spec. Voltage proof No insulation breakdown or other damage. External appearance No mechanical damage. Characteristics Q Class1 C0G NP0 Class2 X7R X7S X7T X8R X8L Change from the value before test ± 2.5% or ± 0.25pF, whichever larger. ± 7.5 % Meet the initial spec. (Class1) D.F. (Class2) Sn-3.0Ag-0.5Cu or Sn-37Pb Flux : Isopropyl alcohol (JIS K 8839) Rosin (JIS K 5902) 25% solid solution. Solder temp. : 260±5°C Dwell time : 10±1s. Solder position : Until both terminations are completely soaked. Pre-heating : Temp. ― 110~140°C Time ― 30～60s. Leaving time : Class1 ― 6~24h Class2 ― 24±2h D.F. (Class2) Capacitance Solder : Change from the value before test (Class1) 12 Test or inspection method Meet the initial spec. — 10 — Applied force : 5G max. Frequency : 10~2,000Hz Reciprocating sweep time : 20 min. Cycle : 12 cycles in each 3 mutually perpendicular directions. Reflow solder the capacitors on a P.C.Board shown in Appendix 2 before testing. AUT-GEN-004 (continued) No. Item 13 Temperature External appearance cycle Performance No mechanical damage. Capacitance Characteristics Change from the value before test Test or inspection method Expose the capacitors in the condition step1 through step 4 listed in the following table. Temp. cycle：1,000 cycles Step Class1 Class2 C0G NP0 X7R X7S X7T X8R X8L 1 Please contact with our sales representative. 2 3 4 Q Meet the initial spec. D.F. (Class2) Meet the initial spec. Insulation Resistance Meet the initial spec. Voltage proof No insulation breakdown or other damage. Q (Class1) D.F. (Class2) Insulation Resistance C0G NP0 Class2 X7R X7S X7T X8R X8L Min. operating temp. ±3 Ambient Temp. Max. operating temp. ±2 Ambient Temp. 30 ± 3 2~5 30 ± 2 2~5 Leaving time : Class1 ― 6~24h Class2 ― 24±2h Moisture No mechanical damage. External appearance Resistance (Steady Capacitance Change from the Characteristics State) value before test Class1 Time (min.) As for Min./ Max. operating temp., please refer to "3.OPERATING TEMPERATURE RANGE". (Class1) 14 Temperature(°C) Reflow solder the capacitors on a P.C.Board shown in Appendix 2 before testing. Test temp.：40±2°C Test humidity：90~95%RH Test time：500 +24,0h Leaving time : Class1 ― 6~24h Class2 ― 24±2h Please contact with our sales representative. Capacitance Q 30pF and over 350 min. 10pF and over under 30pF 275+5/2×C min. Under 10pF 200+10×C min. C : Rated capacitance (pF) 200% of initial spec. max. 1,000MΩ or 50MΩ·μF min. (As for the capacitors of rated voltage 16V DC and lower, 1,000 MΩ or 10MΩ·μF min.), whichever smaller. — 11 — Reflow solder the capacitors on a P.C.Board shown in Appendix2 before testing. AUT-GEN-004 (continued) No. Item 15 Moisture External Resistance appearance Performance No mechanical damage. Capacitance Characteristics Q (Class1) D.F. (Class2) 16 Life Test or inspection method Class1 C0G NP0 Class2 X7R X7S X7T X8R X8L Change from the value before test Charge/discharge current：50mA or lower Please contact with our sales representative. Capacitance Q 30pF and over 200 min. Under 30pF 100+10/3×C min. C : Rated capacitance (pF) 200% of initial spec. max. Insulation Resistance 500MΩ or 25MΩ·μF min. (As for the capacitors of rated voltage 16V DC and lower, 500 MΩ or 5MΩ·μF min.), whichever smaller. External appearance No mechanical damage. Capacitance Characteristics Q (Class1) Class1 C0G NP0 Class2 X7R X7S X7T X8R X8L Change from the value before test Please contact with our sales representative. Q 30pF and over 350 min. 10pF and over to 275+5/2×C min. under 30pF D.F. (Class2) Insulation Resistance Leaving time : Class1 ― 6~24h Class2 ― 24±2h Reflow solder the capacitors on a P.C.Board shown in Appendix2 before testing. Initial value setting (only for class 2) Voltage conditioning 《After voltage treat the capacitors under testing temperature and voltage for 1 hour,》 leave the capacitors in ambient condition for 24±2h before measurement. Use this measurement for initial value. Test temp.：Maximum operating temperature±2°C Applied voltage：Please contact with our sales representative. Test time：1,000 +48,0h Capacitance Under 10pF Test temp.