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TC1014

TC1014

  • 厂商:

    TELCOM

  • 封装:

  • 描述:

    TC1014 - 50mA CMOS LDO WITH SHUTDOWN AND REFERENCE BYPASS - TelCom Semiconductor, Inc

  • 数据手册
  • 价格&库存
TC1014 数据手册
50mA CMOS LDO WITH SHUTDOWN AND REFERENCE BYPASS PRELIMINARY INFORMATION TC1014 TC1014 50mA CMOS LDO WITH SHUTDOWN AND REFERENCE BYPASS FEATURES s s s s s s s s s s Zero Ground Current for Longer Battery Life! Very Low Dropout Voltage Guaranteed 50mA Output High Output Voltage Accuracy Standard or Custom Output Voltages Power-Saving Shutdown Mode Reference Bypass Input for Ultra Low-Noise Operation Over-Current and Over-Temperature Protection Space-Saving SOT-23A-5 Package Pin Compatible Upgrade for MIC5205 and NSC2980 GENERAL DESCRIPTION The TC1014 is a high accuracy (typically ±0.5%) CMOS upgrade for older (bipolar) low dropout regulators such as the LP2980. Designed specifically for battery-operated systems, the TC1014’s CMOS construction eliminates wasted ground current, significantly extending battery life. Total supply current is typically 50µA at full load (20 to 60 times lower than in bipolar regulators!). TC1014 key features include ultra low-noise operation (plus optional Bypass input); very low dropout voltage (typically 95mV at full load) and internal feed-forward compensation for fast response to step changes in load. Supply current is reduced to less than 1µA when the shutdown input is low. The TC1014 also incorporates both over-temperature and over-current protection. The TC1014 is stable with an output capacitor of only 1µF and has a maximum output current of 100mA. For higher output versions, please see the TC1107, TC1108, TC1173 (IOUT = 300mA) data sheets. APPLICATIONS s s s s s s s Battery Operated Systems Portable Computers Medical Instruments Instrumentation Cellular / GSM / PHS Phones Linear Post-Regulator for SMPS Pagers ORDERING INFORMATION Part No. Output Voltage **(V) Package 2.5 2.7 3.0 3.3 5.0 Junction Temp. Range TC1014-2.5VCT SOT-23A-5* – 40°C to +125°C SOT-23A-5* – 40°C to +125°C SOT-23A-5* – 40°C to +125°C SOT-23A-5* – 40°C to +125°C SOT-23A-5* – 40°C to +125°C TYPICAL APPLICATION TC1014-2.7VCT TC1014-3.0VCT TC1014-3.3VCT TC1014-5.0VCT VIN 1 VIN VOUT 5 1µF VOUT NOTE: *SOT-23A-5 is equivalent to the EIAJ (SC-74A) ** Other output voltages available. Please contact TelCom Semiconductor for details 2 GND TC1014 PIN CONFIGURATION VOUT Bypass 4 3 SHDN Bypass 4 470pF Reference Bypass Cap (Optional) 5 TC1014 (SOT-23A-5*) 1 2 3 TOP VIEW Shutdown Control (from Power Control Logic) VIN GND SHDN NOTE: *SOT-23A-5 is equivalent to the EIAJ (SC-74A) TC1014-01-6/5/97 TelCom Semiconductor reserves the right to make changes in the circuitry and1 specifications to its devices. PRELIMINARY INFORMATION 50mA CMOS LDO WITH SHUTDOWN AND REFERENCE BYPASS TC1014 ABSOLUTE MAXIMUM RATINGS* Input Voltage .................................................................7V Output Voltage .................................. (– 0.3) to (VIN + 0.3) Power Dissipation .................... Internally Limited (Note 7) Operating Temperature .................... – 40°C < TJ < 125°C Storage Temperature ............................ – 65°C to +150°C Maximum Voltage On Any Pin .......... VIN + 0.3V to – 0.3V *Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS: VIN = VOUT + 1V, IL = 100µA, CL = 3.3µF, SHDN > VIH, TA = 25°C, unless otherwise noted. Symbol VIN IOUTMAX VOUT TCVOUT ∆VOUT/∆VIN ∆VOUT/VOUT VIN – VOUT Boldface type specifications apply for junction temperatures of – 40°C to +125°C. Parameter Input Operating Voltage Maximum Output Current Output Voltage VOUT Temperature Coefficient Line Regulation Load Regulation Dropout Voltage (Note 4) Test Conditions Min — 50 VR – 2.5% Typ — — VR ±0.5% 20 40 0.01 0.5 5 65 95 — 50 — 64 200 0.04 260 Max 6.5 — VR + 2.5% — — — — Units V mA V ppm/°C % % mV Note 1 Note 2 (VR + 1V) < VIN < 6V IL = 1.0mA to IOUTMAX (Note 3) IL = 100µA IL = 20mA IL = 50mA (Note 4) IL = IOUTMAX, (Note 5) SHDN = VIH, IL = 0 SHDN = 0V FRE ≤ 1kHz VOUT = 0V Note 6 IL = IOUTMAX 470pF from Bypass to GND VIN = 2.5V to 6.5V VIN = 2.5V to 6.5V — — — IGND IIN IINSD PSRR IOUTSC ∆VOUT/∆PD eN Ground Pin Current Supply Current Shutdown Supply Current Power Supply Rejection Ratio Output Short Circuit Current Thermal Regulation Output Noise — — — — — — — 0 — 0.05 — 400 — — µA µA µA dB mA %/W nV/√Hz SHDN Input VIH VIL SHDN Input High Threshold SHDN Input Low Threshold 45 — — — — 15 %VIN %VIN NOTES: 1. VR is the regulator output voltage setting. VR = 2.5V, 2.7V, 3.0V, 3.3V, 5.0V. 2. TCVOUT = (VOUTMAX – VOUTMIN) x 10 6 VOUT x ∆T 3. Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 1.0mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 4. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value at a 1V differential. 5. Ground pin current is the regulator pass transistor gate current. The total current drawn from the input supply is the sum of the load current, ground current and supply current (i.e. IIN = ISUPPLY + IGND + ILOAD). 6. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10msec. 7. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e. TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Thermal Considerations section of this data sheet for more details. . TC1014-01-6/5/97 2 50mA CMOS LDO WITH SHUTDOWN AND REFERENCE BYPASS PRELIMINARY INFORMATION TC1014 PIN DESCRIPTION Pin No. (SOT-23A-5) 1 2 3 Symbol VIN GND SHDN Description Unregulated supply input. Ground terminal. Shutdown control input. The regulator is fully enabled when a logic high is applied to this input. The regulator enters shutdown when a logic low is applied to this input. During shutdown, output voltage falls to zero, and supply current is reduced to under 1 microamp (typical). Reference bypass input. Connecting a 470pF to this input further reduces output noise. Regulated voltage output. 4 5 Bypass VOUT DETAILED DESCRIPTION The TC1014 is a precision fixed output voltage regulator. (If an adjustable version is desired, please see the TC1070 or TC1071 data sheets.) Unlike the bipolar regulators, the TC1014 supply current does not increase with load current. In addition, VOUT remains stable and within regulation at very low load currents (an important consideration in RTC and CMOS RAM battery back-up applications). Figure 1 shows a typical application circuit. The regulator is enabled any time the shutdown input (SHDN) is at or above VIH, and shutdown (disabled) when SHDN is at or below VIL. SHDN may be controlled by a CMOS logic gate, or I/O port of a microcontroller. If the SHDN input is not required, it should be connected directly to the input supply. While in shutdown, supply current decreases to 0.05µA (typical) and VOUT falls to zero volts. VIN 1µF VOUT 1µF VOUT noise is not a concern, this input may be left unconnected. Larger capacitor values may be used, but results in a longer time period to rated output voltage when power is initially applied. Output Capacitor A 1µF (min) capacitor from VOUT to ground is recommended. The output capacitor should have an effective series resistance of 5Ω or less, and a resonant frequency above 1MHz. A 1µF capacitor should be connected from VIN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor, or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitor types can be used. (Since many aluminum