SPECIFICATION APPROVAL
SPEC. No. E600NAA00843
DATE:
May.12.2017
MESSRS: BEIJING FOXTAR ELECTRONICS CO. , LTD.
CUSTOMER'S PRODUCT NAME:
TDK PRODUCT NAME:
NTCG20 series
THIS SPECIFICATION IS:
FULLY APPROVED
DENIED
APPROVED UNDER THE FOLLOWING CONDITIONS
SIGNATURE:
NAME(PRINTED):
TITLE:
DATE:
TDK Corporation
SALES
Electronic components
Sales & Marketing Group
ENGINEERING
TDK-EPC Corporation
Piezo & Protection Devices Business Group
APPROVED
APPROVED
Person in Charge
CHECKED
Person in Charge
Product name list
This specification shall be applied to following product name.
1
2
Customer's Product name
TDK Product name
NTCG203NH153JTDS
NTCG203NH153JTDS
Page 1
1. Scope
This specification shall be applied to chip type NTC thermistors delivered to
BEIJING FOXTAR ELECTRONICS CO. , LTD..
2. Description
Item
Page
Revision records
1
Instructions for usage
2
3. Part code designation
3
4. Operating temperature range
3
5. Test condition
3
6. Performance
4
7. Shapes and dimension (Construction)
9
8. Reflow temperature profile
9
9. Application manual
10. Taping
10
11. Package & transport
17
12. Production Country
17
15
Revision records
Rev.
Date.
Revised by
Revision
Business Group
Date
Spec No.
Piezo & Protection Device
Business Group
May.12.2017
E600NAA00843
Page 2
INSTRUCTIONS FOR CHIP NTC THERMISTOR
Please read these instructions before using the chip NTC thermistors.
SAFETY WARNING
Pay careful attention to all warnings and operate only in accordance with safety specifications.
Improper use may cause smoke emissions or fire.
！
WARNING
● Confirm your environment of usage and mounting for the NTC thermistors, and do not operate
the NTC thermistors beyond the rating and performance specified in this specification and catalog.
● Do not operate the NTC thermistors beyond the temperature range specified in this specification.
● Do not operate the NTC thermistors beyond the maximum rated power specified in this specification.
● Do not apply instantly and directly the loads of 5mW and over by the constant voltage power supply,
since NTC thermistors may burn by thermal runaway mode.
● Pay careful attention to the power applied to NTC thermistors, because the thermistor that decreased
the resistance by self heating may damage to the electric machines.
● In case of the electrical machine that consumers can directly touch the NTC thermistors by bare hands,
be thorough about warning that customers do not let touch to the NTC thermistors.
● Store the NTC thermistors in the packages that are used for shipment by TDK and keep the storage
facility in the following environmental conditions:
Temperature : -10 ~ +40°C
Relative humidity : 75% or below
To avoid direct sunshine, rapid temperature change, corrosive gas and dusty place.
Not to apply the load stress.
Do not use NTC thermistors if stored over 6 months.
● Confirm reliability of the NTC thermistors when adding sealant which uses molding materials, adhesive materials,
resin, etc. Furthermore, do not exceed temperature limits specified in this specification when curing these
materials.
● Do not apply the vibration, shock (dropping etc.) and force that are beyond the specified limits in this specification.
● Do not use or store in a wet or humid environment over 85%RH, because it damages to the NTC thermistors.
● Do not use or store in the following environmental conditions:
Corrosive gas(Cl2, NH3, SOX, NOX, H2S etc.)
Electrolyte, water, salt water, etc.
Acidic, alkaline and solvent
Dusty place
● To prevent failure or damage to the NTC thermistors, pay careful attention for mounting as follows;
Do not warp or twist the board before and after mounting and soldering the NTC thermistors.
Design bilaterally symmetric land size.
Do not use the NTC thermistors that dropped or that detached from the board.
Do not use excessive amount of solder.
● Use resin or molding materials that hydrogen(H2) doesn't occur, if these are covered on the NTC thermistors.
● The products listed on this specification sheet are intended for use in general electronic equipment (AV equipment,
telecommunications equipment, home appliances, amusement equipment, computer equipment, personal
equipment, office equipment, measurement equipment, industrial robots) under a normal operation and use
condition.