：85±2°C Test humidity：85%RH Applied voltage：Rated voltage Test time：1,000 +48,0h 200+10×C min. C : Rated capacitance (pF) 200% of initial spec. max. 1,000MΩ or 50MΩ·μF min. (As for the capacitors of rated voltage 16V DC and lower, 1,000 MΩ or 10MΩ·μF min.), whichever smaller. Charge/discharge current：50mA or lower Leaving time : Class1 ― 6~24h Class2 ― 24±2h Reflow solder the capacitors on a P.C.Board shown in Appendix2 before testing. Initial value setting (only for class 2) Voltage conditioning 《After voltage treat the capacitors under testing temperature and voltage for 1 hour,》 leave the capacitors in ambient condition for 24±2h before measurement. Use this measurement for initial value. *As for the initial measurement of capacitors (Class2) on number 7,11,12,13 and 14 leave capacitors at 150 0,–10°C for 1 hour and measure the value after leaving capacitors for 24±2h in ambient condition. — 12 — AUT-GEN-004 Appendix1 P.C.Board for bending test (CGA1,CGA2) (CGA3,CGA4,CGA5,CGA6,CGA8,CGA9) 100 100 b b 40 Solder resist 40 a a Solder resist 1.0 1.0 c c Copper Copper Appendix2 P.C. Board for reliability test 100 c 40 b a *Slit Solder resist Copper * It is recommended to provide a slit on P.C.Board for CGA6,CGA8 and CGA9. （Unit：mm） Symbol a b c CGA1 (CC0201) 0.3 0.8 0.3 CGA2 (CC0402) 0.4 1.5 0.5 CGA3 (CC0603) 1.0 3.0 1.2 CGA4 (CC0805) 1.2 4.0 1.65 CGA5 (CC1206) 2.2 5.0 2.0 CGA6 (CC1210) 2.2 5.0 2.9 CGA8 (CC1812) 3.5 7.0 3.7 CGA9 (CC2220) 4.5 8.0 5.6 Case size 1. Material Dimensions : Glass Epoxy(As per JIS C6484 GE4) 2. Thickness : Appendix 1 ― 0.8mm ― 1.6mm : Appendix 2 ― 1.6mm (CGA1,CGA2) (CGA3,CGA4,CGA5,CGA6,CGA8,CGA9) Copper(Thickness:0.035mm) Solder resist — 13 — AUT-GEN-004 8. INSIDE STRUCTURE AND MATERIAL 3 4 5 2 1 MATERIAL No. NAME 1 Dielectric 2 Electrode Nickel ( Ni) Copper (Cu) Termination Nickel (Ni) Class1 Class2 CaZrO 3 BaTiO 3 3 4 5 Tin (Sn) 9. PACKAGING Packaging shall be done to protect the components from the damage during transportation and storing, and a label which has the following information shall be attached. 9.1 Each plastic bag for bulk packaging contains 1000pcs. And the minimum quantity for Bulk packaging is 1000pcs. 9.2 Tape packaging is as per 13. TAPE PACKAGING SPECIFICATION. * CGA1 [CC0201] and CGA2 [CC0402] types are applicable to tape packaging only. 1) Inspection No. 2) TDK P/N 3) Customer's P/N 4) Quantity *Composition of Inspection No. Example F 8 A – 23 – 001 (a) (b) (c) (d) (e) (a) Line code (b) Last digit of the year (c) Month and A for January and B for February and so on. (Skip I) (d) Inspection Date of the month. (e) Serial No. of the day *Composition of new Inspection No. (Will be implemented on and after May 1, 2019) Example I F 9 E (a) (b) (c) (d) 2 3 A 0 0 1 (e) (f) (g) (a) Prefix (b) Line code (c) Last digit of the year (d) Month and A for January and B for February and so on. (Skip I) (e) Inspection Date of the month. (f) Serial No. of the day(00 ~ ZZ) (g) Suffix(00 ~ ZZ) * It is planned to shift to the new inspection No. on and after May 2019, but the implementation timing may be different depending on shipment bases. Until the shift is completed, either current or new composition of inspection No. will be applied. — 14 — AUT-GEN-004 10. RECOMMENDATION As for CGA6 [CC1210] and larger, It is recommended to provide a slit (about 1mm width) in the board under the components to improve washing Flux. And please make sure to dry detergent up completely before. 11. SOLDERING CONDITION As for CGA1 [CC0201], CGA2 [CC0402], CGA6 [CC1210] and larger, reflow soldering only. — 15 — AUT-GEN-004 12. CAUTION No. Process Condition 1 Operating Condition (Storage, Use, Transportation) 1-1. Storage, Use 1) The capacitors must be stored in an ambient temperature of 5 to 40°C with a relative humidity of 20 to 70%RH. The products should be used within 6 months upon receipt. 2) The capacitors must be operated and stored in an environment free of dew condensation and these gases such as Hydrogen Sulphide, Hydrogen Sulphate, Chlorine, Ammonia and sulfur. 3) Avoid storing in sun light and falling of dew. 4) Do not use capacitors under high humidity and high and low atmospheric pressure which may affect capacitors reliability. 5) Capacitors should be tested for the solderability when they are stored for long time. 1-2. Handling in transportation In case of the transportation of the capacitors, the performance of the capacitors may be deteriorated depending on the transportation condition. (Refer to JEITA RCR-2335C 9.2 Handling in transportation) 2 Circuit design ! Caution 2-1. Operating temperature Operating temperature should be followed strictly within this specification, especially be careful with maximum temperature. 