electrolytic capacitors freeze at approximately – 30°C, solid tantalums are recommended for applications operating below – 25°C.) When operating from sources other than batteries, supplynoise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. Thermal Considerations BATTERY GND TC1014 SHDN Bypass 470pF Reference Bypass Cap (Optional) Thermal Shutdown Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 160°C. The regulator remains off until the die temperature drops to approximately 150°C. Power Dissipation The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst case actual power dissipation: Shutdown Control (to CMOS Logic or Tie to VIN if Unused) Figure 1. Typical Application Circuit Bypass Input A 470pF capacitor connected from the Bypass input to ground reduces noise present on the internal reference, which in turn significantly reduces output noise. If output TC1014-01-6/5/97 3 PRELIMINARY INFORMATION 50mA CMOS LDO WITH SHUTDOWN AND REFERENCE BYPASS TC1014 PD ≈ (VINMAX – VOUTMIN)ILOADMAX Where: PD VINMAX VOUTMIN ILOADMAX = Worst case actual power dissipation = Maximum voltage on VIN = Minimum regulator output voltage = Maximum output (load) current Equation 1. In this example, the TC1014 dissipates a maximum of only 60mW; far below the allowable limit of 318mW. In a similar manner, Equation 1 and Equation 2 can be used to calculate maximum current and/or input voltage limits. For example, the maximum allowable VIN is found by sustituting the maximum allowable power dissipation of 318mW into Equation 1, from which VINMAX = 5.9V. Layout Considerations The primary path of heat conduction out of the package is via the package leads. Therefore, layouts having a ground plane, wide traces at the pads, and wide power supply bus lines combine to lower θJA and, therefore, increase the maximum allowable power dissipation limit. The maximum allowable power dissipation (Equation 2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (125°C) and the thermal resistance from junction-to-air ( θ JA ). The SOT-23A-5 package has a θJA of approximately 220°C/Watt when mounted on a single layer FR4 dielectric copper clad PC board. PD MAX = (TJMAX – TJMAX) θJA Where all terms are previously defined. Equation 2. Equation 1 can be used in conjunction with Equation 2 to ensure regulator thermal operation is within limits. For example: Given: VINMAX = 3.0V ±5% VOUTMIN = 2.7V ±0.5V ILOAD = 40mA TAMAX = 55°C 1. Actual power dissipation 2. Maximum allowable dissipation Find: Actual power dissipation: PD ≈ (VINMAX – VOUTMIN)ILOADMAX = [(3.0 x 1.1) – (2.7 x .995)]40 x 10–3 = 18.5mW Maximum allowable power dissipation: PDMAX = (TJMAX – TAMAX) θJA = (125 – 55) 220 = 318mW TC1014-01-6/5/97 4 50mA CMOS LDO WITH SHUTDOWN AND REFERENCE BYPASS PRELIMINARY INFORMATION TC1014 MARKING SOT-23A-5 & = part number code + temperature range and voltage TC1014 (V) 2.5 2.7 3.0 3.3 5.0 Code A1 A2 A3 A5 A7 represents year and quarter code represents lot ID number PACKAGE DIMENSIONS SOT-23A-5* .122 (3.10) .098 (2.50) .020 (0.50) .012 (0.30) .071 (1.80) .059 (1.50) .037 (0.95) REFERENCE .122 (3.10) .106 (2.70) .057 (1.45) .035 (0.90) .006 (0.15) .000 (0.00) 10° MAX. .022 (0.55) .008 (0.20) .010 (0.25) .004 (0.09) NOTE: *SOT-23A-5 is equivalent to the EIAJ (SC-74A) Dimensions: inches (mm) Sales Offices TelCom Semiconductor 1300 Terra Bella Avenue P.O. Box 7267 Mountain View, CA 94039-7267 TEL: 415-968-9241 FAX: 415-967-1590 E-Mail: liter@c2smtp.telcom-semi.com TC1014-01-6/5/97 TelCom Semiconductor Austin Product Center 9101 Burnet Rd. Suite 214 Austin, TX 78758 TEL: 512-873-7100 FAX: 512-873-8236 5 TelCom Semiconductor H.K. Ltd. 10 Sam Chuk Street, 6/F San Po Kong Kowloon