AUT-GEN-004
DELIVERY SPECIFICATION
SPEC. No. A-General-g
D A T E : Jun, 2019
To
Non-Controlled Copy
Upon the acceptance of this spec.
previous spec. (C2014-0057) shall
be abolished.
CUSTOMER’S PRODUCT NAME
TDK'S PRODUCT NAME
Multilayer Ceramic Chip Capacitors
Bulk and Tape packaging 【RoHS compliant】
CGA1,CGA2,CGA3,CGA4,CGA5,CGA6,CGA8,CGA9Type
C0G,NP0,X7R,X7S,X7T,X8R,X8L Characteristics
Please return this specification to TDK representatives with your signature.
If orders are placed without returned specification, please allow us to judge that specification is
accepted by your side.
RECEIPT CONFIRMATION
DATE:
YEAR
MONTH
DAY
Test conditions in this specification based on AEC-Q200 for automotive application.
TDK Corporation
Sales
Electronic Components
Sales & Marketing Group
APPROVED
Person in charge
Engineering
Electronic Components Business Company
Ceramic Capacitors Business Group
APPROVED
CHECKED
Person in charge
AUT-GEN-004
—1—
AUT-GEN-004
—2—
AUT-GEN-004
—3—
AUT-GEN-004
SCOPE
This delivery specification shall be applied to Multilayer ceramic chip capacitors to be delivered to
.
PRODUCTION PLACES
Production places defined in this specification shall be TDK Corporation, TDK(Suzhou)Co.,Ltd
and TDK Components U.S.A.,Inc.
PRODUCT NAME
The name of the product to be defined in this specifications shall be CGA◇◇◇○○○△△□□□×.
REFERENCE STANDARD
JIS C 5101-1:2010
C 5101-21:2014
Fixed capacitors for use in electronic equipment-Part 1: Generic specification
Fixed capacitors for use in electronic equipment-Part21 : Sectional specification
: Fixed surface mount multilayer capacitors of ceramic dielectric,Class1
C 5101-22:2014 Fixed capacitors for use in electronic equipment-Part22 : Sectional specification
: Fixed surface mount multilayer capacitors of ceramic dielectric,Class 2
C 0806-3:2014
Packaging of components for automatic handling - Part 3: Packaging of
surface mount components on continuous tapes
JEITA RCR-2335 C 2014 Safety application guide for fixed ceramic capacitors for use in electronic
equipment
CONTENTS
1. CODE CONSTRUCTION
2. COMBINATION OF RATED CAPACITANCE
AND TOLERANCE
3. OPERATING TEMPERATURE RANGE
4. STORING CONDITION AND TERM
5. P.C. BOARD
6. INDUSTRIAL WASTE DISPOSAL
7. PERFORMANCE
8. INSIDE STRUCTURE AND MATERIAL
9. PACKAGING
10. RECOMMENDATION
11. SOLDERING CONDITION
12. CAUTION
13. TAPE PACKAGING SPECIFICATION
When the mistrust in the spec arises, this specification is given priority. And it will be confirmed by written
spec change after conference of both posts involved.
This specification warrants the quality of the ceramic chip capacitor. Capacitors should be evaluated or
confirmed a state of mounted on your product.
If the use of the capacitors goes beyond the bounds of this specification, we can not afford to guarantee.
Division
Date
SPEC. No.
Ceramic Capacitors Business Group
Jun. 2019
A-General-g
—4—
AUT-GEN-004
1. CODE CONSTRUCTION
(Example)
CGA
CGA
(1)
2
6
(2)
B
P
(3)
3
3
(4)
X7R
X7S
(5)
1E
1H
(6)
104
106
(7)
(1) Series
(2) Case size
K
K
(8)
T
T
(9)
○○○○
○○○○
(10)
Symbol
Series
CGA
For automotive application
Terminal electrode
L
B
W
G
B
T
Internal electrode
Ceramic dielectric
Dimensions (Unit : mm)
L
W
T
0.60±0.03
0.30±0.03
0.30±0.03
CGA1
1
(CC0201)
0.60 +0.10
0.30 +0.10
0.30 +0.10
-0.03
-0.03
-0.03
1.00±0.05
0.50±0.05
0.50±0.05
CGA2
2
(CC0402)
1.00±0.10
0.50±0.10
0.50±0.10
1.60±0.10
0.80±0.10
0.80±0.10
1.60±0.15
0.80±0.15
0.80±0.15
CGA3
3
1.60±0.20
0.80±0.20
0.80±0.20
(CC0603)
+0.30
+0.30
1.60
0.80
0.80 +0.30
-0.10
-0.10
-0.10
0.60±0.15
2.00±0.20
1.25±0.20
0.85±0.15
CGA4
4
1.25±0.20
(CC0805)
+0.25
+0.25
2.00
1.25
1.25 +0.25
-0.15
-0.15
-0.15
0.60±0.15
0.85±0.15
3.20±0.20
1.60±0.20
1.15±0.15
CGA5
5
1.30±0.20
(CC1206)
1.60±0.20
+0.30
+0.30
3.20
1.60
1.60 +0.30
-0.10
-0.10
-0.10
1.25±0.20
1.60±0.20
CGA6
3.20±0.40
2.50±0.30
2.00±0.20
6
(CC1210)
2.30±0.20
2.50±0.30
1.60±0.20
2.00±0.20
CGA8
4.50±0.40
3.20±0.40
8
2.30±0.20
(CC1812)
2.50±0.30
3.20±0.30
1.60±0.20
2.00±0.20
CGA9
5.70±0.40
5.00±0.40
9
2.30±0.20
(CC2220)
2.50±0.30
2.80±0.30
*As for each item, please refer to detail page on TDK Web.
Case size Case size
Symbol (EIA style)
—5—
B
G
0.10 min.
0.20 min.
0.10 min.
0.30 min.
0.20 min.
0.30 min.
0.20 min.
0.50 min.
0.20 min.
1.00 min.
0.20 min.
――
0.20 min.
――
0.20 min.
――
AUT-GEN-004
(3) Thickness
Symbol
A
B
C
E
F
H
J
Dimension(mm)
0.30
0.50
0.60
0.80
0.85
1.15
1.25
(4) Voltage condition in the life test
* Details are shown in table 1 No.16 at 7.PERFORMANCE.
Dimension(mm)
1.30
1.60
2.00
2.30
2.50
2.80
3.20
Symbol
K
L
M
N
P
Q
R
Condition
Symbol
1
Rated Voltage
2
Rated Voltage x 2
3
Rated Voltage x 1.5
4
Rated Voltage x 1.2
(5) Temperature Characteristics
* Details are shown in table 1 No.6 and No.7 at 7.PERFORMANCE.
(6) Rated Voltage
Symbol
Rated Voltage
Symbol
Rated Voltage
2J
DC 630 V
1V
DC 35 V
2W
DC 450 V
1E
DC 25 V
2E
DC 250 V
1C
DC 16 V
2A
DC 100 V
1A
DC 10 V
1N
DC 75 V
0J
DC 6.3 V
1H
DC 50 V
0G
DC 4 V
Symbol
Rated
Capacitance
(Example)
(7) Rated Capacitance
Stated in three digits and in units of pico farads (pF).
