CKG57NX7T2E335MT009W 数据手册
COM-MGC1-003
SPEC. No. C-MEGA-e
DELIVERY SPECIFICATION
D A T E :
Jun, 2 01 9
To
Non-Controlled Copy
Upon the acceptance of this spec. previous
spec. (C2011-0454) shall be abolished.
CUSTOMER'S PRODUCT NAME
TDK’S PRODUCT NAME
Multilayer Ceramic Chip Capacitors
Mega Cap Series
Tape packaging【RoHS compliant】
CKG32K,CKG45K,CKG57K,CKG45N,CKG57N Type
C0G,X5R,X7R,X7S,X7T Characteristics
Please return this specification to TDK representatives with your signature.
If orders are placed without returned specification, please allow us to judge that specification
is accepted by your side.
RECEIPT CONFIRMATION
DATE:
TDK Corporation
Sales
Electronic Components
Sales & Marketing Group
APPROVED
Person in charge
YEAR
MONTH
DAY
Engineering
Electronic Components Business Company
Ceramic Capacitors Business Group
APPROVED
CHECKED
Person in charge
COM-MGC1-003
―1―
COM-MGC1-003
SCOPE
This delivery specification shall be applied to Multilayer ceramic chip capacitors (Mega cap series)
to be delivered to
.
PRODUCTION PLACES
Production places defined in this specification shall be TDK Corporation, TDK Xiamen Co.,Ltd,
TDK(Suzhou)Co.,Ltd and TDK Components U.S.A.Inc.
PRODUCT NAME
The name of the product to be defined in this specifications shall be CKG◇◇◇○○○△△□□□×.
REFERENCE STANDARD
JIS C 5101－1：2010
C 5101－21：2014
Fixed capacitors for use in electronic equipment-Part 1: Generic specification
Fixed capacitors for use in electronic equipment-Part 21 : Sectional specification
: Fixed surface mount multilayer capacitors of ceramic dielectric,Class1
C 5101－22：2014 Fixed capacitors for use in electronic equipment-Part 22 : Sectional specification
: Fixed surface mount multilayer capacitors of ceramic dielectric,Class2
C 0806－3：2014
Packaging of components for automatic handling - Part 3: Packaging of
surface mount components on continuous tapes
JEITA RCR－2335 C 2014 Safety application guide for fixed ceramic capacitors for use in electronic
equipment
CONTENTS
1. CODE CONSTRUCTION
2. OPERATING TEMPERATURE RANGE
3. STORING CONDITION AND TERM
4. INDUSTRIAL WASTE DISPOSAL
5. PERFORMANCE
6. INSIDE STRUCTURE AND MATERIAL
7. PACKAGING
8. RECOMMENDATION
9. SOLDERING CONDITION
10. CAUTION
11. TAPE PACKAGING SPECIFICATION
12. TABLE A (TDK products line up)
When the mistrust in the spec arises, this specification is given priority. And it will be confirmed by written
spec change after conference of both posts involved.
This specification warrants the quality of the ceramic chip capacitor. Capacitors should be evaluated or
confirmed a state of mounted on your product.
If the use of the capacitors goes beyond the bounds of this specification, we can not afford to guarantee.
Division
Date
SPEC. No.
Ceramic Capacitors Business Group
Jun, 2019
C-MEGA-e
―2―
COM-MGC1-003
1. CODE CONSTRUCTION
(Example)
CKG32K
CKG57N
(1)
X7S
X7R
(2)
1H
1E
(3)
106
226
(4)
K
M
(5)
ΟΟΟΟ
ΟΟΟΟ
(7)
T
T
(6)
(1) Case size
Single type
CKG**K : 1 chip capacitor.
W
Stacked type
CKG**N : 2 chip capacitors.
W
L
T
L
T
E
E
Case size
Single
type
Stacked
type
Dimensions (mm)
L
W
T
E
CKG32K
3.60±0.30
2.60±0.30
3.35±0.10
0.80±0.15
CKG45K
5.00±0.50
3.50±0.50
2.90±0.10
1.10±0.30
CKG57K
6.00±0.50
5.00±0.50
3.35±0.15
1.60±0.30
CKG45N
5.00±0.50
3.50±0.50
5.00±0.50
1.10±0.30
CKG57N
6.00±0.50
5.00±0.50
5.00±0.50
1.60±0.30
* As for each item, please refer to detail page on TDK Web.
(2) Temperature Characteristics
* Details are shown in table 1 No.6 and No.7 at 5.PERFORMANCE
(3) Rated Voltage
Symbol
Rated Voltage
Symbol
Rated Voltage
3A
DC 1 kV
2A
DC 100 V
2J
DC 630 V
1H
DC
50 V
2W
DC 450 V
1E
DC
25 V
2E
DC 250 V
1C
DC
16 V
(Example)
(4) Rated Capacitance
Stated in three digits and in units of pico farads (pF).
