Document Number: EB_ARMAT91_XXAXX_B
Revision: 1.2
Release Date: 08/11/2010
ARM Reference Board
Application Note
InvenSense ARM Reference Board
Application Note
A printed copy of this document is NOT UNDER
REVISION CONTROL unless it is dated and stamped
in red ink as, “REVISION CONTROLLED COPY.”
InvenSense, Inc., 1197 Borregas Ave., Sunnyvale, Ca 94089, USA
Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104
Website: http//www.invensense.com
1
EB_ARMAT91_XXAXX_B
©2010 InvenSense, Inc. All rights reserved.
Document Number: EB_ARMAT91_XXAXX_B
Revision: 1.2
Release Date: 08/11/2010
ARM Reference Board
Application Note
1. Revision History
Date
Revision
Description
05/26/2010
1.0
Initial release
06/23/2010
1.1
Updated BOM, added mechanical drawings for select
components, added firmware revision note.
08/11/2010
1.2
Updated firmware revision in Section 10.
InvenSense, Inc., 1197 Borregas Ave., Sunnyvale, Ca 94089, USA
Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104
Website: http//www.invensense.com
2
EB_ARMAT91_XXAXX_B
©2010 InvenSense, Inc. All rights reserved.
Document Number: EB_ARMAT91_XXAXX_B
Revision: 1.2
Release Date: 08/11/2010
ARM Reference Board
Application Note
CONTENTS
1.
REVISION HISTORY ....................................................................................................................................... 2
2.
PURPOSE ..................................................................................................................................................... 4
3.
USAGE ......................................................................................................................................................... 4
4.
OTHER DOCUMENTS ..................................................................................................................................... 4
5.
SCHEMATIC .................................................................................................................................................. 5
6.
BOARD PHOTO ............................................................................................................................................. 6
7.
COMPONENT LAYER SILK SCREEN................................................................................................................. 7
8.
TABLE 1. BILL OF MATERIALS (PARTS STUFFING LIST) .................................................................................... 8
9.
MECHANICAL DRAWINGS FOR SELECTED BOM ITEMS .................................................................................... 9
10. PROGRAMMING THE ARM AT91 MCU......................................................................................................... 11
InvenSense, Inc., 1197 Borregas Ave., Sunnyvale, Ca 94089, USA
Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104
Website: http//www.invensense.com
3
EB_ARMAT91_XXAXX_B
©2010 InvenSense, Inc. All rights reserved.
Document Number: EB_ARMAT91_XXAXX_B
Revision: 1.2
Release Date: 08/11/2010
ARM Reference Board
Application Note
2. Purpose
This document describes the hardware and circuitry of the RB_ARMAT91_XXAXX_A reference board (also
known as InvenSense ARM board).
3. Usage
This reference board provides a bridge function between InvenSense evaluation boards and a PC. It
connects to a PC via USB and to InvenSense evaluation boards via SPI or I2C. The figure below shows the
ARM board connecting an IMU-3000 evaluation board to a Windows PC. (Note that the ARM board is used
as a general-purpose bridge and can also be used with other InvenSense EVBs, including the ITG-3xxx and
MPU-3xxx family of devices.) The ARM processor on the reference board is not meant to be reprogrammed
by the user. It contains all code necessary to be used in conjunction InvenSense evaluation boards. Note
that separate demonstration software may accompany the individual evaluation boards with which this
device connects.
Figure 1. Example of ARM Board Used as Bridge between PC and IMU-3000 Evaluation Board. Note that
the ARM board is used as a general-purpose bridge and can also be used with other InvenSense EVBs,
including the ITG-3xxx and MPU-3xxx family of devices.
4. Other Documents
Since the ARM board is meant to bridge between InvenSense evaluation boards and a PC, this document
should be used in conjunction with the documents related to the particular board that is being used with the
ARM Board.
InvenSense, Inc., 1197 Borregas Ave., Sunnyvale, Ca 94089, USA
Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104
Website: http//www.invensense.com
4
EB_ARMAT91_XXAXX_B
©2010 InvenSense, Inc. All rights reserved.