The products are not designed or warranted to meet the requirements of the applications listed below, whose
performance and/or quality require a more stringent level of safety or reliability, or whose failure, malfunction or
trouble could cause serious damage to society, person or property. If you intend to use the products in the
applications listed below or if you have special requirements exceeding the range or conditions set forth in this
catalog, please contact us.
(1) Aerospace/Aviation equipment
(2) Transportation equipment (cars, electric trains, ships, etc.)
(3) Medical equipment
(4) Power-generation control equipment
(5) Atomic energy-related equipment
(6) Seabed equipment
(7) Transportation control equipment
(8) Public information-processing equipment
(9) Military equipment
(10) Electric heating apparatus, burning equipment
(11) Disaster prevention/crime prevention equipment
(12) Safety equipment
(13) Other applications that are not considered ge etc.
When designing your equipment even for general-purpose applications, you are kindly requested to take into
consideration securing protection circuit/device or providing backup circuits in your equipment.
PLP Spec. No.
NTC095G01
Page 3
3. Part code designation
(Example)
ＮＴＣ Ｇ
２０ ３Ｎ H
１０３ Ｊ
Ｔ
□□
(1)
(2) (3)
(4) (5)
(6) (7) (8) (9)
(1)
(2)
(3)
(4)
(5)
Product category
Structure
Dimensions
Resistance temperature characteristic (B constant)
Resistance temperature
characteristic tolerance
(6) Nominal resistance
(7) Nominal resistance tolerance
(8) Types of packaging
NTC : NTC thermistor
G : Chip type and lead free series
20 : 2.0×1.25×0.7mm
3N : 3650K
J : ±5%
H : ± 3%,
G : ± 2%,
F : ± 1%
3
103 : 10×10 [Ω]
J : ±5%
H : ±3%
F : ±1%
T : Taping
B : Bulk
(9) TDK special code
The TDK special code does not announce by the circumstances of our company
managerially and may be changed.
4. Operating temperature range
-40 ~ 125°C
5. Test condition
Unless otherwise specified, tests and measurements shall be made at the standard condition;
temperature 15 ~ 35°C , humidity 25 ~ 85%RH. and atmospheric pressure 86 ~ 106kPa
Regarding the tests shown section 6.3 and 6.4, the samples shall be mounted glass-epoxy board
by reflow soldering (not to be applicable for solderability nor soldering to heat).
The measurement shall be performed after the tested samples are left under room temperature
and normal humidity for 12 ~ 24hours.
Soldering condition
Solder paste :
Peak temperature of reflow :
Sn-3Ag-0.5Cu
250°C
Page 4
6. Performance
6.1 Electrical performance
Items
1 Nominal resistance
(R25) and tolerance
2 Resistance
temperature
characteristic
(B constant)
and tolerance
Specifications
Test methods
To meet the specifications Measurement shall be made applying 0.25mW max.
shown on section 6.2.
at ambient temperature 25±0.2°C (#1).
This test must be not influenced by self-heating.
To meet the specifications B constant calculated from the resistance between
shown on section 6.2.
ambient temperature 25±0.2°C and 50±0.2°C (#2)
or between ambient temperature 25±0.2°C and
85±0.2°C (#3) according to JIS-C-2570.
B=
ln R1
1
T1
ln R2
1
T2
T1,T2 : Temperature[K]
R1:Thermistor resistance at temperature T1
R2:Thermistor resistance at temperature T2
3 Maximum
rated power
To meet the specifications Maximum rated power loaded consecutively in still air
shown on section 6.2.
(25±0.2°C).
4 Permissive operating To meet the specifications Maximum current to rise 1°C in still air (25±0.2°C).
current
shown on section 6.2.