The first and Second digits identify the first and second
significant figures of the capacitance, the third digit
identifies the multiplier.
―3―
Symbol
Rated
Capacitance
106
10,000,000 pF
226
22,000,000 pF
COM-MGC1-003
(5) Capacitance tolerance
* K (±10%) tolerance is available only for
CKG**K single type (10μF and under).
(6) Packaging
Symbol
Tolerance
J
± 5%
*K
± 10 %
M
± 20 %
Symbol
Packaging
T
Taping
(7) TDK internal code
2. OPERATING TEMPERATURE RANGE
T.C.
Min. operating
Temperature
Max. operating
Temperature
Reference
Temperature
X5R
-55°C
85°C
25°C
C0G/X7R/X7S/X7T
-55°C
125°C
25°C
3. STORING CONDITION AND TERM
Storing temperature
Storing humidity
Storing term
5~40°C
20~70%RH
Within 6 months
upon receipt.
4. INDUSTRIAL WASTE DISPOSAL
Dispose this product as industrial waste in accordance with the Industrial Waste Law.
―4―
COM-MGC1-003
5. PERFORMANCE
table 1
No.
Item
1
External
Appearance
2
Insulation
Resistance
3
Voltage Proof
Performance
No defects which may affect
performance.
10,000MΩ or 500MΩ· μF min.
whichever smaller.
(As for the capacitor of rated
voltage 16V DC, 100MΩ· μF min.)
Withstand test voltage without
insulation breakdown or other
damage.
Test or inspection method
Inspect with magnifying glass (3×)
Measuring voltage：Rated voltage
(As for the capacitor of rated voltage 1kV
and 630V DC, apply 500V DC.)
Voltage application time：60s.
Class
1
2
Rated
voltage(RV)
Apply voltage
RV≦100V
3 × rated voltage
100V＜RV≦500V
1.5 × rated voltage
500V＜RV＜1kV
1.3 × rated voltage
1kV
1.2 × rated voltage
RV≦100V
2.5 × rated voltage
100V＜RV≦500V
1.5 × rated voltage
500V＜RV
1.3 × rated voltage
Voltage application time : 1s.
Charge / discharge current : 50mA or
lower
4
Capacitance
Within the specified tolerance.
《Class1》
Capacitance
Measuring
frequency
1000pF
1MHz±10%
Over 1000pF
1kHz±10%
Measuring
voltage
0.5 ~ 5 Vrms.
《Class2》
Capacitance
10uF and
under
Over 10uF
5
Q
(Class1)
Please refer to detail page on TDK
Web.
Dissipation Factor
(Class2)
―5―
Measuring
frequency
Measuring
voltage
1kHz±10%
1.0±0.2Vrms.
120Hz±20% 0.5±0.2Vrms.
See No.4 in this table for measuring
condition.
COM-MGC1-003
(continued)
No.
Item
6
Temperature
Characteristics
of Capacitance
(Class1)
Performance
T.C.
Temperature Coefficient
(ppm/°C)
C0G
0 ± 30
Capacitance
drift
7
Temperature
Characteristics
of Capacitance
(Class2)
Test or inspection method
Within ± 0.2%
Capacitance Change (%)
No voltage applied
X5R :
±15
X7R :
±15
X7S :
±22
X7T :
+22
- 33
Temperature coefficient shall be
calculated based on values at 25°C and
85°C temperature.
Measuring temperature below 25°C
shall be -10°C and -25°C.
Capacitance shall be measured by the
steps shown in the following table after
thermal equilibrium is obtained for each
step.
∆C be calculated ref. STEP3 reading
Step
Temperature(°C)
1
Reference temp. ± 2
2
Min. operating temp. ± 2
3
Reference temp. ± 2
4
Max. operating temp. ± 2
As for Min./ Max. operating temp. and
Reference temp., please refer to
"2.OPERATING TEMPERATURE RANGE".
As for measuring voltage, please contact with
our sales representative.
8
Robustness of
Terminations
No sign of termination coming off,
breakage of ceramic, or other
abnormal signs.
Reflow solder the capacitors on a
P.C.Board shown in Appendix2.
Apply a pushing force gradually at the
center of a specimen in a horizontal
direction of P.C.board.
Pushing force : 5N
Holding time : 10±1s
Pushing force
P.C.Board
Capacitor
9
Bending
No mechanical damage.
Reflow solder the capacitors on
a P.C.Board shown in Appendix1 and
bend it for 1mm.
20
50
F
R230
1
45
45
(Unit : mm)
―6―
COM-MGC1-003
(continued)
No.
10
11
Item
Solderability
Vibration
Performance
Both end faces and the contact
areas shall be covered with a
smooth and bright solder coating
with no more than a small amount
of scattered imperfections such as
pinholes or un-wetted or dewetted areas.
These imperfections shall not be
concentrated in one area.
No mechanical damage.
