ICS-51360
Bottom Port PDM Digital Output Multi-Mode Microphone
APPLICATIONS
GENERAL DESCRIPTION
The ICS-51360 is a multi-mode, low noise digital MEMS
microphone in a small package. The ICS-51360 consists of a
MEMS microphone element and an impedance converter
amplifier followed by a fourth-order Σ-Δ modulator. The digital
interface allows the pulse density modulated (PDM) output of
two microphones to be time multiplexed on a single data line
using a single clock.
The ICS-51360 has multiple modes of operation: Low-Power
(AlwaysOn), Standard and Sleep. The ICS-51360 has high SNR
in all operational modes. It has 130 dB SPL AOP in Standard
Mode and 120 dB SPL AOP in Low-Power mode.
The ICS-51360 is available in a standard 3.5 × 2.65 × 0.98 mm
surface-mount package. It is reflow solder compatible with
no sensitivity degradation.
FUNCTIONAL BLOCK DIAGRAM
FEATURES
SPEC
Sensitivity
SNR
Current
AOP
Clock
−36 dB FS ±1 dB
62 dBA
590 µA
130 dB SPL
2.4 MHz
−36 dB FS ±1 dB
61 dBA
510 µA
130 dB SPL
1.536 MHz
CLK
ICS-51360
−26 dB FS ±1 dB
65 dBA
230 µA
120 dB SPL
768 kHz
TEMP RANGE
PACKAGING
−40°C to +85°C
13” Tape and Reel
DATA
CHANNEL
SELECT
InvenSense reserves the right to change the detail
specifications as may be required to permit
improvements in the design of its products.
LOW-POWER
MODE
3.5 × 2.65 × 0.98 mm surface-mount package
Extended frequency response from 50 Hz to >20 kHz
Sleep Mode: 12 µA
High power supply rejection (PSR): −98 dB FS
Fourth-order Σ-Δ modulator
Digital pulse density modulation (PDM) output
Compatible with Sn/Pb and Pb-free solder processes
RoHS/WEEE compliant
PART
PDM
MODULATOR
STANDARD MODE
SELECT
VDD
GND
POWER
MANAGEMENT
Smartphones
Microphone Arrays
Tablet Computers
Cameras
ORDERING INFORMATION
ICS-51360
ADC
InvenSense Inc.
1745 Technology Drive, San Jose, CA 95110 U.S.A
+1(408) 988–7339
www.invensense.com
Document Number: DS-000094
Revision: 1.0
Release Date: 9/23/2016
ICS-51360
TABLE OF CONTENTS
General Description ..................................................................................................................................................................... 1
Applications ................................................................................................................................................................................. 1
Features ....................................................................................................................................................................................... 1
Functional Block Diagram ............................................................................................................................................................ 1
Ordering Information ................................................................................................................................................................... 1
Table of Contents .................................................................................................................................................................................... 2
Specifications .......................................................................................................................................................................................... 4
Table 1. Acoustical/Electrical Characteristics – General .............................................................................................................. 4
Table 2. Acoustical/Electrical Characteristics – Standard Mode (2.4 MHz) ................................................................................. 4
Table 3. Acoustical/Electrical Characteristics – Standard Mode (1.536 MHz) ............................................................................. 5
Table 4. Acoustical/Electrical Characteristics – Low-Power Mode .............................................................................................. 6
Table 5. Digital Input/Output Characteristics .............................................................................................................................. 6
Table 6. PDM Digital Input/Output .............................................................................................................................................. 7
Timing Diagram ............................................................................................................................................................................ 7
Absolute Maximum Ratings .................................................................................................................................................................... 8
Table 7. Absolute Maximum Ratings ........................................................................................................................................... 8
ESD Caution ................................................................................................................................................................................. 8
Soldering Profile........................................................................................................................................................................... 9
Table 8. Recommended Soldering Profile* .................................................................................................................................. 9
Pin Configurations And Function Descriptions ..................................................................................................................................... 10
Table 9. Pin Function Descriptions............................................................................................................................................. 10
Typical Performance Characteristics ..................................................................................................................................................... 11
