SP14817

Micro Modules (Substrates with Built-in ICs, Products Utilizing with SESUB) November 2020 Micro Modules (Substrates with Built-in ICs, Products Utilizing with SESUB) Bluetooth® V4.1 Smart (Low Energy) Single Mode Module SESUB-PAN-D14580 Caution The products in this catalog will be or have been stopped production Discontinue Issue Date Nov. 2, 2020 Last Purchase Order Date Apr. 30, 2021 Last Shipment Date Jun. 30, 2021 Please refer to our Web site about replacement information. The products in this catalog will be or have been stopped production (2/4) Micro Modules (Substrates with Built-in ICs, Products Utilizing with SESUB) Micro Modules (Substrates with Built-in ICs, Products Utilizing with SESUB) pr od u st cts op w pe il d lb pr e od or uc ha tio ve n be en Bluetooth® V4.1 Smart (Low Energy) Single Mode Module Overview of SESUB-PAN-D14580 FEATURES Ultra small package - Ideal for for wearable devices Space saving Ultra small package 3.5 x 3.5 x 1.0mm (TYP) Packaged in 36 pin solder bumped BGA with 0.5mm pitch Compatible with Bluetooth® Smart Ready products ARM Cortex-M0 32bit high performance microcontroller 32kB OTP programmable memory, 84kB ROM for BT stack 42kB System SRAM, 8kB Retention SRAM Including IC (Dialog Semiconductor : DA14580), Crystal (16MHz), Inductor, and Capacitor in this module. 3.5mm 8.5mm ∗ Production Part is over molded Space Saving –83% 3.5mm 8.5mm Discrete Solution 72.3mm2 0.5mm pitch Solder Bumped BGA 36pins SESUB-PAN-D14580 12.3mm2 APPLICATION Healthcare/sports & fitness equipment (Example: Activity mass meter, thermometer, sphygmomanometer, blood oximeter, blood glucose meter, heart rate meter, biometrics) Wearable devices (Example: Wristband, watch, ring, glasses, shoes, hat, shirt) Home entertainment equipment (Example: Remote control, sensor tag, toys, lighting products) PC peripheral applications Th e (Example: Mouse, key board, stylus, presentation pointer） Bluetooth® and Bluetooth® Low Energy are the standards established by Bluetooth Special Interest Group (SIG). Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use. Please note that the contents may change without any prior notice due to reasons such as upgrading. For product inquiries: SESUB_Support@tdk.co.jp 20201117 / sesub-pan-d14580_en.fm The products in this catalog will be or have been stopped production (3/4) Micro Modules (Substrates with Built-in ICs, Products Utilizing with SESUB) SESUB-PAN-D14580 3.5mm pr od u st cts op w pe il d lb pr e od or uc ha tio ve n be en SHAPE & DIMENSIONS 3.5mm 0.5mm pitch Solder Bumped BGA 36pins  Production Part is over molded ELECTRICAL CHARACTERISTICS CHARACTERISTICS SPECIFICATION TABLE Communication standard Transmitter output power level Receiver sensitivity level Host Interface Peripheral Interface Current consumption 2.4GHz Bluetooth® V4.1 Low Energy 0dBm (typ) –94dBm UART (2ch)/ SPI+ / I2C (100k/400kHz) 10bits ADC (4ch) / Pin-configurable GPIO 5.0mA (Tx), 5.4mA (Rx), 0.8µA (Deep Sleep mode) RF CHARACTERISTICS Frequency vs. TX Power 3.0 Frequency vs. Sensitivity –60 –65 2.0 0.0 Sensitivity (dBm) TxPower (dBm) –70 1.0 #3 #1 –1.0 –75 –80 –85 #2 –90 –2.0 –95 2412 2422 2432 2442 2452 Frequency (MHz) 2462 2472 2482 –100 2402 #1 2412 2422 2432 2442 2452 Frequency (MHz) 2462 #2 2472 2482 Th e –3.0 2402 #3 Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use. Please note that the contents may change without any prior notice due to reasons such as upgrading. For product inquiries: SESUB_Support@tdk.co.jp 20201117 / sesub-pan-d14580_en.fm The products in this catalog will be or have been stopped production (4/4) Micro Modules (Substrates with Built-in ICs, Products Utilizing with SESUB) SESUB-PAN-D14580 SESUB-PAN-D14580 EVALUATION BOARD [SP14817] pr od u st cts op w pe il d lb pr e od or uc ha tio ve n be en TDK’s SP14817, Daughter board is ready to connect with Dialog Semiconductor’s evaluation mother board. This allows for quick designs by utilizing Dialog’s -software development tools and development materials SMA connector for RF ANT Pin compatible with DA14580DEVKIT-PRO SP14817 on Dialog’ s DA14580 DEVKIT-PRO mother board SESUB-PAN-D14580 EVALUATION KIT [SESUB-PAN-D14580EVK] Regulatory certified evaluation module [SP14808] with integrated 128kB Serial Flash ROM for reprogramming during development. Evaluation Module is ideal for immediate software development. 128kB Serial ROM SP14808 SESUB-PAN-D14580EVK SP14808 evaluation module with integrated antenna [ARIB-STD T66 / FCC certified] ORDERING INFORMATION Ordering Code SESUB-PAN-D14580 SP14817 SESUB-PAN-D14580 EVK SP14808 MOQ 1000pcs 1pc SP14808 1pc SP14809 1pc 1pc 1set Remark Evaluation board for RF characteristics. SESUB-PAN-D14580 Evaluation Module with ANT Certified Japanese & FCC Radio Certification Adapter Board for SP14808. For the customer who wants to have spare units. SP14808ST contains 5 pcs of SP14808 in a set. Volume discount. Th e SP14808 ST Contents Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use. Please note that the contents may change without any prior notice due to reasons such as upgrading. For product inquiries: SESUB_Support@tdk.co.jp 20201117 / sesub-pan-d14580_en.fm