ICM-20601

ICM-20601 World’s First Wide-Range 6-Axis MEMS MotionTracking™ Device for Sports and High Impact Applications GENERAL DESCRIPTION APPLICATIONS Many of today’s wearable and sports solutions, which analyze the motion of a user’s golf or tennis swings, soccer ball kicks, or basketball activities, require higher than currently available ±2000 dps (degrees per second) FSR for gyroscope and ±16g FSR for accelerometer to better insure that critical data is not lost at the point of high impact or high speed rotation. The ICM-20601 SoC offers the smallest size, lowest profile and lowest power in conjunction with industry leading high FSR. With an extended FSR range of ±4000 dps for gyroscope and ±32g for accelerometer, the ICM-20601 enables precise analysis of contact sports applications providing continuous motion sensor data before, during and after impact providing more accurate feedback The ICM-20601 is the world’s first wide-range 6-axis MotionTracking device for Sports and other High Impact applications. It is available in a 3x3x0.75mm 16-pin LGA package. ORDERING INFORMATION    FEATURES            PART TEMP RANGE PACKAGE ICM-20601† −40°C to +85°C 16-Pin LGA Sports Wearable Sensors High Impact Applications 3-Axis Gyroscope with Programmable FSR of ±500dps, ±100dps, ±2000dps and ±4000dps 3-Axis Accelerometer with Programmable FSR of ±4g, ±8g, ±16g and ±32g User-programmable interrupts Wake-on-motion interrupt for low power operation of applications processor 512 byte FIFO buffer enables the applications processor to read the data in bursts On-Chip 16-bit ADCs and Programmable Filters Host interface: 8MHz SPI or 400kHz Fast Mode I2C Digital-output temperature sensor VDD operating range of 1.71 to 3.45V MEMS structure hermetically sealed and bonded at wafer level RoHS and Green compliant TYPICAL OPERATING CIRCUIT †Denotes RoHS and Green-Compliant Package BLOCK DIAGRAM 1.71 – 3.45VDC RESV VDD C4, 2.2 mF C2, 0.1 mF 16 VDDIO 1.71 – 3.45 VDC C3, 10 nF SCLK SCL/SCLK SDI SDO nCS SDA/SDI AD0/SDO CS REGOUT 15 14 1 13 2 12 3 ICM-20601 10 5 9 7 8 RESV FSYNC INT Motion Analysis Pod Architecture InvenSense Inc. 1745 Technology Drive, San Jose, CA 95110 U.S.A +1(408) 988–7339 www.invensense.com 11 4 6 This document contains information on a pre-production product. InvenSense Inc. reserves the right to changespecifications and information herein without notice. C1, 0.47 mF Document Number: PB-ICM-20601-00 Revision: 1.0 Revision Date: 11/30/2015 GND RESV RESV RESV RESV