1) Do not use capacitors above the maximum allowable operating temperature. 2) Surface temperature including self heating should be below maximum operating temperature. (Due to dielectric loss, capacitors will heat itself when AC is applied. Especially at high frequencies around its SRF, the heat might be so extreme that it may damage itself or the product mounted on. Please design the circuit so that the maximum temperature of the capacitors including the self heating to be below the maximum allowable operating temperature. Temperature rise at capacitor surface shall be below 20°C) 3) The electrical characteristics of the capacitors will vary depending on the temperature. The capacitors should be selected and designed in taking the temperature into consideration. 2-2. Operating voltage 1) Operating voltage across the terminals should be below the rated voltage. When AC and DC are super imposed, V 0-P must be below the rated voltage. — (1) and (2) AC or pulse with overshooting, V P-P must be below the rated voltage. — (3), (4) and (5) When the voltage is started to apply to the circuit or it is stopped applying, the irregular voltage may be generated for a transit period because of resonance or switching. Be sure to use the capacitors within rated voltage containing these Irregular voltage. △ E A R R Voltage (1) DC voltage Positional Measurement V 0-P (Rated voltage) R (2) DC+AC voltage V 0-P R R 0 (4) Pulse voltage (A) (5) Pulse voltage (B) Positional Measurement V P-P (Rated voltage) V P-P R R 0 — 16 — (3) AC voltage V P-P R 0 Voltage R 0 0 AUT-GEN-004 No. Process Condition 2 Circuit design ! Caution 2) Even below the rated voltage, if repetitive high frequency AC or pulse is applied, the reliability of the capacitors may be reduced. △ A E A 3) The effective capacitance will vary depending on applied DC and AC voltages. The capacitors should be selected and designed in taking the voltages into consideration. 2-3. Frequency When the capacitors (Class 2) are used in AC and/or pulse voltages, the capacitors may vibrate themselves and generate audible sound. 3 Designing P.C.board The amount of solder at the terminations has a direct effect on the reliability of the capacitors. 1) The greater the amount of solder, the higher the stress on the chip capacitors, and the more likely that it will break. When designing a P.C.board, determine the shape and size of the solder lands to have proper amount of solder on the terminations. 2) Avoid using common solder land for multiple terminations and provide individual solder land for each terminations. 3) Size and recommended land dimensions. Chip capacitors Solder land C B Solder resist A Flow soldering Case size (mm) CGA3 (CC0603) CGA4 (CC0805) CGA5 (CC1206) A 0.7 ~ 1.0 1.0 ~ 1.3 2.1 ~ 2.5 B 0.8 ~ 1.0 1.0 ~ 1.2 1.1 ~ 1.3 C 0.6 ~ 0.8 0.8 ~ 1.1 1.0 ~ 1.3 Symbol Reflow soldering Case size CGA1 (CC0201) Symbol CGA2 (CC0402) CGA3 (CC0603) (mm) CGA4 (CC0805) A 0.25 ~ 0.35 0.3 ~ 0.5 0.6 ~ 0.8 0.9 ~ 1.2 B 0.20 ~ 0.30 0.35 ~ 0.45 0.6 ~ 0.8 0.7 ~ 0.9 C 0.25 ~ 0.35 0.4 ~ 0.6 0.6 ~ 0.8 0.9 ~ 1.2 CGA5 (CC1206) CGA6 (CC1210) CGA8 (CC1812) CGA9 (CC2220) A 2.0 ~ 2.4 2.0 ~ 2.4 3.1 ~ 3.7 4.1 ~ 4.8 B 1.0 ~ 1.2 1.0 ~ 1.2 1.2 ~ 1.4 1.2 ~ 1.4 C 1.1 ~ 1.6 1.9 ~ 2.5 2.4 ~ 3.2 4.0 ~ 5.0 Case size Symbol — 17 — AUT-GEN-004 No. 3 Process Designing P.C.board Condition 4) Recommended chip capacitors layout is as following. Disadvantage against bending stress Advantage against bending stress Perforation or slit Perforation or slit Break P.C.board with mounted side up. Break P.C.board with mounted side down. Mounting face Mount perpendicularly to perforation or slit Mount in parallel with perforation or slit Perforation or slit Perforation or slit Chip arrangement (Direction) Closer to slit is higher stress ℓ1 Away from slit is less stress ℓ2 R Distance from slit ( ℓ1< ℓ2 ) R — 18 — R R R R R ( ℓ1< ℓ2 ) AUT-GEN-004 No. 3 Process Designing P.C.board Condition 5) Mechanical stress varies according to location of chip capacitors on the P.C.board. E D Perforation C B A Slit The stress in capacitors is in the following order. A>B=C>D>E 6) Layout recommendation Example Use of common solder land Soldering with chassis Use of common solder land with other SMD Lead wire Chassis Chip Solder land Excessive solder Solder Need to avoid Excessive solder PCB Adhesive Solder land ℓ1 Missing solder Lead wire Solder land Solder resist Solder resist Recommendation Solder resist ℓ2 ℓ 2 >ℓ 1 — 19 — AUT-GEN-004 No. 4 Process Mounting Condition 4-1. Stress from mounting head If the mounting head is adjusted too low, it may induce excessive stress in the chip capacitors to result in cracking. Please take following precautions. 