U2043B

U2043B Flasher, 30-mW Shunt, Pilot Lamp to GND or VBatt Description The integrated circuit U2043B is used in relay controlled automotive flashers where a high EMC level is required. A lamp outage is indicated by frequency doubling during hazard mode as well as direction mode. Pilot lamp can be connected either to VBatt or GND. Features D Temperature and voltage compensated frequency D Warning indication of lamp failure by means of frequency doubling D Relay output with high current carrying capacity and low saturation voltage D Minimum lamp load for flasher operation w 10 W Package DIP8 SO8 D Low susceptibility to EMI Ordering Information Extended Type Number U2043B U2043B–FP Remarks Block Diagram + VS + 49 6 C1 Measuring comparator 4 K 1 V 6–81 mV 7 Pilot lamp Pulse generator 3.8 k W 8 K 3 V –5 V 6 49 a–Comparator 23 V 1 IC Ground 13283 2 R3 Shunt 30 m W 5W R1 3 Relay R2 3.3 k W 49 a 5 R1 100 W GND – 31 5 W 21 W 21 W 21 W 21 W 5 W Indicator lamps Pilot lamps Figure 1. TELEFUNKEN Semiconductors Rev. A2, 25-Feb-97 1 (6) U2043B Pin Description Pin 1 2 3 4 5 6 7 8 Symbol GND VS REL OSC OSC VS LD SI Function IC ground Supply voltage VS Relay driver C1 oscillator R1 oscillator Supply voltage VS Lamp failure detection Start input (49a) GND Vs REL OSC 1 2 8 7 SI LD Vs OSC 12749 U2043B 3 4 6 5 Figure 2. Pinning Functional Description Pin 1, GND The integrated circuit is protected against damage via resistor R4 to ground (–31) in the case of battery reversal. An integrated protection circuit together with external resistances R2 and R4 limits the current pulses in the IC. Pin 2, Supply voltage, VS - Power The arrangement of the supply connections to Pin 2 must be such as ensure that, on the connection printed circuit board (PCB), the resistance of VS to Pin 6 is lower than that to Pin 2. Pin 3, Relay control output (driver) The relay control output is a high-side driver with a low saturation voltage and capable to drive a typical automotive relay with a minimum coil resistance of 60 W. Pin 4 and 5 Oscillator Flashing frequency, f1, is determined by the R1C1 components as follows (see figure 1): mized layer resistance from point VS / shunt to Pin 6 is recommended. Pin 7, Lamp outage detection The lamp current is monitored via an external shunt resistor R3 and an internal comparator K1 with its reference voltage of typ. 81 mV (VS = 12 V). The outage of one lamp out of two lamps is detected according to the following calculation: Nominal current of 1 lamp: 21 W / (VS = 12 V): Ilamp = 1.75 A Nominal current of 2 lamps: 2 x 21 W / (VS = 12 V): Ilamp = 3.5 A. The detection threshold is recommended to be set in the middle of the current range: Ioutage 2.7 A Thus the shunt resistor is calculated as: R3 = VT (K1) / Ioutage R3 = 81 mV/2.7 A = 30 mW. Comparator K1‘s reference voltage is matched to the characteristics of filament lamps (see “control signal threshold” in the data part). The combination of shunt resistor and resistance of wire harness prevents Pin 7 from a too high voltage in the case of shortet lamps. [ where [ R C1 1.5 Hz C  47 mF R + 6.8 kW to 510 kW f1 1 1 1 1 In the case of a lamp outage (see Pin 7) the oscillator frequency is switched to the lamp outage frequency f2 with f2 2.2 f1. [ Duty cycle in normal flashing mode: 50% Duty cycle in lamp outage mode: 40% (bright phase) Pin 6, Supply voltage, Sense For accurate monitoring via the shunt resistor, a mini- Pin 8, Start input Start condition for flashing: the voltage at Pin 8 