Advance Data Sheet: iAF Series – Non-isolated SMT Power Module iAF Series DC/DC Power Modules 4.5-14V Input, 20A Output Surface Mount Power Module
iAF power modules perform local voltage conversion from any bus voltage in the 5V to 12V range. The iAF12020A007V utilizes a low component count that results in both a low cost structure and a high level of performance. The open-frame, compact, surface mountable design features a low profile and weight as well as additional edge plated pads that allow for extremely flexible and robust manufacturing processes.
Features • Size – 33mm x 13.46 mm x 7.75 mm (1.3 in. x 0.53 in. x 0.305 in.) • DOSA Compatible Footprint • Edge plated castellations for forming inspectable solder joints • Surface mountable • Maximum weight 5.5g (0.194 oz) • Up to 110W of output power in high ambient temperature, low airflow environments with no power derating • Positive logic on/off • Flexible Output Voltage Sequencing • Starts with pre-biased output • Output voltage adjustment – industry standard • Outstanding transient response without the need for external loop tuning components • Constant switching frequency • Remote Sense • Power Good • Full, auto-recovery protection: o Input under voltage o Short circuit o Thermal limit • ISO Certified manufacturing facilities • Patent pending
Optional Features • Negative logic on/off • No output voltage sequencing • Solder bumping for enhanced solderability on the EPC footprint
©2011 TDK Innoveta Inc. iAF12_Full_Datasheet_08152011.doc 8/16/2011
(877) 498-0099
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Advance Data Sheet: iAF Series – Non-isolated SMT Power Module Ordering information:
Product Identifier Package Size Platform Input Voltage Output Current/ Power Units Main Output Voltage # of Outputs Safety Class Feature Set RoHS Indicator
i TDK Innoveta
A 33mm x 13.5mm
F iAF
12 4.5V to 14V
020 20
A Amps
007 0.70V to 5.5V
V Single
-
0
06 See option table
-
R
R=RoHS 6 Compliant
Option Table:
Feature Set 00 01 02 03 04 05 06 07 X X X X X X X X x x x x Positive Logic On/Off X X Negative Logic On/Off Sequence X X LGA Solder Bumping* EPC Solder Bumping* x x x x Product Label Marking -000 -001 -002 -003 -004 -005 -006 -007
* LGA solder bumping option is recommended for customers using the DOSA standard land grid array
footprint and EPC soldering bumping is recommended for customers using the inspectable edge plated castellation pads
Product Offering:
Code iAF12020A007V Input Voltage 4.5V-14V Output Voltage 0.70V-5.5V Output Current 20A Maximum Output Power 110W Efficiency 95%
3320 Matrix Drive, Suite 100
Richardson, TX 75802
Phone (877) 498-0099 Toll Free (469) 916-4747 Fax (877) 498-0143 Toll Free (214) 239-3101 support@tdkinnoveta.com http://www.tdkinnoveta.com/ ©2011 TDK Innoveta Inc. iAF12_Full_Datasheet_08152011.doc 8/16/2011 (877) 498-0099
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Advance Data Sheet: iAF Series – Non-isolated SMT Power Module Mechanical Specification:
Dimensions are in mm [in]. Unless otherwise specified tolerances are: x.x ± 0.5 [0.02], x.xx ± 0.25 [0.010]
See ordering information for solder bumping options
©2011 TDK Innoveta Inc. iAF12_Full_Datasheet_08152011.doc 8/16/2011
(877) 498-0099
3/18
Advance Data Sheet: iAF Series – Non-isolated SMT Power Module
Pin Locations: (bottom view)
DOSA PADS
EPC PADS
Pin Assignment:
PIN 1 2 3 4 5 FUNCTION ON/OFF VIN SEQ GND VOUT PIN 6 7 8 9 10 FUNCTION TRIM SENSE + SENSE RES PW GOOD SYNC RES
©2011 TDK Innoveta Inc. iAF12_Full_Datasheet_08152011.doc 8/16/2011
(877) 498-0099
4/18
Advance Data Sheet: iAF Series – Non-isolated SMT Power Module
Recommended Footprint (top view):
DOSA PADS
EPC PADS
©2011 TDK Innoveta Inc. iAF12_Full_Datasheet_08152011.doc 8/16/2011
(877) 498-0099
5/18
Advance Data Sheet: iAF Series – Non-isolated SMT Power Module Absolute Maximum Ratings:
Stress in excess of Absolute Maximum Ratings may cause permanent damage to the device.
Characteristic
Continuous Input Voltage Storage Temperature Operating Temperature Range (Tc)
Min
-0.25 -55 -40
Max
15 125 115*
Unit
Vdc ˚C ˚C
Notes & Conditions
Measured at the location specified in the thermal measurement figure; maximum temperature varies with output current – see curve in the thermal performance section of the data sheet.
* Engineering estimate
Input Characteristics:
Unless otherwise specified, specifications apply over all rated Input Voltage, Resistive Load, and Temperature conditions.
Characteristic
Operating Input Voltage Maximum Input Current Startup Delay Time from application of input voltage Startup Delay Time from on/off Output Voltage Rise Time Input Reflected Ripple Input Ripple Rejection Turn on input voltage Turn off input voltage *Engineering Estimate
Min
4.5 -----------------
Typ
----5 5 4 15 45* 4.2 3.5
Max
14 20 ---------------
Unit
Vdc A mS mS mS mApp dB V V
Notes & Conditions
Vin=4.5 to Vin,max; Io=Io,max Vo=0 to 0.1*Vo,set; on/off=on, Io=Io,max, Tc=25˚C Vo=0 to 0.1*Vo,set; Vin=Vi,nom, Io=Io,max,Tc=25˚C Io=Io,max,Tc=25˚C, Vo=0.1 to 0.9*Vo,set See input/output ripple measurement figure; BW=20 MHz @ 120 Hz
Caution: The power modules are not internally fused. An external input line normal blow fuse with a maximum value of 20A is required, see the Safety Considerations section of the data sheet.
©2011 TDK Innoveta Inc. iAF12_Full_Datasheet_08152011.doc 8/16/2011
(877) 498-0099
6/18
Advance Data Sheet: iAF Series – Non-isolated SMT Power Module Electrical Data:
Characteristic
Output Voltage Initial Setpoint Output Voltage Tolerance Efficiency Vo = 1.2V Vo = 1.5V Vo = 1.8V Vo = 3.3V Vo = 5.0V
Min
-2 -3 --------------0 -------
Typ
82 85 87 91.5 93.5 3 7 --42 1 10
Max
+2 +3 --------------20 -------
Unit
% % % % % % % mV mV A A A mVpp
Notes & Conditions
Vo=3.3Vsetting, Vin=Vin,nom; Io=Io,max; Tc = 25˚C Over all rated input voltage, load, and temperature conditions to end of life Vin=12V; Io=Io,max; Tc=25˚C
Line Regulation Load Regulation Output Current Output Current Limiting Threshold Short Circuit Current Output Ripple and Noise Voltage
Vin=Vin,min to Vin,max Io=Io,min to Io,max
Vo = 0.9*Vo,nom, Tc
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