Hong Kong TEL: 852-2324-0122 FAX: 852-2354-9957 Printed in the U.S.A. 100mA CMOS LDO WITH SHUTDOWN AND REFERENCE BYPASS PRELIMINARY INFORMATION TC1015 TC1015 100mA CMOS LDO WITH SHUTDOWN AND REFERENCE BYPASS FEATURES s s s s s s s s s s Zero Ground Current for Longer Battery Life! Very Low Dropout Voltage Guaranteed 100mA Output High Output Voltage Accuracy Standard or Custom Output Voltages Power-Saving Shutdown Mode Reference Bypass Input for Ultra Low-Noise Operation Over-Current and Over-Temperature Protection Space-Saving SOT-23A-5 Package Pin Compatible Upgrade for MIC5205 and NSC2980 GENERAL DESCRIPTION The TC1015 is a high accuracy (typically ±0.5%) CMOS upgrade for older (bipolar) low dropout regulators such as the LP2980. Designed specifically for battery-operated systems, the TC1015’s CMOS construction eliminates wasted ground current, significantly extending battery life. Total supply current is typically 50µA at full load (20 to 60 times lower than in bipolar regulators!). TC1015 key features include ultra low-noise operation (plus optional Bypass input); very low dropout voltage (typically 200mV at full load) and internal feed-forward compensation for fast response to step changes in load. Supply current is reduced to 0.05µA and VOUT is disabled when the shutdown input is low. The TC1015 also incorporates both over-temperature and over-current protection. The TC1015 is stable with an output capacitor of only 1µF and has a maximum output current of 100mA. For higher output versions, please see the TC1107, TC1108, TC1173 (IOUT = 300mA) data sheets. APPLICATIONS s s s s s s s Battery Operated Systems Portable Computers Medical Instruments Instrumentation Cellular / GSM / PHS Phones Linear Post-Regulator for SMPS Pagers ORDERING INFORMATION Part No. Output Voltage **(V) Package 2.5 2.7 3.0 3.3 5.0 Junction Temp. Range TYPICAL APPLICATION TC1015-2.5VCT TC1015-2.7VCT TC1015-3.0VCT TC1015-3.3VCT TC1015-5.0VCT SOT-23A-5* – 40°C to +125°C SOT-23A-5* – 40°C to +125°C SOT-23A-5* – 40°C to +125°C SOT-23A-5* – 40°C to +125°C SOT-23A-5* – 40°C to +125°C VIN 1 VIN VOUT 5 1µF VOUT NOTE: *SOT-23A-5 is equivalent to the EIAJ (SC-74A) ** Other output voltages available. Please contact TelCom Semiconductor for details 2 GND TC1015 PIN CONFIGURATION VOUT Bypass 4 3 SHDN Bypass 4 470pF Reference Bypass Cap (Optional) 5 TC1015 (SOT-23A-5*) 1 VIN 2 3 Shutdown Control (from Power Control Logic) TOP VIEW GND SHDN NOTE: *SOT-23A-5 is equivalent to the EIAJ (SC-74A) TC1015-01-6/5/97 TelCom Semiconductor reserves the right to make changes in the circuitry and1 specifications to its devices. PRELIMINARY INFORMATION 100mA CMOS LDO WITH SHUTDOWN AND REFERENCE BYPASS TC1015 ABSOLUTE MAXIMUM RATINGS* Input Voltage .................................................................7V Output Voltage .................................. (– 0.3) to (VIN + 0.3) Power Dissipation .................... Internally Limited (Note 7) Operating Temperature .................... – 40°C < TJ < 125°C Storage Temperature ............................ – 65°C to +150°C Maximum Voltage On Any Pin .......... VIN + 0.3V to – 0.3V *Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS: VIN = VOUT + 1V, IL = 100µA, CL = 3.3µF, SHDN > VIH, TA = 25°C, unless otherwise noted. Symbol VIN IOUTMAX VOUT TCVOUT ∆VOUT/∆VIN ∆VOUT/VOUT VIN – VOUT Boldface type specifications apply for junction temperatures of – 40°C to +125°C. Parameter Input Operating Voltage Maximum Output Current Output Voltage VOUT Temperature Coefficient Line Regulation Load Regulation Dropout Voltage (Note 4) Test Conditions Min — 100 VR – 2.5% Typ — — VR ±0.5% 20 40 0.01 0.5 20 70 93 112 — 50 — 64 300 0.04 