Theory Of Operation ............................................................................................................................................................................. 12
PDM Data Format ...................................................................................................................................................................... 12
Table 10. ICS-51360 Channel Setting ......................................................................................................................................... 12
PDM Microphone Sensitivity ..................................................................................................................................................... 12
Applications Information ...................................................................................................................................................................... 14
Low Power Mode ....................................................................................................................................................................... 14
Dynamic Range Considerations ................................................................................................................................................. 14
Connecting PDM Microphones .................................................................................................................................................. 14
Sleep Mode ................................................................................................................................................................................ 16
Start-Up Time ............................................................................................................................................................................. 16
Supporting Documents ......................................................................................................................................................................... 17
Application Notes – General ...................................................................................................................................................... 17
PCB Design And Land Pattern Layout ................................................................................................................................................... 18
PCB Material And Thickness ...................................................................................................................................................... 18
Handling Instructions ............................................................................................................................................................................ 19
Page 2 of 22
Document Number: DS-000094
Revision: 1.0
ICS-51360
Pick And Place Equipment ......................................................................................................................................................... 19
Reflow Solder ............................................................................................................................................................................. 19
Board Wash................................................................................................................................................................................ 19
Outline Dimensions ............................................................................................................................................................................... 20
Ordering Guide .......................................................................................................................................................................... 20
Revision History ......................................................................................................................................................................... 21
Compliance Declaration Disclaimer ...................................................................................................................................................... 22
Page 3 of 22
Document Number: DS-000094
Revision: 1.0
ICS-51360
SPECIFICATIONS
TABLE 1. ACOUSTICAL/ELECTRICAL CHARACTERISTICS – GENERAL
TA = 25°C, VDD = 1.8 to 3.3 V, SCK = 1.536 MHz, 32× decimation, CLOAD = 30 pF unless otherwise noted. Typical specifications are not
guaranteed.
PARAMETER
PERFORMANCE
Directionality
Output Polarity
Supply Voltage (VDD)
Sleep Mode Current (IS)
CONDITIONS
MIN
TYP
MAX
UNITS
NOTES
Omni
Input acoustic pressure vs. output
data
Non-Inverted
1.65
SCK < 200 kHz
3.63
12
V
µA
TABLE 2. ACOUSTICAL/ELECTRICAL CHARACTERISTICS – STANDARD MODE (2.4 MHZ)
TA = 25°C, VDD = 1.8 to 3.3 V, SCK = 2.4 MHz, 50× decimation, CLOAD = 30 pF unless otherwise noted. Typical specifications are not
guaranteed.
PARAMETER
Sensitivity
Signal-to-Noise Ratio (SNR)
Equivalent Input Noise (EIN)
Acoustic Dynamic Range
Total Harmonic Distortion (THD)
Power Supply Rejection (PSR)
Power Supply Rejection—Swept Sine
Acoustic Overload Point
Supply Current (IS)
CONDITIONS
1 kHz, 94 dB SPL
20 kHz bandwidth, A-weighted
20 kHz bandwidth, A-weighted
Derived from EIN and acoustic
overload point
94 dB SPL
217 Hz, 100 mV p-p square wave
superimposed on VDD = 1.8 V, Aweighted
1 kHz sine wave
10% THD
VDD = 1.8 V, no load
VDD = 1.8 V, 19 pF load
MIN
−37
TYP
−36
62
32
MAX
−35
98
0.2
UNITS
dB FS
dBA
dBA SPL
NOTES
1
dB
1
%
−98
dB FS
−110
130
590
670
dB FS
dB SPL
µA
µA
650
730
Note 1: Sensitivity is relative to the RMS level of a sine wave with positive amplitude equal to 100% 1s density and negative amplitude equal to 0% 1s density.
Note 2: The additional current in the loaded condition is independent of the microphone and can be calculated by ILOAD = CLOAD × VDD × fCLK.
