EV_MOD_CH101-01-02

AN-000260 EV_MOD_CH101-01-02 Evaluation Module User Guide Chirp Microsystems reserves the right to change specifications and information herein without notice. Chirp Microsystems 2560 Ninth Street, Ste 200, Berkeley, CA 94710 U.S.A +1(510) 640–8155 www.chirpmicro.com Document Number: AN-000260 Revision: 1.0 Release Date: 01/27/2021 AN-000260 Table of Contents 1 SCOPE AND PURPOSE ................................................................................................................................................................3 2 EV_MOD_CH101 EVALUATION MODULE BOARD .......................................................................................................................4 2.1 2.2 2.3 2.4 3 PIN ASSIGNMENTS .......................................................................................................................................................................... 4 ELECTRICAL SPECIFICATIONS .............................................................................................................................................................. 4 SCHEMATIC .................................................................................................................................................................................... 4 BILL OF MATERIALS ......................................................................................................................................................................... 5 CONFIGURATION, PROGRAMMING, AND OPERATION ...............................................................................................................6 3.1 3.2 CONFIGURATION AND PROGRAMMING ................................................................................................................................................ 6 OPERATION.................................................................................................................................................................................... 6 4 MECHANICAL SPECIFICATIONS ...................................................................................................................................................7 5 APPLICATIONS ...........................................................................................................................................................................8 5.1 5.2 6 OBJECT DETECTION ......................................................................................................................................................................... 8 BEAM PATTERNS............................................................................................................................................................................. 8 Sensor Mounting ................................................................................................................................................................ 8 Beam Pattern ..................................................................................................................................................................... 9 REVISION HISTORY ................................................................................................................................................................... 10 Table of Figures Figure 1-1. View of EV_MOD_CH101-01-02 evaluation module with a particle ingress filter and 45° field-of-view acoustic housing .... 3 Figure 2-1. EV_MOD_CH101 Schematic .................................................................................................................................................... 4 Figure 2-2. EV_MOD_CH101 Module Connection (EV_MOD_CH101 acoustic port is facing down) ......................................................... 5 Figure 4-1. Dimensions of the EV_MOD_CH101-01-02 assembly ............................................................................................................. 7 Figure 5-1. Recommended EV_MOD_CH101 module mounting ............................................................................................................... 8 Figure 5-2. Mount Gap Tolerance .............................................................................................................................................................. 8 Figure 5-3. EV_MOD_CH101-01-02 Beam pattern .................................................................................................................................... 9 List of Tables Table 1. EV_MOD_CH101 ZIF Connector Pin-Out ...................................................................................................................................... 