1) Adjust the bottom dead center of the mounting head to reach on the P.C.board surface and not press it. 2) Adjust the mounting head pressure to be 1 to 3N of static weight. 3) To minimize the impact energy from mounting head, it is important to provide support from the bottom side of the P.C.board. See following examples. Not recommended Single-sided mounting Recommended Crack Support pin Double-sides mounting Solder peeling Crack Support pin When the centering jaw is worn out, it may give mechanical impact on the capacitors to cause crack. Please control the close up dimension of the centering jaw and provide sufficient preventive maintenance and replacement of it. 4-2. Amount of adhesive a a b c c Example : CGA4 (CC0805), CGA5 (CC1206) a 0.2mm min. b 70 ~ 100μm c Do not touch the solder land — 20 — AUT-GEN-004 No. Process Condition 5 Soldering 5-1. Flux selection Flux can seriously affect the performance of capacitors. Confirm the following to select the appropriate flux. 1) It is recommended to use a mildly activated rosin flux (less than 0.1wt% chlorine). Strong flux is not recommended. 2) Excessive flux must be avoided. Please provide proper amount of flux. 3) When water-soluble flux is used, enough washing is necessary. 5-2. Recommended soldering profile by various methods Reflow soldering Wave soldering Soldering Natural cooling Soldering Preheating Peak Temp Temp.. (°C) Temp. (°C) Peak Temp △T 0 Preheating Natural cooling Over 60 sec. Over 60 sec. ∆T 0 Over 60 sec. Peak Temp time Peak Temp time Manual soldering (Solder iron) APPLICATION As for CGA3 (CC0603), CGA4 (CC0805) and Peak Temp CGA5 (CC1206), applied to wave soldering Temp.. (°C) and reflow soldering. ∆T As for other case sizes, applied to reflow soldering only. Preheating 0 3sec. (As short as possible) ※ As for peak temperature of manual soldering, please refer“5-6. Solder repair by solder iron”. 5-3. Recommended soldering peak temp and peak temp duration Temp./Duration Wave soldering Reflow soldering Peak temp(°C) Duration(sec.) Peak temp(°C) Duration(sec.) Sn-Pb Solder 250 max. 3 max. 230 max. 20 max. Lead Free Solder 260 max. 5 max. 260 max. 10 max. Solder Recommended solder compositions Lead Free Solder : Sn-3.0Ag-0.5Cu Sn-Pb solder : Sn-37Pb — 21 — AUT-GEN-004 No. Process 5 Soldering Condition 5-4. Avoiding thermal shock 1) Preheating condition Soldering Case size Wave soldering Reflow soldering Manual soldering 2) Temp. (°C) CGA3(CC0603), CGA4(CC0805), CGA5(CC1206) CGA1(CC0201),CGA2(CC0402) CGA3(CC0603),CGA4(CC0805) CGA5(CC1206) CGA6(CC1210), CGA8(CC1812), CGA9(CC2220) CGA1(CC0201),CGA2(CC0402) CGA3(CC0603),CGA4(CC0805) CGA5(CC1206) CGA6(CC1210), CGA8(CC1812), CGA9(CC2220) ∆T ≦ 150 ∆T ≦ 150 ∆T ≦ 130 ∆T ≦ 150 ∆T ≦ 130 Cooling condition Natural cooling using air is recommended. If the chips are dipped into a solvent for cleaning, the temperature difference (∆T) must be less than 100°C. 5-5. Amount of solder Excessive solder will induce higher tensile force in chip capacitors when temperature changes and it may result in chip cracking. In sufficient solder may detach the capacitors from the P.C.board. Higher tensile force in chip capacitors to cause crack Excessive solder Maximum amount Minimum amount Adequate Low robustness may cause contact failure or chip capacitors come off the P.C.board. Insufficient solder 5-6. Solder repair by solder iron 1) Selection of the soldering iron tip Tip temperature of solder iron varies by its type, P.C.board material and solder land size. The higher the tip temperature, the quicker the operation. However, heat shock may cause a crack in the chip capacitors. Please make sure the tip temp. before soldering and keep the peak temp and time in accordance with following recommended condition. Recommended solder iron condition (Sn-Pb Solder and Lead Free Solder) Case size Temp. (°C) CGA1(CC0201) CGA2(CC0402) CGA3(CC0603) CGA4(CC0805) CGA5(CC1206) 