External
appearance
Capacitance
Characteristics
12
Change from the
value before test
Class1
C0G
± 2.5 %
Class2
X5R
X7R
X7S
X7T
± 7.5 %
Q
(Class1)
Meet the initial spec.
D.F.
(Class2)
Meet the initial spec.
Temperature External
cycle
appearance
No mechanical damage.
Test or inspection method
Solder : Sn-3.0Ag-0.5Cu or Sn-37Pb
Reflow solder the capacitor on a
P.C.Board shown in Appendix2.
Please refer to No.5 Soldering in
10.CAUTION for soldering condition.
Frequency : 10~55~10Hz
Reciprocating sweep time : 1 min.
Amplitude : 1.5mm
Repeat this for 2h each in 3
perpendicular directions(Total 6h).
Reflow solder the capacitors on a
P.C.Board shown in Appendix2 before
testing.
Expose the capacitors in the condition
step1 through step 4 listed in the
following table.
Capacitance
Characteristics
Class1
C0G
Class2
X5R
X7R
X7S
X7T
Change from the
value before test
Please contact
with our sales
representative.
Q
(Class1)
Meet the initial spec.
D.F.
(Class2)
Meet the initial spec.
Insulation
Resistance
Meet the initial spec.
Voltage
proof
No insulation breakdown or
other damage.
―7―
Temp. cycle : 100 cycles
Step
Temperature(°C)
Time (min.)
1
Min. operating
temp. ±3
30 ± 3
2
Ambient Temp.
2~5
3
Max. operating
temp. ±2
30 ± 2
4
Ambient Temp.
2~5
As for Min./Max operating temp., please
refer to “2. OPERATING TEMPERATURE
RANGE”
Leave the capacitors in ambient
condition for
Class 1 : 6~24h
Class 2 : 24±2h before measurement.
Reflow solder the capacitors on a
P.C.Board shown in Appendix2 before
testing.
COM-MGC1-003
(continued)
No.
13
Item
Moisture
Resistance
External
Performance
No mechanical damage.
appearance
Capacitance
Characteristics
14
Life
Class1
C0G
Class2
X5R
X7R
X7S
X7T
Change from the
value before test
Please contact
with our sales
representative.
200 min.
D.F.
(Class2)
200% of initial spec. max.
Insulation
Resistance
500MΩ or 25MΩ・μF min.
whichever smaller.
(As for the capacitor of rated
voltage 16V DC, 5MΩ・μF min.)
No mechanical damage.
Capacitance
Characteristics
Class1
C0G
Class2
X5R
X7R
X7S
X7T
Test temp. : 40±2°C
Test humidity : 90~95%RH
Applied voltage : Rated voltage
Test time : 500 +24,0h
Charge/discharge current : 50mA or lower
Leave the capacitors in ambient
condition for
Class 1 : 6~24h
Class 2 : 24±2h before measurement.
Reflow solder the capacitors on a
P.C.Board shown in Appendix2 before
testing.
Q
(Class1)
External
appearance
Test or inspection method
Change from the
value before test
Please contact
with our sales
representative.
Q
(Class1)
350 min.
D.F.
(Class2)
200% of initial spec. max.
Insulation
Resistance
1,000MΩ or 50MΩ・μF min.
whichever smaller.
(As for the capacitor of rated
voltage 16V DC, 10MΩ・μF min.)
Initial value setting (only for class 2)
Voltage conditioning 《After voltage treat
the capacitors under testing temperature
and voltage for 1 hour,》 leave the
capacitors in ambient condition for 24±2h
before measurement.
Use this measurement for initial value.
Test temp. : Maximum operating
temperature±2°C
Applied voltage : Please contact with
our sales representative
Test time : 1,000 +48,0h
Charge/discharge current : 50mA or lower
Leave the capacitors in ambient
condition for
Class 1 : 6~24h
Class 2 : 24±2h before measurement.
Reflow solder the capacitors on a
P.C.Board shown in Appendix2 before
testing.
Initial value setting (only for class 2)
Voltage conditioning 《After voltage
treat the capacitors under testing
temperature and voltage for 1 hour,》
leave the capacitors in ambient
condition for 24±2h before
measurement.
Use this measurement for initial value.
*As for the initial measurement of capacitors (Class2) on number 7, 11 and 12, leave capacitors at
150 0,-10°C for 1 hour and measure the value after leaving capacitors for 24±2h in ambient condition.
―8―
COM-MGC1-003
Appendix1
Appendix2
P.C.Board for bending test
P.C. Board for reliability test
100
100
c
b
b
40
a
40
Solder resist
Slit
a
Solder resist
1.0
c
Copper
(Unit：mm)
Symbol
a
b
c
CKG32K
2.2
5.0
2.9
CKG45K
3.5
6.1
2.9
CKG57K
4.1
7.6
4.7
CKG45N
3.5
6.1
2.9
CKG57N
4.1
7.6
4.7
Case size
1. Material
: Glass Epoxy(As per JIS C6484 GE4)
2. Thickness : 1.6mm
Copper(Thickness:0.035mm)
Solder resist
―9―
Copper
COM-MGC1-003
6. INSIDE STRUCTURE AND MATERIAL
A
A
A’
A’
A－A’
5
7
4
3
6
7
6
5
1
4
2
1
2
MATERIAL
No.
