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Chip Beads(SMD Array) For General Signal Line
MZA Series MZA1608 Type
FEATURES • A single MZA series chip provides noise attenuation for four lines, making it ideal for use with I/O lines of various highly miniaturized. • Electronic equipment, such as portable products, which comprise high density circuitry. • Low crosstalk between adjacent circuits. • Internal electrodes feature low DC resistance, minimizing wasteful power consumption. • Electroplated terminal electrodes accommodate reflow soldering. • Monolithic structure ensures high reliability. • It is a product conforming to RoHS directive. APPLICATIONS High-frequency noise countermeasure in computers, printers, VCRs, televisions, portable telephones, and other equipment. PRODUCT IDENTIFICATION MZA 1608 S 121 C T (1) (2) (3) (4) (5) (6) (1) Series name (2) Dimensions L× W (3) Material code (4) Nominal impedance 121:120Ω at 100MHz (5) Characteristic type (6) Packaging style T:Taping RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING
Conformity to RoHS Directive
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN
1.6± 0.1 0.8± 0.1 Ferrite 0.5 0.4 0.2 Dimensions in mm Terminal electrode 1.1 to 1.4
0.15
0.4 0.5± 0.1
0.2
CIRCUIT DIAGRAM
• No polarity
TEMPERATURE RANGES
Operating/storage –55 to +125°C
PACKAGING STYLE AND QUANTITIES
Packaging style Taping Quantity 5000 pieces/reel
10s max. 250 to 260˚C 230˚C Natural cooling
180˚C 150˚C Preheating 60 to 120s Time(s) Soldering 30 to 60s
HANDLING AND PRECAUTIONS • Before soldering, be sure to preheat components. The preheating temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150°C. • After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. • The inductance value may change due to magnetic saturation if the current exceeds the rated maximum. • Do not expose the inductors to stray magnetic fields. • Avoid static electricity discharge during handling. • When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed 350°C. Soldering time should not exceed 3 seconds. • This product does not apply to flow soldering construction method.
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. • Please contact our Sales office when your application are considered the following: The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice. 001-01 / 20070723 / e9421_mza1608.fm
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ELECTRICAL CHARACTERISTICS
Part No. MZA1608S800C MZA1608S121C MZA1608S241C
∗
Impedance (Ω)[100MHz]∗ 80±25% 120±25% 240±25%
DC resistance (Ω)max. 0.35 0.4 0.5
Rated current (mA)max. 150 150 150
Test equipment: E4991A or equivalent Test tool: 16192A or equivalent Test temperature: 25±10°C
TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MZA1608S800C MZA1608S121C
160 140
Impedance(Ω) Impedance(Ω)
MZA1608S241C
400 350 300 250 200 150 100 50 10000 0 1 10 100 1000 Frequency (MHz) 10000
X
250 200
Z Z
100 80 60 40 20 0 1 10
150 100 50
R
X
Impedance(Ω)
120
Z R
R
X
100 1000 Frequency (MHz)
10000
0 1
10
100 1000 Frequency (MHz)
PACKAGING STYLES REEL DIMENSIONS
TAPE DIMENSIONS
1.5 +0.1 –0.0 1.75±0.1 300min. Dimensions in mm 2.3±0.2 3.5±0.05 8.0±0.3 0.8max. 1.3± 0.2 4.0± 0.1 2.0± 0.05 4.0± 0.1 160min. Taping 200min. Dimensions in mm Drawing direction
Sprocket hole 1.0
Cavity
2.0± 0.5 ø13± 0.5 ø21± 0.8 ø178± 2.0
9.0± 0.3 13.0± 1.4
• All specifications are subject to change without notice. 001-01 / 20070723 / e9421_mza1608.fm
ø60± 2.0
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