4 Table 2. Recommended Flat Flex Cable and Connector ............................................................................................................................ 5 Table 3. Bill of Material .............................................................................................................................................................................. 5 Table 4. Geometric Dimensions for EV_MOD_CH101-01-02 ..................................................................................................................... 7 Document Number: AN-000260 Revision: 1.0 Page 2 of 10 AN-000260 1 SCOPE AND PURPOSE This document details the specification, programming, and operation of an EV_MOD_CH101-01-02 (also referred to as the EV_MOD_CH101 in the remainder of this document) ultrasonic sensor evaluation module. The module board incorporates a CH101 Ultrasonic Sensor device with an 45° field-of-view acoustic housing assembly, a capacitor and an FPC/FFC connector. This evaluation module can perform pitch-catch and pulse-echo range-finding at distances from 4 cm to 1.2m. Several programming options are available for medium and short-range applications. Figure 1-1. View of EV_MOD_CH101-01-02 evaluation module with a particle ingress filter and 45° field-of-view acoustic housing Document Number: AN-000260 Revision: 1.0 Page 3 of 10 AN-000260 2 EV_MOD_CH101 EVALUATION MODULE BOARD 2.1 PIN ASSIGNMENTS Table 1. EV_MOD_CH101 ZIF Connector Pin-Out PIN 1 2 3 4 5 6 7 8 2.2 NAME INT SCL SDA PROG RESET_N VSS VSS VDD DESCRIPTION Interrupt output. Can be switched to input for triggering and calibration functions SCL Input. I2C clock input. This pin must be pulled up to VDD externally. SDA Input/Output. I2C data I/O. This pin must be pulled up to VDD externally. Program Enable. This pin must be pulled down to ground externally. Active-low reset. This pin must be pulled up to VDD externally. Power return. Power return. Power supply input. Connect to externally regulated 1.8V supply ELECTRICAL SPECIFICATIONS Please refer to DS-000331 CH101 Datasheet for information on the device’s electrical characteristics. Please note that the datasheet covers CH101 part numbers with different suffixes. Regardless, the electrical specifications in the datasheet still apply. 2.3 SCHEMATIC Electrical connection to the EV_MOD_CH101 module is via an 8-pin 0.5 mm pitch flat flex cable (FFC) connector. Part numbers of the FFC connectors on the module PCB and the recommended FFC cables are shown in Table 2. The electrical schematic of the module, including the connector pinout and the connections to the EV_MOD_CH101 module, are shown in Figure 2-1. Note that the 0.1 μF decoupling capacitor, as recommended in the CH101 datasheet, is included in the module. Consult the CH101 datasheet and application notes for additional information on the electrical connections and operation. Figure 2-1. EV_MOD_CH101 Schematic Document Number: AN-000260 Revision: 1.0 Page 4 of 10 AN-000260 Each EV_MOD_CH101 requires its own PROG and INT lines, the remaining connections can be shared. Refer to the CH101 datasheet for additional information. Module connections using a flat flex cable (FFC) are shown in Figure 2-2. Figure 2-2. EV_MOD_CH101 Module Connection (EV_MOD_CH101 acoustic port is facing down) TABLE 2. RECOMMENDED FLAT FLEX CABLE AND CONNECTOR FLAT CABLE CONNECTOR TYPE Molex 503480-0800 RECOMMENDED FLAT CABLE Molex 151660073...151660094 2.4 BILL OF MATERIALS TABLE 3. BILL OF MATERIAL PCB FOOTPRINT MANUFACTURER QUANTITY REFERENCE PART 1 1 1 1 PCB U1 C1 J1 PCB CH101-01 100n 6.3V 20% X7R 0402 Connector, FPC-FFC, 8-Pin Document Number: AN-000260 Revision: 1.0 NA Custom – 8 Pin 0402 8Pin, 0.5 mm Pitch Page 5 of 10 TDK TDK Molex MANUFACTURER PART NUMBER CH101-01 CGA2B1X7R1C104K050BC 503480-0800 AN-000260 3 CONFIGURATION, PROGRAMMING, AND OPERATION Please refer to DS-000331 CH101 Datasheet for information on the device’s electrical characteristics. 3.1 CONFIGURATION AND PROGRAMMING Please refer to the following documents for configuration and programming information: • AN-000154 SmartSonic Hello Chirp Hands-On Document • AN-000175 SonicLib Programmers Guide 3.2 OPERATION Please refer to the following documents for operating information: • AN-000155 CHx01 SonicLink Software Quick Start Guide • AN-000180 CH101 and CH201 SmartSonic Evaluation Kit Users Guide Document Number: AN-000260 Revision: 1.0 Page 6 of 10 AN-000260 4 MECHANICAL SPECIFICATIONS TABLE 4. GEOMETRIC DIMENSIONS FOR EV_MOD_CH101-01-02 DIMENSION EV_MOD_CH101-01-02 UNIT Acoustic port hole 0.75 mm Maximum width 8.15 mm Module height 5.05 mm The outer dimensions of the EV_MOD_CH101-01-02 assembly are shown in Figure 4-1. The acoustic port hole has a diameter of 0.75 mm and is in the center