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SP13801

SP13801

  • 厂商:

    TDK(东电化)

  • 封装:

    -

  • 描述:

    EVAL BOARD FOR SESUB-PAN-T2541

  • 数据手册
  • 价格&库存
SP13801 数据手册
Micro Modules (Substrates with Built-in ICs, Products Utilizing with SESUB) October 2017 Micro Modules (Substrates with Built-in ICs, Products Utilizing with SESUB) Bluetooth V4.0 Smart Single Mode Module SESUB-PAN-T2541 Caution The products in this catalog will be or have been stopped production Discontinue Issue Date Oct 16, 2017 Last Purchase Order Date Jan. 31, 2018 Last Shipment Date Jun. 30, 2018 Please refer to our Web site about replacement information. The products in this catalog will be or have been stopped production (2/4) Micro Modules (Substrates with Built-in ICs, Products Utilizing with SESUB) Micro Modules (Substrates with Built-in ICs, Products Utilizing with SESUB) pr od u st cts op w pe il d lb pr e od or uc ha tio ve n be en Bluetooth V4.0 Smart Single Mode Module Overview of SESUB-PAN-T2541 FEATURES Micro size (4.6×5.6×1.0mm) ideal for wearable devices. Communicable with Bluetooth® Smart Ready compatible devices. Separate antenna type that provides more flexibility for product design. APPLICATION Health care, sports & fitness devices (physical activity monitor, thermometer, blood pressure monitor, blood oxygen monitor, blood sugar monitor, heart rate monitor, etc.) Wearable computers (bracelet type, watch type, ring type, glass type, shoe, hat, shirt, etc.) Home & entertainment devices (remote control, sensor tag, toy, lighting apparatus, etc.) PC accessories (mouse, keyboard, stylus pen, presentation pointer, etc.) BLOCK DIAGRAM Vsupply Analog / Digital I/O I2C / UART / SPI 32.768MHz Sleep Clock∗ Texas Instruments CC2541F256 Filter to RF ANT Th e Crystal 32MHz Bluetooth® and Bluetooth® Low Energy are the standards established by Bluetooth Special Interest Group (SIG). Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use. Please note that the contents may change without any prior notice due to reasons such as upgrading. For product inquiries: SESUB_Support@tdk.co.jp 20171026 / sesub-pan-t2541_en.fm The products in this catalog will be or have been stopped production (3/4) Micro Modules (Substrates with Built-in ICs, Products Utilizing with SESUB) SESUB-PAN-T2541 SHAPE & DIMENSIONS 4.6 (nom.) 0.5 (nom.) 1.0 (nom.) (0.06) (nom.) 5.6 (nom.) 0.5 (nom.) pr od u st cts op w pe il d lb pr e od or uc ha tio ve n be en ø0.28 (nom.) Dimensions in mm ELECTRICAL CHARACTERISTICS CHARACTERISTICS SPECIFICATION TABLE Communication standards Wireless output power (dBm)typ. Communication range (m) Interface Line-of-sight distances. Depending on antenna properties. Th e  2.4GHz Bluetooth® V4.0 low energy 0 10 UART/SPI/I2C/GPIO/ADC Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use. Please note that the contents may change without any prior notice due to reasons such as upgrading. For product inquiries: SESUB_Support@tdk.co.jp 20171026 / sesub-pan-t2541_en.fm The products in this catalog will be or have been stopped production (4/4) Micro Modules (Substrates with Built-in ICs, Products Utilizing with SESUB) SESUB-PAN-T2541 MODULE TERMINAL 2 P2_1 3 P2_0 4 5 6 7 8 9 VDO VDA_1 VDA_2 GND RST_N GND 10 P0_0 36 P2_2 35 GND GND GND GND GND GND 11 P0_1 34 P2_4/32k GND GND GND GND GND 12 P0_2 33 P2_3/32k GND GND GND GND GND 13 P0_3 32 P1_7 GND GND GND GND GND 14 P0_4 31 P1_6 GND GND GND GND GND 15 P0_5 30 P1_1 GND GND GND GND GND 16 P0_6 29 P1_2 GND GND GND GND GND 17 P0_7 Pin1 18 P1_0 28 P1_3 27 GND RF POWER Clock I/O Cont GND pr od u st cts op w pe il d lb pr e od or uc ha tio ve n be en 1 GND 26 SCL 25 SDA 24 P1_4 23 P1_5 22 21 20 GND 2G_RF GND 19 GND Module Bottom View EVALUATION BOARD Based on the IC manufacturer-provided evaluation environment (TDK part number: SP13801) The product is used by connecting to the IC evaluation kits of IC manufacturers. All software development environments and programming tools are provided by IC manufacturers. Various development materials of IC manufacturers are available as they are, which enables smooth development of products. We also offer evaluation kits which enables to evaluate product functions easily. (TDK part number: SP13808)  For more details, please contact us. Equipped with a program writing terminal A chip antenna on the evaluation board Equipped with a land pattern for a crystal unit for generating a sleep clock Th e Connectors to evaluation boards of the IC manufacturers Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use. Please note that the contents may change without any prior notice due to reasons such as upgrading. For product inquiries: SESUB_Support@tdk.co.jp 20171026 / sesub-pan-t2541_en.fm
SP13801 价格&库存

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