NAME
1
Dielectric
2
Electrode
Class1
Class2
CaZrO 3
BaTiO 3
Nickel (Ni)
3
4
Copper (Cu)
Nickel (Ni)
Termination
5
Tin (Sn)
6
Metal cap joint
High temp solder
7
Metal cap
42 Alloy
— 10 —
3
COM-MGC1-003
7. PACKAGING
Packaging shall be done to protect the components from the damage during transportation and
storing, and a label which has the following information shall be attached.
Tape packaging is as per 11. TAPE PACKAGING SPECIFICATION.
1) Inspection No.*
2) TDK P/N
3) Customer's P/N
4) Quantity
*Composition of Inspection No.
Example
A 9 A – 23 – 001
(a) (b) (c)
(d)
(e)
(a) Line code
(b) Last digit of the year
(c) Month and A for January and B for February and so on. (Skip I)
(d) Inspection Date of the month.
(e) Serial No. of the day
*Composition of new Inspection No.
(Will be implemented on and after May 1, 2019)
Example
I
A 9 E
(a) (b) (c) (d)
2 3 A 0
(e)
(f)
0 1
(g)
(a) Prefix
(b) Line code
(c) Last digit of the year
(d) Month and A for January and B for February and so on. (Skip I)
(e) Inspection Date of the month.
(f) Serial No. of the day(00 ~ ZZ)
(g) Suffix(00 ~ ZZ)
*It is planned to shift to the new inspection No. on and after May 2019,
but the implementation timing may be different depending on shipment bases.
Until the shift is completed, either current or new composition of inspection No. will be applied.
8. RECOMMENDATION
It is recommended to provide a slit (about 1mm wide) in the board under the components
to improve washing Flux.
And please make sure to dry detergent up completely before.
9. SOLDERING CONDITION
Reflow soldering only.
Metal cap is jointed by high temp solder, however the solder temperature must be
less than 250°C to avoid melting the solder.
Please refer to No.5 Soldering in 10.CAUTION for recommended soldering condition.
— 11 —
COM-MGC1-003
10. CAUTION
No.
1
Process
Operating
Condition
(Storage, Use
Transportation)
Condition
1-1. Storage, Use
1) The capacitors must be stored in an ambient temperature of 5 to 40°C with a
relative humidity of 20 to 70%RH. The products should be used within 6 months
upon receipt.
2) The capacitors must be operated and stored in an environment free of dew
condensation and these gases such as Hydrogen Sulphide, Hydrogen Sulphate,
Chlorine, Ammonia and sulfur.
3) Avoid storing in sun light and falling of dew.
4) Do not use capacitors under high humidity and high and low atmospheric
pressure which may affect capacitors reliability.
5) Capacitors should be tested for the solderability when they are stored for long
time.
1-2. Handling in transportation
In case of the transportation of the capacitors, the performance of the capacitors
may be deteriorated depending on the transportation condition.
(Refer to JEITA RCR-2335C 9.2 Handling in transportation)
2
Circuit design
△Caution
!
E
A
2-1. Operating temperature
Operating temperature should be followed strictly within this specification,
especially be careful with maximum temperature.
1) Do not use capacitors above the maximum allowable operating temperature.
2) Surface temperature including self heating should be below maximum operating
temperature.
(Due to dielectric loss, capacitors will heat itself when AC is applied. Especially at
high frequencies around its SRF, the heat might be so extreme that it may damage
itself or the product mounted on. Please design the circuit so that the maximum
temperature of the capacitors including the self heating to be below the maximum
allowable operating temperature. Temperature rise at capacitor surface shall be
below 20°C)
3) The electrical characteristics of the capacitors will vary depending on the
temperature. The capacitors should be selected and designed in taking the
temperature into consideration.
2-2. Operating voltage
1) Operating voltage across the terminals should be below the rated voltage.
When AC and DC are super imposed, V 0-P must be below the rated voltage.
— (1) and (2)
AC or pulse with overshooting, V P-P must be below the rated voltage.
— (3), (4) and (5)
When the voltage is started to apply to the circuit or it is stopped applying, the
irregular voltage may be generated for a transit period because of resonance
or switching. Be sure to use the capacitors within rated voltage containing
these Irregular voltage.
Voltage
(1) DC voltage
(2) DC+AC voltage
(3) AC voltage
R
R
Positional
Measurement
(Rated voltage)
Voltage
R
V 0-P
V 0-P
0
0
R
V P-P
R
(4) Pulse voltage (A)
Positional
V P-P
Measurement
(Rated voltage)
R
(5) Pulse voltage (B)
V P-P
R
R
R
0
— 12 —
0
0
COM-MGC1-003
No.
