MMICT5818-00-012

T5818 Bottom Port PDM Digital Output Multi-Mode Microphone APPLICATIONS GENERAL DESCRIPTION The T5818 is a multi-mode, low noise digital MEMS microphone in a small package. The T5818 consists of a MEMS microphone element and an impedance converter amplifier followed by a fourth-order Σ-Δ modulator. The digital interface allows the pulse density modulated (PDM) output of two microphones to be time multiplexed on a single data line using a single clock. The T5818 has multiple modes of operation: High Quality, Low-Power (AlwaysOn), and Sleep. The T5818 has high SNR in all operational modes. It has 135 dB SPL AOP in High Quality Mode and 120 dB SPL AOP in Low-Power mode. The T5818 is available in a standard 3.5 × 2.65 × 0.98 mm surface-mount package. It is reflow solder compatible with no sensitivity degradation. FUNCTIONAL BLOCK DIAGRAM FEATURES SPEC HIGH QUALITY MODE LOW-POWER MODE Sensitivity SNR Current AOP Clock −41 dB FS ±1 dB 66 dBA 590 µA 135 dB SPL 2.0 MHz to 3.3 MHz −26 dB FS ±1 dB 63 dBA 220 µA 120 dB SPL 400 kHz to 800 kHz • • • • • • • 3.5 × 2.65 × 0.98 mm surface-mount package Extended frequency response from 40 Hz to >20 kHz Sleep Mode: 9 µA Fourth-order Σ-Δ modulator Digital pulse density modulation (PDM) output Compatible with Sn/Pb and Pb-free solder processes RoHS/WEEE compliant PART PDM MODULATOR CLK MMICT5818-00-012 TEMP RANGE PACKAGING −40°C to +85°C 13” Tape and Reel DATA CHANNEL SELECT SELECT VDD GND POWER MANAGEMENT Smartphones Microphone Arrays Tablet Computers Cameras ORDERING INFORMATION T5818 ICS-51360 ADC • • • • TDK, Inc. reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. TDK Corporation 1745 Technology Drive, San Jose, CA 95110 U.S.A +1(408) 988–7339 www.tdk.com Document Number: DS-000270 Revision: 1.2 Release Date: 3/30/2020 T5818 TABLE OF CONTENTS General Description ..................................................................................................................................................................... 1 Applications ................................................................................................................................................................................. 1 Features ....................................................................................................................................................................................... 1 Functional Block Diagram ............................................................................................................................................................ 1 Ordering Information ................................................................................................................................................................... 1 Table of Contents .................................................................................................................................................................................... 2 Specifications .......................................................................................................................................................................................... 4 Table 1. Acoustical/Electrical Characteristics – General .............................................................................................................. 4 Table 2. Acoustical/Electrical Characteristics – High Quality Mode ........................................................................................... 4 Table 3. Acoustical/Electrical Characteristics – Low-Power Mode .............................................................................................. 5 Table 4. Digital Input/Output Characteristics .............................................................................................................................. 5 Table 5. PDM Digital Input/Output .............................................................................................................................................. 6 Timing Diagram ............................................................................................................................................................................ 6 Absolute Maximum Ratings .................................................................................................................................................................... 7 Table 6. Absolute Maximum Ratings ........................................................................................................................................... 7 ESD Caution ................................................................................................................................................................................. 7 Soldering Profile........................................................................................................................................................................... 8 Table 7. Recommended Soldering Profile .................................................................................................................................... 