6N139
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Vishay Semiconductors
High Speed Optocoupler, 100 kBd, Low Input Current,
Photodiode Darlington Output
DESCRIPTION
High common mode transient immunity and very high
current ratio together with 5300 VRMS insulation are
achieved by coupling and LED with an integrated high gain
photo detector in an eight pin dual-in-line package.
Separate pins for the photo diode and output stage enable
TTL compatible saturation voltages with high speed
operation.
Access to the base terminal allows adjustment to the gain
bandwidth.
The 6N139 is suited for low power logic applications
involving CMOS and low power TTL applications. A 400 %
current transfer ratio with only 0.5 mA of LED current is
guaranteed.
NC
1
8
VCC
A
2
7
VB
C
3
6
VO
NC
4
5
GND
Caution: Due to the small geometries of this device, it should be
handled with Electrostatic Discharge (ESD) precautions. Proper
grounding would prevent damage further and/or degradation which
may be induced by ESD.
FEATURES
•
•
•
•
•
LINKS TO ADDITIONAL RESOURCES
3D 3D
3D Models
Design Tools
Related
Documents
Footprints
Schematics
High current transfer ratio, 500 %
Low input current, 1.6 mA
High common mode rejection, 500 V/μs
Adjustable bandwidth-access to base
Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
•
•
•
•
•
•
•
Microprocessor system interface
PLC, ATE input / output isolation
EIA RS232 line receiver
TTL, CMOS voltage level translation
Multiplexed data transmission
Digital control power supply
Ground loop and electrical noise elimination
AGENCY APPROVALS
• UL 1577
• cUL
• DIN EN 60747-5-5 (VDE 0884-5), available with option 1
Rev. 1.8, 24-Mar-2023
Document Number: 83605
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ORDERING INFORMATION
DIP
6
N
1
3
#
-
X
0
#
#
T
7.62 mm
PART NUMBER
PACKAGE OPTION
TAPE
AND
REEL
Option 7
> 0.7 mm
Option 9
> 0.1 mm
CTR (%)
AGENCY CERTIFIED / PACKAGE
1.6 mA
UL, cUL
> 500
DIP-8
6N139
SMD-8, option 7
6N139-X007, 6N139-X007T
SMD-8, option 9
6N139-X009, 6N139-X009T
UL, cUL, VDE (option 1)
> 500
DIP-8
6N139-X001
SMD-8, option 7
6N139-X017T
SMD-8, option 9
6N139-X019T
Note
• For additional information on the available options refer to option information
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
VALUE
UNIT
input
Reverse voltage
VR
5
V
Forward current
IF
25
mA
Average input current
If(avg)
20
mA
Input power dissipation
Pdiss
35
mW
VCC, VO
output
Supply and output voltage
Emitter base reverse voltage
Peak input current
Peak transient input current
Pin 8 to pin 5, pin 6 to pin 5
-0.5 to 18
V
Pin 5 to pin 7
0.5
V
50 % duty cycle - 1 ms pulse width
40
mA
tp ≤ 1 μs, 300 pps
1
A
IO
60
mA
Pdiss
100
mW
Storage temperature
Tstg
-55 to +150
°C
Operating temperature
Tamb
-55 to +100
°C
Tsld
260
°C
Output current
Pin 6
Output power dissipation
coupler
Lead soldering temperature
t = 10 s
Note
• Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not
implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute
maximum ratings for extended periods of the time can adversely affect reliability.
Rev. 1.8, 24-Mar-2023
Document Number: 83605
2
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ELECTRICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
MIN.
TYP.
MAX.
