MZA1608S121C

(1/2) Chip Beads(SMD Array) For General Signal Line MZA Series MZA1608 Type FEATURES • A single MZA series chip provides noise attenuation for four lines, making it ideal for use with I/O lines of various highly miniaturized. • Electronic equipment, such as portable products, which comprise high density circuitry. • Low crosstalk between adjacent circuits. • Internal electrodes feature low DC resistance, minimizing wasteful power consumption. • Electroplated terminal electrodes accommodate reflow soldering. • Monolithic structure ensures high reliability. • It is a product conforming to RoHS directive. APPLICATIONS High-frequency noise countermeasure in computers, printers, VCRs, televisions, portable telephones, and other equipment. PRODUCT IDENTIFICATION MZA 1608 S 121 C T (1) (2) (3) (4) (5) (6) (1) Series name (2) Dimensions L× W (3) Material code (4) Nominal impedance 121:120Ω at 100MHz (5) Characteristic type (6) Packaging style T:Taping RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING Conformity to RoHS Directive SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN 1.6± 0.1 0.8± 0.1 Ferrite 0.5 0.4 0.2 Dimensions in mm Terminal electrode 1.1 to 1.4 0.15 0.4 0.5± 0.1 0.2 CIRCUIT DIAGRAM • No polarity TEMPERATURE RANGES Operating/storage –55 to +125°C PACKAGING STYLE AND QUANTITIES Packaging style Taping Quantity 5000 pieces/reel 10s max. 250 to 260˚C 230˚C Natural cooling 180˚C 150˚C Preheating 60 to 120s Time(s) Soldering 30 to 60s HANDLING AND PRECAUTIONS • Before soldering, be sure to preheat components. The preheating temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150°C. • After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. • The inductance value may change due to magnetic saturation if the current exceeds the rated maximum. • Do not expose the inductors to stray magnetic fields. • Avoid static electricity discharge during handling. • When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed 350°C. Soldering time should not exceed 3 seconds. • This product does not apply to flow soldering construction method. • Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. • Please contact our Sales office when your application are considered the following: The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) • All specifications are subject to change without notice. 001-01 / 20070723 / e9421_mza1608.fm (2/2) ELECTRICAL CHARACTERISTICS Part No. MZA1608S800C MZA1608S121C MZA1608S241C ∗ Impedance (Ω)[100MHz]∗ 80±25% 120±25% 240±25% DC resistance (Ω)max. 0.35 0.4 0.5 Rated current (mA)max. 150 150 150 Test equipment: E4991A or equivalent Test tool: 16192A or equivalent Test temperature: 25±10°C TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MZA1608S800C MZA1608S121C 160 140 Impedance(Ω) Impedance(Ω) MZA1608S241C 400 350 300 250 200 150 100 50 10000 0 1 10 100 1000 Frequency (MHz) 10000 X 250 200 Z Z 100 80 60 40 20 0 1 10 150 100 50 R X Impedance(Ω) 120 Z R R X 100 1000 Frequency (MHz) 10000 0 1 10 100 1000 Frequency (MHz) PACKAGING STYLES REEL DIMENSIONS TAPE DIMENSIONS 1.5 +0.1 –0.0 1.75±0.1 300min. Dimensions in mm 2.3±0.2 3.5±0.05 8.0±0.3 0.8max. 1.3± 0.2 4.0± 0.1 2.0± 0.05 4.0± 0.1 160min. Taping 200min. Dimensions in mm Drawing direction Sprocket hole 1.0 Cavity 2.0± 0.5 ø13± 0.5 ø21± 0.8 ø178± 2.0 9.0± 0.3 13.0± 1.4 • All specifications are subject to change without notice. 001-01 / 20070723 / e9421_mza1608.fm ø60± 2.0