MPU-6500
MPU-6500
Product Specification
Revision 1.3
InvenSense reserves the right to change the detail
specifications as may be required to permit
improvements in the design of its products.
InvenSense, Inc.
1745 Technology Drive, San Jose, CA 95110 U.S.A
+1(408) 988–7339
www.invensense.com
Document Number: PS-MPU-6500A-01
Revision: 1.3
Rev. Date: 05/15/2020
MPU-6500
TABLE OF CONTENTS
1
2
3
4
INTRODUCTION ..........................................................................................................................................5
1.1
PURPOSE AND SCOPE ..........................................................................................................................5
1.2
PRODUCT OVERVIEW ...........................................................................................................................5
1.3
APPLICATIONS .....................................................................................................................................5
FEATURES ..................................................................................................................................................6
2.1
GYROSCOPE FEATURES .......................................................................................................................6
2.2
ACCELEROMETER FEATURES ...............................................................................................................6
2.3
ADDITIONAL FEATURES ........................................................................................................................6
2.4
MOTIONPROCESSING® ........................................................................................................................6
ELECTRICAL CHARACTERISTICS ...........................................................................................................7
3.1
GYROSCOPE SPECIFICATIONS ..............................................................................................................7
3.2
ACCELEROMETER SPECIFICATIONS .......................................................................................................8
3.3
ELECTRICAL SPECIFICATIONS ...............................................................................................................9
3.4
I2C TIMING CHARACTERIZATION..........................................................................................................13
3.5
SPI TIMING CHARACTERIZATION .........................................................................................................14
3.6
ABSOLUTE MAXIMUM RATINGS ...........................................................................................................16
APPLICATIONS INFORMATION ..............................................................................................................17
4.1
PIN OUT DIAGRAM AND SIGNAL DESCRIPTION .....................................................................................17
4.2
TYPICAL OPERATING CIRCUIT.............................................................................................................18
4.3
BILL OF MATERIALS FOR EXTERNAL COMPONENTS ..............................................................................18
4.4
BLOCK DIAGRAM ...............................................................................................................................19
4.5
OVERVIEW ........................................................................................................................................19
4.6
THREE-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING ................................20
4.7
THREE-AXIS MEMS ACCELEROMETER WITH 16-BIT ADCS AND SIGNAL CONDITIONING ........................20
4.8
DIGITAL MOTIONPROCESSOR® ..........................................................................................................20
4.9
PRIMARY I2C AND SPI SERIAL COMMUNICATIONS INTERFACES ............................................................20
4.10
AUXILIARY I2C SERIAL INTERFACE ......................................................................................................22
4.11
SELF-TEST ........................................................................................................................................23
4.12
CLOCKING .........................................................................................................................................23
4.13
SENSOR DATA REGISTERS .................................................................................................................24
4.14
FIFO ................................................................................................................................................24
4.15
INTERRUPTS ......................................................................................................................................24
4.16
DIGITAL-OUTPUT TEMPERATURE SENSOR ..........................................................................................24
4.17
BIAS AND LDOS ................................................................................................................................24
Document Number: PS-MPU-6500A-01
Revision: 1.3
Page 2 of 39
MPU-6500
5
4.18
CHARGE PUMP ..................................................................................................................................25
4.19
STANDARD POWER MODES ................................................................................................................25
PROGRAMMABLE INTERRUPTS............................................................................................................26
5.1
6
7
DIGITAL INTERFACE ...............................................................................................................................28
6.1
I2C AND SPI SERIAL INTERFACES .......................................................................................................28
6.2
I2C INTERFACE ..................................................................................................................................28
6.3
I2C COMMUNICATIONS PROTOCOL ......................................................................................................28
6.4
I2C TERMS ........................................................................................................................................31
6.5
SPI INTERFACE .................................................................................................................................32
SERIAL INTERFACE CONSIDERATIONS ...............................................................................................33
7.1
8
9
WAKE-ON-MOTION INTERRUPT ...........................................................................................................27
MPU-6500 SUPPORTED INTERFACES .................................................................................................33
ASSEMBLY ...............................................................................................................................................34
8.1
ORIENTATION OF AXES ......................................................................................................................34
8.2
PACKAGE DIMENSIONS ......................................................................................................................35
PART NUMBER PACKAGE MARKING ...................................................................................................36
10 RELIABILITY .............................................................................................................................................37
10.1
QUALIFICATION TEST POLICY .............................................................................................................37
10.2
QUALIFICATION TEST PLAN ................................................................................................................37
11 REFERENCE .............................................................................................................................................38
12 REVISION HISTORY .................................................................................................................................39
Document Number: PS-MPU-6500A-01
Revision: 1.3
Page 3 of 39
MPU-6500
Table of Figures
Figure 1. I2C Bus Timing Diagram...................................................................................................................................... 13
Figure 2. SPI Bus Timing Diagram ..................................................................................................................................... 14
Figure 3. Pin out Diagram for MPU-6500 3.0x3.0x0.9mm QFN........................................................................................ 17
Figure 4. MPU-6500 QFN Application Schematic. (a) I2C operation, (b) SPI operation. ................................................... 18
Figure 5. MPU-6500 Block Diagram .................................................................................................................................. 19
Figure 6. MPU-6500 Solution Using I2C Interface ............................................................................................................. 21
Figure 7. MPU-6500 Solution Using SPI Interface ............................................................................................................ 22
Figure 8. Wake-on-Motion Interrupt Configuration ......................................................................................................... 27
Figure 9. START and STOP Conditions .............................................................................................................................. 28
Figure 10. Acknowledge on the I2C Bus ............................................................................................................................ 29
Figure 11. Complete I2C Data Transfer ............................................................................................................................. 30
Figure 12. Typical SPI Master / Slave Configuration ......................................................................................................... 32
Figure 13. I/O Levels and Connections ............................................................................................................................. 33
Figure 14. Orientation of Axes of Sensitivity and Polarity of Rotation ............................................................................. 34
Table of Tables
Table 1. Gyroscope Specifications ...................................................................................................................................... 7
Table 2. Accelerometer Specifications ............................................................................................................................... 8
Table 3. D.C. Electrical Characteristics................................................................................................................................ 9
Table 4. A.C. Electrical Characteristics .............................................................................................................................. 11
Table 5. Other Electrical Specifications ............................................................................................................................ 12
Table 6. I2C Timing Characteristics ................................................................................................................................... 13
Table 7. SPI Timing Characteristics ................................................................................................................................... 14
Table 8. fCLK = 20 MHz ..................................................................................................................................................... 15
Table 9. Absolute Maximum Ratings ................................................................................................................................ 16
Table 10. Signal Descriptions ............................................................................................................................................ 17
Table 11. Bill of Materials ................................................................................................................................................. 18
Table 12. Standard Power Modes for MPU-6500............................................................................................................. 25
Table 13. Table of Interrupt Sources ................................................................................................................................ 26
Table 14. Serial Interface .................................................................................................................................................. 28
Table 15. I2C Terms ........................................................................................................................................................... 31
Table 16. Accelerated Life Tests ....................................................................................................................................... 37
Table 17. Device Component Level Tests ......................................................................................................................... 37
Document Number: PS-MPU-6500A-01
Revision: 1.3
Page 4 of 39
MPU-6500
1 INTRODUCTION
1.1
PURPOSE AND SCOPE
This document is a product specification, providing a description, specifications, and design related information on the
MPU-6500™ MotionTracking device. The device is housed in a small 3x3x0.90mm QFN package.
Specifications are subject to change without notice. For references to register map and descriptions of individual
registers, please refer to the MPU-6500 Register Map and Register Descriptions document.
1.2
PRODUCT OVERVIEW
The MPU-6500 is a 6-axis MotionTracking device that combines a 3-axis gyroscope, 3-axis accelerometer, and a Digital
MotionProcessor® (DMP®) all in a small 3x3x0.9mm package. It also features a 512-byte FIFO that can lower the traffic
on the serial bus interface, and reduce power consumption by allowing the system processor to burst read sensor data
and then go into a low-power mode. With its dedicated I2C sensor bus, the MPU-6500 directly accepts inputs from
external I2C devices. MPU-6500, with its 6-axis integration, on-chip DMP, and run-time calibration firmware, enables
manufacturers to eliminate the costly and complex selection, qualification, and system level integration of discrete
devices, guaranteeing optimal motion performance for consumers. MPU-6500 is also designed to interface with
multiple non-inertial digital sensors, such as pressure sensors, on its auxiliary I2C port.