Page 4 of 22
Document Number: DS-000094
Revision: 1.0
ICS-51360
TABLE 3. ACOUSTICAL/ELECTRICAL CHARACTERISTICS – STANDARD MODE (1.536 MHZ)
TA = 25°C, VDD = 1.8 to 3.3 V, SCK = 1.536 MHz, 32× decimation, CLOAD = 30 pF unless otherwise noted. Typical specifications are not
guaranteed.
PARAMETER
Sensitivity
Signal-to-Noise Ratio (SNR)
Equivalent Input Noise (EIN)
Acoustic Dynamic Range
Total Harmonic Distortion (THD)
Power Supply Rejection (PSR)
Power Supply Rejection—Swept Sine
Acoustic Overload Point
Supply Current (IS)
CONDITIONS
1 kHz, 94 dB SPL
20 kHz bandwidth, A-weighted
20 kHz bandwidth, A-weighted
Derived from EIN and acoustic
overload point
105 dBs SPL
217 Hz, 100 mV p-p square wave
superimposed on VDD = 1.8 V, Aweighted
1 kHz sine wave
10% THD
VDD = 1.8 V, no load
VDD = 1.8 V, 19 pF load
MIN
−37
TYP
−36
61
33
MAX
−35
97
0.2
UNITS
dB FS
dBA
dBA SPL
NOTES
1
dB
1
%
−94
dB FS
−112
130
510
560
dB FS
dB SPL
µA
µA
570
620
Note 1: Sensitivity is relative to the RMS level of a sine wave with positive amplitude equal to 100% 1s density and negative amplitude equal to 0% 1s density.
Note 2: The additional current in the loaded condition is independent of the microphone and can be calculated by ILOAD = CLOAD × VDD × fCLK.
Page 5 of 22
Document Number: DS-000094
Revision: 1.0
2
ICS-51360
TABLE 4. ACOUSTICAL/ELECTRICAL CHARACTERISTICS – LOW-POWER MODE
TA = 25°C, VDD = 1.8 to 3.3 V, SCK = 768 kHz, 48× decimation, CLOAD = 30 pF unless otherwise noted. Typical specifications are not
guaranteed.
PARAMETER
Sensitivity
Signal-to-Noise Ratio (SNR)
Equivalent Input Noise (EIN)
Acoustic Dynamic Range
Total Harmonic Distortion (THD)
Power Supply Rejection (PSR)
Power Supply Rejection—Swept Sine
Acoustic Overload Point
Supply Current (IS)
CONDITIONS
1 kHz, 94 dB SPL
8 kHz bandwidth, A-weighted
8 kHz bandwidth, A-weighted
Derived from EIN and acoustic
overload point
105 dB SPL
217 Hz, 100 mV p-p square wave
superimposed on VDD = 1.8 V, Aweighted
1 kHz sine wave
10% THD
VDD = 1.8 V, no load
VDD = 1.8 V, 19 pF load
MIN
−27
TYP
−26
65
29
MAX
−25
91
UNITS
dB FS
dBA
dBA SPL
NOTES
1
dB
0.2
1
%
−91
dB FS
−102
120
230
255
dB FS
dB SPL
µA
µA
255
280
2
Note 1: Sensitivity is relative to the RMS level of a sine wave with positive amplitude equal to 100% 1s density and negative amplitude equal to 0% 1s density.
Note 2: The additional current in the loaded condition is independent of the microphone and can be calculated by ILOAD = CLOAD × VDD × fCLK.
TABLE 5. DIGITAL INPUT/OUTPUT CHARACTERISTICS
TA = 25°C, 1.8 V < VDD < 3.3 V, unless otherwise noted.