Page 5
6.2 Electrical characteristic specifications
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
TDK product name
R25 (#1)
ＮＴＣＧ２０３ＥＨ４７１ＪＴDS
ＮＴＣＧ２０３ＥＨ６８１ＪＴDS
ＮＴＣＧ２０３ＢＨ１０２ＪＴDS
ＮＴＣＧ２０３ＢＨ１５２ＪＴDS
ＮＴＣＧ２０３ＦＨ２２２ＪＴDS
ＮＴＣＧ２０３ＦＨ３３２ＪＴDS
ＮＴＣＧ２０３ＪＨ４７２ＪＴDS
ＮＴＣＧ２０３ＪＨ６８２ＪＴDS
ＮＴＣＧ２０３ＮＨ１０３ＪＴDS
ＮＴＣＧ２０３ＮＨ１５３ＪＴDS
ＮＴＣＧ２０３ＳＨ２２３ＪＴDS
ＮＴＣＧ２０３ＳＨ３３３ＪＴDS
ＮＴＣＧ２０４ＡＨ４７３ＪＴDS
ＮＴＣＧ２０４ＡＨ６８３ＪＴDS
ＮＴＣＧ２０４ＣＨ１０４ＪＴDS
ＮＴＣＧ２０４ＣＨ１５４ＪＴDS
[Ω]
470 ± 5%
680 ± 5%
1.0k ± 5%
1.5k ± 5%
2.2K ± 5%
3.3k ± 5%
4.7k ± 5%
6.8k ± 5%
10k ± 5%
15k ± 5%
22k ± 5%
33k ± 5%
47k ± 5%
68k ± 5%
100k ± 5%
150k ± 5%
B constant
B25/50
B25/85
(#2)
(#3)
[K]
[K]
3250 ± 3%
3250 ± 3%
3100 ± 3%
3100 ± 3%
3300 ± 3%
3300 ± 3%
3450 ± 3%
3450 ± 3%
3650 ± 3%
3650 ± 3%
3850 ± 3%
3850 ± 3%
4000 ± 3%
4000 ± 3%
4150 ± 3%
4150 ± 3%
Maximum rated
Permissive
power
operating current
(25°C)
(25°C)
[mA]
[mW]
200
2.00
1.70
200
1.40
200
1.10
200
0.95
200
0.77
200
0.65
200
200
0.54
0.44
200
200
0.36
200
0.30
200
0.24
200
0.20
200
0.17
200
0.14
200
0.11
#1) R25 : Nominal resistance
#2) B25/50 : B constant between 25 and 50°C
#3) B25/85 : B constant between 25 and 85°C
Page 6
6.3 Mechanical performance
Items
1 Vibration
Specifications
1)External appearance shall
have no mechanical damage
2)Resistance change:
within ± 3%
3)B constant change:
within ± 1%
Test methods
Test shall be performed according to
MIL-STD-202 method 204, Codition F.
Test cycle: 12 cyc.
2 Shock test
1)External appearance shall
have no mechanical damage
at the thermistor.
2)Resistance change:
within ± 3%
3)B constant change:
within ± 1%
Test shall be performed according to
MIL-STD-202 method 213, Codition F.
3 Solderability
More than 75% of terminal
electrode sections shall be
covered with new solder.
25% may have pinholes or
rough spots but they shall not
be collected in one position.
Ceramic surface of A-sections
shall not be exposed due to
melting of shifting of electrode
sections.
Completely soak both terminal electrodes in solder
of 245± 3°C for 3 ± 0.5 seconds.
Solder : Sn-3Ag-0.5Cu
Flux : Ethanol(JIS K 1501) solution of rosin
(JIS K 5902) concentration with rosin
approximately 20%(weight ratio)
Test shall be performed according to JIS-C-2570.
A
4 Resistance to
solder heat
1)External appearance shall
have no abnormal sign at
the thermistor.
2)External appearance shall
have no mechanical damage
at the thermistor.
3)Resistance change:
within ± 3%
4)B constant change:
within ± 1%
Completely dip both terminal electrodes in solder of
260± 3°C for 10 ± 0.5 seconds.
Solder : Sn-3Ag-0.5Cu
Flux : Ethanol(JIS K 1501) solution of rosin
(JIS K 5902) concentration with rosin
approximately 20%(weight ratio)
Preheat
Temp. : 100±10°C
Time : 30±5s
Test shall be performed according to JIS-C-2570.
Or, passed through the reflow oven under the
condition shown on §8.
Page 7
Items
5 Robustness
of terminations
Specifications
There shall be no sign of
coming off terminal electrodes,
breakage of ceramic, or other
abnormal sign.
Test methods
Test samples shall be mounted test board (1.2mm
thickness glass-epoxy board) with solder.