The gyroscope has a programmable full-scale range of ±250, ±500, ±1000, and ±2000 degrees/sec and very low rate
noise at 0.01 dps/√Hz. The accelerometer has a user-programmable accelerometer full-scale range of ±2g, ±4g, ±8g,
and ±16g. Factory-calibrated initial sensitivity of both sensors reduces production-line calibration requirements.
Other industry-leading features include on-chip 16-bit ADCs, programmable digital filters, a precision clock with 1%
drift from -40°C to 85°C, an embedded temperature sensor, and programmable interrupts. The device features I2C and
SPI serial interfaces, a VDD operating range of 1.71 to 3.6V, and a separate digital IO supply, VDDIO from 1.71V to
3.6V.
Communication with all registers of the device is performed using either I2C at 400kHz or SPI at 1MHz. For applications
requiring faster communications, the sensor and interrupt registers may be read using SPI at 20MHz.
By leveraging its patented and volume-proven CMOS-MEMS fabrication platform, which integrates MEMS wafers with
companion CMOS electronics through wafer-level bonding, InvenSense has driven the package size down to a
footprint and thickness of 3x3x0.90mm (24-pin QFN), to provide a very small yet high performance low cost package.
The device provides high robustness by supporting 10,000g shock reliability.
1.3
APPLICATIONS
•
•
•
•
•
•
•
•
TouchAnywhere™ technology (for “no touch” UI Application Control/Navigation)
MotionCommand™ technology (for Gesture Short-cuts)
Motion-enabled game and application framework
Location based services, points of interest, and dead reckoning
Handset and portable gaming
Motion-based game controllers
3D remote controls for Internet connected DTVs and set top boxes, 3D mice
Wearable sensors for health, fitness and sports
Document Number: PS-MPU-6500A-01
Revision: 1.3
Page 5 of 39
MPU-6500
2 FEATURES
2.1
GYROSCOPE FEATURES
The triple-axis MEMS gyroscope in the MPU-6500 includes a wide range of features:
•
•
•
•
•
2.2
Digital-output X-, Y-, and Z-axis angular rate sensors (gyroscopes) with a user-programmable full-scale range
of ±250, ±500, ±1000, and ±2000°/sec and integrated 16-bit ADCs
Digitally-programmable low-pass filter
Gyroscope operating current: 3.2mA
Factory calibrated sensitivity scale factor
Self-test
ACCELEROMETER FEATURES
The triple-axis MEMS accelerometer in MPU-6500 includes a wide range of features:
•
•
•
•
•
•
2.3
Digital-output X-, Y-, and Z-axis accelerometer with a programmable full scale range of ±2g, ±4g, ±8g and
±16g and integrated 16-bit ADCs
Accelerometer normal operating current: 450µA
Low power accelerometer mode current: 6.37µA at 0.98Hz, 17.75µA at 31.25Hz
User-programmable interrupts
Wake-on-motion interrupt for low power operation of applications processor
Self-test
ADDITIONAL FEATURES
The MPU-6500 includes the following additional features:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
2.4
Auxiliary master I2C bus for reading data from external sensors (e.g. magnetometer)
3.4mA operating current when all 6 motion sensing axes are active
VDD supply voltage range of 1.8 – 3.3V ± 5%
VDDIO reference voltage of 1.8 – 3.3V ± 5% for auxiliary I2C devices
Smallest and thinnest QFN package for portable devices: 3x3x0.9mm
Minimal cross-axis sensitivity between the accelerometer and gyroscope axes
512 byte FIFO buffer enables the applications processor to read the data in bursts
Digital-output temperature sensor
User-programmable digital filters for gyroscope, accelerometer, and temp sensor
10,000 g shock tolerant
400kHz Fast Mode I2C for communicating with all registers
1MHz SPI serial interface for communicating with all registers
20MHz SPI serial interface for reading sensor and interrupt registers
MEMS structure hermetically sealed and bonded at wafer level
RoHS and Green compliant
MOTIONPROCESSING®
•
•
•
Internal Digital MotionProcessing® (DMP) engine supports advanced MotionProcessing® and low power
functions such as gesture recognition using programmable interrupts
In addition to the angular rate, this device optionally outputs the angular position (angle).
Low-power pedometer functionality allows the host processor to sleep while the DMP maintains the step
count.
Document Number: PS-MPU-6500A-01
Revision: 1.3
Page 6 of 39
MPU-6500
3 ELECTRICAL CHARACTERISTICS
3.1
GYROSCOPE SPECIFICATIONS
Typical Operating Circuit of section 4.2, VDD = 1.8V, VDDIO = 1.8V, TA=25°C, unless otherwise noted.
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
NOTES
GYROSCOPE SENSITIVITY
Full-Scale Range
FS_SEL=0
±250
º/s
3
FS_SEL=1
±500
º/s
3
FS_SEL=2
±1000
º/s
3
FS_SEL=3
±2000
º/s
3
16
bits
3
FS_SEL=0
131
LSB/(º/s)
3
FS_SEL=1
65.5
LSB/(º/s)
3
FS_SEL=2
32.8
LSB/(º/s)
3
FS_SEL=3
Gyroscope ADC Word Length
Sensitivity Scale Factor
16.4
LSB/(º/s)
3
Sensitivity Scale Factor Tolerance
25°C
±3
%
2
Sensitivity Scale Factor Variation Over Temperature
-40°C to +85°C
±4
%
1
Nonlinearity
Best fit straight line; 25°C
±0.1
%
1
±2
%
1
Cross-Axis Sensitivity
ZERO-RATE OUTPUT (ZRO)
Initial ZRO Tolerance
25°C
ZRO Variation Over Temperature
-40°C to +85°C
±5
º/s
2
±0.24
º/s/°C
1
0.1
º/s-rms
2
GYROSCOPE NOISE PERFORMANCE (FS_SEL=0)
Total RMS Noise
DLPFCFG=2 (92 Hz)
Rate Noise Spectral Density
0.01
GYROSCOPE MECHANICAL FREQUENCIES
25
LOW PASS FILTER RESPONSE
Programmable Range
GYROSCOPE START-UP TIME
From Sleep mode
OUTPUT DATA RATE
Programmable, Normal (Filtered)
mode
27
5
29
250
35
4
º/s/√Hz
4
KHz
2
Hz
3
1
ms
8000
Hz
Table 1. Gyroscope Specifications
Notes:
1.
2.
3.
4.
Derived from validation or characterization of parts, not guaranteed in production.
Tested in production.
Guaranteed by design.
Calculated from Total RMS Noise.
Please refer to the following document for information on Self-Test: MPU-6500 Accelerometer and Gyroscope SelfTest Implementation; AN-MPU-6500A-02
Document Number: PS-MPU-6500A-01
Revision: 1.3
Page 7 of 39
1
MPU-6500
3.2
ACCELEROMETER SPECIFICATIONS
Typical Operating Circuit of section 4.2, VDD = 1.8V, VDDIO = 1.8V, TA=25°C, unless otherwise noted.
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
NOTES
ACCELEROMETER SENSITIVITY
Full-Scale Range
ADC Word Length
Sensitivity Scale Factor
Initial Tolerance
Sensitivity Change vs. Temperature
Nonlinearity
AFS_SEL=0
±2
g
3
AFS_SEL=1
±4
g
3
AFS_SEL=2
±8
g
3
AFS_SEL=3
±16
g
3
Output in two’s complement format
16
bits
3
AFS_SEL=0
16,384
LSB/g
3
AFS_SEL=1
8,192
LSB/g
3
AFS_SEL=2
4,096
LSB/g
3
AFS_SEL=3
Component-level
-40°C to +85°C AFS_SEL=0
Component-level
Best Fit Straight Line
2,048
±3
LSB/g
%
3
2
±0.026
%/°C
1
±0.5
%
1
±2
%
1
±60
Cross-Axis Sensitivity
ZERO-G OUTPUT
Initial Tolerance
Component-level, all axes
Zero-G Level Change vs. Temperature
-40°C to +85°C,
Board-level
X and Y axes
Z axis
mg
2
±0.64
mg/°C
1
±1
mg/°C
1
µg/√Hz
4
Hz
3
NOISE PERFORMANCE
Power Spectral Density
Low noise mode
LOW PASS FILTER RESPONSE
Programmable Range
300
5
INTELLIGENCE FUNCTION INCREMENT
ACCELEROMETER STARTUP TIME
OUTPUT DATA RATE
4
20
30
From Sleep mode
From Cold Start, 1ms VDD ramp
Low power (duty-cycled)
260
0.24
Duty-cycled, over temp
Low noise (active)
mg/LSB
ms
ms
500
±15
4
Hz
%
4000
Hz
Table 2. Accelerometer Specifications
Notes:
1.
2.
3.
4.