UNIT
INPUT
Input forward voltage
IF = 1.6 mA
VF
-
1.4
1.7
V
Input reverse breakdown voltage
IR = 10 μA
BVR
5
-
-
V
f = 1 MHz, VF = 0
CIN
-
25
-
pF
-
-1.8
-
mV/°C
VOL
-
0.1
0.4
V
V
Input capacitance
Temperature coefficient of
forward voltage
IF = 1.6 mA
OUTPUT
IF = 1.6 mA, IO = 8 mA, VCC = 4.5 V
Logic low, output voltage
(1)
IF = 5 mA, IO = 15 mA, VCC = 4.5 V
VOL
-
0.15
0.4
IF = 12 mA, IO = 24 mA, VCC = 4.5 V
VOL
-
0.25
0.4
V
Logic high, output current (1)
IF = 0 mA, VCC = 18 V
IOH
-
0.05
100
μA
Logic low supply current (1)
IF = 1.6 mA, VO = OPEN, VCC = 18 V
ICCL
-
0.2
1.5
mA
Logic high supply current (1)
IF = 0 mA, VO = OPEN, VCC = 18 V
ICCH
-
0.001
10
μA
-
-
1
μA
-
0.6
-
pF
COUPLER
Input output insulation leakage
current
45 % relative humidity,
Tamb = 25 °C, t = 5 s, VIO = 3000 VDC
Coupling capacitance
f = 1 MHz
CIO
Notes
• Minimum and maximum values are testing requirements. Typical values are characteristics of the device and are the result of engineering
evaluation. Typical values are for information only and are not part of the testing requirements.
(1) Pin 7 open
CURRENT TRANSFER RATIO
PARAMETER
Current transfer ratio (1)
TEST CONDITION
SYMBOL
MIN.
TYP.
MAX.
UNIT
IF = 0.5 mA, VO = 0.4 V, VCC = 4.5 V
CTR
400
1600
-
%
IF = 1.6 mA, VO = 0.4 V, VCC = 4.5 V
CTR
500
2000
-
%
Notes
(1) Pin 7 open
SAFETY AND INSULATION RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
Climatic classification
Comparative tracking index
TEST CONDITION
SYMBOL
According to IEC 68 part 1
VALUE
UNIT
55 / 100 / 21
Insulation group IIIa
CTI
175
Maximum rated withstanding isolation voltage
According to UL 1577, t = 1 min
VISO
5300
Maximum transient isolation voltage
According to DIN EN 60747-5-5
VIOTM
8000
Vpeak
Maximum repetitive peak isolation voltage
According to DIN EN 60747-5-5
VIORM
890
Vpeak
Tamb = 25 °C, VIO = 500 V
RIO
≥ 1012
Ω
Tamb = 100 °C, VIO = 500 V
RIO
≥ 1011
Ω
Isolation resistance
VRMS
Output safety power
PSO
500
mW
Input safety current
ISI
300
mA
Input safety temperature
TS
175
°C
≥7
mm
≥7
mm
≥8
mm
≥8
mm
≥ 0.4
mm
Creepage distance
Clearance distance
Creepage distance
Clearance distance
Insulation thickness
DIP-8
SMD-8, option 7,
SMD-8, option 9
DTI
Note
• As per IEC 60747-5-5, § 7.4.3.8.2, this optocoupler is suitable for “safe electrical insulation” only within the safety ratings. Compliance with
the safety ratings shall be ensured by means of protective circuits.
Rev. 1.8, 24-Mar-2023
Document Number: 83605
3
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SWITCHING CHARACTERISTICS
PARAMETER
Propagation delay time to logic low at output
TEST CONDITION
SYMBOL
MIN.
TYP.
MAX.
UNIT
IF = 0.5 mA, RL = 4.7 kΩ
tPHL
-
6
25
μs
IF = 12 mA, RL = 270 Ω
tPHL
-
0.6
1
μs
Propagation delay time to logic high at output
IF = 0.5 mA, RL = 4.7 kΩ
tPLH
-
4
60
μs
Propagation delay time to logic high at output
IF = 12 mA, RL = 270 Ω
tPLH
-
1.5
7
μs
I
10 % duty cycle
1/f < 100 µs
0
+5V
8
1
Pulse
generator
ZO = 5 0 Ω
tr = 5 n s
5V
V
IF
2
(saturated
response)
7
RL
3
1.5 V
6
0.1 µF
I F = monitor
5
4
1.5 V
VOL
VO
t PLH
t PHL
C L = 15 pF
5V
VO
Rm
90 %
90 %
(non-saturated
response)
10 %
10 %
tr
tf
isfh6318t_01
Fig. 1 - Switching Test Circuit
COMMON MODE TRANSIENT IMMUNITY
TEST CONDITION
SYMBOL
MIN.
TYP.
MAX.