2
Process
Circuit design
△Caution
!
E
Condition
2) Even below the rated voltage, if repetitive high frequency AC or pulse is applied,
the reliability of the capacitors may be reduced.
A
3) The effective capacitance will vary depending on applied DC and AC voltages.
The capacitors should be selected and designed in taking the voltages into
consideration.
2-3. Frequency
When the capacitors (Class 2) are used in AC and/or pulse voltages, the
capacitors may vibrate themselves and generate audible sound.
3
Designing
P.C.board
The amount of solder at the terminations has a direct effect on the reliability of the
capacitor.
1) The greater the amount of solder, the higher the stress on the chip capacitor,
and the more likely that it will break. When designing a P.C.board, determine
the shape and size of the solder lands to have proper amount of solder on the
terminations.
2) Avoid using common solder land for multiple terminations and provide
individual solder land for each terminations.
3) Size and recommended land dimensions.
Chip capacitors
Solder land
C
Solder resist
B
A
Reflow soldering
（Unit : mm）
Case size
CKG32K
CKG45K
CKG57K
CKG45N
CKG57N
A
2.0 ~ 2.2
3.3 ~ 3.7
3.9 ~ 4.3
3.3 ~ 3.7
3.9 ~ 4.3
B
1.1 ~ 1.3
1.2 ~ 1.5
1.5 ~ 2.0
1.2 ~ 1.5
1.5 ~ 2.0
C
2.3 ~ 2.5
2.7 ~ 3.2
4.5 ~ 5.0
2.7 ~ 3.2
4.5 ~ 5.0
Symbol
— 13 —
COM-MGC1-003
No.
Process
3
Designing
P.C.board
Condition
4)
Recommended chip capacitor layout is as following.
Disadvantage against
bending stress
Advantage against
bending stress
Perforation or slit
Perforation or slit
Mounting
face
Break P.C.board with
mounted side up.
Mount perpendicularly to
perforation or slit
Perforation or slit
Break P.C.board with
mounted side down.
Mount in parallel with
perforation or slit
Perforation or slit
Chip
arrangement
(Direction)
Closer to slit is higher stress
ℓ1
Away from slit is less stress
ℓ2
Distance from
slit
( ℓ1 ＜ ℓ2 )
— 14 —
( ℓ1 ＜ ℓ2 )
COM-MGC1-003
No.
Process
3
Designing
P.C.board
Condition
5) Mechanical stress varies according to location of chip capacitors on the P.C.board.
E
Perforation
D
C
B
A
Slit
The stress in capacitors is in the following order.
A ＞ B=C ＞ D ＞ E
6) Layout recommendation
Use of common
solder land
Example
Chip
Lead wire
Solder
Soldering with
chassis
Use of common
solder land with
other SMD
Chassis
Excessive solder
Solder
land
Need to
avoid
Excessive solder
ℓ1
PCB
Solder land
Solder resist
Lead wire
Missing solder
Solder
land
Solder resist
Recommendation
Solder resist
ℓ2
ℓ2 > ℓ1
— 15 —
COM-MGC1-003
No.
4
Process
Mounting
Condition
4-1. Stress from mounting head
If the mounting head is adjusted too low, it may induce excessive stress in
the chip capacitor to result in cracking. Please take following precautions.
1) Adjust the bottom dead center of the mounting head to reach on the P.C.board
surface and not press it.
2) Adjust the mounting head pressure to be 1 to 3N of static weight.
3) To minimize the impact energy from mounting head, it is important to provide
support from the bottom side of the P.C.board.
See following examples.
Not recommended
Recommended
Crack
Single-sided
mounting
Support pin
Double-sides
mounting
Solder
peeling
Crack
Support pin
When the centering jaw is worn out, it may give mechanical impact on the
capacitor to cause crack. Please control the close up dimension of the
centering jaw and provide sufficient preventive maintenance and replacement
of it.
— 16 —
COM-MGC1-003
No.
Process
Condition
5
Soldering
5-1. Flux selection
Flux can seriously affect the performance of capacitors. Confirm the following to
select the appropriate flux.
1) It is recommended to use a mildly activated rosin flux ( less than 0.1wt%
chlorine ). Strong flux is not recommended.
2) Excessive flux must be avoided. Please provide proper amount of flux.
3) When water-soluble flux is used, enough washing is necessary.
5-2. Recommended soldering profile by various methods
Reflow soldering condition
1) Soldering condition (Preheating temperature, soldering temperature and these
times) is limited to reflow soldering method which is stipulated on the
specification.
2) Chips should be mounted, shortly after a solder is on a P.C.Board.
3) Temperature of metal cap surface must not exceed 250°C.
(Metal frames are jointed by high temp solder, however the solder
temperature must be less than 250°C to avoid melting the solder.)
Reflow soldering
Soldering
Natural cooling
Preheating
Temp.. (°C)
Peak
Temp
0
∆T
Over 60 sec.
