INMP510
RF-Hardened, Ultra-Low Noise Microphone with Bottom Port and Analog Output
GENERAL DESCRIPTION
APPLICATIONS
*
The INMP510 is an RF-hardened, analog output, bottom-ported,
omnidirectional MEMS microphone with high performance,
ultra-low noise, and low power. The INMP510 consists of a
MEMS microphone element, an impedance converter, and an
output amplifier. The INMP510 sensitivity specification makes
it an excellent choice for both near-field and far-field
applications. The INMP510 is pin compatible with the INMP504
microphone. The INMP510 has a very high signal-to-noise
ratio (SNR) and extended wideband frequency response,
resulting in natural sound with high intelligibility. Low current
consumption enables long battery life for portable
applications.
The INMP510 is available in a miniature 3.35 × 2.5 × 0.98 mm
surface-mount package. It is reflow solder compatible with no
sensitivity degradation.
*Protected by U.S. Patents 7,449,356; 7,825,484; 7,885,423; and 7,961,897.
Other patents are pending.
FUNCTIONAL BLOCK DIAGRAM
•
•
•
•
•
•
•
Smartphones and Feature Phones
Tablet Computers
Teleconferencing Systems
Digital Still and Video Cameras
Bluetooth Headsets
Notebook PCs
Security and Surveillance
FEATURES
•
•
•
•
•
•
•
•
•
•
•
•
•
Tiny, 3.35 × 2.5 × 0.98 mm Surface-Mount Package
High SNR of 65 dBA
Acoustic Overload Point of 124 dB SPL
Extended Frequency Response from 60 Hz to 20 kHz
Omnidirectional Response
Sensitivity of −38 dBV
Sensitivity Tolerance of ±2 dB
Enhanced Radio Frequency (RF) Performance
Low Current Consumption of 180 µA
Single-Ended Analog Output
High PSR of −78 dBV
Compatible with Sn/Pb and Pb-Free Solder Processes
RoHS/WEEE Compliant
ORDERING INFORMATION
PART
OUTPUT
AMPLIFIER
INMP510
OUTPUT
POWER
VDD
INMP510ACEZ-R0*
INMP510ACEZ-R7†
EV_INMP510-FX
TEMP RANGE
−40°C to +85°C
−40°C to +85°C
—
* – 13” Tape and Reel
† – 7” Tape and reel is to be discontinued. Contact
sales@invensense.com for availability.
GND
InvenSense reserves the right to change the detail
specifications as may be required to permit
improvements in the design of its products.
InvenSense Inc.
1745 Technology Drive, San Jose, CA 95110 U.S.A
+1(408) 988–7339
www.invensense.com
Document Number: DS-INMP510-00
Revision: 1.1
Rev Date: 05/21/2014
INMP510
TABLE OF CONTENTS
General Description ................................................................................................................................................. 1
Applications ............................................................................................................................................................. 1
Features ................................................................................................................................................................... 1
Functional Block Diagram ........................................................................................................................................ 1
Ordering Information ............................................................................................................................................... 1
Table of Contents ............................................................................................................................................................ 2
Specifications .................................................................................................................................................................. 3
Table 1. Electrical Characteristics ............................................................................................................................ 3
Absolute Maximum Ratings ............................................................................................................................................ 4
Table 2. Absolute Maximum Ratings ....................................................................................................................... 4
ESD Caution ............................................................................................................................................................. 4
Soldering Profile....................................................................................................................................................... 5
Table 3. Recommended Soldering Profile*.............................................................................................................. 5
Pin Configurations And Function Descriptions ............................................................................................................... 6
Table 4. Pin Function Descriptions........................................................................................................................... 6
Typical Performance Characteristics............................................................................................................................... 7
Applications Information ................................................................................................................................................ 8
Connecting to Audio Codecs .................................................................................................................................... 8
SUPPORTING Documents ................................................................................................................................................ 9
Evaluation Board User Guide ................................................................................................................................... 9
Application Notes (General) .................................................................................................................................... 9
Application Notes (Product Specific) ....................................................................................................................... 9
PCB Design And Land Pattern Layout ........................................................................................................................... 10
Handling Instructions .................................................................................................................................................... 11
Pick And Place Equipment ..................................................................................................................................... 11
Reflow Solder ......................................................................................................................................................... 11
Board Wash............................................................................................................................................................ 11
Outline Dimensions ....................................................................................................................................................... 12
Ordering Guide ...................................................................................................................................................... 13
Revision History ..................................................................................................................................................... 13
Compliance Declaration Disclaimer ....................................................................................................................... 14
Document Number: DS-INMP510-00
Revision: 1.1
Page 2 of 14
INMP510
SPECIFICATIONS
TABLE 1. ELECTRICAL CHARACTERISTICS
(TA = −40 to 85°C, VDD = 1.5 to 3.63 V, unless otherwise noted. All minimum and maximum specifications are guaranteed across
temperature and voltage, and are specified in Table 1, unless otherwise noted. Typical specifications are not guaranteed.)