350 max. CGA6(CC1210) CGA8(CC1812) CGA9(CC2220) 280 max. Duration (sec.) Wattage (W) Shape (mm) 3 max. 20 max. Ø 3.0 max. * Please preheat the chip capacitors with the condition in 5-4 to avoid the thermal shock. — 22 — AUT-GEN-004 No. Process 5 Soldering Condition 2) Direct contact of the soldering iron with ceramic dielectric of chip capacitors may cause crack. Do not touch the ceramic dielectric and the terminations by solder iron. 5-7.Soldering rework using spot heater Heat stress during rework may possibly be reduced by using a spot heater (also called a “blower”) rather than a soldering iron. It is applied only to adding solder in the case of insufficient solder amount. 1) Reworking using a spot heater may suppress the occurrence of cracks in the capacitor compared to using a soldering iron. A spot heater can heat up a capacitor uniformly with a small heat gradient which leads to lower thermal stress caused by quick heating and cooling or localized heating. Moreover, where ultra-small capacitors are mounted close together on a printed circuit board, reworking with a spot heater can eliminate the risk of direct contact between the tip of a soldering iron and a capacitor. 2) Rework condition If the blower nozzle of a spot heater is too close to a capacitor, a crack in the capacitor may occur due to heat stress. Below are recommendations for avoiding such an occurrence. Keep more than 5mm between a capacitor and a spot heater nozzle. The blower temperature of the spot heater shall be lower than 400°C. The airflow shall be set as weak as possible. The diameter of the nozzle is recommended to be 2mm(one-outlet type).The size is standard and common. Duration of blowing hot air is recommended to be 10s or less for CGA3 (CC0603), CGA4 (CC0805) and CGA5 (CC1206), and 30s or less for CGA6 (CC1210), CGA8(CC1812) and CGA9 (CC2220), considering surface area of the capacitor and melting temperature of solder. The angle between the nozzle and the capacitor is recommended to be 45degrees in order to work easily and to avoid partial area heating. As is the case when using a soldering iron, preheating reduces thermal stress on capacitors and improves operating efficiency. ・Recommended rework condition（Consult the component manufactures for details.） Distance from nozzle 5mm and over Nozzle angle 45degrees Nozzle temp. 400°C and less Set as weak as possible (The airflow shall be the minimum value necessary for solder to melt in the conditions mentioned above.) φ2mm（one-outlet type） 10s and less (CGA3 [CC0603], CGA4 [CC0805], CGA5 [CC1206]) 30s and less (CGA6 [CC1210], CGA8 [CC1812], CGA9 [CC2220]) Airflow Nozzle diameter Blowing duration ・Example of recommended spot heater use One-outlet type nozzle Angle : 45degrees — 23 — AUT-GEN-004 No. Process 5 Soldering Condition 3) Amount of solder should be suitable to from a proper fillet shape. Excess solder causes mechanical and thermal stress on a capacitor and results in cracks. Insufficient solder causes weak adherence of the capacitor to the substrate and may result in detachment of a capacitor and deteriorate reliability of the printed wiring board. See the example of appropriate solder fillet shape for 5-5.Amount of solder. 5-8. Sn-Zn solder Sn-Zn solder affects product reliability. Please contact TDK in advance when utilize Sn-Zn solder. 5-9. Countermeasure for tombstone The misalignment between the mounted positions of the capacitors and the land patterns should be minimized. The tombstone phenomenon may occur especially the capacitors are mounted (in longitudinal direction) in the same direction of the reflow soldering. (Refer to JEITA RCR-2335C Annex A (Informative), Recommendations to prevent the tombstone phenomenon.) 6 Cleaning 1) If an unsuitable cleaning fluid is used, flux residue or some foreign articles may stick to chip capacitors surface to deteriorate especially the insulation resistance. 2) If cleaning condition is not suitable, it may damage the chip capacitors. 2)-1. Insufficient washing (1) Terminal electrodes may corrode by Halogen in the flux. (2) Halogen in the flux may adhere on the surface of capacitors, and lower the insulation resistance. (3) Water soluble flux has higher tendency to have above mentioned problems (1) and (2). 