The soldering methods shall be soldering iron or
reflow soldering without any thermal shock nor
cause of failure.
5N
10±1s
Test board
6 Bending
strength test
No mechanical damage
shall be caused on the
thermistor.
Test shall be performed according to JIS-C-2570.
To be soldered on the glass-epoxy board (thickness
1.6mm), the load shall be put on the until the board
bends 1mm.
Increase pressure pole
Glass-epoxy board
t
R230
F(Force )
1mm/s
45±2
45±2
Test stand
7 Electrostatic
discharge test
1)No mechanical damage
shall be caused on the
thermistor.
2)Resistance change:
within ± 5%
3)B constant change:
within ± 2%
HBM(Human Body Model)
Discharge resistor : 330Ω
Energy storage capacitance : 150pF
Output voltage : ± 2kV
Number of discharge : 10 times
Contact discharge
Test shall be performed according to
IEC61000-4-2.
Support stand
Page 8
6.4 Life test
Items
Specifications
1 High temperature 1)Resistance change:
storage
within ± 5%
2)B constant change:
within ± 2%
Test methods
Leave at temperature 125±5°C for 1000±12 hours.
2 Temperature
cycle
1)Shall have no mechanical
damage at the thermistor.
2)Resistance change:
within ± 5%
3)B constant change:
within ± 2%
Leave at temperature of the two steps of 1 to 2
sequentially, shown in the following table. With the
above procedure as one cycle, repeat 1000 cycles
consecutively.
Step
Temp. [°C] Time[minutes]
30
-40±5
１
30
125±5
２
The transfer time at each temperature is within
a minute.
3 Moisture
resistance
1)Shall have no mechanical
damage at the thermistor.
2)Resistance change:
within ± 5%
3)B constant change:
within ± 2%
Test shall be performed according to
MIL-STD-202 method 106
Test cycle: 10 cyc. (24 hours/cycle).
Note: Steps 7a & 7b not required. Unpowered.
4 Biased
Humidity
1)Shall have no mechanical
damage at the thermistor.
2)Resistance change:
within ± 5%
3)B constant change:
within ± 2%
At temperature 85±5℃ and humidity 82 to 87%RH,
apply the 10mW (DC voltage) for 1000±12 hours.
5 Operational
life
1)Shall have no mechanical
damage at the thermistor.
2)Resistance change:
within ± 5%
3)B constant change:
within ± 2%
At temperature 125±5 °C, apply the 0.1mW
(DC voltage) for 1000±12 hours, and then taken
out to room temperature for 2 hours before
measurement.
Page 9
7. Shapes and dimension (Construction)
2.0±0.2
1.25±0.2
0.5±0.2
0.3
0.5±0.2
0.3
0.7±0.2
⑤
③
①
②
Palladium
② Inner electrodes ※The number of inner electrodes
may not be according to this figure.
③
④ Terminals
⑤
Silver base
Nickel-plating
Tin-plating
(Unit : mm)
8. Reflow temperature profile
Tpea
Temp
④
Construction
Materials, treatment
NTC Thermistor Mn, Ni, Co-oxide base ceramics
① element
materials
No.
Tmelt
Tpre
tpre
0
time
Item
Tpre
Tmelt
Tpeak
tpre
tmelt
tmelt
Preheat temp.
Solder melting temp.
Peak temp.
Preheat time
Solder melting time
Reflow possibility times
Conditions
For Sn-Pb solder
For lead-free solder
160 ~ 180°C
150 ~ 180°C
200°C
230°C
240°C max.
260°C max.
100s max.
120s max.
30s max.
40s max.
2 max.
2 max.
Page 10
9. Application manual
Process
1 PC Board design
Condition
The solder filet volume will directly affect the reliability of the NTC thermistors.
1)The greater the amount of solder, the higher the stress on the NTC thermistors,
and the more likely that it will break. When designing a P.C.board, determine the
shape and size of the solder lands to have proper amount of solder on the terminations.
2)Avoid using common solder land for multiple terminations and provide
individual solder land for each termination.