PARAMETER
PERFORMANCE
Directionality
Sensitivity
CONDITIONS
MIN
TYP
MAX
UNITS
1 kHz, 94 dB SPL
−40
Omni
−38
−36
dBV
Signal-to-Noise Ratio (SNR)
Equivalent Input Noise (EIN)
Dynamic Range
Frequency Response
Total Harmonic Distortion (THD)
Power-Supply Rejection (PSR)
Power-Supply Rejection Ratio (PSRR)
Acoustic Overload Point
POWER SUPPLY
Supply Voltage (VDD)
Supply Current (IS)
Derived from EIN and maximum
acoustic input
Low frequency −3 dB point
High frequency −3 dB point
105 dB SPL
217 Hz, 100 mVp-p square wave
superimposed on VDD = 1.8 V (Aweighted)
1 kHz, 100 mV p-p sine wave
superimposed on VDD = 1.8 V
10% THD
65
29
dBA
dBA SPL
91
dB
60
>20
0.2
Hz
kHz
%
−78
dBV
−55
dB
124
dB SPL
1.5
VDD = 1.8 V
VDD = 3.3 V
1
180
210
3.63
V
220
250
µA
µA
OUTPUT CHARACTERISTICS
Output Impedance (ZOUT)
350
Ω
Output DC Offset
0.7
V
Maximum Output Voltage
131 dB SPL input
0.398
V rms
Noise Floor
20 Hz to 20 kHz, A-weighted, rms
−103
dBV
Note 1: See Figure 3 and Figure 4.
Document Number: DS-INMP510-00
Revision: 1.1
Page 3 of 14
NOTES
1
INMP510
ABSOLUTE MAXIMUM RATINGS
Stress above those listed as Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only
and functional operation of the device at these conditions is not implied. Exposure to the absolute maximum ratings conditions for
extended periods may affect device reliability.
TABLE 2. ABSOLUTE MAXIMUM RATINGS
PARAMETER
Supply Voltage (VDD)
Sound Pressure Level
Mechanical Shock
Vibration
Operating Temperature Range
Storage Temperature Range
RATING
−0.3 V to +3.63 V
160 dB
10,000 g
Per MIL-STD-883 Method 2007, Test Condition B
−40°C to +85°C
−55°C to +150°C
ESD CAUTION
ESD (electrostatic discharge) sensitive device.
Charged devices and circuit boards can
discharge without detection. Although this
product features patented or proprietary
protection circuitry, damage may occur on
devices subjected to high energy ESD.
Therefore proper ESD precautions should be
taken to avoid performance degradation or
loss of functionality.
Document Number: DS-INMP510-00
Revision: 1.1
Page 4 of 14
INMP510
SOLDERING PROFILE
CRITICAL ZONE
TL TO TP
tP
TP
TEMPERATURE
RAMP-UP
TL
tL
TSMAX
TSMIN
tS
RAMP-DOWN
PREHEAT
t25°C TO PEAK TEMPERATURE
TIME
Figure 1. Recommended Soldering Profile Limits
TABLE 3. RECOMMENDED SOLDERING PROFILE*
PROFILE FEATURE
Average Ramp Rate (TL to TP)
Sn63/Pb37
1.25°C/sec max
Pb-Free
1.25°C/sec max
100°C
100°C
150°C
200°C
60 sec to 75 sec
1.25°C/sec
45 sec to 75 sec
60 sec to 75 sec
1.25°C/sec
~50 sec
183°C
217°C
215°C +3°C/−3°C
260°C +0°C/−5°C
Time Within +5°C of Actual Peak
Temperature (tP)
20 sec to 30 sec
20 sec to 30 sec
Ramp-Down Rate
3°C/sec max
3°C/sec max
Time +25°C (t25°C) to Peak Temperature
5 min max
5 min max
Minimum Temperature
(TSMIN)
Minimum Temperature
Preheat
(TSMIN)
Time (TSMIN to TSMAX), tS
Ramp-Up Rate (TSMAX to TL)
Time Maintained Above Liquidous (tL)
Liquidous Temperature (TL)
Peak Temperature (TP)
*The reflow profile in Table 3 is recommended for board manufacturing with InvenSense MEMS microphones. All
microphones are also compatible with the J-STD-020 profile.
