TC1173-3.0VUA

TC1173 300mA CMOS LDO with Shutdown, ERROR Output and Bypass FEATURES s s s s s s s s s Extremely Low Supply Current for Longer Battery Life! Very Low Dropout Voltage Guaranteed 300mA Output Standard or Custom Output Voltages ERROR Output Can be Used as a Low Battery Detector or Processor Reset Generator Power-Saving Shutdown Mode Bypass Input for Ultra-Quiet Operation Over-Current and Over-Temperature Protection Space-Saving MSOP Package Option GENERAL DESCRIPTION The TC1173 is a precision output (typically ±0.5%) CMOS low dropout regulator. Total supply current is typically 50µA at full load (20 to 60 times lower than in bipolar regulators!). TC1173 key features include ultra low noise operation (plus optional Bypass input); very low dropout voltage (typically 240mV at full load) and internal feed-forward compensation for fast response to step changes in load. An error output (ERROR) is asserted when the TC1173 is outof-regulation (due to a low input voltage or excessive output current). ERROR can be set as a low battery warning or as a processor RESET signal (with the addition of an external RC network). Supply current is reduced to 0.05µA (typical) and VOUT and ERROR fall to zero when the shutdown input is low. The TC1173 incorporates both over-temperature and over-current protection. The TC1173 is stable with an output capacitor of only 1µF and has a maximum output current of 300mA. APPLICATIONS s s s s s s s Battery-Operated Systems Portable Computers Medical Instruments Instrumentation Cellular / GSM / PHS Phones Linear Post-Regulator for SMPS Pagers ORDERING INFORMATION Part Number TC1173-xxVOA TC1173-xxVUA Package 8-Pin SOIC 8-Pin MSOP Junction Temp. Range – 40°C to +125°C – 40°C to +125°C TYPICAL APPLICATION 1 C1 1µF 2 8 VOUT VIN VIN GND NC 7 R3 1M TC1173 3 NC SHDN 6 Available Output Voltages: 2.5, 2.8, 3.0, 3.3, 5.0 xx indicates output voltages Other output voltages are available. Please contact TelCom Semiconductor for details. 4 Bypass ERROR 5 ERROR PIN CONFIGURATION MSOP VOUT GND NC Bypass 1 2 3 4 8 7 CBYPASS 470pF (Optional) Shutdown Control (from Power Control Logic) TC1173VUA 6 5 VIN NC SHDN ERROR SOIC VOUT 1 GND 2 8 VIN 7 NC NC 3 TC1173VOA 6 SHDN Bypass 4 5 ERROR TC1173-2 2/2/00 TelCom Semiconductor reserves the right to make changes in the circuitry and specifications of its devices. 300mA CMOS LDO With Shutdown, ERROR Output, And Bypass TC1173 ABSOLUTE MAXIMUM RATINGS* Input Voltage .............................................................. 6.5V Output Voltage ........................... (VSS – 0.3) to (VIN + 0.3) Power Dissipation .................... Internally Limited (Note 7) Operating Temperature .................... – 40°C < TJ < 125°C Storage Temperature ............................ – 65°C to +150°C Maximum Voltage on Any Pin ............ VIN +0.3V to – 0.3V Lead Temperature (Soldering, 10 Sec.) ................ +300°C *Absolute Maximum Ratings indicate device operation limits beyond damage may occur. Device operation beyond the limits listed in Electrical Characteristics is not recommended. ELECTRICAL CHARACTERISTICS: VIN = VOUT + 1V, IL = 0.1µA, CL = 3.3µF, SHDN > VIH, TA = 25°C, unless otherwise noted. BOLDFACE type specifications apply for junction temperatures of – 40°C to +125°C Symbol VIN IOUTMAX VOUT ∆VOUT/∆T ∆VOUT/∆VIN ∆VOUT/VOUT VIN – VOUT Parameter Input Operating Voltage Maximum Output Current Output Voltage VOUT Temperature