3)Recommended PC Board Pattern
C
B
（Unit : mm）
A
・Recommend land pattern for reflow use
Symbol
A
Dimension
0.9～1.2
2012
B
C
0.7～0.9
0.9～1.2
4)Relationship between NTC thermistors position and flex stress during board separation
Disadvantage against
bending stress
Mounting
face
Perforation or slit
Hold chip mounting surface
upward and bend upward
Chip
arrangement
(Direction)
Mount perpendicularly to
perforation or slit
Perforation or slit
Distance
from slit
Closer to slit is higher stress
L1
Advantage against
bending stress
Perforation or slit
Hold chip mounting
surface downward and
bend downward.
Mount in parallel with
perforation or slit
Perforation or slit
Away from slit is less stress
L2
(L1 D > E
6)Example of placement to be avoided and layout recommendations
(processing of land divisions)
Example
Need to avoid
Recommendation
Use of common
solder land with
PTH components
Leads
Chip Solder
Leads
Solder resist
PCB
Chassis
Solder
(ground solder)
Solder resist
Soldering with chassis
L1
L2
L2>L1
Land
Use of common
solder land with
other SMD
Excess solder
Missing solder Land
Solder resist
Page 12
Process
2 Mounting
Condition
Pressure on installation head
If the drop point of the suction nozzle is too low, excessive forces will
be applied to the NTC thermistors during installation and that may cause breaks.
1)Realign the circuit board slide and adjust the bottom dead center over the circuit board.
2)The usual amount of mounting force is 0.1N to 0.3N (dead weight).
3)To prevent pressure from the installation head causes the circuit board to bend,
we recommend the installation of support pins for the back surface of the
circuit board. (See the model diagram as below.)
Locations to avoid
single
-sided
circuit
board
Recommended locations
Crack
Support pin
dual-sided
circuit
board
Solder peeling
Crack
Support pin
When the centering jaw is worn, excessive localized shock may be loaded on the
NTC thermistors during positioning and cracking may occur. To prevent problems
like this from occurring, carefully monitor the centering jaw and ensure that
periodic maintenance and inspection is performed.
3 Soldering
3-1 Recommended flux
Flux is one of the more important elements affecting the performance of NTC thermistors.
Before selecting and using flux, check the items shown below for the best flux.
1)Use flux that has a chlorine content of 0.1wt% or less. Do not use strong acid flux.
2)Excessive flux must be avoided. Keep the amount of flux coating minimized.
3)When water-soluble flux is used, enough washing is necessary.
3-2 Solder amount
Too much or too little solder may cause serious consequences for circuit
reliability such as cracks from solder stress and parts falling off the circuit board.
Check the diagram and make sure to provide the right amount of solder.
Page 13
Process
Condition
Excess amount
of solder
Increased occurrence of
solder stress and cracks
Maximum layer quantity
Right amount
of solder
Minimum layer quantity
Adhesive strength is weak
producing danger of defective
contacts and parts coming off
of board.
Insufficient amount
of solder
3-3 Condition of re-work by a soldering iron
Basically TDK don't recommend re-work by a soldering iron.
In case of re-work, the condition is shown below.
1)The selection of a soldering iron.
The temperature of a soldering iron varies with the kinds, the size of printed
circuit board and land patterns.
In case of high temperature soldering, the time of the soldering work may be shortened.
However thermal shock may cause cracks in some cases, so please solder condition below.
Tip temp.
(°C)
Wattage
(W)
Tip shape
(mm)
Soldering time
(s)
350max.
20max.
φ3.0max.
5 max.
Number of
soldering
1 time or less for
each terminals.
(Total 2 times or less)
2)If the soldering iron may touch the body of NTC thermistors, the strain will be
caused by thermal shock, in some case thermal crack may be caused.
Don't contact a soldering iron to NTC thermistors body except terminals.
4 Cleaning
1)In the case that cleaning fluid is inappropriate, residues of flux and other foreign substance
adhere on the surface of the NTC thermistors and the case may causes deterioration
the performance (especially insulation resistance) of the NTC thermistors.
2)In the case that cleaning condition is inappropriate(cleaning insufficient, cleaning excessive),
it may deteriorate the performance of the NTC thermistors.
2-1).Cleaning insufficient
(1)The terminal electrode may corrode by the substance of the halogenate in residues
of flux.
(2)The halogenate in residues of flux adheres on the surface of the NTC thermistors
and may deteriorate insulation resistance.