260 Max 6.5 — VR + 2.5% — — — — Units V mA V ppm/°C % % mV Note 1 Note 2 (VR + 1V) < VIN < 6V IL = 1.0mA to IOUTMAX (Note 3) IL = 0.1mA IL = 20mA IL = 50mA IL =100mA (Note 4) IL = IOUTMAX, (Note 5) SHDN = VIH, IL = 0 SHDN = 0V FRE ≤ 1kHz VOUT = 0V Note 6 IL = IOUTMAX 470pF from Bypass to GND VIN = 2.5V to 6.5V VIN = 2.5V to 6.5V — — — IGND IIN IINSD PSRR IOUTSC ∆VOUT/∆PD eN Ground Pin Current Supply Current Shutdown Supply Current Power Supply Rejection Ratio Output Short Circuit Current Thermal Regulation Output Noise — — — — — — — 0 — 0.05 — 500 — — µA µA µA dB mA %/W nV/√Hz SHDN Input VIH VIL SHDN Input High Threshold SHDN Input Low Threshold 45 — — — — 15 %VIN %VIN NOTES: 1. VR is the regulator output voltage setting. VR = 2.5V, 2.7V, 3.0V, 3.3V, 5.0V. 2. TCVOUT = (VOUTMAX – VOUTMIN) x 10 6 VOUT x ∆T 3. Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 1.0mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 4. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value at a 1V differential. 5. Ground pin current is the regulator pass transistor gate current. The total current drawn from the input supply is the sum of the load current, ground current and supply current (i.e. IIN = ISUPPLY + IGND + ILOAD). 6. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10msec. 7. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e. TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Thermal Considerations section of this data sheet for more details. . TC1015-01-6/5/97 2 100mA CMOS LDO WITH SHUTDOWN AND REFERENCE BYPASS PRELIMINARY INFORMATION TC1015 PIN DESCRIPTION Pin No. (SOT-23A-5) 1 2 3 Symbol VIN GND SHDN Description Unregulated supply input. Ground terminal. Shutdown control input. The regulator is fully enabled when a logic high is applied to this input. The regulator enters shutdown when a logic low is applied to this input. During shutdown, output voltage falls to zero, and supply current is reduced to under 1 microamp (typical). Reference bypass input. Connecting a 470pF to this input further reduces output noise. Regulated voltage output. 4 5 Bypass VOUT DETAILED DESCRIPTION The TC1015 is a precision fixed output voltage regulator. (If an adjustable version is desired, please see the TC1070 or TC1071 data sheets.) Unlike the bipolar regulators, the TC1015 supply current does not increase with load current. In addition, VOUT remains stable and within regulation at very low load currents (an important consideration in RTC and CMOS RAM battery back-up applications). Figure 1 shows a typical application circuit. The regulator is enabled any time the shutdown input (SHDN) is at or above VIH, and shutdown (disabled) when SHDN is at or below VIL. SHDN may be controlled by a CMOS logic gate, or I/O port of a microcontroller. If the SHDN input is not required, it should be connected directly to the input supply. While in shutdown, supply current decreases to 0.05µA (typical) and VOUT falls to zero volts. VIN 1µF VOUT 1µF VOUT noise is not a concern, this input may be left unconnected. Larger capacitor values may be used, but results in a longer time period to rated output voltage when power is initially applied. Output Capacitor A 1µF (min) capacitor from VOUT to ground is recommended. The output capacitor should have an effective series resistance of 5Ω or less, and a resonant frequency above 1MHz. A 1µF capacitor should be connected from VIN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor, or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitor types can be used. (Since many aluminum electrolytic capacitors freeze at approximately – 30°C, solid tantalums are recommended for applications operating below – 