MLF1005DR12KT

(1/3) SMD Inductors(Coils) For Signal Line(Multilayer, Magnetic Shielded) Conformity to RoHS Directive MLF Series MLF1005 Various kinds of digital equipment are becoming smaller with more advanced functions. Therefore, parts used in such digital equipment need to be small and thinner. MLFI005 Series inductors were developed to meet these demands. This series of inductors have 75% less mass than conventional MLF1608 inductors and are magnetically sealed just like conventional inductors, making high-density mounting possible. PRODUCT IDENTIFICATION MLF 1005 DR10 K T (1) (2) (3) (4) (5) (1) Series name (2) Dimensions L× W 1005 FEATURES • 75% less mass than the MLF1608 series. • Magnetically sealed configuration allowing for high-density mounting. • Does not contain lead and is compatible with lead-free soldering. • It is a product conforming to RoHS directive. 1.0× 0.5× 0.5 (3) Material code (4) Inductance value R10 1R0 0.1µH 1.0µH (5) Inductance tolerance APPLICATIONS Signal processing modules such as mobile phones and tuners K ±10% (6) Packaging style T SPECIFICATIONS Operating temperature range Storage temperature range –40 to +85°C –40 to +85°C RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING 10s max. 250 to 260˚C Natural cooling 230˚C 180˚C 150˚C Preheating 60 to 120s Soldering 30 to 60s Time(s) Taping [reel] PACKAGING STYLE AND QUANTITIES Packaging style Taping Quantity 10000 pieces/reel HANDLING AND PRECAUTIONS • Before soldering, be sure to preheat components. The preheating temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150°C. • After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. • The inductance value may change due to magnetic saturation if the current exceeds the rated maximum. • Do not expose the inductors to stray magnetic fields. • Avoid static electricity discharge during handling. • When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed 350°C. Soldering time should not exceed 3 seconds. • Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. • Please contact our Sales office when your application are considered the following: The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) • All specifications are subject to change without notice. 002-04 / 20090402 / e511_mlf1005.fm (2/3) SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN 0.5±0.05 1.0±0.05 0.1min. 0.5 0.4 0.5 0.5 0.5±0.05 0.1min. Dimensions in mm Net weight : 1.2mg ELECTRICAL CHARACTERISTICS Part No. Inductance (µH) Inductance tolerance MLF1005DR10K MLF1005DR12K MLF1005DR15K MLF1005DR18K MLF1005DR22K MLF1005DR27K MLF1005DR33K MLF1005AR39K MLF1005AR47K MLF1005AR56K MLF1005AR68K MLF1005AR82K MLF1005A1R0K MLF1005A1R2K MLF1005A1R5K MLF1005A1R8K MLF1005A2R2K 0.1 0.12 0.15 0.18 0.22 0.27 0.33 0.39 0.47 0.56 0.68 0.82 1.0 1.2 1.5 1.8 2.2 ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% Test frequency L, Q (MHz) 25 25 25 25 25 25 25 10 10 10 10 10 10 10 10 10 10 Test current L, Q (mA) 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 Q min. 10 10 10 10 10 10 10 25 25 25 25 25 25 25 25 25 25 Self-resonant frequency (MHz)min. 450 400 350 320 290 260 230 210 190 170 150 130 120 110 100 90 80 DC resistance (Ω)max. Rated current (mA)max. 0.60 0.70 0.80 0.90 1.10 1.30 1.50 0.60 0.65 0.70 0.80 0.90 1.00 1.10 1.30 1.55 1.80 25 25 25 25 25 25 25 10 10 10 10 10 10 10 10 10 10 ・Test equipment(L, Q): Ag-4294A or equivalent Test tool: Ag-16034G or equivalent TYPICAL ELECTRICAL CHARACTERISTICS INDUCTANCE vs. FREQUENCY CHARACTERISTICS 10 Inductance (µH) 2.2µH 1 1.0µH 0.33µH 0.1 0.01 0.1µH 1 10 100 Frequency (MHz) 1000 10000 Q vs. FREQUENCY CHARACTERISTICS IMPEDANCE vs. FREQUENCY CHARACTERISTICS 60 10000 0.33µH 50 2.2µH 1000 Impedance (Ω) 40 Q 0.1µH 30 1.0µH 0.33µH 20 2.2µH 1.0µH 100 0.1µH 10 10 0 1 10 100 Frequency (MHz) 1000 10000 1 1 10 100 Frequency (MHz) 1000 10000 • All specifications are subject to change without notice. 002-04 / 20090402 / e511_mlf1005.fm (3/3) PACKAGING STYLES REEL DIMENSIONS ø60min. 1.0 2.0±0.5 8.4 +2.0 –0.0 ø13±0.2 14.4max. ø21±0.8 ø180±2.0 Dimensions in mm Cavity 3.5±0.05 1.5 +0.1 –0.0 0.8max. 0.65±0.1 4.0±0.1 2.0±0.05 160min. Taping 2.0±0.05 1.15±0.1 8.0±0.3 Sprocket hole 1.75±0.1 TAPE DIMENSIONS 200min. Drawing direction 300min. Dimensions in mm • All specifications are subject to change without notice. 002-04 / 20090402 / e511_mlf1005.fm