Derived from validation or characterization of parts, not guaranteed in production.
Tested in production.
Guaranteed by design.
Calculated from Total RMS Noise.
Please refer to the following document for information on Self-Test: MPU-6500 Accelerometer and Gyroscope SelfTest Implementation; AN-MPU-6500A-02
Document Number: PS-MPU-6500A-01
Revision: 1.3
Page 8 of 39
3
1
1
1
MPU-6500
3.3
ELECTRICAL SPECIFICATIONS
3.3.1
D.C. Electrical Characteristics
Typical Operating Circuit of section 4.2, VDD = 1.8V, VDDIO = 1.8V, TA=25°C, unless otherwise noted.
PARAMETER
CONDITIONS
MIN
TYP
MAX
Units
Notes
VDD
1.71
1.8
3.45
V
1
VDDIO
1.71
1.8
3.45
V
1
SUPPLY VOLTAGES
SUPPLY CURRENTS
Normal Mode
Accelerometer Low Power Mode
6-axis
3.4
mA
1
3-axis Gyroscope
3.2
mA
1
3-Axis Accelerometer, 4kHz ODR
450
µA
1
0.98 Hz update rate
7.27
µA
1,2
31.25 Hz update rate
18.65
µA
1,2
1.6
mA
1
6
µA
1
°C
1
Standby Mode
Full-Chip Sleep Mode
TEMPERATURE RANGE
Specified Temperature Range
Performance parameters are not applicable
beyond Specified Temperature Range
-40
+85
Table 3. D.C. Electrical Characteristics
Notes:
1.
2.
Derived from validation or characterization of parts, not guaranteed in production.
Accelerometer Low Power Mode supports the following output data rates (ODRs): 0.24, 0.49, 0.98, 1.95, 3.91, 7.81, 15.63, 31.25, 62.50,
125, 250, 500Hz. Supply current for any update rate can be calculated as: Supply Current in µA = 6.9 + Update Rate * 0.376
Document Number: PS-MPU-6500A-01
Revision: 1.3
Page 9 of 39
MPU-6500
3.3.2
A.C. Electrical Characteristics
Typical Operating Circuit of section 4.2, VDD = 1.8V, VDDIO = 1.8V, TA=25°C, unless otherwise noted.
Parameter
Conditions
MIN
TYP
MAX
Units
100
ms
85
°C
NOTES
SUPPLIES
Supply Ramp Time
Monotonic ramp. Ramp rate is
10% to 90% of the final value
0.1
1
TEMPERATURE SENSOR
Operating Range
Ambient
Sensitivity
Untrimmed
Room Temp Offset
21°C
-40
333.87
LSB/°C
0
LSB
1
Power-On RESET
Supply Ramp Time (TRAMP)
Valid power-on RESET
Start-up time for register read/write
From power-up
I2C ADDRESS
AD0 = 0
AD0 = 1
0.01
20
100
ms
1
11
100
ms
1
1101000
1101001
DIGITAL INPUTS (FSYNC, AD0, SCLK, SDI, CS)
VIH, High Level Input Voltage
0.7*VDDIO
V
VIL, Low Level Input Voltage
0.3*VDDIO
CI, Input Capacitance
< 10
V
1
pF
DIGITAL OUTPUT (SDO, INT)
VOH, High Level Output Voltage
RLOAD=1MΩ;
VOL1, LOW-Level Output Voltage
RLOAD=1MΩ;
VOL.INT1, INT Low-Level Output Voltage
Output Leakage Current
OPEN=1, 0.3mA sink
Current
OPEN=1
100
nA
tINT, INT Pulse Width
LATCH_INT_EN=0
50
µs
0.9*VDDIO
V
0.1*VDDIO
V
0.1
V
1
I2C I/O (SCL, SDA)
VIL, LOW Level Input Voltage
-0.5V
0.3*VDDIO
V
VIH, HIGH-Level Input Voltage
0.7*VDDIO
VDDIO + 0.5V
V
Vhys, Hysteresis
VOL, LOW-Level Output Voltage
IOL, LOW-Level Output Current
0.1*VDDIO
3mA sink current
0
VOL=0.4V
VOL=0.6V
3
6
Output Leakage Current
tof, Output Fall Time from VIHmax to VILmax
V
0.4
100
Cb bus capacitance in pf
20+0.1Cb
V
mA
mA
1
nA
250
ns
0.3*VDDIO
V
AUXILLIARY I/O (AUX_CL, AUX_DA)
VIL, LOW-Level Input Voltage
-0.5V
VIH, HIGH-Level Input Voltage
0.7* VDDIO
Vhys, Hysteresis
VDDIO + 0.5V
0.1* VDDIO
V
V
VOL1, LOW-Level Output Voltage
VDDIO > 2V; 1mA sink current
0
0.4
V
VOL3, LOW-Level Output Voltage
VDDIO < 2V; 1mA sink current
0
0.2* VDDIO
V
Document Number: PS-MPU-6500A-01
Revision: 1.3
Page 10 of 39
1
MPU-6500
Parameter
IOL, LOW-Level Output Current
Conditions
VOL
VOL = 0.6V
MIN
=
0.4V
MAX
3
6
Output Leakage Current
tof, Output Fall Time from VIHmax to VILmax
TYP
20+0.1Cb
NOTES
mA
mA
100
Cb bus capacitance in pF
Units
nA
250
ns
INTERNAL CLOCK SOURCE
Sample Rate
Clock Frequency Initial Tolerance
Frequency Variation over Temperature
Fchoice=0,1,2
SMPLRT_DIV=0
Fchoice=3;
DLPFCFG=0 or 7
SMPLRT_DIV=0
Fchoice=3;
DLPFCFG=1,2,3,4,5,6;
SMPLRT_DIV=0
CLK_SEL=0, 6; 25°C
-2
CLK_SEL=1,2,3,4,5; 25°C
-1
CLK_SEL=0,6
-10
+10
CLK_SEL=1,2,3,4,5
Notes:
Derived from validation or characterization of parts, not guaranteed in production.
Guaranteed by design.
Document Number: PS-MPU-6500A-01
Revision: 1.3
kHz
2
8
kHz
2
1
kHz
2
+2
%
1
+1
%
1
%
1
%
1
±1
Table 4. A.C. Electrical Characteristics
1.
2.
32
Page 11 of 39
MPU-6500
3.3.3
Other Electrical Specifications
Typical Operating Circuit of section 4.2, VDD = 1.8V, VDDIO = 1.8V, TA=25°C, unless otherwise noted.
PARAMETER
CONDITIONS
MIN
TYP
MAX
Units
Notes
SERIAL INTERFACE
SPI Operating Frequency, All Registers
Read/Write
Low Speed Characterization
100 ±10%
kHz
1
High Speed Characterization
1 ±10%
MHz
1
20 ±10%
MHz
1
SPI Operating Frequency, Sensor and
Interrupt Registers Read Only
I2C Operating Frequency
All registers, Fast-mode
400
kHz
1
All registers, Standard-mode
100
kHz
1
Table 5. Other Electrical Specifications
Notes:
1.
Derived from validation or characterization of parts, not guaranteed in production.
Document Number: PS-MPU-6500A-01
Revision: 1.3
Page 12 of 39
MPU-6500
3.4
I2C TIMING CHARACTERIZATION
Typical Operating Circuit of section 4.2, VDD = 1.8V, VDDIO = 1.8V, TA=25°C, unless otherwise noted.
Parameters
Conditions
I2C TIMING
I2C FAST-MODE
Min
Typical
Max
Units
Notes
400
kHz
2
1
fSCL, SCL Clock Frequency
tHD.STA, (Repeated) START Condition Hold Time
0.6
µs
2
tLOW, SCL Low Period
1.3
µs
2
tHIGH, SCL High Period
0.6
µs
2
tSU.STA, Repeated START Condition Setup Time
0.6
µs
2
tHD.DAT, SDA Data Hold Time
0
µs
2
tSU.DAT, SDA Data Setup Time
100
ns
2
ns
2
tr, SDA and SCL Rise Time
Cb bus cap. from 10 to 400pF
20+0.1Cb
300
tf, SDA and SCL Fall Time
Cb bus cap. from 10 to 400pF
20+0.1Cb
300
ns
2
tSU.STO, STOP Condition Setup Time
0.6
µs
2
tBUF, Bus Free Time Between STOP and START
Condition
1.3
µs
2
Cb, Capacitive Load for each Bus Line
< 400
tVD.DAT, Data Valid Time
tVD.ACK, Data Valid Acknowledge Time
Table 6.
I2C
pF
2
0.9
µs
2
0.9
µs
2
Timing Characteristics
Notes:
1.