5
4
ARM_3V0
S
2
1
Q1
DNS_P-MOS SI2301ADS/SOT23
SOT23GSD
ARM_3V0
BP1
0.1uF
USB_DP_PUP
G
S
G
D
D
DM
DP
TDI
TDO
TMS
33
49
51
53
TDI
TDO
TMS
TCK
39
40
50
55
RST
TEST MODE
JTAG_SEL
ERASE
9
10
13
16
3
4
5
6
AD0/ PA17/ PGMD5
AD1/ PA18/ PGMD6
AD2/ PA19/ PMGD7
AD3/ PA20/ PGMD8
AD4
AD5
AD6
AD7
ARM_3V0
1
NRST
2
4
JP4
HEADER 3X2, Male, 180D, 2.0mmx2.0mm
1
ARM_3V0
1
3
TST
JTAGSEL
ERASE
C9
10uF/0603
ADC_VREF
1
DC 5V
@1A
1
2
3
1
2
BP15
0.1uF
JP6
DNS_HEADER 2, 100mil
GND
EN
NC
ARM_3V0
BP14
0.1uF
4
3V3@0.6A
AD4
AD6
PA18
PA19
PA23
3
1
1
3
5
7
9
11
13
15
17
19
2
4
6
8
10
12
1
3
5
7
9
11
AD5
AD7
PA21
PA22
PA24
ARM_3V0
R16
DNS_0/0402
JP9
HEADER 3
1
2
3
BP16
0.1uF
ARM_3V0
1
ARM_3V0
A
I2C
1
2
3
4
PA4_SCL
PA3
1
C13
DNS_10pF/0402
Y1
Crystal 18.432MHz@50ppm, SMD5032
JP3
DNS_WAFER 4, 2.0mm , 90D
B
ARM_3V0
R50
0R/0402
R51
0R/0402
PA14_CLK
PA13_MOSI
PA12_MISO
A
User Header
(Female)
Invensense
1197 Borregas Ave
TP1
Sunnyvale, CA 94089
TEST-POINT
H1
1
4
2
R45
2K/0402
1
PA11_/SPI_CS
PA30_INT2
PA7_D_IO
PA20_INT1
PA17_TEMP
USB_5V
JP14
JP2P1_8X1_3S
4
C
JP1
WAFER 4, 2.0mm , 90D
1
PA4
PA3
PA2
PA1
PA0
3
C12
DNS_10pF/0402
1
JP13
JP2P1_8X1_3S
1
UART
for
Debug
1
2
3
4
R46
2K/0402
JP7
HEADER 10X2, Female, 90D, 2.54mmx2.54mm
1
JP8
DNS_HEADER 6X2, Male, 180D, 2.0mmx2.0mm
2
4
6
8
10
12
14
16
18
20
C
VDD_FLASH
VDDIO
VDDIO
VDDIO
A
ARM_3V0
TXD
RXD
1
USB_5V
Reserved
5
R8
510/0402
1
PA6_HPS
SW2
PUSH SW
TSW2P7_1X6_6
1
R15
100K/1%/0402
1
A
1
ARM_3V0
C14
10uF/0603
1
LED_GRN_0805
PA24
PA23
PA22
PA21
2
U2
YB1231ST25X330
SOT235
Vin OUT 5
R11
1K/0603
LED1
R14
1M/0603
C11
0.01uF/25V/0402
1
USB_5V
LED_RED_0805
ARM_3V0
R13
100/0603
R12
1.5K/0402
BP13
0.1uF
ARM_3V0
JP5
DNS_HEADER 3X2, Male, 180D, 2.0mmx2.0mm
BP12
0.1uF
1
L4
BEAD/0603
L0603
PLL_RC
XOUT
1
3
5
52
42
41
38
37
26
25
23
15
14
11
19
20
21
22
27
28
29
30
31
32
34
35
36
43
44
47
48
LED2
ARM_3V0
XIN
2
4
6
for
Debug
PUSH SW
TSW2P7_1X6_6
B
ADC_VREF
ARM_3V0
R10
100K/1%/0402
SW1
AD4
AD5
AD6
AD7
63
TDO
2
4
6
8
TDI
TMS
TCK
PA18
PA19
C10
1000pF/0402
R9
0/0402
RTCK
H/W
Reset
AD3
RP1
10Kx4/0603
1
CON2
DNS_DC-JACK
1
3
2
JTAGSEL
ERASE
PA31
PA30
PA29
PA28
PA27
PA26
PA25
PA24
PA23
PA22
PA21
PA16
PA15
PA14
PA13
PA12
PGMM3/PA11
PGMM2/PA10
PGMM1/PA9
PGMM0/PA8
PGMNVALID/PA7
PGMNOE/PA6
PGMNRDY/PA5
PGMNCMD/PA4
PA3
PGMEN2/PA2
PGMEN1/PA1
PGMEN0/PA0
D
C
VDDPLL
56
57
AD0
1
2
3
4
5
6
7
8
9
10
JTAG
NRST
TST
R7
330K/0402
59
58
45
18
7
64
USB_DM
USB_DP
1
5
3
1
1
1
3
5
7
C
R6
330K/0402
VDD_IN
A1V8_PLL
R2
33K/0402
GND
GND
GND
GND
TCK
VDDCORE
VDDCORE
VDDCORE
U1
AT91SAM7S256
64S.5\470
2
17
46
60
C8
15PF/0402
1
1
ARM_3V0
JP2
HEADER 10x1, Female, 180D, 2.0mm
C1
10uF/0603
USB_5V
USB_5V
R1
22K/0402
4
C7
15PF/0402
12
24
54
XOUT
2
R5
22/0402
1
BP11
0.1uF
VDD_OUT
PGMCK/XIN
BP10
0.1uF
8
61
BP8
0.1uF
1
REG_1V8
R4
22/0402
3
2
1
2
2
1
2
3
4
5
1
L3
USB CHOKE DLW21HN900SQ2L
USB_D4
USB_D+
1
C6
33pF/0402
BP9
0.1uF
C5
10uF/0603
1
L0603
PLLRC
L2
BEAD/0603
62
2
8
9
NC2
NC1
R3
1.5K/0402
1
VBUS
DM
DP
ID
GND
A1V8_PLL
BP7
0.1uF
C4
10uF/0603
6
7
NC3
NC4
C3
10uF/0603
BP5
0.1uF
PWR On
CON1
miniUSB-A
BP6
0.1uF
VBUS_DET
ARM_3V0
S
USB_5V
C2
100pF/0402
BP4
0.1uF
1
G
L0603
BP3
0.1uF
D
D
L1
BEAD/0603
BP2