8 Pin Configurations And Function Descriptions ....................................................................................................................................... 9 Table 8. Pin Function Descriptions............................................................................................................................................... 9 Typical Performance Characteristics ..................................................................................................................................................... 10 Theory Of Operation ............................................................................................................................................................................. 12 PDM Data Format ...................................................................................................................................................................... 12 Table 9. T5818 Channel Setting ................................................................................................................................................. 12 PDM Microphone Sensitivity ..................................................................................................................................................... 12 Applications Information ...................................................................................................................................................................... 14 Low-Power Mode....................................................................................................................................................................... 14 Dynamic Range Considerations ................................................................................................................................................. 14 Connecting PDM Microphones .................................................................................................................................................. 14 Sleep Mode ................................................................................................................................................................................ 16 Start-Up Time ............................................................................................................................................................................. 16 Supporting Documents ......................................................................................................................................................................... 17 Application Notes – General ...................................................................................................................................................... 17 PCB Design And Land Pattern Layout ................................................................................................................................................... 18 PCB Material And Thickness ...................................................................................................................................................... 18 Handling Instructions ............................................................................................................................................................................ 19 Pick And Place Equipment ......................................................................................................................................................... 19 Reflow Solder ............................................................................................................................................................................. 19 Page 2 of 22 Document Number: DS-000270 Revision: 1.2 T5818 Board Wash................................................................................................................................................................................ 19 Outline Dimensions ............................................................................................................................................................................... 20 Ordering Guide .......................................................................................................................................................................... 20 Revision History ......................................................................................................................................................................... 21 Compliance Declaration Disclaimer ...................................................................................................................................................... 