2.
Timing Characteristics apply to both Primary and Auxiliary I2C Bus
Based on characterization of 5 parts over temperature and voltage as mounted on evaluation board or in sockets
Figure 1. I2C Bus Timing Diagram
Document Number: PS-MPU-6500A-01
Revision: 1.3
Page 13 of 39
MPU-6500
3.5
SPI TIMING CHARACTERIZATION
Typical Operating Circuit of section 4.2, VDD = 1.8V, VDDIO = 1.8V, TA=25°C, unless otherwise noted.
Parameters
Conditions
Min
Typical
Max
Units
1
Notes
SPI TIMING
fSCLK, SCLK Clock Frequency
MHz
1
tLOW, SCLK Low Period
400
ns
1
tHIGH, SCLK High Period
400
ns
1
tSU.CS, CS Setup Time
8
ns
1
tHD.CS, CS Hold Time
500
ns
1
tSU.SDI, SDI Setup Time
11
ns
1
ns
1
ns
1
ns
1
ns
1
tHD.SDI, SDI Hold Time
7
tVD.SDO, SDO Valid Time
Cload = 20pF
tHD.SDO, SDO Hold Time
Cload = 20pF
100
4
tDIS.SDO, SDO Output Disable Time
50
Table 7. SPI Timing Characteristics
Notes:
1.
Based on characterization of 5 parts over temperature and voltage as mounted on evaluation board or in sockets
Figure 2. SPI Bus Timing Diagram
Document Number: PS-MPU-6500A-01
Revision: 1.3
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MPU-6500
3.5.1
fSCLK = 20 MHz
Parameters
Conditions
Min
Typical
Max
Units
Notes
20
MHz
1
SPI TIMING
fSCLK, SCLK Clock Frequency
0.9
tLOW, SCLK Low Period
-
-
ns
tHIGH, SCLK High Period
-
-
ns
tSU.CS, CS Setup Time
1
ns
1
tHD.CS, CS Hold Time
1
ns
1
tSU.SDI, SDI Setup Time
0
ns
1
tHD.SDI, SDI Hold Time
1
ns
1
ns
1
ns
1
tVD.SDO, SDO Valid Time
Cload = 20pF
tDIS.SDO, SDO Output Disable Time
25
25
Table 8. fCLK = 20 MHz
Notes:
1.
Based on characterization of 5 parts over temperature and voltage as mounted on evaluation board or in sockets
Document Number: PS-MPU-6500A-01
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MPU-6500
3.6
ABSOLUTE MAXIMUM RATINGS
Stress above those listed as “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these conditions is not implied. Exposure to the absolute
maximum ratings conditions for extended periods may affect device reliability.
Parameter
Rating
Supply Voltage, VDD
-0.5V to +4V
Supply Voltage, VDDIO
-0.5V to +4V
REGOUT
-0.5V to 2V
Input Voltage Level (AUX_DA, AD0, FSYNC, INT, SCL, SDA)
-0.5V to VDD + 0.5V
Acceleration (Any Axis, unpowered)
10,000g for 0.2ms
Operating Temperature Range
-40°C to +105°C
Storage Temperature Range
-40°C to +125°C
2kV (HBM);
Electrostatic Discharge (ESD) Protection
250V (MM)
Latch-up
JEDEC Class II (2),125°C, ±100mA
Table 9. Absolute Maximum Ratings
Document Number: PS-MPU-6500A-01
Revision: 1.3
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MPU-6500
4 APPLICATIONS INFORMATION
4.1
PIN OUT DIAGRAM AND SIGNAL DESCRIPTION
Pin Number
Pin Name
7
AUX_CL
I2C Master serial clock, for connecting to external sensors
Pin Description
8
VDDIO
Digital I/O supply voltage
9
AD0 / SDO
10
REGOUT
11
FSYNC
12
INT
Interrupt digital output (totem pole or open-drain)
Note: The Interrupt line should be connected to a pin on the Application
Processor (AP) that can bring the AP out of suspend mode.
13
VDD
Power supply voltage and Digital I/O supply voltage
18
GND
Power supply ground
19
RESV
Reserved. Do not connect.
20
RESV
Reserved. Connect to GND.
21
AUX_DA
I2C Slave Address LSB (AD0); SPI serial data output (SDO)
Regulator filter capacitor connection
Frame synchronization digital input. Connect to GND if unused.
I2C master serial data, for connecting to external sensors
22
nCS
23
SCL / SCLK
Chip select (SPI mode only)
I2C serial clock (SCL); SPI serial clock (SCLK)
24
SDA / SDI
I2C serial data (SDA); SPI serial data input (SDI)
1 – 6, 14 - 17
NC
No Connect pins. Do not connect.
SDA / SDI
SCL / SCLK
nCS
AUX_DA
RESV
RESV
24
23
22
21
20
19
Table 10. Signal Descriptions
NC
1
18 GND
NC
2
17 NC
NC
3
NC
4
NC
5
14 NC
NC
6
13 VDD
16 NC
MPU-6500
7
8
9
10
11
12
AUX_CL
VDDIO
SDO / AD0
REGOUT
FSYNC
INT
15 NC
Figure 3. Pin out Diagram for MPU-6500 3.0x3.0x0.9mm QFN
Document Number: PS-MPU-6500A-01
Revision: 1.3
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MPU-6500
TYPICAL OPERATING CIRCUIT
5
14 NC
6
13 VDD
1.8 – 3.3VDC
C2, 0.1 µF
12
11
15 NC
INT
FSYNC
9
8
C3, 10 nF
REGOUT 10
1.8 – 3.3VDC
C1, 0.1 µF
SDO / AD0
C2, 0.1 µF
INT
12
1.8 – 3.3VDC
7
13 VDD
16 NC
MPU-6500
VDDIO
14 NC
6
11
RESV
NC
NC
5
FSYNC
19
4
NC
9
RESV
NC
NC
REGOUT 10
20
15 NC
4
SDO / AD0
nCS
3
NC
7
AUX_DA
17 NC
NC
3
VDDIO
21
17 NC
16 NC
NC
AUX_CL
22
18
2
18
C3, 10 nF
23
1
NC
2
MPU-6500
GND
NC
1
NC
1.8 – 3.3VDC
SDA / SDI
24
GND
NC
AUX_CL
RESV
RESV
19
20
AUX_DA
21
22
SCL / SCLK
SDA / SDI
nCS
23
24
SCLK
SDI
SCL / SCLK
nCS
VDDIO
SCL
SDA
8
4.2
C1, 0.1 µF
SD0
AD0
(a)
(b)
Figure 4. MPU-6500 QFN Application Schematic. (a) I2C operation, (b) SPI operation.
4.3
BILL OF MATERIALS FOR EXTERNAL COMPONENTS
Component
Label
Specification
Quantity
Regulator Filter Capacitor
C1
Ceramic, X7R, 0.1µF ±10%, 2V
1
VDD Bypass Capacitor
C2
Ceramic, X7R, 0.1µF ±10%, 4V
1
VDDIO Bypass Capacitor
C3
Ceramic, X7R, 10nF ±10%, 4V
1
Table 11. Bill of Materials
Document Number: PS-MPU-6500A-01
Revision: 1.3
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MPU-6500
4.4
BLOCK DIAGRAM
MPU-6500
Self
test
X Accel
ADC
Self
test
Y Accel
ADC
INT
Interrupt
Status
Register
nCS
Slave I2C and
SPI Serial
Interface
FIFO
Z Accel
ADC
Self
test
X Gyro
ADC
Self
test
Y Gyro
ADC
Self
test
Z Gyro
Temp Sensor
SDA / SDI
Signal Conditioning
Self
test
AD0 / SDO
SCL / SCLK
User & Config
Registers
Serial
Interface
Bypass
Mux
Master I2C
Serial
Interface
Sensor
Registers
AUX_CL
AUX_DA
FSYNC
Digital Motion
Processor
(DMP)
ADC
ADC
Bias & LDOs
Charge
Pump
VDD
GND
REGOUT
Figure 5. MPU-6500 Block Diagram
Note: The Interrupt line should be connected to a pin on the Application Processor (AP) that can bring the AP out of suspend mode.