25°C.) When operating from sources other than batteries, supplynoise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. Thermal Considerations BATTERY GND TC1015 SHDN Bypass 470pF Reference Bypass Cap (Optional) Thermal Shutdown Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 160°C. The regulator remains off until the die temperature drops to approximately 150°C. Power Dissipation The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst case actual power dissipation: Shutdown Control (to CMOS Logic or Tie to VIN if Unused) Figure 1. Typical Application Circuit Bypass Input A 470pF capacitor connected from the Bypass input to ground reduces noise present on the internal reference, which in turn significantly reduces output noise. If output TC1015-01-6/5/97 3 PRELIMINARY INFORMATION 100mA CMOS LDO WITH SHUTDOWN AND REFERENCE BYPASS TC1015 PD ≈ (VINMAX – VOUTMIN)ILOADMAX Where: PD VINMAX VOUTMIN ILOADMAX = Worst case actual power dissipation = Maximum voltage on VIN = Minimum regulator output voltage = Maximum output (load) current Equation 1. In this example, the TC1015 dissipates a maximum of only 60mW; far below the allowable limit of 318mW. In a similar manner, Equation 1 and Equation 2 can be used to calculate maximum current and/or input voltage limits. For example, the maximum allowable VIN is found by sustituting the maximum allowable power dissipation of 318mW into Equation 1, from which VINMAX = 5.9V. Layout Considerations The primary path of heat conduction out of the package is via the package leads. Therefore, layouts having a ground plane, wide traces at the pads, and wide power supply bus lines combine to lower θJA and, therefore, increase the maximum allowable power dissipation limit. The maximum allowable power dissipation (Equation 2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (125°C) and the thermal resistance from junction-to-air ( θ JA ). The SOT-23A-5 package has a θJA of approximately 220°C/Watt when mounted on a single layer FR4 dielectric copper clad PC board. PD MAX = (TJMAX – TJMAX) θJA Where all terms are previously defined. Equation 2. Equation 1 can be used in conjunction with Equation 2 to ensure regulator thermal operation is within limits. For example: Given: VINMAX = 3.0V ±10% VOUTMIN = 2.7V ±0.5V ILOAD = 98mA TAMAX = 55°C 1. Actual power dissipation 2. Maximum allowable dissipation Find: Actual power dissipation: PD ≈ (VINMAX – VOUTMIN)ILOADMAX = [(3.0 x 1.1) – (2.7 x .995)]98 x 10–3 = 60mW Maximum allowable power dissipation: PDMAX = (TJMAX – TAMAX) θJA = (125 – 55) 220 = 318mW TC1015-01-6/5/97 4 100mA CMOS LDO WITH SHUTDOWN AND REFERENCE BYPASS PRELIMINARY INFORMATION TC1015 MARKING SOT-23A-5 & = part number code + temperature range and voltage TC1015 (V) 2.5 2.7 3.0 3.3 5.0 Code B1 B2 B3 B5 B7 represents year and quarter code represents lot ID number PACKAGE DIMENSIONS SOT-23A-5* .122 (3.10) .098 (2.50) .020 (0.50) .012 (0.30) .071 (1.80) .059 (1.50) .037 (0.95) REFERENCE .122 (3.10) .106 (2.70) .057 (1.45) .035 (0.90) .006 (0.15) .000 (0.00) 10° MAX. .022 (0.55) .008 (0.20) .010 (0.25) .004 (0.09) NOTE: *SOT-23A-5 is equivalent to the EIAJ (SC-74A) Dimensions: inches (mm) Sales Offices TelCom Semiconductor 1300 Terra Bella Avenue P.O. Box 7267 Mountain View, CA 94039-7267 TEL: 415-968-9241 FAX: 415-967-1590 E-Mail: liter@c2smtp.telcom-semi.com TC1015-01-6/5/97 TelCom Semiconductor Austin Product Center 9101 Burnet Rd. Suite 214 Austin, TX 78758 TEL: 512-873-7100 FAX: 512-873-8236 5 TelCom Semiconductor H.K. Ltd. 10 Sam Chuk Street, 6/F San Po Kong Kowloon Hong Kong TEL: 852-2324-0122 FAX: 852-2354-9957 Printed in the U.S.A.
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