2)-2. Excessive washing When ultrasonic cleaning is used, excessively high ultrasonic energy output can affect the connection between the ceramic chip capacitor's body and the terminal electrode. To avoid this, following is the recommended condition. Power : 20 W/ ℓ max. Frequency : 40 kHz max. Washing time : 5 minutes max. 2)-3. If the cleaning fluid is contaminated, density of Halogen increases, and it may bring the same result as insufficient cleaning. — 24 — AUT-GEN-004 No. 7 Process Coating and molding of the P.C.board Condition 1) When the P.C.board is coated, please verify the quality influence on the product. 2) Please verify carefully that there is no harmful decomposing or reaction gas emission during curing which may damage the chip capacitors. 3) Please verify the curing temperature. 8 Handling after chip mounted △Caution ! E 1) Please pay attention not to bend or distort the P.C.board after soldering in handling otherwise the chip capacitors may crack. Bend A Twist 2) Printed circuit board cropping should not be carried out by hand, but by using the proper tooling. Printed circuit board cropping should be carried out using a board cropping jig as shown in the following figure or a board cropping apparatus to prevent inducing mechanical stress on the board. (1)Example of a board cropping jig Recommended example: The board should be pushed from the back side, close to the cropping jig so that the board is not bent and the stress applied to the capacitor is compressive. Unrecommended example: If the pushing point is far from the cropping jig and the pushing direction is from the front side of the board, large tensile stress is applied to the capacitor, which may cause cracks. Outline of jig Printed circuit board Recommended Direction of load V-groove Printed circuit board Unrecommended Components Printed circuit board Load point Slot Board cropping jig V-groove — 25 — Direction of load Load point Slot Components V-groove Slot AUT-GEN-004 No. 8 Process Handling after chip mounted ! Caution △ A E A Condition (2)Example of a board cropping machine An outline of a printed circuit board cropping machine is shown below. The top and bottom blades are aligned with one another along the lines with the V-grooves on printed circuit board when cropping the board. Unrecommended example: Misalignment of blade position between top and bottom, right and left, or front and rear blades may cause a crack in the capacitor. Outline of machine Principle of operation Top blade Top blade Printed circuit board Bottom blade V-groove Printed circuit board Cross-section Printed circuit board V-groove Top blade Bottom blade Unrecommended Recommended Top-bottom misalignment Left-right misalignment Front-rear misalignment Top blade Top blade Top blade Bottom blade Bottom blade Bottom blade Top blade Board Bottom blade 3) When functional check of the P.C.board is performed, check pin pressure tends to be adjusted higher for fear of loose contact. But if the pressure is excessive and bend the P.C.board, it may crack the chip capacitors or peel the terminations off. Please adjust the check pins not to bend the P.C.board. Item Not recommended Termination peeling Recommended Support pin Board bending Check pin — 26 — Check pin AUT-GEN-004 No. Process Condition 9 Handling of loose chip capacitors 1) If dropped the chip capacitors may crack. Once dropped do not use it. Especially, the large case sized chip capacitors are tendency to have cracks easily, so please handle with care. Crack Floor 2) Piling the P.C.board after mounting for storage or handling, the corner of the P.C. board may hit the chip capacitors of another board to cause crack. P.C.board Crack 10 Capacitance aging The capacitors (Class 2) have aging in the capacitance. They may not be used in precision time constant circuit. In case of the time constant circuit, the evaluation should be done well. 11 Estimated life and estimated failure rate of capacitors As per the estimated life and the estimated failure rate depend on the temperature and the voltage. This can be calculated by the equation described in JEITA RCR-2335C Annex F (Informative) Calculation of the estimated lifetime and the estimated failure rate ( Voltage acceleration coefficient : 3 multiplication rule, Temperature acceleration coefficient : 10°C rule) The failure rate can be decreased by reducing the temperature and the voltage but they will not be guaranteed. — 27 — AUT-GEN-004 No. 12 Process Caution during operation of equipment Condition 1) A capacitor shall not be touched directly with bare hands during operation in order to avoid electric shock. Electric energy held by the capacitor may be discharged through the human body when touched with a bare hand. Even when the equipment is off, a capacitor may stay charged. The capacitor should be handled after being completely discharged using a resistor. 