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MLP2520P4R7S

MLP2520P4R7S

  • 厂商:

    TDK(东电化)

  • 封装:

  • 描述:

    FIXED IND 1.2A 195 MOHM SMD

  • 数据手册
  • 价格&库存
MLP2520P4R7S 数据手册
(1/3) SMD Inductors(Coils) For Power Line(Multilayer, Magnetic Shielded) Conformity to RoHS Directive MLP Series MLP2520 In response to market demands for smaller mobile devices with a longer lasting life, mounted switching supply circuits with even higher frequencies are now being developed. With optimized materials the MLP2520 type contributes to the improved efficiency of power sources, and reduces the losses caused by ferrite, even if the products are used for supply circuits with high drive frequencies. PRODUCT IDENTIFICATION MLP 2520 S 1R0 M T (1) (2) (3) (4) (5) (6) (1) Series name (2) Dimensions LuW FEATURES • Optimized ferrite materials enable the reduction of losses. • Compared to the existing MLP2520 type, DC superposition characteristics have been substantially improved. • The products contain no lead and also support lead-free soldering. • It is a product conforming to RoHS directive. 2520 2.5u2.0mm (3) Product characteristics classification code S STD Improved DC superimposition characteristics P (4) Inductance value APPLICATIONS Cellular phones, DSCs, DVCs, HDs, etc. SPECIFICATIONS Operating temperature range Storage temperature range –40 to +125°C [Including self-temperature rise] –40 to +85°C RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING 1R0 1R5 2R2 3R3 4R7 1.0PH 1.5PH 2.2PH 3.3PH 4.7PH • S1R0S: 1.2PH, S2R2S: 2.5PH (5) Management number M S t=1.0mm max. t=1.2mm max. (6) Packaging style T 10s max. 250 to 260˚C Natural cooling 230˚C 180˚C 150˚C Preheating 60 to 120s Soldering 30 to 60s Time(s) Taping [reel] PACKAGING STYLE AND QUANTITIES Packaging style Taping Thickness T(mm) 1.0mm max. 1.2mm max. Quantity 3000 pieces/reel 3000 pieces/reel HANDLING AND PRECAUTIONS • Before soldering, be sure to preheat components. The preheating temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150°C. • After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. • The inductance value may change due to magnetic saturation if the current exceeds the rated maximum. • Do not expose the inductors to stray magnetic fields. • Avoid static electricity discharge during handling. • When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed 350°C. Soldering time should not exceed 3 seconds. • Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. • Please contact our Sales office when your application are considered the following: The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) • All specifications are subject to change without notice. 003-01 / 20101021 / e533_mlp2520.fm (2/3) SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN 2.5±0.2 1.4 0.7 2.0 2.0±0.2 0.7 0.5±0.3 0.5±0.3 Dimensions in mm T T(Thickness) 1.0max. 1.2max. Weight(mg) 15 25 ELECTRICAL CHARACTERISTICS Type Part No. MLP2520S1R0M MLP2520S1R5M MLP2520S2R2M MLP2520S3R3M MLP2520S4R7M MLP2520P2R2M MLP2520P4R7M MLP2520S1R0S MLP2520S2R2S MLP2520S3R3S MLP2520S4R7S MLP2520P2R2S MLP2520P4R7S General Designed especially for DC superimposition General Designed especially for DC superimposition Inductance (μH) 1.0 1.5 2.2 3.3 4.7 2.2 4.7 1.2 2.5 3.3 4.7 2.2 4.7 Inductance tolerance ±20% ±20% ±20% ±20% ±20% ±20% ±20% ±20% ±20% ±20% ±20% ±20% ±20% Test frequency (MHz) 2 2 2 2 2 2 2 2 2 2 2 2 2 DC resistance (: )±30% 0.085 0.09 0.09 0.13 0.13 0.12 0.28 0.08 0.11 0.11 0.11 0.17 0.18 Rated current (mA) 1500 1200 1200 1000 1000 1200 700 1500 1200 1000 1000 1000 800 Thickness (mm)max. 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.2 1.2 1.2 1.2 1.2 1.2 TYPICAL ELECTRICAL CHARACTERISTICS INDUCTANCE CHANGE vs. DC SUPERPOSITION CHARACTERISTICS T=1.2mm max. MLP2520S-S series MLP2520P-S Series 6.0 6.0 4.7μH 5.0 5.0 4.0 Inductance (μH) Inductance (μH) 3.3μH 2.2μH 3.0 2.0 1.0 4.7μH 4.0 3.0 2.2μH 2.0 1.0 1.0μH 0 0 250 500 750 1000 DC current (mA) 1250 T=1.0mm max. MLP2520S-M series 5.0 4.5 4.5 250 4.0 4.7μH Inductance (μH) 3.5 3.3μH 3.0 2.2μH 2.5 1.5μH 2.0 1.5 500 750 1000 DC current (mA) 1250 1500 750 1000 DC current (mA) 1250 1500 4.7μH 3.5 3.0 2.5 2.2μH 2.0 1.5 1.0 1.0 1.0μH 0.5 0.5 0 0 MLP2520P-M series 5.0 4.0 Inductance (μH) 0 1500 0 0 250 500 750 1000 DC current (mA) 1250 1500 0 250 500 • All specifications are subject to change without notice. 003-01 / 20101021 / e533_mlp2520.fm (3/3) PACKAGING STYLES REEL DIMENSIONS ø60min. 1.0 2.0±0.5 8.4 +2.0 –0.0 ø13±0.2 14.4max. ø21±0.8 ø180±2.0 Dimensions in mm K Q 4.0±0.1 2.0±0.05 160min. Taping 4.0±0.1 2.3±0.1 2.7±0.1 8.0±0.3 Cavity 3.5±0.05 1.5 +0.1 –0.0 Sprocket hole 1.75±0.1 TAPE DIMENSIONS 200min. Drawing direction 300min. Dimensions in mm • All specifications are subject to change without notice. 003-01 / 20101021 / e533_mlp2520.fm
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