PARAMETER
CONDITIONS
MIN
Input Voltage High (VIH)
TYP
0.65 × VDD
0.35 × VDD
Output Voltage High (VOH)
ILOAD = 0.5 mA
Output Voltage Low (VOL)
ILOAD = 0.5 mA
Output DC Offset
Latency
Percent of full scale
0.7 × VDD
3
400
kHz, output within 1 dB of final sensitivity,
power on
Between Low-Power and Standard Modes
Wake-Up Time
Switching time
INPUT
tCLKIN
592
Input clock period
Sleep Mode
Clock Frequency (CLK)
690
Low-Power Mode
1.00
Standard Mode
Clock Duty Cycle
tRISE
tFALL
OUTPUT
t1OUTEN
t1OUTDIS
t2OUTEN
t2OUTDIS
fCLK < 2.65 MHz
fCLK > 2.65 MHz
CLK rise time (10% to 90% level)
CLK fall time (90% to 10% level)
40
48
DATA1 (right) driven after falling clock edge
DATA1 (right) disabled after rising clock
edge
DATA2 (left) driven after rising clock edge
DATA2 (left) disabled after falling clock
edge
40
10
23
40
10
23
ns
ns
Note 1: Guaranteed by design
TIMING DIAGRAM
tCLKIN
CLK
tFALL
tRISE
t1OUTEN
t1OUTDIS
DATA1
t2OUTDIS
DATA2
t2OUTEN
Figure 1. Pulse Density Modulated Output Timing
Page 7 of 22
Document Number: DS-000094
Revision: 1.0
ns
ns
1
1
ICS-51360
ABSOLUTE MAXIMUM RATINGS
Stress above those listed as Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only
and functional operation of the device at these conditions is not implied. Exposure to the absolute maximum ratings conditions for
extended periods may affect device reliability.
TABLE 7. ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
−0.3 V to +3.63 V
Supply Voltage (VDD)
Digital Pin Input Voltage
Sound Pressure Level
−0.3 V to VDD + 0.3 V or 3.63 V, whichever is less
160 dB
Mechanical Shock
10,000 g
Vibration
Per MIL-STD-883 Method 2007, Test Condition B
Temperature Range
Biased
Storage
−40°C to +85°C
−55°C to +150°C
ESD CAUTION
ESD (electrostatic discharge) sensitive device.
Charged devices and circuit boards can
discharge without detection. Although this
product features patented or proprietary
protection circuitry, damage may occur on
devices subjected to high energy ESD.
Therefore proper ESD precautions should be
taken to avoid performance degradation or
loss of functionality.
Page 8 of 22
Document Number: DS-000094
Revision: 1.0
ICS-51360
SOLDERING PROFILE
CRITICAL ZONE
TL TO TP
tP
TP
TEMPERATURE
RAMP-UP
TL
tL
TSMAX
TSMIN
tS
RAMP-DOWN
PREHEAT
t25°C TO PEAK TEMPERATURE
TIME
Figure 2. Recommended Soldering Profile Limits
TABLE 8. RECOMMENDED SOLDERING PROFILE*
PROFILE FEATURE
Average Ramp Rate (TL to TP)
Sn63/Pb37
1.25°C/sec max
Pb-Free
1.25°C/sec max
100°C
100°C
150°C
200°C
60 sec to 75 sec
60 sec to 75 sec
Ramp-Up Rate (TSMAX to TL)
1.25°C/sec
1.25°C/sec
Time Maintained Above Liquidous (tL)
45 sec to 75 sec
~50 sec
Liquidous Temperature (TL)
Peak Temperature (TP)
183°C
217°C
215°C +3°C/−3°C
260°C +0°C/−5°C
Time Within +5°C of Actual Peak
Temperature (tP)
20 sec to 30 sec
20 sec to 30 sec
Ramp-Down Rate
3°C/sec max
3°C/sec max
Time +25°C (t25°C) to Peak Temperature
5 min max
5 min max
Preheat
Minimum Temperature
(TSMIN)
Minimum Temperature
(TSMIN)
Time (TSMIN to TSMAX), tS
*The reflow profile in Table 8 is recommended for board manufacturing with InvenSense MEMS microphones. All microphones are
also compatible with the J-STD-020 profile
Page 9 of 22
Document Number: DS-000094
Revision: 1.0
ICS-51360
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
Figure 3. Pin Configuration (Top View, Terminal Side Down)
TABLE 9. PIN FUNCTION DESCRIPTIONS
PIN
NAME
FUNCTION
1
DATA
Digital Output Signal (DATA1 or DATA2)
2
SELECT
3
GND
Left Channel or Right Channel Select:
DATA 1 (right): SELECT tied to GND
DATA 2 (left): SELECT tied to VDD. In this setting, SELECT should be tied to the same voltage
source as the VDD pin.