2) The terminals of a capacitor shall not be short-circuited by any accidental contact with a conductive object. A capacitor shall not be exposed to a conductive liquid such as an acid or alkali solution. A conductive object or liquid, such as acid and alkali, between the terminals may lead to the breakdown of a capacitor due to short circuit 3) Confirm that the environment to which the equipment will be exposed during transportation and operation meets the specified conditions. Do not to use the equipment in the following environments. (1) Environment where a capacitor is spattered with water or oil (2) Environment where a capacitor is exposed to direct sunlight (3) Environment where a capacitor is exposed to Ozone, ultraviolet rays or radiation (4) Environment where a capacitor exposed to corrosive gas(e.g. hydrogen sulfide, sulfur dioxide, chlorine. ammonia gas etc.) (5) Environment where a capacitor exposed to vibration or mechanical shock exceeding the specified limits. (6) Atmosphere change with causes condensation 13 Others △Caution A ! E The product listed in this specification is intended for use in automotive applications under normal operation and usage conditions. S S A The product is not designed or warranted to meet the requirements of application listed below, whose performance and/or quality requires a more stringent level of safety or reliability, or whose failure, malfunction or defect could cause serious damage to society, person or property. Please understand that we are not responsible for any damage or liability caused by use of the products in any of the applications below or for any other use exceeding the range or conditions set forth in this specification sheet. If you intend to use the products in the applications listed below or if you have special requirements exceeding the range or conditions set forth in this specification, please contact us. (1) Aerospace/Aviation equipment (2) Transportation equipment (electric trains, ships etc.) (3) Medical equipment (Excepting Pharmaceutical Affairs Law classification Class1, 2) (4) Power-generation control equipment (5) Atomic energy-related equipment (6) Seabed equipment (7) Transportation control equipment (8) Public information-processing equipment (9) Military equipment (10) Electric heating apparatus, burning equipment (11) Disaster prevention/crime prevention equipment (12) Safety equipment (13) Other applications that are not considered general-purpose applications When designing your equipment even for general-purpose applications, you are kindly requested to take into consideration securing protection circuit/device or providing backup circuits in your equipment. In addition, although the product listed in this specification is intended for use in automotive applications as described above, it is not prohibited to use for general electronic equipment, whose performance and/or quality doesn’t require a more stringent level of safety or reliability, or whose failure, malfunction or defect could not cause serious damage to society, person or property. Therefore, the description of this caution will be applied, when the product is used in general electronic equipment under a normal operation and usage conditions. — 28 — AUT-GEN-004 13. TAPE PACKAGING SPECIFICATION 1. CONSTRUCTION AND DIMENSION OF TAPING 1-1. Dimensions of carrier tape Dimensions of paper tape shall be according to Appendix 3, 4, 5. Dimensions of plastic tape shall be according to Appendix 6, 7. 1-2. Bulk part and leader of taping Trailer(Empty) Empty 160mm min. Chips 160mm min. Leader Drawing direction 400mm min 1-3. Dimensions of reel Dimensions of Ø178 reel shall be according to Appendix 8, 9. Dimensions of Ø330 reel shall be according to Appendix 10, 11. 1-4. Structure of taping 〈Paper〉 〈Plastic〉 Top cover tape Top cover tape Pitch hole Cavity (Chip insert) Paper carrier tape Bottom cover tape (Bottom cover tape is not always applied.) 