Peak Temp time
Manual soldering
(Solder iron)
Temp.. (°C)
280
∆T
Preheating
0
3sec. (As short as possible)
5-3. Recommended soldering peak temp and peak temp duration
Temp./Duration
Reflow soldering
Peak temp(°C)
Duration(sec.)
Sn-Pb Solder
230 max.
20 max.
Lead Free Solder
250 max.
10 max.
Solder
Recommended solder compositions
Lead Free Solder : Sn-3.0Ag-0.5Cu
Sn-Pb Solder : Sn-37Pb
— 17 —
COM-MGC1-003
No.
Process
5
Soldering
Condition
5-4. Avoiding thermal shock
1) Preheating condition
2)
Soldering
Temp. (°C)
Reflow soldering
∆T ≦ 130
Manual soldering
∆T ≦ 130
Cooling condition
Natural cooling using air is recommended. If the chips are dipped into a
solvent for cleaning, the temperature difference (∆T) must be less than 100°C.
5-5. Amount of solder
Excessive solder will induce higher tensile force in chip capacitor when
temperature changes and it may result in chip cracking. In sufficient solder may
detach the capacitor from the P.C.board.
Excessive
solder
Higher tensile force in chip
capacitor to cause crack
Adequate
Low robustness may
cause contact failure or
chip capacitor comes off
the P.C.board.
Insufficient
solder
5-6. Solder repair by solder iron
1) Selection of the soldering iron tip
Tip temperature of solder iron varies by its type, P.C.board material and solder
land size. The higher the tip temperature, the quicker the operation.
However, heat shock may cause a crack in the chip capacitors.
Please make sure the tip temp. before soldering and keep the peak temp and
time in accordance with following recommended condition.
Recommended solder iron condition (Sn-Pb Solder and Lead Free Solder)
Temp. (°C)
Duration (sec.)
Wattage (W)
Shape (mm)
⌀ 3.0 max.
* Please preheat the chip capacitors with the condition in 5-4 to avoid the
thermal shock.
280 max.
3 max.
20 max.
2) Direct contact of the soldering iron with ceramic dielectric of chip capacitors may
cause crack. Do not touch the ceramic dielectric and the terminations by solder
iron.
— 18 —
COM-MGC1-003
No.
Process
5
Soldering
Condition
5-7. Sn-Zn solder
Sn-Zn solder affects product reliability.
Please contact TDK in advance when utilize Sn-Zn solder.
5-8. Countermeasure for tombstone
The misalignment between the mounted positions of the capacitors and the land
patterns should be minimized. The tombstone phenomenon may occur especially the
capacitors are mounted (in longitudinal direction) in the same direction of the reflow
soldering.
(Refer to JEITA RCR-2335C Annex A (Informative) Recommendations to prevent the
tombstone phenomenon)
6
Cleaning
1) If an unsuitable cleaning fluid is used, flux residue or some foreign articles may
stick to chip capacitors surface to deteriorate especially the insulation resistance.
2) If cleaning condition is not suitable, it may damage the chip capacitors.
2)-1. Insufficient washing
(1) Terminal electrodes may corrode by Halogen in the flux.
(2) Halogen in the flux may adhere on the surface of capacitors, and lower the
insulation resistance.
(3) Water soluble flux has higher tendency to have above mentioned problems
(1) and (2).
2)-2. Excessive washing
When ultrasonic cleaning is used, excessively high ultrasonic energy output
can affect the connection between the ceramic chip capacitor's body and the
terminal electrode. To avoid this, following is the recommended condition.
Power : 20 W/ℓ max.
Frequency : 40 kHz max.
Washing time : 5 minutes max.
2)-3. If the cleaning fluid is contaminated, density of Halogen increases, and it may
bring the same result as insufficient cleaning.
7
Coating and
molding of the
P.C.board
1) When the P.C.board is coated, please verify the quality influence on the product.
2) Please verify carefully that there is no harmful decomposing or reaction gas
emission during curing which may damage the chip capacitors.
3) Please verify the curing temperature.
8
Handling after
chip mounted
△Caution
!
E
A
1) Please pay attention not to bend or distort the P.C.board after soldering in
handling otherwise the chip capacitors may crack.
Bend
— 19 —
Twist
COM-MGC1-003
No.
8
Process
Handling after
chip mounted
! Caution
△
A
E
A
Condition
2) Printed circuit board cropping should not be carried out by hand, but by using the
proper tooling. Printed circuit board cropping should be carried out using a board
cropping jig as shown in the following figure or a board cropping apparatus to prevent
inducing mechanical stress on the board.
(1)Example of a board cropping jig
Recommended example: The board should be pushed from the back side, close
to the cropping jig so that the board is not bent and the stress applied to the
capacitor is compressive.
Unrecommended example: If the pushing point is far from the cropping jig and
the pushing direction is from the front side of the board, large tensile stress is
applied to the capacitor, which may cause cracks.