4.5
OVERVIEW
The MPU-6500 is comprised of the following key blocks and functions:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Three-axis MEMS rate gyroscope sensor with 16-bit ADCs and signal conditioning
Three-axis MEMS accelerometer sensor with 16-bit ADCs and signal conditioning
Digital MotionProcessor® (DMP) engine
Primary I2C and SPI serial communications interfaces
Auxiliary I2C serial interface
Self-Test
Clocking
Sensor Data Registers
FIFO
Interrupts
Digital-Output Temperature Sensor
Bias and LDOs
Charge Pump
Standard Power Modes
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MPU-6500
4.6
THREE-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING
The MPU-6500 consists of three independent vibratory MEMS rate gyroscopes, which detect rotation about the X-, Y-,
and Z- Axes. When the gyros are rotated about any of the sense axes, the Coriolis Effect causes a vibration that is
detected by a capacitive pickoff. The resulting signal is amplified, demodulated, and filtered to produce a voltage that
is proportional to the angular rate. This voltage is digitized using individual on-chip 16-bit Analog-to-Digital Converters
(ADCs) to sample each axis. The full-scale range of the gyro sensors may be digitally programmed to ±250, ±500,
±1000, or ±2000 degrees per second (dps). The ADC sample rate is programmable from 8,000 samples per second,
down to 3.9 samples per second, and user-selectable low-pass filters enable a wide range of cut-off frequencies.
4.7
THREE-AXIS MEMS ACCELEROMETER WITH 16-BIT ADCS AND SIGNAL CONDITIONING
The MPU-6500’s 3-Axis accelerometer uses separate proof masses for each axis. Acceleration along a particular axis
induces displacement on the corresponding proof mass, and capacitive sensors detect the displacement differentially.
The MPU-6500’s architecture reduces the accelerometers’ susceptibility to fabrication variations as well as to thermal
drift. When the device is placed on a flat surface, it will measure 0g on the X- and Y-axes and +1g on the Z-axis. The
accelerometers’ scale factor is calibrated at the factory and is nominally independent of supply voltage. Each sensor
has a dedicated sigma-delta ADC for providing digital outputs. The full scale range of the digital output can be adjusted
to ±2g, ±4g, ±8g, or ±16g.
4.8
DIGITAL MOTIONPROCESSOR®
The embedded Digital MotionProcessor® (DMP) within the MPU-6500 offloads computation of motion processing
algorithms from the host processor. The DMP acquires data from accelerometers, gyroscopes, and additional 3rd party
sensors such as magnetometers, and processes the data. The resulting data can be read from the FIFO. The DMP has
access to one of the MPU’s external pins, which can be used for generating interrupts.
The purpose of the DMP is to offload both timing requirements and processing power from the host processor.
Typically, motion processing algorithms should be run at a high rate, often around 200Hz, in order to provide accurate
results with low latency. This is required even if the application updates at a much lower rate; for example, a low
power user interface may update as slowly as 5Hz, but the motion processing should still run at 200Hz. The DMP can
be used to minimize power, simplify timing, simplify the software architecture, and save valuable MIPS on the host
processor for use in applications.
The DMP supports the following functionality:
•
•
•
4.9
Low Power Quaternion (3-Axis Gyroscope)
Screen Orientation (A low-power implementation of Android’s screen rotation algorithm)
Pedometer (InvenSense implementation)
PRIMARY I2C AND SPI SERIAL COMMUNICATIONS INTERFACES
The MPU-6500 communicates to a system processor using either a SPI or an I2C serial interface. The MPU-6500 always
acts as a slave when communicating to the system processor. The LSB of the of the I2C slave address is set by pin 9
(AD0).
4.9.1
MPU-6500 Solution Using I2C Interface
In the figure below, the system processor is an I2C master to the MPU-6500. In addition, the MPU-6500 is an I2C
master to the optional external compass sensor. The MPU-6500 has limited capabilities as an I2C Master, and depends
on the system processor to manage the initial configuration of any auxiliary sensors. The MPU-6500 has an interface
bypass multiplexer, which connects the system processor I2C bus pins 23 and 24 (SDA and SCL) directly to the auxiliary
sensor I2C bus pins 6 and 7 (AUX_DA and AUX_CL).
Document Number: PS-MPU-6500A-01
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MPU-6500
Once the auxiliary sensors have been configured by the system processor, the interface bypass multiplexer should be
disabled so that the MPU-6500 auxiliary I2C master can take control of the sensor I2C bus and gather data from the
auxiliary sensors.
For further information regarding I2C master control, please refer to section 6.
Interrupt
Status
Register
MPU-6500
AD0
Slave I2C
or SPI
Serial
Interface
FIFO
I2C Processor Bus: for reading all
sensor data from MPU and for
configuring external sensors (i.e.
compass in this example)
INT
VDD or GND
SCL
SCL
SDA/SDI
SDA
System
Processor
Sensor I2C Bus: for
configuring and reading
from external sensors
User & Config
Registers
Sensor
Master I2C
Serial
Interface
Sensor
Register
Factory
Calibration
Optional
Interface
Bypass
Mux
Digital
Motion
Processor
(DMP)
AUX_CL
SCL
AUX_DA
SDA
Compass
Interface bypass mux allows
direct configuration of
compass by system processor
Bias & LDOs
VDD
GND
REGOUT
Figure 6. MPU-6500 Solution Using I2C Interface
Note: The Interrupt line should be connected to a pin on the Application Processor (AP) that can bring the AP out of suspend mode.
Document Number: PS-MPU-6500A-01
Revision: 1.3
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MPU-6500
4.9.2
MPU-6500 Solution Using SPI Interface
In the figure below, the system processor is an SPI master to the MPU-6500. Pins 8, 9, 23, and 24 are used to support
the CS, SDO, SCLK, and SDI signals for SPI communications. Because these SPI pins are shared with the I2C slave pins (9,
23 and 24), the system processor cannot access the auxiliary I2C bus through the interface bypass multiplexer, which
connects the processor I2C interface pins to the sensor I2C interface pins. Since the MPU-6500 has limited capabilities
as an I2C Master, and depends on the system processor to manage the initial configuration of any auxiliary sensors,
another method must be used for programming the sensors on the auxiliary sensor I2C bus pins 6 and 7 (AUX_DA and
AUX_CL).
When using SPI communications between the MPU-6500 and the system processor, configuration of devices on the
auxiliary I2C sensor bus can be achieved by using I2C Slaves 0-4 to perform read and write transactions on any device
and register on the auxiliary I2C bus. The I2C Slave 4 interface can be used to perform only single byte read and write
transactions. Once the external sensors have been configured, the MPU-6500 can perform single or multi-byte reads
using the sensor I2C bus. The read results from the Slave 0-3 controllers can be written to the FIFO buffer as well as to
the external sensor registers.
For further information regarding the control of the MPU-6500’s auxiliary I2C interface, please refer to the MPU-6500
Register Map and Register Descriptions document.
Processor SPI Bus: for reading all
data from MPU and for configuring
MPU and external sensors
Interrupt
Status
Register
INT
nCS
nCS
MPU-6500
Slave I2C
or SPI
Serial
Interface
FIFO
SDI
SDO
SCLK
SCLK
System
Processor
SDO
SDI
Sensor I2C Bus: for
configuring and
reading data from
external sensors
Config
Register
Sensor
Master I2C
Serial
Interface
Sensor
Register
Factory
Calibration
Optional
Interface
Bypass
Mux
Digital
Motion
Processor
(DMP)
AUX_CL
SCL
AUX_DA
SDA
Compass
I2C Master performs
read and write
transactions on
Sensor I2C bus.
Bias & LDOs
VDD
GND
REGOUT
Figure 7. MPU-6500 Solution Using SPI Interface
Note: The Interrupt line should be connected to a pin on the Application Processor (AP) that can bring the AP out of suspend mode.
4.10
AUXILIARY I2C SERIAL INTERFACE
The MPU-6500 has an auxiliary I2C bus for communicating to an off-chip 3-Axis digital output magnetometer or other
sensors. This bus has two operating modes:
•
•
I2C Master Mode: The MPU-6500 acts as a master to any external sensors connected to the auxiliary I2C bus
Pass-Through Mode: The MPU-6500 directly connects the primary and auxiliary I2C buses together, allowing
the system processor to directly communicate with any external sensors.
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MPU-6500
4.10.1
•
Auxiliary I2C Bus Modes of Operation:
I2C Master Mode: Allows the MPU-6500 to directly access the data registers of external digital sensors, such
as a magnetometer. In this mode, the MPU-6500 directly obtains data from auxiliary sensors without
intervention from the system applications processor.
For example, In I2C Master mode, the MPU-6500 can be configured to perform burst reads, returning the
following data from a magnetometer:
o
o
o
X magnetometer data (2 bytes)
Y magnetometer data (2 bytes)
Z magnetometer data (2 bytes)
The I2C Master can be configured to read up to 24 bytes from up to 4 auxiliary sensors. A fifth sensor can be
configured to work single byte read/write mode.