2. CHIP QUANTITY Please refer to detail page on TDK Web. — 29 — Pitch hole Cavity (Chip insert) Plastic carrier tape AUT-GEN-004 3. PERFORMANCE SPECIFICATIONS 3-1. Fixing peeling strength (top tape) 0.05N < Peeling strength < 0.7N 〈Paper〉 Direction of cover tape pulling Top cover tape Carrier tape 0～15° Direction of pulling Paper tape should not adhere to top cover tape when pull the cover tape. 〈Plastic〉 Direction of pulling Top cover tape Carrier tape 0～15° Direction of pulling 3-2. Carrier tape shall be flexible enough to be wound around a minimum radius of 30mm with components in tape. 3-3. The missing of components shall be less than 0.1% 3-4. Components shall not stick to fixing tape. 3-5. When removing the cover tape, there shall not be difficulties by unfitting clearance gap, burrs and crushes of cavities. Also the sprocket holes shall not be covered by absorbing dust into the suction nozzle. — 30 — AUT-GEN-004 Appendix 3 Paper Tape U Pitch hole Cavity(Chip insert) J E D A C B K H G F T （Unit：mm） Symbol Case size CGA1 (CC0201) Symbol Case size CGA1 (CC0201) A B ( 0.38 ) ( 0.68 ) * ( 0.45 ) * ( 0.75 ) G H 2.00 ± 0.05 4.00 ± 0.05 C D E F 8.00 ± 0.30 3.50 ± 0.05 1.75 ± 0.10 2.00 ± 0.05 J K T Ø 1.50 +0.10 0.35 ± 0.02 0 * 0.43 ± 0.02 0.40 min. * 0.47 min. ( ) Reference value. * Applied to 100nF. Appendix 4 Paper Tape U Pitch hole Cavity(Chip insert) J E A D C B H T G F (Unit : mm) Symbol Case size CGA2 (CC0402) Symbol Case size CGA2 (CC0402) ( A B C D E F ( 0.65 ) ( 1.15 ) 8.00 ± 0.30 3.50 ± 0.05 1.75 ± 0.10 2.00 ± 0.05 G H J T 2.00 ± 0.05 4.00 ± 0.10 Ø 1.50 +0.10 0 ) Reference value. — 31 — 0.60±0.15 AUT-GEN-004 Appendix 5 Paper Tape Pitch hole Cavity(Chip insert) J E A D B T H G C F (Unit : mm) Symbol Case size CGA3 (CC0603) CGA4 (CC0805) CGA5 (CC1206) Symbol Case size CGA3 (CC0603) CGA4 (CC0805) CGA5 (CC1206) ( A B ( 1.10 ) ( 1.90 ) ( 1.50 ) ( 2.30 ) ( 1.90 ) ( 3.50 ) G H 2.00 ± 0.05 4.00 ± 0.10 C D E F 8.00 ± 0.30 3.50 ± 0.05 1.75 ± 0.10 4.00 ± 0.10 J T Ø 1.50 +0.10 0 ) Reference value. — 32 — 1.20 max. AUT-GEN-004 Appendix 6 Plastic Tape Pitch hole Cavity(Chip insert) J E A D C B T H Q F G K (Unit : mm) Symbol Case size CGA3 (CC0603) CGA4 (CC0805) CGA5 (CC1206) CGA6 (CC1210) Symbol Case size CGA3 (CC0603) CGA4 (CC0805) CGA5 (CC1206) CGA6 (CC1210) ( A B ( 1.10 ) ( 1.90 ) ( 1.50 ) ( 2.30 ) ( 1.90 ) ( 3.50 ) ( 2.90 ) ( 3.60 ) G H C D 8.00 ± 0.30 3.50 ± 0.05 E F 1.75 ± 0.10 4.00 ± 0.10 T Q 0.60 max. Ø 0.50 min. * 12.00 ± 0.30 * 5.50 ± 0.05 J K 1.60 max. 2.00 ± 0.05 4.00 ± 0.10 Ø 1.50 +0.10 0 2.50 max. 3.40 max. ) Reference value. Exceptionally no hole in the cavity is applied. Please inquire if hole in cavity is mandatory. * Applied to thickness, 2.5mm products. — 33 — AUT-GEN-004 Appendix 7 Plastic Tape Pitch hole Cavity(Chip insert) J E A D C B T H G Q F K (Unit : mm) Symbol Case size CGA8 (CC1812) CGA9 (CC2220) Symbol Case size CGA8 (CC1812) CGA9 (CC2220) ( A B ( 3.60 ) ( 4.90 ) ( 5.40 ) ( 6.10 ) G H 2.00 ± 0.05 4.00 ± 0.10 C D E F 12.00 ± 0.30 5.50 ± 0.05 1.75 ± 0.10 8.00 ± 0.10 J K T Q 6.50 max. 0.60 max. Ø 1.50 min. Ø 1.50 +0.10 0 ) Reference value. Exceptionally no hole in the cavity is applied. Please inquire if hole in cavity is mandatory. — 34 — AUT-GEN-004 Appendix 8 Dimensions of reel (Material : Polystyrene) U U CGA1, CGA2, CGA3, CGA4, CGA5, CGA6 W2 E C B D R W1 A (Unit : mm) Symbol A B C D E W1 Dimension Ø178 ± 2.0 Ø60 ± 2.0 Ø13 ± 0.5 Ø21 ± 0.8 2.0 ± 0.5 9.0 ± 0.3 Symbol W2 R Dimension 13.0 ± 1.4 1.0 R R Appendix 9 Dimensions of reel (Material : Polystyrene) CGA6(2.5mm thickness products), CGA8, CGA9 U U W2 E C B D R W1 A (Unit : mm) Symbol A B C D E W1 Dimension Ø178 ± 2.0 Ø60 ± 2.0 Ø13 ± 0.5 Ø21 ± 0.8 2.0 ± 0.5 13.0 ± 0.3 Symbol W2 R Dimension 17.0 ± 1.4 1.0 R — 35 — R AUT-GEN-004 Appendix 10 Dimensions of reel (Material : Polystyrene) U U CGA1, CGA2, CGA3, CGA4, CGA5, CGA6 E C B D R t W A (Unit : mm) Symbol Dimension A Ø382 max. (Nominal Ø330) B C D E W Ø50 min. Ø13 ± 0.5 Ø21 ± 0.8 2.0 ± 0.5 10.0 ± 1.5 Symbol t R Dimension 2.0 ± 0.5 1.0 Appendix 11 Dimensions of reel (Material : Polystyrene) U U CGA6(2.5mm thickness products), CGA8, CGA9 E C B D R W A t (Unit : mm) Symbol Dimension A Ø382 max. (Nominal Ø330) B C D E W Ø50 min. Ø13 ± 0.5 Ø21 ± 0.8 2.0 ± 0.5 14.0 ± 1.5 Symbol t R Dimension 2.0 ± 0.5 1.0 — 36 —