Coefficient Line Regulation Load Regulation Dropout Voltage (Note 4) Test Conditions Min — 300 — VR - 2.5% — — — — Typ — — ± 0.5% — 40 0.05 0.5 20 80 240 50 0.05 60 550 0.04 260 Max 6.0 — — VR + 2.5% — 0.35 2.0 30 160 480 90 0.5 — 650 — — Units V mA V ppm/°C % % mV Note 1 Note 2 (VR + 1V) < VIN < 6V IL = 0.1mA to IOUTMAX (Note 3) IL = 0.1mA IL = 100mA IL = 300mA SHDN = VIH SHDN = 0V FRE ≤ 1kHz VOUT = 0V Note 5 F = 1kHz, COUT = 1µF, RLOAD = 50Ω VR ISS1 ISS2 PSRR IOUTSC ∆VOUT∆PD eN Supply Current Shutdown Supply Current Power Supply Rejection Ratio Output Short Circuit Current Thermal Regulation Output Noise — — — — — — µA µA dB mA V/W nV/√Hz SHDN Input VIH VIL SHDN Input High Threshold SHDN Input Low Threshold 45 — — — — 15 %VIN %VIN ERROR Output VMIN VOL VTH VOL Minimum Operating Voltage Output Logic Low Voltage ERROR Threshold Voltage ERROR Positive Hysteresis 1mA Flows to ERROR Note 7 1.0 — — — — — 0.95 x VR 50 — 400 — — V mV V mV NOTES: 1. VR is the user-programmed regulator output voltage setting. 2. TC VOUT = (VOUTMAX – VOUTMIN) x 10 6 VOUT x ∆T 3. Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 4. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V differential. 5. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10msec. 6. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature, and the thermal resistance from junction-to-air (i.e. TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Thermal Considerations section of this data sheet for more details. 7. Hysteresis voltage is referenced to VR. TC1173-2 2/2/00 2 300mA CMOS LDO With Shutdown, ERROR Output, And Bypass TC1173 DETAILED DESCRIPTION The TC1173 is a fixed output, low drop-out regulator. Unlike bipolar regulators, the TC1173 supply current does not increase with load current. In addition, VOUT remains stable and within regulation at very low load currents (an important consideration in RTC and CMOS RAM battery back-up applications). TC1173 pin functions are detailed below: SHDN may be controlled by a CMOS logic gate, or I/O port of a microcontroller. If the SHDN input is not required, it should be connected directly to the input supply. While in shutdown, supply current decreases to 0.05µA (typical), VOUT falls to zero and ERROR is disabled. ERROR Output ERROR is driven low whenever VOUT falls out of regulation by more than – 5% (typical). This condition may be caused by low input voltage, output current limiting, or thermal limiting. The ERROR threshold is 5% below rated VOUT regardless of the programmed output voltage value (e.g., ERROR = VOL at 4.75V (typ) for a 5.0V regulator and 2.85V (typ) for a 3.0V regulator). ERROR output operation is shown in Figure 2. Note that ERROR is active when VOUT is at or below VTH, and inactive when VOUT is above VTH + VH. As shown in Figure 1, ERROR can be used as a battery low flag, or as a processor RESET signal (with the addition of timing capacitor C2). R1 x C3 should be chosen to maintain ERROR below VIH of the processor RESET input for at least 200msec to allow time for the system to stabilize. Pull-up resistor R1 can be tied to VOUT, VIN or any other voltage less than (VIN + 0.3V.) VOUT PIN DESCRIPTIONS Pin No. 1 2 3 4 5 Symbol VOUT GND NC Bypass ERROR Description Regulated voltage output Ground terminal No connect Reference bypass input. Connecting a 470pF to this input further reduces output noise. Out-of-Regulation Flag (Open Drain Output). This output goes