IBF12012A007V

Advance Data Sheet: iBF Series – Non-isolated SMT Power Module iBF Series DC/DC Power Modules 4.5-14V Input, 12A Output Surface Mount Power Module iBF power modules perform local voltage conversion from any bus voltage in the 5V to 12V range. The iBF12012A007V utilizes a low component count that results in both a low cost structure and a high level of performance. The open-frame, compact, surface mountable design features a low profile and weight as well as additional edge plated pads that allow for extremely flexible and robust manufacturing processes. Features • Size – 20.32mm x 11.43 mm x 8.5 mm (0.80 in. x 0.45 in. x 0.335 in.) • DOSA Compatible Footprint • Edge plated castellations for forming inspectable solder joints • Surface mountable • Maximum weight 5.5g (0.194 oz) • Up to 66W of output power in high ambient temperature, low airflow environments with no power derating • Positive logic on/off • Flexible Output Voltage Sequencing • Starts with pre-biased output • Output voltage adjustment – industry standard • Outstanding transient response without the need for external loop tuning components • Constant switching frequency • Remote Sense • Power Good • Full, auto-recovery protection: o Input under voltage o Short circuit o Thermal limit • ISO Certified manufacturing facilities • Patent pending Optional Features • Negative logic on/off • No output voltage sequencing • Solder bumping for enhanced solderability on the EPC footprint ©2010 TDK Innoveta Inc. iBF12_Full_Datasheet_092010.doc 9/22/2010 (877) 498-0099 1/17 Advance Data Sheet: iBF Series – Non-isolated SMT Power Module Ordering information: Product Identifier Package Size Platform Input Voltage Output Current/ Power Units Main Output Voltage # of Outputs Safety Class Feature Set RoHS Indicator i TDK Innoveta B F iBF 12 4.5V to 14V 012 12 A Amps 007 0.70V to 5.5V V Single - 0 06 See option table - R R=RoHS 6 Compliant 0.80 in. x 0.45 in. Option Table: Feature Set 00 01 02 03 04 05 06 07 X X X X X X X X x x x x Positive Logic On/Off X X Negative Logic On/Off Sequence X X LGA Solder Bumping* EPC Solder Bumping* x x x x Product Label Marking -000 -001 -002 -003 -004 -005 -006 -007 * LGA solder bumping option is recommended for customers using the DOSA standard land grid array footprint and EPC soldering bumping is recommended for customers using the inspectable edge plated castellation pads Product Offering: Code iBF12012A007V Input Voltage 4.5V-14V Output Voltage 0.70V-5.5V Output Current 12A Maximum Output Power 66W Efficiency 94% 3320 Matrix Drive, Suite 100 Richardson, TX 75802 Phone (877) 498-0099 Toll Free (469) 916-4747 Fax (877) 498-0143 Toll Free (214) 239-3101 support@tdkinnoveta.com http://www.tdkinnoveta.com/ ©2010 TDK Innoveta Inc. iBF12_Full_Datasheet_092010.doc 9/22/2010 (877) 498-0099 2/17 Advance Data Sheet: iBF Series – Non-isolated SMT Power Module Mechanical Specification: Dimensions are in mm [in]. Unless otherwise specified tolerances are: x.x ± 0.5 [0.02], x.xx ± 0.25 [0.010] See ordering information for solder bumping options Pin Locations: (bottom view) Pin Assignment: PIN 1 2 3 4 5 FUNCTION ON/OFF VIN SEQ GND TRIM PIN 6 7 8 9 10 FUNCTION VOUT SENSE + SENSE RES PW GOOD SYNC RES ©2010 TDK Innoveta Inc. iBF12_Full_Datasheet_092010.doc 9/22/2010 (877) 498-0099 3/17 Advance Data Sheet: iBF Series – Non-isolated SMT Power Module Recommended Footprint (top view): FOR DOSA STANDARD PADS FOR EPC PADS, AND EPC/DOSA DUAL FOOTPRINT ©2010 TDK Innoveta Inc. iBF12_Full_Datasheet_092010.doc 9/22/2010 (877) 498-0099 4/17 Advance Data Sheet: iBF Series – Non-isolated SMT Power Module Absolute Maximum Ratings: Stress in excess of Absolute Maximum Ratings may cause permanent damage to the device. Characteristic Continuous Input Voltage Storage Temperature Operating Temperature Range (Tc) Min -0.25 -55 -40 Max 15 125 115* Unit Vdc ˚C ˚C Notes & Conditions Measured at the location specified in the thermal measurement figure; maximum temperature varies with output current – see curve in the thermal performance section of the data sheet. * Engineering estimate Input Characteristics: Unless otherwise specified, specifications apply over all rated Input Voltage, Resistive Load, and Temperature conditions. Characteristic Operating Input Voltage Maximum Input Current Startup Delay Time from application of input voltage Startup Delay Time from on/off Output Voltage Rise Time Input Reflected Ripple Input Ripple Rejection Turn on input voltage Turn off input voltage *Engineering Estimate Min 4.5 ----------------- Typ ----5 5 4 17 45* 4.2 3.5 Max 14 11.5 --------------- Unit Vdc A mS mS mS mApp dB V V Notes & Conditions Vin=4.5 to Vin,max; Io=Io,max Vo=0 to 0.1*Vo,set; on/off=on, Io=Io,max, Tc=25˚C Vo=0 to 0.1*Vo,set; Vin=Vi,nom, Io=Io,max,Tc=25˚C Io=Io,max,Tc=25˚C, Vo=0.1 to 0.9*Vo,set See input/output ripple measurement figure; BW=20 MHz @ 120 Hz Caution: The power modules are not internally fused. An external input line normal blow fuse with a maximum value of 15A is required, see the Safety Considerations section of the data sheet. ©2010 TDK Innoveta Inc. iBF12_Full_Datasheet_092010.doc 9/22/2010 (877) 498-0099 5/17 Advance Data Sheet: iBF Series – Non-isolated SMT Power Module Electrical Data: Characteristic Output Voltage Initial Setpoint Output Voltage Tolerance Efficiency Vo = 1.2V Vo = 1.5V Vo = 1.8V Vo = 3.3V Vo = 5.0V Min -2 -3 --------------0 ------- Typ 83 85.5 87 92 94.5 Max +2 +3 --------------- Unit % % % % % % % mV mV A A A mVpp Notes & Conditions Vo=3.3Vsetting, Vin=Vin,nom; Io=Io,max; Tc = 25˚C Over all rated input voltage, load, and temperature conditions to end of life Vin=12V; Io=Io,max; Tc=25˚C Line Regulation Load Regulation Output Current Output Current Limiting Threshold Short Circuit Current Output Ripple and Noise Voltage Vin=Vin,min to Vin,max Io=Io,min to Io,max --18 1 30 12 ------- Vo = 0.9*Vo,nom, Tc