(3)Water soluble flux has higher tendency to have above mentioned problems (1) and (2).
Page 14
Process
Condition
2-2).Cleaning excessive
(1)It may deteriorate the performance of the NTC thermistors by cleaning fluid.
(2)If the ultrasonic energy output is too high during ultrasonic cleaning that
will affect the adhesion of terminal electrodes so we recommend the
following conditions for ultrasonic cleaning:
Output :
20W/liter or less
Frequency :
40kHz or less
Cleaning time : 5minutes or less
2-3).Pollution of cleaning fluid may resulted the such as cleaning insufficient.
5 Handling of PC
board after
mounting
1)As separate the board, please do not load the stress shown in the blow as much as possible,
because crack may occur to the NTC thermistors.
Bends
Twist
2)To prevent pressure from the check pin causes the circuit board to bend,
we recommend the installation of support pins for the back surface of the circuit board.
(see the model diagram on the below.)
Item
Locations to avoid
Recommended locations
Support pin
Peeling
Board bends
Check pin
Check pin
6 Handling of chip
1)Please do not use the NTC thermistors that fell, because a damage and
crack may occur by the fall impact.
Crack
Floor
2)Please pay attention handling of the PC board after soldering, because damage and crack
might occur to the NTC thermistors with the impact by the accumulation storage and
the corner of the board hits to the NTC thermistors.
Crack
PC board
Page 15
10. Taping
10.1 Scope
This specification sheet is applicable to the tape packaging of chip type NTC Thermistor. When
questionable matters are found regarding the specification of the products, this specification
sheet shall be applicable with a priority, and the matters shall be settled with written
documents upon conferring and confirming between the design groups of both companies.
10.2 Structure
(1)Taping consist of :
① Tape (Dimensions are shown in section 10.5)
② Reel (Dimensions are shown in section 10.6)
③ Cover tape
④ Bottom tape
(2)2,000 chips is in each reel.
(3)Vacant cavity of chip is less than 0.2%.
(4)Taping structure.
Cover tape
Tape
Bottom tape
Reel
Components
Trailer
40mm min.
・・・・・・・・・・・・
Empty components
20mm min.
・・・・・・・・・・・・
Leader
400mm min.
Unreeling direction
10.3 Mechanical performance
Cover tape peeling force
0.05N < Peeling force < 0.7N
Peeling direction
Cover tape
Carrier tape
0゜~ 15゜
Bottom tape
Unreeling direction
(When cover tape is peeled, paper tape shall not adhere to the cover tape by broken.)
10.4 Tape packaging specification
(1) Tape bending
Taping shall show no mechanical damage nor with bending diameter of 30mm min.
(2) Adhesion of the chip to the cover tape
Chip shall not be stuck to cover tape and exist in rectangular hole.
(3) Burr etc. of the rectangular hole
When cover tape is peeled, NTC thermistor shall be easily picked up and pick-up nozzle
may not be stopped up by paper filings.
Page 16
10.5 Paper tape dimension
H
Sprocket holes
Rectangular holes
G
F
C
B
D
E
J
T
A
A
B
C
D
E
F
1.5±0.2
2.3±0.2
8.0±0.3
3.5±0.05
1.75±0.1
4.0±0.1
G
H
J
T
Dimension
[mm]
φ
2.0±0.05
+0.1
1.5 -0
4.0±0.１
1.1MAX
10.6 Reel dimension
Material : Poly-styrene
D
B
r
E
C
A
W1
W2
A
φ
Dimension
[mm]
B
φ
C
φ
D
E
21±0.8
2.0±0.5
φ
180±2.0
60min
13±0.2
W1
W2
r
9.0min
14max
0.8
Page 17
11. Package & transport
11.1 Package shall be secure from damage during transportation and storage,
shipping label shall be attached.
(1) Shipping No.
(2) TDK's parts No.
(3) Customer's parts No.
(4) Quantity
(5) Production Country
Example)
AE 15 E 0406701
Ser. No.
Shipping month A ~ M except for I&O (E : May)
Shipping year last 2 digit（15：2015）
Control No.
11.2 Package is shown as figure below. (unit : mm)
The height varies with
the number of reel.
185max.
12. Production Country
Japan
185max.