UNIT
Common mode transient immunity,
logic high level output (1)
PARAMETER
IF = 0 mA, RL = 2.2 kΩ,
RCC = 0, |VCM| = 10 VP-P
|CMH|
-
500
-
V/μs
Common mode transient immunity,
logic low level output (1)
IF = 16 mA, RL = 2.2 kΩ,
RCC = 0, |VCM| = 10 VP-P
|CML|
-
-500
-
V/μs
Note
(2) In applications where dV/dt may exceed 50 000 V/μs (such as state discharge) a series resistor, R
CC should be included to protect IC from
destructively high surge currents. The recommend value is RCC ≅ [(1 V)/(0.15 IF (mA)] kΩ.
RCC (see Note 6)
1
8
2
7
IF
+5V
220 Ω
VCM
RL
A
3
6
4
5
B
90 %
90 %
0 V 10 %
0.1 µF
10 %
tr
tf
t f + t f =16 ns
VO
VO
5V
Switch at A: IF = 0 mA
VCC
VCM
+
isfh6318t_02
–
Pulse Generator
VO
Switch at B: IF = 1.6 mA
VOL
Fig. 2 - Test Circuit for Transient Immunity and Typical Waveforms
Rev. 1.8, 24-Mar-2023
Document Number: 83605
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TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
120
100
Total Power (mW)
IF - LED Current (mA)
30
20
10
Detector
80
60
40
Emitter
20
0
0
0
22418
25
50
75
100
125
Tamb - Ambient Temperature (°C)
0
22419
Fig. 3 - Permissible Forward LED Current vs. Temperature
25
50
75
100
125
Tamb - Ambient Temperature (°C)
Fig. 4 - Permissible Power Dissipation vs. Temperature
PACKAGE DIMENSIONS (in millimeters)
DIP-8
0.70 ± 0.20
6.00 ± 0.25
3.55 ± 0.20
6.70 ± 0.15
1.27 ± 0.10
0.50 ± 0.10
2.54 nom.
7° typ.
3 x 2.54 = 7.62
8
7
6
5
1
2
3
4
3.10 ± 0.25
7.62 typ.
10.16 max.
9.75 ± 0.15
0.95 ± 0.20
.10
0.25 ± 0
PIN ONE I.D.
Rev. 1.8, 24-Mar-2023
22672
Document Number: 83605
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SMD-8, Option 7
10.05 ± 0.25
10.16 max.
7.62 typ.
9.75 ± 0.15
6.70 ± 0.15
0.25 ± 0.10
3.55 ± 0.20
0.70 ± 0.20
0.95 ± 0.20
8.00 min.
8.40 min.
1.27 ± 0.10
0.75 ± 0.25
2.54 nom.
Leads
Coplanarity
0.10 max.
3 x 2.54 = 7.62
PIN ONE I.D.
8
7
6
5
1
2
3
4
22674
SMD-8, Option 9
9.78 ± 0.25
7.62 typ.
10.16 max.
9.75 ± 0.15
0.95 ± 0.20
0.75 ± 0.20
1.27 ± 0.10
2.54 nom.
0.25 ± 0.10
0.18 ± 0.08
3.55 ± 0.20
6.70 ± 0.15
8.00 min.
Leads Coplanarity
0.10 max.
3 x 2.54 = 7.62
PIN ONE I.D.
8
7
6
5
1
2
3
4
22675
Rev. 1.8, 24-Mar-2023
Document Number: 83605
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PACKAGE MARKING
6N139
V XXXX 68
Fig. 3 - Example of 6N139-X017T
Note
• XXXX = LMC (lot marking code)
• VDE logo is only marked on option 1 parts
• Tape and reel suffix (T) is not part of the package marking
PACKING INFORMATION (in millimeters)
Tube
528 ± 0.2
330 ± 0.5
260 ± 0.5
200 ± 0.5
150 ± 0.5
125 ± 0.5
– 1.0
30 ± 0.5
B
VISHAY OPTOSEMICONDUCTOR MADE IN MALAYSIA ANTISTATIC
Detail B
Detail A
– 1.0
A
– 1.0
3 ± 0.5
0.7 ± 0.5
– 1.0
380 ± 1
1.0 14 x
13 x 10 = 130
17996-3
Fig. 4 - Shipping Tube Specifications for DIP-8 Packages
DEVICES PER TUBES
TYPE
UNITS/TUBE
TUBES/BOX
UNITS/BOX
DIP-8
50
40
2000
Rev. 1.8, 24-Mar-2023
Document Number: 83605
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DIP-8
12 ± 0.3
B
6.6 ± 0.3
Transparent rigid PVC
2.7 ± 0.2
R
0.
