Transys
Electronics
LIMITED
NPN SILICON PLANAR SWITCHING TRANSISTOR
TN2222A TO-237 Plastic Package
E BC
For use as a Medium Power Amplifier
ABSOLUTE MAXIMUM RATINGS DESCRIPTION Collector Emitter Voltage Collector Base Voltage Emitter Base Voltage Collector Current Continuous Power Dissipation @ Ta=25ºC Power Dissipation @ Tc=25ºC @ Ta=25ºC PCB Land Area for Collector Lead >1 sq inch @ Ta=25ºC with heat sink Operating And Storage Junction Temperature Range THERMAL RESISTANCE Junction to Case Junction to Ambient in free air Thermal Resistance >with PCB land area for collector lead >1 sq inch Thermal Resistance Junction to Ambient with heat sink PD SYMBOL VCEO VCBO VEBO IC VALUE 40 75 6.0 800 0.75 2.2 1.2 1.5 Tj, Tstg - 55 to +150 UNIT V V V mA W W W W ºC
Rth (j-c) Rth (j-a) Rth (j-a) Rth (j-a)
57 167 104 83
ºC/W ºC/W ºC/W ºC/W
ELECTRICAL CHARACTERISTICS (Ta=25ºC unless specified otherwise ) DESCRIPTION SYMBOL TEST CONDITION *VCEO IC=10mA, IB=0 Collector Emitter Voltage VCBO Collector Base Voltage IC=10µA, IE=0 VEBO Emitter Base Voltage IE=10µA, IC=0 ICEX VCE=60V, VEB(off)=3V Collector Cut Off Current ICBO VCB=60V, IE=0 Collector Cut Off Current VCB=60V, IE=0, Ta=150ºC IEBO VEB=3V, IC=0 Emitter Cut Off Current IBL VCE=60V, VEB(off)=3V Base Cut Off Current hFE IC=0.1mA, VCE=10V DC Current Gain IC=1mA, VCE=10V IC=10mA, VCE=10V IC=150mA, VCE=10V IC=150mA, VCE=1V IC=500mA, VCE=10V *Pulse Test: Pulse Width < 300µ s, Duty Cycle < 2%
MIN 40 75 6
MAX
10 10 10 10 20 35 50 75 100 50 40
UNIT V V V nA nA µA nA nA
300
NPN SILICON PLANAR SWITCHING TRANSISTOR
TN2222A TO-237 Plastic Package
E BC
ELECTRICAL CHARACTERISTICS (Ta=25ºC unless specified otherwise) DESCRIPTION Collector Emitter Saturation Voltage Base Emitter Saturation Voltage SYMBOL *VCE (sat) *VBE (sat) TEST CONDITION IC=150mA, IB=15mA IC=500mA, IB=50mA IC=150mA, IB=15mA IC=500mA, IB=50mA TEST CONDITION VCB=10V, IE=0, f=100KHz VEB=0.5V, IC=0, f=100KHz IC=1mA, VCE=10V, f=1KHz IC=10mA, VCE=10V, f=1KHz IE=20mA, VCE=20V, f=31.8MHz IC=100µA, VCE=10V, RS=IKΩ, f=1KHz, Bw=1KHz IC=20mA, VCE=20V, f=300MHz MIN MAX 0.3 1.0 1.2 2.0 UNIT V V V V
0.6
SMALL SIGNAL CHARACTERISTICS DESCRIPTION Output Capacitance Input Capacitance Small Signal Current Gain Collector Base Time Constant Noise Figure Real Part of Common Emitter High Frequency Input Impedance SWITCHING TIME DESCRIPTION Delay Time
SYMBOL Cobo Cibo hfe rb'CC NF Re(hie)
MIN
MAX 8.0 25 300 375 150 4.0 60
UNIT pF pF
50 75
pS dB Ω
SYMBOL td
tr Rise Time ts Storage Time tf Fall Time *Pulse Test: Pulse Width < 300µ s, Duty Cycle < 2%
TEST CONDITION IC=150mA, IB1=15mA, VCC=30V, VBE(off)=0.5V IC=150mA, IB1= IB2=15mA, VCC=30V
MIN
MAX 10 25 225 60
UNIT ns ns ns ns
TN2222A TO-237 Plastic Package
F B
Dimension With 'M'
Beyond 'M'
1 2 3 K D E
D G L J
AA
SEC AA
MIN. MAX. 4.32 5.33 4.45 5.20 3.18 4.19 0.41 0.55 0.35 0.50 — 5.40 1.14 1.40 — 2.54 1.03 1.20 12.70 — 5 DEG 1.982 2.082 1.20 1.40 N All dimensions are in mm
DIM A B C D E F G H J K L M
Uncontrolled
H
Solderability Ensured
M
L
Mold Parting Line
321
PIN CONFIGURATION 1. COLLECTOR 2. BASE 3. EMITTER
321
The TO-237 Package, Tape and Ammo Pack Drawings are correct as on the date of issue/revision of this Data Sheet. The currently valid dimensions and information, may please be confimed from the TO-237 Drawing in the Package and Packing Section of the Product Catalogue.