The first and Second digits identify the first and
second significant figures of the capacitance, the
third digit identifies the multiplier.
R is designated for a decimal point.
(8) Capacitance tolerance
* M tolerance shall be standard for over 10uF.
1 04
100,000 pF
Tolerance
C
± 0.25 pF
D
± 0.5
pF
J
± 5%
K
± 10 %
*M
± 20 %
* CGA1 and CGA2 types are applicable to tape packaging only.
—6—
2.2 pF
Symbol
(9) Packaging
(10) TDK internal code
2R 2
Capacitance
10pF and under
Over 10pF
Symbol
Packaging
B
Bulk
T
Taping
AUT-GEN-004
2. COMBINATION OF RATED CAPACITANCE AND TOLERANCE
Class
Temperature
Characteristics
Capacitance tolerance
10pF and
under
C0G
NP0
1
X7R
X7S
X7T
X8R
X8L
2
Rated capacitance
C (±0.25pF)
1, 1.5, 2, 2.2, 3, 3.3, 4, 4.7, 5
D (±0.5pF)
6, 6.8, 7, 8, 9, 10
12pF to
10,000pF
Over
10,000pF
J (±
0.1uF and
under
K (± 10 %)
Over 0.1uF
K (± 10 %)
M (± 20 %)
E – 12 series
5 %)
E – 6 series
E – 6 series
Capacitance Step in E series
Capacitance Step
E series
1.0
E- 6
1.0
E-12
1.5
1.2
1.5
2.2
1.8
2.2
3.3
2.7
3.3
4.7
3.9
4.7
6.8
5.6
6.8
8.2
3. OPERATING TEMPERATURE RANGE
T.C.
Min. operating
Temperature
Max. operating
Temperature
Reference
Temperature
C0G
-55°C
125°C
25°C
NP0
-55°C
150°C
25°C
X7R/X7S/X7T
-55°C
125°C
25°C
X8R/X8L
-55°C
150°C
25°C
4. STORING CONDITION AND TERM
Storing temperature
Storing humidity
Storing term
5~40°C
20~70%RH
Within 6 months
upon receipt.
5. P.C. BOARD
When mounting on an aluminum substrate, large case size such as CGA6 [CC1210] and larger
are more likely to be affected by heat stress from the substrate.
Please inquire separate specification for the large case sizes when mounted on the substrate.
6. INDUSTRIAL WASTE DISPOSAL
Dispose this product as industrial waste in accordance with the Industrial Waste Law.
—7—
AUT-GEN-004
7. PERFORMANCE
Table 1
No.
Item
Performance
Test or inspection method
1
External Appearance
No defects which may affect
performance.
Inspect with magnifying glass (3×)
In case of CGA1[CC0201] type, with
magnifying glass(10×).
2
Insulation Resistance
10,000MΩ or 500MΩ·μF min.
(As for the capacitors of rated
voltage 16V DC and lower,
10,000 MΩ or 100MΩ·μF min.),
whichever smaller.
Measuring voltage:Rated voltage
(As for the capacitor of rated voltage 630V
DC, apply 500V DC.)
Voltage application time:60s.
3
Voltage Proof
Withstand test voltage without
insulation breakdown or other
damage.
Class
1
2
Rated
voltage(RV)
Apply voltage
RV≦100V
3 × rated voltage
100V<RV≦500V 1.5 × rated voltage
500V<RV
1.3 × rated voltage
RV≦100V
2.5 × rated voltage
100V<RV≦500V 1.5 × rated voltage
500V<RV
1.3 × rated voltage
Voltage application time : 1s.
Charge / discharge current : 50mA or lower
4
Capacitance
Within the specified tolerance.
《Cl a ss 1》
Capacitance
Measuring
frequency
1000pF and
under
1MHz±10%
Over 1000pF
1kHz±10%
Measuring
voltage
0.5 ~ 5 Vrms.
《Cl a ss 2》
Capacitance
Measuring
frequency
Measuring
voltage
10uF and
under
1kHz±10%
1.0±0.2Vrms
Over 10uF
120Hz±20% 0.5±0.2Vrms.
As for the capacitors of rated voltage 6.3V
DC, 0.5Vrms is applied.
As an exception, 1.0Vrms is applied for
10uF and under on X8L characteristics.
5
6
Q
Class1
Dissipation
Factor
Class2
Temperature
Characteristics
of Capacitance
(Class1)
Please refer to detail page on TDK
Web.
T.C.
Temperature Coefficient
(ppm/°C)
C0G
0 ± 30
NP0
0 ± 30
Capacitance Within ± 0.2% or
± 0.05pF,
drift
whichever larger.
—8—
See No.4 in this table for measuring
condition.
Temperature coefficient shall be calculated
based on values at 25°C and 85°C
temperature.
Measuring temperature below 25°C shall
be -10°C and -25°C.
AUT-GEN-004
(continued)
No.
7
Item
Temperature
Characteristics
of Capacitance
(Class2)
Performance
Capacitance Change (%)
No voltage applied
X7R : ± 15
X7S : ± 22
+22
X7T :
-33
X8R : ± 15
X8L : +15
-40
Test or inspection method
Capacitance shall be measured by the
steps shown in the following table after
thermal equilibrium is obtained for each
step.
∆C be calculated ref. STEP3 reading
Step
Temperature(°C)
1
Reference temp. ± 2
2
Min. operating temp. ± 2
3
Reference temp. ± 2
4
Max. operating temp. ± 2
As for Min./ Max. operating temp. and
Reference temp., please refer to
"4.OPERATING TEMPERATURE RANGE".
As for measuring voltage, please contact
with our sales representative.
8
Robustness of
Terminations
No sign of termination coming off,
breakage of ceramic, or other
abnormal signs.
Reflow solder the capacitors on a
P.C.Board shown in Appendix 2.
Apply a pushing force gradually at the
center of a specimen in a horizontal
direction of P.C.board.
Pushing force : 17.7N
(2N is applied for CGA1 and CGA2 type.)
Holding time : 10±1s.
Pushing force
Capacitor
9
Bending
No mechanical damage.
P.C.Board
Reflow solder the capacitors on
a P.C.Board shown in Appendix 1.
(1mm is applied for 0.85mm thickness of
Class2 items.)
20
50
F
R230
2
45
10
Solderability
New solder to cover over 75% of
termination.
25% may have pin holes or rough
spots but not concentrated in one
spot.
Ceramic surface of A sections
shall not be exposed due to
melting or shifting of termination
material.
A section
—9—
Solder :
Flux :
45
(Unit : mm)
Sn-3.0Ag-0.5Cu or
Sn-37Pb
Isopropyl alcohol (JIS K
8839) Rosin (JIS K 5902)
25% solid solution.