Ground
4
CLK
Clock Input to Microphone
5
VDD
Power Supply. For best performance and to avoid potential parasitic artifacts, place a 0.1 µF
(100 nF) ceramic type X7R capacitor between Pin 5 (VDD) and ground. Place the capacitor as
close to Pin 5 as possible.
Page 10 of 22
Document Number: DS-000094
Revision: 1.0
ICS-51360
TYPICAL PERFORMANCE CHARACTERISTICS
30
Standard Mode
10
10
THD+N (%)
NORMALIZED AMPLITUDE (dB)
Low Power Mode
20
0
1
-10
-20
0.1
100
1000
10000
90
FREQUENCY (Hz)
-20
PSR (dB FS)
-40
-60
-80
-100
-120
10000
FREQUENCY (Hz)
Figure 6. Power Supply Rejection (PSR) vs. Frequency, Standard
Mode
Page 11 of 22
Document Number: DS-000094
Revision: 1.0
120
130
Figure 5. THD + N vs. Input Level, Standard and Low-Power Modes
0
1000
110
INPUT AMPLITUDE (dB SPL)
Figure 4. Typical Audio Frequency Response, Standard Mode
100
100
ICS-51360
THEORY OF OPERATION
PDM DATA FORMAT
The output from the DATA pin of the ICS-51360 is in pulse density modulated (PDM) format. This data is the 1-bit output of a fourthorder Σ-Δ modulator. The data is encoded so that the left channel is clocked on the falling edge of CLK, and the right channel is clocked
on the rising edge of CLK. After driving the DATA signal high or low in the appropriate half frame of the CLK signal, the DATA driver of
the microphone tristates. In this way, two microphones, one set to the left channel and the other to the right, can drive a single DATA
line. See Figure 1 for a timing diagram of the PDM data format; the DATA1 and DATA2 lines shown in this figure are two halves of the
single physical DATA signal. Figure 7 shows a diagram of the two stereo channels sharing a common DATA line.
CLK
DATA2 (L)
DATA
DATA1 (R)
DATA2 (L)
DATA1 (R)
Figure 7. Stereo PDM Format
If only one microphone is connected to the DATA signal, the output is only clocked on a single edge (Figure 8). For example, a left
channel microphone is never clocked on the rising edge of CLK. In a single microphone application, each bit of the DATA signal is
typically held for the full CLK period until the next transition because the leakage of the DATA line is not enough to discharge the line
while the driver is tristated.
CLK
DATA
DATA1 (R)
DATA1 (R)
DATA1 (R)
Figure 8. Mono PDM Format
See Table 10 for the channel assignments according to the logic level on the SELECT pin. The setting on the SELECT pin is sampled at
power-up and should not be changed during operation.
TABLE 10. ICS-51360 CHANNEL SETTING
SELECT Pin Setting
Low (tie to GND)
High (tie to VDD)
Channel
Right (DATA1)
Left (DATA2)
For PDM data, the density of the pulses indicates the signal amplitude. A high density of high pulses indicates a signal near positive
full scale, and a high density of low pulses indicates a signal near negative full scale. A perfect zero (dc) audio signal shows an
alternating pattern of high and low pulses.
The output PDM data signal has a small dc offset of about 3% of full scale. A high-pass filter in the codec that is connected to the digital
microphone and does not affect the performance of the microphone typically removes this dc signal.
PDM MICROPHONE SENSITIVITY
The sensitivity of a PDM output microphone is specified with the unit dB FS (decibels relative to digital full scale). A 0 dB FS sine
wave is defined as a signal whose peak just touches the full-scale code of the digital word (see Figure 9). This measurement convention
also means that signals with a different crest factor may have an RMS level higher than 0 dB FS. For example, a full-scale square wave
has an RMS level of 3 dB FS.