Packing Details
PACKAGE Details TO-237 Bulk TO-237 T&A 1K/ polybag 2K/ ammo box STANDARD PACK Net Weight/ Qty 240 gm/ pcs 1K 725 gm/ pcs 2K Size 3" x 7.5" x 7.5" 12.5" x 8" x 1.8" INNER CARTON BOX Qty 5K 2K Size 17" x 15" x 13.5" 17" x 15" x 13.5" OUTER CARTON BOX Qty 80K 32K Gr Wt 26.2 kgs 13.8 kgs
N
C
A
TN2222A TO-237 Plastic Package TO-237 Tape and Ammo Pack
Tape Mechanical Data
T1 h h
A H3 H2 H1 Ho L C1 C2 W2 Wo W1 W A1 P A2 B (p) h1 h1
Ammo Pack Style
Adhesive Tape on Top Side Flat side Label
D FEE
Carrier Strip
186 (7.3")
F1
F2 F
Do
t1 t
P2
332
43 (1.7 ")
") (1 3
Po
Flat Side of Transistor and Adhesive Tape Visible 2000 pcs./Ammo Pack
All dimensions are in mm
ITEM BODY WIDTH BODY HEIGHT BODY THICKNESS PITCH OF COMPONENT * 1 FEED HOLE PITCH * 2 FEED HOLE CENTRE TO COMPONENT CENTRE DISTANCE BETWEEN OUTER LEADS SPECIFICATION SYMBOL A1 A T P Po P2 F h h1 W Wo W1 W2 Ho H1 L Do t F1, F2 H2 H3 | C1 - C2 | (p) A2 B T1 0.45 MIN. NOM. MAX. 4.0 4.8 3.9 12.7 12.7 6.35 5.08 0 0 18 6 9 0.5 16 23.25 11.0 4 1.2 2.54 1.45 3.0 0.22 5.40 2.54 0.45 + 0.4 - 0.1 REMARKS ± 0.2 1.0 1.3 ± 0.5 ± 0.2 + 0.7 - 0.5 ± 0.2 ± 0.5 4.8 5.2 4.2 ± 1.0 ± 0.3 ± 0.4 + 0.6 - 0.2 TOL . NOTES 1. Maximum alignment deviation between leads will not to be greater than 0.2mm. 2. Maximum non-cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches. 3. Holddown tape will not exceed beyond the edge(s) of carrier tape and there shall be no exposure of adhesive. 4. There will be no more than three (3) consecutive missing components in a tape. 5. A tape trailer, having at least three feed holes are provided after the last component in a tape. 6. Splices should not interfere with the sprocket feed holes.
* 3 COMPONENT ALIGNMENT SIDE VIEW * 4 COMPONENT ALIGNMENT FRONT VIEW
TAPE WIDTH HOLD-DOWN TAPE WIDTH HOLE POSITION HOLD-DOWN TAPE POSITION LEAD WIRE CLINCH HEIGHT COMPONENT HEIGHT LENGTH OF SNIPPED LEADS FEED HOLE DIAMETER * 5 TOTAL TAPE THICKNESS LEAD - TO - LEAD DISTANCE STAND OFF CLINCH HEIGHT LEAD PARALLELISM PULL - OUT FORCE HEAT SINK WIDTH HEAT SINK HEIGHT HEAT SINK THICKNESS
6N
* 1 Cumulative pitch error 1.0 mm/20 pitch * 2 To be measured at bottom of clinch * 3 At top of body * 4 At top of body * 5 t1 0.3 – 0.6 mm