•
4.11
Pass-Through Mode: Allows an external system processor to act as master and directly communicate to the
external sensors connected to the auxiliary I2C bus pins (AUX_DA and AUX_CL). In this mode, the auxiliary I2C
bus control logic (3rd party sensor interface block) of the MPU-6500 is disabled, and the auxiliary I2C pins
AUX_DA and AUX_CL (Pins 6 and 7) are connected to the main I2C bus (Pins 23 and 24) through analog
switches internally.
Pass-Through mode is useful for configuring the external sensors, or for keeping the MPU-6500 in a lowpower mode when only the external sensors are used. In this mode the system processor can still access
MPU-6500 data through the I2C interface.
SELF-TEST
Please refer to the register map document for more details on self-test.
Self-test allows for the testing of the mechanical and electrical portions of the sensors. The self-test for each
measurement axis can be activated by means of the gyroscope and accelerometer self-test registers (registers 13 to
16).
When the self-test is activated, the electronics cause the sensors to be actuated and produce an output signal. The
output signal is used to observe the self-test response.
The self-test response is defined as follows:
SELF-TEST RESPONSE = SENSOR OUTPUT WITH SELF-TEST ENABLED – SENSOR OUTPUT WITHOUT SELF-TEST ENABLED
The self-test response for each gyroscope axis is defined in the gyroscope specification table, while that for each
accelerometer axis is defined in the accelerometer specification table.
When the value of the self-test response is within the specified min/max limits of the product specification, the part
has passed self-test. When the self-test response exceeds the min/max values, the part is deemed to have failed selftest. It is recommended to use InvenSense MotionApps software for executing self-test.
4.12
CLOCKING
The MPU-6500 has a flexible clocking scheme, allowing a variety of internal clock sources to be used for the internal
synchronous circuitry. This synchronous circuitry includes the signal conditioning and ADCs, the DMP, and various
control circuits and registers. An on-chip PLL provides flexibility in the allowable inputs for generating this clock.
Allowable internal sources for generating the internal clock are:
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MPU-6500
•
•
An internal relaxation oscillator
Any of the X, Y, or Z gyros (MEMS oscillators with a variation of ±1% over temperature)
Selection of the source for generating the internal synchronous clock depends on the requirements for power
consumption and clock accuracy. These requirements will most likely vary by mode of operation. For example, in one
mode, where the biggest concern is power consumption, the user may wish to operate the Digital MotionProcessor of
the MPU-6500 to process accelerometer data, while keeping the gyros off. In this case, the internal relaxation
oscillator is a good clock choice. However, in another mode, where the gyros are active, selecting the gyros as the
clock source provides for a more accurate clock source.
Clock accuracy is important, since timing errors directly affect the distance and angle calculations performed by the
Digital MotionProcessor (and by extension, by any processor).
There are also start-up conditions to consider. When the MPU-6500 first starts up, the device uses its internal clock
until programmed to operate from another source. This allows the user, for example, to wait for the MEMS oscillators
to stabilize before they are selected as the clock source.
4.13
SENSOR DATA REGISTERS
The sensor data registers contain the latest gyro, accelerometer, auxiliary sensor, and temperature measurement
data. They are read-only registers, and are accessed via the serial interface. Data from these registers may be read
anytime.
4.14
FIFO
The MPU-6500 contains a 512-byte FIFO register that is accessible via the Serial Interface. The FIFO configuration
register determines which data is written into the FIFO. Possible choices include gyro data, accelerometer data,
temperature readings, auxiliary sensor readings, and FSYNC input. A FIFO counter keeps track of how many bytes of
valid data are contained in the FIFO. The FIFO register supports burst reads. The interrupt function may be used to
determine when new data is available.
For further information regarding the FIFO, please refer to the MPU-6500 Register Map and Register Descriptions
document.
4.15
INTERRUPTS
Interrupt functionality is configured via the Interrupt Configuration register. Items that are configurable include the
INT pin configuration, the interrupt latching and clearing method, and triggers for the interrupt. Items that can trigger
an interrupt are (1) Clock generator locked to new reference oscillator (used when switching clock sources); (2) new
data is available to be read (from the FIFO and Data registers); (3) accelerometer event interrupts; and (4) the MPU6500 did not receive an acknowledge from an auxiliary sensor on the secondary I2C bus. The interrupt status can be
read from the Interrupt Status register.
For further information regarding interrupts, please refer to the MPU-6500 Register Map and Register Descriptions
document.
4.16
DIGITAL-OUTPUT TEMPERATURE SENSOR
An on-chip temperature sensor and ADC are used to measure the MPU-6500 die temperature. The readings from the
ADC can be read from the FIFO or the Sensor Data registers.
4.17
BIAS AND LDOS
The bias and LDO section generates the internal supply and the reference voltages and currents required by the MPU6500. Its two inputs are an unregulated VDD and a VDDIO logic reference supply voltage. The LDO output is bypassed
by a capacitor at REGOUT. For further details on the capacitor, please refer to the Bill of Materials for External
Components.
Document Number: PS-MPU-6500A-01
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Page 24 of 39
MPU-6500
4.18
CHARGE PUMP
An on-chip charge pump generates the high voltage required for the MEMS oscillators.
4.19
STANDARD POWER MODES
The following table lists the user-accessible power modes for MPU-6500.
Mode
Name
Gyro
Accel
DMP
1
Sleep Mode
Off
Off
Off
2
Standby Mode
Drive On
Off
Off
3
Low-Power Accelerometer Mode
Off
Duty-Cycled
Off
4
Low-Noise Accelerometer Mode
Off
On
Off
5
Gyroscope Mode
On
Off
On or Off
6
6-Axis Mode
On
On
On or Off
Table 12. Standard Power Modes for MPU-6500
Notes:
1.
Power consumption for individual modes can be found in section 3.3.1.
Document Number: PS-MPU-6500A-01
Revision: 1.3
Page 25 of 39
MPU-6500
5 PROGRAMMABLE INTERRUPTS
The MPU-6500 has a programmable interrupt system which can generate an interrupt signal on the INT pin. Status
flags indicate the source of an interrupt. Interrupt sources may be enabled and disabled individually.
Interrupt Name
Module
Motion Detection
Motion
FIFO Overflow
FIFO
Data Ready
Sensor Registers
I C Master errors: Lost Arbitration, NACKs
I2C Master
I C Slave 4
I2C Master
2
2
Table 13. Table of Interrupt Sources
For information regarding the interrupt enable/disable registers and flag registers, please refer to the MPU-6500
Register Map and Register Descriptions document. Some interrupt sources are explained below.
Document Number: PS-MPU-6500A-01
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Page 26 of 39
MPU-6500
5.1
WAKE-ON-MOTION INTERRUPT
The MPU-6500 provides motion detection capability. A qualifying motion sample is one where the high passed sample
from any axis has an absolute value exceeding a user-programmable threshold. The following flowchart explains how
to configure the Wake-on-Motion Interrupt. For further details on individual registers, please refer to the MPU-6500
Registers Map and Registers Description document.
Configuration Wake-on-Motion Interrupt using low power Accel mode
Make Sure Accel is running:
• In PWR_MGMT_1 (0x6B) make CYCLE =0, SLEEP = 0 and STANDBY = 0
• In PWR_MGMT_2 (0x6C) set DIS_XA, DIS_YA, DIS_ZA = 0 and DIS_XG, DIS_YG, DIS_ZG = 1
Set Accel LPF setting to 184 Hz Bandwidth:
• In ACCEL_CONFIG 2 (0x1D) set ACCEL_FCHOICE_B = 0 and A_DLPFCFG[2:0]=1(b001)
Enable Motion Interrupt:
• In INT_ENABLE (0x38), set the whole register to 0x40 to enable motion interrupt only.
Enable Accel Hardware Intelligence:
• In MOT_DETECT_CTRL (0x69), set ACCEL_INTEL_EN = 1 and ACCEL_INTEL_MODE = 1
Set Motion Threshold:
• In WOM_THR (0x1F), set the WOM_Threshold [7:0] to 1~255 LSBs (0~1020mg)
Set Frequency of Wake-up:
• In LP_ACCEL_ODR (0x1E), set Lposc_clksel [3:0] = 0.24Hz ~ 500Hz
Enable Cycle Mode (Accel Low Power Mode):
• In PWR_MGMT_1 (0x6B) make CYCLE =1
Motion Interrupt Configuration Completed
Figure 8. Wake-on-Motion Interrupt Configuration
Document Number: PS-MPU-6500A-01
Revision: 1.3
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MPU-6500
6 DIGITAL INTERFACE
6.1
I2C AND SPI SERIAL INTERFACES
The internal registers and memory of the MPU-6500 can be accessed using either I2C at 400 kHz or SPI at 1 MHz. SPI
operates in four-wire mode.