0.1uF
6
4
2
ARM_3V0
R49
0R/0402
3
H2
H3
H4
M1
M2
1
Title
Size
Phone: 408-988-7339
Fax: 408-988-8104
www.invensense.com
Document Number
Date:
3
InvenSense, Inc., 1197 Borregas Ave., Sunnyvale, CA 94089, USA
5
Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104 ©2010 InvenSense, Inc. All rights reserved.
Website: http://www.invensense.com
2
Rev
Sheet
1
1
ARM Reference Board
Application Note
Rev 1.2; 08/11/2010
of
1
Document Number: EB_ARMAT91_XXAXX_B
Revision: 1.2
Release Date: 08/11/2010
ARM Reference Board
Application Note
6. Board Photo
Figure 3. Component-layer board photo
InvenSense, Inc., 1197 Borregas Ave., Sunnyvale, Ca 94089, USA
Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104
Website: http//www.invensense.com
6
EB_ARMAT91_XXAXX_B
©2010 InvenSense, Inc. All rights reserved.
Document Number: EB_ARMAT91_XXAXX_B
Revision: 1.2
Release Date: 08/11/2010
ARM Reference Board
Application Note
7. Component Layer Silk Screen
Figure 4. Component-layer silk screen
InvenSense, Inc., 1197 Borregas Ave., Sunnyvale, Ca 94089, USA
Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104
Website: http//www.invensense.com
7
EB_ARMAT91_XXAXX_B
©2010 InvenSense, Inc. All rights reserved.
Document Number: EB_ARMAT91_XXAXX_B
Revision: 1.2
Release Date: 08/11/2010
ARM Reference Board
Application Note
8. Table 1. Bill of Materials (Parts Stuffing List)
Item
Quantity
Reference
1
16
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
1
1
6
1
1
2
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
3
1
1
1
1
1
2
2
2
1
4
1
2
1
1
1
2
1
1
BP1,BP2,BP3,BP4,BP5,BP6,BP7,BP8,BP9,
BP10,BP11,BP12,BP13,BP14,BP15,BP16
CON1
CON2 (DO NOT STUFF)
C1,C3,C4,C5,C9,C14
C2
C6
C7,C8
C10
C11
C12 (DO NOT STUFF)
C13 (DO NOT STUFF)
JP1
JP2
JP3 (DO NOT STUFF)
JP4
JP5 (DO NOT STUFF)
JP6 (DO NOT STUFF)
JP7
JP8 (DO NOT STUFF)
JP9
LED1
LED2
L1,L2,L4
L3
Q1 (DO NOT STUFF)
RP1
R1
R2
R3,R12
R4,R5
R6,R7
R8
R9, R49, R50, R51
R16 (DO NOT STUFF)
R10,R15
R11
R13
R14
R45,R46
SW1 (DO NOT STUFF)
SW2 (DO NOT STUFF)
42
1
U1
43
1
U2
44
45
46
1
1
1
Y1
Blank Printed Circuit Board
Firmware for ARM
InvenSense, Inc., 1197 Borregas Ave., Sunnyvale, Ca 94089, USA
Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104
Website: http//www.invensense.com
Part
PCB Footprint
0.1uF
C0402
miniUSB‐A
DC Jack
10uF/0603
100pF/0402
33pF/0402
15PF/0402
1000pF/0402
0.01uF/25V/0402
10pF/0402
10pF/0402
WAFER 4, 80mil, ANGLE
HEADER 10, 80mil, Angle, Female
HEADER 4, 80mil
HEADER 3X2, 80mil
HEADER 3x2, 2mmx2mm, Male
HEADER 2, 100mil
HEADER 10X2, 100mil, Female
HEADER 6X2, 2mmx2mm, Male
HEADER 3
LED_GRN_0805
LED_RED_0805
BEAD/0603
CHOKE CM3216W900H
P‐FET SI2301ADS/SOT23
10Kx4/RP4A0603
22K/0402
33K/0402
1.5K/0402
33/0402
330K/0402
510/0402
0/0402
0/0402
100K/1%/0402
1K/0603
100/0603
1M/0603
2K/0402
PUSH SW
PUSH SW
ARM
AT91SAM7S64
3V3 LDO
YB1231ST25X330
Crystal 18.432MHz@50ppm, SMD5032
Gerber_ARM_EVB.rar
V1.1.1 Firmware for ARM MCU
USB\MINI
C0603
C0402
C0402
C0402
C0402
C0402
J79\4SA90
J79\10S
J79\6D
J100\20DF
J79\3S
LED0805AC
LED0805AC
L0603
CH4P1_25X2_05S
RN8P06SN
R0402
R0402
R0402
R0402
R0402
R0402
R0402
R0402
R0603