Document Number: DS-INMP510-00
Revision: 1.1
Page 5 of 14
INMP510
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
GND
3
2
OUTPUT
1
VDD
INMP510
TOP VIEW
(TERMINAL SIDE DOWN)
Not to Scale
Figure 2. Pin Configuration
TABLE 4. PIN FUNCTION DESCRIPTIONS
PIN
NAME
FUNCTION
1
VDD
Power Supply
2
OUTPUT
Analog Output Signal
3
GND
Ground
Document Number: DS-INMP510-00
Revision: 1.1
Page 6 of 14
INMP510
TYPICAL PERFORMANCE CHARACTERISTICS
15
20
NORMALIZED AMPLITUDE (dB)
NORMALIZED AMPLITUDE (dB)
15
10
5
0
–5
–10
–15
10
100
1k
10
5
0
–5
–10
–15
10
10k
1k
100
10k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 3. Frequency Response Mask
Figure 4. Typical Frequency Response (Measured)
–50
–51
10
–52
THD + N (%)
–53
PSRR (dB)
–54
–55
–56
1
–57
–58
–59
–60
100
1k
0.1
90
10k
100
FREQUENCY (Hz)
120
130
Figure 6. Total Harmonic Distortion + Noise (THD+N) vs. Input SPL
-5
1.4
-10
1.2
-15
1.0
-20
OUTPUT (V)
OUTPUT AMPLITUDE (dBV)
Figure 5. PSR vs. Frequency, 100 mV p-p Swept Sine Wave
-25
-30
0.8
0.6
0.4
-35
120dB SPL
124dB SPL
128dB SPL
132dB SPL
0.2
-40
-45
90
110
INPUT (dB SPL)
0
100
110
120
INPUT AMPLITUDE (dB SPL)
0
130
1.0
TIME (ms)
Figure 7. Linearity
Document Number: DS-INMP510-00
Revision: 1.1
0.5
Figure 8. Clipping Characteristics
Page 7 of 14
INMP510
APPLICATIONS INFORMATION
CONNECTING TO AUDIO CODECS
The output of the INMP510 can be connected to a dedicated codec microphone input (see Figure 9) or to a high input impedance
gain stage (see Figure 10). A 0.1 µF ceramic capacitor placed close to the INMP510 supply pin is used for testing and is
recommended to adequately decouple the microphone from noise on the power supply. A DC blocking capacitor is required at the
output of the microphone. This capacitor creates a high-pass filter with a corner frequency at
fC = 1/(2π × C × R)
where R is the input impedance of the codec.
A minimum value of 2.2 μF is recommended in Figure 9 because the input impedance of codecs can be as low as 2 kΩ at their
highest PGA gain setting, which results in a high-pass filter corner frequency at 37 Hz. Figure 10 shows the INMP510 connected to an
op amp configured as a noninverting preamplifier.
MI CBIAS
0.1 µF
ADC
OR
CODEC
VDD
2.2 µ F
M I NI M UM
INM P510
INPUT
O U T P UT
G ND
Figure 9. INMP510 Connected to a Codec
1.8-3.3 V
GAIN = (R1 + R2)/R1
R1
R2
VREF
0.1µF
VDD
INMP510
AMP
1µF
MINIMUM
OUTPUT
GND
10kΩ
VREF
Figure 10. INMP510 Connected to an Op Amp
Document Number: DS-INMP510-00
Revision: 1.1
Page 8 of 14
VOUT
INMP510
SUPPORTING DOCUMENTS
For additional information, see the following documents.
EVALUATION BOARD USER GUIDE
UG-325 Analog Output MEMS Microphone Flex Evaluation Board
APPLICATION NOTES (GENERAL)
AN-1003 Recommendations for Mounting and Connecting the Invensense, Bottom-Ported MEMS Microphones
AN-1068 Reflow Soldering of the MEMS Microphone
AN-1112 Microphone Specifications Explained
AN-1124 Recommendations for Sealing Invensense, Bottom-Port MEMS Microphones from Dust and Liquid Ingress
AN-1140 Microphone Array Beamforming
AN-1165 Op Amps for MEMS Microphone Preamp Circuits
AN-1181 Using a MEMS Microphone in a 2-Wire Microphone Circuit
APPLICATION NOTES (PRODUCT SPECIFIC)
AN-0207 High-Performance Analog MEMS Microphone Simple Interface-to-SigmaDSP Audio Codec
AN-0262 Low-Noise Analog MEMS Microphone and Preamp with Compression and Noise Gating
Document Number: DS-INMP510-00
Revision: 1.1
Page 9 of 14
INMP510
PCB DESIGN AND LAND PATTERN LAYOUT
The recommended PCB land pattern for the INMP504 should be laid out to a 1:1 ratio to the solder pads on the microphone
package, as shown in Figure 8. Take care to avoid applying solder paste to the sound hole in the PCB. A suggested solder paste
stencil pattern layout is shown in Figure 9. The diameter of the sound hole in the PCB should be larger than the diameter of the
sound port of the microphone. A minimum diameter of 0.5 mm is recommended.