Solder temp. : 245±5°C (Sn-3.0Ag-0.5Cu)
235±5°C (Sn-37Pb)
Dwell time :
3±0.3s.(Sn-3.0Ag-0.5Cu)
2±0.2s.(Sn-37Pb)
Solder
position :
Until both terminations are
completely soaked.
AUT-GEN-004
(continued)
No.
11
Item
Performance
Resistance External
No cracks are allowed and
to solder
appearance terminations shall be covered at
least 60% with new solder.
heat
Capacitance
Characteristics
Q
Class1
C0G
NP0
Class2
X7R
X7S
X7T
X8R
X8L
Vibration
± 2.5% or ± 0.25pF,
whichever larger.
± 7.5 %
Meet the initial spec.
Meet the initial spec.
Insulation
Resistance
Meet the initial spec.
Voltage
proof
No insulation breakdown or
other damage.
External
appearance
No mechanical damage.
Characteristics
Q
Class1
C0G
NP0
Class2
X7R
X7S
X7T
X8R
X8L
Change from the
value before test
± 2.5% or ± 0.25pF,
whichever larger.
± 7.5 %
Meet the initial spec.
(Class1)
D.F.
(Class2)
Sn-3.0Ag-0.5Cu or
Sn-37Pb
Flux :
Isopropyl alcohol (JIS K
8839) Rosin (JIS K 5902)
25% solid solution.
Solder temp. :
260±5°C
Dwell time :
10±1s.
Solder
position :
Until both terminations
are completely soaked.
Pre-heating :
Temp. ― 110~140°C
Time ― 30~60s.
Leaving time : Class1 ― 6~24h
Class2 ― 24±2h
D.F.
(Class2)
Capacitance
Solder :
Change from the
value before test
(Class1)
12
Test or inspection method
Meet the initial spec.
— 10 —
Applied force : 5G max.
Frequency : 10~2,000Hz
Reciprocating sweep time : 20 min.
Cycle : 12 cycles in each 3 mutually
perpendicular directions.
Reflow solder the capacitors on a
P.C.Board shown in Appendix 2 before
testing.
AUT-GEN-004
(continued)
No.
Item
13
Temperature External
appearance
cycle
Performance
No mechanical damage.
Capacitance
Characteristics
Change from the
value before test
Test or inspection method
Expose the capacitors in the condition
step1 through step 4 listed in the
following table.
Temp. cycle:1,000 cycles
Step
Class1
Class2
C0G
NP0
X7R
X7S
X7T
X8R
X8L
1
Please contact
with our sales
representative.
2
3
4
Q
Meet the initial spec.
D.F.
(Class2)
Meet the initial spec.
Insulation
Resistance
Meet the initial spec.
Voltage
proof
No insulation breakdown or
other damage.
Q
(Class1)
D.F.
(Class2)
Insulation
Resistance
C0G
NP0
Class2
X7R
X7S
X7T
X8R
X8L
Min. operating
temp. ±3
Ambient Temp.
Max. operating
temp. ±2
Ambient Temp.
30 ± 3
2~5
30 ± 2
2~5
Leaving time : Class1 ― 6~24h
Class2 ― 24±2h
Moisture
No mechanical damage.
External
appearance
Resistance
(Steady
Capacitance
Change from the
Characteristics
State)
value before test
Class1
Time (min.)
As for Min./ Max. operating temp., please
refer to "3.OPERATING TEMPERATURE
RANGE".
(Class1)
14
Temperature(°C)
Reflow solder the capacitors on a
P.C.Board shown in Appendix 2 before
testing.
Test temp.:40±2°C
Test humidity:90~95%RH
Test time:500 +24,0h
Leaving time : Class1 ― 6~24h
Class2 ― 24±2h
Please contact
with our sales
representative.
Capacitance
Q
30pF and over
350 min.
10pF and over
under 30pF
275+5/2×C min.
Under 10pF
200+10×C min.
C : Rated capacitance (pF)
200% of initial spec. max.
1,000MΩ or 50MΩ·μF min.
(As for the capacitors of rated
voltage 16V DC and lower,
1,000 MΩ or 10MΩ·μF min.),
whichever smaller.
— 11 —
Reflow solder the capacitors on a
P.C.Board shown in Appendix2 before
testing.
AUT-GEN-004
(continued)
No.
Item
15
Moisture
External
Resistance appearance
Performance
No mechanical damage.
Capacitance
Characteristics
Q
(Class1)
D.F.
(Class2)
16
Life
Test or inspection method
Class1
C0G
NP0
Class2
X7R
X7S
X7T
X8R
X8L
Change from the
value before test
Charge/discharge current:50mA or lower
Please contact
with our sales
representative.
Capacitance
Q
30pF and over
200 min.
Under 30pF
100+10/3×C min.
C : Rated capacitance (pF)
200% of initial spec. max.
Insulation
Resistance
500MΩ or 25MΩ·μF min.
(As for the capacitors of rated
voltage 16V DC and lower,
500 MΩ or 5MΩ·μF min.),
whichever smaller.
External
appearance
No mechanical damage.
Capacitance
Characteristics
Q
(Class1)
Class1
C0G
NP0
Class2
X7R
X7S
X7T
X8R
X8L
Change from the
value before test
Please contact
with our sales
representative.
Q
30pF and over
350 min.
10pF and over to
275+5/2×C min.
under 30pF
D.F.
(Class2)
Insulation
Resistance
Leaving time : Class1 ― 6~24h
Class2 ― 24±2h
Reflow solder the capacitors on a
P.C.Board shown in Appendix2 before
testing.
Initial value setting (only for class 2)
Voltage conditioning 《After voltage treat
the capacitors under testing temperature
and voltage for 1 hour,》 leave the
capacitors in ambient condition for 24±2h
before measurement.
Use this measurement for initial value.
Test temp.:Maximum operating
temperature±2°C
Applied voltage:Please contact with our
sales representative.
Test time:1,000 +48,0h
Capacitance
Under 10pF
Test temp.:85±2°C
Test humidity:85%RH
Applied voltage:Rated voltage
Test time:1,000 +48,0h
200+10×C min.
C : Rated capacitance (pF)
200% of initial spec. max.
1,000MΩ or 50MΩ·μF min.
(As for the capacitors of rated
voltage 16V DC and lower,
1,000 MΩ or 10MΩ·μF min.),
whichever smaller.
Charge/discharge current:50mA or lower
Leaving time : Class1 ― 6~24h
Class2 ― 24±2h
Reflow solder the capacitors on a
P.C.Board shown in Appendix2 before
testing.
Initial value setting (only for class 2)
Voltage conditioning 《After voltage treat
the capacitors under testing temperature
and voltage for 1 hour,》 leave the
capacitors in ambient condition for 24±2h
before measurement.
Use this measurement for initial value.
*As for the initial measurement of capacitors (Class2) on number 7,11,12,13 and 14 leave capacitors at
150 0,–10°C for 1 hour and measure the value after leaving capacitors for 24±2h in ambient condition.
