QEHC49H3510LM5016

FREQUENCY QESM07 SMD 3.0x2.5 Crystal – Ceramic SMD packaged Specification (Rev-A) Electrical Characteristics ......................................................P01 ESR vs. frequency range and Mode of vibration ..................P01 Mechanical Characteristics ...................................................P01 Ordering Information .............................................................P02 Suggested Reflow Soldering profile ......................................P02 Tape Drawing ........................................................................P03 Reel Drawing ........................................................................P03 Frequency QESM07 SMD 3.2x2.5 Crystal – Ceramic SMD packaged Specification (rev-A) June 26th, 2006 Electrical Characteristics Electrical Parameters Frequency range Temperature Stability Operating Temperature Range Storage temperature range Shunt capacitance C0 Load capacitance Drive level Aging (First Year) Insulator resistance Unit MHz ± ppm °C °C pF pF µW ± ppm MΩ 500 10 8pF ~ 12pF 100 300 2 Ref at 25°C At 100VDC Customized specification upon request -40 Minimum Typical Maximum 13 10 10 15 15 -20/+70 54 30 30 -40/+85 +85 3.0 Refer to Ordering Information Refer to Ordering Information Refer to Ordering Information Refer to Ordering Information Test conditions Frequency Tolerance (at 25°C) ± ppm ESR vs. frequency range and Mode of vibration Frequency range (MHz) 13.000 to 19.999 20.000 to 25.999 26.000 to 54.000 Mode of vibration Fundamental (AT-cut) Fundamental (AT-cut) Fundamental (AT-cut) Max ESR (Ω) 80 70 50 Mechanical Characteristics Line 1 Line 2 Marking for QESM06 Temex code (3 digits) T+date code (2digits) Mechanical conditions Vibration 10g, 10Hz to 2KHz according to standard CEI 68-2-63 Shocks 100g, 6ms according to standard CEI 68-227 Note 1 : Pin 2 and Pin 4 are connected through cover. In case connected to GND, frequency might be drifted. Note 2 : QESM07 is fully RoHS compliant. H = 0.65 ± 0.10 mm 1 TEME X r e se rv es th e r i g h t to m o di fy h er ei n s pe c i f i c a t i o n s a n d in form a t i o n s a t a ny t ime w hen ne ce ssa r y t o pr ov ide o p t im u m p er form a n ce an d c o st. Frequency QESM07 SMD 3.2x2.5 Crystal – Ceramic SMD packaged Specification (rev-A) June 26th, 2006 Ordering Information QESM07 1 10 Part numbering system HQ 10 10 14.7456MHZ Package type Vibration mode 1=Fundamental Frequency tolerance Operating temperature range Frequency stability Load Capacitance 10=10pF Please, enter the value of load capacitance Nominal Frequency (MHz) Please enter the nominal frequency SMD Package QESM07 : SMD ceramic 3.2 x 2.5 10=±10ppm 20=±20ppm 30=±30ppm D=-40°C F= -30°C H=-20°C J=-10°C L=0°C M=+50°C N=+55°C O=+60°C Q=+70°C T=+85°C 10=±10ppm 20=±20ppm 30=±30ppm Suggested Reflow Soldering Profile 2 TEME X r e se rv es th e r i g h t to m o di fy h er ei n s pe c i f i c a t i o n s a n d in form a t i o n s a t a ny t ime w hen ne ce ssa r y t o pr ov ide o p t im u m p er form a n ce an d c o st. Frequency QESM07 SMD 3.2x2.5 Crystal – Ceramic SMD packaged Specification (rev-A) June 26th, 2006 Tape Drawing Item Pitch of components Pitch of sprocket hole Length from hole center to component center Width of carrier tape Width of adhesive tape Height of component hole Width of component hole Gap of hold down tape and carrier tape Diameter of sprocket hole Diameter of feed hole Total of tape thickness Code P Po P1 W W0 A B W2 Do D1 K Dimension 4.0 4.0 2.0 8.0 3.5 3.5 2.8 0.5 ∅ 1.5 ∅ 1.5 1.0 Tolerance ± 0.1 ± 0.1 ± 0.1 ± 0.3 ± 0.1 ± 0.1 ± 0.1 ± 0.1 ± 0.05 ± 0.25 ± 0.1 Reel Drawing 9.5 2.5 Ø21.6 Ø13.5 Multiple : 2000pcs per reel Ø 178 1.6 Ø 60 3 TEME X r e se rv es th e r i g h t to m o di fy h er ei n s pe c i f i c a t i o n s a n d in form a t i o n s a t a ny t ime w hen ne ce ssa r y t o pr ov ide o p t im u m p er form a n ce an d c o st.