1.52
0.68
1.22
0.61
Ø1.55
1.90
Ø0.95
0.61
0.90
Dimensions shown in millimeters
Figure 11. PCB Land Pattern Layout
1.55/1.05 DIA.
0.225 CUT WIDTH (2×)
0.8 × 0.6
2×
1.22
0.2 × 45
TYP
1.52mm
Dimensions shown in millimeters
Figure 12. Suggested Solder Paste Stencil Pattern Layout
Document Number: DS-INMP510-00
Revision: 1.1
Page 10 of 14
INMP510
HANDLING INSTRUCTIONS
PICK AND PLACE EQUIPMENT
The MEMS microphone can be handled using standard pick-and-place and chip shooting equipment. Take care to avoid damage to the
MEMS microphone structure as follows:
• Use a standard pickup tool to handle the microphone. Because the microphone hole is on the bottom of the package, the
pickup tool can make contact with any part of the lid surface.
• Do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone.
Do not pull air out of or blow air into the microphone port.
• Do not use excessive force to place the microphone on the PCB.
REFLOW SOLDER
For best results, the soldering profile must be in accordance with the recommendations of the manufacturer of the solder paste used to
attach the MEMS microphone to the PCB. It is recommended that the solder reflow profile not exceed the limit conditions specified in
Figure 1 and Table 3.
BOARD WASH
When washing the PCB, ensure that water does not make contact with the microphone port. Do not use blow-off procedures or
ultrasonic cleaning.
Document Number: DS-INMP510-00
Revision: 1.1
Page 11 of 14
INMP510
OUTLINE DIMENSIONS
3.425
3.350
3.275
1.52
BSC
0.75 REF
3.06 REF
REFERENCE
CORNER
1.08
1.07
REF
0.30 BSC
0.90 × 0.68
(PINS 1, 3)
1.55 DIA.
2
2.575
2.500
2.425
2.21
REF
TOP VIEW
PIN 1
3
1.22 BSC
1.25
0.64 REF
0.20 TYP
× 45°
BOTTOM VIEW
SIDE VIEW
Figure 13. 3-Terminal Chip Array Small Outline No-Lead Cavity [LGA_CAV]
3.35 × 2.50 × 0.98 mm Body
Dimensions shown in millimeters
DATE CODE
LOT TRACEABILITY
YYXXX
510
PART NUMBER
PIN 1 INDIC ATION
Figure 14. Package Marking Specification (Top View)
Document Number: DS-INMP510-00
Revision: 1.1
Page 12 of 14
(SOUND PORT)
0.95 DIA.
0.54
REF
1
1.08
0.98
0.88
0.25 NOM
DIA.
0.20 MIN THRU HOLE
INMP510
ORDERING GUIDE
PART
1
INMP510ACEZ-R0 *
1
INMP510ACEZ-R7 †
TEMP RANGE
−40°C to +85°C
PACKAGE
3-Terminal LGA_CAV
QUANTITY
10,000
−40°C to +85°C
3-Terminal LGA_CAV
1,000
EV_INMP510-FX
—
Flexible Evaluation Board —
* – 13” Tape and Reel
† – 7” Tape and reel is discontinued. Contact sales@invensense.com for availability.
1
Z = RoHS Compliant Part
REVISION HISTORY
REVISION DATE
REVISION
DESCRIPTION
02/06/2014
1.0
Initial Release
05/21/2014
1.1
Updated compliance disclaimer, replaced block diagram
on page 1
Document Number: DS-INMP510-00
Revision: 1.1
Page 13 of 14
INMP510
COMPLIANCE DECLARATION DISCLAIMER
InvenSense believes the environmental and other compliance information given in this document to be correct but cannot
guarantee accuracy or completeness. Conformity documents substantiating the specifications and component characteristics are on
file. InvenSense subcontracts manufacturing and the information contained herein is based on data received from vendors and
suppliers, which has not been validated by InvenSense.
This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by
InvenSense for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications
are subject to change without notice. InvenSense reserves the right to make changes to this product, including its circuits and
software, in order to improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither
expressed nor implied, regarding the information and specifications contained in this document. InvenSense assumes no
responsibility for any claims or damages arising from information contained in this document, or from the use of products and
services detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights,
mask work and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by
implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information
previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors
should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons
or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment,
transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime
prevention equipment.
©2014 InvenSense, Inc. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion,
MotionApps, DMP, AAR, and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be
trademarks of the respective companies with which they are associated.
©2014 InvenSense, Inc. All rights reserved.
Document Number: DS-INMP510-00
Revision: 1.1
Page 14 of 14
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