Pin Number
Pin Name
Pin Description
6
VDDIO
7
AD0 / SDO
I2C Slave Address LSB (AD0); SPI serial data output (SDO)
21
SCL / SCLK
I2C serial clock (SCL); SPI serial clock (SCLK)
22
SDA / SDI
I2C serial data (SDA); SPI serial data input (SDI)
Digital I/O supply voltage.
Table 14. Serial Interface
Note:To prevent switching into I C mode when using SPI, the I2C interface should be disabled by setting the I2C_IF_DIS configuration bit. Setting this
bit should be performed immediately after waiting for the time specified by the “Start-Up Time for Register Read/Write” in Section 6.3.
2
For further information regarding the I2C_IF_DIS bit, please refer to the MPU-6500 Register Map and Register Descriptions document.
6.2
I2C INTERFACE
I2C is a two-wire interface comprised of the signals serial data (SDA) and serial clock (SCL). In general, the lines are
open-drain and bi-directional. In a generalized I2C interface implementation, attached devices can be a master or a
slave. The master device puts the slave address on the bus, and the slave device with the matching address
acknowledges the master.
The MPU-6500 always operates as a slave device when communicating to the system processor, which thus acts as the
master. SDA and SCL lines typically need pull-up resistors to VDD. The maximum bus speed is 400 kHz.
The slave address of the MPU-6500 is b110100X which is 7 bits long. The LSB bit of the 7 bit address is determined by
the logic level on pin AD0. This allows two MPU-6500s to be connected to the same I2C bus. When used in this
configuration, the address of the one of the devices should be b1101000 (pin AD0 is logic low) and the address of the
other should be b1101001 (pin AD0 is logic high).
6.3
I2C COMMUNICATIONS PROTOCOL
START (S) and STOP (P) Conditions
Communication on the I2C bus starts when the master puts the START condition (S) on the bus, which is defined as a
HIGH-to-LOW transition of the SDA line while SCL line is HIGH (see figure below). The bus is considered to be busy until
the master puts a STOP condition (P) on the bus, which is defined as a LOW to HIGH transition on the SDA line while
SCL is HIGH (see Figure 9).
Additionally, the bus remains busy if a repeated START (Sr) is generated instead of a STOP condition.
SDA
SCL
S
P
START condition
STOP condition
Figure 9. START and STOP Conditions
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MPU-6500
Data Format / Acknowledge
I2C data bytes are defined to be 8-bits long. There is no restriction to the number of bytes transmitted per data
transfer. Each byte transferred must be followed by an acknowledge (ACK) signal. The clock for the acknowledge
signal is generated by the master, while the receiver generates the actual acknowledge signal by pulling down SDA and
holding it low during the HIGH portion of the acknowledge clock pulse.
If a slave is busy and cannot transmit or receive another byte of data until some other task has been performed, it can
hold SCL LOW, thus forcing the master into a wait state. Normal data transfer resumes when the slave is ready and
releases the clock line (refer to Figure 10).
DATA OUTPUT BY
TRANSMITTER (SDA)
not acknowledge
DATA OUTPUT BY
RECEIVER (SDA)
acknowledge
SCL FROM
MASTER
1
2
9
clock pulse for
acknowledgement
START
condition
Figure 10. Acknowledge on the I2C Bus
Document Number: PS-MPU-6500A-01
Revision: 1.3
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MPU-6500
Communications
After beginning communications with the START condition (S), the master sends a 7-bit slave address followed by an
8th bit, the read/write bit. The read/write bit indicates whether the master is receiving data from or is writing to the
slave device. Then, the master releases the SDA line and waits for the acknowledge signal (ACK) from the slave device.
Each byte transferred must be followed by an acknowledge bit. To acknowledge, the slave device pulls the SDA line
LOW and keeps it LOW for the high period of the SCL line. Data transmission is always terminated by the master with
a STOP condition (P), thus freeing the communications line. However, the master can generate a repeated START
condition (Sr), and address another slave without first generating a STOP condition (P). A LOW to HIGH transition on
the SDA line while SCL is HIGH defines the stop condition. All SDA changes should take place when SCL is low, with the
exception of start and stop conditions.
SDA
SCL
1–7
8
9
1–7
8
9
1–7
8
9
S
P
START ADDRESS
condition
R/W
ACK
DATA
ACK
DATA
ACK
STOP
condition
Figure 11. Complete I2C Data Transfer
To write the internal MPU-6500 registers, the master transmits the start condition (S), followed by the I2C address and
the write bit (0). At the 9th clock cycle (when the clock is high), the MPU-6500 acknowledges the transfer. Then the
master puts the register address (RA) on the bus. After the MPU-6500 acknowledges the reception of the register
address, the master puts the register data onto the bus. This is followed by the ACK signal, and data transfer may be
concluded by the stop condition (P). To write multiple bytes after the last ACK signal, the master can continue
outputting data rather than transmitting a stop signal. In this case, the MPU-6500 automatically increments the
register address and loads the data to the appropriate register. The following figures show single and two-byte write
sequences.
Single-Byte Write Sequence
Master
S
AD+W
Slave
RA
ACK
DATA
P
ACK
ACK
Burst Write Sequence
Master
Slave
S
AD+W
RA
ACK
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DATA
ACK
DATA
ACK
Page 30 of 39
P
ACK
MPU-6500
To read the internal MPU-6500 registers, the master sends a start condition, followed by the I2C address and a write
bit, and then the register address that is going to be read. Upon receiving the ACK signal from the MPU-6500, the
master transmits a start signal followed by the slave address and read bit. As a result, the MPU-6500 sends an ACK
signal and the data. The communication ends with a not acknowledge (NACK) signal and a stop bit from master. The
NACK condition is defined such that the SDA line remains high at the 9th clock cycle. The following figures show single
and two-byte read sequences.
Single-Byte Read Sequence
Master
S
AD+W
RA
Slave
S
ACK
AD+R
ACK
NACK
ACK
P
DATA
Burst Read Sequence
Master
S
AD+W
RA
Slave
6.4
ACK
S
AD+R
ACK
ACK
ACK
DATA
NACK
DATA
I2C TERMS
Signal
S
Description
Start Condition: SDA goes from high to low while SCL is high
AD
Slave I2C address
W
Write bit (0)
R
Read bit (1)
ACK
NACK
RA
DATA
P
Acknowledge: SDA line is low while the SCL line is high at the 9th clock cycle
Not-Acknowledge: SDA line stays high at the 9th clock cycle
MPU-6500 internal register address
Transmit or received data
Stop condition: SDA going from low to high while SCL is high
Table 15. I2C Terms
Document Number: PS-MPU-6500A-01
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P
MPU-6500
6.5
SPI INTERFACE
SPI is a 4-wire synchronous serial interface that uses two control lines and two data lines. The MPU-6500 always
operates as a Slave device during standard Master-Slave SPI operation.
With respect to the Master, the Serial Clock output (SCLK), the Serial Data Output (SDO) and the Serial Data Input (SDI)
are shared among the Slave devices. Each SPI slave device requires its own Chip Select (CS) line from the master.
CS goes low (active) at the start of transmission and goes back high (inactive) at the end. Only one CS line is active at a
time, ensuring that only one slave is selected at any given time. The CS lines of the non-selected slave devices are held
high, causing their SDO lines to remain in a high-impedance (high-z) state so that they do not interfere with any active
devices.
SPI Operational Features
1.
2.
3.
4.
5.
Data is delivered MSB first and LSB last
Data is latched on the rising edge of SCLK
Data should be transitioned on the falling edge of SCLK
The maximum frequency of SCLK is 1MHz
SPI read and write operations are completed in 16 or more clock cycles (two or more bytes). The first byte
contains the SPI Address, and the following byte(s) contain(s) the SPI data. The first bit of the first byte
contains the Read/Write bit and indicates the Read (1) or Write (0) operation. The following 7 bits contain the
Register Address. In cases of multiple-byte Read/Writes, data is two or more bytes:
SPI Address format
MSB
R/W
A6
A5
A4
A3
A2
A1
LSB
A0
D1
LSB
D0
SPI Data format
MSB
D7
6.
D6
D5
D4
D3
D2
Supports Single or Burst Read/Writes.