— 12 —
AUT-GEN-004
Appendix1
P.C.Board for bending test
(CGA1,CGA2)
(CGA3,CGA4,CGA5,CGA6,CGA8,CGA9)
100
100
b
b
40
Solder resist
40
a
a
Solder resist
1.0
1.0
c
c
Copper
Copper
Appendix2
P.C. Board for reliability test
100
c
40
b a
*Slit
Solder resist
Copper
* It is recommended to provide a slit on P.C.Board for CGA6,CGA8 and CGA9.
(Unit:mm)
Symbol
a
b
c
CGA1 (CC0201)
0.3
0.8
0.3
CGA2 (CC0402)
0.4
1.5
0.5
CGA3 (CC0603)
1.0
3.0
1.2
CGA4 (CC0805)
1.2
4.0
1.65
CGA5 (CC1206)
2.2
5.0
2.0
CGA6 (CC1210)
2.2
5.0
2.9
CGA8 (CC1812)
3.5
7.0
3.7
CGA9 (CC2220)
4.5
8.0
5.6
Case size
1. Material
Dimensions
: Glass Epoxy(As per JIS C6484 GE4)
2. Thickness : Appendix 1 ― 0.8mm
― 1.6mm
: Appendix 2 ― 1.6mm
(CGA1,CGA2)
(CGA3,CGA4,CGA5,CGA6,CGA8,CGA9)
Copper(Thickness:0.035mm)
Solder resist
— 13 —
AUT-GEN-004
8. INSIDE STRUCTURE AND MATERIAL
3
4
5
2
1
MATERIAL
No.
NAME
1
Dielectric
2
Electrode
Nickel ( Ni)
Copper (Cu)
Termination
Nickel (Ni)
Class1
Class2
CaZrO 3
BaTiO 3
3
4
5
Tin (Sn)
9. PACKAGING
Packaging shall be done to protect the components from the damage during transportation and storing,
and a label which has the following information shall be attached.
9.1 Each plastic bag for bulk packaging contains 1000pcs. And the minimum quantity for
Bulk packaging is 1000pcs.
9.2 Tape packaging is as per 13. TAPE PACKAGING SPECIFICATION.
* CGA1 [CC0201] and CGA2 [CC0402] types are applicable to tape packaging only.
1) Inspection No.
2) TDK P/N
3) Customer's P/N
4) Quantity
*Composition of Inspection No.
Example
F 8 A – 23 – 001
(a) (b) (c)
(d)
(e)
(a) Line code
(b) Last digit of the year
(c) Month and A for January and B for February and so on. (Skip I)
(d) Inspection Date of the month.
(e) Serial No. of the day
*Composition of new Inspection No.
(Will be implemented on and after May 1, 2019)
Example
I
F
9
E
(a) (b) (c) (d)
2 3
A 0
0 1
(e)
(f)
(g)
(a) Prefix
(b) Line code
(c) Last digit of the year
(d) Month and A for January and B for February and so on. (Skip I)
(e) Inspection Date of the month.
(f) Serial No. of the day(00 ~ ZZ)
(g) Suffix(00 ~ ZZ)
* It is planned to shift to the new inspection No. on and after May 2019, but the implementation timing
may be different depending on shipment bases.
Until the shift is completed, either current or new composition of inspection No. will be applied.
— 14 —
AUT-GEN-004
10. RECOMMENDATION
As for CGA6 [CC1210] and larger, It is recommended to provide a slit (about 1mm width)
in the board under the components to improve washing Flux. And please make sure to dry
detergent up completely before.
11. SOLDERING CONDITION
As for CGA1 [CC0201], CGA2 [CC0402], CGA6 [CC1210] and larger, reflow soldering only.
— 15 —
AUT-GEN-004
12. CAUTION
No.
Process
Condition
1
Operating
Condition
(Storage, Use,
Transportation)
1-1. Storage, Use
1) The capacitors must be stored in an ambient temperature of 5 to 40°C with a
relative humidity of 20 to 70%RH. The products should be used within 6 months
upon receipt.
2) The capacitors must be operated and stored in an environment free of dew
condensation and these gases such as Hydrogen Sulphide, Hydrogen Sulphate,
Chlorine, Ammonia and sulfur.
3) Avoid storing in sun light and falling of dew.
4) Do not use capacitors under high humidity and high and low atmospheric pressure
which may affect capacitors reliability.
5) Capacitors should be tested for the solderability when they are stored for long time.
1-2. Handling in transportation
In case of the transportation of the capacitors, the performance of the capacitors
may be deteriorated depending on the transportation condition.
(Refer to JEITA RCR-2335C 9.2 Handling in transportation)
2
Circuit design
! Caution
2-1. Operating temperature
Operating temperature should be followed strictly within this specification, especially
be careful with maximum temperature.
1) Do not use capacitors above the maximum allowable operating temperature.
2) Surface temperature including self heating should be below maximum operating
temperature.
(Due to dielectric loss, capacitors will heat itself when AC is applied. Especially at
high frequencies around its SRF, the heat might be so extreme that it may damage
itself or the product mounted on. Please design the circuit so that the maximum
temperature of the capacitors including the self heating to be below the maximum
allowable operating temperature. Temperature rise at capacitor surface shall be
below 20°C)
3) The electrical characteristics of the capacitors will vary depending on the
temperature. The capacitors should be selected and designed in taking the
temperature into consideration.
2-2. Operating voltage
1) Operating voltage across the terminals should be below the rated voltage.
When AC and DC are super imposed, V 0-P must be below the rated voltage.
— (1) and (2)
AC or pulse with overshooting, V P-P must be below the rated voltage.
— (3), (4) and (5)
When the voltage is started to apply to the circuit or it is stopped applying, the
irregular voltage may be generated for a transit period because of resonance or
switching. Be sure to use the capacitors within rated voltage containing these
Irregular voltage.
△
E
A
R
R
Voltage
(1) DC voltage
Positional
Measurement V 0-P
(Rated voltage)
R
(2) DC+AC voltage
V 0-P
R
R
0
(4) Pulse voltage (A) (5) Pulse voltage (B)
Positional
Measurement V P-P
(Rated voltage)
V P-P
R
R
0
— 16 —
(3) AC voltage
V P-P
R
0
Voltage
R
0
0
AUT-GEN-004
No.
Process
Condition
2
Circuit design
! Caution
2) Even below the rated voltage, if repetitive high frequency AC or pulse is applied, the
reliability of the capacitors may be reduced.
△
A
E
A
3) The effective capacitance will vary depending on applied DC and AC voltages.
The capacitors should be selected and designed in taking the voltages into
consideration.
2-3. Frequency
When the capacitors (Class 2) are used in AC and/or pulse voltages, the
capacitors may vibrate themselves and generate audible sound.
3
Designing
P.C.board
The amount of solder at the terminations has a direct effect on the reliability of the
capacitors.
1) The greater the amount of solder, the higher the stress on the chip capacitors,
and the more likely that it will break. When designing a P.C.board, determine the
shape and size of the solder lands to have proper amount of solder on the
terminations.