Page 12 of 22
Document Number: DS-000094
Revision: 1.0
ICS-51360
This definition of a 0 dB FS signal must be understood when measuring the sensitivity of the ICS-51360. A 1 kHz sine wave at a
94 dB SPL acoustic input to the ICS-51360 results in an output signal with a −26 dB FS level (low power mode). The output digital
word peaks at −26 dB below the digital full-scale level. A common misunderstanding is that the output has an RMS level of −29 dB FS;
however, this is not true because of the definition of the 0 dB FS sine wave.
1.0
0.8
DIGITAL AMPLITUDE (D)
0.6
0.4
0.2
0
–0.2
–0.4
–0.6
–0.8
–1.0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
TIME (ms)
Figure 9. 1 kHz, 0 dB FS Sine Wave
There is not a commonly accepted unit of measurement to express the instantaneous level, as opposed to the RMS level of the
signal, of a digital signal output from the microphone. Some measurement systems express the instantaneous level of an individual
sample in units of D, where 1.0 D is digital full scale. In this case, a −26 dB FS sine wave has peaks at 0.05 D.
Page 13 of 22
Document Number: DS-000094
Revision: 1.0
ICS-51360
APPLICATIONS INFORMATION
LOW POWER MODE
Low Power Mode (LPM) enables the ICS-51360 to be used in an AlwaysOn listening mode for keyword spotting and ambient sound
analysis. The ICS-51360 will enter LPM when the frequency of SCK is 768 kHz. In this mode, the microphone consumes only 230 µA
while retaining high electro-acoustic performance.
When one microphone is in LPM for AlwaysOn listening, a second microphone sharing the same data line may be powered down. In
this case, where one microphone is powered up and another is powered down by disabling the VDD supply or in sleep mode by
reducing the frequency of a separate clock source, the disabled microphone does not present a load to the signal on the LPM
microphone’s DATA pin.
DYNAMIC RANGE CONSIDERATIONS
The microphone clips (THD = 10%) at 120 dB SPL in Low Power Mode and at 130 dB SPL in Standard Mode (see Figure 5); however, it
continues to output an increasingly distorted signal above that point. The peak output level, which is controlled by the modulator, limits
at 0 dB FS.
To fully use the 98 dB dynamic range of the output data of the ICS-51360 in a design, the digital signal processor (DSP), analog-to-digital
converter (ADC), or codec circuit following it must be chosen carefully. The decimation filter that inputs the PDM signal from the ICS51360 must have a dynamic range sufficiently better than the dynamic range of the microphone so that the overall noise
performance of the system is not degraded. If the decimation filter has a dynamic range of 10 dB better than the microphone, the
overall system noise only degrades by 0.4 dB. This 108 dB filter dynamic range requires the filter to have at least 18 bit resolution.
CONNECTING PDM MICROPHONES
A PDM output microphone is typically connected to a codec with a dedicated PDM input. This codec separately decodes the left and right
channels and filters the high sample rate modulated data back to the audio frequency band. This codec also generates the clock for the
PDM microphones or is synchronous with the source that is generating the clock. Figure 10 and Figure 11 show mono and stereo
connections of the ICS-51360 to a codec. The mono connection shows an ICS-51360 set to output data on the right channel. To output
on the left channel, tie the SELECT pin to VDD instead of tying it to GND.
1.8V TO 3.3V
0.1µF
VDD
PDM
MICROPHONE
SELECT
CODEC
CLOCK OUTPUT
CLK
DATA
DATA INPUT
GND
Figure 10. Mono PDM Microphone (Right Channel) Connection to Codec
Page 14 of 22
Document Number: DS-000094
Revision: 1.0
ICS-51360
1.8V TO 3.3V
0.1µF
VDD
CODEC
CLK
PDM
MICROPHONE
SELECT
CLOCK OUTPUT
DATA
DATA INPUT
GND
1.8V TO 3.3V
0.1µF
VDD
PDM
MICROPHONE
SELECT
CLK
DATA
GND
Figure 11. Stereo PDM Microphone Connection to Codec
Decouple the VDD pin of the ICS-51360 to GND with a 0.1 µF capacitor. Place this capacitor as close to VDD as the printed circuit board
(PCB) layout allows.