low when VOUT is outof-tolerance by approximately -5%. Shutdown control input. The regulator is fully enabled when a logic high is applied to this input. The regulator enters shutdown when a logic low is applied to this input. During shutdown, output voltage falls to zero and supply current is reduced to 0.05µA (typical). No connect Unregulated supply input 6 SHDN 7 8 NC VIN VTH Hysteresis (VH) Figure 1 shows a typical application circuit. The regulator is enabled any time the shutdown input (SHDN) is above VIH, and shutdown (disabled) when SHDN is at or below VIL. ERROR VIH VOL VOUT 1 C1 1µF 2 VOUT VIN 8 Figure 2: ERROR Output Operation VIN GND NC 7 R3 1M TC1173 3 NC SHDN 6 4 Bypass ERROR 5 ERROR CBYPASS 470pF (Optional) Shutdown Control (from Power Control Logic) Output Capacitor A 1µF (min) capacitor from VOUT to ground is recommended. The output capacitor should have an effective series resistance of 5Ω or less. A 1µF capacitor should be connected from VIN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor, or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitor types can be used. (Since many aluminum electrolytic capacitors freeze at approximately – 30°C, solid tantalums are recommended for applications operating below – 25°C.) When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. 3 Figure 1: Typical Application Circuit TC1173-2 2/2/00 300mA CMOS LDO With Shutdown, ERROR Output, And Bypass TC1173 Bypass Input A 470pF capacitor connected from the Bypass input to ground reduces noise present on the internal reference, which in turn significantly reduces output noise. If output noise is not a concern, this input may be left unconnected. Larger capacitor values may be used, but results in a longer time period to rated output voltage when power is initially applied. Equation 1 can be used in conjunction with Equation 2 to ensure regulator thermal operation is within limits. For example: GIVEN: VINMAX = 3.0V ± 10% VOUTMIN = 2.7V ± 0.5% ILOADMAX = 250mA TJMAX = 125°C TAMAX = 55°C JA = 200°C/W 8-Pin MSOP Package 1. Actual power dissipation 2. Maximum allowable dissipation Thermal Considerations Thermal Shutdown Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 150°C. The regulator remains off until the die temperature drops to approximately 140°C. Power Dissipation The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst case actual power dissipation: PD ≈ (VINMAX – VOUTMIN)ILOADMAX Where: PD = VINMAX = VOUTMIN = ILOADMAX = worst case actual power dissipation maximum voltage on VIN minimum regulator output voltage maximum output (load) current Equation 1. FIND: Actual power dissipation: PD ≈ (VINMAX - VOUTMIN)ILOADMAX = [(3.0 x 1.1) - (2.7 x .995)]250 x 10-3 = 155mW Maximum allowable power dissipation: PD ≈ (TJMAX– TAMAX) JA = (125 – 55) 200 = 350mW In this example, the TC1173 dissipates a maximum of only 155mW; far below the allowable limit of 350mW. In a similar manner, Equation 1 and Equation 2 can be used to calculate maximum current and/or input voltage limits. For example, the maximum allowable VIN is found by substituting the maximum allowable power dissipation of 350mW into Equation 1, from which VINMAX = 4.1V. Layout Considerations The primary path of heat conduction out of the package is via the package leads. Therefore, layouts having a ground plane, wide traces at the pads, and wide power supply bus lines combine to lower JA and, therefore, increase the