2) Avoid using common solder land for multiple terminations and provide individual
solder land for each terminations.
3) Size and recommended land dimensions.
Chip capacitors
Solder land
C
B
Solder resist
A
Flow soldering
Case size
(mm)
CGA3
(CC0603)
CGA4
(CC0805)
CGA5
(CC1206)
A
0.7 ~ 1.0
1.0 ~ 1.3
2.1 ~ 2.5
B
0.8 ~ 1.0
1.0 ~ 1.2
1.1 ~ 1.3
C
0.6 ~ 0.8
0.8 ~ 1.1
1.0 ~ 1.3
Symbol
Reflow soldering
Case size
CGA1
(CC0201)
Symbol
CGA2
(CC0402)
CGA3
(CC0603)
(mm)
CGA4
(CC0805)
A
0.25 ~ 0.35
0.3 ~ 0.5
0.6 ~ 0.8
0.9 ~ 1.2
B
0.20 ~ 0.30
0.35 ~ 0.45
0.6 ~ 0.8
0.7 ~ 0.9
C
0.25 ~ 0.35
0.4 ~ 0.6
0.6 ~ 0.8
0.9 ~ 1.2
CGA5
(CC1206)
CGA6
(CC1210)
CGA8
(CC1812)
CGA9
(CC2220)
A
2.0 ~ 2.4
2.0 ~ 2.4
3.1 ~ 3.7
4.1 ~ 4.8
B
1.0 ~ 1.2
1.0 ~ 1.2
1.2 ~ 1.4
1.2 ~ 1.4
C
1.1 ~ 1.6
1.9 ~ 2.5
2.4 ~ 3.2
4.0 ~ 5.0
Case size
Symbol
— 17 —
AUT-GEN-004
No.
3
Process
Designing
P.C.board
Condition
4) Recommended chip capacitors layout is as following.
Disadvantage against
bending stress
Advantage against
bending stress
Perforation or slit
Perforation or slit
Break P.C.board with
mounted side up.
Break P.C.board with
mounted side down.
Mounting
face
Mount perpendicularly to
perforation or slit
Mount in parallel with
perforation or slit
Perforation or slit
Perforation or slit
Chip
arrangement
(Direction)
Closer to slit is higher stress
ℓ1
Away from slit is less stress
ℓ2
R
Distance from
slit
( ℓ1< ℓ2 )
R
— 18 —
R
R
R
R
R
( ℓ1< ℓ2 )
AUT-GEN-004
No.
3
Process
Designing
P.C.board
Condition
5) Mechanical stress varies according to location of chip capacitors on the P.C.board.
E
D
Perforation
C
B
A
Slit
The stress in capacitors is in the following order.
A>B=C>D>E
6) Layout recommendation
Example
Use of common
solder land
Soldering with
chassis
Use of common
solder land with
other SMD
Lead wire Chassis
Chip
Solder
land
Excessive solder
Solder
Need to
avoid
Excessive solder
PCB Adhesive
Solder land
ℓ1
Missing
solder
Lead wire
Solder land
Solder resist
Solder resist
Recommendation
Solder resist
ℓ2
ℓ 2 >ℓ 1
— 19 —
AUT-GEN-004
No.
4
Process
Mounting
Condition
4-1. Stress from mounting head
If the mounting head is adjusted too low, it may induce excessive stress in the chip
capacitors to result in cracking. Please take following precautions.
1) Adjust the bottom dead center of the mounting head to reach on the P.C.board
surface and not press it.
2) Adjust the mounting head pressure to be 1 to 3N of static weight.
3) To minimize the impact energy from mounting head, it is important to provide
support from the bottom side of the P.C.board.
See following examples.
Not recommended
Single-sided
mounting
Recommended
Crack
Support pin
Double-sides
mounting
Solder
peeling
Crack
Support pin
When the centering jaw is worn out, it may give mechanical impact on the capacitors
to cause crack. Please control the close up dimension of the centering jaw and
provide sufficient preventive maintenance and replacement of it.
4-2. Amount of adhesive
a
a
b
c
c
Example : CGA4 (CC0805), CGA5 (CC1206)
a
0.2mm min.
b
70 ~ 100μm
c
Do not touch the solder land
— 20 —
AUT-GEN-004
No.
Process
Condition
5
Soldering
5-1. Flux selection
Flux can seriously affect the performance of capacitors. Confirm the following to
select the appropriate flux.
1) It is recommended to use a mildly activated rosin flux (less than 0.1wt% chlorine).
Strong flux is not recommended.
2) Excessive flux must be avoided. Please provide proper amount of flux.
3) When water-soluble flux is used, enough washing is necessary.
5-2. Recommended soldering profile by various methods
Reflow soldering
Wave soldering
Soldering
Natural cooling
Soldering
Preheating
Peak
Temp
Temp.. (°C)
Temp. (°C)
Peak
Temp
△T
0
Preheating
Natural cooling
Over 60 sec.
Over 60 sec.
∆T
0
Over 60 sec.
Peak Temp time
Peak Temp time
Manual soldering
(Solder iron)
APPLICATION
As for CGA3 (CC0603), CGA4 (CC0805) and
Peak
Temp
CGA5 (CC1206), applied to wave soldering
Temp.. (°C)
and reflow soldering.
∆T
As for other case sizes, applied to reflow
soldering only.
Preheating
0
3sec. (As short as possible)
※ As for peak temperature of manual soldering, please refer“5-6. Solder repair by solder iron”.
5-3. Recommended soldering peak temp and peak temp duration
Temp./Duration
Wave soldering
Reflow soldering
Peak temp(°C) Duration(sec.)
Peak temp(°C)
Duration(sec.)
Sn-Pb Solder
250 max.
3 max.
230 max.
20 max.
Lead Free Solder
260 max.
5 max.
260 max.
10 max.
Solder
Recommended solder compositions
Lead Free Solder : Sn-3.0Ag-0.5Cu
Sn-Pb solder : Sn-37Pb
— 21 —
AUT-GEN-004
No.
Process
5
Soldering
Condition
5-4. Avoiding thermal shock
1) Preheating condition
Soldering
Case size
Wave soldering
Reflow soldering
Manual soldering
2)
Temp. (°C)
CGA3(CC0603), CGA4(CC0805),
CGA5(CC1206)
CGA1(CC0201),CGA2(CC0402)
CGA3(CC0603),CGA4(CC0805)
CGA5(CC1206)
CGA6(CC1210), CGA8(CC1812),
CGA9(CC2220)
CGA1(CC0201),CGA2(CC0402)
CGA3(CC0603),CGA4(CC0805)
CGA5(CC1206)
CGA6(CC1210), CGA8(CC1812),
CGA9(CC2220)
∆T ≦ 150
∆T ≦ 150
∆T ≦ 130
∆T ≦ 150
∆T ≦ 130
Cooling condition
Natural cooling using air is recommended. If the chips are dipped into a solvent for
cleaning, the temperature difference (∆T) must be less than 100°C.