22 Page 3 of 22 Document Number: DS-000270 Revision: 1.2 T5818 SPECIFICATIONS TABLE 1. ACOUSTICAL/ELECTRICAL CHARACTERISTICS – GENERAL TA = 25°C, VDD = 1.8 V to 3.3 V, SCK = 2.4 MHz, CLOAD = 30 pF unless otherwise noted. Typical specifications are not guaranteed. PARAMETER PERFORMANCE Directionality Output Polarity Supply Voltage (VDD) Sleep Mode Current (IS) CONDITIONS MIN TYP MAX UNITS NOTES Omni Input acoustic pressure vs. output data Non-Inverted 1.65 SCK < 200 kHz, VDD=1.8V 1.8 9 3.63 V µA 1 Note 1: Sleep Mode current is not specified at 3.3V TABLE 2. ACOUSTICAL/ELECTRICAL CHARACTERISTICS – HIGH QUALITY MODE TA = 25°C, VDD = 1.8 V to 3.3 V, SCK = 2.4 MHz, CLOAD = 30 pF unless otherwise noted. Typical specifications are not guaranteed. PARAMETER Sensitivity Signal-to-Noise Ratio (SNR) Equivalent Input Noise (EIN) Acoustic Dynamic Range Total Harmonic Distortion (THD) Power Supply Rejection (PSR) Power Supply Rejection (PSR) Power Supply Rejection—Swept Sine Acoustic Overload Point Supply Current (IS) CONDITIONS 1 kHz, 94 dB SPL 20 kHz bandwidth, A-weighted 20 kHz bandwidth, A-weighted Derived from EIN and acoustic overload point 94 dB SPL 20 Hz, 100 mVpp applied to VDD 1 kHz, 100 mVpp applied to VDD 5 kHz, 100 mVpp applied to VDD 10 kHz, 100 mVpp applied to VDD 20 kHz, 100 mVpp applied to VDD 217 Hz, 100 mV p-p square wave superimposed on VDD = 1.8 V, Aweighted 1 kHz sine wave 10% THD VDD = 1.8 V, no load MIN −42 TYP −41 66 28 MAX −40 UNITS dB FS dBA dBA SPL 107 dB 0.15 -89 -114 -100 -100 -86 % NOTES 2 dB FS(A) -108 dB FS (A) −114 135 590 dB FS dB SPL µA Note 2: Sensitivity is relative to the RMS level of a sine wave with positive amplitude equal to 100% 1s density and negative amplitude equal to 0% 1s density. Page 4 of 22 Document Number: DS-000270 Revision: 1.2 T5818 TABLE 3. ACOUSTICAL/ELECTRICAL CHARACTERISTICS – LOW-POWER MODE TA = 25°C, VDD = 1.8 V to 3.3 V, SCK = 768 kHz, CLOAD = 30 pF unless otherwise noted. Typical specifications are not guaranteed. PARAMETER Sensitivity Signal-to-Noise Ratio (SNR) Equivalent Input Noise (EIN) Acoustic Dynamic Range CONDITIONS 1 kHz, 94 dB SPL 8 kHz bandwidth, A-weighted 8 kHz bandwidth, A-weighted Derived from EIN and acoustic overload point Total Harmonic Distortion (THD) Power Supply Rejection (PSR) 105 dB SPL 217 Hz, 100 mV p-p square wave superimposed on VDD = 1.8 V, A-weighted 1 kHz sine wave 10% THD VDD = 1.8 V, no load Power Supply Rejection—Swept Sine Acoustic Overload Point Supply Current (IS) MIN −27 TYP −26 63 31 MAX −25 UNITS dB FS dBA dBA SPL 89 dB 0.15 % −91 dB FS −102 120 220 dB FS dB SPL µA NOTES 3 Note 3: Sensitivity is relative to the RMS level of a sine wave with positive amplitude equal to 100% 1s density and negative amplitude equal to 0% 1s density. TABLE 4. DIGITAL INPUT/OUTPUT CHARACTERISTICS TA = 25°C, 1.8 V < VDD < 3.3 V , unless otherwise noted. PARAMETER CONDITIONS MIN Input Voltage High (VIH) TYP MAX 0.65 × VDD UNITS V Input Voltage Low (VIL) 0.35 × VDD V Output Voltage High (VOH) ILOAD = 0.5 mA Output Voltage Low (VOL) ILOAD = 0.5 mA 0 Output DC Offset Percent of full scale 3 % 400 kHz, output within 0.5 dB of final sensitivity, power on Between Low-Power and High Quality Mode 303 Input clock period Sleep Mode 1 ms 7 ms 7 ms 7 ms 2500 ns 200 kHz Low-Power Mode 400 800 kHz High Quality Mode 2.0 3.3 MHz Clock Duty Cycle fCLK 15 cm) or other large capacitive load, a digital buffer may be required. Only use a signal buffer on the DATA line when one microphone is in use or after the point where two microphones are connected (see Figure 14). The DATA output of each microphone in a stereo configuration cannot be individually buffered because the two buffer outputs cannot drive a single signal line. If a buffer is used, take care to select one with low propagation delay so that the timing of the data connected to the codec is not corrupted. Figure 14. Buffered Connections Between Stereo T5818s and a Codec When long wires are used to connect the codec to the T5818, a source termination resistor can be used on the clock output of the codec instead of a buffer to minimize signal overshoot or ringing. Match the value of this resistor to the characteristic impedance of Page 15 of 22 Document Number: DS-000270 Revision: 1.2 T5818 the CLK trace on the PCB. Depending on the drive capability of the codec clock output, a buffer may still be needed, as shown in Figure 14. SLEEP MODE The microphone enters sleep mode when the clock frequency falls below 200 kHz. In this mode, the microphone data output is in a high impedance state. The current consumption in sleep mode is 9 µA. The microphone wakes up from sleep mode and begins to output data 7 ms after the clock becomes active. The wake-up time indicates the time from when the clock is enabled to when the T5818 outputs data within 0.5 dB of its settled sensitivity. START-UP TIME The start-up time of the T5818 is typically 7 ms, measured by the time from when power and clock are enabled until sensitivity of the output signal is within 0.5 dB of its settled sensitivity. Page 16 of 22 Document Number: DS-000270 Revision: 1.2 T5818 SUPPORTING DOCUMENTS For additional information, see the following documents. APPLICATION NOTES – GENERAL AN-000048, PDM Digital Output MEMS Microphone Flex Evaluation Board User Guide AN-100, MEMS Microphone Handling and Assembly Guide AN-1003, Recommendations for Mounting and Connecting the TDK, Bottom-Ported MEMS Microphones AN-1112, Microphone Specifications Explained AN-1124, Recommendations for Sealing TDK Bottom-Port MEMS Microphones from Dust and Liquid Ingress AN-1140, Microphone