R0603
R0603
R0402
TSW2P7_1X6_6
TSW2P7_1X6_6
8
64S.5\470
SOT235
SX‐5032
EB_ARMAT91_XXAXX_B
©2010 InvenSense, Inc. All rights reserved.
Document Number: EB_ARMAT91_XXAXX_B
Revision: 1.2
Release Date: 08/11/2010
ARM Reference Board
Application Note
9. Mechanical Drawings for Selected BOM Items
Figure 5. BOM Item #12, JP1 Drawing
InvenSense, Inc., 1197 Borregas Ave., Sunnyvale, Ca 94089, USA
Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104
Website: http//www.invensense.com
9
EB_ARMAT91_XXAXX_B
©2010 InvenSense, Inc. All rights reserved.
ARM Reference Board
Application Note
Document Number: EB_ARMAT91_XXAXX_B
Revision: 1.2
Release Date: 08/11/2010
Figure 6. BOM Item #20, JP9 Drawing (3-Pin Header)
Figure 7. BOM Item #24, L3 Drawing
InvenSense, Inc., 1197 Borregas Ave., Sunnyvale, Ca 94089, USA
Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104
Website: http//www.invensense.com
10
EB_ARMAT91_XXAXX_B
©2010 InvenSense, Inc. All rights reserved.
ARM Reference Board
Application Note
Document Number: EB_ARMAT91_XXAXX_B
Revision: 1.2
Release Date: 08/11/2010
10. Programming the ARM AT91 MCU
The firmware for the InvenSense ARM Board must be factory programmed using the JTAG port JP2 with
Atmel’s programming tool and software. The current firmware revision is V1.1.2EVB. For upgrading boards
that have an older firmware revision, the ARM MCU may only be programmed by InvenSense or its
designated representatives.
This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense for its use, or for any infringements of patents or
other rights of third parties that may result from its use. Specifications are subject to change without notice. InvenSense reserves the right to make changes to this product, including its
circuits and software, in order to improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding the information
and specifications contained in this document. InvenSense assumes no responsibility for any claims or damages arising from information contained in this document, or from the use of
products and services detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property
rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by implication or otherwise under any patent or patent rights of
InvenSense. This publication supersedes and replaces all information previously supplied. Trademarks that are registered trademarks are the property of their respective companies.
InvenSense sensors should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or any other weapons or life
threatening applications, as well as in any other life critical applications such as medical equipment, transportation, aerospace and nuclear instruments, undersea equipment, power plant
equipment, disaster prevention and crime prevention equipment.
©2010 InvenSense, Inc. All rights reserved.
InvenSense, Inc., 1197 Borregas Ave., Sunnyvale, Ca 94089, USA
Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104
Website: http//www.invensense.com
11
EB_ARMAT91_XXAXX_B
©2010 InvenSense, Inc. All rights reserved.
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