5-5. Amount of solder
Excessive solder will induce higher tensile force in chip capacitors when
temperature changes and it may result in chip cracking. In sufficient solder may
detach the capacitors from the P.C.board.
Higher tensile force in
chip capacitors to cause
crack
Excessive
solder
Maximum amount
Minimum amount
Adequate
Low robustness may
cause contact failure or
chip capacitors come off
the P.C.board.
Insufficient
solder
5-6. Solder repair by solder iron
1) Selection of the soldering iron tip
Tip temperature of solder iron varies by its type, P.C.board material and solder
land size. The higher the tip temperature, the quicker the operation. However,
heat shock may cause a crack in the chip capacitors.
Please make sure the tip temp. before soldering and keep the peak temp and
time in accordance with following recommended condition.
Recommended solder iron condition (Sn-Pb Solder and Lead Free Solder)
Case size
Temp. (°C)
CGA1(CC0201)
CGA2(CC0402)
CGA3(CC0603)
CGA4(CC0805)
CGA5(CC1206)
350 max.
CGA6(CC1210)
CGA8(CC1812)
CGA9(CC2220)
280 max.
Duration (sec.)
Wattage (W)
Shape (mm)
3 max.
20 max.
Ø 3.0 max.
* Please preheat the chip capacitors with the condition in 5-4 to avoid the thermal shock.
— 22 —
AUT-GEN-004
No.
Process
5
Soldering
Condition
2) Direct contact of the soldering iron with ceramic dielectric of chip capacitors
may cause crack. Do not touch the ceramic dielectric and the terminations by
solder iron.
5-7.Soldering rework using spot heater
Heat stress during rework may possibly be reduced by using a spot heater
(also called a “blower”) rather than a soldering iron.
It is applied only to adding solder in the case of insufficient solder amount.
1) Reworking using a spot heater may suppress the occurrence of cracks in the
capacitor compared to using a soldering iron. A spot heater can heat up a capacitor
uniformly with a small heat gradient which leads to lower thermal
stress caused by quick heating and cooling or localized heating.
Moreover, where ultra-small capacitors are mounted close together on a printed
circuit board, reworking with a spot heater can eliminate the risk of direct contact
between the tip of a soldering iron and a capacitor.
2) Rework condition
If the blower nozzle of a spot heater is too close to a capacitor, a crack in the
capacitor may occur due to heat stress. Below are recommendations for avoiding
such an occurrence.
Keep more than 5mm between a capacitor and a spot heater nozzle.
The blower temperature of the spot heater shall be lower than 400°C.
The airflow shall be set as weak as possible.
The diameter of the nozzle is recommended to be 2mm(one-outlet type).The size is
standard and common.
Duration of blowing hot air is recommended to be 10s or less for CGA3 (CC0603),
CGA4 (CC0805) and CGA5 (CC1206), and 30s or less for CGA6 (CC1210),
CGA8(CC1812) and CGA9 (CC2220), considering surface area of the capacitor
and melting temperature of solder.
The angle between the nozzle and the capacitor is recommended to be 45degrees
in order to work easily and to avoid partial area heating.
As is the case when using a soldering iron, preheating reduces thermal stress on
capacitors and improves operating efficiency.
・Recommended rework condition(Consult the component manufactures for details.)
Distance from nozzle
5mm and over
Nozzle angle
45degrees
Nozzle temp.
400°C and less
Set as weak as possible
(The airflow shall be the minimum value necessary for
solder to melt in the conditions mentioned above.)
φ2mm(one-outlet type)
10s and less (CGA3 [CC0603], CGA4 [CC0805], CGA5 [CC1206])
30s and less (CGA6 [CC1210], CGA8 [CC1812], CGA9 [CC2220])
Airflow
Nozzle diameter
Blowing duration
・Example of recommended spot heater use
One-outlet type nozzle
Angle : 45degrees
— 23 —
AUT-GEN-004
No.
Process
5
Soldering
Condition
3) Amount of solder should be suitable to from a proper fillet shape.
Excess solder causes mechanical and thermal stress on a capacitor and
results in cracks. Insufficient solder causes weak adherence of the capacitor
to the substrate and may result in detachment of a capacitor and deteriorate
reliability of the printed wiring board.
See the example of appropriate solder fillet shape for 5-5.Amount of solder.
5-8. Sn-Zn solder
Sn-Zn solder affects product reliability.
Please contact TDK in advance when utilize Sn-Zn solder.
5-9. Countermeasure for tombstone
The misalignment between the mounted positions of the capacitors and the land
patterns should be minimized. The tombstone phenomenon may occur especially
the capacitors are mounted (in longitudinal direction) in the same direction of the
reflow soldering.
(Refer to JEITA RCR-2335C Annex A (Informative), Recommendations to prevent
the tombstone phenomenon.)
6
Cleaning
1) If an unsuitable cleaning fluid is used, flux residue or some foreign articles may
stick to chip capacitors surface to deteriorate especially the insulation resistance.
2) If cleaning condition is not suitable, it may damage the chip capacitors.
2)-1. Insufficient washing
(1) Terminal electrodes may corrode by Halogen in the flux.
(2) Halogen in the flux may adhere on the surface of capacitors, and lower the
insulation resistance.
(3) Water soluble flux has higher tendency to have above mentioned
problems (1) and (2).
2)-2. Excessive washing
When ultrasonic cleaning is used, excessively high ultrasonic energy output
can affect the connection between the ceramic chip capacitor's body and the
terminal electrode. To avoid this, following is the recommended condition.
Power : 20 W/ ℓ max.
Frequency : 40 kHz max.
Washing time : 5 minutes max.
2)-3. If the cleaning fluid is contaminated, density of Halogen increases, and it may
bring the same result as insufficient cleaning.
— 24 —
AUT-GEN-004
No.
7
Process
Coating and
molding of the
P.C.board
Condition
1) When the P.C.board is coated, please verify the quality influence on the product.
2) Please verify carefully that there is no harmful decomposing or reaction gas
emission during curing which may damage the chip capacitors.
3) Please verify the curing temperature.
8
Handling after
chip mounted
△Caution
!
E
1) Please pay attention not to bend or distort the P.C.board after soldering in handling
otherwise the chip capacitors may crack.
Bend
A
Twist
2) Printed circuit board cropping should not be carried out by hand, but by using the
proper tooling. Printed circuit board cropping should be carried out using a board
cropping jig as shown in the following figure or a board cropping apparatus to
prevent inducing mechanical stress on the board.
(1)Example of a board cropping jig
Recommended example: The board should be pushed from the back side,
close to the cropping jig so that the board is not bent and the stress applied to
the capacitor is compressive.
Unrecommended example: If the pushing point is far from the cropping jig and
the pushing direction is from the front side of the board, large tensile stress is
applied to the capacitor, which may cause cracks.