Do not use a pull-up or pull-down resistor on the PDM data signal line because it can pull the signal to an incorrect state during the period
that the signal line is tristated.
The DATA signal does not need to be buffered in normal use when the ICS-51360 microphone(s) is placed close to the codec on the PCB. If
the DATA signal must be driven over a long cable (>15 cm) or other large capacitive load, a digital buffer may be required. Only use a signal
buffer on the DATA line when one microphone is in use or after the point where two microphones are connected (see Figure 12). The
DATA output of each microphone in a stereo configuration cannot be individually buffered because the two buffer outputs cannot
drive a single signal line. If a buffer is used, take care to select one with low propagation delay so that the timing of the data
connected to the codec is not corrupted.
CODEC
PDM MICROPHONE
CLK
CLOCK OUTPUT
DATA
DATA INPUT
PDM MICROPHONE
CLK
DATA
Figure 12. Buffered Connections Between Stereo ICS-51360s and a Codec
Page 15 of 22
Document Number: DS-000094
Revision: 1.0
ICS-51360
When long wires are used to connect the codec to the ICS-51360, a source termination resistor can be used on the clock output of the
codec instead of a buffer to minimize signal overshoot or ringing. Match the value of this resistor to the characteristic impedance of
the CLK trace on the PCB. Depending on the drive capability of the codec clock output, a buffer may still be needed, as shown in Figure
12.
SLEEP MODE
The microphone enters sleep mode when the clock frequency falls below 200 kHz. In this mode, the microphone data output is in a high
impedance state. The current consumption in sleep mode is 12 µA.
The microphone wakes up from sleep mode and begins to output data within 10 ms after the clock becomes active. The wake-up time
indicates the time from when the clock is enabled to when the ICS-51360 outputs data within 1 dB of its settled sensitivity.
START-UP TIME
The start-up time of the ICS-51360 is less than 20 ms, measured by the time from when power and clock are enabled until sensitivity
of the output signal is within 1 dB of its settled sensitivity.
Page 16 of 22
Document Number: DS-000094
Revision: 1.0
ICS-51360
SUPPORTING DOCUMENTS
For additional information, see the following documents.
APPLICATION NOTES – GENERAL
AN-000048, PDM Digital Output MEMS Microphone Flex Evaluation Board User Guide
AN-100, MEMS Microphone Handling and Assembly Guide
AN-1003, Recommendations for Mounting and Connecting the Invensense, Bottom-Ported MEMS Microphones
AN-1112, Microphone Specifications Explained
AN-1124, Recommendations for Sealing InvenSense Bottom-Port MEMS Microphones from Dust and Liquid Ingress
AN-1140, Microphone Array Beamforming
Page 17 of 22
Document Number: DS-000094
Revision: 1.0
ICS-51360
PCB DESIGN AND LAND PATTERN LAYOUT
The recommended PCB land pattern for the ICS-51360 is a 1:1 ratio of the solder pads on the microphone package, as shown in Figure
13. Avoid applying solder paste to the sound hole in the PCB. A suggested solder paste stencil pattern layout is shown in Figure 14.
The response of the ICS-51360 is not affected by the PCB hole size as long as the hole is not smaller than the sound port of the
microphone (0.375 mm in diameter). A 0.5 mm to 1 mm diameter for the hole is recommended. Take care to align the hole in the
microphone package with the hole in the PCB. The exact degree of the alignment does not affect the microphone performance as long
as the holes are not partially or completely blocked.
0.522x0.725(4X)
Ø1.625
Ø1.025
1.675
0.838
0.822
1.252
Figure 13. Recommended PCB Land Pattern Layout
0.422x0.625(4X)
Ø1.625
Ø1.125
1.675
0.1(4x)
0.822
1.252
Figure 14. Suggested Solder Paste Stencil Pattern Layout
PCB MATERIAL AND THICKNESS
The performance of the ICS-51360 is not affected by PCB thickness. The ICS-51360 can be mounted on either a rigid or flexible PCB.