Outline of jig
Printed
circuit
board
Recommended
V-groove
Printed
circuit
board
Direction
of load
Load point
Components
Printed
circuit
board
Load point
Slot
Unrecommended
Direction of
load
Board
cropping jig
V-groove
Components
V-groove
Slot
Slot
(2)Example of a board cropping machine
An outline of a printed circuit board cropping machine is shown below.
The top and bottom blades are aligned with one another along the lines
with the V-grooves on printed circuit board when cropping the board.
Unrecommended example: Misalignment of blade position between top and
bottom, right and left, or front and rear blades may cause a crack in the capacitor.
Outline of machine
Principle of operation
Top blade
Top
blade
Printed circuit board
V-groove
Bottom blade
Printed circuit board
Cross-section diagram
Printed circuit board
V-groove
Top blade
Bottom blade
Unrecommended
Recommended
Top-bottom
misalignment
Left-right
misalignment
Front-rear
misalignment
Top blade
Top blade
Top blade
Bottom blade
Bottom blade
Bottom blade
Top blade
Board
Bottom blade
— 20 —
COM-MGC1-003
No.
8
Process
Handling after
chip mounted
! Caution
△
E
A
Condition
3) When functional check of the P.C.board is performed, check pin pressure tends
to be adjusted higher for fear of loose contact. But if the pressure is excessive
and bend the P.C.board, it may crack the chip capacitor or peel the terminations
off. Please adjust the check pins not to bend the P.C.board.
Item
Not recommended
Recommended
Support
Termination
peeling
Board
bending
Check pin
Check pin
9
Handling of loose
chip capacitor
1) If dropped the chip capacitor may crack. Once dropped do not use it.
Especially, the large case sized chip capacitors are tendency to have cracks
easily, so please handle with care.
Crack
Floor
2) Piling the P.C.board after mounting for storage or handling, the corner of the P.C.
board may hit the chip capacitor of another board to cause crack.
P.C.board
Crack
10
Capacitance aging
The capacitors (Class 2) have aging in the capacitance. They may not be used in
precision time constant circuit. In case of the time constant circuit, the evaluation
should be done well.
11
Estimated life and
estimated failure
rate of capacitors
As per the estimated life and the estimated failure rate depend on the temperature
and the voltage. This can be calculated by the equation described in JEITA
RCR-2335C Annex F (Informative) Calculation of the estimated lifetime and the
estimated failure rate ( Voltage acceleration coefficient : 3 multiplication rule,
Temperature acceleration coefficient : 10°C rule)
The failure rate can be decreased by reducing the temperature and the voltage but
they will not be guaranteed.
— 21 —
COM-MGC1-003
No.
Process
Condition
12
Caution during
operation of
equipment
1) A capacitor shall not be touched directly with bare hands during operation in order to
avoid electric shock.
Electric energy held by the capacitor may be discharged through the human body
when touched with a bare hand.
Even when the equipment is off, a capacitor may stay charged. The capacitor should
be handled after being completely discharged using a resistor.
2) The terminals of a capacitor shall not be short-circuited by any accidental contact
with a conductive object. A capacitor shall not be exposed to a conductive liquid such
as an acid or alkali solution. A conductive object or liquid, such as acid and alkali,
between the terminals may lead to the breakdown of a capacitor due to short circuit
3) Confirm that the environment to which the equipment will be exposed during
transportation and operation meets the specified conditions. Do not to use the
equipment in the following environments.
(1) Environment where a capacitor is spattered with water or oil
(2) Environment where a capacitor is exposed to direct sunlight
(3) Environment where a capacitor is exposed to Ozone, ultraviolet rays or
radiation
(4) Environment where a capacitor exposed to corrosive gas(e.g. hydrogen
sulfide, sulfur dioxide, chlorine. ammonia gas etc.)
(5) Environment where a capacitor exposed to vibration or mechanical shock
exceeding the specified limits.
(6) Atmosphere change with causes condensation
13
Others
! Caution
△
E
A
The products listed on this specification sheet are intended for use in general electronic
equipment (AV equipment, telecommunications equipment, home appliances, amusement
equipment, computer equipment, personal equipment, office equipment, measurement
equipment, industrial robots) under a normal operation and use condition.
The products are not designed or warranted to meet the requirements of the applications
listed below, whose performance and/or quality require a more stringent level of safety or
reliability, or whose failure, malfunction or trouble could cause serious damage to society,
person or property. Please understand that we are not responsible for any damage or
liability caused by use of the products in any of the applications below or for any other use
exceeding the range or conditions set forth in this specification sheet. If you intend to use
the products in the applications listed below or if you have special requirements exceeding
the range or conditions set forth in this specification, please contact us.
(1) Aerospace/Aviation equipment
(2) Transportation equipment (cars, electric trains, ships, etc.)