Outline of jig
Printed
circuit
board
Recommended
Direction of
load
V-groove
Printed
circuit
board
Unrecommended
Components
Printed
circuit
board
Load point
Slot
Board
cropping jig
V-groove
— 25 —
Direction
of load
Load point
Slot
Components
V-groove
Slot
AUT-GEN-004
No.
8
Process
Handling after
chip mounted
! Caution
△
A
E
A
Condition
(2)Example of a board cropping machine
An outline of a printed circuit board cropping machine is shown below. The
top and bottom blades are aligned with one another along the lines with the
V-grooves on printed circuit board when cropping the board.
Unrecommended example: Misalignment of blade position between top and
bottom, right and left, or front and rear blades may cause a crack in the
capacitor.
Outline of machine
Principle of operation
Top blade
Top
blade
Printed circuit board
Bottom blade
V-groove
Printed circuit board
Cross-section
Printed circuit board
V-groove
Top blade
Bottom blade
Unrecommended
Recommended
Top-bottom
misalignment
Left-right
misalignment
Front-rear
misalignment
Top blade
Top blade
Top blade
Bottom blade
Bottom blade
Bottom blade
Top blade
Board
Bottom blade
3) When functional check of the P.C.board is performed, check pin pressure tends
to be adjusted higher for fear of loose contact. But if the pressure is excessive
and bend the P.C.board, it may crack the chip capacitors or peel the terminations
off. Please adjust the check pins not to bend the P.C.board.
Item
Not recommended
Termination
peeling
Recommended
Support pin
Board
bending
Check pin
— 26 —
Check pin
AUT-GEN-004
No.
Process
Condition
9
Handling of loose
chip capacitors
1) If dropped the chip capacitors may crack. Once dropped do not use it. Especially,
the large case sized chip capacitors are tendency to have cracks easily, so please
handle with care.
Crack
Floor
2) Piling the P.C.board after mounting for storage or handling, the corner of the P.C.
board may hit the chip capacitors of another board to cause crack.
P.C.board
Crack
10
Capacitance aging
The capacitors (Class 2) have aging in the capacitance. They may not be used in
precision time constant circuit. In case of the time constant circuit, the evaluation
should be done well.
11
Estimated life and
estimated failure
rate of capacitors
As per the estimated life and the estimated failure rate depend on the temperature
and the voltage. This can be calculated by the equation described in JEITA
RCR-2335C Annex F (Informative) Calculation of the estimated lifetime and the
estimated failure rate ( Voltage acceleration coefficient : 3 multiplication rule,
Temperature acceleration coefficient : 10°C rule)
The failure rate can be decreased by reducing the temperature and the voltage but
they will not be guaranteed.
— 27 —
AUT-GEN-004
No.
12
Process
Caution during
operation of
equipment
Condition
1) A capacitor shall not be touched directly with bare hands during operation in
order to avoid electric shock.
Electric energy held by the capacitor may be discharged through the human
body when touched with a bare hand.
Even when the equipment is off, a capacitor may stay charged. The capacitor
should be handled after being completely discharged using a resistor.
2) The terminals of a capacitor shall not be short-circuited by any accidental
contact with a conductive object. A capacitor shall not be exposed to a
conductive liquid such as an acid or alkali solution. A conductive object or liquid,
such as acid and alkali, between the terminals may lead to the breakdown of a
capacitor due to short circuit
3) Confirm that the environment to which the equipment will be exposed during
transportation and operation meets the specified conditions. Do not to use the
equipment in the following environments.
(1) Environment where a capacitor is spattered with water or oil
(2) Environment where a capacitor is exposed to direct sunlight
(3) Environment where a capacitor is exposed to Ozone, ultraviolet rays or
radiation
(4) Environment where a capacitor exposed to corrosive gas(e.g. hydrogen
sulfide, sulfur dioxide, chlorine. ammonia gas etc.)
(5) Environment where a capacitor exposed to vibration or mechanical shock
exceeding the specified limits.
(6) Atmosphere change with causes condensation
13
Others
△Caution
A
!
E
The product listed in this specification is intended for use in automotive applications
under normal operation and usage conditions.
S
S
A
The product is not designed or warranted to meet the requirements of application
listed below, whose performance and/or quality requires a more stringent level of
safety or reliability, or whose failure, malfunction or defect could cause serious
damage to society, person or property. Please understand that we are not
responsible for any damage or liability caused by use of the products in any of the
applications below or for any other use exceeding the range or conditions set forth in
this specification sheet. If you intend to use the products in the applications listed
below or if you have special requirements exceeding the range or conditions set forth
in this specification, please contact us.
(1) Aerospace/Aviation equipment
(2) Transportation equipment (electric trains, ships etc.)
(3) Medical equipment (Excepting Pharmaceutical Affairs Law classification Class1, 2)
(4) Power-generation control equipment
(5) Atomic energy-related equipment
(6) Seabed equipment
(7) Transportation control equipment
(8) Public information-processing equipment
(9) Military equipment
(10) Electric heating apparatus, burning equipment
(11) Disaster prevention/crime prevention equipment
(12) Safety equipment
(13) Other applications that are not considered general-purpose applications
When designing your equipment even for general-purpose applications, you are
kindly requested to take into consideration securing protection circuit/device or
providing backup circuits in your equipment.
In addition, although the product listed in this specification is intended for use in
automotive applications as described above, it is not prohibited to use for general
electronic equipment, whose performance and/or quality doesn’t require a more
stringent level of safety or reliability, or whose failure, malfunction or defect could not
cause serious damage to society, person or property.
Therefore, the description of this caution will be applied, when the product is used in
general electronic equipment under a normal operation and usage conditions.
— 28 —
AUT-GEN-004
13. TAPE PACKAGING SPECIFICATION
1. CONSTRUCTION AND DIMENSION OF TAPING
1-1. Dimensions of carrier tape
Dimensions of paper tape shall be according to Appendix 3, 4, 5.
Dimensions of plastic tape shall be according to Appendix 6, 7.
1-2. Bulk part and leader of taping
Trailer(Empty)
Empty
160mm min.
Chips
160mm min.
Leader
Drawing direction
400mm min
1-3. Dimensions of reel
Dimensions of Ø178 reel shall be according to Appendix 8, 9.
Dimensions of Ø330 reel shall be according to Appendix 10, 11.
1-4. Structure of taping
〈Paper〉
〈Plastic〉
Top cover tape
Top cover tape
Pitch hole
Cavity (Chip insert)
Paper carrier tape
Bottom cover tape
(Bottom cover tape is not always applied.)
2. CHIP QUANTITY
Please refer to detail page on TDK Web.
— 29 —
Pitch hole
Cavity (Chip insert)
Plastic carrier tape
AUT-GEN-004
3. PERFORMANCE SPECIFICATIONS
3-1. Fixing peeling strength (top tape)
0.05N < Peeling strength < 0.7N
〈Paper〉
Direction of cover tape pulling
Top cover tape
Carrier tape
0~15°
Direction of pulling
Paper tape should not adhere to top
cover tape when pull the cover tape.