of the front face. During transducer operation, the port cannot be occluded or covered. Figure 4-1. Dimensions of the EV_MOD_CH101-01-02 assembly Document Number: AN-000260 Revision: 1.0 Page 7 of 10 AN-000260 5 APPLICATIONS 5.1 OBJECT DETECTION Detecting the presence of objects or people can be optimized via software by setting the sensor’s full-scale range (FSR). The user may set the maximum distance at which the sensor will detect an object. FSR values refer to the one-way distance to a detected object. In practice, the FSR setting controls the amount of time that the sensor spends in the listening (receiving) period during a measurement cycle. Therefore, the FSR setting affects the time required to complete a measurement. Longer full-scale range values will require more time for a measurement to complete. Ultrasonic signal processing using the CH101’s General Purpose Rangefinder (GPR) Firmware will detect echoes that bounce off the first target in the Field-of-View. The size, position, and material composition of the target will affect the maximum range at which the sensor can detect the target. Large targets, such as walls, are much easier to detect than smaller targets. Thus, the associated operating range for smaller targets will be shorter. The range to detect people will be affected by a variety of factors such as a person’s size, clothing, orientation to the sensor, and the sensor’s field-of-view. In general, given these factors, people can be detected at a maximum distance of 1.1m away from the EV_MOD_CH101-01-02 sensor. 5.2 BEAM PATTERNS Sensor Mounting To achieve the best acoustic performance, users are recommended to mount the EV_MOD_CH101 module in a flat mounting plate. An example mounting plate is shown in Figure 5-1, where the sensor has been inserted flush into a drilled hole of a 150mm square plastic sheet. In Figure 5-2, the allowable mount gap tolerance between the acoustic interface and device enclosure’s hole is shown. Please refer to AN-000158 CH101 Mechanical Integration Guide for detailed module and module integration information. Figure 5-1. Recommended EV_MOD_CH101 module mounting Figure 5-2. Mount Gap Tolerance Document Number: AN-000260 Revision: 1.0 Page 8 of 10 AN-000260 Beam Pattern Beam-pattern plots of the EV_MOD_CH101-01-02 with a 45° FoV acoustic housing module are shown in Figure 5-3. This beampattern was measured by placing a 1m2 flat target at a 30 cm distance from the EV_MOD_CH101 module and recording the ToF amplitude as the sensor is rotated 180°. The plots are shown in both raw LSB units and normalized dB units, where 0 dB corresponds to the peak amplitude recorded on-axis. Chirp defines the field-of-view (FoV) as the full-width at half-maximum (FWHM) of the beam pattern; in other words, the FoV is the range of angles over which the amplitude remains above half the peak amplitude (or -6 dB). When mounted in the recommended plate, the sensor’s FoV is approximately 45°. Figure 5-3. EV_MOD_CH101-01-02 Beam pattern Document Number: AN-000260 Revision: 1.0 Page 9 of 10 AN-000260 6 REVISION HISTORY Revision Date 01/27/2021 Revision 1.0 Description Initial Release This information furnished by Chirp Microsystems, Inc. (“Chirp Microsystems”) is believed to be accurate and reliable. However, no responsibility is assumed by Chirp Microsystems for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without notice. Chirp Microsystems reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance, without prior notice. Chirp Microsystems makes no warranties, neither expressed nor implied, regarding the information and specifications contained in this document. Chirp Microsystems assumes no responsibility for any claims or damages arising from information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights. Certain intellectual property owned by Chirp Microsystems and described in this document is patent protected. No license is granted by implication or otherwise under any patent or patent rights of Chirp Microsystems. This publication supersedes and replaces all information previously supplied. Trademarks that are registered trademarks are the property of their respective companies. Chirp Microsystems sensors should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment, transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment. ©2020 Chirp Microsystems. All rights reserved. Chirp Microsystems and the Chirp Microsystems logo are trademarks of Chirp Microsystems, Inc. The TDK logo is a trademark of TDK Corporation. Other company and product names may be trademarks of the respective companies with which they are associated. ©2020 Chirp Microsystems. All rights reserved. Document Number: AN-000260 Revision: 1.0 Page 10 of 10