(3) Medical equipment (Excepting Pharmaceutical Affairs Law classification Class1,2)
(4) Power-generation control equipment
(5) Atomic energy-related equipment
(6) Seabed equipment
(7) Transportation control equipment
(8) Public information-processing equipment
(9) Military equipment
(10) Electric heating apparatus, burning equipment
(11) Disaster prevention/crime prevention equipment
(12) Safety equipment
(13) Other applications that are not considered general-purpose applications
When designing your equipment even for general-purpose applications, you are kindly
requested to take into consideration securing protection circuit/device or providing backup
circuits in your equipment.
— 22 —
COM-MGC1-003
11. TAPE PACKAGING SPECIFICATION
1. CONSTRUCTION AND DIMENSION OF TAPING
1-1. Dimensions of carrier tape
Dimensions of tape shall be according to Appendix 3, 4.
1-2. Bulk part and leader of taping
Trailer(Empty)
160mm min.
Chips
Empty
160mm min.
Leader
Drawing direction
400mm min
1-3. Dimensions of reel
Dimensions of ⌀178 reel shall be according to Appendix 5.
Dimensions of ⌀330 reel shall be according to Appendix 6.
1-4. Structure of taping
Top cover tape
Pitch hole
Cavity (Chip insert)
Plastic carrier tape
2. CHIP QUANTITY
Please refer to detail page on TDK Web.
— 23 —
COM-MGC1-003
3. PERFORMANCE SPECIFICATIONS
3-1. Fixing peeling strength (top tape)
0.05 < Peeling strength < 0.7N
Direction of pulling
Top cover tape
Carrier tape
0～15°
Direction of pulling
3-2. Carrier tape shall be flexible enough to be wound around a minimum radius
of 30mm with components in tape.
3-3. The missing of components shall be less than 0.1%
3-4. Components shall not stick to fixing tape.
3-5. When removing the cover tape, there shall not be difficulties by unfitting clearance
gap, burrs and crushes of cavities. Also the sprocket holes shall not be covered
by absorbing dust into the suction nozzle.
— 24 —
COM-MGC1-003
Appendix 3
Plastic Tape
Cavity (Chip insert)
J
Pitch hole
E
D
C
B
Q
T
F
A
H
G
K
(Unit : mm)
Symbol
A
B
C
D
E
F
( 3.00 )
( 3.90 )
12.0 ± 0.25
5.50 ± 0.05
1.75 ± 0.10
4.00 ± 0.10
G
H
J
K
T
Q
2.00 ± 0.10
4.00 ± 0.10
3.75 max.
0.50 ± 0.05
⌀ 1.65 ± 0.10
Case size
CKG32K
Symbol
Case size
CKG32K
⌀ 1.50
+0.10
0
(
) Reference value.
Exceptionally no hole in the cavity is applied. Please inquire if hole in cavity is mandatory.
— 25 —
COM-MGC1-003
Appendix 4
Plastic Tape
Cavity (Chip insert)
Pitch hole
J
E
D
C
B
G
A
K
H
F
(Unit : mm)
Symbol
A
B
C
D
E
F
( 3.90 )
( 5.60 )
12.0 ± 0.30
5.50 ± 0.10
1.75 ± 0.10
8.00 ± 0.10
( 5.60 )
( 6.60 )
16.0 ± 0.30
7.50 ± 0.10
1.75 ± 0.10
8.00 ± 0.10
G
H
J
K
4.00 ± 0.10
+0.10
⌀ 1.50 0
3.75 max.
2.00 ± 0.10
Case size
CKG45K
CKG45N
CKG57K
CKG57N
Symbol
Case size
CKG45K
CKG45N
CKG57K
2.00 ± 0.10
CKG57N
(
) Reference value.
4.00 ± 0.10
⌀ 1.50
+0.10
0
— 26 —
6.15 max.
4.15 max.
6.15 max.
COM-MGC1-003
Appendix 5
Dimensions of reel (Material : Polystyrene)
W2
E
C
B
D
R
W1
A
(Unit : mm)
Symbol
Case size
CKG32K
Symbol
Case size
CKG32K
A
B
C
D
E
W1
⌀ 178 ± 2.0
⌀ 13 ± 0.5
⌀ 21 ± 0.8
2.0 ± 0.5
13.0 ± 0.3
W2
⌀ 60 ± 2.0
17.0 ± 1.4
1.0
R
Appendix 6
Dimensions of reel (Material : Polystyrene)
E
C
B
D
R
t
W
A
(Unit : mm)
Symbol
A
Case size
CKG32K
⌀ 382 max.
(Nominal
CKG45K, CKG45N
⌀ 330)
CKG57K, CKG57N
Symbol
Case size
CKG32
CKG45K, CKG45N
CKG57K, CKG57N
B
C
⌀ 50 min.
t
R
2.0 ± 0.5
1.0
⌀ 13 ± 0.5
— 27 —
D
⌀ 21 ± 0.8
E
W
2.0 ± 0.5
14.0 ± 1.5
13.5 ± 1.5
17.5 ± 1.5