〈Plastic〉
Direction of pulling
Top cover tape
Carrier tape
0~15°
Direction of pulling
3-2. Carrier tape shall be flexible enough to be wound around a minimum radius
of 30mm with components in tape.
3-3. The missing of components shall be less than 0.1%
3-4. Components shall not stick to fixing tape.
3-5. When removing the cover tape, there shall not be difficulties by unfitting clearance gap,
burrs and crushes of cavities. Also the sprocket holes shall not be covered by
absorbing dust into the suction nozzle.
— 30 —
AUT-GEN-004
Appendix 3
Paper Tape
U
Pitch hole
Cavity(Chip insert)
J
E
D
A
C
B
K
H
G
F
T
(Unit:mm)
Symbol
Case size
CGA1
(CC0201)
Symbol
Case size
CGA1
(CC0201)
A
B
( 0.38 )
( 0.68 )
* ( 0.45 )
* ( 0.75 )
G
H
2.00 ± 0.05
4.00 ± 0.05
C
D
E
F
8.00 ± 0.30
3.50 ± 0.05
1.75 ± 0.10
2.00 ± 0.05
J
K
T
Ø 1.50
+0.10 0.35 ± 0.02
0
* 0.43 ± 0.02
0.40 min.
* 0.47 min.
(
) Reference value.
* Applied to 100nF.
Appendix 4
Paper Tape
U
Pitch hole
Cavity(Chip insert)
J
E
A
D
C
B
H
T
G
F
(Unit : mm)
Symbol
Case size
CGA2
(CC0402)
Symbol
Case size
CGA2
(CC0402)
(
A
B
C
D
E
F
( 0.65 )
( 1.15 )
8.00 ± 0.30
3.50 ± 0.05
1.75 ± 0.10
2.00 ± 0.05
G
H
J
T
2.00 ± 0.05
4.00 ± 0.10 Ø 1.50
+0.10
0
) Reference value.
— 31 —
0.60±0.15
AUT-GEN-004
Appendix 5
Paper Tape
Pitch hole
Cavity(Chip insert)
J
E
A
D
B
T
H
G
C
F
(Unit : mm)
Symbol
Case size
CGA3
(CC0603)
CGA4
(CC0805)
CGA5
(CC1206)
Symbol
Case size
CGA3
(CC0603)
CGA4
(CC0805)
CGA5
(CC1206)
(
A
B
( 1.10 )
( 1.90 )
( 1.50 )
( 2.30 )
( 1.90 )
( 3.50 )
G
H
2.00 ± 0.05
4.00 ± 0.10
C
D
E
F
8.00 ± 0.30
3.50 ± 0.05
1.75 ± 0.10
4.00 ± 0.10
J
T
Ø 1.50
+0.10
0
) Reference value.
— 32 —
1.20 max.
AUT-GEN-004
Appendix 6
Plastic Tape
Pitch hole
Cavity(Chip insert)
J
E
A
D
C
B
T
H
Q
F
G
K
(Unit : mm)
Symbol
Case size
CGA3
(CC0603)
CGA4
(CC0805)
CGA5
(CC1206)
CGA6
(CC1210)
Symbol
Case size
CGA3
(CC0603)
CGA4
(CC0805)
CGA5
(CC1206)
CGA6
(CC1210)
(
A
B
( 1.10 )
( 1.90 )
( 1.50 )
( 2.30 )
( 1.90 )
( 3.50 )
( 2.90 )
( 3.60 )
G
H
C
D
8.00 ± 0.30
3.50 ± 0.05
E
F
1.75 ± 0.10
4.00 ± 0.10
T
Q
0.60 max.
Ø 0.50 min.
* 12.00 ± 0.30 * 5.50 ± 0.05
J
K
1.60 max.
2.00 ± 0.05
4.00 ± 0.10
Ø 1.50
+0.10
0
2.50 max.
3.40 max.
) Reference value.
Exceptionally no hole in the cavity is applied. Please inquire if hole in cavity is mandatory.
* Applied to thickness, 2.5mm products.
— 33 —
AUT-GEN-004
Appendix 7
Plastic Tape
Pitch hole
Cavity(Chip insert)
J
E
A
D
C
B
T
H
G
Q
F
K
(Unit : mm)
Symbol
Case size
CGA8
(CC1812)
CGA9
(CC2220)
Symbol
Case size
CGA8
(CC1812)
CGA9
(CC2220)
(
A
B
( 3.60 )
( 4.90 )
( 5.40 )
( 6.10 )
G
H
2.00 ± 0.05
4.00 ± 0.10
C
D
E
F
12.00 ± 0.30
5.50 ± 0.05
1.75 ± 0.10
8.00 ± 0.10
J
K
T
Q
6.50 max.
0.60 max.
Ø 1.50 min.
Ø 1.50
+0.10
0
) Reference value.
Exceptionally no hole in the cavity is applied. Please inquire if hole in cavity is mandatory.
— 34 —
AUT-GEN-004
Appendix 8
Dimensions of reel (Material : Polystyrene)
U
U
CGA1, CGA2, CGA3, CGA4, CGA5, CGA6
W2
E
C
B
D
R
W1
A
(Unit : mm)
Symbol
A
B
C
D
E
W1
Dimension
Ø178 ± 2.0
Ø60 ± 2.0
Ø13 ± 0.5
Ø21 ± 0.8
2.0 ± 0.5
9.0 ± 0.3
Symbol
W2
R
Dimension
13.0 ± 1.4
1.0
R
R
Appendix 9
Dimensions of reel (Material : Polystyrene)
CGA6(2.5mm thickness products), CGA8, CGA9
U
U
W2
E
C
B
D
R
W1
A
(Unit : mm)
Symbol
A
B
C
D
E
W1
Dimension
Ø178 ± 2.0
Ø60 ± 2.0
Ø13 ± 0.5
Ø21 ± 0.8
2.0 ± 0.5
13.0 ± 0.3
Symbol
W2
R
Dimension
17.0 ± 1.4
1.0
R
— 35 —
R
AUT-GEN-004
Appendix 10
Dimensions of reel (Material : Polystyrene)
U
U
CGA1, CGA2, CGA3, CGA4, CGA5, CGA6
E
C
B
D
R
t
W
A
(Unit : mm)
Symbol
Dimension
A
Ø382 max.
(Nominal
Ø330)
B
C
D
E
W
Ø50 min.
Ø13 ± 0.5
Ø21 ± 0.8
2.0 ± 0.5
10.0 ± 1.5
Symbol
t
R
Dimension
2.0 ± 0.5
1.0
Appendix 11
Dimensions of reel (Material : Polystyrene)
U
U
CGA6(2.5mm thickness products), CGA8, CGA9
E
C
B
D
R
W
A
t
(Unit : mm)
Symbol
Dimension
A
Ø382 max.
(Nominal
Ø330)
B
C
D
E
W
Ø50 min.
Ø13 ± 0.5
Ø21 ± 0.8
2.0 ± 0.5
14.0 ± 1.5
Symbol
t
R
Dimension
2.0 ± 0.5
1.0
— 36 —