SCLK
SDI
SDO
SPI Master
/CS1
SPI Slave 1
/CS
/CS2
SCLK
SDI
SDO
/CS
SPI Slave 2
Figure 12 Typical SPI Master / Slave Configuration
Figure 12. Typical SPI Master / Slave Configuration
Document Number: PS-MPU-6500A-01
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MPU-6500
7 SERIAL INTERFACE CONSIDERATIONS
7.1
MPU-6500 SUPPORTED INTERFACES
The MPU-6500 supports I2C communications on both its primary (microprocessor) serial interface and its auxiliary
interface.
The MPU-6500’s I/O logic levels are set to be VDDIO.
The figure below depicts a sample circuit of MPU-6500 with a third-party magnetometer attached to the auxiliary I2C
bus. It shows the relevant logic levels and voltage connections.
Note: Actual configuration will depend on the auxiliary sensors used.
VDDIO
(0V - VDDIO)
VDD
INT
SDA
SCL
FSYNC
VDDIO
(0V - VDDIO)
VDDIO
(0V - VDDIO)
(0V - VDDIO)
MPU-6500
VDD_IO
VDDIO
AUX_DA
(0V, VDDIO)
AD0
VDD_IO
System
Processor IO
VDDIO
VDD
(0V - VDDIO)
SYSTEM BUS
AUX_CL
(0V - VDDIO)
(0V - VDDIO)
3rd Party
Magnetometer
CS
SDA
INT 1
SCL
INT 2
SA0
(0V, VDDIO)
(0V - VDDIO)
(0V - VDDIO)
(0V, VDDIO)
Figure 13. I/O Levels and Connections
Note: The Interrupt line should be connected to a pin on the Application Processor (AP) that can bring the AP out of suspend mode.
Document Number: PS-MPU-6500A-01
Revision: 1.3
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MPU-6500
8 ASSEMBLY
This section provides general guidelines for assembling InvenSense Micro Electro-Mechanical Systems (MEMS) gyros
packaged in Quad Flat No leads package (QFN) surface mount integrated circuits.
8.1
ORIENTATION OF AXES
The diagram below shows the orientation of the axes of sensitivity and the polarity of rotation. Note the pin 1
identifier (•) in the figure.
+Z
+Y
+Z
MP
U-
+Y
65
00
+X
+X
Figure 14. Orientation of Axes of Sensitivity and Polarity of Rotation
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MPU-6500
8.2
PACKAGE DIMENSIONS
24 Lead QFN (3x3x0.9) mm NiPdAu Lead-frame finish
h
w
SYMBOLS
A
A1
b
c
D
D2
E
E2
e
f (e-b)
K
L
R
R’
R’’
s
h
w
y
DIMENSIONS IN MILLIMETERS
MIN
NOM
MAX
DESCRIPTION
Package thickness
Lead finger (pad) seating height
Lead finger (pad) width
Lead frame (pad) height
Package width
Exposed pad width
Package length
Exposed pad length
Lead finger-finger (pad-pad) pitch
Lead-lead (Pad-Pad) space
Lead (pad) to Exposed Pad Space
Lead (pad) length
Lead (pad) corner radius
Corner lead (pad) outer radius
Corner lead (pad) inner radius
Corner lead-lead (pad-pad) spacing
Corner lead dimension
Corner lead dimension
Lead Conformality
Document Number: PS-MPU-6500A-01
Revision: 1.3
Page 35 of 39
0.85
0.00
0.15
--2.90
1.65
2.90
1.49
--0.15
--0.25
0.075
0.10
0.10
--0.00
0.90
0.02
0.20
0.20 REF
3.00
1.70
3.00
1.54
0.40
0.20
0.35 REF
0.30
REF
0.11
0.11
0.25 REF
0.22
0.12
---
0.95
0.05
0.25
--3.10
1.75
3.10
1.59
--0.25
--0.35
--0.12
0.12
--0.075
MPU-6500
9 PART NUMBER PACKAGE MARKING
The part number package marking for MPU-6500 devices is summarized below:
Part Number
Part Number Package Marking
MPU-6500
MP65
Document Number: PS-MPU-6500A-01
Revision: 1.3
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MPU-6500
10 RELIABILITY
10.1
QUALIFICATION TEST POLICY
InvenSense’s products complete a Qualification Test Plan before being released to production. The Qualification Test
Plan for the MPU-6500 followed the JESD47I Standards, “Stress-Test-Driven Qualification of Integrated Circuits,” with
the individual tests described below.
10.2
QUALIFICATION TEST PLAN
TEST
Method/Condition
Lot
Quantity
Sample /
Lot
Acc /
Reject
Criteria
(HTOL/LFR)
High Temperature Operating Life
JEDEC JESD22-A108D, Dynamic, 3.63V biased, Tj>125°C [readpoints 168, 500, 1000 hours]
3
77
(0/1)
(HAST)
Highly Accelerated Stress Test (1)
JEDEC JESD22-A118A
Condition A, 130°C, 85%RH, 33.3 psia. unbiased, [read-point 96
hours]
3
77
(0/1)
(HTS)
High Temperature Storage Life
JEDEC JESD22-A103D, Cond. A, 125°C Non-Bias Bake [readpoints 168, 500, 1000 hours]
3
77
(0/1)
Lot
Quantity
Sample /
Lot
Acc /
Reject
Criteria
Table 16. Accelerated Life Tests
TEST
Method/Condition
(ESD-HBM)
ESD-Human Body Model
ANSI/ESDA/JEDEC JS-001-2012, (2KV)
1
3
(0/1)
(ESD-MM)
ESD-Machine Model
JEDEC JESD22-A115C, (250V)
1
3
(0/1)
(LU)
Latch Up
JEDEC JESD-78D Class II (2), 125°C; ±100mA
1
6
(0/1)
(MS)
Mechanical Shock
JEDEC JESD22-B104C, Mil-Std-883,
Method 2002.5, Cond. E, 10,000g’s, 0.2ms,
±X, Y, Z – 6 directions, 5 times/direction
3
5
(0/1)
(VIB)
Vibration
JEDEC JESD22-B103B, Variable Frequency (random), Cond. B, 5500Hz,
X, Y, Z – 4 times/direction
3
5
(0/1)
(TC)
Temperature Cycling (1)
JEDEC JESD22-A104D
Condition G [-40°C to +125°C],
Soak Mode 2 [5’], 1000 cycles
3
77
(0/1)
Table 17. Device Component Level Tests
Note: Tests are preceded by MSL3 Preconditioning in accordance with JEDEC JESD22-A113F
Document Number: PS-MPU-6500A-01
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MPU-6500
11 REFERENCE
Please refer to “InvenSense MEMS Handling Application Note (AN-IVS-0002A-00)” for the following information:
•
•
Manufacturing Recommendations
o Assembly Guidelines and Recommendations
o PCB Design Guidelines and Recommendations
o MEMS Handling Instructions
o ESD Considerations
o Reflow Specification
o Storage Specifications
o Package Marking Specification
o Tape & Reel Specification
o Reel & Pizza Box Label
o Packaging
o Representative Shipping Carton Label
Compliance
o Environmental Compliance
o DRC Compliance
o Compliance Declaration Disclaimer
Document Number: PS-MPU-6500A-01
Revision: 1.3
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MPU-6500
12 REVISION HISTORY
Revision Date
Revision
Description
09/18/2013
1.0
Initial Release
03/05/2014
1.1
Updated Sections 1, 2, 4, 9, 11
05/08/2014
1.2
Updated Section 1.2
05/15/2020
1.3
Formatting update
This information furnished by InvenSense, Inc. (“InvenSense”) is believed to be accurate and reliable. However, no responsibility is assumed by
InvenSense for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to
change without notice. InvenSense reserves the right to make changes to this product, including its circuits and software, in order to improve its
design and/or performance, without prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding the information and
specifications contained in this document. InvenSense assumes no responsibility for any claims or damages arising from information contained in
this document, or from the use of products and services detailed therein. This includes, but is not limited to, claims or damages based on the
infringement of patents, copyrights, mask work and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by implication or
otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information previously supplied.
Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors should not be used or sold in the
development, storage, production or utilization of any conventional or mass-destructive weapons or for any other weapons or life threatening
applications, as well as in any other life critical applications such as medical equipment, transportation, aerospace and nuclear instruments,
undersea equipment, power plant equipment, disaster prevention and crime prevention equipment.
©2013—2020 InvenSense. All rights reserved. InvenSense, MotionTracking®, MotionProcessing®, MotionProcessor®, MotionFusion®, MotionApps®,
DMP, AAR®, and the InvenSense® logo are trademarks of InvenSense, Inc. The TDK logo is a trademark of TDK Corporation. Other company and
product names may be trademarks of the respective companies with which they are associated.
©2013—2020 InvenSense. All rights reserved.
Document Number: PS-MPU-6500A-01
Revision: 1.3
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