has to be below less than VS – 5 V (flasher switch closed). Humidity and dirt may decrease the resistance between 49 a and GND. If this leakage resistance is 5 kW the IC is still kept in its off-condition. In this case the voltage at Pin 8 is greater than VS – 5 V. During the bright phase the voltage at Pin 8 is above the K2 threshold, during the dark phase it is below the K3 threshold. For proper start conditions a minimum lamp wattage of 10 W is required. u 2 (6) TELEFUNKEN Semiconductors Rev. A2, 25-Feb-97 U2043B Absolute Maximum Ratings Reference point Pin 1 Parameters Supply voltage Surge forward current tp = 0.1 ms tp = 2 ms tp = 2 ms Output current Power dissipation Tamb = 95°C Tamb = 60°C Junction temperature Ambient temperature range Storage temperature range Pins 2, 6 Pins 2, 6 Pins 2, 6 Pin 8 Pin 3 DIP8 SO8 DIP8 SO8 Symbol VS IFSM IFSM IFSM IO Ptot Ptot Ptot Ptot Tj Tamb Tstg Value 16.5 1.5 1.0 50 0.3 420 340 690 560 150 –40 to +95 –55 to +150 Unit V A A mA A mW mW mW mW °C °C °C Thermal Resistance Parameters Junction ambient DIP8 SO8 Symbol RthJA RthJA Value 110 160 Unit K/W K/W Electrical Characteristics Typical values under normal operation in application circuit figure 1, VS (+49, Pins 2 and 6) = 12 V. Reference point ground (–31), Tamb = 25°C, unless otherwise specified Parameters Supply voltage range Supply current Supply current Relay output Test Conditions / Pins Pins 2, 6 Dark phase or stand-by Pins 2, 6 Bright phase Pins 2, 6 Saturation voltage IO = 150 mA, Pin 3 VS = 9 V Pin 3 Symbol VS(+49) IS IS VO IO RL ton R1 C1 60 6.8 10 510 47 Min. Typ. 9 to 15 4.5 7.0 Max. 8 11 1.0 0.1 Unit V mA mA V mA Relay output reverse current Relay coil resistance Start delay Frequency determining resistor Frequency determining capacitor W ms kW First bright phase mF TELEFUNKEN Semiconductors Rev. A2, 25-Feb-97 3 (6) U2043B Electrical Characteristics (continued) Parameters Frequency tolerance Test Conditions / Pins Normal flashing, basisc frequency f1 not including the tolerance of the external components R1 and C1 Basic frequency f1 Control frequency f2 Lamp outage VS = 15 V Pin 7 VS = 9 V VS = 12 V 49a to GND Symbol Min. Typ. Max. Unit Df1 Df1 Df2 f2 VR3 VR3 VR3 Rp PL –5 47 37 2.15 f1 85 66 76 10 +5 53 45 2.3 f1 97 76 87 5 % % % Hz mV mV mV kW W Bright period Bright period Frequency increase Control signal threshold Leakage resistance Lamp load 91 71 81 2 4 (6) TELEFUNKEN Semiconductors Rev. A2, 25-Feb-97 U2043B Package Information Package DIP8 Dimensions in mm 9.8 9.5 1.64 1.44 7.77 7.47 4.8 max 6.4 max 0.5 min 0.58 0.48 7.62 8 5 2.54 3.3 0.36 max 9.8 8.2 technical drawings according to DIN specifications 13021 1 4 Package SO8 Dimensions in mm 5.00 4.85 1.4 0.4 1.27 3.81 8 5 0.25 0.10 0.2 3.8 6.15 5.85 5.2 4.8 3.7 technical drawings according to DIN specifications 13034 8 5 TELEFUNKEN Semiconductors Rev. A2, 25-Feb-97 5 (6) U2043B Ozone Depleting Substances Policy Statement It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances ( ODSs). The Montreal Protocol ( 1987) and its London Amendments ( 1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2 . Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency ( EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C ( transitional substances ) respectively. TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances. We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 49 ( 0 ) 7131 67 2831, Fax number: 49 ( 0 ) 7131 67 2423 6 (6) TELEFUNKEN Semiconductors Rev. A2, 25-Feb-97