1
6°
4.4 ± 0.3
0.
5
11 ± 0.3
R
0.6 ± 0.1
10°
A
Detail A
Detail B
5.7 ± 0.15
// 0.2 B
17996-4
Not to scale
Section A - B
Fig. 5 - Tube Shipping Medium
Tape and Reel
ESD sticker
Tape slot
in core
330
(13")
Top cover tape
Regular, special
or bar code label
Embossed carrier
Embossment
17999
17998
Fig. 6 - Tape and Reel Shipping Medium
Fig. 7 - Tape and Reel Shipping Medium
SMD-8 (option 7)
Pin 1 and
top of component
0.35 (0.014)
4 ± 0.1
(1.57 ± 0.004)
2 ± 0.05 (0.079 ± 0.002)
1.5 (0.059) min.
10 pitch cumulative
tolerance on tape
± 0.2 (0.008)
1.75 ± 0.1
(0.069 ± 0.004)
Top
cover
tape
10.41 (0.410)
7.5 ± 0.05 16.0 ± 0.3
(0.295 ± 0.002) (0.630 ± 0.012)
4.7 (0.185)
10.21
(0.402)
13.3 (0.523)
12.0 (0.472)
0.1 (0.004) max.
Embossment
Center lines
of cavity
18008
1.5 (0.059)
Direction of feed
Fig. 8 - Tape and Reel Packing (1000 pieces on Reel)
Rev. 1.8, 24-Mar-2023
Document Number: 83605
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SMD-8 (option 9)
Pin 1 and
top of component
4 ± 0.1
(1.57 ± 0.004)
2 ± 0.05 (0.079 ± 0.002)
1.5 (0.059) min.
10 pitch cumulative
tolerance on tape
± 0.2 (0.008)
0.35 (0.014)
1.75 ± 0.1
(0.069 ± 0.004)
Top
cover
tape
10.2 (0.402)
7.5 ± 0.05 16.0 ± 0.3
(0.295 ± 0.002) (0.630 ± 0.012)
4.17 (0.164)
10.31
(0.406)
13.3 (0.523)
12.0 (0.472)
0.1 (0.004) max.
Embossment
18009
Center lines
of cavity
1.5 (0.059)
Direction of feed
Fig. 9 - Tape and Reel Shipping Medium
SOLDER PROFILES
Axis Title
Axis Title
10000
5s
10000
300
Lead temperature
1000
ca. 2 K/s
ca. 200 K/s
150
Full line: typical
Dotted lines:
process limits
Second
wave
100 °C to
130 °C
100
100
2 K/s
50
2nd line
Temperature (°C)
200
Max. 260 °C
10
100
150
200
Max. 30 s
150
Max. 120 s
100
Max. 100 s
Max. ramp down 6 °C/s
100
Max. ramp up 3 °C/s
Fig. 10 - Wave Soldering Double Wave Profile According to
J.STD-020 for DIP-8 Devices
10
0
0
250
Time (s)
948626
1000
200
50
0
50
245 °C
ca. 5 K/s
Forced cooling
0
255 °C
240 °C
217 °C
250
235 °C to
260 °C
First wave
1st line
2nd line
2nd line
Temperature (°C)
250
1st line
2nd line
300
19841
50
100
150
200
250
300
Time (s)
Fig. 11 - Lead (Pb)-free Reflow Solder Profile According to
J-STD-020 for SMD-8 Devices
HANDLING AND STORAGE CONDITIONS
ESD level: HBM class 2
Floor life: unlimited
Conditions: Tamb < 30 °C, RH < 85 %
Moisture sensitivity level 1, according to J-STD-020
Rev. 1.8, 24-Mar-2023
Document Number: 83605
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Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
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Statements regarding the suitability of products for certain types of applications are based on Vishay's knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer's responsibility to validate that a particular product
with the properties described in the product specification is suitable for use in a particular application. Parameters provided in
datasheets and / or specifications may vary in different applications and performance may vary over time. All operating
parameters, including typical parameters, must be validated for each customer application by the customer's technical experts.
Product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited
to the warranty expressed therein.
Hyperlinks included in this datasheet may direct users to third-party websites. These links are provided as a convenience and
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Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
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Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please
contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.
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© 2024 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED
Document Number: 91000
1
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Revision: 01-Jan-2024