Array Beamforming Page 17 of 22 Document Number: DS-000270 Revision: 1.2 T5818 PCB DESIGN AND LAND PATTERN LAYOUT The recommended PCB land pattern for the T5818 is a 1:1 ratio of the solder pads on the microphone package, as shown in Figure 15. Avoid applying solder paste to the sound hole in the PCB. A suggested solder paste stencil pattern layout is shown in Figure 16. The response of the T5818 is not affected by the PCB hole size as long as the hole is not smaller than the sound port of the microphone (0.375 mm in diameter). A 0.5 mm to 1 mm diameter for the hole is recommended. Take care to align the hole in the microphone package with the hole in the PCB. The exact degree of the alignment does not affect the microphone performance as long as the holes are not partially or completely blocked. 0.522x0.725(4X) Ø1.625 Ø1.025 1.675 0.838 0.822 1.252 Figure 15. Recommended PCB Land Pattern Layout 0.422x0.625(4X) Ø1.625 Ø1.125 1.675 0.1(4x) 0.822 1.252 Figure 16. Suggested Solder Paste Stencil Pattern Layout PCB MATERIAL AND THICKNESS The performance of the T5818 is not affected by PCB thickness. The T5818 can be mounted on either a rigid or flexible PCB. A flexible PCB with the microphone can be attached directly to the device housing with an adhesive layer. This mounting method offers a reliable seal around the sound port while providing the shortest acoustic path for good sound quality. Page 18 of 22 Document Number: DS-000270 Revision: 1.2 T5818 HANDLING INSTRUCTIONS PICK AND PLACE EQUIPMENT The MEMS microphone can be handled using standard pick-and-place and chip shooting equipment. Take care to avoid damage to the MEMS microphone structure as follows: • Use a standard pickup tool to handle the microphone. Because the microphone hole is on the bottom of the package, the pickup tool can make contact with any part of the lid surface. • Do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone. Do not pull air out of or blow air into the microphone port. • Do not use excessive force to place the microphone on the PCB. REFLOW SOLDER For best results, the soldering profile must be in accordance with the recommendations of the manufacturer of the solder paste used to attach the MEMS microphone to the PCB. It is recommended that the solder reflow profile not exceed the limit conditions specified in Figure 2 and Table 7. BOARD WASH When washing the PCB, ensure that water does not make contact with the microphone port. Do not use blow-off procedures or ultrasonic cleaning. Page 19 of 22 Document Number: DS-000270 Revision: 1.2 T5818 OUTLINE DIMENSIONS Figure 17. 5-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV] 3.5 mm × 2.65 mm × 0.98 mm Body Dimensions shown in millimeters Dimension tolerance is ±0.15 mm unless otherwise specified Figure 18. Package Marking Specification (Top View) ORDERING GUIDE PART TEMP RANGE PACKAGE QUANTITY PACKAGING MMICT5818-00-012 −40°C to +85°C 5-Terminal LGA_CAV 10,000 13” Tape and Reel Page 20 of 22 Document Number: DS-000270 Revision: 1.2 T5818 REVISION HISTORY REVISION DATE REVISION DESCRIPTION 1/10/20 1.0 Initial version 2/6/20 1.1 Fixed typo in ordering guide part name 3/30/20 1.2 Updated specs for 3.3V operation Page 21 of 22 Document Number: DS-000270 Revision: 1.2 T5818 COMPLIANCE DECLARATION DISCLAIMER TDK believes the environmental and other compliance information given in this document to be correct but cannot guarantee accuracy or completeness. Conformity documents substantiating the specifications and component characteristics are on file. TDK subcontracts manufacturing, and the information contained herein is based on data received from vendors and suppliers, which has not been validated by TDK. This information furnished by TDK, Inc. (“TDK”) is believed to be accurate and reliable. However, no responsibility is assumed by TDK for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without notice. TDK reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance, without prior notice. TDK makes no warranties, neither expressed nor implied, regarding the information and specifications contained in this document. TDK assumes no responsibility for any claims or damages arising from information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights. Certain intellectual property owned by TDK and described in this document is patent protected. No license is granted by implication or otherwise under any patent or patent rights of TDK. This publication supersedes and replaces all information previously supplied. Trademarks that are registered trademarks are the property of their respective companies. TDK sensors should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment, transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment. ©2019 TDK. All rights reserved. TDK, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion, MotionApps, DMP, AAR, and the TDK logo are trademarks of TDK, Inc. The TDK logo is a trademark of TDK Corporation. Other company and product names may be trademarks of the respective companies with which they are associated. ©2019 TDK. All rights reserved. Page 22 of 22 Document Number: DS-000270 Revision: 1.2