A flexible PCB with the microphone can be attached directly to the device housing with an adhesive layer. This mounting method
offers a reliable seal around the sound port while providing the shortest acoustic path for good sound quality.
Page 18 of 22
Document Number: DS-000094
Revision: 1.0
ICS-51360
HANDLING INSTRUCTIONS
PICK AND PLACE EQUIPMENT
The MEMS microphone can be handled using standard pick-and-place and chip shooting equipment. Take care to avoid damage to the
MEMS microphone structure as follows:
Use a standard pickup tool to handle the microphone. Because the microphone hole is on the bottom of the package, the
pickup tool can make contact with any part of the lid surface.
Do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone.
Do not pull air out of or blow air into the microphone port.
Do not use excessive force to place the microphone on the PCB.
REFLOW SOLDER
For best results, the soldering profile must be in accordance with the recommendations of the manufacturer of the solder paste used to
attach the MEMS microphone to the PCB. It is recommended that the solder reflow profile not exceed the limit conditions specified
in Figure 2 and Table 8.
BOARD WASH
When washing the PCB, ensure that water does not make contact with the microphone port. Do not use blow-off procedures or
ultrasonic cleaning.
Page 19 of 22
Document Number: DS-000094
Revision: 1.0
ICS-51360
OUTLINE DIMENSIONS
d 0.10 (4X)
3.50
0.522X0.725 (4x)
j 0.10m C A B
A
PIN1
CORNER
PIN1
CORNER
0.82
ø 1.625
ø 1.025
(2.45)
2.65
1
2
5
4
ø 0.325
1.68
3
B
(3.30)
(0.125)
0.300
(0.125)
1.51
BOTTOM VIEW
TOP VIEW
f 0.10 C
0.98±0.10
(0.254)
C
SIDE VIEW
Figure 15. 5-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV]
3.5 mm × 2.65 mm × 0.98 mm Body
Dimensions shown in millimeters
Dimension tolerance is ±0.15 mm unless otherwise specified
PART NUMBER
PIN 1 INDICATION
1360
YYXXX
DATE CODE
LOT TRACEABILITY CODE
Figure 16. Package Marking Specification (Top View)
ORDERING GUIDE
PART
TEMP RANGE
PACKAGE
QUANTITY
PACKAGING
ICS-51360
−40°C to +85°C
5-Terminal LGA_CAV
10,000
13” Tape and Reel
Page 20 of 22
Document Number: DS-000094
Revision: 1.0
1.04
1.33
ICS-51360
REVISION HISTORY
REVISION DATE
REVISION
DESCRIPTION
9/23/2016
1.0
Initial version
Page 21 of 22
Document Number: DS-000094
Revision: 1.0
ICS-51360
COMPLIANCE DECLARATION DISCLAIMER
InvenSense believes the environmental and other compliance information given in this document to be correct but cannot
guarantee accuracy or completeness. Conformity documents substantiating the specifications and component characteristics are on
file. InvenSense subcontracts manufacturing, and the information contained herein is based on data received from vendors and
suppliers, which has not been validated by InvenSense.
This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by
InvenSense for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications
are subject to change without notice. InvenSense reserves the right to make changes to this product, including its circuits and
software, in order to improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither
expressed nor implied, regarding the information and specifications contained in this document. InvenSense assumes no
responsibility for any claims or damages arising from information contained in this document, or from the use of products and
services detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights,
mask work and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by
implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information
previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors
should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons
or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment,
transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime
prevention equipment.
©2016 InvenSense, Inc. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion,
MotionApps, DMP, AAR and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be
trademarks of the respective companies with which they are associated.
©2016 InvenSense, Inc. All rights reserved.
Page 22 of 22
Document Number: DS-000094
Revision: 1.0
工商网监
湘ICP备2023018690号