maximum allowable power dissipation limit. The maximum allowable power dissipation (Equation 2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (125°C), and the thermal resistance from junction-to-air ( JA). The 8-Pin SOIC package has a JA of approximately 160°C/Watt, while the 8-Pin MSOP package has a JA of approximately 200°C/Watt; both when mounted on a single layer FR4 dielectric copper clad PC board. PDMAX = (TJMAX – TAMAX) JA Where all terms are previously defined. Equation 2. TC1173-2 2/2/00 4 300mA CMOS LDO With Shutdown, ERROR Output, And Bypass TC1173 TYPICAL CHARACTERISTICS Line Regulation 0.012 0.010 LINE REGULATION (%) Noise (µV/√/ HZ) Output Noise 10.0 RLOAD = 50Ω COUT = 1µF LOAD REGULATION (%) Load Regulation 2.00 1.80 1.60 1.40 1.20 1.00 0.80 0.60 0.40 0.20 1 to 100mA 1 to 50mA 1 to 300mA 0.008 0.006 0.004 0.002 0.000 –0.002 –0.004 –40 –20 0 20 40 60 80 100 120 1.0 0.1 0.0 0.01 0.01 1 10 100 1000 0.00 –40 –20 0 20 40 60 80 100 120 TEMPERATURE (°C) Supply Current 100.0 DROPOUT VOLTAGE (V) SUPPLY CURRENT (µA) FREQUENCY (KHz) TEMPERATURE (°C) VOUT vs. Temperature 3.075 VIN = 4V ILOAD = 100µA CLOAD = 3.3µF Dropout Voltage vs. Load Current 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 –40°C 125°C 85°C 70°C 25°C 0°C VOUT (V) 90.0 80.0 70.0 60.0 50.0 40.0 –40 –20 3.025 2.975 0 20 40 60 80 100 120 0 50 100 150 200 250 300 2.925 –40 –20 0 20 40 60 80 100 120 TEMPERATURE (°C) LOAD CURRENT (mA) TEMPERATURE (°C) Power Supply Rejection Ratio VOUT = 5V –35dB R LOAD = 50Ω –40dB VINAC = 50mV p-p –45dB PSRR (dB) –30dB –50dB –55dB –60dB –65dB –70dB –75dB –80dB 10 100 1K 10K 100K 1M FREQUENCY (KHz) COUT = 1µF TC1173-2 2/2/00 5 300mA CMOS LDO With Shutdown, ERROR Output, And Bypass TC1173 TAPE AND REEL DIAGRAMS Component Taping Orientation for 8-Pin SOIC (Narrow) Devices User Direction of Feed PIN 1 User Direction of Feed W PIN 1 Standard Reel Component Orientation for TR Suffix Device P Reverse Reel Component Orientation for RT Suffix Device Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 8-Pin SOIC (N) 12 mm 8 mm 2500 13 in Component Taping Orientation for 8-Pin MSOP Devices User Direction of Feed PIN 1 User Direction of Feed W PIN 1 Standard Reel Component Orientation for TR Suffix Device P Reverse Reel Component Orientation for RT Suffix Device Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 8-Pin MSOP 12 mm 8 mm 2500 13 in TC1173-2 2/2/00 6 300mA CMOS LDO With Shutdown, ERROR Output, And Bypass TC1173 PACKAGE DIMENSIONS 8-Pin SOIC (Narrow) PIN 1 .157 (3.99) .150 (3.81) .244 (6.20) .228 (5.79) .050 (1.27) TYP. .197 (5.00) .189 (4.80) .069 (1.75) .053 (1.35) .020 (0.51) .010 (0.25) .013 (0.33) .004 (0.10) 8° MAX. .050 (1.27) .016 (0.40) .010 (0.25) .007 (0.18) 8-Pin MSOP PIN 1 .122 (3.10) .114 (2.90) .197 (5.00) .189 (4.80) .026 (0.65) TYP. .122 (3.10) .114 (2.90) .043 (1.10) MAX. .016 (0.40) .010 (0.25) .006 (0.15) .002 (0.05) 6° MAX. .028 (0.70) .016 (0.40) .008 (0.20) .005 (0.13) Dimensions: inches (mm) Sales Offices TelCom Semiconductor, Inc. 1300 Terra Bella Avenue P.O. Box 7267 Mountain View, CA 94039-7267 TEL: 650-968-9241 FAX: 650-967-1590 E-Mail: liter@telcom-semi.com TelCom Semiconductor, GmbH Lochhamer Strasse 13 D-82152 Martinsried Germany TEL: (011) 49 89 895 6500 FAX: (011) 49 89 895 6502 2 TelCom Semiconductor H.K. Ltd. 10 Sam Chuk Street, Ground Floor San Po Kong, Kowloon Hong Kong TEL: (011) 852-2350-7380 FAX: (011) 852-2354-9957 TC1173-2 2/2/00 7